TW200620610A - Gluing machine of wafer and lead frame for LOC package - Google Patents
Gluing machine of wafer and lead frame for LOC packageInfo
- Publication number
- TW200620610A TW200620610A TW093138525A TW93138525A TW200620610A TW 200620610 A TW200620610 A TW 200620610A TW 093138525 A TW093138525 A TW 093138525A TW 93138525 A TW93138525 A TW 93138525A TW 200620610 A TW200620610 A TW 200620610A
- Authority
- TW
- Taiwan
- Prior art keywords
- lead frame
- wafer
- supplying
- storage box
- sticking
- Prior art date
Links
Landscapes
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A gluing machine of wafer and lead frame for LOC package in this invention includes: a supplying device of lead frame to store and supply the lead frame; a dispensing device, involving a glue supplying tank and a robot to soak the glue and print to the surface of adhesive tape; a wafer sticking device, involving a wafer supplying mechanism and a sticking robot to pick up the wafer from wafer supplying mechanism and stick on the adhesive tape. A collecting device to collect said lead frame sticking with wafer includes: a storage box; a moving mechanism carrying and moving the storage box, when the lead frame is moved by a transporting device into the storage box, the moving mechanism carries the storage box to go forward to the designated position, waiting for the next lead frame to move in; a conveying device transporting the lead frame from the lead frame supplying device to the dispensing device, wafer-sticking device and collecting device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93138525A TWI239619B (en) | 2004-12-13 | 2004-12-13 | Gluing machine of wafer and lead frame for LOC package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93138525A TWI239619B (en) | 2004-12-13 | 2004-12-13 | Gluing machine of wafer and lead frame for LOC package |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI239619B TWI239619B (en) | 2005-09-11 |
TW200620610A true TW200620610A (en) | 2006-06-16 |
Family
ID=37007491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93138525A TWI239619B (en) | 2004-12-13 | 2004-12-13 | Gluing machine of wafer and lead frame for LOC package |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI239619B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109801869A (en) * | 2019-01-18 | 2019-05-24 | 广州明森科技股份有限公司 | A kind of efficient radio frequency identification tag package Processes and apparatus |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104591078B (en) * | 2013-10-31 | 2016-08-10 | 无锡华润安盛科技有限公司 | What a kind of MEMS sensor dipped in adhesive dispenser and application thereof dips in gluing method |
-
2004
- 2004-12-13 TW TW93138525A patent/TWI239619B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109801869A (en) * | 2019-01-18 | 2019-05-24 | 广州明森科技股份有限公司 | A kind of efficient radio frequency identification tag package Processes and apparatus |
CN109801869B (en) * | 2019-01-18 | 2020-10-09 | 广州明森科技股份有限公司 | Efficient electronic tag packaging process and device |
Also Published As
Publication number | Publication date |
---|---|
TWI239619B (en) | 2005-09-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |