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Application filed by Kinik CofiledCriticalKinik Co
Priority to TW094100821ApriorityCriticalpatent/TW200626031A/en
Publication of TW200626031ApublicationCriticalpatent/TW200626031A/en
This invention relates to a printed circuit board (PCB) with high heat conduction. It sequentially builds the following layers upon a substrate: a first heat conducting insulation layer, a first electric insulation layer, a circuit, and an external protection layer. It forms the first heat conducting insulation layer upon the top of the substrate. Further, it forms the first electric insulation layer upon the top of the first heat conducting insulation layer. Furthermore, the circuit is formed on the top of the first electrically insulation layer. Moreover, it forms external protection layer on the top of the first electrically insulation layer. The first heat conducting insulation layer absorbs the heat of the first electrically insulation layer. Eventually, it keeps the stable temperature for the circuit and electronic devices formed on the circuit.
TW094100821A2005-01-122005-01-12Printed circuit board (PCB) with high heat conducting
TW200626031A
(en)