TW200532948A

TW200532948A - Encapsulation structure of light-emitting diode (LED) and method for encapsulating the same

Info

Publication number: TW200532948A
Application number: TW93108436A
Authority: TW
Inventors: Shr-Huei Li; Shiang-Kai Gau; Yu-Yan Lin; Li-Ren He
Original assignee: Super Bright Optoelectronics Inc
Priority date: 2004-03-26
Filing date: 2004-03-26
Publication date: 2005-10-01
Also published as: TWI241033B

Abstract

The present invention provides an encapsulation structure of light-emitting diode (LED) and a method for encapsulating the same. A buried injection process is used to combine a lead frame, a metal base, and plastic enclosure. An opening between the top of the metal base and the plastic enclosure forms a reflective cup with a high reflectivity so that the light-emitting chip combined on the metal base can project its light produced in a wide angle range at a low loss. Furthermore, the design of the lead frame can provide a multi-chip encapsulation and a light output effect of blended color or full color.

Description

200532948 五、發明說明（1) 【發明所屬之技術本發明係關於法’特別是指一種200532948 V. Description of the invention (1) [Technology to which the invention belongs The invention relates to law ', especially to a method

~種發光二極髀與塑膠【先前於光線的散熱能的方便基材的請結構，黏著一頂面沖體1 0結射杯1 6 屬塊12LI、L2 後再於殼體，並形技術】發光二極體過程中持續力良好的材性’往往需雙材質結構參照第1圖，係先利用射金屬塊1 2於壓成型出缺合時，係穿暴露於塑膠的反射杯1 6 銲線1 4完成塑膠本體10 成封裝。此一結構以加 ^，私之封裝結構及其封裝古 ._ 方式結合導線架、金屬美命成向反射率及土座欠射杯之封裝結構及封裝方出於一之溫度缺 /η、特定角度範傳導至外界而，上述結封裝技術領域中，由於發放熱，因而必須將發光晶質（如金屬）上；不過，要使用到塑膠材料。但是 ’部具有結合強度上的缺習知技術中發光二極體出成形之塑膠本體10包覆塑勝本體1〇下方的穿孔17 凹的一反射杯1 6，當金屬過塑膠本體1 0階梯裝的穿本體1 0頂面，以將發光晶杯底；待發光晶片1 3與導後，即形成發光晶片1 3之與發光晶片1 3上方接著一藉由金屬塊1 2之反射杯1 6 圍内；而金屬塊12可直接，供作散熱之用。構具有一些缺弊。其利用黏著方式結合光晶片於產生片直接設置在如欲兼顧封| ，塑膠與散熱陷。〔LED)之封裝導線架1 1，再 ;此金屬塊1 2 塊1 2與塑膠本孔1 7，並使反片1 3接著於金線架1 1的引腳外接電路；而透鏡1 5，便完，可使光源輸將發光晶片1 3~ Kind of light-emitting diode and plastic [convenient base material structure for heat dissipation of light, adhere to a top punch 1 0 shoot cup 16 6 block 12LI, L2 and then the shell, and shape technology ] The material with good continuity during the process of light-emitting diodes often requires a dual-material structure. Refer to Figure 1. First, when the metal block 12 is used for compression molding, the reflective cup 16 exposed to the plastic is welded. Line 1 4 completes the plastic body 10 into a package. This structure combines the packaging structure of the lead frame, the metal-made directional reflectance, and the soil under-emission cup with the package structure and the packaging method. A specific angle range is transmitted to the outside. In the above-mentioned junction packaging technology field, a light-emitting crystal (such as a metal) must be applied due to heat release; however, a plastic material is used. However, in the conventional technology, the plastic body 10 formed by the light emitting diode is covered with a plastic body 10 covering the perforation 17 below the plastic body 10, and a concave reflection cup 16 is provided. The top surface of the body 10 is worn to make the bottom of the light-emitting crystal cup; after the light-emitting wafer 13 and the lead are formed, the light-emitting wafer 13 and the light-emitting wafer 13 are formed above the reflection cup 1 through the metal block 12 2 6; the metal block 12 can be directly used for heat dissipation. The architecture has some drawbacks. It uses an adhesive method to combine the light chip with the production chip, which is directly placed on the substrate. If you want to take care of sealing, plastic and heat sink. [LED] encapsulation lead frame 1 1, and then; the metal block 12 2 block 12 and the plastic hole 17, and the reverse sheet 1 3 is connected to the pin of the gold wire frame 1 1 external circuit; and the lens 1 5 After finishing, you can make the light source lose the light emitting chip 1 3

第6頁 200532948 五、發明說明（2) 金屬塊12與塑膠本體1〇，交情形，進而造成金屬塊〗2脫落^ =接著=勻、產生空隙的内，以致於導致產品失效。夕、水氣進入封裝結構射杯1 6内壁面反射率欠佳，盔金屬塊1 2沖壓成型的反面照射的光線，作高效率的的將發光晶片13向侧 11的設計亦只能供單一晶片壯，^耗，，其次，其導線架而單一封裝結構亦無法達成、、曰二^衣作多晶片封裝，第2圖是另一種習知枯:色或王衫的光源輸出效果。技術之發光二極體封梦社播 ^ 散熱係數之基板〇〇頂面被覆有一層絕声 1 回則設有表面銅層〇 6、〇 7，而矣而二昆、曰，、、、巴、、、彖層0 1上引刷層0 5。首先，鑽出一個^ f “ 〇 6、〇 7上則具有表面盲孔08 ·將曰透緣層〇1、露出基材00的目孔〇8，將曰曰片〇2固定於盲孔〇8内的基材〇〇上之後接銲線03於表面銅層〇6、〇7上；最後，於盲孔〇8内脂04以封裝銲線03與晶片〇2，如此即完成封裝；露出於^ 面印刷層0 5的銅層〇 6、〇 7，即是產品的兩個電極。、此一結構雖無第1圖所示結構的結合強度問題，但因為基板00上盲孔08内壁面反射晶片〇2側向光線的能力極差’即便欲以電鍍方式改善，也因為其結構設計問題，無法僅局部電鍍於盲孔〇8位置；盲孔〇8的低反射率，導致二體亮度下降。、正因此’現有之發光二極體封裝技術，尚未足以兼顧散熱能力、結構強度與光輸出效率；事實上，在製程效率及產品彳§賴度上，同樣具有相當的改善空間。【發明内容】Page 6 200532948 V. Description of the invention (2) The metal block 12 intersects with the plastic body 10, causing the metal block 2 to fall off ^ = then = uniform, creating voids, resulting in product failure. In the evening, water and gas enter the packaging structure. The internal wall surface reflectivity of the shot cup 16 is not good. The light irradiated on the reverse side of the helmet metal block 12 is formed by pressing. The design of the light emitting chip 13 to the side 11 can only be used for a single unit. The chip is strong, and it consumes, secondly, its lead frame and a single package structure cannot be achieved, and the second chip is used as a multi-chip package. Figure 2 is another conventional light source output effect. The light-emitting diode of the technology Feng Mengshe broadcasts ^ The substrate of the heat dissipation coefficient 〇〇 The top surface is covered with a layer of sound insulation 1 time is provided with a surface copper layer 〇6, 〇7, and Er Kun, Yue ,,,, Ba ,,, And 彖 layer 0 1 on the brush layer 0 5. First, drill a ^ f "〇6, 〇7 with a surface blind hole 08 · will pass through the edge layer 〇1, the hole 00 exposing the substrate 00 〇8, fix the film 〇2 in the blind hole. After the substrate 〇0 in 8 is connected to the bonding wire 03 on the surface copper layer 〇6, 〇7; finally, in the blind hole 〇8 grease 04 to encapsulate the bonding wire 03 and the chip 〇2, so that the package is completed; exposed The copper layers 〇6 and 〇7 of the printed layer 05 on the surface are the two electrodes of the product. Although this structure does not have the problem of the bonding strength of the structure shown in Figure 1, but because the blind hole 08 in the substrate 00 The ability of the wall surface to reflect the lateral light of the wafer is very poor. 'Even if it is to be improved by electroplating, because of its structural design problems, it cannot be plated only at the position of the blind hole 08; the low reflectivity of the blind hole 08 leads to the two The brightness decreases. Because of this, the existing light-emitting diode packaging technology is not enough to consider heat dissipation capacity, structural strength and light output efficiency. In fact, there is also considerable room for improvement in process efficiency and product reliability. [Summary of the Invention]

第7頁 200532948 五、發明說明（3) 鑒於以上習一種高功率、高其不僅可提升封多晶片封裝，達為達上述目構’乃由金屬基所構成，其中導線區，這些鲜線覆金屬晶座週緣之頂面中央區域及焊線區；而考务面，並藉由數條膠殼體，保護發另外，本發入射出方式射出上；接著，分別面；然後，以數後，則封裝各個再者，本發數支引腳，各弓丨引腳供與一發光^ 形成末端較高之接0 知技術的問題，本發明之目的即在於效能之發光二極體封裝結構及封裳方法: 裝結構之散熱能力與光輸出效率，到混色全彩之效果。 .的’本發明所提供的發光二極體封裝社座、導線架、塑膠殼體、發線架具有數支引腳，每一引；= 區環設於金屬基座頂側週緣；塑膠殼體：與導線架上，其具有一^ + ,^ 開口暴露金屬晶座而形成一反射杯，並露出所有引腳外端光晶片則結合於反射杯十之金屬基座頂電性，接銲線區；透鏡乃用以封裝塑光晶片與焊線。明所提供之則包含了下列步驟：首成形複數塑膠殼體於—支架接合發光晶片於反射杯中之：=;架性連接發光晶片與婷線區；最明提供一種發光二極體之導線架，1 腳係包含相連之内引腳與外引腳，其中二晶片電性連接，且其具有一彎折部，，、使直折彎階層，而外引腳則供與外部電路連〃Page 7 200532948 V. Description of the invention (3) In view of the above, a high-power, high-level package can not only enhance the sealing of multi-chip packages, but to achieve the above-mentioned objective structure, it is composed of a metal base, in which the wire area, these fresh wires are covered The central area of the top surface of the periphery of the metal crystal base and the wire bonding area; while the test surface is protected by several plastic shells. In addition, the hair is emitted in the way of injection; then, the surfaces are separated; then, Then, each package is packaged, and several pins and pins are provided for a light emitting ^ to form a high-end connection. The purpose of the present invention is to provide a light emitting diode packaging structure with high efficiency. And sealing method: the heat dissipation capacity and light output efficiency of the structure, to the effect of color mixing and full color. . 'The light-emitting diode package housing, lead frame, plastic casing, and hair extension frame provided by the present invention have several pins, each lead; = the zone ring is located on the top edge of the metal base; plastic shell Body: on the lead frame, it has a ^ +, ^ opening to expose the metal crystal base to form a reflective cup, and to expose all the pins outside the optical chip is combined with the top of the metal base of the reflective cup. Line area; the lens is used to encapsulate the plastic light chip and the bonding wire. The rules provided by Ming Dynasty include the following steps: first forming a plurality of plastic shells on the bracket to join the light-emitting chip in the reflection cup: =; frame connection between the light-emitting chip and the Ting line area; most clearly provide a light-emitting diode wire Frame, the 1-pin series includes the inner and outer pins that are connected, of which the two chips are electrically connected, and it has a bent portion, so that it can be straightly bent, and the outer pins are for connection with external circuits.

200532948200532948

五、發明說明（4) 楚瞭解本發明之技術手段、特徵及達成功效，兹列舉實施例配合圖式詳細說明如後。、【實施方式】請芩閱第3 A - 3 D圖，本發明第一較佳實施例所提供之發光二極體封裝結構，係由塑膠殼體2〇、導線架21、金屬基座22、發光晶片24與透鏡38所組成。用以散熱之金屬基座22為一盤狀物，其中央具有一突出之平台2 2 0，週緣則具有外突之延伸部2 2 1。導線架21具有四支引腳LI、L2、L3、L4，分別具有獨立之銲線區210、211、212、213圍繞於平台220四周，如第3 A圖之虛線所示。導線架之詳細結構後續將配合第3E圖說明。 “ 本例中，塑膠殼體20係採用成形後表面具有9〇%反射率之PPA材料（p〇iyphthalamide，聚（酉太）酸酯），利用埋入射出技術’使塑膠殼體2 〇於射出時直接包覆導線架 21與金屬基座22，且於金屬基座22之平台22〇上方具有一開孔’而形成環形之反射杯23 ;在將發光晶片24接著於金屬基座2 2上方，並將發光晶片2 4與導線架2丨之銲線區 2 1 〇、2 1 1、2 1 2、2 1 3予以銲線連接，即可結合透鏡3 8完成封裝。塑膠殼體20週緣形成較高的側牆2〇ι，如第3B、3C 1 ·側胺2 0 1内則為較低的接合部2 〇 2，可供與透鏡3 8結。’封^的各種形式，將於後續的第4-7Β圖詳細介紹。由第3B、3C圖中，可看出金屬基座22因為週緣突出的延伸部221 ’結合塑膠殼體2〇的埋入射出設計，而使二者V. Description of the invention (4) To understand the technical means, features and effects of the present invention, the examples are described in detail below together with the drawings. [Embodiment] Please read Figures 3A-3D. The light-emitting diode package structure provided by the first preferred embodiment of the present invention is composed of a plastic housing 20, a lead frame 21, and a metal base 22. The light emitting chip 24 and the lens 38 are composed. The metal base 22 for heat dissipation is a disk-shaped object, with a protruding platform 2 2 0 in the center and an outwardly extending extension 2 2 1 in the periphery. The lead frame 21 has four pins LI, L2, L3, and L4, and has independent bonding wire areas 210, 211, 212, and 213, respectively, surrounding the platform 220, as shown by the dotted line in FIG. 3A. The detailed structure of the lead frame will be described later with reference to Figure 3E. "In this example, the plastic casing 20 is made of a PPA material (poiphthalide, poly (acetic acid)) having a surface reflectance of 90% after being formed, and the plastic casing 20 is injected using the buried injection technique. The lead frame 21 and the metal base 22 are directly covered, and an opening is formed above the platform 22 of the metal base 22 to form a circular reflection cup 23; the light emitting chip 24 is then attached above the metal base 22 And bonding the light-emitting chip 24 with the bonding wire area 2 1 0, 2 1 1, 2 1 2, 2 1 3 of the lead frame 2 丨, and then the lens 3 8 can be used to complete the package. The peripheral edge of the plastic case 20 A higher side wall 200m is formed, such as 3B, 3C 1 · The side amine 201 is a lower joint portion 200, which can be connected to the lens 38. 'Various forms of sealing, will It will be described in detail in the subsequent Figures 4-7B. From Figures 3B and 3C, it can be seen that the metal base 22 is designed by the protruding portion 221 ′ of the peripheral edge combined with the embedding of the plastic housing 20 to make both

第9頁 200532948 五、發明說明（5) '^ 旎緊始、結合，提升產品信賴性；且因無需於封裝製程中行接著金屬基座2 2 (如第1圖之習用技術），亦提升製程生產力與減少製程變異性。其次，將會發熱的發光接著於金屬基座22上，熱能直接經由金屬基座22傳導分出去，只要於金屬基座2 2底部再接觸一散熱基板，即可^ 成良好之熱能傳導與散熱的效果。其次，請參閱第3E圖，本發明所提供發光二極體封壯 …構之導線架2 6 0，於封裝前係位於一支架2 6上，圖中導線架26 0具有四支引腳261，每支引腳261包含相連的内引腳2 62與外引腳263。各個外引腳2 6 3概呈矩形，供與外部電路連接；各個内引腳2 6 2亦概呈帶狀，其上設有透孔 264 ’可增加塑膠射出後之結合強度。尤其，内引腳其具 $ 一幫折部26 5，使其形成末端較高之折彎階層；此舉需 1屬基座2 2射出較高的表面，相對會讓反射杯2 3具有較大 =ΐ度’如此將對多發光晶片的混光效果能夠有所提升， :日守=可使内引腳262的銲線區更接近金屬基座22表面而於辉線作業。再者，内引腳262末端端緣成凹弧狀，且办有内引腳262末端之凹弧狀端緣近乎共圓，如此可騰出 =間丄使得中間的反射杯2 3能有更大的空間安置發光晶區凡成塑膠射出作業之後，四支内引腳2 6 2分別有局部 ^域裸路出來，用作與發光晶片打線結合之銲線區（如第圖之銲線區210、211、212與213)。 ♦、清參閱第4-7Β圖，完成銲線作業之後，依照不同產品吊求’可有不同之封裝作業方式。Page 9 200532948 V. Description of the invention (5) '^ 旎 Start tightly and combine to improve product reliability; and because there is no need to connect the metal base 2 2 in the packaging process (such as the conventional technology in Figure 1), the process is also improved. Productivity and reduced process variability. Secondly, the hot light will be emitted on the metal base 22, and the thermal energy will be conducted directly through the metal base 22. As long as the bottom of the metal base 22 is in contact with a heat-dissipating substrate, good thermal energy transmission and heat dissipation can be achieved. Effect. Secondly, referring to FIG. 3E, the light-emitting diode provided by the present invention is provided with a lead frame 2 60, which is located on a bracket 26 before the package. The lead frame 26 0 in the figure has four pins 261 Each pin 261 includes an inner pin 2 62 and an outer pin 263 that are connected. Each outer pin 2 6 3 is generally rectangular for connection with an external circuit; each inner pin 2 6 2 is also generally in the shape of a band, and a through hole 264 ′ is provided on the outer pin to increase the bonding strength after the plastic is injected. In particular, the inner pin has a bunch of folds 26 5 so that it forms a bending stage with a higher end; this requires a base 2 2 to project a higher surface, which will relatively make the reflection cup 2 3 more Large = ΐ degree 'will improve the light mixing effect of multiple light-emitting chips.: Day guard = can make the bonding wire area of the inner pin 262 closer to the surface of the metal base 22 and work on the glow wire. In addition, the end edge of the inner pin 262 is concavely curved, and the concave arc-shaped end edge of the inner pin 262 is almost round, so that it can be vacated = the gap makes the middle reflection cup 2 3 more A large space is provided for the light-emitting crystal area. After the plastic injection operation, the four inner pins 2 6 2 are partially exposed, and are used as bonding wire areas (such as the bonding wire area shown in the figure). 210, 211, 212, and 213). ♦ Please refer to Figure 4-7B for details. After the wire bonding operation is completed, there may be different packaging operations according to different product requirements.

第10頁 200532948Page 10 200532948

第4圖中，銲線完成的半成σ曰μ 由上方點入樹脂3 3並完全包F曰"取間易之封裝方式，是脂33硬化後，即完成封裝^與銲線25結構，待樹色所使用之激光材料34，可、、β入#兩光輸出效率或進行混激光材料34進行封裝。、何如^中’或直接以純第5圖中，將銲線完成之半包覆發光晶片24與銲線25及導加^可點上内膠35，但僅後，於上再點入樹脂33作外層封:.之銲線區，經硬化内膠35或樹脂33中，或者擇I取激光材料34可混合於混合於内膠35時，可槎^ Γ之；特別是激光材料34 於第度。業，再將樹脂33先點入模粒36 :弟圖：之内膠封裝作後將完成銲線、内膠封穿之本=36〇中（第^圖）；隨 (第6B圖）；經硬化脫槿口，開口朝下貼合模粒之透鏡38(+第6C圖）。、Ρ凡、封裝，並產生光折射必須In Figure 4, the semi-finished σ of the wire is completed. Μ is clicked into the resin 3 3 from the top and fully encapsulates the F " package method. After the grease 33 is hardened, the package is completed and the structure of the wire 25 is completed. The laser material 34 to be used for the tree color can be packaged with the two light output efficiencies of β, #, or mixed laser material 34. "He Ru ^ zhong" or directly in the pure figure 5, the half-coated light-emitting chip 24 and the welding wire 25 and the guide wire ^ can be clicked on the inner glue 35, but only later, click on the resin 33 For the outer layer seal: the welding wire area, after hardening the inner rubber 35 or resin 33, or choose I to take the laser material 34 can be mixed with the inner rubber 35, it can be ^^ Γ; especially the laser material 34 in the first degree. Then, the resin 33 is first clicked into the mold pellet 36: Brother picture: After the inner rubber encapsulation is done, the welding wire and inner rubber encapsulation will be completed = 36% (Fig. ^); Then (Fig. 6B); After hardening, the lens 38 with the opening facing downward is attached to the lens 38 (+ FIG. 6C). , Pfan, package, and produce light refraction must

脂33封裝『Π圖同顯卢不者人以完成第5圖中之内膠35、樹另-透鏡38接人於上；？樹脂33未硬化時（第7A圖），將 (第7B圖）。。、方，树脂33硬化後黏合，即完成封裝發明：用：之圖早無論其最後封裝之形式為何，本反射杯23設計曰，曰C面與塑膠殼體之開口所形成泛產生之光綠^句可達到絕佳之光輸出效果。發光晶片L 因角度較為傾穿透透鏡或樹脂者，其側面光線万貝斜而反射回到反射杯之光線，係藉由具有讀 200532948 五、發明說明（7) 反射率之塑膠殼體與金屬晶座之平台，此，可減少光輸出的損失，並維持# 又反射出去，如會形成點光源的問題。 ”又大的光擴散角度，不另外’請參閱第9A-9B圖，具有£丨、t 導線架21與大面積平台之金屬基座22，腳與四銲線區之面積、多銲點之發光晶片，或者提供夕了 =以，裝單一 ·大屬基座22的埋入射出設計，即使封裝=二片封裝。由於金或多晶片，均無脫落位移之問題。=^面積發光晶片 2 1設計，可供多個發光晶片銲線連接，-本發7之導線架圖）亦可同時於本封裝結構内發光，原色a曰片（第9 B 請參閱第10A、1〇Β圖，根據上成全彩光輸出。封裝結構，本發明提供一種發光二極^知例=發光二極體點在於金屬基座及塑膠殼體，係以埋入之封I方法，其特「支架」的多個導線架上（第3E圖），射出方式結合於構體，進行後續的發光二極體封裝作業並以此支架為主結簡言之，本發明所提供發光二極轉包含以下步驟（如第丨丨圖所示）：首2之封裝方法，主要射出成形複數塑膠殼體於一支架之先^以埋入射出方式 4 i )，每個塑膠殼體分別包覆一金導線架上（步驟杯於金屬基座露出之頂面上，並露 ^座、，且形成一反射線區；接著，分別接合發光晶片於個導線架的多個銲面（步驟42);然後，以數條銲線令之金屬基座頂線區（步驟43 );最後，則 1連接發光晶片與銲 44 )。衣。個塑膠晶座（步驟第12頁 200532948 五、發明說明（8) 當然，實務上更可包含一沖壓裁切該支架之步驟，以分離已完成封裝之導線架。而且，封裝的步驟可如第4-7B 圖所示者，具有各種不同的封裝方式；例如封裝步驟可更包含以一内膠覆蓋於反射杯與銲線區之步驟，而完成内膠封裝之後，也可進行以下步驟：（1 )提供具有一凹槽之一模粒，凹槽中注入一樹脂材料；（2 )將已封裝内膠之塑膠殼體，向下貼合於模粒之凹槽中；及（3 )待樹脂材料已硬化後，將塑膠殼體脫模。以上所述者，僅為本發明較佳之實施例而已，並非用以限定本發明實施之範圍，熟習此技藝者經本發明之揭露後，所據以修改替換者，均屬基於本發明技術思想之衍生創作。因此，在不脫離本發明之技術思想範圍下所作之均等變化與修飾，皆應涵蓋於本發明之申請專利範圍内。The grease 33 is encapsulated. "Pictures are the same as those shown in Fig. 5 to complete the inner glue 35 and tree in Fig. 5-the lens 38 is connected to the people; When the resin 33 is not cured (Fig. 7A), it will be (Fig. 7B). . Square, resin 33 is hardened and glued to complete the packaging invention: Use: The figure is as early as possible regardless of the form of its final package. The design of this reflective cup 23 is that the light green produced by the C surface and the opening of the plastic shell ^ Sentence can achieve excellent light output. Because the light emitting chip L is more inclined to penetrate the lens or resin, its side light is reflected obliquely and reflected back to the reflection cup. It is made of plastic housing and metal with reflectivity after reading 200532948 V. Description of invention (7) The platform of the wafer seat can reduce the loss of light output and keep the # reflected off again, such as the problem of point light sources. "Large light diffusion angle, please refer to Figs. 9A-9B. There are £ 丨, t lead frame 21 and large-area platform metal base 22, the area of the feet and four bonding wire areas, The light-emitting chip, or provided with a single embedded design of the large base 22, even if the package is a two-chip package. Because of gold or multiple chips, there is no problem of falling off. = ^ Area light-emitting chip 2 1 design, which can be used to connect multiple light-emitting chip bonding wires,-the lead frame diagram of the present 7) can also emit light in the package structure at the same time, the primary color a (see 9B, 10B, 10B, According to the above-mentioned full-color light output package structure, the present invention provides a light-emitting diode ^ known example = the point of the light-emitting diode is a metal base and a plastic shell, which is embedded in the I method, its special "bracket" On multiple lead frames (Figure 3E), the injection method is combined with the structure to perform subsequent light-emitting diode packaging operations and use the bracket as the main knot. In short, the light-emitting diode conversion provided by the present invention includes the following steps ( (As shown in Figure 丨丨): The first 2 packaging methods, mainly injection A plurality of plastic casings are placed in a bracket before being inserted into the bracket 4 i), and each plastic casing is respectively covered with a gold lead frame (the cup is exposed on the top surface of the metal base and exposed) , And a reflection line area is formed; then, the light emitting chip is respectively bonded to a plurality of welding surfaces of the lead frame (step 42); then, the top line area of the metal base is made with a plurality of welding lines (step 43); finally Then, 1 connects the light emitting chip and the solder 44). clothes. Plastic crystal holder (step 12 200532948 V. Description of the invention (8) Of course, in practice, a step of punching and cutting the bracket may be included to separate the packaged lead frame. Moreover, the packaging step may be as described in the first step. As shown in Figure 4-7B, there are various packaging methods; for example, the packaging step may further include the step of covering the reflective cup and the bonding wire area with an inner rubber. After the inner rubber packaging is completed, the following steps may also be performed: ( 1) Provide a mold pellet with a groove, and inject a resin material into the groove; (2) Glue the plastic shell with the encapsulated inner plastic down to the groove of the mold pellet; and (3) Wait for After the resin material has been hardened, the plastic shell is demolded. The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Those skilled in the art will be informed by the disclosure of the present invention. Modifications and replacements are derivative works based on the technical ideas of the present invention. Therefore, all equivalent changes and modifications made without departing from the scope of the technical ideas of the present invention should all be covered by the scope of patent application of the present invention.

第13頁 200532948 圖式簡單說明第1圖係先前技術之發光二極體封裝纟士第2圖係先前技術之另一發夯_ 、4 ’ X 一極體封奘έ士错· 第3Α圖係本發明第一較佳實施例之彳r g · 第3B圖係沿第3 A圖A-A剖線—立,丨、目中視不思圖’ 第3C圖係沿第3A圖B-B剖線之立，丨、/、心圖’ 第3D圖係本發明第一較佳實施、圖，第3E圖係本發明第一較佳實不意圖’· 圖 J之導線架結構示意第4圖係本發明第二較佳實施例一第5圖係本發明第三較佳實施例 ^視示意圖；第6A-6C圖係本發明第四較杂之剖視示意圖；圖；土只施例之封裝流程示意第7A-7B圖係本發明第五較隹余圖；汽施例之封裴流程示意第8A-8C圖係本發明之光線散 .第9A-9B圖係本發明第六較佳舍^熱能傳導示意圖；構示意圖；土戰施例之多晶片封裝結第10A-10B圖係本發明第七較一意圖；及土貫施例之封裝流程示第11圖係本發明所提供發井一程圖。、盈體封裝方法之主要流【圖式符號說明】引腳 LI 、 L2 、 L3 、 L4 基板 0 0Page 13 200532948 Brief description of the diagram. Figure 1 is a light-emitting diode packager of the prior art. Figure 2 is another tamping of the prior art. _ 4 'X monopolar seal. Figure 3A Fig. 3B is the first preferred embodiment of the present invention. Fig. 3B is taken along the line AA of Fig. 3A-standing, 丨, the picture is not seen in the eyes'. Fig. 3C is taken along the line BB of Fig. 3A.丨, /, Mind map 'Figure 3D is the first preferred embodiment of the present invention, Figure 3E is the first preferred embodiment of the present invention is not intended' · Figure J schematic diagram of the lead frame structure Figure 4 is the first of the present invention The second preferred embodiment The fifth diagram is a schematic diagram of the third preferred embodiment of the present invention; FIGS. 6A-6C are the fourth diagrammatic cross-sectional diagrams of the present invention; FIG. 7A-7B is the fifth comparison diagram of the present invention; the sealing process of the steam application is shown schematically. 8A-8C is the light dispersion of the present invention. 9A-9B is the sixth best heat conduction of the present invention. Schematic diagrams; Schematic diagrams; Multi-chip packaging junctions of the soil warfare embodiment. Figures 10A-10B are the seventh comparative intent of the present invention; The present invention provides a process chart. 、 The main flow of the body package method

第14 '頁 200532948 圖式簡單說明絕緣層 01 晶片 02 銲線 03 樹脂 04 表面引刷層 05 表面銅層 06 ^ 07 盲孔 08 塑膠本體 10 導線架 11 金屬塊 12 銲線 14 透鏡 15 反射杯 16 穿孔 17 塑膠殼體 20 側牆 201 接合部 202 導線架 21 銲線區 210 >211 ^ 212 ^ 213 金屬基座 22 平台 220 延伸部 221 反射杯 23 發光晶片 24Page 14 '20052005948 Brief description of the drawing Insulating layer 01 Wafer 02 Welding wire 03 Resin 04 Surface brush layer 05 Surface copper layer 06 ^ 07 Blind hole 08 Plastic body 10 Lead frame 11 Metal block 12 Welding wire 14 Lens 15 Reflective cup 16 Perforation 17 Plastic case 20 Side wall 201 Joint 202 Lead frame 21 Wire bonding area 210 > 211 ^ 212 ^ 213 Metal base 22 Platform 220 Extension 221 Reflective cup 23 Light-emitting chip 24

第15頁Page 15

200532948 圖式簡單說明銲線 25 支架 26 導線架 260 引腳 261 内引腳 262 外引腳 263 透孔 264 彎折部 265 樹月旨 33 激光材料 34 内膠 35 模粒 36 凹槽 360 透鏡 38 步驟41 以埋入射出方式射出成形複數塑膠殼體於一之複數導線架上支架步驟4 2 分別接合發光晶片於反射杯中之金屬基座頂面步驟4 3 以數條銲線電性連接發光晶片與銲線區步驟44 封裝各個塑膠晶座200532948 Schematic description of welding wire 25 bracket 26 lead frame 260 pin 261 inner pin 262 outer pin 263 through hole 264 bend 265 tree moon purpose 33 laser material 34 inner rubber 35 mold grain 36 groove 360 lens 38 step 41 Shoot out a plurality of plastic casings on a lead frame by burying and inserting them. Step 4 2 Join the light emitting chip to the top surface of the metal base in the reflection cup. Step 4 3 Connect the light emitting chip electrically with several bonding wires. Step 44 with bonding wire

第16頁Page 16

Claims

200532948 六、申請專利範圍種發光二極線區一金屬基一導線架 ’該等鮮其具有反射杯塑膠殼一開口 ’並露至少一發面，並如申請該金屬晶片位如申請該金屬如申請各該弓I 具有_ 銲線區電路連如申請該等内 t凹弧如申請藉由複透鏡，專利範基座丁頁於該平專利範基座週專利範腳具有彎折部係位於接。專利範引腳末狀端緣專利範體封座；，具線區體，暴露出該光晶數銲封裝圍第面具台上圍第緣外圍第相連，使該等裝結構，包含：有複數引腳，各該引腳分環設於該金屬基座頂側週/·、包覆該金屬晶座週緣與該 '、、曾’ 該金屬晶座頂面中央區线 Ί 等引腳外端及該等銲線區I而片，結合於該反射杯中〈金Μ 線電性連接該等銲線區；及該塑膠殼體。 1項所述發光二極體封雙姓、、口才有一平台位於該反射杯中， -Jl· 0 1項所述發光二極體封梦沾突一延伸部。 1項所述發光二極體封裝社之一内引腳與一外引腳，各S 其形成末端較高之折彎階層該内引腳上，而該等外引跏二’ W卿則供圍第4項所述發光二極體封努、、、Ό 才喬’，端端緣成凹弧狀，且所有兮榮 %寻内引共圓。 51 圍第1項所述發光二極體封奘狂 J衣結構，有銲架上，形成一基座11 其中該發光 ’其中 ’其中内引腳且前述與外在β 其中200532948 VI. Patent Application: Light-emitting diode area, a metal base, and a lead frame, 'these have a reflective cup, a plastic case, and an opening', and at least one surface is exposed, and if the metal wafer is applied for, the metal such as Application for each of the bows I have _ bonding wire circuit connection, such as the application of the inner t concave arc, such as the application of the compound lens, the patent fan base sill page in the flat patent fan base, the patent fan foot has a bent portion is located in Pick up. The patented pin terminal terminal edge patented patent body seal; the wire body, which exposes the optical crystal welding package, the outer periphery of the outer periphery of the mask, and the outer periphery of the outer periphery of the outer periphery of the outer periphery, so that the mounting structure includes: Pins, each of which is divided into rings on the top side of the metal base, and covers the outer periphery of the metal crystal base and the line of the central area of the top surface of the metal crystal base. And the bonding wire areas I and sheets, which are combined in the reflection cup <the gold M wire is electrically connected to the bonding wire areas; and the plastic shell. The light emitting diode described in item 1 has a platform located in the reflecting cup, and -Jl · 0 The light emitting diode described in item 1 has an extension. One of the inner and outer pins of the light-emitting diode package described in item 1, each S forms a bent end with a higher end on the inner pin, and the outer leads are provided by W Qing The light-emitting diodes such as those described in item 4 above are enclosed in concave arcs at the ends, and all the internal leads are rounded. 51 The structure of the light-emitting diode sealing j-suit described in item 1 above has a welding frame to form a base 11 where the light-emitting ‘where’ among the inner pins and the aforementioned and external β among

第17頁 200532948Page 17 200532948

六、申請專利範圍該導線架之引腳·與該銲線區之數量為四。 7 ·如申請專利範圍第1項所述發光二極體封|、纟士構，其巾該塑膠殼體週緣具有較高之一側牆。 8·如申請專利範圍第7項所述發光二極體封袭結構，其中該側牆内係具有高度低於該側牆之接合部。 μ 9·如申請專利範圍第1項所述發光二極體封裝結構，其_ 該塑膠殼體係由PPA材料（P〇lyphthai=Oide ^，聚 (酉太）酸酯）製成。 a6. Scope of patent application The number of pins of the lead frame and the bonding area is four. 7 · As described in item 1 of the scope of the patent application, the light-emitting diode seal | and the structure of the glass structure have a higher side wall on the periphery of the plastic casing. 8. The light-emitting diode encapsulation structure according to item 7 in the scope of the patent application, wherein the side wall has a joint portion with a height lower than the side wall. μ 9 · According to the light emitting diode package structure described in item 1 of the scope of the patent application, the plastic case is made of PPA material (Polyphthai = Oide ^, poly (polyether)). a

10.如申請專利範圍第1項所述發光二極體封裝結構，並該透鏡由一激光材料形成。 1 1 ·如申請專利範圍第1項所述發光二極體封士該透鏡由含有一激光材料之一樹脂形成。 /、 1 2 ·如申請專利範圍第1項所述發光二極體封裝於盆更包含一内膠覆蓋於該反射杯與該等銲線"區、、"。，八中 1 3 ·如申凊專利範圍第1 2項所述發光二極體封^缺中該内膠含有一激光材料。、…構，其 1 4 ·如申請專利範圍第1 2項所述發中該内膠係為一激光材料。光一極體封裝結構，其 15· 一種發光二極體封裝方法，包含以下步驟：10. The light-emitting diode packaging structure as described in item 1 of the scope of patent application, and the lens is formed of a laser material. 1 1 · The light emitting diode seal as described in the first item of the patent application scope The lens is formed of a resin containing a laser material. /, 1 2 · The light-emitting diode is packaged in a basin as described in item 1 of the scope of the patent application, and further includes an inner rubber covering the reflection cup and the bonding wires " area ". The middle glue 1 3 · As described in item 12 of the patent application, the inner diode contains a laser material. The structure is as follows: The inner rubber is a laser material as described in Item 12 of the scope of patent application. A light-emitting diode packaging structure, which includes a light-emitting diode packaging method, including the following steps:

。以埋入射出方式，射出成形複數塑膠扭雕口之複數導線架上，各該塑膠殼體分別包；：全屬 f，且形成一反射杯於該金屬基座露出之屬^ 路出各該導線架之複數銲線區；、上，』分別接合至少一發光晶片於各 /久射杯中之該d. In the form of buried injection, a plurality of plastic leadframes with a plurality of plastic twist-engraved openings are injected, and each of the plastic shells is respectively wrapped; all belong to f, and a reflection cup is formed on the metal base exposed. The plurality of bonding wire areas of the lead frame; ,,,, and ′ are respectively connected to at least one light-emitting chip in each / long shot cup.

第18頁六、申請專利範圍屬基座頂面；區；及複數_、、泉電性連接各該發光晶片與該等録線封裝該塑膠晶座。極體封裝·方法，其 ’以分離已完成封極體封裝方法，其 16·如申請專利範圍第15項所述發光中更包含一沖壓裁切該支架^步裝之該等導線架。 17, = : = =光二極體封裳方法， 18 且各該發光晶片接合ς各^台台1立於各該反射杯中，士:申請專利範圍第15項所述發中各該金屬基座週緣外突一延伸部。f衣方法’其 19.U請專利範圍第15項所述發光二極體 20 中各該塑膠殼體週緣法其如申請專利範圍第丨5項所述發光二極體封^ 21 =該導線架具有複數引腳，各該引腳具有相連之ί 内引腳與一外引腳，各該内引腳具有一彎折形成末端較高之折彎階層，且前述銲線區係，内引腳上，該等外引腳則供與外部電路連接。；^等如申凊專利範圍第2 0項所述發光二極體封裝中該内引腳末端端緣成凹弧狀，且所有 -、端之凹弧狀端緣共圓。 4内引腳末 2 2 ·如申凊專利範圍第1 5項所述發光二極體封叢方、去，i .中該封裝步驟係以一樹脂材料覆蓋於該等塑膠峻體其 200532948 六、申請專利範圍上。 2 3 ·如申請專利範中該樹脂材料 24·如申請專利範中該封裝步驟上。 2 5 ·如申請專利範中該封裝步驟銲線區之步驟 2 6 ·如申請專利範中更包含以— 2 7 ·如申請專利範中更包含以— 2 8 ·如申請專利範中更包含以下提供具有料，將已封裝模粒之凹槽中待該樹脂 2 9 · —種發光二極腳係包含相連腳供與一發光其形成末端較樹脂材圍第2 2項所述發光二極體封農方法，其含有一激光材料。圍弟1 5項所述發光一極體封巢方法，立係以一激光材料覆蓋於該等塑膜殼體圍第1 5項所述發光二極體封裝方法，其包含以一内膠覆蓋於該等反射杯與該等〇圍第25項所述發光二極體封裝方法，其樹脂材料覆蓋於該内膠上之步驟。圍第2 6項所述發光二極體封裝方法，其透鏡結合於未乾之該樹脂材料之步驟。圍第25項所述發光二極體封裝方法，苴步驟： ” 一凹槽之一模粒，該凹槽注入該内膠之該等塑膠殼體，向下貼合於該 ;及材料已硬化後，將該等塑膠殼體脫模。體之導線架，其包含複數引腳，各該引之-内引腳與一外引腳，其中各該内引，片電性連接，且其具有一彎折部，使咼之折彎階層，而該外引腳則供與外部Page 18 VI. The scope of patent application belongs to the top surface of the base; the area; and a plurality of _, and springs electrically connect each of the light-emitting chips and the recording wires to package the plastic crystal base. Polar body packaging method, which separates the completed sealed polar body packaging method, and 16. As described in item 15 of the scope of patent application, the light emitting device further includes a stamping and cutting of the lead frame mounted in steps. 17, =: = = Photodiode sealing method, 18 and each of the light-emitting wafers are attached to each of the reflection cups, and each of the metal bases is described in claim 15 of the scope of patent application. The seat periphery protrudes from an extension. f-coat method '19. U. Please apply the perimeter of the plastic case in the light-emitting diode 20 described in item 15 of the patent scope. It is the light-emitting diode seal described in item 5 of the patent scope ^ 21 = the wire. The frame has a plurality of pins, each of which has an inner pin and an outer pin connected to each other, each of the inner pins has a bent layer formed by bending to form a higher end, and the aforementioned bonding wire area, the inner lead These pins are used to connect to external circuits. ; ^ Etc. As described in claim 20 of the light emitting diode package, the end edges of the inner pins are concave arc-shaped, and the concave arc-shaped edges of all the-and ends are round. 4 End of the inner lead 2 2 · As described in claim 15 of the scope of the patent application, the light-emitting diode is sealed, and the packaging step is to cover the plastic body with a resin material. 200532948 6 Scope of patent application. 2 3 · As the resin material in the patent application 24. In the packaging step in the patent application 2 5 · As in the patent application, the step of bonding the soldering area of the packaging step 2 6 · If the patent application includes the-2 7 · If the patent application includes the-2 8 · If the patent application includes the The following is provided with the material, the resin 2 9 · · a kind of light emitting diode foot system including a connecting foot for a light emitting diode formed in the groove of the encapsulating pellet is more than the light emitting diode described in the resin material 22 A method for bulk farming, which includes a laser material. The method of enclosing a light-emitting diode according to item 15 of the sibling is to cover the plastic film casing with a laser material. The method of encapsulating the light-emitting diode according to item 15 includes encapsulating with an inner rubber. In the reflective cup and the light emitting diode packaging method described in item 25, the resin material is covered on the inner rubber. The method for encapsulating a light-emitting diode according to item 26, wherein the lens is combined with the resin material which has not been dried. The method of encapsulating a light-emitting diode as described in item 25, the steps are as follows: "One of the grooves is one of the pellets, which is injected into the plastic shells of the inner plastic, and is attached to the downward; and the material has been hardened. After that, the plastic shells are demolded. The lead frame of the body includes a plurality of pins, each of which is an inner pin and an outer pin, wherein each of the inner pins is electrically connected to the chip and has A bent portion, so that the bent level of the 咼, and the outer pin is provided for external

第20頁 200532948 六、申請專利範圍電路連接。 3 〇.如申請專利範圍第2 9項所述之發光二極體之導線架，其中該等内引腳末端端緣成凹弧狀，且所有該等内引腳末端之凹弧狀端緣共圓。 3 1.如申請專利範圍第2 9項所述之發光二極體之導線架，其中該引腳之數量為4。 3 2.如申請專利範圍第2 9項所述之發光二極體之導線架，其中該内引腳上具有一透孔。Page 20 200532948 6. Scope of patent application Circuit connection. 30. The lead frame of the light-emitting diode as described in item 29 of the scope of the patent application, wherein the end edges of the inner pin ends are concave arc-shaped, and the concave arc-shaped end edges of all the inner pin ends are Round. 3 1. The leadframe of the light-emitting diode as described in item 29 of the patent application scope, wherein the number of the pins is four. 3 2. The lead frame of the light-emitting diode according to item 29 of the patent application scope, wherein the inner pin has a through hole.

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