TW200605720A - Method of manufacturing encapsulation member for use in organic electro-luminescence device using film type pattern - Google Patents

Method of manufacturing encapsulation member for use in organic electro-luminescence device using film type pattern

Info

Publication number
TW200605720A
TW200605720A TW094124416A TW94124416A TW200605720A TW 200605720 A TW200605720 A TW 200605720A TW 094124416 A TW094124416 A TW 094124416A TW 94124416 A TW94124416 A TW 94124416A TW 200605720 A TW200605720 A TW 200605720A
Authority
TW
Taiwan
Prior art keywords
organic electro
encapsulation member
film type
type pattern
luminescence device
Prior art date
Application number
TW094124416A
Other languages
Chinese (zh)
Other versions
TWI261482B (en
Inventor
Soo-Jin Park
Suk-Bong Cho
Hyun-Mi Yuk
Original Assignee
Komico Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komico Ltd filed Critical Komico Ltd
Publication of TW200605720A publication Critical patent/TW200605720A/en
Application granted granted Critical
Publication of TWI261482B publication Critical patent/TWI261482B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

Provided is a method of manufacturing an encapsulation member for use in organic electro-luminescence(EL)devices. The method includes forming a predetermined pattern on a substrate and forming a groove on the substrate using the pattern by performing mechanical processing, wet etching, or a combination of mechanical processing and wet etching. The pattern is formed by attaching a film to an upper surface of the substrate and cutting a predetermined portion of the film using a laser or a blade device in which a program is stored.
TW094124416A 2004-07-21 2005-07-19 Method of manufacturing encapsulation member for use in organic electro-luminescence device using film type pattern TWI261482B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040056859A KR100665311B1 (en) 2004-07-21 2004-07-21 Method for manufacturing encapsulation member used in organic electro-luminescence device using film type pattern

Publications (2)

Publication Number Publication Date
TW200605720A true TW200605720A (en) 2006-02-01
TWI261482B TWI261482B (en) 2006-09-01

Family

ID=36077435

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094124416A TWI261482B (en) 2004-07-21 2005-07-19 Method of manufacturing encapsulation member for use in organic electro-luminescence device using film type pattern

Country Status (3)

Country Link
KR (1) KR100665311B1 (en)
CN (1) CN1735297A (en)
TW (1) TWI261482B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI650236B (en) * 2016-04-12 2019-02-11 Ｌｇ化學股份有限公司 Encapsulation film

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100756918B1 (en) * 2004-08-27 2007-09-07 주식회사 멤스웨어 Cover Plate for Organic Electro-luminescence Device and its Manufacture Method
KR101107180B1 (en) 2009-11-10 2012-01-25 삼성모바일디스플레이주식회사 Organic light emitting diode display and method for manufacturing the same
CN102130307B (en) * 2011-01-06 2012-10-03 浙江贝力生科技有限公司 Etching package method for sealing cover plate of organic light emitting display
CN102651324A (en) * 2011-02-28 2012-08-29 诺发光电股份有限公司 Manufacturing system of package substrate
CN106283054B (en) * 2015-06-05 2019-02-05 深圳市美达成科技有限公司 Film covering method, engraving method and the equipment for coating film of sheet metal strip for etching

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI650236B (en) * 2016-04-12 2019-02-11 Ｌｇ化學股份有限公司 Encapsulation film
US10937990B2 (en) 2016-04-12 2021-03-02 Lg Chem Ltd. Encapsulation film

Also Published As

Publication number Publication date
CN1735297A (en) 2006-02-15
TWI261482B (en) 2006-09-01
KR100665311B1 (en) 2007-01-04
KR20060008557A (en) 2006-01-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees