200529520 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種藉由熱壓接手段而對於形成在軟性 電路基板（FPC=FleXiblePrintedCircuit)之電極 面來假固定異方性導電膜UCF=AnisotropicConductive200529520 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for temporarily fixing an anisotropic conductive film UCF = AnisotropicConductive to an electrode surface formed on a flexible circuit board (FPC = FleXiblePrintedCircuit) by thermocompression bonding.
Film)之技術；特別是關於—種在該假固定製程所利 熱壓接裝置及熱壓接方法、藉由該前述熱壓接方法所以 之軟性電路基板以及搭載前述電路基板之電子機器。 【先前技術】 由於行動電話機或可攜式資訊終端機（ρΜ)等之並 =要求可以具有高精細之圖像顯示功能並JL實現薄型^低 要，電力的顯示面板，向來，液晶顯示面板係成為滿足該 ，未之顯示面板而採用於許多製品。此外，在近來， ^胃成為自發光型發光元件之特質之有機EL (電_ ^示面板係擔祕前述—部分之f子機器，這個係成^ 目代習知之液㈣示面板之下—世代之齡面板而受到注 在此種顯㈣板，在構成面板之例如_等之透縣 ，呈條紋狀地配列許多資料線以及直交 描線’在這些資料線和择描線間之交差位 例如呈矩陣狀地形成顯示像素。 ^ 刀別 在構成顯示“ 〜之终多電極配線而接受來自 200529520 :素驅動用資料器及掃插驅動器等之驅動訊號之構 正如前面敘述，例如作為 板上之資料線及掃描線而分別連接基 =之)手=來採用透過異方性導=== 二接而相互地進行連接之手段。 粒子，可以性樹脂薄膜内分散許多導電 對峙之端子;，連繫導力=熱=頂:’而在 接。因此’利用=:::手;:’也，機械之連 以適當地利用在總括地連接許多端子間述’可 板之了利用/⑶而對於例如構成顯示面 首先勃之貝料線或掃描線來熱壓接FPC，因此， 著，可之電極配線面來假固定ACF之製程。接 固定“之前掃描線，抵接假 式壓接)頂頭而透過二:二广始，編^ 或掃描線;_來連接‘之各㈣極Ιί明基板上之資料線 用假對於FPC而假固定前述ACF之製程以及利 古，而將FPC正式壓接於顯示面板面之製程而 【專利文獻請人之已經申請之專利文獻1。 =驮丄】日本特開2003 —86999號公報 疋透過則述ACF而電路連接於例如顯示面板之基 200529520 板面之前述FPG係成為在軟性賴狀基底構件面形成銅箱 圖案（電極配線）並且在其上面塗敷絕緣阻劑之構造。接 者，成為在假固定前述ACF之區域不塗敷絕緣阻劑而露出 前述電極配線之構造。 ^第一圖係顯示該例子，擴大及顯示Fpci之端部。符號 2係顯示構成m：l之薄餘基底構件。在該基底構件^ 上，正如以虛線所示，藉由銅箔所造成之電極配線3係相 互平行地形成為條紋狀，在形成該電極配線3之面，在除 了後面敘述之一部分以外之整個面，還塗敷絕緣阻劑，形 成絕緣阻劑層4。 少 在藉由符號5所示之鏈線而包圍之矩形區域係顯示假 固定ACF (同樣藉由符號5所示）之區域，前述絕緣阻劑 層4係使得假固定ACF5之區域内之前述電極配線3之部 ^f為阻劑層之未形成（未塗裝）部分。也就是說，在 施行藉由符號3 a所示之剖面線之區域，形成為露出電極 配線3之狀態。接著，在電極配線之露出部分3 a，正如 以不路白之狀態來顯示剖面線，配合需要而施行金電鍍3 b 〇 正如前面敘述’ACF5係覆蓋電極配線之露出部分3 a 之整體’同時，還進行假固定而也覆蓋其周邊之施行絕緣 阻劑層4之部分。這個係絕緣阻劑層4之境界部附近容易 呈力學地集中應力，在作用重複彎曲等之力時，容易在該 部分發生破裂等。因此，為了避免前述問題，因此，ACF5 係固定在廣泛地覆蓋包含電極配線3之露出部分3 a之絕 200529520 緣阻劑層4之形成位置之區域。 第一圖及第二圖係顯示對於第一圖所示構造之FPCi 來假固定ACF5之狀況。也就是說，第二圖及第三圖之而 係藉由擴大第-圖所示之六部分之剖面圖而進行顯示。此 外，在第二圖及第三圖，藉由相同符號而顯示對應於第一 圖所示之各部分之部分。 正如第二圖及第三圖所示，在對kFPC1來假固定acf5 之狀怨下’ FPG1係載置於構成熱壓接裝置之支承台座工〇 上。該支承台座1 〇係藉由比較硬質且熱傳導係數效小之 素材所構成，電路基板之載置面i 〇 s係變得平坦（平面 狀）。接著，在FPC1之上面，正如第二圖所示，載置Αα?5。 該ACF5之載置位置係正如前面敘述，進行載置而覆蓋包含 電極配線3之露出部分3 a之絕緣阻劑層4之形成位置。 在該狀恶下，正如第二圖所示，由於在阻劑層4具有厚度， 因此，在電極配線之露出部分3 a和阻劑層4間，發生位 差，在該位差部分，在ACF5之背面侧，產生比較大之空間 1 3 a。接著，正如第二圖所示，下降構成熱壓接裝置之 熱壓接頂頭1 i而加熱ACF5,同時，將這個壓接在Fpci 側。藉此而使得構成ACF5之樹脂素材發生熱 假固定於FPC1上。接著，正如第三圖所示，結束熱壓接頂 頭1 1進行上升而對於FPC1來假固定ACF5之製程。 在對於FPC1來假固定ACF5之狀態下，正如第三圖所 示，由於電極配線之露出部分3 a和阻劑層4間之位差存 在，因此，發生所謂在ACF5之背面側還殘留密封之空間工 200529520 3 b之問題。殘留於該密封之空間1 3 b内之空氣係在進 行後面之正式壓接時，接受來自熱壓接頂頭之熱而進行膨 脹’發生所謂疏忽和電極配線之露出部分3 a間之電氣連 接之問題。 為了避免前述問題，因此，考慮例如在絕緣阻劑層4 預先製作空氣之散逸圖案。但是，由於阻劑層4係一般藉 由網版印刷所形成，因此，發生〇· 3mm左右之誤差，不容 易形成對應於細間距之電極端子（電極配線3間）之微細 之空氣之散逸圖案。此外，如果避免網版印刷而使用罩幕 等的話’則能夠在阻劑層4作成微細之空氣之散逸圖案， 因此，製程變得複雜及成本升高而無法實現。 一 【發明内容】 本發明係著眼於前述問題點而完成的；其課題係提供 種了以在對於軟性電路基板來假固定異方性導電膜之製 轾而極度地減低在電路基板和異方性導電膜間形成密閉空 ^之，度的熱壓接裝置及熱壓接方法；企圖藉此而提供提 高電氣可靠性之軟性電路基板以及搭載該軟性電路基板之 電子機器。 用以解決前述課題所完成之關於本發明之熱壓接裝置 ，在利用於對於形成在雜電路基板之電極崎面來假固 疋“方電膜之熱墨接製程並且具備載置前述電路基板 =支承台座以及對於前述電路基板之電極配線面還抵接於 置之異紐導賴之熱壓接糊的熱壓接裝置、在前述 承台座之前述軟性電路基板之載置面具備前述電路基板 200529520 200529520 之深度之凹部之方 之具有薄膜狀基底構件厚度20〜100% 面，具有特徵。 此外’用以解決前述課題所完成之關於本發明之熱壓 接方法係_前述構造之熱壓接裝置而對於形成在軟ς電 路基板之電極配線面來㈣定異方性導電膜技^接方 法，前述軟性電路基板係具備將薄膜狀基底構件和配列於 件上之電極配線甚至絕緣阻_予以層積而露出 線一部分的構造，將前述電極配線之露出部和 則述絕緣阻劑和之境界部，配置在前述 凹部之形成位置’將前述電極配線之露出部，=== 支承台座之軟性電路基板之魅面，同時，藉 = 性導電膜而覆蓋包含前述電極配線之$ /、 間之境界部之電極配線之露二:::== 14導電膜，抵接熱壓接頂頭，來對於_ ^ 1 假固定異方性導電膜之方面，具邊電路基板， 【實施方式】 =，就.本發明之熱壓接裝置及_轴壓接裝 進行說明。此外，即使是在以下態而 接裝置及熱謝法，也使用第一圖月發明之熱壓 此，藉由相同符號而顯示對應於第 〜之fpc。因 分，其詳細說明係適當地省略/目所不之各部分之部 —第四®及第五圖偏領於本發明之熱_第 貫施形態，在該鍾難置所採用之支承台幻〇，在 200529520 軟性電路基板之載置面i 0 s之一部分，形成凹部玉4。 接著，在對於㈣來假狀咖時，首先將聰之電極 配線之露出部3 a和絕緣阻劑層4間之境界部，配置在支 f台座1 Q之前述凹部1 4之形成位置，使得電極配線之 路出部3 a位處於前述支承台座之Fpc之載置面丄〇 $ 上。 藉由像這樣在支承台座工〇上載置FPC1而正如第四 圖所示，使得FPC1之端部進入至形成於支承台座1 〇之凹 部1 4 :也就是說，構成FPC1之薄膜狀基底構件2及電極 配線3係其储具有比較柔軟性，由於其本身重量而成為 第四圖所示之狀態。因此，層積於Fpci端部之絕緣阻劑層 4係也正如第四圖所示，受到變形，形成於該絕緣阻劑層 4和電極配線之露出部3 a間之位差係比較於第二圖所示 之例子時，變得非常小。 在該狀態下，正如第四圖所示，在載置ACF5之狀況， 形成於ACF5背面侧之空間丄3 c係非常小。因此，在該狀 恝下，正如第五圖所示，在ACF5由於熱壓接頂頭丄丄而受 到加熱及壓接之狀況下，在ACF5之背面側幾乎不積存空氣 之狀態，可以在FPC1之上面，假固定祕。可以藉此而 即使是在對於例如顯示面板等之其他基板等來進行正式壓 接時’也避免因為存在於ACF5背面側之空氣積存所產生之 前述問題。 第六圖係擴大及顯示前述支承台座i 〇之一部分，這 個係顯示在第四圖藉由虛線所包圍之C&D部分。該支承 11 200529520 Γ=: Γ狀台座本體10 a來重合板狀輔助體 T所輔助體1〇b之上面係成為Fpc之載置面 =“：二在辅助體之非重合部、也就是不重合輔助 體1 0 b之口P刀，形成前述凹部工4。 在由别述凹部1 4開始而***於Fpc载置面丄〇 s之 ，界部，成為具有相對於前述凹部14之面超過⑽度之角 又α之傾斜面1 Q e。此外，在第六圖所示之例子，前述 U30度左右。這個係因為所謂在前述α成為90度以下 之超出狀態之情況下，FPC1受到熱壓接頂頭i i之抵接壓 而受到損叙程度㈣非fA，域地，在成為前述角度 5傾斜面1 〇 e之狀態下，FPC1受到損傷之程度變得非 韦小之理由所造成的。 >攻於别述支承台座1〇之凹部14之深 =、換句話說在該實施形態對於台座本體丨Q a所重合之 體1 Q b之厚度1 Q d係最好是在構成Fpcl之薄膜 構件2之厚度20〜職之_。這個係在凹部1 =/罙度更加淺於前述數值之狀態下，藉由設置凹部14 所得到之前述效果之程度變少。 —在則述凹部14之深度更加深於前述數值之狀態下， 在藉由熱壓接頂頭11所造成之壓接時 ，FPC1變形於凹部 1 4側之裎度係變大，在一部分，發生熱壓接之不良。此 ’在凹部1 4之深度更加深於前述數值之狀態下，在受 到熱壓接頂頭1 1之抵接壓之情況，也發生所謂導致配列 於FPC1之電極配線3之切斷之其他問題。 12 200529520 作為一例子係將使得構成前述聊 件2之厚度成為25_、電極 專^大基底構 且絕緣阻劑層4之厚度成為5〜25//尽度成為丨2/^並 且求出二㈣之FPC1作為樣本而 二Ϊ:= 〇之凹部14之理想深度之實驗 、4』不於弟八圖。此外，在絕緣阻劑層4之 :面=細寬者係由於藉著印刷來形成阻二而 在一片基板内發生相當多之不均之緣故。 第八圖所示之實驗資料係顯示相對於凹部 於構成FPC1之基底構件2厚度而求出鐘接良品 =⑷之關係之結果。可以由該第八圖所示之資料而理 ^特別最好是具備FPC;之基底構件厚度別〜聰之深 又之凹部1 4 ’最好是在實用上，將具有別〜醜深度 之凹部14予以具備。 接著，第七圖係藉由剖面圖而顯示關於本發明之熱壓 ，裝置之第二實施形態，這個係對應於顯示已經說明之第 —實施形態之第四圖。在該第七圖所示之第二實施形態， 在形成於支承台座i 〇之凹部χ 4，形成複數個吸引孔丄 6。可以藉此而將載置於支承台座丄〇之Fpci之背面，吸 弓丨及固定於凹部1 4側。 因此，在藉由構成第七圖所示之熱壓接裝置之支承台 座1 0之形態時，對於FPC1之背面，進行作用而藉由負壓 來吸引至凹部1 4侧，因此，在FPC1上載置ACF5之狀態 下’可以使得形成於ACF5背面側之空間1 3 c之容積變得 更加小。可以藉此而在藉由利用熱壓接頂頭1 1來加熱壓 13 200529520 接ACF5以便假固定於體上之狀態下，使得在聰和 ACF5間殘留空氣之機率變得更加低。 在猎纟採㈣財發日狀熱壓接裝置及顯接方法而 ;，、壓接異雜導電叙軟性妨基板時，舰_度地減 低在電路基板和異方性導電_形成密閉空間之程度，因 ^ ’可以提供提高電氣可靠性之倾電路基板以及搭載該 車人性電路基板之電子機器。 ^上_之第四圖〜第七圖所示之實施形態係顯示處 理第-圖所7F之敕性電路基板i之端部、也就是處理第一 圖所示之U電路基板之A部分之熱壓接裝置之部分構 & °但疋’即使是在第―圖所示之B部分，也抱持已經說 明之同制題，因此，即使是在處理第-圖所示之B部分 之支承σ座，也呈對照地形成同樣之凹部1 4。 北此外’就採用前述軟性電路基板之電子機器而言，在 月景技術之攔位，鱗顯示器之顯示面板，來作為一例子， 但是，本發明係不僅是採用於前述特定者，此外，也可以 採用在半賴積電路之凸塊和軟性電路基板間之連接以及 同樣之軟性電路基板間之連接等，能夠有助於提升採用這 些之電子機器之可靠性。 【圖式簡單說明】 第-圖係說明FPC端部之構造和假固^似之位置之 俯視圖。 第二圖係說明在習知之熱壓接裝置、在Fpc假固定acf 之狀況之剖面圖。 200529520 第三圖係說明同樣假固定結束之狀況之剖面圖。 第四圖係說明在關於本發明之熱壓接裝置之第一實 施形態、在FPC假固定ACF之狀況之剖面圖。 第五圖係說明同樣假固定結束之狀況之剖面圖。 第六圖係擴大及顯示第四圖之C和D部分之剖面圖。 第七圖係說明在關於本發明之熱壓接裝置之第二實 施形態、在FPC假固定ACF之狀況之剖面圖。 第八圖係顯示將形成在關於本發明之熱壓接裝置之 支承台座之凹部之理想深度予以求出之實驗結果之圖。 【主要元件符號說明】 α角度 Α部分 B部分 C部分 D部分 1 FPC (軟性電路基板） 2 基底構件 3 電極配線 3 a 露出部分 3 b 金電鍍 4 絕緣阻劑層 5 ACF (異方性導電膜） 10 支承台座 1 0 a 平面狀台座本體 1 Ob 板狀輔助體 1 0 c 傾斜面 15 200529520 10s 載置面 11 熱壓接頂頭 13a 空間 13b 空間 13c 空間 14 凹部 16 吸引孔 16Film) technology; in particular, a type of thermocompression device and thermocompression method used in the fake fixing process, a flexible circuit board by the aforementioned thermocompression method, and an electronic device equipped with the aforementioned circuit board. [Prior technology] Due to the combination of mobile phones or portable information terminals (ρΜ), etc., it is required to have a high-definition image display function and JL to achieve a thin, low-profile, power-driven display panel. Traditionally, liquid crystal display panel systems In order to satisfy this, many display products are used. In addition, recently, the organic EL (electrical display panel) that has the characteristics of a self-luminous light-emitting element is an electronic display panel that is responsible for the above-mentioned part of the sub-machine. Generational panels have received attention in such display boards. In the prefectures that make up the panel, such as _, many data lines and orthogonal lines are arranged in stripes. The intersection between these data lines and the selected lines is, for example, The display pixels are formed in a matrix. ^ The structure of the display "~" at the end of the multi-electrode wiring and receiving the drive signals from 200529520: the driver drive data device and the scanning driver is described above, for example, as the data on the board. And scanning lines are connected to the base separately. (Hand) is used to connect with each other through anisotropic conduction === two connections. Particles can disperse many conductive opposite terminals in the resin film; Conductive force = heat = top: 'while connected. So' use = ::: hand ;: 'Also, the mechanical connection is properly used in the connection of a large number of terminals collectively. Display surface First of all, the BPC material line or scanning line is used for thermocompression bonding of FPC. Therefore, the electrode wiring surface can be used to falsely fix the ACF process. Then fix the "previous scanning line and abut the false crimping) head and pass through two: Erguangshi, edit ^ or scan line; _ to connect the data lines on the respective substrates of the Ming board with fake FPC and fixed the aforementioned ACF process and Ligu, and formally crimp the FPC to the display panel surface The process and [Patent Literature invites people who have applied for Patent Literature 1. = 驮 丄] Japanese Patent Laid-Open No. 2003-86999 疋 The aforementioned FPG system, which is connected to, for example, a display panel base 200529520 board surface through the ACF described above, forms a copper box pattern (electrode wiring) on the surface of a flexible base member and A structure in which an insulating resist is applied. Then, a structure is provided in which the electrode wiring is exposed without applying an insulating resist in a region where the ACF is temporarily fixed. ^ The first figure shows this example, and the ends of Fpci are enlarged and shown. The symbol 2 indicates a thin surplus base member constituting m: l. On the base member ^, as shown by a dotted line, the electrode wirings 3 made of copper foil are formed into stripes in parallel with each other. On the surface on which the electrode wirings 3 are formed, the entire surface except for a part described later An insulating resist is also applied to form an insulating resist layer 4. Rather, the rectangular area enclosed by the chain line shown by symbol 5 is a region where the ACF is pseudo-fixed (also shown by symbol 5), and the aforementioned insulating resist layer 4 is the electrode in the region where the ACF5 is pseudo-fixed. The portion ^ f of the wiring 3 is an unformed (unpainted) portion of the resist layer. That is, in a region where the hatching shown by the symbol 3a is performed, the electrode wiring 3 is exposed. Next, in the exposed portion 3a of the electrode wiring, as shown in a broken state, the hatching is performed, and gold plating 3b is performed according to the needs. As described above, "ACF5 series covers the entire exposed portion 3a of the electrode wiring." Also, a portion where the insulating resist layer 4 is applied is also false-fixed and also covers its periphery. In the vicinity of the boundary portion of this insulating resist layer 4, stress tends to be mechanically concentrated, and when a force such as repeated bending is applied, cracks and the like easily occur in the portion. Therefore, in order to avoid the aforementioned problems, the ACF5 is fixed in a region that extensively covers the position where the exposed portion 3a of the electrode wiring 3a is formed. The first and second figures show the situation where the ACF5 is fixed to the FPCi of the structure shown in the first figure. That is, the second and third figures are displayed by enlarging the sectional view of the six parts shown in the first figure. In addition, in the second and third figures, parts corresponding to the parts shown in the first figure are shown by the same symbols. As shown in the second and third figures, FPG1 is placed on the support base worker 0 that constitutes the thermocompression bonding device under the condition that kFPC1 is falsely fixed to acf5. The support base 10 is made of a relatively hard material with a small thermal conductivity coefficient, and the mounting surface i 0 s of the circuit board is flat (flat). Next, on the FPC1, as shown in the second figure, Aα? 5 is placed. The mounting position of the ACF 5 is the position where the insulating resist layer 4 including the exposed portion 3a of the electrode wiring 3 is mounted as described above. In this state, as shown in the second figure, since the resist layer 4 has a thickness, a disparity occurs between the exposed portion 3 a of the electrode wiring and the resist layer 4. In this disparity portion, The back side of ACF5 creates a relatively large space 1 3 a. Next, as shown in the second figure, the ACF5 is heated by lowering the thermocompression head 1 i constituting the thermocompression bonding device, and at the same time, this is crimped on the Fpci side. As a result, the resin material constituting ACF5 is thermally fixed to FPC1. Next, as shown in the third figure, the process of ending the thermocompression bonding head 1 1 and temporarily fixing ACF5 to FPC1 is ended. In the state where ACF5 is pseudo-fixed for FPC1, as shown in the third figure, because there is a gap between the exposed portion 3a of the electrode wiring and the resist layer 4, there is a so-called remaining seal on the back side of ACF5. Space Engineering 200529520 3 b. The air remaining in the sealed space 1 3 b is subject to thermal expansion from the thermal compression head during the subsequent formal crimping. The so-called negligence and electrical connection between the exposed parts of the electrode wiring 3 a occur. problem. In order to avoid the aforementioned problems, it is conceivable, for example, that a diffusion pattern of air is prepared in advance in the insulating resist layer 4. However, since the resist layer 4 is generally formed by screen printing, an error of about 0.3 mm occurs, and it is not easy to form a fine air dissipation pattern corresponding to fine-pitch electrode terminals (electrode wiring 3). In addition, if screen printing is avoided and a mask or the like is used, a fine air dissipation pattern can be formed on the resist layer 4, and therefore, the manufacturing process becomes complicated and the cost becomes high, which cannot be achieved. [Content of the Invention] The present invention is completed focusing on the aforementioned problems; its subject is to provide a method for extremely reducing the anisotropic conductive film in a flexible circuit substrate, thereby extremely reducing the A thermocompression bonding device and a thermocompression bonding method are used to form a sealed space between the flexible conductive films; in order to provide a flexible circuit substrate that improves electrical reliability and an electronic device equipped with the flexible circuit substrate. The thermocompression bonding device of the present invention completed to solve the foregoing problems is used in a thermal ink bonding process for falsely fixing a “square electric film” to an electrode formed on a miscellaneous circuit substrate, and is provided with the aforementioned circuit substrate. = A thermocompression bonding device that supports the base and the thermocompression paste of the electrode wiring surface of the circuit board, which is in contact with each other; and the mounting surface of the flexible circuit board on the pedestal includes the circuit board 200529520 200529520 The depth of the recessed part has a thickness of 20 to 100% of the surface of the film-like base member, and has features. In addition, the method of thermocompression bonding of the present invention completed to solve the aforementioned problem is the thermocompression bonding of the aforementioned structure The device is used to determine the anisotropic conductive film connection method on the electrode wiring surface of the flexible circuit board. The aforementioned flexible circuit board is provided with a film-like base member and electrode wiring arranged on the component, or even an insulation resistance. A structure in which a part of the wire is exposed by being laminated, and the exposed portion of the electrode wiring and the boundary portion of the insulating resistor are disposed in the shape of the concave portion. Position 'expose the exposed part of the aforementioned electrode wiring, === support the fascinating surface of the flexible circuit board of the pedestal, and at the same time, cover the electrode wiring by the conductive conductive film and cover the electrode wiring of the boundary part ::: == 14 conductive film, abutting the thermocompression bonding head, to _ ^ 1 false fixation of the anisotropic conductive film, with edge circuit board, [Embodiment] =, just. The thermocompression bonding of the present invention The device and _shaft press-fitting will be described. In addition, even if the device and the heat-receiving method are connected in the following state, the hot-pressing method invented in the first figure is used, and the same symbol is used to display the fpc corresponding to the first ~ Due to points, its detailed description is appropriately omitted / parts of the various parts-the fourth ® and the fifth figure are partial to the hot _ first embodiment of the present invention, the support table used in this bell is difficult to set 〇〇, the recessed part 4 is formed on a part of the mounting surface i 0 s of the flexible circuit board of 200529520. Next, when the dummy is made, the exposed part 3 a of the Satoshi electrode wiring and the insulating resist layer are first formed. The boundary section of 4 rooms is arranged in the shape of the aforementioned recessed section 1 4 on the support base 1 Q Position so that the exit portion 3a of the electrode wiring path is located on the mounting surface of the Fpc of the aforementioned support stand 丄 〇 $. By placing FPC1 on the support stand worker 0 as shown in the fourth figure, the FPC1 The end portion enters the recessed portion 14 formed in the support base 10: That is, the film-like base member 2 and the electrode wiring 3 constituting the FPC1 are relatively flexible, and are shown in the fourth figure due to their own weight. Therefore, the insulation resist layer 4 laminated on the end of the Fpci is also deformed as shown in the fourth figure, and the position difference between the insulation resist layer 4 and the exposed portion 3 a of the electrode wiring is formed. Compared with the example shown in the second figure, it becomes very small. In this state, as shown in the fourth figure, when the ACF5 is placed, the space 丄 3 c formed on the back side of the ACF5 is very small. Therefore, in this state, as shown in the fifth figure, under the condition that the ACF5 is heated and crimped by the thermocompression head 顶, there is almost no air accumulated on the back side of the ACF5, and it can be stored in the FPC1. Above, fake fixed secret. This makes it possible to avoid the aforementioned problems caused by the accumulation of air on the back side of the ACF5, even when the other substrates such as a display panel are formally bonded. The sixth diagram expands and shows a part of the aforementioned support base i 0, which is shown in the fourth diagram in the C & D section surrounded by a dotted line. The support 11 200529520 Γ =: The Γ-shaped base body 10 a overlaps the upper surface of the auxiliary body 10 supported by the plate-shaped auxiliary body T as the mounting surface of the Fpc = “: two in the non-overlapping part of the auxiliary body, that is, not The mouth P knife of the auxiliary body 10 b is overlapped to form the aforementioned recessed section 4. The boundary section is formed to have a surface that exceeds the recessed section 14 with respect to the recessed section 14 starting from the other recessed section 14. The angle of ⑽ degree is also the inclined surface 1 Q e of α. In addition, in the example shown in the sixth figure, the aforementioned U is about 30 degrees. This is because the so-called FPC1 is exposed to heat when the aforementioned α becomes below 90 degrees. The degree of damage caused by the contact pressure of the crimping head ii is not fA, and it is caused by the reason that the degree of damage to the FPC1 becomes non-small in a state where the angle 5 is the inclined surface 10e. > Depth of the recessed portion 14 of the other supporting base 10 = In other words, in this embodiment, the thickness of the body 1 Q b which overlaps with the base body 丨 Q a 1 Q d is preferably formed in the Fpcl The thickness of the thin film member 2 is 20 to _. This is in the recess 1 = / 罙 degree is shallower than the previous number In this state, the degree of the aforementioned effect obtained by providing the recessed portion 14 becomes smaller.-In a state where the depth of the recessed portion 14 is deeper than the aforementioned value, when the crimping is caused by thermal crimping the head 11 The degree of deformation of the FPC1 deformed on the side of the recessed portion 14 becomes larger, and in some parts, the failure of the thermocompression bonding occurs. In this state, the depth of the recessed portion 14 is deeper than the aforementioned value, and the head 1 1 is subjected to thermocompression bonding. In the case of the abutment pressure, other problems such as the so-called cutting of the electrode wiring 3 arranged in the FPC1 also occur. 12 200529520 As an example, the thickness of the above-mentioned chat piece 2 will be 25 mm, and the electrode structure will be large. The thickness of the insulating resist layer 4 becomes 5 ~ 25 // as much as possible 2 / ^ and the experiment of the ideal depth of the recessed part 14 of the two Ϊ: = 〇, 4 不 not less than eight In addition, in the case of the insulating resist layer 4: the surface = thin width is caused by considerable unevenness in a substrate due to the formation of the resistance 2 by printing. The experimental data shown in Figure 8 shows Thickness of the base member 2 with respect to the recessed portion constituting the FPC1 Calculate the result of the relationship between the good quality of the bell and the good = ⑷. It can be reasoned from the information shown in the eighth figure ^ It is particularly preferable to have FPC; the thickness of the base member ~ the depth of the deep and concavity 1 4 ' Practically, the recessed portion 14 having a different depth is provided. Next, the seventh figure is a sectional view showing the hot pressing of the present invention and the second embodiment of the device, which corresponds to the display already explained The fourth diagram of the first embodiment. In the second embodiment shown in the seventh diagram, a plurality of suction holes 丄 6 are formed in the recessed portion χ 4 formed in the support base i 0. The Fpci placed on the support stand 丄 can be used to fix the suction bow 丨 on the 14 side of the recessed portion. Therefore, in the form of the support base 10 constituting the thermocompression bonding device shown in the seventh figure, the back surface of the FPC1 is acted upon and attracted to the recessed portion 14 side by negative pressure. Therefore, it is loaded on the FPC1. When the ACF5 is placed, the volume of the space 1 3 c formed on the back side of the ACF5 can be made smaller. This can be used to make the temperature of the air remaining between Satoshi and ACF5 even lower under the condition that the ACF5 is connected to the ACF5 to be falsely fixed on the body by using the thermal compression head 11 1 to heat and press. In the case of hunting, collecting and developing the thermal crimping device and the display method, and crimping the heterogeneous conductive substrates, the circuit board and the anisotropic conductive substrates are reduced to form a closed space. It is possible to provide a tilt circuit board that improves electrical reliability and an electronic device equipped with the human circuit board of the vehicle. ^ The fourth embodiment to the seventh embodiment are shown in Fig. 7F. The end portion of the flexible circuit board i shown in Fig. 7F is processed, that is, the portion of the U circuit substrate shown in the first diagram is processed. Part of the structure of the thermocompression device & ° But 疋 'even in the part B shown in Figure--still holds the same problem as described, so even when dealing with the part B shown in Figure- The support σ seat is also formed in the same recessed portion 14 in contrast. In addition, as for an electronic device using the aforementioned flexible circuit board, a display panel of a scale display is used as an example in terms of the moonlight technology. However, the present invention is not only applied to the specific one, but also The connection between the bumps of the semi-conductor circuit and the flexible circuit substrate and the connection between the same flexible circuit substrate can be used, which can help improve the reliability of the electronic equipment using these. [Brief Description of the Drawings] The first figure is a top view illustrating the structure of the FPC end portion and the position of the false solid. The second figure is a cross-sectional view illustrating a conventional thermocompression bonding device and a pseudo-acf fixing on the Fpc. 200529520 The third figure is a cross-sectional view illustrating the situation of the same false fixation. The fourth figure is a cross-sectional view illustrating a state where the ACF is temporarily fixed to the FPC in the first embodiment of the thermocompression bonding apparatus of the present invention. The fifth figure is a cross-sectional view illustrating a situation where the pseudo-fixing is also completed. The sixth diagram is an enlarged and cross-sectional view showing portions C and D of the fourth diagram. The seventh figure is a cross-sectional view illustrating a second embodiment of the thermocompression bonding apparatus according to the present invention, and a state where the ACF is temporarily fixed to the FPC. The eighth figure is a diagram showing an experimental result obtained by calculating an ideal depth of a recessed portion formed in the support base of the thermocompression bonding apparatus of the present invention. [Description of main component symbols] α Angle A Part B Part C Part D Part 1 FPC (flexible circuit board) 2 Base member 3 Electrode wiring 3 a Exposed part 3 b Gold plating 4 Insulating resist layer 5 ACF (Anisotropic conductive film ) 10 Supporting pedestal 1 0 a Flat pedestal body 1 Ob Plate-shaped auxiliary body 1 0 c Inclined surface 15 200529520 10s Mounting surface 11 Thermal compression head 13a Space 13b Space 13c Space 14 Recessed portion 16 Suction hole 16