TW200617093A - Curable liquid resin composition and method for producing multilayer body using same - Google Patents
Curable liquid resin composition and method for producing multilayer body using sameInfo
- Publication number
- TW200617093A TW200617093A TW094125917A TW94125917A TW200617093A TW 200617093 A TW200617093 A TW 200617093A TW 094125917 A TW094125917 A TW 094125917A TW 94125917 A TW94125917 A TW 94125917A TW 200617093 A TW200617093 A TW 200617093A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- liquid resin
- volatile solvent
- curable liquid
- same
- Prior art date
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Paints Or Removers (AREA)
Abstract
Disclosed is a curable liquid resin composition comprising: (A) a fluorine-containing polymer; (B) a thermosetting compound; (C) a curing catalyst; (D) metal oxides particles having a number average particle diameter of not more than 100 nm; (E-1) one or more solvents having a high solubility for the fluorine-containing polymer (A) (hereinafter referred to as a highly volatile solvent (E-1)); (E-2) one or more solvents which has high dispersion stability for the metal oxide particles (D) and is compatible with the highly volatile solvent (E-1) (hereinafter referred to as a less volatile solvent (E-2)); and (F) an active energy ray-curable compound. The curable liquid resin composition is characterized in that the relative evaporation rate of the highly volatile solvent (E-1) is higher than that of the less volatile solvent (E-2). Also disclosed is a cured film made from such a curable liquid resin composition.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004331274 | 2004-11-15 | ||
JP2004331182 | 2004-11-15 | ||
JP2005022382A JP2006161013A (en) | 2004-03-22 | 2005-01-31 | Liquid curable resin composition, curable film and laminate |
JP2005022474A JP2006161014A (en) | 2004-03-22 | 2005-01-31 | Method for producing laminate |
PCT/JP2005/004666 WO2005090472A1 (en) | 2004-03-22 | 2005-03-16 | Curable liquid resin composition and method for producing multilayer body using same |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200617093A true TW200617093A (en) | 2006-06-01 |
Family
ID=57808108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094125917A TW200617093A (en) | 2004-11-15 | 2005-07-29 | Curable liquid resin composition and method for producing multilayer body using same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200617093A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9608184B2 (en) | 2006-06-02 | 2017-03-28 | Hitachi Chemical Company, Ltd. | Optical semiconductor element mounting package, and optical semiconductor device using the same |
-
2005
- 2005-07-29 TW TW094125917A patent/TW200617093A/en unknown
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9608184B2 (en) | 2006-06-02 | 2017-03-28 | Hitachi Chemical Company, Ltd. | Optical semiconductor element mounting package, and optical semiconductor device using the same |
US9660156B2 (en) | 2006-06-02 | 2017-05-23 | Hitachi Chemical Company, Ltd. | Optical semiconductor element mounting package, and optical semiconductor device using the same |
US9673362B2 (en) | 2006-06-02 | 2017-06-06 | Hitachi Chemical Company, Ltd. | Optical semiconductor element mounting package, and optical semiconductor device using the same |
TWI595684B (en) * | 2006-06-02 | 2017-08-11 | 日立化成股份有限公司 | Thermosetting resin composition, molding material, package for carrying optical semiconductor element and production method thereof and optical semiconductor device |
US10205072B2 (en) | 2006-06-02 | 2019-02-12 | Hitachi Chemical Company, Ltd. | Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same |
US10326063B2 (en) | 2006-06-02 | 2019-06-18 | Hitachi Chemical Company, Ltd. | Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same |
US10950767B2 (en) | 2006-06-02 | 2021-03-16 | Shenzhen Jufei Optoelectronics Co., Ltd. | Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same |
US11810778B2 (en) | 2006-06-02 | 2023-11-07 | Shenzhen Jufei Optoelectronics Co., Ltd. | Optical semiconductor element mounting package and optical semiconductor device using the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200537120A (en) | Curable liquid resin composition and method for producing multilayer body using same | |
TW200502321A (en) | Liquid resin composition, cured film and laminate | |
JP5044326B2 (en) | Epoxy resin composition and resin sealing device | |
WO2009041533A1 (en) | Hard coat film | |
EP1574556A3 (en) | Curable pressure sensitive adhesive composition, optical disk producing sheet, and optical disk | |
SG144820A1 (en) | Highly conductive composition for wafer coating | |
JP7000858B2 (en) | Curable composition and cured product | |
WO2009025292A1 (en) | Antireflection film | |
JP6125431B2 (en) | Method for forming a UV curable conductive composition and composition formed thereby | |
WO2006060592A3 (en) | Device comprising low outgassing photo or electron beam cured rubbery polymer material | |
US20200165411A1 (en) | Curable composition and cured product | |
TW200604277A (en) | Liquid curable resin composition, cured film and multilayer body | |
DE602005016155D1 (en) | SURFACE MODIFIED CORUND AND RESIN COMPOSITION | |
JP2007051272A (en) | Heat-resistant conductive adhesive | |
TW200738459A (en) | Anti-reflection film | |
TW200617093A (en) | Curable liquid resin composition and method for producing multilayer body using same | |
KR101688974B1 (en) | Curable resin composition for inkjet printing, solder resist using the same and method for manufacturing the same | |
TW200626654A (en) | Curable resin composition and cured film comprising the same and laminate | |
CN110591522A (en) | Powder coating and preparation and use methods thereof | |
AU2001267906A1 (en) | Molding resin composition and method of molding | |
JP2008163258A5 (en) | ||
JP2005181565A5 (en) | ||
JP5338202B2 (en) | Solventless active energy ray-curable coating composition, method for producing the same, and substrate with functional thin film | |
WO2015129100A1 (en) | Transparent polyamide resin composition, transparent polyamide resin crosslinked molded article | |
US20190119532A1 (en) | Granular adhesive |