TW200612589A - Acoustic resonator device and method for manufacturing the same - Google Patents

Acoustic resonator device and method for manufacturing the same

Info

Publication number
TW200612589A
TW200612589A TW093131284A TW93131284A TW200612589A TW 200612589 A TW200612589 A TW 200612589A TW 093131284 A TW093131284 A TW 093131284A TW 93131284 A TW93131284 A TW 93131284A TW 200612589 A TW200612589 A TW 200612589A
Authority
TW
Taiwan
Prior art keywords
semiconductor substrate
acoustic resonator
resonator device
reinforcing plate
manufacturing
Prior art date
Application number
TW093131284A
Other languages
Chinese (zh)
Other versions
TWI236777B (en
Inventor
Chin-Tang Hsieh
Ying-Chung Chen
Sean Wu
Chen-Kuei Chung
Kuo-Sheng Kao
Chin Chi Chen
Original Assignee
Int Semiconductor Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Semiconductor Tech Ltd filed Critical Int Semiconductor Tech Ltd
Priority to TW93131284A priority Critical patent/TWI236777B/en
Application granted granted Critical
Publication of TWI236777B publication Critical patent/TWI236777B/en
Publication of TW200612589A publication Critical patent/TW200612589A/en

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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

An acoustic resonator device includes a semiconductor substrate, a FBAR (thin film bulk acoustic resonator) and a reinforcing plate. The FBAR is fabricated on the upper surface of the semiconductor substrate. The semiconductor substrate has a resonating cavity through its upper and lower surfaces. The reinforcing plate is bonded to the lower surface of the semiconductor substrate to seal the resonating cavity. Therefore the reinforcing plate can be configured for die-bonding to eliminate the contamination of the resonating cavity. The semiconductor substrate will not suffer from chipping during wafer sawing.
TW93131284A 2004-10-15 2004-10-15 Acoustic resonator device and method for manufacturing the same TWI236777B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93131284A TWI236777B (en) 2004-10-15 2004-10-15 Acoustic resonator device and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93131284A TWI236777B (en) 2004-10-15 2004-10-15 Acoustic resonator device and method for manufacturing the same

Publications (2)

Publication Number Publication Date
TWI236777B TWI236777B (en) 2005-07-21
TW200612589A true TW200612589A (en) 2006-04-16

Family

ID=36675049

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93131284A TWI236777B (en) 2004-10-15 2004-10-15 Acoustic resonator device and method for manufacturing the same

Country Status (1)

Country Link
TW (1) TWI236777B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI667189B (en) * 2017-08-31 2019-08-01 研能科技股份有限公司 Microelectromechanical fluid control device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422238B (en) * 2009-09-25 2014-01-01 Ind Tech Res Inst Acoustic power generator and the manufacturing method thereof
CN109541319B (en) * 2018-10-10 2023-09-01 金华职业技术学院 Liquid dielectric constant measuring method
CN109374982B (en) * 2018-10-10 2023-08-01 金华职业技术学院 Liquid dielectric constant measuring device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI667189B (en) * 2017-08-31 2019-08-01 研能科技股份有限公司 Microelectromechanical fluid control device
US10883487B2 (en) 2017-08-31 2021-01-05 Microjet Technology Co., Ltd. Micro-electromechanical fluid control device

Also Published As

Publication number Publication date
TWI236777B (en) 2005-07-21

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