TW200621460A - A sheet cutting method and a sheet mounting method - Google Patents
A sheet cutting method and a sheet mounting methodInfo
- Publication number
- TW200621460A TW200621460A TW094138279A TW94138279A TW200621460A TW 200621460 A TW200621460 A TW 200621460A TW 094138279 A TW094138279 A TW 094138279A TW 94138279 A TW94138279 A TW 94138279A TW 200621460 A TW200621460 A TW 200621460A
- Authority
- TW
- Taiwan
- Prior art keywords
- sheet
- semiconductor wafer
- stuck
- wafer
- condition
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Nonmetal Cutting Devices (AREA)
- Die Bonding (AREA)
- Dicing (AREA)
Abstract
A sheet cutting method and a sheet mounting method, wherein a semiconductor wafer(W) is placed and suckingly supported on an outer periphery cutting table (47)under the condition that an adhesive sheet (S) having a flat surface larger than that of the semiconductor wafer (W) is stuck on the rear surface of the semiconductor wafer (W) minimized in thickness. Under this condition, the outer periphery of the sheet (S) is cut off with a cutter (96) in the state of securing a sheet extruded amount of 0.1 to 1 mm from the outer peripheral edge of the semiconductor wafer (W). The wafer (W) on which the sheet (S) is stuck is transferred to a mount table (137) and mounted on a ring frame (RF). In this case, the wafer (W) is stuck on a dicing table (DT) with a relief margin for the extruded sheet portion eliminated.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004327409A JP2006140251A (en) | 2004-11-11 | 2004-11-11 | Sheet cutting method and mounting method |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200621460A true TW200621460A (en) | 2006-07-01 |
Family
ID=36336367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094138279A TW200621460A (en) | 2004-11-11 | 2005-11-01 | A sheet cutting method and a sheet mounting method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2006140251A (en) |
TW (1) | TW200621460A (en) |
WO (1) | WO2006051684A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8833423B2 (en) | 2010-06-24 | 2014-09-16 | Nec Engineering, Ltd. | Film attachment apparatus and attachment method |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100874953B1 (en) | 2006-09-20 | 2008-12-19 | 삼성전자주식회사 | Semiconductor wafer holding device |
JP4927582B2 (en) * | 2007-02-07 | 2012-05-09 | 株式会社ディスコ | Breaking method of adhesive film mounted on backside of wafer |
JP5006176B2 (en) * | 2007-12-11 | 2012-08-22 | リンテック株式会社 | Sheet cutting method |
JP5296604B2 (en) * | 2009-05-29 | 2013-09-25 | リンテック株式会社 | Sheet sticking device and sticking method |
JP5670209B2 (en) * | 2011-01-13 | 2015-02-18 | 株式会社ディスコ | Resin coating device |
JP6302765B2 (en) * | 2014-06-25 | 2018-03-28 | 株式会社ディスコ | Tape sticking device |
JP6099799B1 (en) * | 2016-07-26 | 2017-03-22 | 株式会社 エイブル | Cutting system and cutting method |
JP6833542B2 (en) * | 2017-02-08 | 2021-02-24 | 日東電工株式会社 | Tape collection method and tape collection device |
JP2020203326A (en) * | 2019-06-14 | 2020-12-24 | リンテック株式会社 | Cutting device and cutting method |
KR102330850B1 (en) * | 2020-07-21 | 2021-12-01 | 창원대학교 산학협력단 | Cutting machine for composite laminates |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2589678B2 (en) * | 1986-09-03 | 1997-03-12 | 松下電子工業株式会社 | Backside treatment method for semiconductor substrate |
JP3515917B2 (en) * | 1998-12-01 | 2004-04-05 | シャープ株式会社 | Method for manufacturing semiconductor device |
JP4311522B2 (en) * | 2002-03-07 | 2009-08-12 | 日東電工株式会社 | Adhesive sheet attaching method and apparatus, and semiconductor wafer processing method |
JP2004079768A (en) * | 2002-08-19 | 2004-03-11 | Lintec Corp | Pasting device |
-
2004
- 2004-11-11 JP JP2004327409A patent/JP2006140251A/en active Pending
-
2005
- 2005-10-25 WO PCT/JP2005/019534 patent/WO2006051684A1/en active Application Filing
- 2005-11-01 TW TW094138279A patent/TW200621460A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8833423B2 (en) | 2010-06-24 | 2014-09-16 | Nec Engineering, Ltd. | Film attachment apparatus and attachment method |
TWI505937B (en) * | 2010-06-24 | 2015-11-01 | Nec Engineering Ltd | Diaphragm attachment device and attachment method |
Also Published As
Publication number | Publication date |
---|---|
JP2006140251A (en) | 2006-06-01 |
WO2006051684A1 (en) | 2006-05-18 |
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