TW200615075A - Substrate positioning device - Google Patents

Substrate positioning device

Info

Publication number
TW200615075A
TW200615075A TW094112851A TW94112851A TW200615075A TW 200615075 A TW200615075 A TW 200615075A TW 094112851 A TW094112851 A TW 094112851A TW 94112851 A TW94112851 A TW 94112851A TW 200615075 A TW200615075 A TW 200615075A
Authority
TW
Taiwan
Prior art keywords
axis directional
axis
substrate
stopper
directional stopper
Prior art date
Application number
TW094112851A
Other languages
Chinese (zh)
Other versions
TWI271255B (en
Inventor
Atsuhiro Kaneda
Original Assignee
Mitsubishi Electric Corp
Melco Mechatronic System Engineering Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp, Melco Mechatronic System Engineering Co filed Critical Mitsubishi Electric Corp
Publication of TW200615075A publication Critical patent/TW200615075A/en
Application granted granted Critical
Publication of TWI271255B publication Critical patent/TWI271255B/en

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
    • E02B3/00—Engineering works in connection with control or use of streams, rivers, coasts, or other marine sites; Sealings or joints for engineering works in general
    • E02B3/04—Structures or apparatus for, or methods of, protecting banks, coasts, or harbours
    • E02B3/12—Revetment of banks, dams, watercourses, or the like, e.g. the sea-floor
    • E02B3/128—Coherent linings made on the spot, e.g. cast in situ, extruded on the spot
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
    • E02B3/00—Engineering works in connection with control or use of streams, rivers, coasts, or other marine sites; Sealings or joints for engineering works in general
    • E02B3/04—Structures or apparatus for, or methods of, protecting banks, coasts, or harbours
    • E02B3/12—Revetment of banks, dams, watercourses, or the like, e.g. the sea-floor
    • E02B3/122—Flexible prefabricated covering elements, e.g. mats, strips
    • E02B3/123—Flexible prefabricated covering elements, e.g. mats, strips mainly consisting of stone, concrete or similar stony material

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Ocean & Marine Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Automatic Assembly (AREA)
  • Control Of Position Or Direction (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

To provide a substrate positioning device capable of reducing processing defects caused by misalignment and inclinations of optical axes of two processing heads in a two-head type laser processing machine. The substrate positioning device comprises a table 33 where a substrate is placed and a table holding stand 34 holding the table, an X-axis directional stopper 37 and a Y-axis directional stopper 36 which make the substrate position by bringing into contact with two orthogonal sides of the substrate, an X-axis directional stopper position switching device 47 for switching an X-axis directional position of the X-axis directional stopper 37 against the table holding stand 34 to a predetermined reference position and an offset position, a Y-axis directional stopper position switching device 41 for switching a Y-axis directional position of the Y-axis directional stopper 36 against the table holding stand 34 to a predetermined reference position and an offset position, and a table driving device 50 for making the substrate bring into contact with the X-axis directional stopper 37 and Y-axis directional stopper 36 by horizontally moving the table 33 in a slanting direction slantly intersected with the X axis and Y axis.
TW094112851A 2004-11-08 2005-04-22 Substrate positioning device TWI271255B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004323612A JP4491650B2 (en) 2004-11-08 2004-11-08 Substrate positioning device

Publications (2)

Publication Number Publication Date
TW200615075A true TW200615075A (en) 2006-05-16
TWI271255B TWI271255B (en) 2007-01-21

Family

ID=36727630

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094112851A TWI271255B (en) 2004-11-08 2005-04-22 Substrate positioning device

Country Status (4)

Country Link
JP (1) JP4491650B2 (en)
KR (1) KR100693696B1 (en)
CN (1) CN100411810C (en)
TW (1) TWI271255B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475635B (en) * 2012-05-07 2015-03-01
CN112975777A (en) * 2021-01-29 2021-06-18 洛博特思智能科技(苏州)有限公司 Changeable benchmark carrier

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100469508C (en) * 2007-04-26 2009-03-18 瑞安市博业激光应用技术有限公司 Double-head moving type laser cutting machine
JP5460420B2 (en) * 2010-03-30 2014-04-02 三菱電機株式会社 Processing control device and laser processing device
CN103286452B (en) * 2012-03-02 2015-09-09 大族激光科技产业集团股份有限公司 Laser micropore processing method and laser micropore process equipment
JP7370140B2 (en) * 2019-01-23 2023-10-27 大船企業日本株式会社 A substrate conveyance method, a substrate conveyance device equipped with the substrate conveyance method, and a substrate processing device with a substrate conveyance device comprising the substrate conveyance device and a substrate processing device
CN112296700B (en) * 2020-10-30 2021-09-21 永固集团股份有限公司 A adsorption structure for processing of circuit breaker spare part

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61178444U (en) * 1985-04-25 1986-11-07
JP3550617B2 (en) * 1997-06-03 2004-08-04 日立ビアメカニクス株式会社 Laser processing equipment
JP3767310B2 (en) * 2000-03-08 2006-04-19 三菱電機株式会社 Workpiece positioning device, workpiece positioning method, and laser processing apparatus using the workpiece positioning device
JP3715196B2 (en) * 2000-11-13 2005-11-09 三菱電機株式会社 Laser processing equipment
JP3855684B2 (en) * 2001-06-05 2006-12-13 松下電器産業株式会社 Laser processing apparatus and laser processing method
JP2003004614A (en) * 2001-06-22 2003-01-08 Akashi Corp Material test machine
DE10235234B3 (en) * 2002-08-01 2004-01-08 Siemens Ag Device for holding and positioning a substrate in a laser processing machine
CN2605955Y (en) * 2002-12-24 2004-03-10 华中科技大学 Laser sheet cutting and welding device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475635B (en) * 2012-05-07 2015-03-01
CN112975777A (en) * 2021-01-29 2021-06-18 洛博特思智能科技(苏州)有限公司 Changeable benchmark carrier

Also Published As

Publication number Publication date
CN1772434A (en) 2006-05-17
JP4491650B2 (en) 2010-06-30
CN100411810C (en) 2008-08-20
KR20060045361A (en) 2006-05-17
KR100693696B1 (en) 2007-03-09
JP2006134143A (en) 2006-05-25
TWI271255B (en) 2007-01-21

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