TW200620610A - Gluing machine of wafer and lead frame for LOC package - Google Patents

Gluing machine of wafer and lead frame for LOC package

Info

Publication number
TW200620610A
TW200620610A TW093138525A TW93138525A TW200620610A TW 200620610 A TW200620610 A TW 200620610A TW 093138525 A TW093138525 A TW 093138525A TW 93138525 A TW93138525 A TW 93138525A TW 200620610 A TW200620610 A TW 200620610A
Authority
TW
Taiwan
Prior art keywords
lead frame
wafer
supplying
storage box
sticking
Prior art date
Application number
TW093138525A
Other languages
Chinese (zh)
Other versions
TWI239619B (en
Inventor
Han-Zhen You
Original Assignee
Gofac Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gofac Technologies Co Ltd filed Critical Gofac Technologies Co Ltd
Priority to TW93138525A priority Critical patent/TWI239619B/en
Application granted granted Critical
Publication of TWI239619B publication Critical patent/TWI239619B/en
Publication of TW200620610A publication Critical patent/TW200620610A/en

Links

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A gluing machine of wafer and lead frame for LOC package in this invention includes: a supplying device of lead frame to store and supply the lead frame; a dispensing device, involving a glue supplying tank and a robot to soak the glue and print to the surface of adhesive tape; a wafer sticking device, involving a wafer supplying mechanism and a sticking robot to pick up the wafer from wafer supplying mechanism and stick on the adhesive tape. A collecting device to collect said lead frame sticking with wafer includes: a storage box; a moving mechanism carrying and moving the storage box, when the lead frame is moved by a transporting device into the storage box, the moving mechanism carries the storage box to go forward to the designated position, waiting for the next lead frame to move in; a conveying device transporting the lead frame from the lead frame supplying device to the dispensing device, wafer-sticking device and collecting device.
TW93138525A 2004-12-13 2004-12-13 Gluing machine of wafer and lead frame for LOC package TWI239619B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93138525A TWI239619B (en) 2004-12-13 2004-12-13 Gluing machine of wafer and lead frame for LOC package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93138525A TWI239619B (en) 2004-12-13 2004-12-13 Gluing machine of wafer and lead frame for LOC package

Publications (2)

Publication Number Publication Date
TWI239619B TWI239619B (en) 2005-09-11
TW200620610A true TW200620610A (en) 2006-06-16

Family

ID=37007491

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93138525A TWI239619B (en) 2004-12-13 2004-12-13 Gluing machine of wafer and lead frame for LOC package

Country Status (1)

Country Link
TW (1) TWI239619B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109801869A (en) * 2019-01-18 2019-05-24 广州明森科技股份有限公司 A kind of efficient radio frequency identification tag package Processes and apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104591078B (en) * 2013-10-31 2016-08-10 无锡华润安盛科技有限公司 What a kind of MEMS sensor dipped in adhesive dispenser and application thereof dips in gluing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109801869A (en) * 2019-01-18 2019-05-24 广州明森科技股份有限公司 A kind of efficient radio frequency identification tag package Processes and apparatus
CN109801869B (en) * 2019-01-18 2020-10-09 广州明森科技股份有限公司 Efficient electronic tag packaging process and device

Also Published As

Publication number Publication date
TWI239619B (en) 2005-09-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees