TW200617093A - Curable liquid resin composition and method for producing multilayer body using same - Google Patents

Curable liquid resin composition and method for producing multilayer body using same

Info

Publication number
TW200617093A
TW200617093A TW094125917A TW94125917A TW200617093A TW 200617093 A TW200617093 A TW 200617093A TW 094125917 A TW094125917 A TW 094125917A TW 94125917 A TW94125917 A TW 94125917A TW 200617093 A TW200617093 A TW 200617093A
Authority
TW
Taiwan
Prior art keywords
resin composition
liquid resin
volatile solvent
curable liquid
same
Prior art date
Application number
TW094125917A
Other languages
Chinese (zh)
Inventor
Hiroomi Shimomura
Mitsunobu Doimoto
Yasunobu Suzuki
Tetsuya Yamamura
Takayoshi Tanabe
Hideaki Takase
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005022382A external-priority patent/JP2006161013A/en
Priority claimed from JP2005022474A external-priority patent/JP2006161014A/en
Priority claimed from PCT/JP2005/004666 external-priority patent/WO2005090472A1/en
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200617093A publication Critical patent/TW200617093A/en

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  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Paints Or Removers (AREA)

Abstract

Disclosed is a curable liquid resin composition comprising: (A) a fluorine-containing polymer; (B) a thermosetting compound; (C) a curing catalyst; (D) metal oxides particles having a number average particle diameter of not more than 100 nm; (E-1) one or more solvents having a high solubility for the fluorine-containing polymer (A) (hereinafter referred to as a highly volatile solvent (E-1)); (E-2) one or more solvents which has high dispersion stability for the metal oxide particles (D) and is compatible with the highly volatile solvent (E-1) (hereinafter referred to as a less volatile solvent (E-2)); and (F) an active energy ray-curable compound. The curable liquid resin composition is characterized in that the relative evaporation rate of the highly volatile solvent (E-1) is higher than that of the less volatile solvent (E-2). Also disclosed is a cured film made from such a curable liquid resin composition.
TW094125917A 2004-11-15 2005-07-29 Curable liquid resin composition and method for producing multilayer body using same TW200617093A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2004331274 2004-11-15
JP2004331182 2004-11-15
JP2005022382A JP2006161013A (en) 2004-03-22 2005-01-31 Liquid curable resin composition, curable film and laminate
JP2005022474A JP2006161014A (en) 2004-03-22 2005-01-31 Method for producing laminate
PCT/JP2005/004666 WO2005090472A1 (en) 2004-03-22 2005-03-16 Curable liquid resin composition and method for producing multilayer body using same

Publications (1)

Publication Number Publication Date
TW200617093A true TW200617093A (en) 2006-06-01

Family

ID=57808108

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094125917A TW200617093A (en) 2004-11-15 2005-07-29 Curable liquid resin composition and method for producing multilayer body using same

Country Status (1)

Country Link
TW (1) TW200617093A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9608184B2 (en) 2006-06-02 2017-03-28 Hitachi Chemical Company, Ltd. Optical semiconductor element mounting package, and optical semiconductor device using the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9608184B2 (en) 2006-06-02 2017-03-28 Hitachi Chemical Company, Ltd. Optical semiconductor element mounting package, and optical semiconductor device using the same
US9660156B2 (en) 2006-06-02 2017-05-23 Hitachi Chemical Company, Ltd. Optical semiconductor element mounting package, and optical semiconductor device using the same
US9673362B2 (en) 2006-06-02 2017-06-06 Hitachi Chemical Company, Ltd. Optical semiconductor element mounting package, and optical semiconductor device using the same
TWI595684B (en) * 2006-06-02 2017-08-11 日立化成股份有限公司 Thermosetting resin composition, molding material, package for carrying optical semiconductor element and production method thereof and optical semiconductor device
US10205072B2 (en) 2006-06-02 2019-02-12 Hitachi Chemical Company, Ltd. Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
US10326063B2 (en) 2006-06-02 2019-06-18 Hitachi Chemical Company, Ltd. Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
US10950767B2 (en) 2006-06-02 2021-03-16 Shenzhen Jufei Optoelectronics Co., Ltd. Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
US11810778B2 (en) 2006-06-02 2023-11-07 Shenzhen Jufei Optoelectronics Co., Ltd. Optical semiconductor element mounting package and optical semiconductor device using the same

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