TW200603686A - Manufacturing method for double-sided metal-clad laminate, and double-sided metal-clad laminate obtained by the manufacturing method - Google Patents

Manufacturing method for double-sided metal-clad laminate, and double-sided metal-clad laminate obtained by the manufacturing method

Info

Publication number
TW200603686A
TW200603686A TW094110270A TW94110270A TW200603686A TW 200603686 A TW200603686 A TW 200603686A TW 094110270 A TW094110270 A TW 094110270A TW 94110270 A TW94110270 A TW 94110270A TW 200603686 A TW200603686 A TW 200603686A
Authority
TW
Taiwan
Prior art keywords
double
clad laminate
manufacturing
sided metal
resin
Prior art date
Application number
TW094110270A
Other languages
Chinese (zh)
Inventor
Tetsuro Sato
Noriyuki Nagashima
Kensuke Nakamura
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200603686A publication Critical patent/TW200603686A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

A double-sided metal clad laminate that for use as a fundamental material for production of printed wiring board, has an insulating layer with unprecedented small thickness but exhibits satisfactory inter-layer insulation. There is provided, for example, a process for producing a double-sided metal clad laminate consisting of an insulating layer containing a skeletal material having its both sides furnished with a conductive metal layer, characterized in that two first resin bearing metal foils, each of which comprises a metal foil and, superimposed in sequence on one major surface thereof, a hardened resin layer and a semihardened resin layer containing a skeletal material, are provided, and that they are piled so that the semihardened resin layer of one of the first resin bearing metal foils is brought into contact with the semihardened resin layer of the other of the first resin bearing metal foils and press molded to thereby accomplish laminating of the first resin bearing metal foils.
TW094110270A 2004-04-02 2005-03-31 Manufacturing method for double-sided metal-clad laminate, and double-sided metal-clad laminate obtained by the manufacturing method TW200603686A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004110167A JP2005288966A (en) 2004-04-02 2004-04-02 Manufacturing method for double-sided metal-clad laminate, and double-sided metal-clad laminate obtained by the manufacturing method

Publications (1)

Publication Number Publication Date
TW200603686A true TW200603686A (en) 2006-01-16

Family

ID=35063610

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094110270A TW200603686A (en) 2004-04-02 2005-03-31 Manufacturing method for double-sided metal-clad laminate, and double-sided metal-clad laminate obtained by the manufacturing method

Country Status (5)

Country Link
JP (1) JP2005288966A (en)
KR (1) KR20060134192A (en)
CN (1) CN1942310A (en)
TW (1) TW200603686A (en)
WO (1) WO2005095103A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070178300A1 (en) * 2005-12-06 2007-08-02 Isola Usa Corp. Laminates for high speed and high frequency printed circuit boards
JP5291553B2 (en) * 2009-07-02 2013-09-18 三井金属鉱業株式会社 Copper foil with composite resin layer, method for producing copper foil with composite resin layer, flexible double-sided copper-clad laminate and method for producing three-dimensional molded printed wiring board
KR101095489B1 (en) * 2011-04-13 2011-12-16 (주)한비메탈텍 Plate of shield can for smd process, manufacturing method for the plate and shield can using the plate
CN102285168A (en) * 2011-05-06 2011-12-21 广东生益科技股份有限公司 Buried capacitance material and manufacturing method thereof
WO2013076973A1 (en) * 2011-11-22 2013-05-30 パナソニック株式会社 Metal-clad laminate, and printed wiring board
WO2017135124A1 (en) * 2016-02-03 2017-08-10 凸版印刷株式会社 Laminated sheet and packaging container sleeve
CN114828447A (en) * 2021-01-28 2022-07-29 鹏鼎控股(深圳)股份有限公司 Circuit board and manufacturing method thereof
CN113956481A (en) * 2021-09-07 2022-01-21 江苏诺德新材料股份有限公司 Resin composition for 5G high-frequency high-speed copper-clad plate, prepreg and laminated plate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08216340A (en) * 1995-02-09 1996-08-27 Hitachi Chem Co Ltd Highly rigid copper-clad laminated plate and manufacture thereof
JP2001096665A (en) * 1999-10-01 2001-04-10 Tdk Corp Substrate
JP4148501B2 (en) * 2002-04-02 2008-09-10 三井金属鉱業株式会社 Dielectric filler-containing resin for forming a built-in capacitor layer of a printed wiring board, double-sided copper-clad laminate having a dielectric layer formed using the dielectric filler-containing resin, and method for producing the double-sided copper-clad laminate

Also Published As

Publication number Publication date
CN1942310A (en) 2007-04-04
KR20060134192A (en) 2006-12-27
JP2005288966A (en) 2005-10-20
WO2005095103A1 (en) 2005-10-13

Similar Documents

Publication Publication Date Title
TW200603686A (en) Manufacturing method for double-sided metal-clad laminate, and double-sided metal-clad laminate obtained by the manufacturing method
EP1830611A4 (en) Printed wiring board and production method of printed wiring borad
TW200617065A (en) Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate
WO2003074268A1 (en) Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
TW200709751A (en) Polyimide copper foil laminate and method of producing the same
CN104135823A (en) Fabrication method for rigid-flex printed combination board of covering membrane window
MY150055A (en) Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate
TW200721932A (en) Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
TW200704833A (en) Surface treated copper foil, process for producing surface treated copper foil, and surface treated copper foil with very thin primer resin layer
TW200731893A (en) Wiring board and manufacturing method of wiring board
TW200617098A (en) Method for manufacturing multilayer printed wiring board and multilayer printed wiring board obtained by the manufacturing method
TW200702162A (en) Fiber-rein composite, laminate article, and board for printed wiring, and method for producing board for printed wiring
SG153797A1 (en) Circuit board
TW200735730A (en) Resin composite copper foil, printed wiring board, and production process thereof
EP1599079A4 (en) Method for producing circuit-forming board and material for producing circuit-forming board
TW200700221A (en) Copper clad laminated sheet and its manufacturing method
CN104125727A (en) Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards
CN102497749A (en) Method for embedding capacitor into PCB (printed circuit board) multilayer board
CN103260350A (en) Blind buried orifice plate laminating method and blind buried orifice plate manufactured with blind buried orifice plate laminating method
MY155884A (en) Two-layered laminate having metal foil cladded on its one surface, method for production of the laminate, single-sided printed wiring board, and method for production of the wiring board
TW200635464A (en) Method for producing printed wiring board
WO2008126642A1 (en) Metal foil plated laminated board and printed wiring board
TW200730041A (en) Circuit board with embeded passive component and fabricating process thereof
CN201534940U (en) Phenolic paper laminate provided with melamine gum paper on single side
JP2006294666A (en) Flex rigid wiring board and manufacturing method thereof