TW200621460A - A sheet cutting method and a sheet mounting method - Google Patents

A sheet cutting method and a sheet mounting method

Info

Publication number
TW200621460A
TW200621460A TW094138279A TW94138279A TW200621460A TW 200621460 A TW200621460 A TW 200621460A TW 094138279 A TW094138279 A TW 094138279A TW 94138279 A TW94138279 A TW 94138279A TW 200621460 A TW200621460 A TW 200621460A
Authority
TW
Taiwan
Prior art keywords
sheet
semiconductor wafer
stuck
wafer
condition
Prior art date
Application number
TW094138279A
Other languages
Chinese (zh)
Inventor
Masaki Tsujimoto
Takahisa Yoshioka
Kenji Kobayashi
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200621460A publication Critical patent/TW200621460A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)

Abstract

A sheet cutting method and a sheet mounting method, wherein a semiconductor wafer(W) is placed and suckingly supported on an outer periphery cutting table (47)under the condition that an adhesive sheet (S) having a flat surface larger than that of the semiconductor wafer (W) is stuck on the rear surface of the semiconductor wafer (W) minimized in thickness. Under this condition, the outer periphery of the sheet (S) is cut off with a cutter (96) in the state of securing a sheet extruded amount of 0.1 to 1 mm from the outer peripheral edge of the semiconductor wafer (W). The wafer (W) on which the sheet (S) is stuck is transferred to a mount table (137) and mounted on a ring frame (RF). In this case, the wafer (W) is stuck on a dicing table (DT) with a relief margin for the extruded sheet portion eliminated.
TW094138279A 2004-11-11 2005-11-01 A sheet cutting method and a sheet mounting method TW200621460A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004327409A JP2006140251A (en) 2004-11-11 2004-11-11 Sheet cutting method and mounting method

Publications (1)

Publication Number Publication Date
TW200621460A true TW200621460A (en) 2006-07-01

Family

ID=36336367

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094138279A TW200621460A (en) 2004-11-11 2005-11-01 A sheet cutting method and a sheet mounting method

Country Status (3)

Country Link
JP (1) JP2006140251A (en)
TW (1) TW200621460A (en)
WO (1) WO2006051684A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8833423B2 (en) 2010-06-24 2014-09-16 Nec Engineering, Ltd. Film attachment apparatus and attachment method

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100874953B1 (en) 2006-09-20 2008-12-19 삼성전자주식회사 Semiconductor wafer holding device
JP4927582B2 (en) * 2007-02-07 2012-05-09 株式会社ディスコ Breaking method of adhesive film mounted on backside of wafer
JP5006176B2 (en) * 2007-12-11 2012-08-22 リンテック株式会社 Sheet cutting method
JP5296604B2 (en) * 2009-05-29 2013-09-25 リンテック株式会社 Sheet sticking device and sticking method
JP5670209B2 (en) * 2011-01-13 2015-02-18 株式会社ディスコ Resin coating device
JP6302765B2 (en) * 2014-06-25 2018-03-28 株式会社ディスコ Tape sticking device
JP6099799B1 (en) * 2016-07-26 2017-03-22 株式会社 エイブル Cutting system and cutting method
JP6833542B2 (en) * 2017-02-08 2021-02-24 日東電工株式会社 Tape collection method and tape collection device
JP2020203326A (en) * 2019-06-14 2020-12-24 リンテック株式会社 Cutting device and cutting method
KR102330850B1 (en) * 2020-07-21 2021-12-01 창원대학교 산학협력단 Cutting machine for composite laminates

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2589678B2 (en) * 1986-09-03 1997-03-12 松下電子工業株式会社 Backside treatment method for semiconductor substrate
JP3515917B2 (en) * 1998-12-01 2004-04-05 シャープ株式会社 Method for manufacturing semiconductor device
JP4311522B2 (en) * 2002-03-07 2009-08-12 日東電工株式会社 Adhesive sheet attaching method and apparatus, and semiconductor wafer processing method
JP2004079768A (en) * 2002-08-19 2004-03-11 Lintec Corp Pasting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8833423B2 (en) 2010-06-24 2014-09-16 Nec Engineering, Ltd. Film attachment apparatus and attachment method
TWI505937B (en) * 2010-06-24 2015-11-01 Nec Engineering Ltd Diaphragm attachment device and attachment method

Also Published As

Publication number Publication date
JP2006140251A (en) 2006-06-01
WO2006051684A1 (en) 2006-05-18

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