TW200521059A

TW200521059A - Wafer loading station that automatically retracts from a moving conveyor in response to an unscheduled event

Info

Publication number: TW200521059A
Application number: TW093134811A
Authority: TW
Inventors: Michael R Rice; Eric A Englhardt; Robert B Lowrance; Martin R Elliott; Jeffrey C Hudgens
Original assignee: Applied Materials Inc
Priority date: 2003-11-13
Filing date: 2004-11-12
Publication date: 2005-07-01
Also published as: CN1683223A; KR101106869B1; TWI376345B; CN1683223B; KR20050046611A

Abstract

In a first aspect, a wafer loading station adapted to exchange wafer carriers with a wafer carrier transport system comprises a biasing element adapted to urge the end effector of the wafer loading station away from a movable conveyor of the wafer carrier transport system upon the occurrence of a unscheduled event such as a power failure or an emergency shutdown. In a second aspect, an uninterruptible power supply commands a controller to cause the wafer carrier handler to retract the end effector from the wafer carrier transport system upon the occurrence of unscheduled event, and provides the power necessary for the same. Numerous other aspects are provided.

Description

200521059 玖、發明說明：【發明所屬之技術領域】本發明大體上係有關於半導體元件製造系統，及更特定地係有關於在一製造廠中之基材載件的傳送。【先前技術】半導體元件的製造典型地涉及了一基材，像是一碎美材，一玻璃板等，實施一連串的處理（這些基材亦被稱為= 圓，不論是已形成有圖案或未形成有圖案）。這些步驟可包括研磨，沉積，蝕刻，微影成像術，處理，等等。通常，數種不同的處理步驟可在一具有複數個處理室之單一處理系統或’’工具，，内實施。然而，通常會有其它的處理需要在一製造工廠内的其它處理位置進行處理，因而基材必需被需在該製造工廠内從一處理位置被傳送到另一處理位置。依據將被製造的半導體元件種類，可能會有相當大數量的處理步驟需要在該製造工廠内的許多不同處理位置來實施。傳統的傳送方式為，將基材放在基材載具内，如密封的莢艙’匣盒，容器等等，從一處理位置傳送至另一處理位置。傳統的方式亦使用自動化的基材載具傳送裝置，像是自動導弓丨的車輛，高架式的傳送系統，基材載具搬運機器人等等，來將基材載具從該製造工廠内的一個位置移動至另一位置，或將基材載具來回運送至一基材載具傳送裝置。 200521059 對於一單獨的基材而言，從形成或接收處女完成的基材切割成半導體元件的完整基材處理可時數週或數月的時間。在一典型的製造工廠中，的基材會以”進行中的工作（WIP)，，的形式出現在的時間。以WIP處現在製造工廠中的基材代表一資本的投資，這會提高每片基材的製造成本。因給定的基材產出率下降低製造工廠的WIP量是所為了要達到此目的，處理每一基材的總時間應被; 【發明内容】在一態樣中’本發明的一設備被設計來供應處理工具。該設備包含一基材載具搬運器其被設一基材載具至一第一對接站。該基材載健搬運器施作器（end effertor)其被設計來支撐一基材載具器被耦合到該基材載具搬運器上且可操作用以控載具搬運器使得該基材載具搬運器的端施作器在具在運動中時將該基材載具與一基材載具傳送帶控制器可操作用以該傳送帶自動地縮回該端施作應一突發事件’像是緊及停機或停電。在某些態設備被耦合至一不斷電系統，其可在一突發事件應該控制器及/或該基材載具搬運器電力。在另一態樣中，一種用來傳送基材載具來回載具傳送系統的設備被提供。該設備包含一基材器，其被設計成與一傳送路徑相交會，一基材載基材到從能需要為一大數量任何給定大的作業此，在一想要的。橋短。基材給一計來傳送包括一端。一控制制該基材該基材載分離。該器，以回樣中，該發生時供於一基材載具搬運具傳送系 200521059 統沿著該路徑傳送基材載具。該基材載具搬運器可從該基材載具傳送系統撿取一基材載具或放置一基材載具至該基材載具傳送系統上。一偏動機構被耦合到該基材載具搬運器上且被设计成可施加一力量至該基材載具搬運器，用以將該基材載具搬運器的至少一部分移動離開該傳送路徑，基材載具傳送系統沿著該路徑傳送基材載具。另態樣中，一種用來調節在（1) 一被設計來沿著一路徑傳送基材載件的基材載件傳送系統與該路徑交會用以從該基材載具傳送系統撿取一棊材^或放置一基材載具至該基材載具傳送系統上的基材载具搬運器之間的互動的方法被提供。該方法包含（1)提供一基材載具搬運器，其被設計成可選擇性地與一路徑相交會，一基材載具傳送系統沿著該路徑傳送基材載具；（2)提供一偏^ 機構，其被設計成可施加一力量至該基材搬運器用以消除該基材搬運器與該路徑的相交會；（3)施加一不电#至該基材搬運器，其足以讓該基材搬運器移動該端施作器抵抗該偏動機構的力量並進入到該路徑中；（4)從該基材搬運= 將該端施作器移入到該路徑中用以產生該基材搬運器與該路徑的交會；（5)在該交會期間奪走該基材搬運器的該第2 電源；及（6)讓該偏動機構的力量將該端施作器移離開該路徑，用以消除該交會。 ^ 本發明的其它特徵及態樣從下面的詳細說 _ 〒晴專利範圍及附圖中將可被更完整地瞭解。 5 200521059 【實施方式】一级在_晶|®裝載站_L的晶圓載具搬運器包括—水的導引件其可沿著平行的垂直導引件垂直地移冑，及—端施作器其可沿著水平的導引件水平地移動。為了要從—用來傳送晶圓載具且從該晶圓裝載站旁通過之移動的傳 (“晶圓載具傳送帶”）上取下_a · )取卜曰日圓載具，該端施作器被沿著該水平的導引件移動，其移動的速度大致與該晶圓載具的速度相符(如，Λ致與晶圓載具在水平方向上的逮度相當）。此外，該端施作器可被保持在一與該晶圓载具相鄰的位置處。因此，該端施作器可與該晶圓載具的一個位置大致相當，同時大致與該晶圓载具的速度相當。相同地，傳送帶位置及/或速度可大致相當。當端施作器與該晶圓載具的速度（及/或位置）相當時’該端施作器會被升高’藉由將水平的導引件沿著垂直導引件向上移動，使得該端施作器與該晶圓载具接觸並讓該晶圓載具與該晶圓載具傳送帶脫離。類似地，藉由在裝載期間讓該端施作器與傳送帶的速度（及/或位置）相當，一晶圓載具可被裝載到該移動的晶圓載具傳送帶上。依據本發明，設備及方法被提供來在突發事件發生時，如停電或緊急停機時，將端施作器移離開該傳送帶的路徑。這些設備及方法將參照第9-11圖來加以詳細說明。 2003 年八月 28日提申，名稱為，，System For Transporting Substrate Carriers” 的美國專利申請案第 10/650,310號揭示了一種基材載具傳送系統，其包括了一 200521059 基材動。傳送以降運作將基上的的基直導件作傳送載具移動致與器可施作該晶大致時，導引該晶載期載具的傳送帶，其在製造工廠的作呆期間不停地移該不停地移動的傳送帶是要促進該製造廠内之基材、 ,以降低每一基材在該製造廠内的總”停留，，時間；= 低，及降低資金及製造成本。為了要以此方式：一製造廠，應該要提供用來在該傳送帶在移動中時，材载具從#送帶上卸了，及將基材載具裝冑到傳送帶方法及設備。 $ 依據本發明的至少一個態樣，一設在一基材襞載站材載具搬運器包括一水平的導引件其可沿著平行的引件作垂直的移動，及一單施作器其可沿著水平導= 水平的移動。為了要將一基材載具從一移動中之用來基材載具且從該基材裝載站旁邊通過的傳送帶（“基材傳送帶’’）上取下，該端施作器被沿著該水平的導引件，其移動的速度大致與該晶圓載具的速度相符（如大晶圓載具在水平方向上的速度相當）。此外，該端施作被保持在一與該晶圓載具相鄰的位置處。因此，該端器可與該晶圓載具的一個位置大致相當，同時大致與圓載具的速度相當。相同地，傳送帶位置及/或速度可相當。 X 當端施作器與該晶圓载具的速度（及/或位置）相當該端施作器會被升高，藉由將水平的導引件沿著垂直件向上移動，使得該端施作器與該晶圓載具接觸並讓圓載具與該晶圓載具傳送帶脫離。類似地，藉由在裝間讓該端施作器與傳送帶的速度（及/或位置）相當，一 200521059 晶圓載具可被裝载到該移動的晶圓載具傳送帶上。在本發明的至少一實施例中，在端施作器與基材载具傳送帶之間的基材載具傳遞是在該端施作器與基材载具傳送帶之間零速度及/或加速度下實施的。。本發明的許多其它態樣被提供在下文的詳細說明中。200521059 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates generally to a semiconductor device manufacturing system, and more specifically to the transfer of a substrate carrier in a manufacturing plant. [Previous technology] The manufacture of semiconductor components typically involves a substrate, such as a broken piece of material, a glass plate, etc., and a series of processes (these substrates are also referred to as = circles, whether they have been patterned or No pattern is formed). These steps may include grinding, deposition, etching, lithography, processing, and so on. In general, several different processing steps may be implemented in a single processing system or a 'tool' with multiple processing chambers. However, there are usually other processes that need to be processed at other processing locations within a manufacturing plant, and therefore the substrate must be transferred from one processing location to another processing location within the manufacturing plant. Depending on the type of semiconductor element to be manufactured, a significant number of processing steps may need to be performed at many different processing locations within the manufacturing plant. The traditional transfer method is to place the substrate in a substrate carrier, such as a sealed pod compartment 'box, container, etc., and transfer it from one processing position to another. Traditional methods also use automated substrate carrier transfer devices, such as automatic guided bow vehicles, overhead conveyor systems, substrate carrier handling robots, etc., to remove substrate carriers from the manufacturing plant. Move from one location to another, or transport the substrate carrier back and forth to a substrate carrier transfer device. 200521059 For a single substrate, the complete substrate processing from cutting or receiving a virgin finished substrate to a semiconductor element can take weeks or months. In a typical manufacturing plant, the substrate will appear as "Work in Progress (WIP)," at the time. The substrate in the manufacturing plant at WIP now represents a capital investment, which will increase each piece The manufacturing cost of the substrate. To reduce the WIP amount of the manufacturing plant at a given substrate output rate is to achieve this. The total time to process each substrate should be; [Summary of the Invention] In one aspect 'A device of the present invention is designed to supply processing tools. The device includes a substrate carrier carrier which is provided with a substrate carrier to a first docking station. The substrate carrier transporter applicator (end effertor) which is designed to support a substrate carrier that is coupled to the substrate carrier carrier and is operable to control the carrier carrier such that the end effector of the substrate carrier carrier When in motion, the substrate carrier and a substrate carrier conveyor controller are operable to automatically retract the end of the conveyor belt to perform an emergency event, such as tightness and shutdown or power outage. In some states The device is coupled to an uninterruptible power system, which can The component should be powered by the controller and / or the substrate carrier carrier. In another aspect, a device for transferring a substrate carrier to and from the carrier transfer system is provided. The device includes a substrate carrier, which Designed to intersect with a conveying path, a substrate carries the substrate from where it can be needed for a large number of any given large job, a desired one. The bridge is short. The substrate gives a meter to convey including one end A control system controls the separation of the substrate and the substrate carrier. In the sample, the substrate carrier transport system 200521059 is used to transport the substrate carrier along the path. The carrier carrier can pick up a substrate carrier from the substrate carrier transport system or place a substrate carrier on the substrate carrier transport system. A biasing mechanism is coupled to the substrate carrier transport And is designed to apply a force to the substrate carrier carrier to move at least a part of the substrate carrier carrier off the conveying path, and the substrate carrier conveying system conveys the substrate along the path. Material carrier. In another aspect, one is used to adjust (1) A substrate carrier transfer system designed to transport a substrate carrier along a path intersects the path to pick up a base material from the substrate carrier transport system ^ or place a substrate carrier A method for interacting with a substrate carrier carrier on the substrate carrier transfer system is provided. The method includes (1) providing a substrate carrier carrier that is designed to selectively interact with a substrate carrier carrier. A path intersects, and a substrate carrier conveying system transports the substrate carrier along the path; (2) providing a biasing mechanism which is designed to apply a force to the substrate carrier to eliminate the substrate The intersection of the carrier and the path; (3) Applying a non-electrical # to the substrate carrier, which is sufficient to allow the substrate carrier to move the end applicator to resist the force of the biasing mechanism and enter the path (4) Handling from the substrate = moving the end applicator into the path to produce the intersection of the substrate carrier and the path; (5) taking the substrate carrier during the intersection The second power source; and (6) allowing the force of the biasing mechanism to move the end applicator away from the path To eliminate the rendezvous. ^ Other features and aspects of the present invention will be more fully understood from the detailed description below. 5 200521059 [Embodiment] The first stage wafer carrier at _Jing | ® Loading Station_L includes a water guide which can be moved vertically along parallel vertical guides, and an end effector. It can move horizontally along the horizontal guide. In order to remove a Japanese yen carrier from a moving conveyor ("wafer carrier conveyor") used to transport a wafer carrier and pass by the wafer loading station, the end effector When being moved along the horizontal guide, the moving speed is approximately consistent with the speed of the wafer carrier (for example, Λ is equivalent to the degree of catch of the wafer carrier in the horizontal direction). In addition, the end effector can be held at a position adjacent to the wafer carrier. Therefore, the end effector can be approximately equivalent to a position of the wafer carrier, and at the same time approximately the speed of the wafer carrier. Similarly, the position and / or speed of the conveyor belt may be approximately the same. When the end applicator is equivalent to the speed (and / or position) of the wafer carrier, 'the end applicator will be raised' by moving the horizontal guide up the vertical guide, so that the The end applicator is in contact with the wafer carrier and detaches the wafer carrier from the wafer carrier conveyor. Similarly, a wafer carrier can be loaded onto the moving wafer carrier conveyor by making the end effector comparable to the speed (and / or position) of the conveyor during the loading. In accordance with the present invention, equipment and methods are provided to move end effectors away from the path of the conveyor belt in the event of an emergency, such as a power outage or emergency shutdown. These devices and methods will be described in detail with reference to Figures 9-11. U.S. Patent Application No. 10 / 650,310, filed on August 28, 2003 and entitled, "System For Transporting Substrate Carriers" discloses a substrate carrier transfer system that includes a 200521059 substrate movement. When the base straight guide on the base is used as a carrier to move the actuator, the carrier can be used to guide the carrier of the wafer period, which is continuously moved during the idle period of the manufacturing plant. The continuously moving conveyor belt is to promote the substrates in the manufacturing plant to reduce the total "stay" of each substrate in the manufacturing plant, time; = low, and reduce capital and manufacturing costs. In order to: In this way, a manufacturing plant should provide methods and equipment for unloading the material carrier from the #conveyor belt and loading the substrate carrier to the conveyor belt while the conveyor is in motion. According to at least one aspect of the present invention, a material carrier carrier provided on a substrate loading station includes a horizontal guide member capable of vertical movement along the parallel guide member, and a single applicator. It can move along horizontal guide = horizontal. In order to remove a substrate carrier from a moving conveyor ("substrate conveyor") used for the substrate carrier and passing by the substrate loading station, the end applicator is moved along The speed of the horizontal guide is approximately the same as the speed of the wafer carrier (such as the speed of a large wafer carrier in the horizontal direction). In addition, the end is held to be held at a position equal to that of the wafer carrier. Adjacent positions. Therefore, the end device can be approximately equivalent to one position of the wafer carrier, and at the same time approximately the speed of a round carrier. Similarly, the position and / or speed of the conveyor can be equivalent. X When the end effector The end applicator will be raised at a speed (and / or position) that is equivalent to the wafer carrier. By moving the horizontal guide upward along the vertical member, the end applicator and the wafer carrier will be raised. The tool contacts and disengages the round carrier from the wafer carrier conveyor. Similarly, by aligning the speed (and / or position) of the end effector with the conveyor in the booth, a 200521059 wafer carrier can be loaded to The moving wafer carrier conveyor. In at least one embodiment of the invention, the transfer of the substrate carrier between the end applicator and the substrate carrier conveyor is performed at zero speed and / or acceleration between the end applicator and the substrate carrier conveyor. Many other aspects of the invention are provided in the detailed description below.

第1圖為一等視圖，其顯示一傳統的裝載及儲存設備 111其處在將基材载具存放在與一傳統的處理工具113相鄰的位置處。一工廠界面（FI)115位在該裝载及儲存設備 111與處理工具113之間。該裝載及儲存設備U1位在與一無塵室壁117的地一側相鄰處且該工廠界面115為在與該無塵室壁117的第二側相鄰處❶該工廠界面115包括一 FI機器人119其可沿著一軌道（未示出）水平地移動，該軌道平行於該無塵室壁117且可將一基材從一或多個出現在該裝載及儲存設備111中之基材載具120中取出。該FI 機器人119可將基材傳送至該處理工具113的一負載鎖定室12卜第1圖中所示的負載鎖定室121被耦合到該處理工具 113的一傳送室123。同樣耦合到該傳送室123的還有處理室25及輔助處理室127。每一處理室25及輔助處理室127 都被安排成可實施一傳統的半導體元件製造處理，像是氧化，薄膜沉積，蝕刻，熱處理，去氣，冷卻等等。一基材搬運機器人129被設置在該傳送室123内用以傳送基材，如基材131，於處理室125，127及負載鎖定室121之間。該裝載及儲存設備111包括一或多個基材載具存放架 8 200521059 133用來在基材被裝在該等基材載具内之前或之後存放基材載具。該裝載及儲存設備111亦包括一或多個對接站（其未被示出，但可位在該存放架133底下一基材載具可被停靠在一對接站用以讓FI機器人119將基材從基材載具上取出。該裝載及儲存設備111亦包括一工廠裝載位置135, 一基材載具傳送裝置，如一自動導引的車輛（AGV)，可放置或撿取一基材載具。該裝載及儲存設備111進一步包括一基材載具搬運器 U7’其被設計來將基材載具移動在該工廠裝載位置135, 存放架1 3 3及對接站之間。與上述之促進一製造工廠内的基材傳送的目標一致地’利用一不斷地在移動中之基材載具傳送帶來將基材載具來回傳送至一基材裝載佔，如該裝載及儲存設備ηι，亦疋所想要的（如，藉以減少在製造廒内的時間及製造成本）。因此，依據本發明，一基材裝載站被提供，其可在該基材載具傳送帶在移動當中，將基材載具從一基材載具傳送帶上取下，及可將基材載具裝載到該基彩載具傳送帶上。本發明的一實施例現將參照第2A-6E圖來加以說明。第2A圖為依據本發明被提供的一基材裝載站2〇1的前視圖°雖然在第2A圖中沒有示出，應被暸解的是，該基材裝載站201可與以第1圖進行說明之一處理工具及/或工廠界面結合。基材裝载站201可包括一或多個裝載埠或類似的位 200521059 置’基材或基材載具被放在該等位置用以傳送到一處理工具或從該處理工具傳送出來（如，一或多個對接站2〇3，但沒有使用對接/離岸（docking/undocking)運動的傳送位置亦可被使用）。在第2A圖所示的特定實施例中，基材裝載站20 1包括總數八個的對接站2〇3，它們被安排成兩列，每列四個對接站。其它數目的列及/或對接站亦可被使用。每一對接站203都被設計來在該對基站2〇3處支撐及/或停靠一基材載具207,並容許一基材（未示出)在該對接站2〇3 處從該基材載具207被取出並被傳送至一處理工具，如第 1圖的處理工具113 (如，利用一工廠界面機器人，像是第 1圖的工廠界面機器人119)。在本發明的一實施例中，該等基材載具207為單一的基材載具。，，單一基材載具，，將被理解為一被作成在一個時間只可容納單一基材的形狀及大小的基材載具。容納超過一片基材的基材載具亦可被使用 (如’25片或其它數目）。（或者，一或多個對接站203可被採用，用以直接支撐一基材而無需基材載具）。每一對接站 203可如2002年八月31日提申，名稱為” Wafer Loading with Docking Grippers at Docking Stations”的美國專利申請案第60/407,337號中所描述地來加以建構。其它的對接站結構亦可被使用。每一對接站203可包括一埠209，通過該埠，一基材可被傳送至該工廠界面（如，第1圖中的工廠界面115)。與每一埠2 0 9相鄰的是一對接扣爪2〗丨其被設計來懸掛一基 10 200521059 材載具207及用來將該被懸掛的基材載具207移動於一被對接（docked)及一未對接（undocked)的位置之間。一可移動的階台或其它支撐件（未示出）可被用來在每一對站203支撐（如，從底下支撐或以其它方式支撐）及/或對接/未對接每一基材載具207。每一埠209亦可包括一基材載件開啟件 213’其在一態樣中被設計來當該基材載具207從一未對接的位置移動至一對接的位置時打開該基材載具207，如在 2003 年八月 28 日提申，名稱為”Method and Apparatus forFIG. 1 is a first-level view showing a conventional loading and storage device 111 in which a substrate carrier is stored adjacent to a conventional processing tool 113. A factory interface (FI) 115 is located between the loading and storage device 111 and the processing tool 113. The loading and storage device U1 is located adjacent to the ground side of a clean room wall 117 and the factory interface 115 is located adjacent to a second side of the clean room wall 117. The factory interface 115 includes a The FI robot 119 can move horizontally along a track (not shown) parallel to the clean room wall 117 and can move a substrate from one or more substrates appearing in the loading and storage device 111 The material carrier 120 is taken out. The FI robot 119 can transfer the substrate to a load lock chamber 12 of the processing tool 113. The load lock chamber 121 shown in FIG. 1 is coupled to a transfer chamber 123 of the processing tool 113. Also coupled to the transfer chamber 123 are a processing chamber 25 and an auxiliary processing chamber 127. Each processing chamber 25 and auxiliary processing chamber 127 are arranged to perform a conventional semiconductor device manufacturing process such as oxidation, thin film deposition, etching, heat treatment, degassing, cooling, and the like. A substrate transfer robot 129 is disposed in the transfer chamber 123 to transfer substrates, such as the substrate 131, between the processing chambers 125, 127 and the load lock chamber 121. The loading and storing device 111 includes one or more substrate carrier storage racks 8 200521059 133 for storing the substrate carrier before or after the substrate is loaded in the substrate carriers. The loading and storage device 111 also includes one or more docking stations (which are not shown, but can be located under the storage rack 133. The substrate carrier can be docked at the docking station for the FI robot 119 to dock the The material is removed from the substrate carrier. The loading and storage device 111 also includes a factory loading position 135, a substrate carrier conveying device, such as an automatic guided vehicle (AGV), which can place or pick up a substrate carrier The loading and storage device 111 further includes a substrate carrier carrier U7 ′ which is designed to move the substrate carrier between the factory loading position 135, the storage rack 1 3 3 and the docking station. And the above The goal of promoting substrate transfer in a manufacturing plant consistently 'uses a substrate carrier transfer belt that is constantly moving to transfer substrate carriers back and forth to a substrate loading station, such as the loading and storage equipment, It is also desirable (eg, to reduce time and manufacturing costs in the manufacturing facility). Therefore, in accordance with the present invention, a substrate loading station is provided which can move the substrate carrier conveyor belt while moving, Substrate carrier The belt is removed, and the substrate carrier can be loaded on the base color carrier conveyor. An embodiment of the present invention will now be described with reference to Figures 2A-6E. Figure 2A is provided in accordance with the present invention. A front view of a substrate loading station 201, although not shown in Figure 2A, it should be understood that the substrate loading station 201 can be used with one of the processing tools and / or illustrated in Figure 1 The factory interface is combined. The substrate loading station 201 may include one or more loading ports or the like. 200521059 The substrate or substrate carrier is placed at these locations for transfer to or from a processing tool. Teleporting (eg, one or more docking stations 203, but transport locations that do not use docking / undocking movements can also be used.) In the specific embodiment shown in Figure 2A, the basic The material loading station 201 includes a total of eight docking stations 203, which are arranged in two rows of four docking stations each. Other numbers of rows and / or docking stations can also be used. Each docking station 203 Are designed to support and / or dock a substrate carrier 207 at the pair of base stations 203, and Xu Yi substrate (not shown) is taken out of the substrate carrier 207 at the docking station 203 and transferred to a processing tool, such as the processing tool 113 of FIG. 1 (eg, using a factory interface robot, such as Is the factory interface robot 119 in Figure 1. In one embodiment of the present invention, the substrate carriers 207 are single substrate carriers. A single substrate carrier will be understood as a substrate Create a substrate carrier of a shape and size that can only accommodate a single substrate at a time. A substrate carrier that accommodates more than one substrate can also be used (such as '25 pieces or other numbers). (Or, one or more Docking stations 203 can be used to directly support a substrate without the need for a substrate carrier.) Each docking station 203 can be filed as of August 31, 2002 and named "Wafer Loading with Docking Grippers at Docking Stations" "Is described in US Patent Application No. 60 / 407,337. Other docking station structures can also be used. Each docking station 203 may include a port 209 through which a substrate may be transferred to the factory interface (e.g., the factory interface 115 in Figure 1). Adjacent to each port 2 0 9 is a pair of docking claws 2 which are designed to suspend a base 10 200521059 material carrier 207 and used to move the suspended substrate carrier 207 to a docked ( docked) and an undocked position. A movable stage or other support (not shown) may be used to support (eg, support from below or otherwise support) each pair of stations 203 and / or dock / undo each substrate carrier 207. Each port 209 may also include a substrate carrier opening member 213 'which is designed in one aspect to open the substrate carrier when the substrate carrier 207 is moved from an unmated position to a docked position. 207, as filed on August 28, 2003, named "Method and Apparatus for

Using Substrate Carrier Movement to Actuate Substrate Carrier Door Opening/Closing”的美國專利申請案第 1 0/6 5 0,312號中所述者。每一基材載具207可具有揭示在 2003 年八月 28 日提申，名稱為”Substrate Carrier Having Door Latching and Substrate Clamping Mechanism”的美國專利申請案第1 0/65 0,3 1 1號中所揭示的載具門閂鎖及/或基材夾持結構。其它的基材載具開啟件，門閂，及/或基材夾持結構亦可被使用。該基材裝載站201亦包括一基材載具搬運器215，其依據本發明的一個態樣操作。在本發明的一或多個實施例中’該基材載具搬運器215包括一對垂直的導引件217， 219及一水平的導引件221其被安裝成可垂直地移動在垂直導引件2 1 7，2 1 9上。一皮帶驅動件或一導螺桿及一相關聯的馬達（未示出）或其它適當的機構被提供，用以驅動該水平的導引件22 1沿著垂直的導引件2 1 7，2 1 9作垂直的運 200521059 動。一支撐件223被安裝在一水平導引件22丨上用以沿著水平導引件22 1作水平運動。一皮帶驅動件或一導螺桿及一相關聯的馬達（未示出）或其它適當的機構被提供，用以驅動該支撐件223沿著水平導引件221作水平的運動。在本發明的至少一實施例中，垂直導引件2丨7，2 1 9 每一者都包含一整合的導引/驅動機構，像是由B〇sch公司所製造的型號1140-260-10，1 76 8mm者。相同地，該水平導引件221可包含一整合的導引/驅動機構像是由公司所製造的.型號U40-260-1 0, 1 468mm者。其它的導引/ 驅動機構亦可被使用。一端施作器225被安裝在該支撐件223上。該端施作器225可以是一被水平地定向的平台227的形式，其被設計來支撐一基材載具（如，基材載具2〇7中的一者）。在至少一實施例中，該平台227可具有運動學上的銷或其它種類的運動定位特徵結構229。（雖然在第2A圖中只有兩個運動學上的特徵結構229被示出，但其它數目的運動學上的鎖或特徵結構，如三個或更多個亦可提供在該平台227 上。）該等運動學上的特徵結構229可與在該基材載具2〇7 的底部上的下凹的或其它形狀的特徵結構（未示出）配合來將基材載具207導引到該平台227上的正確（正的）位置上。在本發明的至少一實施例中，該端施作器225可包含一端施作器其能夠改變一基材載具的方向，從垂直改為水平，反之亦可，像是2002年八月31日提申，名稱為End Effector Having Mechanism For Reorienting A Wafer 12 200521059Using Substrate Carrier Movement to Actuate Substrate Carrier Door Opening / Closing "as described in US Patent Application No. 1 0/6 5 0,312. Each substrate carrier 207 may have a disclosure disclosed on August 28, 2003 The carrier door latch and / or substrate holding structure disclosed in US Patent Application No. 10/65 0,3 1 1 entitled "Substrate Carrier Having Door Latching and Substrate Clamping Mechanism". Other bases Material carrier openings, latches, and / or substrate holding structures can also be used. The substrate loading station 201 also includes a substrate carrier carrier 215, which operates in accordance with one aspect of the present invention. In one or more embodiments of the invention, the substrate carrier carrier 215 includes a pair of vertical guides 217, 219 and a horizontal guide 221, which are installed to be vertically movable on the vertical guide. 2 1 7, 2 1 9. A belt drive or a lead screw and an associated motor (not shown) or other suitable mechanism are provided to drive the horizontal guide 22 1 along the vertical The guides 2 1 7 and 2 1 9 are vertical 200521059. A support member 223 is mounted on a horizontal guide 22 丨 for horizontal movement along the horizontal guide 22 1. A belt drive or a lead screw and an associated motor (not shown) ) Or other suitable mechanism is provided to drive the supporting member 223 to move horizontally along the horizontal guide 221. In at least one embodiment of the present invention, the vertical guides 2 丨 7, 2 1 9 each Both of them include an integrated guide / drive mechanism, such as those manufactured by Bosch Company Model 1140-260-10, 1 76 8mm. Similarly, the horizontal guide 221 may include an integrated guide The guide / drive mechanism is made by the company. Model U40-260-1 0, 1 468mm. Other guide / drive mechanisms can also be used. One end applicator 225 is mounted on the support 223. The end effector 225 may be in the form of a horizontally oriented platform 227 designed to support a substrate carrier (eg, one of the substrate carriers 207). In at least one embodiment The platform 227 may have kinematic pins or other kinds of motion positioning features 229. Although only two kinematic features 229 are shown in Figure 2A, other numbers of kinematic locks or features, such as three or more, can also be provided on the platform 227.) The kinematic features 229 may cooperate with a recessed or other shaped feature (not shown) on the bottom of the substrate carrier 207 to guide the substrate carrier 207 to the feature carrier 207. In the correct (positive) position on platform 227. In at least one embodiment of the present invention, the end applicator 225 may include an end applicator that can change the direction of a substrate carrier from vertical to horizontal, and vice versa, such as August 31, 2002 Day proposal, named End Effector Having Mechanism For Reorienting A Wafer 12 200521059

Carrier* Between Vertical And Horiz〇ntal 〇rientati〇ns”之美國專利申請案第60/407,452號中所揭示者。任何其它適當的端施作器亦可被使用。一連續不斷的或其它形式之移動的傳送帶，示意地以箭頭23 1代表，被設置在該基材裝載站2〇1及該基材載具搬運器215的上方。該傳送帶231被設計來傳送基材載具，像是基材載具207,來回於該基材裝載站2〇1。在本發明的一實施例中，該不斷地移動的傳送帶231可以是一不銹鋼或類似材料之帶狀物，像是在2〇〇4年一月26日提申，名稱為”Methods and Apparatus for Transporting Substrate Carriers”的美國專利申請案第1〇/764,982號中所揭示者。本發明可與其它種類之不斷移動的傳送帶一起使用。基材裝置站201可包括一或多個感測器233,235用來偵測（1)傳送帶；（2)傳送帶231的構件（如，用來支撐被該傳送帶231所傳送之基材載件的構件，這將在下文中參照第4A-4E，6A_6E及7C-7D圖加以說明）；及⑺被傳送帶 2 3 1所傳送之基材載具的移動極/或位置。例如，感測器2 3 3 可被女裝在基材裝載具2〇1上，感測器23 5被安裝在端施作器225上。其它的感測器位置亦可被使用，以及任何適當的感測器亦可被使用（如，穿透式射束感測器，反射式感測器，等等）。第213圖為該基材装载站201的一部分的側視圖，其對於描述感測器23 3的一舉例性實施例很有用。參照第Μ 圖感測器233包含—第一對感測器233a，233a，用來偵 13 200521059 測該傳送帶231的速度及/或位置；及/或基材載具的位置 (及/或該基材載具207被該傳送帶231所傳送的速度，這將於下文中說明）。感測器233亦包括一第二對感測器 233b，233b’用來偵測是否有一基材載具207被傳送帶231 所傳送。例如，第一對感測器2 3 3 a，2 3 3 a，可被安裝在傳送帶231的一個高度上，及第二對感測器233b，233b，可被安裝在基材載具被該傳送帶231傳送的高度處，如第2B 圖所示（如，透過一耦合到該基材裝載站2〇1的一骨架F 的一安裝架B上，或透過另一適當的安裝機構）。每一對感測器都包含由Banner公司所生產之型號為mi 26E2LDQ的光源及型號為Q23SN6RMHSQDP的接收器。其它的感測器結構/種類亦可被使用。感測器23 5的舉例性實施例將於下文中參照第2C-E及第3圖來加以說明。一控制器237(第2A圖）可被耗合至感測器233，235 及基材載具搬運器215上’用以接收來自於感測器233， 23 5的輸入及控制基材載具搬運器215的操作，這將於下文中詳細說明。比兩個感測器多或少的感測器可被提供，且感測器233, 235可被安裝在除了第μ及2B圖所示的位置之外的位置處。控制器23 7可以與用來控制包含了該基材裝載站201之處理工具的操作之控制器是同一控制器，亦或可以是一分開來的控制器。在本發明的至少一實施例中，傳送帶（及/或被該傳送帶傳送的基材載具）的速度可被直接測量（而非使用該感測器233來間接地測量傳送帶的速度）。例如，如第2a圖所 14 200521059 示的，一或多個編碼器240a，240b(將於下文中說明）可被耦合至該傳送帶231並直接測量傳送帶231(及其所傳送的任何基材载具）的速度並提供速度資訊給控制器237。數目比兩個多或少的編碼器亦可被使用。每一編碼器都包含一 U.S. Digital編碼器（如，HDS6交磁編碼器）或任何其它適合的編碼器。一線性編碼器，分析器或其它定位裝置亦可被用來測量傳送帶速度及/或位置。第3圖為一流程圖，其顯示一可被依據本發明的基材窗載站201實施之舉例性處理，用以將一基材載具2〇7從該傳送帶23 1上取下。第4A-4E圖為示意側視圖，其顯示第3圖的處理的各階段。當要實施將將一基材載具2 07從該傳送帶23丨上取丁的作業時’該基材載搬運器215的水平導引件被放置在靠近垂直導引件217, 219的上端217a，2l9a的位置，且支撐件223被放置在靠近該水平導引件221的上游側 22 la(在第2A圖的視圖中的左側，雖然由右至左的移動可被使用，如果該傳送帶231是由右往左移動的話）。第3圖的處理在步驟301開始且前進至步驟3〇3。在步驟303,控制器237接收一訊號（如，來自感測器23 3或 23 5)用以顯示一被該傳送帶231所傳送之基材載具的存在，且該基材載具將被基材裝載站2〇1從傳送帶231下 (即，”目標基材載具207”）。例如，參照第2B圖，第二對感測器23 3, 23 3,可债測目標基材载具2〇7,當與第二對感測器23 3，23 3,有關的光束L被目標基材載具2〇7擋住。 15 200521059 ¥機到感測器訊號時，控制器2 3 7控制基材載具搬運器2 1 5 使得支撐件223(其上帶有端施作器225)被傳送帶231移動相同的方向上（如，往第2A圖的右方）用以與目標基材载具 207的位置及速度相當（第3圖的步驟3〇5)。第‘A圖顯示第3圖的處理的此階段。在本發明的至少一實施例中，在加速該端施作器225 使其與目標基材載具207的位置及速度相當（步驟305)之月3 ’控制器2 3 7使用感測器2 3 3 (或編碼器2 4 0 a，2 4 0 b中的一或兩者）來決定傳送帶231的速度。傳送帶231的位置亦可被決定。如前所述的，感測器2 3 3可包含用來偵測該傳送帶231的速度（及/或該基材載具2〇7被該傳送帶231 所傳送的速度）之第一對感測器23 3 a，233a，（第2B圖），及用來伯測是否有一基材載具207被傳送帶23 1所傳送的第二對感測器23 3b，233b，。此一速度及/或位置的決定可週期性地’持續地或在某些其它時段中，在每一基材載具 207的卸載作業之前或期間被實施。根據傳送帶23 1的速度，控制器237可決定該端施作器225的運動規劃（moti〇n pr〇file)並根據該移動規劃來指導該端施作器225的運動用以讓該端施作器225的速度及位置與目標基材載具207相當。該運動規劃可被，，預先決定）’使得控制器237只是讓該端施作器225開始實施一卸載操作（如，開始加速），如果該傳送帶231的速度是在一預疋的速度範圍之内的話（如，一可確保該端施作器225 會適當地與該目標基材載具207對齊的範圍，如果該端施 16 200521059 作器225依照預定的運動規劃被加速，移動及/或放置的話）；否則的話第3圖的處理即被終止。此一預定的運動規劃即使是在該傳送帶2 3 1的速度沒有被測量下亦可被使用 (如，假設傳送器2 3 1的速度被保持在一預定的速度範圍内，該速度範圍可確保該端施作器225會適當地與該目標基材載具207對齊的範圍，如果該端施作器225依照預定的運動規劃被加速，移動及/或放置的話控制器237可使用該傳送帶231的速度來決定該端施作器2 2 5的一運動規劃，例如使用一預定運動規劃查詢表，使用一演算法則來計算該運動規劃等等。應被瞭解的疋，疋基材載具的速度，而不是傳送帶的速度被測量及被用來決定一運動規劃或是否要使用該端施作器225的一預定的運動規劃。每一運動規劃都包括該端施作器225在一卸載操作期間所使用的所有加速，減速，升高及降低（將於下文中描述）。上文提及的，在本發明的至少一實施例中，傳送帶23 i 可包含一絲帶狀的傳送帶（如，不銹鋼或其它材質），如在 2004 年一月 26 日提申，名稱為” Meth〇d and Apparatus f〇rCarrier * Between Vertical And HorizOntal Orientatins "disclosed in US Patent Application No. 60 / 407,452. Any other suitable end effector can also be used. A continuous or other form of movement The conveyor belt, represented schematically by arrow 23 1, is disposed above the substrate loading station 201 and the substrate carrier carrier 215. The conveyor belt 231 is designed to transport a substrate carrier, such as a substrate The carrier 207 is back and forth to the substrate loading station 2001. In an embodiment of the present invention, the continuously moving conveyor belt 231 may be a stainless steel or similar material belt, such as in 2004. Filed on January 26, 2014, disclosed in U.S. Patent Application No. 10 / 764,982, entitled "Methods and Apparatus for Transporting Substrate Carriers." The invention can be used with other types of continuously moving conveyor belts. The material device station 201 may include one or more sensors 233, 235 for detecting (1) a conveyor belt; (2) a component of the conveyor belt 231 (eg, a component for supporting a substrate carrier conveyed by the conveyor belt 231, This It will be described below with reference to Figures 4A-4E, 6A_6E, and 7C-7D); and ⑺ the moving poles and / or positions of the substrate carrier transferred by the conveyor belt 2 3 1. For example, the sensor 2 3 3 may be Women's clothing is on the substrate carrier 201, and the sensor 235 is mounted on the end applicator 225. Other sensor positions can also be used, and any suitable sensor can also be used ( (E.g., a transmissive beam sensor, a reflective sensor, etc.). Figure 213 is a side view of a portion of the substrate loading station 201, which is an exemplary implementation for describing the sensor 23 3 Examples are useful. Refer to Figure M. Sensors 233 include a first pair of sensors 233a, 233a, which are used to detect the speed and / or position of the conveyor belt 231; and / or the position of the substrate carrier ( And / or the speed at which the substrate carrier 207 is being conveyed by the conveyor belt 231, which will be explained below.) The sensor 233 also includes a second pair of sensors 233b, 233b 'for detecting whether a substrate The material carrier 207 is transported by the conveyor belt 231. For example, the first pair of sensors 2 3 3 a, 2 3 3 a can be mounted on a conveyor belt 231 And the second pair of sensors 233b, 233b can be installed at the height at which the substrate carrier is conveyed by the conveyor belt 231, as shown in FIG. 2B (for example, through a coupling to the substrate loading station 001 on a mounting frame B of a skeleton F, or through another appropriate mounting mechanism). Each pair of sensors includes a light source of model mi 26E2LDQ produced by Banner and a receiver of model Q23SN6RMHSQDP Device. Other sensor configurations / types can be used. Exemplary embodiments of the sensor 235 will be described below with reference to Figs. 2C-E and Fig. 3. A controller 237 (Fig. 2A) can be used on the sensors 233, 235 and the substrate carrier 215 to receive input from the sensors 233, 23 5 and control the substrate carrier. The operation of the carrier 215 will be described in detail later. More or less sensors than two sensors may be provided, and sensors 233, 235 may be installed at positions other than the positions shown in Figs. 2 and 2B. The controller 237 may be the same controller as the controller for controlling the operation of the processing tool including the substrate loading station 201, or it may be a separate controller. In at least one embodiment of the present invention, the speed of the conveyor belt (and / or the substrate carrier being conveyed by the conveyor belt) can be directly measured (instead of using the sensor 233 to indirectly measure the speed of the conveyor belt). For example, as shown in Figure 2a, 14 200521059, one or more encoders 240a, 240b (described below) can be coupled to the conveyor 231 and directly measure the conveyor 231 (and any substrate And) provide speed information to the controller 237. More or less encoders than two can also be used. Each encoder includes a U.S. Digital encoder (eg, HDS6 cross-magnetic encoder) or any other suitable encoder. A linear encoder, analyzer or other positioning device can also be used to measure conveyor speed and / or position. FIG. 3 is a flowchart showing an exemplary process that can be performed by the substrate window carrier station 201 according to the present invention for removing a substrate carrier 207 from the conveyor belt 23 1. Figures 4A-4E are schematic side views showing the stages of the processing of Figure 3. When the operation to remove a substrate carrier 2 07 from the conveyor 23 丨 is performed, the horizontal guide of the substrate carrier 215 is placed near the upper ends 217 a of the vertical guides 217 and 219. 219a, and the support member 223 is placed near the upstream side 22 la of the horizontal guide 221 (the left side in the view in FIG. 2A, although the right-to-left movement can be used if the conveyor belt 231 If you move from right to left). The process of FIG. 3 starts at step 301 and proceeds to step 303. In step 303, the controller 237 receives a signal (eg, from the sensor 23 3 or 23 5) to indicate the presence of a substrate carrier transferred by the conveyor belt 231, and the substrate carrier is to be supported by the substrate. The material loading station 201 is lowered from the conveyor 231 (ie, the “target substrate carrier 207”). For example, referring to FIG. 2B, the second pair of sensors 23 3, 23 3, and the target substrate carrier 2007 can be measured. When the second pair of sensors 23 3, 23 3, the light beam L is The target substrate carrier 207 was blocked. 15 200521059 ¥ When the machine reaches the sensor signal, the controller 2 3 7 controls the substrate carrier carrier 2 1 5 so that the support 223 (with the end applicator 225 thereon) is moved in the same direction by the conveyor 231 ( For example, go to the right in FIG. 2A) to match the position and speed of the target substrate carrier 207 (step 305 in FIG. 3). Figure 'A shows this stage of the processing of Figure 3. In at least one embodiment of the present invention, the sensor 3 is used to accelerate the end effector 225 to a position and speed equivalent to the target substrate carrier 207 (step 305). The controller 2 3 7 uses the sensor 2 3 3 (or one or both of the encoders 2 4 0 a and 2 4 0 b) to determine the speed of the conveyor 231. The position of the conveyor 231 can also be determined. As mentioned above, the sensor 2 3 3 may include a first pair of sensors for detecting the speed of the conveyor belt 231 (and / or the speed of the substrate carrier 2007 being conveyed by the conveyor belt 231). Sensors 23 3a, 233a, (Fig. 2B), and a second pair of sensors 23 3b, 233b, which are used to test whether a substrate carrier 207 is transported by the conveyor belt 23 1. This speed and / or position determination may be implemented periodically 'continuously or during some other time period, before or during the unloading operation of each substrate carrier 207. According to the speed of the conveyor belt 23 1, the controller 237 may determine a motion plan (moti ON pr file) of the end applicator 225 and guide the motion of the end applicator 225 to let the end applicator according to the movement plan. The speed and position of the actuator 225 are equivalent to the target substrate carrier 207. The motion plan can be determined in advance) so that the controller 237 simply causes the end effector 225 to start an unloading operation (eg, start acceleration) if the speed of the conveyor 231 is within a predetermined speed range (Eg, a range to ensure that the end effector 225 will properly align with the target substrate carrier 207, if the end effector 16 200521059 the actuator 225 is accelerated, moved, and / or according to a predetermined motion plan If it is placed); otherwise, the processing of FIG. 3 is terminated. This predetermined motion plan can be used even if the speed of the conveyor 2 3 1 is not measured (for example, assuming that the speed of the conveyor 2 3 1 is maintained within a predetermined speed range, the speed range can ensure The range where the end effector 225 is properly aligned with the target substrate carrier 207. If the end effector 225 is accelerated according to a predetermined motion plan, the controller 237 can use the conveyor belt 231 if it is moved and / or placed Speed to determine a motion plan of the end effector 2 2 5, such as using a predetermined motion planning lookup table, using an algorithm to calculate the motion plan, etc. It should be understood that the Speed, not conveyor speed, is measured and used to determine a motion plan or whether to use a predetermined motion plan of the end effector 225. Each motion plan includes the end effector 225 in an unloading operation All acceleration, deceleration, raising and lowering used during the period (to be described below). As mentioned above, in at least one embodiment of the present invention, the conveyor belt 23 i may include a ribbon-shaped Belt (eg, stainless steel or other materials), as mentioned in Shen January 26, 2004, entitled "Meth〇d and Apparatus f〇r

Transporting Substrate Carriers，，的美國專利申請案第 1 0/7 64,9 82號中所揭不者。在此—實施例中，傳送帶m 被提供有槽孔或其它開口（如，第2B圖中的槽孔Mb)，其沿著該傳送冑231以—預定的間距間隔開，當感測器對 23 3 a, 23 3 a’（第2B圖）移動經過該傳送帶231時，感測器對23 3 a，233a #光束會透過這些槽孔。冑由測量感測器 17 200521059 對23 3a 23 3a的光束的兩個連續的透射（透過該傳送帶川上的兩個連續的槽孔)之間的時間及知道兩個連續的槽孔之間的距離此即可計算出該傳送帶231的速度。在每一基材載具207上方的槽孔23U的位置（第％亦可將傳送帶231及/或基材載纟2〇7的位置f訊提供給控㈣ 237 〇在發明的一實施例中，編碼器24〇a，24〇b(第2A圖）可被用來直接讀取傳送帶的速度。例卜每_編碼器 240a’ 240b可提供傳送帶速度資訊給控制器237且控制器 237會將此由編碼器24〇a，24〇b接收到的此資訊當作一錯誤檢查或信心常例行工作的一部分般地加以比對。此速度監視可瘳期性地，持續性地或在其它的時段下實施。藉由直接測量傳送帶速度（如，透過一或多個編碼器或其它定位裝置），及藉由感測器23 3 (如，槽孔23 la)來決定傳送帶位置，介於該端施作器225與傳送帶231之間在該傳送帶231 的移動期間的基材載具傳遞即可如下文所述地被精確地實施。在第4A圖中，該目標基材載具2〇7藉由一載具卡合件401而被傳送帶231傳送，該載具卡合件與該基材載具 207的一上凸緣402相卡合。其它用於支撐該基材載具207 的結構亦可被使用（如，一或多個用來支撐該基材載具2〇7 的侧邊’底部或類此者的機構）。一種基材卡合件4 〇 1的結構被提供在2004年一月26日提申，名稱為” Overhead Transfer Flanfe and Support for Suspending Substrate 18 200521059Transporting Substrate Carriers, as disclosed in US Patent Application No. 10/7 64,9 82. In this embodiment, the conveyor belt m is provided with slotted holes or other openings (eg, slotted holes Mb in FIG. 2B), which are spaced at a predetermined interval along the conveying roller 231, when the sensor pair When 23 3 a, 23 3 a '(Figure 2B) moves through the conveyor belt 231, the sensor pair 23 3 a, 233a # beam will pass through these slots.胄 From the measurement sensor 17 200521059 to the time between two consecutive transmissions of the beam of 23 3a 23 3a (through the two consecutive slots on the conveyor belt) and know the distance between the two consecutive slots From this, the speed of the conveyor 231 can be calculated. The position of the slot 23U above each substrate carrier 207 (the %% can also provide the position of the conveyor belt 231 and / or the substrate carrier 207 to the control unit 237 〇 In an embodiment of the invention The encoders 24a, 24b (Figure 2A) can be used to directly read the speed of the conveyor. For example, each encoder 240a '240b can provide the conveyor speed information to the controller 237 and the controller 237 will This information received by the encoders 24a, 24b is compared as part of a routine routine for error checking or confidence. This speed monitoring can be performed periodically, continuously or at other It is implemented by directly measuring the speed of the conveyor belt (eg, through one or more encoders or other positioning devices), and by determining the position of the conveyor belt with a sensor 23 3 (eg, slot 23 la), between The substrate carrier transfer between the end effector 225 and the conveyor belt 231 during the movement of the conveyor belt 231 can be accurately performed as described below. In FIG. 4A, the target substrate carrier 2 7 is transported by a conveyor belt 231 through a carrier engaging piece 401, which is engaged with An upper flange 402 of the substrate carrier 207 is engaged with each other. Other structures for supporting the substrate carrier 207 can also be used (eg, one or more of the substrate carriers 207 for supporting the substrate carrier 207). Side 'bottom or the like). A structure of the substrate engaging piece 〇1 was provided on January 26, 2004, and was named "Overhead Transfer Flanfe and Support for Suspending Substrate 18 200521059.

Carrier”的美國專利申請案第1 0/764,820號中。箭頭403代表傳送帶231的運動方向。該基材載具搬運器215的端施作器225被示於第4A圖中的一個位在該目標基材載具207底下的位置且被移動在與傳送帶231同一方向上（箭頭405所示），且速度與目標基材載具2〇7的速度相當。因此，該端施作器225與目標基材載具2〇7的速率（即’速度及方向）大致相當。此外，該端施作器225 與目標基材載具207的位置大致相當。詳言之，該端施作器225與目標基材載具207的運動（即，速率及/或位置）大致相當。在本文中所用之，，大致相當，，一詞係指大致相當使得一基材載具可在不傷到裝在該基材載具上的基材下及/ 或在不產生微粒下，從一移動中的傳送帶及/或載具卡合件上卸下及/或裝載到該移動中的傳送帶及/或載具卡合件上。在不於第4A圖的實施例中，該目標基材載具2〇7與該傳送帶23 1 —起移動。因此，端施作器225亦與該傳送帶231的速度，速率，運動及/或位置大致相當。在有些實施例中，該傳送帶231可以一不同於該目標基材載具2〇7 的速率運動。你1如，該載具卡合件401本身可將該目標基材載具207沿著該傳送帶231移動。在後者的此實施例中，端施作器225可能不會與傳送帶23 1的速度，速率及/或位置相當。、在本發明的一或多個實施例中，端施作器225可不是破放置在與啟動（或發動）感測器（如，第2B圖中的感測器 19 200521059 對23 3b，23 3b’）相同的位置，該感測器是用來偵測該目標基材載具是否有該傳送帶231上。在這些實施例中，延遲在步驟3 05的端施作器225的加速是必要的，用以補償該端施作器225與目標基材载具2〇7之間的位置差異。此，，發動偏位’’與介於該端施作器2 2 5及該啟動感測器之間的距離，傳送帶231的速度等相關。一發動偏位可與該端施作器225的運動規劃分開或内建於其内。再次參照第3圖，在步驟3 07，該目標基材載具2〇7 相對於該端施作器2 2 5的位置被偵測（如，透過來自感測器 23 5 (第2 A圖）的一個訊號或多個訊號）。例如，如果感測器 235包含一光源/>(貞測器對’如可從Banner公司購得之型號Q S 3 0的感測器，則感測器2 3 5可朝向該目標基材載具 207發出一光束，該光束只有在該端施作器225相對於該目標基材載具207被適當地放置時才會被偵測到（如，藉由提供該基材載具207 —適當的反射表面及/或表面拓樸，像是一有角度的槽口，其只有在該端施作器225相對於該目標基材載具207被適當地放置時才可將光線朝向感測器 235反射）。第2C圖為該端施作器225的一部分的立體圖，其顯示一舉例性的感測器23 5，其被設置來偵測被該目標基材載具207的一部分之槽口 243所反射的光束241(第2D 圖），該槽口在端施作器225相對於該目標基材載具207 被適當地放置時才會反射光束。第2D圖為第2C圖的一部分的放大立體圖。如第2 C-2D圖所示的，感測器23 5可經由一適當的架子或其它支撐結構247而被耦合至端施作器 20 200521059 225上。其它的結構亦可被使用。在本發明的另一實施例中，如果該端施作器225沒有相對於該目標基材載具2〇7被適當地放置的話，則第3圖的處理即會終止。或者，在本發明的另一實施例中，該端施作器225相對於該目標基材载具2〇7之在位置上的任何必要的調整會被實施（步驟3〇9)。例如，控制器237可將該端施作器225加速及/或減速直到接收到一來自感測器 235的適當對齊訊號，用以確定運動學上的銷229(第4a 圖）被適當地放置在該對齊特徵結構（如，凹面，或該目標基材載具207的其它形狀特徵結構4〇7)。應被暸解的是，步驟307及309是在目標基材載具207及端施作器225運動中實施的’且使得端施作器225被放置在該目標基材載具2 07的底下同時與它的速度大致相當。因此，端施作器 225被移動用以在該目標基材載具2〇7運動當中保持著與該目標基材載具207相鄰且在其底下。將被瞭解的是，目心基材载具2〇7與端施作器225的相對位置可被偵測及調整許夕次（或持續地偵測或調整），及一回饋控制迴路（未示出）可被使用，用以確定端施作器225的速度及/或位置保持著與目標基材載具2〇7的速度及/或位置大致相當。在本發明的其它實施例中，步驟3 07及3 09可被取消掉（如，如果一預定的運動規劃被使用，其與該傳送帶23丨的速度及該端施作器225的發動時間/位置相關聯。在此一實施例中’感測器2 3 5可被省略掉。編碼器2 4 0 a及/或2 4 0 b可被用來監視在卸載操作期間 21 200521059 的傳送帶速度。在回應一卸載操作期間傳送帶速度上的總偏差時，該控制器237可放棄該卸載操作（如，藉由使用另一可確保端施作器225不會干擾到該傳送帶231或被傳送的基材載具之運動規劃或者，對於很小的傳送帶速度變化而言，控制器237可調整端施作器位置（如，藉由加速或減速）用以確保適當卸載（或裝載）作業。一包含該端施作器 225，該感測器233，該編碼器240a及/或240b及/或該控"Carrier" in US Patent Application No. 10 / 764,820. The arrow 403 represents the direction of movement of the conveyor belt 231. The end effector 225 of the substrate carrier 215 is shown in Figure 4A. The position under the target substrate carrier 207 is moved in the same direction as the conveyor belt 231 (indicated by arrow 405), and the speed is equivalent to the speed of the target substrate carrier 207. Therefore, the end effector 225 and The speed (ie, 'speed and direction') of the target substrate carrier 207 is approximately the same. In addition, the end applicator 225 is approximately the same position as the target substrate carrier 207. Specifically, the end applicator 225 It is roughly equivalent to the movement (ie, velocity and / or position) of the target substrate carrier 207. As used herein, roughly equivalent, the term refers to a term that is substantially equivalent so that a substrate carrier can Unloading and / or loading from a moving conveyor and / or carrier engagement member under the substrate on the substrate carrier and / or without generating particles and / or loaded onto the moving conveyor and / or On the carrier engaging member. In the embodiment shown in FIG. 4A, the target substrate carrier 2 〇7 moves with the conveyor belt 23 1. Therefore, the end effector 225 is also substantially equivalent to the speed, velocity, movement, and / or position of the conveyor belt 231. In some embodiments, the conveyor belt 231 may be different from the conveyor belt 231. The target substrate carrier moves at a speed of 207. For example, the carrier engaging member 401 itself can move the target substrate carrier 207 along the conveyor belt 231. In this embodiment of the latter, the end application The actuator 225 may not be comparable to the speed, speed, and / or position of the conveyor belt 23 1. In one or more embodiments of the present invention, the end effector 225 may not be placed in place and activated (or activated). Sensor (for example, sensor 19 200521059 in Figure 2B to 23 3b, 23 3b ') at the same position, the sensor is used to detect whether the target substrate carrier has the conveyor belt 231. In these embodiments, it is necessary to delay the acceleration of the end applicator 225 at step 305 to compensate for the position difference between the end applicator 225 and the target substrate carrier 207. Therefore, start Distance between `` offset '' and the end effector 2 2 5 and the activation sensor The speed of the conveyor belt 231 is related. A starting offset can be separated from or built in the motion plan of the end effector 225. Referring again to FIG. 3, at step 3 07, the target substrate carrier 207 The position relative to the end effector 2 2 5 is detected (eg, by a signal or signals from the sensor 23 5 (Figure 2 A)). For example, if the sensor 235 includes a light source / > (Sensor pair 'If a model QS 3 0 sensor is available from Banner, the sensor 2 3 5 can emit a light beam toward the target substrate carrier 207. The end effector 225 will only be detected when it is properly placed relative to the target substrate carrier 207 (eg, by providing the substrate carrier 207-an appropriate reflective surface and / or surface topology, Like an angled notch, it can reflect light toward the sensor 235 only when the end applicator 225 is properly placed relative to the target substrate carrier 207). FIG. 2C is a perspective view of a part of the end effector 225, which shows an exemplary sensor 235, which is configured to detect the reflection from the slot 243 of a part of the target substrate carrier 207. For the light beam 241 (FIG. 2D), the notch will reflect the light beam only when the end applicator 225 is appropriately placed relative to the target substrate carrier 207. Figure 2D is an enlarged perspective view of a portion of Figure 2C. As shown in Figures 2C-2D, the sensor 235 can be coupled to the end effector 20 200521059 225 via a suitable shelf or other support structure 247. Other structures can also be used. In another embodiment of the present invention, if the end effector 225 is not appropriately placed with respect to the target substrate carrier 207, the processing of FIG. 3 is terminated. Alternatively, in another embodiment of the present invention, any necessary adjustment of the position of the end effector 225 relative to the target substrate carrier 207 is performed (step 309). For example, the controller 237 may accelerate and / or decelerate the end effector 225 until a properly aligned signal from the sensor 235 is received to determine that the kinematic pin 229 (Figure 4a) is properly placed On the alignment feature (eg, a concave surface, or other shape feature of the target substrate carrier 207). It should be understood that steps 307 and 309 are performed during the movement of the target substrate carrier 207 and the end applicator 225 and the end applicator 225 is placed under the target substrate carrier 207 at the same time It's about the same speed. Therefore, the end applicator 225 is moved to keep the target substrate carrier 207 adjacent to and below the target substrate carrier 207 during the movement of the target substrate carrier 207. It will be understood that the relative position of the center of gravity substrate carrier 207 and the end applicator 225 can be detected and adjusted by Xu Xici (or continuously detected or adjusted), and a feedback control loop (not (Shown) may be used to determine that the speed and / or position of the end effector 225 remains approximately the same as the speed and / or position of the target substrate carrier 207. In other embodiments of the present invention, steps 3 07 and 3 09 may be cancelled (for example, if a predetermined motion plan is used, its speed with the conveyor 23 丨 and the start time of the end effector 225 / The position is related. In this embodiment, the 'sensor 2 3 5 can be omitted. The encoder 2 4 a and / or 2 4 0 b can be used to monitor the conveyor speed during the unload operation 21 200521059. In response to the total deviation in conveyor speed during an unloading operation, the controller 237 can abandon the unloading operation (e.g., by using another one, it can be ensured that the end effector 225 does not interfere with the conveyor 231 or the conveyor base The motion planning of the material carrier or, for small changes in conveyor speed, the controller 237 can adjust the end effector position (eg, by accelerating or decelerating) to ensure proper unloading (or loading) operations. The end effector 225, the sensor 233, the encoder 240a and / or 240b and / or the control unit

制器237的封閉式迴路系統可確保適當的卸載（或裝載）操作，儘管有傳送帶速度變化。The closed loop system of the controller 237 ensures proper unloading (or loading) operation despite changes in conveyor speed.

假設端施作器225相對於目標基材載具2〇7被適當地放置，緊接在第3圖的處理的步驟307及/或步驟309之後的是步驟311。在步驟311，控制器237控制著該基材載具搬運器215使得端施作器225被升高起來（如，水平導引件 22 1在垂直導引件2 1 7，2 1 9上被升高起來用以將端施作器 225升高），同時持續讓該端施作器225的水平速度（及/或即時的位置）與該目標基材載具207的速度（及/或即時的位置）相匹配。端施作器225的升高造成它的運動學上的銷 229與位在該目標基材載具207的底部上的凹面特徵結構 407相卡合。因此，端施作器225被移到一高度，該傳送帶231是在該尚度傳送基材載具207。以此方式，端施作器225與目標基材載具2〇7的底部接觸（如第4B圖所示）。在本發明的/或多個實施例中，端施作器225最好是在零速率及/或加速度下與目標基材載具2 07接觸，這將在下文中參照第8A-D圖加以說明。當端施作器225持續被升高 22 200521059 時（同時端施作器持續與目標基材載具207的水平速度及/ 或位置相匹配），目標基材載具2〇7(特別是其上凸緣被舉起來而沒有與該傳送帶231的載具卡合件4〇ι相可合，如第4C圖所示。接下來，在第3圖的步驟313中，控制器237控制該基材載具搬運器215用以稍微將該端施作器225的水平運動減速，藉以將目標基材載具2〇7減速。減速的程度為，可以讓該目標基材載具2〇7繼續移動於箭頭4〇3所指的方向上，但速度上比該傳送帶231慢。這可讓該載具卡合件 401(其已與該目標基材载具2〇7的凸緣4〇2相卡合）用以移動到該凸緣4 (λ2的前面，如第4D圖所示。當該載具卡合件401已從凸緣402的底下移出來時（如第4D圖所示），端施作器225可再次被加速，使得單施作器225及目標基材載具207的水平速度可再次與傳送帶231的水平速度大致相當，用以防止被傳送帶231傳送的另一基材載具（如在第 4D圖中的基材載具409)不會與該目標基材載具207相撞。在第3圖的步驟315中，端施作器225被降低（如，藉由沿著垂直導引件2 1 7，2 1 9降低水平導引件2 2 1)來降低目標基材載具207使其離開該傳送帶23 1。目標基材載具 207的降低被示於第4E圖中。其上支撐著該目標基材載具 207的端施作器225然後可被減速（第3圖的步317)並變成停止。如上文提及的，在本發明的至少一實施例中，上述的端施作器225加速，減速，升高及/或降低可由端施作器 225的運動規劃來界定。（舉例性的運動規劃將於下文中參 23 200521059 照第8A-8D圖來說明）。在步驟319中，基材載具搬運器215可將被支撑在該端施作器225上的目標基材載具207傳送到一對接站 203(第2A圖）。或者，如果裝載站201包括一或多個存放架或其它儲存位置（如，存放架239，在第2A圖以虛線示出’且被設計來儲存一基材載具的話），則基材載具搬運器 215可將該目標基材載具2〇7傳送至一儲存位置。（其它及 /或更多的儲存位置可被使用）。第3圖的處理在步驟321 處結束。假設該目標基材載具207被帶至一對接站203，則該目標基材載具207可被基材載具搬運器遞送至該對接站 2〇3的對接扣爪211。該目標基材載具2〇7然後可被對接到該對接站2 03上，且被該對接站203的基材載具開啟器213 打開’讓一目標基材可從該目標基材載具2〇7中被取出 (如’被第1圖中的FI機器人取出）^該被取出的基材然後被送到一與該基材裝載站2〇丨相關聯的處理工具（如，第1 圖中的處理工具113)且該處理工具可施加一或多個製程到該基材上。在完成在該處理工具中的處理之後，該基材會被回送到該目標基材載具207中且該目標基材載具207會被關閉且與該對接站203脫離。該基材載具搬運器215然後會將該目標基材載具207送離該對接站203並送到位在該傳送帶23 1底下的一個位置（如，假設該目標基材載具 2〇7是要被回送到該傳送帶23丨而不是被存放在一儲存位置’如儲存位置239，中）。亦即，當該目標基材載具207 24 200521059 被支撐在該端旆靠近垂直導引件可被移動到水平具207然後可被照第5-6E圖來影一可依據本裝載到該傳送帶說明。第5圖為處理。第6A-6E 同階段。第5圖的處步驟503，控制或23 5)其顯示有在。在步驟5 0 5 具搬運器使得該送帶23 1上的目加速，讓其與該兰的運動相匹配。卡合件401在水中提及的，在一放置在與啟動感相同的位置處。器225的加速用位置差是必要的作器225上時，水平導引件22 1可被移動 217’219的上端2173,219&且支撐件223 導引件221的上游端221a。該目標基材載送回到該傳送帶231上，這將在下文中參，明。發明來實施之用來將一目標基材載具207 23 1上的舉例性處理現將參照第5-6E圖來一流程圖，其顯示本發明之基材載具裝載圖為示意側視圖其顯示第5圖的處理的不理在步驟501開始且前進至步驟503。在器2 3 7接收到一訊號（如，來自感測器2 3 3 ‘一空的傳送帶231的載具卡合件4〇1存回應此訊號時，控制器2 3 7控制該基材載端施作器225(其上帶著將被傳送到該傳標基材載具207)沿著該水平導引件221被 E著的載具卡合件401(及/或該傳送帶231) 例如，該端施作器225可與該空著的載具平方向上的速度及位置大致相當。如上文或多個實施例中，端施作器225可以不被測器（如第2B圖的感測器對23 3b，23 3b，）在這些例子中，在步驟505中延遲端施作以補償端施作器225與啟動感測器之間的It is assumed that the end effector 225 is appropriately placed with respect to the target substrate carrier 207, and step 311 is immediately after step 307 and / or step 309 of the process of FIG. 3. In step 311, the controller 237 controls the substrate carrier carrier 215 so that the end applicator 225 is raised (for example, the horizontal guide 22 1 is lifted on the vertical guides 2 1 7 and 2 1 9 Raise to raise the end applicator 225), while continuously keeping the horizontal speed (and / or instant position) of the end applicator 225 and the speed (and / or instant) of the target substrate carrier 207 Location). The elevation of the end effector 225 causes its kinematic pin 229 to engage with the concave feature 407 located on the bottom of the target substrate carrier 207. As a result, the end effector 225 is moved to a height, and the conveyor belt 231 is used to convey the substrate carrier 207 at this level. In this manner, the end effector 225 is in contact with the bottom of the target substrate carrier 207 (as shown in FIG. 4B). In the embodiment of the present invention, the end effector 225 is preferably in contact with the target substrate carrier 20 07 at zero velocity and / or acceleration, which will be described below with reference to FIGS. 8A-D. . When the end applicator 225 is continuously raised 22 200521059 (while the end applicator continues to match the horizontal speed and / or position of the target substrate carrier 207), the target substrate carrier 207 (especially its The upper flange is lifted without being fitted with the carrier engaging piece 40m of the conveyor belt 231, as shown in FIG. 4C. Next, in step 313 of FIG. 3, the controller 237 controls the base The material carrier carrier 215 is used to slightly decelerate the horizontal movement of the end applicator 225, thereby decelerating the target substrate carrier 207. The degree of deceleration is such that the target substrate carrier 207 can continue Move in the direction indicated by arrow 403, but at a slower speed than the conveyor belt 231. This allows the carrier engagement piece 401 (which has been aligned with the target substrate carrier 407 flange 402 Phase engagement) is used to move to the front of the flange 4 (λ2, as shown in FIG. 4D. When the vehicle engagement member 401 has been removed from under the flange 402 (as shown in FIG. 4D) The end applicator 225 can be accelerated again, so that the horizontal speed of the single applicator 225 and the target substrate carrier 207 can be approximately the same as the horizontal speed of the conveyor belt 231 again. It is equivalent to prevent another substrate carrier (such as the substrate carrier 409 in FIG. 4D) transferred by the conveyor belt 231 from colliding with the target substrate carrier 207. Step 315 in FIG. 3 In the middle, the end effector 225 is lowered (for example, by lowering the horizontal guide 2 2 1 along the vertical guides 2 1 7, 2 1 9) to lower the target substrate carrier 207 away from the conveyor belt 23. 1. The lowering of the target substrate carrier 207 is shown in Figure 4E. The end applicator 225 supporting the target substrate carrier 207 can then be slowed down (step 317 in Figure 3) and stopped. As mentioned above, in at least one embodiment of the present invention, the acceleration, deceleration, raising and / or lowering of the end effector 225 can be defined by the motion plan of the end effector 225. (Exemplary The motion planning will be described below with reference to 23 200521059 according to Figures 8A-8D.) In step 319, the substrate carrier 215 may support the target substrate carrier 207 supported on the end applicator 225. Transfer to docking station 203 (Figure 2A). Or, if loading station 201 includes one or more storage racks or other storage locations (eg, The rack 239 is shown by a dotted line in FIG. 2A and is designed to store a substrate carrier), then the substrate carrier carrier 215 can transfer the target substrate carrier 207 to a storage position (Other and / or more storage locations can be used.) The processing of Figure 3 ends at step 321. Assuming the target substrate carrier 207 is brought to the docking station 203, the target substrate carrier 207 can be delivered by the substrate carrier carrier to the docking claw 211 of the docking station 203. The target substrate carrier 207 can then be docked on the docking station 203 and by the docking station 203 The substrate carrier opener 213 is opened to allow a target substrate to be removed from the target substrate carrier 207 (such as' removed by the FI robot in the first figure) ^ The removed substrate is then It is sent to a processing tool (eg, processing tool 113 in FIG. 1) associated with the substrate loading station 20, and the processing tool can apply one or more processes to the substrate. After the processing in the processing tool is completed, the substrate is returned to the target substrate carrier 207 and the target substrate carrier 207 is closed and disconnected from the docking station 203. The substrate carrier carrier 215 then sends the target substrate carrier 207 away from the docking station 203 and to a position below the conveyor belt 23 1 (eg, assuming the target substrate carrier 2007 is To be returned to the conveyor 23 instead of being stored in a storage location '(eg, storage location 239, middle). That is, when the target substrate carrier 207 24 200521059 is supported at the end near the vertical guide, it can be moved to the leveler 207 and then can be photographed according to Figure 5-6E. It can be loaded on the conveyor belt according to the book. Instructions. Figure 5 shows the processing. 6A-6E At the same stage. Figure 5 Step 503, Control or 23 5) It is displayed. At step 5 0 5 the carrier accelerates the head on the belt 23 1 to match the movement of the blue. The engaging member 401 is mentioned in the water, and is placed at the same position as the starting feeling. When the position difference for acceleration of the actuator 225 is necessary for the actuator 225, the horizontal guide 22 1 can be moved 217'219 upper end 2173,219 & and the support 223 upstream end 221a of the guide 221. The target substrate is carried back onto the conveyor 231, which will be described later. An exemplary process implemented on the target substrate carrier 207 23 1 implemented by the invention will now be described with reference to FIGS. 5-6E as a flow chart showing a substrate carrier loading diagram of the present invention as a schematic side view. The ignore of the process shown in FIG. 5 starts at step 501 and proceeds to step 503. When the device 2 3 7 receives a signal (for example, the carrier engagement piece 401 from the sensor 2 3 3 ′ empty conveyor belt 231 stores and responds to this signal, the controller 2 3 7 controls the substrate carrier end. An applicator 225 (on which is carried a carrier substrate 207 to be conveyed to the mark) a carrier engaging member 401 (and / or the conveyor belt 231) which is held along the horizontal guide 221. For example, The end effector 225 may be approximately equal to the speed and position of the empty carrier in the square direction. As in the above or multiple embodiments, the end effector 225 may not be tested (such as the sensing in FIG. 2B) 23 3b, 23 3b,) In these examples, in step 505 the delay end is applied to compensate for the delay between the end effector 225 and the start sensor.

25 200521059 在本發明的至少一實施例中，在加速端施作器2 2 5使其與該空著的載具卡合件401在水平方向上的速度及位艽大致相當（步驟5 05)之前，控制器23 7使用感測器23 3或一或多個耦合到該傳送帶23 1上的編碼器240a，240b來決定傳送帶231的速度。傳送帶231的位置亦可被決定。根據傳送帶23 1的速度，控制器23 7可決定端施作器225 (其上支撐著目標基材載具 2 07)的運動規劃用以讓端施作器 225的位置及速度與該空著的載具卡合件401大致相當，該目標基材載具207將被載入到該空著的載具卡合件401 上。該運動規劃可以是”預先決定的”，使得控制器23 7只是讓該端施作器 225開始實施一裝载操作（如，開始加速），如果該傳送帶231的速度是在一預定的速度範圍之内的話（如，一可確保該端施作器225會適當地與該空著的載具卡合件401對齊的範圍，如果該端施作器225依照預定的運動規劃被加速的話）；否則的話第 5圖的處理即被終止。或者，控制器237可使用該傳送帶231的速度來決定該端施作器2 2 5的一運動規劃，例如使用一預定運動規劃查詢表，使用一演算法則來計算該運動規劃等等。應被暸解的是，是基材載具的速度，而不是傳送帶的速度被測量及被用來決定一運動規劃或是否要使用該端施作器225的一預定的運動規劃。每一運動規劃都包括該端施作器225 在一卸載操作期間所使用的所有加速，減速，升高及降低 (將於下文中描述）。（舉例性的運動規劃將於下文中參照第 26 200521059 8A-8D圖加以說明）。第6A圖顯示以與傳送帶231的速率大致相當的速度被移動的端施作器225,其該目標基材載具2〇7的凸緣4〇2 在該載具卡合件401底下且稍微落後該载具卡合件，該目標基材載具207是要被载入到該載具卡合件4〇ι。以此方式，該目標基材載具207可在凸緣402不會被該載具卡合件401擋到的情形下於該目標基材載具2〇7的傳送期間被升高起來。通常，該目標基材載具2〇7的凸緣4〇2可被放置在任何位置處，只要該位置能夠讓該目標基材載具 207被升高且不會接觸到該载具卡合件4〇1，及該载具卡合件（及/或放置於其上的基材載具）接在其上將被裝載該目標基材載具207的該載具卡合件4〇丨之後。在步驟505之後是步驟507，該目標基材載具2〇7及載具可合件401的相對水平位置被偵測（如，被第2A圖的感測器23 5偵測）。例如，如果感測器23 5包含一光源/谓測器對的話，則感測器235可朝向該該空著的載具卡合件 4〇 1(或傳送| 23 υ發出一光束，該光束只有在該端施作器 225相對於該空著的載具卡合件4〇1被適當地放置時才會被偵測到（如之前參照第2C-2D圖所描述的）。第2Ε圖為端施作器225的一部分的立體圖，其顯示感測器2 3 5，其被放置來偵測一載具卡合件4 〇〗之將該載具卡合件401耦合到該傳送帶231上的一部分249。詳 "之該載具卡合件401的部分249包含一槽口 251其在該端施作器225被適當地放置在載具卡合件401底下以進 27 200521059 一裝載操作時被對齊，用以將（感、了…劂器235發出之）光束241 反射回感測器 2 3 5。盆夕沾彡士 4益-A- 八匕的結構亦可被使用。例如，一或多個編碼器240a，24Ob或1它亦古社θ ，忒具匕可直接量測傳送帶速度的定 =裝置可提供此資訊給控制胃237(如，持續地提供），使得控制器237可在-裝載（或#載）操作期間追蹤傳送帶的位置。25 200521059 In at least one embodiment of the present invention, the speed applicator 2 2 5 at the acceleration end makes it approximately equal to the speed and position of the empty carrier engaging member 401 in the horizontal direction (step 5 05) Previously, the controller 23 7 used the sensor 23 3 or one or more encoders 240 a, 240 b coupled to the conveyor belt 23 1 to determine the speed of the conveyor belt 231. The position of the conveyor 231 can also be determined. Based on the speed of the conveyor 23 1, the controller 23 7 can determine the motion plan of the end applicator 225 (on which the target substrate carrier 2 07 is supported) to make the position and speed of the end applicator 225 different from the empty position. The carrier engaging member 401 is substantially equivalent, and the target substrate carrier 207 will be loaded onto the empty carrier engaging member 401. The motion planning may be "predetermined", so that the controller 237 simply causes the end effector 225 to start a loading operation (eg, start acceleration) if the speed of the conveyor 231 is within a predetermined speed range (For example, a range that can ensure that the end applicator 225 will properly align with the empty vehicle engaging member 401 if the end applicator 225 is accelerated according to a predetermined motion plan); Otherwise, the processing of FIG. 5 is terminated. Alternatively, the controller 237 may use the speed of the conveyor 231 to determine a motion plan of the end effector 2 2 5, such as using a predetermined motion plan lookup table, using an algorithm to calculate the motion plan, and so on. It should be understood that the speed of the substrate carrier, not the speed of the conveyor belt, is measured and used to determine a motion plan or whether a predetermined motion plan of the end effector 225 is to be used. Each motion plan includes all accelerations, decelerations, raises and lowers used by the end effector 225 during an unloading operation (described below). (Exemplary exercise planning will be explained below with reference to Figures 26 200521059 8A-8D). FIG. 6A shows the end applicator 225 that is moved at a speed approximately equal to the speed of the conveyor 231. The target substrate carrier 207 has a flange 402 under the carrier engaging member 401 and slightly Behind the carrier engaging part, the target substrate carrier 207 is to be loaded into the carrier engaging part 400m. In this manner, the target substrate carrier 207 can be raised during the transfer of the target substrate carrier 207 without the flange 402 being blocked by the carrier engaging member 401. Generally, the flange 40 of the target substrate carrier 207 can be placed at any position, as long as the position allows the target substrate carrier 207 to be raised without contacting the carrier. Piece 401, and the carrier engaging piece 4 (and / or the substrate carrier placed thereon) on which the carrier engaging piece 4 of the target substrate carrier 207 will be loaded. after that. After step 505 is followed by step 507. The relative horizontal positions of the target substrate carrier 207 and the carrier-composable member 401 are detected (for example, by the sensor 23 5 in FIG. 2A). For example, if the sensor 23 5 includes a light source / predictor pair, the sensor 235 may emit a light beam toward the empty vehicle engagement member 4 0 (or transmit | 23 υ, the light beam It will only be detected when the end effector 225 is properly placed relative to the empty vehicle engagement member 401 (as described previously with reference to Figures 2C-2D). Figure 2E It is a perspective view of a part of the end effector 225, which shows a sensor 2 3 5 which is placed to detect a vehicle engaging member 4 〇 The vehicle engaging member 401 is coupled to the conveyor belt 231 Part 249. In detail, the part 249 of the vehicle engaging member 401 includes a notch 251 at which the applicator 225 is appropriately placed under the vehicle engaging member 401 to enter 27 200521059 for a loading operation. It is aligned to reflect the light beam 241 (sent by the device 235) back to the sensor 2 3 5. The structure of the pot wicker 4 彡 -A- eight dagger can also be used. For example, One or more encoders 240a, 24Ob, or 1 It is also an ancient society θ. The dagger can directly measure the speed of the conveyor. The device can provide this information to the control Stomach 237 (e.g., provided continuously) so that the controller 237 can track the position of the conveyor belt during the -load (or #load) operation.

在本發明的至少一實施例中，如果端施作器225沒有相對於該空著的載具卡合件4〇1被適當地放置的話，則第 5圖的處理會終止。或|，在本發明的另_實施例中，在步驟509可實施該目標基材載具2()7的相對水平位置之任何必要的調整(如，用以確保當該目標基材載具2〇7被升高時凸緣402不會接觸該載具卡合件4〇1)。例如，控制器可將該端施作器225加速及/或減速直到從該感測器23 5接收到一適當的對準訊號為止。在此位置調整期間，該目標基材載具207的水平速度及該傳送帶231及/或該載具卡合件401的水平速度可保持大致相當。在本發明的另一實施例中’步驟507及509可被省略（如，如果一預定的運動規劃被使用，其與該傳送帶231的速度及/或發動時間及/或端施作器225的位置有關聯）。在此實施例中，感測器23 5 可被省略掉。假設端施作器2 2 5相對於該空的載具卡合件4 〇丨被適當地放置的話，則在步驟5 1 1，端施作器2 2 5會被水平導引件221沿著垂直導引件217, 219升起，如第6B圖所示，使付該目標基材載具207及其凸緣402被帶到該載具卡人 28 200521059 件401的高度。如第6b圖所示，凸緣402被放置在稍微咼於該載具卡合件401(如，為了如下文所述地裝載於其上）。接下來’如步驟513及第6C圖所示的，該目標基材載具207被加速用以將該目標基材載具2〇7的凸緣4〇2帶到高於該傳送帶23 1的載具卡合件401的上方。該目標基材載具207然後被減速，使得該目標基材載具2〇7的水平速度再次與傳送帶231的水平速度大致相當。接下來，如第6D圖所示及步驟515所代表的，端施作器225被降低（同時保持著與傳送帶23 1的水平速度大致相當），用以讓該目標基材載具207的凸緣402與傳送帶231的基材卡合件4〇1 相卡合，藉以將該目標基材載具2〇7傳遞到該載具卡合件 4 〇 1上。在本發明的一或多個實施例中，該目標基材载具 2〇7最好是以零速率及/或加速來與該載具卡合件4〇1接觸’這將於下文中參照第8A-8 B圖來說明。基材載具搬運器215在控制器237的控制下持續降低該端施作器225(同時保持與傳送帶231的水平速度大致相當），使得端施作器 225的運動學上的銷229與該目標基材載具2〇7底部上的特徵結構407脫離。步驟5丨7的一舉例性的結果被示於第 6E圖中。在端施作器225與該目標基材載具207脫離之後，在步驟519，該端施作器225被減速（如，被暫停）且第5圖的處理結束（步驟521)。同時，該目標基材載具2〇7(其被載具卡合件401支撐著其凸緣4〇2)被傳送帶231送離開該 29 200521059 裝載站2 0 1。如上文所述，在本發明的至少一實施例中，上述的端施作器225加速，減速，升高及/或降低可由端施作器225的運動規劃來界定。因此，依據發明被提供之基材裝載站2 0 1，特別是在控制器237控制下操作之基材載具搬運器215，將基材載具從一移動中的傳送帶上卸下來，及將基材載具裝載到該移動中的傳送帶。以此方式，本發明之基材裝载站及基材載具搬運器可減少基材在製造工廠内的停駐（dweU)時間，並降低工作資本及製造成本。依據本發明，控制器2 3 7可被程式化用以實施第3及 5圖中的處理。而且第3及5圖的處理可被内建在一或多個電腦程式產品中。每一電腦程式產品都可用一電腦可讀取的媒體來攜帶（如，載波訊號，軟碟片，硬碟機，隨機存取記憶體等等）。在本發明的至少一實施例中，本發明的基材裝載站 2 〇 1可被建構成能夠在一停電，緊急停機（將於下文中討論）等事件中自動地將端施作器225從該傳送帶231上縮回。例如，控制器2 3 7可包括一端施作器縮回常式，其可將該端施作器225(及/或水平導引件221)自動地從傳送帶231 縮回以回意一突發事件，像是停電，緊急停機等等。又，該端施作器225(及/或水平導引件221)可被偏動用以在該裝載站201的電力被拿掉時該端施作器225(及/或水平導引件22 1)可自動地縮回。任何適當的偏動機構，像是彈簧，重力，氣壓缸，滾珠絲杠，導螺桿等等，都可被使用。 30 200521059 上面所述的端施作器縮回常式可用一或多個電赧程式產片來實施。會影響到基材裝載站的設計的舉例性參數包括（1)傳送帶速度；（2)基材載具搬運器215可移動該端施作器225 的水平及/或垂直速度；（3)可被施加到該基材載具搬運器 215的端施作器225上的水平及/垂直加速及減速；（4)該基材載具搬運器215的端施作器225的水平及垂直運動範圍；（5)介於被該傳送帶231傳送之相鄰基材載具207之間的距離；（6 _)該傳送帶231傳送基材載具207的高度；（7) 基材載具207應被舉離該傳送帶231的载具卡合件4〇1的垂直距離；（8)每一基材載具207的高度（垂直尺寸）；（9) 在基材載具207從載具卡合件401上被釋當之後，其必需被降低的距離，用以讓基材載具可被傳送帶231運送經過該被釋當的基材載具207且不會撞到該被釋放的基材載具 2〇7 ; (10)載具卡合件的種類；及/或（n)其它類似的參數。例如，在本發明的至少一實施例中，本發明的基材載具搬運器2 1 5應能夠（1)達到該端施作器2 2 5的最大水平速度，其大於或等於該傳送帶231的水平速度；（2)將該端施作器22 5升高至一足以讓該基材載具2〇7脫離一載具卡合件401的高度；（3)在兩個或更多個水平速度下移動，如一用來與傳送帶速度相匹配的第一水平速度，及用來來/回傳送一基材載具2 07至對接站2〇3的第二水平速度；（4)在兩個或更多個垂直速度下移動，如用來讓一基材載具2〇7脫離該傳送帶231或將基材載具2〇7遞交至該傳送帶231的 31 200521059 第一垂直速度，及用來來/回傳送一基材載具207至對接站 2〇3的第二垂直速度；及/或（5)實施被該端施作器225支撐的基材载具207(及基材載具與傳送帶231之間的卡合及解卡合所需要）的所有加速及減速且不會傷及裝在該基材載具207内的基材。相同地，基材載具搬運器2 1 5應操作用以將其端施作器225降低至一可服務最底下的對接站2〇3的夠低的高度、如果一存放架或其它儲存位置位在比該最低的對基站 2〇3更低的地方的話，則該基材載具搬運器215應被進一步操作用以降低端施作器225來服務該最低的存放架/位置）。被提供在該水平導引件221上上的端施作器225的水平移動範圍，及移動該端施作器225的機構應被安排成可讓該端施作器225能夠加速至一足以與該傳送帶速度相匹被的水平速度，讓基材載具207與傳送帶231脫離及/或與傳送帶23 1嚙合（同時可避免與該傳送帶231上所傳送之其它基材載具相撞），及可減速而至暫停，所有這些都是在該水平導引件221提供的水平移動範圍内。本發明包含了將某些或所有上述的特徵/參數包括在本發明的基材裝載站的一或多個實施例中。的特定實施例及/或In at least one embodiment of the present invention, if the end effector 225 is not appropriately placed with respect to the empty carrier engagement member 401, the processing of FIG. 5 is terminated. Or | In another embodiment of the present invention, in step 509, any necessary adjustment of the relative horizontal position of the target substrate carrier 2 () 7 (for example, to ensure that when the target substrate carrier When 207 is raised, the flange 402 will not contact the carrier engaging member 401). For example, the controller may accelerate and / or decelerate the end effector 225 until a suitable alignment signal is received from the sensor 235. During this position adjustment, the horizontal speed of the target substrate carrier 207 and the horizontal speed of the conveyor belt 231 and / or the carrier engagement member 401 can be kept approximately the same. In another embodiment of the present invention, steps 507 and 509 may be omitted (eg, if a predetermined motion plan is used, its speed and / or launch time of the conveyor 231 and / or the end effector 225 Location is relevant). In this embodiment, the sensor 23 5 may be omitted. Assuming that the end applicator 2 2 5 is appropriately placed with respect to the empty vehicle engaging member 4 〇丨, in step 5 1 1, the end applicator 2 2 5 will be moved along by the horizontal guide 221 The vertical guides 217 and 219 are raised, and as shown in FIG. 6B, the target substrate carrier 207 and its flange 402 are brought to the height of the carrier card holder 28 200521059 pieces 401. As shown in Fig. 6b, the flange 402 is placed slightly on the vehicle engaging member 401 (for example, to be mounted thereon as described below). Next, as shown in step 513 and FIG. 6C, the target substrate carrier 207 is accelerated to bring the flange 40 of the target substrate carrier 207 to a position higher than the conveyor belt 23 1 Above the carrier engaging member 401. The target substrate carrier 207 is then decelerated so that the horizontal speed of the target substrate carrier 207 is again approximately equal to the horizontal speed of the conveyor belt 231. Next, as shown in FIG. 6D and represented by step 515, the end applicator 225 is lowered (while maintaining approximately the horizontal speed of the conveyor belt 23 1) to make the target substrate carrier 207 convex. The edge 402 is engaged with the substrate engaging member 401 of the conveyor belt 231, so that the target substrate carrier 207 is transferred to the carrier engaging member 401. In one or more embodiments of the present invention, the target substrate carrier 207 is preferably brought into contact with the carrier engaging member 401 at zero speed and / or acceleration. This will be referred to hereinafter Figure 8A-8B illustrates. Under the control of the controller 237, the substrate carrier carrier 215 continuously lowers the end applicator 225 (while maintaining approximately the horizontal speed of the conveyor 231), so that the kinematic pin 229 of the end applicator 225 and the The feature 407 on the bottom of the target substrate carrier 207 is detached. An exemplary result of steps 5 to 7 is shown in Fig. 6E. After the end effector 225 is disengaged from the target substrate carrier 207, in step 519, the end effector 225 is decelerated (e.g., suspended) and the processing of FIG. 5 ends (step 521). At the same time, the target substrate carrier 207 (which is supported by the carrier engaging member 401 with its flange 402) is transported by the conveyor belt 231 away from the 29 200521059 loading station 201. As described above, in at least one embodiment of the present invention, the acceleration, deceleration, raising and / or lowering of the end effector 225 can be defined by the motion planning of the end effector 225. Therefore, the substrate loading station 201 provided in accordance with the invention, particularly the substrate carrier carrier 215 operated under the control of the controller 237, unloads the substrate carrier from a moving conveyor belt, and The substrate carrier is loaded onto the moving conveyor. In this way, the substrate loading station and substrate carrier carrier of the present invention can reduce the dweU time of the substrate in the manufacturing plant, and reduce working capital and manufacturing costs. According to the present invention, the controller 2 3 7 can be programmed to perform the processing in FIGS. 3 and 5. Moreover, the processing of Figures 3 and 5 can be built into one or more computer program products. Each computer program product can be carried by a computer-readable medium (eg, carrier signal, floppy disk, hard drive, random access memory, etc.). In at least one embodiment of the present invention, the substrate loading station 001 of the present invention may be constructed to automatically remove the end effector 225 from an event such as a power outage, emergency shutdown (to be discussed later), and the like. The conveyor belt 231 is retracted. For example, the controller 2 3 7 may include a one-end applicator retracting routine, which may automatically retract the end-applicator 225 (and / or the horizontal guide 221) from the conveyor 231 to recall a burst Events, such as power outages, emergency shutdowns, etc. In addition, the end effector 225 (and / or the horizontal guide 221) may be biased to be used when the power of the loading station 201 is removed. ) Can retract automatically. Any appropriate biasing mechanism, such as springs, gravity, pneumatic cylinders, ball screws, lead screws, etc. can be used. 30 200521059 The above-mentioned end-applicator retraction routine can be implemented with one or more electronic program chips. Exemplary parameters that can affect the design of the substrate loading station include (1) the speed of the conveyor; (2) the horizontal and / or vertical speed at which the substrate carrier 215 can move the end effector 225; (3) the Horizontal and / or vertical acceleration and deceleration applied to the end applicator 225 of the substrate carrier 215; (4) horizontal and vertical movement ranges of the end applicator 225 of the substrate carrier 215 (5) the distance between adjacent substrate carriers 207 transferred by the conveyor belt 231; (6 _) the height of the substrate carrier 207 transferred by the conveyor belt 231; (7) the substrate carrier 207 should be Lift the vertical distance from the carrier engaging part 401 of the conveyor belt 231; (8) the height (vertical size) of each substrate carrier 207; (9) the substrate engaging part 207 from the carrier engaging part After being released on 401, it must be lowered by a distance so that the substrate carrier can be transported by the conveyor 231 through the released substrate carrier 207 without hitting the released substrate carrier 20.7; (10) the type of vehicle engaging parts; and / or (n) other similar parameters. For example, in at least one embodiment of the present invention, the substrate carrier carrier 2 1 5 of the present invention should be able to (1) reach the maximum horizontal speed of the end applicator 2 2 5, which is greater than or equal to the conveyor belt 231 (2) Raise the end applicator 22 5 to a height sufficient to release the substrate carrier 207 from a carrier engaging member 401; (3) at two or more Move at the horizontal speed, such as a first horizontal speed to match the speed of the conveyor belt, and a second horizontal speed to transfer / return a substrate carrier 2 07 to the docking station 203; (4) between two Or at a vertical speed of more than one, such as to remove a substrate carrier 2007 from the conveyor belt 231 or to deliver the substrate carrier 2007 to the conveyor belt 231 at 31 200521059 at a first vertical speed, and to / Transfer a second vertical speed of a substrate carrier 207 to the docking station 203; and / or (5) implement the substrate carrier 207 (and the substrate carrier and conveyor belt) supported by the end applicator 225 All of the acceleration and deceleration required for the engagement between 231 and the release of the engagement will not hurt the substrate contained in the substrate carrier 207. Similarly, the substrate carrier carrier 2 1 5 should be operated to lower its end applicator 225 to a sufficiently low height to service the bottom docking station 20 3, if a storage rack or other storage location If it is lower than the lowest pair of base stations 203, the substrate carrier carrier 215 should be further operated to lower the end effector 225 to serve the lowest storage rack / position). The horizontal movement range of the end applicator 225 provided on the horizontal guide 221, and the mechanism for moving the end applicator 225 should be arranged so that the end applicator 225 can accelerate to a speed sufficient to interact with The horizontal speed of the conveyor belt is matched with the horizontal speed, so that the substrate carrier 207 is disengaged from the conveyor belt 231 and / or meshed with the conveyor belt 23 1 (while avoiding collision with other substrate carriers conveyed on the conveyor belt 231), and It can decelerate to pause, all within the horizontal movement range provided by the horizontal guide 221. The present invention encompasses the inclusion of some or all of the above-mentioned features / parameters in one or more embodiments of the substrate loading station of the present invention. Specific embodiments of and / or

第4A-4E及6A-6E圖類似之一 π圖。第7C-7D圖為與基材载具在與該傳送帶231 在設計本發明的基材裝載站2〇1 程 7A 本 200521059 喊合及/或與傳送帶23 1脫離期間的簡化側視圖。基材載具搬運器215的端施作器225的水平運動範圍被示於第7A圖中。端施作器225及支撐件223在該端施作器225沿著該基材载具搬運器21 5的水平導引件221的運動的上游極限點701以實線輪廓被示出。端施作器225 及支撐件223在該端施作器225沿著該水平導引件221的運動的下游極限點7〇2以虛線被示出。在第7A圖中的一距離DHR代表該端施作器225的最大水平移動範圍。移動的水平範圍Dhr的選擇除了受到上文中討論的設計因素的影響之外，其亦受到對接站203或架子239的位置（如’對接站或架子的數量及/或水平跨距），該基材裝載站201之合意的佔地面積，該工廠界面或耦合至該基材装載站201的處理工具的尺寸，及/或類此者的影響。基材載具搬運器215的端施作器225的垂直運動範圍被示於第7B圖中。端施作器225，支撐件223及水平導引件221在該端施作器225的垂直運動範圍的上限點703處以實線輪廓被示出。在該位置上，端施作器225是在Eh 的高度，該高度足以讓一基材載具207的凸緣402不接觸該傳送帶231的載具卡合件401(見第4B-4D圖）。繼續參照第7 B圖，端施作器2 2 5，支撐件2 2 3及水平導引件221在該端施作器225的垂直運動範圍的下限點 7〇4處以虛線被示出。在該位置上，端施作器225是在El 的高度，該高度是服務該基材裝載站201的最底下的對接站（或存放位置）所需要的最低高度。第7B圖中所示的距離 200521059 EVR代表端施作器225垂直移動的最大範匿 EVR = EH-EL)。其它的垂直移動距離亦可被使用。影響一基材載具207與傳送帶231喃合咬與 231脫離操作的參數被示於第7C-7D圖中。第7C 一距離Ds，其將被該傳送帶231所傳送之兩相鄰的具207分隔開來。該分隔距離Ds與介於該载具卡/ 之間的距離D c E M相關但不小於該距離，且亦與談具207的水平尺寸有關。加大該距離Ds可藉由提大的空間及/或增加在裝載與卸載作業期間之用於^ 低’加速及/或減速一基材載具207的時間長度以方及卸載作業。然而，加大距離Ds會減少該傳送帶傳送之基材載具數量。如第7D圖所示的，在本發明的至少一實施例了要讓一基材載具2 07與該傳送帶23 1脫離，端施竹將運動學的特徵結構229升高到一高度，其等於至材載具207的底部的高度ECB。詳言之，運動學的構229被升高到大於或等於該高度ecb加上支撐該具207之載具合件401的基座的高度Hc EM (如，讓载具207的凸緣402不接觸該載具卡合件401)。在被解脫的基材載具207之間，端施作器225被減速載具卡合件401移到該基材載具207的前頭一對大緣4 02的長度LF的距離。數種其它的參數可影響本基材裝載站201及基材搬運器215的設計。以上的說明只揭示了本發明的一舉例性的實施 (如，傳送帶圖顯示基材載 .件 4 0 1 基材載供一較 •高、降便裝載 23 1可中，為器225 少該基特徵結基材載該基材降低該用以讓於該凸發明的例；上 34 200521059 面所揭示的設備及方法之以本發明的範圍内之變化對於熟習此技藝者而言是很明顯@。例如，除了如上文所述地使用兩個垂直導引件於該基材載具搬運器上之外，亦可只使用-垂直導引件。…基材載具搬運器可被安排成具有-垂直導引件，其被耦合以沿著一水平導引件水平地移動，而不該水平導引件被耦合以沿著垂直導引件作垂直的移動。當該基材載具搬運器包括一為了沿著一水平導引件移動而被安裝之垂直導引件時，端施作器的升高用以將一基材載具與傳送帶脫離，或端施作器的降低用以將該基材載具遞交至該傳送帶，都可藉由沿著該垂直導引件升高或降低端施作器來達成（而不是相對於一對垂直導引件升高該水平導引件來達成）。一作動件（如，皮帶驅動器或導螺桿，未示出）可被提供在基材載具搬運器215的支撐件223上用來將該端施作器225相對於該水平導引件221升高並讓一基材載具與傳送帶231分離，或用來將端施作器225朝向該水平導引件221降低用以將該基材載具遞交到該傳送帶 2 3 1 (以取代將水平導引件2 2 1沿著一垂直導引件升高/降低）。本發明可被用來將一基材載具從一傳送帶上卸下，或將一基材載具裝載到該傳送帶231上，該傳送帶以垂直的方位傳送該基材載具。在此一例子中，端施作器225可包括一重新定位機構用來將一基材載具重新定位於垂直與水平方位之間，如2002年八31日提申，名稱為，，End Effect〇r Having Mechanism for Reorienting a Wafer Carrier 35 200521059Figures 4A-4E and 6A-6E are similar to one π diagram. Figures 7C-7D are simplified side views of the substrate carrier during the process of designing the substrate loading station of the present invention with the conveyor belt 231, 7A, 200521059, and / or disengagement from the conveyor belt 231. The horizontal movement range of the end effector 225 of the substrate carrier carrier 215 is shown in Fig. 7A. The end effector 225 and the supporting member 223 at the upstream limit point 701 of the movement of the end applicator 225 along the horizontal guide 221 of the substrate carrier carrier 21 15 are shown in solid outline. The end effector 225 and the support member 223 are shown at the downstream limit point 702 of the end effector 225 along the horizontal guide 221 by a dotted line. A distance DHR in Fig. 7A represents the maximum horizontal movement range of the end effector 225. The selection of the horizontal range of movement Dhr is not only influenced by the design factors discussed above, it is also affected by the position of the docking station 203 or shelf 239 (such as the number of docking stations or shelves and / or horizontal span). The desirable footprint of the material loading station 201, the size of the plant interface or the processing tool coupled to the substrate loading station 201, and / or the like. The vertical movement range of the end effector 225 of the substrate carrier carrier 215 is shown in Fig. 7B. The end applicator 225, the support member 223, and the horizontal guide 221 are shown with a solid line outline at the upper limit point 703 of the vertical movement range of the end applicator 225. In this position, the end applicator 225 is at a height of Eh, which is sufficient to prevent the flange 402 of a substrate carrier 207 from contacting the carrier engaging member 401 of the conveyor belt 231 (see Figs. 4B-4D). . Continuing to refer to FIG. 7B, the end effector 2 2 5, the support 2 2 3 and the horizontal guide 221 are shown by dotted lines at the lower limit point 704 of the vertical movement range of the end effector 225. In this position, the end applicator 225 is at the height of El, which is the minimum height required to serve the bottom docking station (or storage position) of the substrate loading station 201. The distance shown in Figure 7B 200521059 EVR represents the maximum range of vertical movement of the end effector 225 (EVR = EH-EL). Other vertical movement distances can also be used. The parameters that affect the operation of a substrate carrier 207 and a conveyor belt 231 articulating and disengaging 231 are shown in Figures 7C-7D. The 7C is a distance Ds, which separates two adjacent tools 207 conveyed by the conveyor belt 231. The separation distance Ds is related to the distance D c E M between the vehicle card / but not less than the distance, and also related to the horizontal size of the vehicle 207. Increasing the distance Ds can be increased by increasing the space and / or increasing the length of time used to accelerate and / or decelerate a substrate carrier 207 during loading and unloading operations to facilitate unloading operations. However, increasing the distance Ds will reduce the number of substrate carriers transferred by the conveyor. As shown in FIG. 7D, in at least one embodiment of the present invention, to remove a substrate carrier 2 07 from the conveyor belt 23 1, Duan Shizhu raised the kinematic characteristic structure 229 to a height, which It is equal to the height ECB to the bottom of the material carrier 207. In detail, the kinematic structure 229 is raised to a height greater than or equal to the height ecb plus the height Hc EM of the base supporting the carrier assembly 401 of the tool 207 (for example, the flange 402 of the carrier 207 does not contact The carrier engaging member 401). Between the released substrate carriers 207, the end effector 225 is moved by the deceleration carrier engaging member 401 to a distance of a length LF of a pair of large edges 402 at the front of the substrate carrier 207. Several other parameters can affect the design of the substrate loading station 201 and the substrate carrier 215. The above description only discloses an exemplary implementation of the present invention (for example, the conveyor belt diagram shows the substrate loading. Parts 4 0 1 The substrate loading is for a high and low loading 23 1 can be medium, for the device 225 less The characteristics of the substrate and the substrate are used to reduce the example of the convex invention; the changes in the scope of the invention disclosed in the above 34 200521059 are obvious to those skilled in the art @. For example, in addition to using two vertical guides on the substrate carrier carrier as described above, only-vertical guides can be used .... The substrate carrier carrier can be arranged as A-vertical guide is coupled to move horizontally along a horizontal guide, but the horizontal guide is not coupled to move vertically along the vertical guide. When the substrate carrier is carried The applicator includes a vertical guide that is mounted for movement along a horizontal guide. The end applicator is raised to release a substrate carrier from the conveyor belt, or the end applicator is lowered to The substrate carrier can be submitted to the conveyor belt by A vertical guide raises or lowers the end applicator (instead of raising the horizontal guide relative to a pair of vertical guides). An actuator (such as a belt drive or lead screw, not shown) (Out) may be provided on the support 223 of the substrate carrier carrier 215 to raise the end applicator 225 relative to the horizontal guide 221 and separate a substrate carrier from the conveyor 231, or It is used to lower the end applicator 225 toward the horizontal guide 221 to deliver the substrate carrier to the conveyor belt 2 3 1 (instead of raising the horizontal guide 2 2 1 along a vertical guide (High / lower). The present invention can be used to unload a substrate carrier from a conveyor belt, or load a substrate carrier onto the conveyor belt 231, which conveys the substrate carrier in a vertical orientation. In this example, the end effector 225 may include a repositioning mechanism to reposition a substrate carrier between vertical and horizontal orientations. For example, as proposed on August 31, 2002, the name is End. Effect〇r Having Mechanism for Reorienting a Wafer Carrier 35 200521059

Between Vertical and Horizontal 〇rientatioIls’’的美國專利申請案第60/407,452號中所揭示者。本發明係以單一基材載具為例來示出，但本發明可被應用到裝承多於一片基材的基材載具上。本文中所揭示的基材裝載站的特定實施例包括狼排成複數個垂直的對接站堆疊。然而，以上所示的裝載站气包括一垂直的對接站堆疊，只有一對接站或多於兩個之垂直的對接站堆疊。該基材裝載站可包括一或多個其它的基材載具存放設備其並沒有存放架。在本文中所示的舉例性基材裝載站中，對接站包括對接扣爪其懸吊一基材載具用以將其移動在被對接的與未對接的位置之間。或者，該等對接站可包括對接雪橇或平台，其可透過該基材載具的底部或侧邊支撐一基材載具的底下，同時將該基材載具移動於被對接的與未對接的位置之間。最好是，本發明被使用在包含一骨架的基材裝载站上，該垂直及水平導引件是耦合到該骨架上。以此方式，較佳的基材裝載站為一模組且可被快速地安裝及校準。在該基材裝載站包括一或多個存放架（如，第2A圖中的存放架239)的例子中，每一存放架亦可被安裝到該骨架上。藉由將基材載具搬運器與存放架安裝在該骨架上，基材載具搬運器與存放架具有一相對於彼此的預定位置。這可進一步方便安裝及校準，且這亦是使用一模組化的基材裝載站的好處。相類似地，其它的機構，<象是用於裝載及/或從一 36 200521059 高架的工廠傳送系統上卸載基材載具專屬的機構地安裝在該骨架上，如2003年八月28日提申利為”For Transporting 〜心，，的稱申請案第1 0/650,3 1 0號所揭示者。利在一態樣中，該骨架可被安裝在無塵室牆壁上安裝位置（如，預先鐵好的螺孔中），或在一搶室（如^ 工薇界面艙室的前牆上。最好是，該牆壁亦具有預定的：裝位置，對接扣爪或對接平台可安裝在女U.S. Patent Application No. 60 / 407,452 between Vertical and Horizontal OrientatioIls ''. The present invention is illustrated by taking a single substrate carrier as an example, but the present invention can be applied to a substrate carrier that holds more than one substrate. Particular embodiments of the substrate loading station disclosed herein include wolves arranged in a plurality of vertical docking station stacks. However, the loading station shown above includes a vertical docking station stack with only one docking station or more than two vertical docking station stacks. The substrate loading station may include one or more other substrate carrier storage devices without storage racks. In the exemplary substrate loading station shown herein, the docking station includes a docking claw that suspends a substrate carrier to move it between a docked and an undocked position. Alternatively, the docking stations may include docking skis or platforms that can support the bottom of a substrate carrier through the bottom or side of the substrate carrier, while moving the substrate carrier to the docked and undocked Between locations. Preferably, the present invention is used on a substrate loading station comprising a frame to which the vertical and horizontal guides are coupled. In this way, the preferred substrate loading station is a module and can be quickly installed and calibrated. In the example where the substrate loading station includes one or more storage racks (e.g., storage rack 239 in Figure 2A), each storage rack can also be mounted to the frame. By mounting the substrate carrier carrier and the storage rack on the frame, the substrate carrier carrier and the storage rack have a predetermined position relative to each other. This further facilitates installation and calibration, and is the benefit of using a modular substrate loading station. Similarly, other mechanisms, such as those used for loading and / or unloading substrate carriers from a 36 200521059 elevated factory conveyor system, are exclusively mounted on the framework, such as on August 28, 2003. Tishenli is "For Transporting ~ Xin," and is referred to as disclosed in Application No. 10 / 650,3 1 0. In one aspect, the skeleton can be installed on the clean room wall installation position ( For example, in a pre-made iron screw hole), or in a grab room (such as the front wall of the Gongwei interface cabin. Preferably, the wall also has a predetermined: installation position, docking claw or docking platform can be installed In women

:外：該牆壁可具有預定的安裝位置，-基材載具L機構了女裝在這些安裝位置上。當該骨#，對接機構，及其材載具開啟機構分別被安裝到同一表面上時，它們彼此2 間的相對位置即被預先決定，且可便於基材裝載站的安：與校準。雖然本文中所述的傳送帶是位在基材裝載站2〇1的上但傳送帶亦可位在該基材裝載站所在的高度或低於該高度或位在與基材裝載站相鄰的另一位置上。 /: Outside: The wall may have predetermined installation positions,-the substrate carrier L structured the women's clothing at these installation positions. When the bone #, the docking mechanism, and the material carrier opening mechanism are respectively mounted on the same surface, their relative positions with respect to each other are determined in advance, which can facilitate the installation and calibration of the substrate loading station. Although the conveyor belt described herein is located above the substrate loading station 201, the conveyor belt may also be located at or below the height of the substrate loading station or another location adjacent to the substrate loading station. One position. /

本文中所不的基材裝載站可被用來提供基材到一處理工具中，一測量位置，或一基材可被傳送到的任何其它位置上。從以上的描述中，應被暸解的是，本發明的基材裝載站可與一工廠界面（FI)相結合地被安裝，該FI具有一 FI 機器人來將一基材從該基材裝載站的一對接站送到一處理工具的負载鎖定室（如，第i圖的系統中）。或者，該工廠界面可被省略掉，且該負載鎖定室包括一基材搬運器其將 37 200521059 一基材直接從該基材裝載站的對接站傳送基材。或者，該處理工具可在大氣壓力下而不是在真空下操作，使得該負載鎖定室可被省略掉。第8A-8D圖為該端施作器225的舉例性運動規劃。在本發明的至少一實施例中，當此等運動規劃被使用時，只需要使用到感測器23 3(如’一，，發動，，感測器），而感測器 235可被省略掉。參照第8八圖，曲線山顯示端施作器在一裝載作業期間沿著X-轴的（傳送帶231移動的水平方向）的速率。曲線C2顯示端施作器在一裝载作業期間沿著心轴的（垂直方向）的速率。曲線C3端施作器在一裝載作業期間在Z-軸上的位置及曲線C4顯示端施作器在χ軸上的位置。第8Β圖為一與第8Α圖類似的圖，但顯示的是被放大之在ζ軸上的位置資料。第8C_8D圖為與第8Α8Β圖類似Substrate loading stations other than those described herein can be used to provide substrates to a processing tool, a measurement location, or any other location to which a substrate can be transferred. From the above description, it should be understood that the substrate loading station of the present invention can be installed in combination with a factory interface (FI) having a FI robot to remove a substrate from the substrate loading station. The docking station is sent to a load lock chamber of a processing tool (eg, in the system of Fig. I). Alternatively, the plant interface may be omitted, and the load lock chamber includes a substrate handler that transfers a substrate directly from a docking station of the substrate loading station. Alternatively, the processing tool can be operated at atmospheric pressure instead of under vacuum, so that the load lock chamber can be omitted. 8A-8D are exemplary motion plans of the end effector 225. In at least one embodiment of the present invention, when such motion planning is used, only the sensor 23 3 (such as' a, start, and sensor) is needed, and the sensor 235 may be omitted. Off. Referring to Figures 8 and 8, the curve mountain shows the speed of the end effector along the X-axis (the horizontal direction in which the conveyor belt 231 moves) during a loading operation. Curve C2 shows the velocity of the end effector along the mandrel (vertical direction) during a loading operation. The position of the end effector on the C-axis in the Z-axis during a loading operation of the curve C3 and the position of the end effector on the X-axis during the loading operation are shown in the curve C4. Figure 8B is similar to Figure 8A, but shows the enlarged position data on the z-axis. Figure 8C_8D is similar to Figure 8A8B

的圖式，但顯示的是端施作器225在一卸載作業期間在I 轴的速率（曲線Cl’），z·軸速率（曲線C2，），z-軸位置（曲C3，）及X-軸的位置（曲線C4，）。應注意的是，第8a_8B圖顯示在一基材載具裝载作業期間的啟動期間在一較低的軸位置的z-軸位置資料（曲線C3)(用來補償一基材載具的尺寸）。參照第8A-8B圖及曲線c卜C4，端施作器225玎實施類似的升兩’降低’及加速，如同參照第5所描述的一裝載作業相同。例如，進一步參照第5及6A-6E圖，在接收到裝載作業的一啟動訊號時（步驟5〇3)，端施作器225會加速用以在時間T 1至T2之間與該傳送帶2 3 1在X-軸方向 38 200521059 上的速率（曲線Cl)相匹配（第6A圖的步驟505)。之後，在時間T3至T4之間，端施作器225(曲線C3)被升高至傳送帶231的高度（第6B圖的步驟511);使得將被裝載到該傳送帶231上的基材載具2〇7的凸緣4〇2是位在將要接收該基材載具207之載具卡合件4〇1的上方。在時間T5至T6之間，端施作器225被加速（曲線C1) 到超過該傳送帶23 1的速度之速度（然後被減速回到該傳送帶231的速度）使得基材載具2〇7的凸緣4〇2是位在載具卡合件401的上方（步驟513及第6C圖）。在時間T7 ,當基材載具207的凸緣4〇2是位在載具卡合件4〇1的上方時’端施作器225降下來（曲線C3)且在凸緣402接觸到該載具卡合件401時停止（如在時間T8時所示）。端施作器 225然後降下來直到時間τ9為止且基材載具2〇7保持在載具卡合件401上。基材載具207藉以在大致零速率及/或加速下被傳送到該傳送帶231上（如，在時間Τ8)(步驟5 15 及517及第6D-6E圖）。例如，因為當凸緣4〇2與載具卡合件401相卡合時，端施作器225會停止，基材載具2〇7的傳送是以在ζ-軸上大致零速率及加速下（曲線C2)發生的。相同地，因為在載具交換期間端施作器225在1軸上的速率是固定的且與傳送帶231的速率相當（曲線C1)，所以基材載具207的傳送以在X-軸上大致零加速下發生的。又，在本發明的至少一實施例中，在基材載具傳送期間在^軸方向上沒有發生運動。因此，基材載具傳送可在三個方向上以大致零加速及在至少兩個方向上以大致零速率的方式 39 200521059 被實施。在時間T9之後，端施作器225會減逮（步驟5i9 及曲線C 1)。參照第8C-8D及曲線C1-C4，端施作器22s在一卸載作業期間可實施與參照第3圖所作的說明類似之升高，降低’及加速等動作。例如，藉由進一步參照第3圖及第4A 4E 圖，在接收到一卸载作業的一啟動訊號之後（步驟3〇/)，端施作器225會加速用以與用以在時間T1至丁2之傳送帶在χ♦方向上的速率（曲線ci，）相匹配 3〇5及第^圖）。之後，在時間丁3至丁4之間，端施作器 225被升高（曲線C3，）使得運動的銷229與將從傳送帶Μ} 上被卸下來的基材載具2〇7的下凹特徵結構相嚙合1 =及第4B圖)。在時間T4，端施作器225在運動學二銷與該下凹的特徵結構相嚙合時停止升 C3:)。在時間…之間，端施作器225被進= 用以將該基材載具207的凸緣402舉離該载具卡合2 4〇1(步驟311及第4C圖）。基材載具2〇7藉此以大致率及/或零加速方式從載具卡合件4〇1上卸下（如，、及/或Ζ-轴方向上，因為在將該基材載具2〇7從該載在且χ ’人y 件4〇1上舉起來之前，在時間T4時x轴運動的暫停二因為端施作器225與傳送帶231之間的速度相匹配）。在間T5之後’端施作器225減速並再加速(步驟⑴及曲： C"及降低(步驟315及㈣cr)用以離開該載具卡〜 401 ’如之前參照第8C-8D圖所述者。 σ 因此，基材載具從一移動中的傳送帶上卸下及/或裝載 40 200521059 到該移動中的傳送帶上的操作會以在— ，士丄或多個方向上，最好是在兩個方向上，更加的是在所有古二方向上，大致零速率及/或大致零加速的方式實施。在卸载戰/裝裁期間，在/垂直方向上之大致零速率及加速是較佳叩’及零速率及/或零加速比大致零速率及加速還要更好。* 在本文中，，，零速率，，或”零加速”意指在系統變數，像是傳史帶间度，傳送帶透度，作動器可重復性等等，及在*** 乐統限制，像是控制器解The figure shows, but shows the velocity of the end effector 225 on the I axis (curve Cl '), the z-axis velocity (curve C2,), the z-axis position (curve C3,) and X during an unloading operation. -The position of the axis (curve C4,). It should be noted that Figures 8a-8B show the z-axis position data (curve C3) of a lower axis position during start-up during a substrate carrier loading operation (to compensate for the dimensions of a substrate carrier) ). Referring to Figs. 8A-8B and curve c and C4, the end effector 225 玎 performs similar lifting and lowering and acceleration, as in a loading operation described with reference to Fig. 5. For example, referring further to FIGS. 5 and 6A-6E, when a start signal is received for the loading operation (step 503), the end effector 225 will accelerate to connect the conveyor 2 between time T1 to T2. 3 1 The velocity (curve C1) in the X-axis direction 38 200521059 is matched (step 505 in Fig. 6A). Thereafter, between time T3 and T4, the end effector 225 (curve C3) is raised to the height of the conveyor belt 231 (step 511 in FIG. 6B); The flange 407 of 207 is located above the carrier engaging member 401 that is to receive the substrate carrier 207. Between time T5 and T6, the end effector 225 is accelerated (curve C1) to a speed exceeding the speed of the conveyor belt 23 1 (then decelerated back to the speed of the conveyor belt 231) so that the substrate carrier 207 The flange 402 is positioned above the vehicle engaging member 401 (step 513 and FIG. 6C). At time T7, when the flange 402 of the substrate carrier 207 is positioned above the carrier engaging member 401, the end applicator 225 is lowered (curve C3) and contacts the flange 402 The vehicle engagement member 401 stops (as shown at time T8). The end effector 225 is then lowered until time τ9 and the substrate carrier 207 is held on the carrier engaging member 401. The substrate carrier 207 is thereby transferred to the conveyor belt 231 (eg, at time T8) at substantially zero speed and / or acceleration (steps 5 15 and 517 and FIGS. 6D-6E). For example, because when the flange 40 is engaged with the carrier engaging member 401, the end applicator 225 will stop, and the conveyance of the substrate carrier 2 will be at a substantially zero velocity and acceleration on the z-axis. The down (curve C2) occurs. Similarly, since the speed of the end effector 225 on the 1 axis is fixed and comparable to the speed of the conveyor belt 231 (curve C1) during the carrier exchange, the transfer of the substrate carrier 207 is approximately on the X-axis It happened at zero acceleration. Also, in at least one embodiment of the present invention, no movement occurs in the ^ -axis direction during the substrate carrier transfer. As a result, the substrate carrier transfer can be implemented with substantially zero acceleration in three directions and substantially zero velocity in at least two directions. 39 200521059. After time T9, the end effector 225 will reduce arrest (step 5i9 and curve C1). Referring to Sections 8C-8D and Curves C1-C4, the end applicator 22s can perform operations such as raising, lowering, and accelerating during the unloading operation similar to those described with reference to FIG. 3. For example, by further referring to FIGS. 3 and 4A to 4E, after receiving an activation signal of an unloading operation (step 30 /), the end effector 225 will be accelerated to use the time between T1 and D1. The speed (curve ci,) of the conveyor belt 2 in the χ ♦ direction matches 305 and ^). Thereafter, between time D3 and D4, the end effector 225 is raised (curve C3,) so that the moving pin 229 and the substrate carrier 207 will be removed from the conveyor belt M}. Concave features are engaged 1 = and Figure 4B). At time T4, the end effector 225 stops rising when the second kinematic pin is engaged with the concave feature C3 :). Between times, the end applicator 225 is fed in to lift the flange 402 of the substrate carrier 207 away from the carrier and engage 2 401 (steps 311 and 4C). The substrate carrier 207 is thereby removed from the carrier engagement member 401 in a rough and / or zero acceleration manner (eg, in the direction of, and / or the Z-axis direction, because Before the tool 207 was lifted from the load and the χ ′ person y piece 401 was lifted, the suspension of the x-axis movement at time T4 was due to the speed matching between the end effector 225 and the conveyor 231). After interval T5, the 'end applicator 225 decelerates and accelerates again (steps ⑴ and tune: C " and lowered (steps 315 and ㈣cr) to leave the vehicle card ~ 401' as described previously with reference to Figures 8C-8D Σ Therefore, the unloading and / or loading of a substrate carrier from a moving conveyor 40 200521059 to the moving conveyor will be performed in-, Shi or more directions, preferably in In both directions, it is more implemented in all ancient two directions with a substantially zero rate and / or substantially zero acceleration. During the unloading warfare / installation, approximately zero speed and acceleration in the / vertical direction are preferred.叩 'and zero rate and / or zero acceleration are better than approximately zero rate and acceleration. * In this article, zero rate, or "zero acceleration" means the system variable, such as the degree of history. , Conveyor penetration, actuator repeatability, etc., and restrictions in the system, such as controller solutions

析度，作動器解析纟，端施作器位置餘裕等等考量下儘< 能接近零。，，大致零速率，，或，，大致零加速，，意指夠接近零，使得一基材載具可從一移動中的傳送帶及/或載具卡合件上被卸下及/或被裝載到移動中的傳送帶及/或载具卡合件上的操作不會傷到裝在該基材載具内的基材及/或產I有害的微粒。例如，一基材載具可以一極小的速率被接觸。在一實施例中，一端施作器可被快速垂直地升高，然後衣接觸一基材載具之前減慢至一相對小或大致為零的速率。Considering resolution, actuator resolution, end-applicator position margin, etc. < can be close to zero. ,, substantially zero speed, or, substantially zero acceleration, means close to zero, so that a substrate carrier can be unloaded from a moving conveyor and / or carrier engagement member and / or The loading operation on the moving conveyor belt and / or the carrier engagement member will not hurt the substrate and / or harmful particles produced in the substrate carrier. For example, a substrate carrier can be contacted at a very small rate. In one embodiment, the one-end applicator can be quickly raised vertically and then slowed to a relatively small or substantially zero rate before the garment contacts a substrate carrier.

一類似之小的（或大致為零）的加速亦可被使用。在一實施例中，基材載具在垂直方向上以一小於〇 5G的力量被接觸到，及在另一實施例中，以小於〇丨5G的力量被接觸到。其它的接觸力量亦可被使用。雖然本發明主要是以卸載/裝載内中一單一晶圓的基材載具至一移動中的傳送帶為例加以說明，但應被瞭解的疋’内裝複數片的基材載具亦可從一移動中的傳送帶上被卸下或亦可被裝載到移動中的基材上。又，本發明可被應用在可傳送單一基材載具及複數基材載具的系統中。相同 41 200521059 地，本發明可被用來將個別的基材從—移動中傳送下及/或將個別的基材裝載到移動中的傳送帶上（如被裝在一封閉的基材載具内的基材卜例如，基材可用開放式的基材載具，基材支撐件，基材盤或其它帶，或另一基材傳送裝置其可讓端施作器225直接材放到該傳送帶的基材傳送裝置上，來傳送，此基裝置使用類似的端施作器運動規劃來移動。這些個材因而可被傳送到一對接站或其它裝載埠，或直接一負載鎖疋室及/或處理工具中。例如，一基材可從作器225直接被傳送至一工廠界面及/或處理工具搬運機器人（如，經由直接的，，載盤-對-載盤，，的傳送一中間的傳送位置）。複數片個別的基材可類似地從中的傳送帶上被卸下及/或被裝在到該移動中的傳这在本文的上述中明中，本發明的晶圓基材裝載設計來在晶圓載具沿著一晶圓載具傳送系統被高時，與晶圓載具互動的。在例如，在將一被選定的具從該傳送帶上拿下來的處理期間，該晶圓載具搬端施作器被設定移動（或，，被發動的”）用以與被該傳傳送之一被選定的晶圓載具的速率或速度相匹配，與該移動中之傳送帶上被該選定的晶圓載具所佔的匹配。當該端施作器被安全地且垂直地與該傳送系統晶圓載具分開時，這些功能（即，匹配速度及匹配可由該裝載站來實施，即使是該傳送系統在高速下帶上卸，沒有透過使的傳送將一基材傳送別的基進入到該端施的基材或透過一移動 l帶上。站是被速傳送晶圓載運器的送系統及用以位置相及與該立置）仍傳送。 42 200521059 然作的該時具傳圓與之開時具被後作鄰在在器它後而’至些功能與該裝載站的一第三功能，即改變該端施器相對於該傳送系統的高度用以與該被選定的晶圓載具高度相匹配（高度匹配），同時結合是較佳的，這可開始裝載站與該傳送系統之間的一暫時的交會。就是這個暫的交會讓意外的相撞（該端施作器與該被選定的晶圓載之間預計中的接觸的一個意外）的危險性升高。A similarly small (or approximately zero) acceleration can also be used. In one embodiment, the substrate carrier is contacted in a vertical direction with a force of less than 0.5G, and in another embodiment, the substrate carrier is contacted with a force of less than 0.5G. Other contact forces can also be used. Although the present invention is mainly explained by taking an unloaded / loaded substrate carrier of a single wafer to a moving conveyor belt as an example, it should be understood that a plurality of substrate carriers with a plurality of substrates can also be loaded from A moving conveyor is unloaded or can also be loaded onto a moving substrate. The present invention can be applied to a system capable of transferring a single substrate carrier and a plurality of substrate carriers. Similarly, 41 200521059, the present invention can be used to transfer individual substrates from-and-moving and / or loading individual substrates on a moving conveyor belt (such as being contained in a closed substrate carrier). For example, the substrate can be an open substrate carrier, a substrate support, a substrate tray or other belt, or another substrate transfer device that allows the end applicator 225 to be placed directly on the belt. The substrate transfer device is used to transfer. This base device is moved using similar end applicator motion planning. These materials can therefore be transferred to a docking station or other loading port, or directly to a load lock chamber and / Or a processing tool. For example, a substrate may be transferred directly from a handler 225 to a factory interface and / or a processing tool handling robot (eg, via direct, carrier-to-carrier, transfer, intermediate) Transfer position). A plurality of individual substrates can be similarly unloaded from the conveyor belt and / or loaded into the moving conveyor. In the above description of this document, the wafer substrate loading of the present invention is Designed to run on a wafer along a wafer When the carrier transfer system is raised, it interacts with the wafer carrier. During, for example, a process of removing a selected tool from the conveyor, the wafer carrier end effector is set to move (or, "," "Is used to match the speed or speed of one selected wafer carrier by one of the transfers, and the one occupied by the selected wafer carrier on the moving conveyor. When the end When the applicator is safely and vertically separated from the wafer carrier of the transfer system, these functions (that is, matching speed and matching can be performed by the loading station, even if the transfer system is unloaded at a high speed under the belt, without using The transfer of a substrate into another substrate into the end of the substrate or through a mobile l belt. The station is the conveyor system of the fast-carrying wafer carrier and is used to position and with the stand) Teleportation. 42 200521059 The time when the circle is made and the time when it is opened is adjacent to the back of the device and some functions and a third function of the loading station, that is, changing the end applicator relative to the pass The height of the delivery system is used to match the height of the selected wafer carrier (height matching), and at the same time the combination is better, which can start a temporary rendezvous between the loading station and the transfer system. This is the temporary Rendezvous increases the risk of an accidental collision (an accident of the expected contact between the end effector and the selected wafer carrier).

當裝載站與傳送系統暫時地交會時，裝載站的構件，送系統的構件，被選定的晶圓載具，及複數個附近的晶載具都是以相當高的速度運動，增加了導引於這些構件晶圓載具之間的碰撞而造成損傷的可能性。When the loading station and the transfer system temporarily meet, the components of the loading station, the components of the delivery system, the selected wafer carrier, and the plurality of nearby crystal carriers all move at a relatively high speed, which increases the guidance for The possibility of damage caused by collisions between these component wafer carriers.

在晶圓載具的卸除處理中，在該裝載站與該傳送系統間之暫時的交會在該端施作器的一部分（如，運動學的銷）始佔據與部分晶圓載具被該傳送系統所傳送之同一高度即會開始，即使是在該端施作器接數該被選定的晶圓載接觸之前亦然。該暫時的交會在該端施作器接觸並將該選定的晶圓載具從該傳送帶的晶圓載具支撐件上舉起之的一端時間内仍會持續。例如，在該時段期間内，端施器的一部分或全部會持續佔據與被該傳送系統所傳送之近的晶圓載具及其它附近的晶圓載具（如，沒有被選定要晶圓載具卸除處理中被卸除的晶圓載具）同一高度。只有端施作器被垂直地移動至一足夠大的程度使得該端施作及被選定的晶圓載具能夠在該移動中的傳送帶及/或其被該傳送系統所傳送的晶圓載具的高度範圍内被縮回之，在該傳送系統與該裝载站之間的暫時交會才會終止， 43 200521059 且相應之意外相撞的危險才會被消除。雖然該裝載站將一被選定的晶圓載具放在該傳送系統上的處理不同於晶圓載具的卸除處理，但晶圓載具的放置處理亦需要在該傳送系統與該裝載站之間有一類似的暫時交會時期。例如，該晶圓載具放置處理的的暫時交會時期可以該被選定的晶圓載具”突破’’已被放在該轉動中的傳送帶上的晶圓載具的流動平面（或進入該高度）來作為開始，並持續到整個端施作器 (現在空著的）倒退通過該平面為止。在介於該裝載站與該傳送系統之間的暫時交換期間，小心地控制介於該裝載站的端施作器與該傳送系統的轉動中的傳送帶之間的相對運動對於要平順地實施晶圓載具卸除及放置處理而言是必要的。對於在期間之介於該端施作器與運動中的傳送帶之間的相對運動的一個控制失當即會造成至少三種會導致意外相撞之不同的故障模式例如，i) 端施作器會持續以其原本的速度運動，而該傳送帶之用於轉動的推動力量被突然地降低或被消除掉，減慢下來及/ 或停止下來；2)該傳送帶持續以全有的速度轉動，而該端施作器其用於直線運動的推動力量（如由該晶圓載具搬運器所的水平導引件所提供的力量）被突然地降低或被消除掉，減慢下來及/或停止下來；及3)傳送帶及端施作器兩者皆喪失它們各自推動力量的一部分或全部並以不同的速率減慢。會造成意外相撞發生之其它可能的故障模式，像是喪失該端施作器之垂直運動的力量（如由該晶圓載具搬運器所的垂直導引件所提供的力量），亦會發生。 44 系統的不同構件，如感測器，都被設計成相互合作，用以施作器與該傳送系統運動中小心的控制。然而，在介於時交會期間的意外事件會對的空制，導致對基材或對設為在該製造工廠内的停電，間造成傳送系統功能或該裝上的中止。特別考量的功能動功能，該晶圓載具搬運器，及該晶圓載具搬運器的垂統或裝載站本身，或整個製停機會被自動地或手動地啟 ’一關鍵系統或機器的故障）靠近該製造系統的人員造成鄰近的系統與機構）。上所述的交會狀況在一突發時間發生的事件，如停電或掉的方法及設備。此外，用該裝載站之間的速度匹配，條理的中斷的方法及設備亦 200521059 在正常的操作期間，整個高精度作動器及處理控制器，提供對於在介於該裝裁站的端的傳送帶之間的相對運動的— 該傳送系統與該裝載站的該ι 此合作造成損傷或破壞此小心備的傷害。此一突發事件的一個例子這會在晶圓載具放置或卸除#月載站的晶圓載具搬運器的功能包括該傳送系統之傳送帶的# 的水平導引件的速度匹配功& 直導引件的高度匹配功能。另一意外事件為該傳送系造工廠的緊急停機事件。緊夸、動，以回應許多不同的肇因（如及許多不同的理由（如，防止對傷害，或防止傷及WIP晶圓或因此，本發明包含可讓以事件發生時’特別是在意外的緊急停機事件發生時，被去除來確保上述介於該傳送系統與位置匹配’及高度匹配有一有被提供。During the wafer carrier unloading process, a temporary rendezvous between the loading station and the transfer system begins to occupy a portion of the end effector (eg, a kinematic pin) and a portion of the wafer carrier is occupied by the transfer system. The same level of transfer will begin, even before the end applicator contacts the selected wafer carrier. The temporary rendezvous will continue for the duration of one end during which the end applicator contacts and lifts the selected wafer carrier from the wafer carrier support of the conveyor. For example, during this period, some or all of the applicator will continue to occupy the wafer carrier and other nearby wafer carriers (e.g., not selected for wafer carrier removal) near to the wafer carrier being transported by the transport system. Wafer carrier being removed during processing) at the same height. Only the end applicator is moved vertically to a height sufficient to enable the end applicator and the selected wafer carrier to be on the moving conveyor belt and / or the height of the wafer carrier conveyed by the conveyor system. The scope will be retracted, the temporary meeting between the transfer system and the loading station will be terminated, and the corresponding accidental collision risk will be eliminated. Although the loading station places a selected wafer carrier on the transfer system differently from the wafer carrier unloading process, the wafer carrier placement process also needs to be placed between the transfer system and the loading station. A similar temporary rendezvous period. For example, the temporary rendezvous period of the wafer carrier placement process may be taken as the “breakthrough” of the selected wafer carrier by the flow plane (or entering the height) of the wafer carrier that has been placed on the rotating conveyor belt. Start and continue until the entire end effector (now empty) retreats through the plane. During the temporary exchange between the loading station and the transfer system, carefully control the end application between the loading station The relative movement between the actuator and the conveyor belt in the rotation of the conveyor system is necessary to smoothly perform wafer carrier removal and placement processing. For the period between the end effector and the movement An improper control of the relative movement between the conveyor belts will result in at least three different failure modes that can cause accidental collisions. For example, i) the end effector will continue to move at its original speed, while the conveyor belt is used for rotation. The driving force is suddenly reduced or eliminated, slowed down and / or stopped; 2) the conveyor continues to rotate at all speeds, and the end effector is used to direct The driving force of the movement (such as the force provided by the horizontal guide of the wafer carrier carrier) is suddenly reduced or eliminated, slowed down and / or stopped; and 3) the conveyor and end effect Both devices lose some or all of their respective driving forces and slow down at different rates. Other possible failure modes that can cause accidental collisions, such as loss of the force of the vertical movement of the end effector (such as by The force provided by the vertical guides of the wafer carrier carrier) will also occur. 44 Different components of the system, such as sensors, are designed to cooperate with each other to move the applicator and the transfer system Careful control. However, accidental events during the time of the meeting will result in a blackout of the substrate or the power supply in the manufacturing plant, which will cause the transfer system to function or the installation to be suspended. Special consideration of functions, the wafer carrier, and the vertical or loading station of the wafer carrier, or the entire system shutdown will be automatically or manually started Or the failure of the machine) Persons who are close to the manufacturing system cause nearby systems and institutions). The rendezvous situation described above occurs at an unexpected time, such as a power outage or a method and equipment. In addition, using the loading station Speed matching, method and equipment for discontinuous interruption 200521059 During normal operation, the entire high-precision actuator and processing controller provide relative movement between the conveyor belts at the end of the loading station — the This cooperation between the transport system and the loading station caused damage or damage to this careful injury. An example of this emergency would be the placement or unloading of a wafer carrier handler in the # 月载站Including the speed matching function of the horizontal guide of the conveyor # of the conveyor system and the height matching function of the straight guide. Another accident was an emergency shutdown of the conveyor system manufacturing plant. Exaggerate and act in response to many different causes (such as and for many different reasons (such as preventing damage to WIP wafers or preventing injury to WIP wafers) or, therefore, the present invention encompasses allowing events to occur 'especially in accidents When an emergency stop event occurs, it is removed to ensure that the above-mentioned between the transfer system and position matching 'and height matching are provided.

45 200521059 設備明。側視傳送對一載負分。1 該偏裝載中，的一該晶運器 809最好性件被可作往到該圖所被不用來將裝载站的端施作器從該傳送系統縮的舉例性實施例將參照第9A-9B圖於下回的方法及文中加以說 •9B圖為依據本發明的—晶圓載具裝載站801的圖，其顯示與-晶圓載具傳送系統805的_可轉動的帶803相鄰。如圖所示，該晶圓載具裝載站8〇ι正在被選定之沿著該傳送的晶圓載具807實施晶圓載具裝載站帶803被一晶圓載具支撐件8〇8 一依據本發明的卸載處理的一部 8〇1新穎地包含了一偏動裝置809。動裝置809被設計來儲存足夠的能量用以在一卸載或作業期間的一喪失電力事件（如停電或緊急停機事件）產生足夠的推動力量用以迫使該晶圓載具裝載站8〇ι 端施作器811離開該傳送帶8〇3。參照第9a 9b圖，圓載具裝載站801更包含一骨架813及一晶圓載具搬 815其被該骨架813所支撐並耦合至該骨架813。第9A-9B圖中所示之晶圓載具裝載站8〇1的偏動裝置的舉例性實施例包含一推進機構825。該推進機構825 包含一殼體827，一彈性件829，及一柱塞831。該彈 82 9最好是被壓擠地裝在該殼體827内，及該柱塞831 操作地耦合到該彈性件829上用以相對於該殼體827 復運動。該柱塞831包含一遠端833其被設計成耦合45 200521059 Equipment. Side-view teleportation. 1 In the partial loading, an example of the crystal transporter 809 can be used to the figure. The exemplary embodiment that is not used to retract the end effector of the loading station from the conveying system will be referred to the first Figures 9A-9B are described in the next method and text. Figure 9B is a diagram of a wafer carrier loading station 801 according to the present invention, which is shown adjacent to the _rotatable belt 803 of the wafer carrier transfer system 805. . As shown, the wafer carrier loading station 80m is being selected to implement the wafer carrier loading station belt 803 along the wafer carrier 807 being transported by a wafer carrier support 808. An unloading section 801 novelly includes a biasing device 809. The moving device 809 is designed to store sufficient energy for a power loss event (such as a power outage or emergency shutdown event) during an unloading or operation to generate sufficient driving force to force the wafer carrier loading station to be loaded at the end. The actuator 811 leaves the conveyor 803. Referring to FIGS. 9a and 9b, the round carrier loading station 801 further includes a skeleton 813 and a wafer carrier 815 supported by the skeleton 813 and coupled to the skeleton 813. An exemplary embodiment of the biasing device of wafer carrier loading station 801 shown in Figures 9A-9B includes a propulsion mechanism 825. The propulsion mechanism 825 includes a housing 827, an elastic member 829, and a plunger 831. The bullet 82 9 is preferably squeezed in the housing 827, and the plunger 831 is operatively coupled to the elastic member 829 for repeated movement relative to the housing 827. The plunger 831 includes a distal end 833 which is designed to be coupled

晶圓載具搬運器815的水平導引件817上，如第9A-9B 示。在第9A-9B圖所示的較佳實施例中，偏動裝置8〇9 動地搞合至該晶圓载具搬運器815的垂直導引件821The horizontal guide 817 of the wafer carrier carrier 815 is shown in FIGS. 9A-9B. In the preferred embodiment shown in FIGS. 9A-9B, the biasing device 809 is dynamically coupled to the vertical guide 821 of the wafer carrier 815.

46 200521059 。其它實施例（未示出耦合模式，如在一特動地耦合到該晶圓載 8〇9引出被保留的能圓载具搬運器815的產生的推動力量最好垂直導引件821上的作。在此時，該偏動引件8 1 7並迫使該水 8 1 1移離開一第一高 801與該晶圓載具傳圖）。最好是，該偏動46 200521059. Other embodiments (coupling mode is not shown, such as a special coupling to the wafer carrier 809 to extract the retained driving force generated by the circular carrier carrier 815 is best done on the vertical guide 821 At this time, the biased lead 8 1 7 and forces the water 8 1 1 to move away from a first height 801 and the wafer carrier to transfer images). Preferably, the bias

上以獲得一精簡的形狀及良好的對準包括用於該偏動機裝置809之不同的定的實施例中，該偏動裝置809被不具裝載站801的骨架813上。晶圓載具裝载站801的偏動裝置量用以產生並施加一推動力量至該晶水平導引件8 1 7上。該偏動件8 0 9所是在供應到該晶圓載具搬運器8丨5的電力被顯著地減少或整個被切斷時操裝置809施加一推動力量至該水平導平導引件8 1 7向下用以將該端施作器度83 5，其對應於該晶圓載具裝載站送系統8 0 5之間的交會的狀況（第9 a 裝置809將該端施作器811從該第一高度835迫擠到一第二尚度837(第9B圖），上述的交會狀況在此高度時不再存In order to obtain a streamlined shape and good alignment, including different embodiments for the biasing device 809, the biasing device 809 is mounted on the frame 813 without the loading station 801. The amount of the biasing device of the wafer carrier loading station 801 is used to generate and apply a driving force to the crystal horizontal guide 8 1 7. The biasing member 809 is a device in which the operating device 809 applies a pushing force to the horizontal guide guide 8 1 when the power supplied to the wafer carrier 8-8 is significantly reduced or cut off entirely. 7 downwards is used to apply the end applicator to 83 5 which corresponds to the state of intersection between the wafer carrier loading station delivery system 8 0 5 (the 9 a device 809 places the end applicator 811 from the The first height 835 was squeezed to a second still degree 837 (Figure 9B). The above-mentioned intersection condition no longer exists at this height.

在’如在該晶圓載具8 0 7與一將被該晶圓載具傳送系統8 〇 5 傳送之晶圓載具8 4 1之間存在有一正的垂直間隙所顯示的0 在一較佳的實施例中’由該偏動裝置809所產生的推動力量大到足以讓其在與重力相結合時其總合的力量在沒有該垂直導引件821所產生的向上力量之下能夠迫使該晶圓載具搬運器815的水平導引件817沿著垂直導引件821 向下移動。而且，在一較佳的實施例中，由該偏動裝置809 所產生的推動力量並沒有大到足以在其預期的使用壽命期 47 200521059 Π高度的精確性及可控制性來重復地且可靠地防止該曰日圓載具搬運器815的垂直導引杜，一 Λ 導引件82丨將水平導引件817 升雨起來’如從楚-古疮第一同度837升到第—高度83 5。在由第 W的推進機構825所代表的該偏動裝置8〇9的該舉例性的實施例的内容中’熟習此技藝者將可瞭解到，該推進機構825的彈#杜+ & 殫座件829依據本發明可以是許多不同的形式’像是一線圈彈簧或一氣壓缸。There is a positive vertical gap of '0 as shown between a positive vertical gap between the wafer carrier 8 0 7 and a wafer carrier 8 4 1 to be transferred by the wafer carrier transfer system 8 05 in a preferred implementation In the example, 'the driving force generated by the biasing device 809 is large enough that the combined force when combined with gravity can force the wafer to be loaded without the upward force generated by the vertical guide 821'. The horizontal guide 817 of the tool carrier 815 moves downward along the vertical guide 821. Moreover, in a preferred embodiment, the driving force generated by the biasing device 809 is not large enough to be repeatedly and reliable over its expected useful life 47 200521059 Π with a high degree of accuracy and controllability In order to prevent the vertical guidance of the Japanese yen carrier 815, a Λ guide 82 丨 Raises the horizontal guide 817 to rain, such as rising from the first degree 837 to the first 83 5. In the content of this exemplary embodiment of the biasing device 809 represented by the W-th propulsion mechanism 825, a person skilled in the art will understand that the bomb # Du + & 该 of the propulsion mechanism 825 The seat member 829 may take many different forms according to the present invention, 'like a coil spring or a pneumatic cylinder.

第1 〇圖為一後視圖，其顧$9A-9B屯中之某具載站8(Π的晶圓載具搬運器815。如第1G圖^示的，，— 偏動裝置809被耗合至該晶圓載具搬運器815的兩個垂直導引件821中的每一個。此一結構將推動力量的產生大致大致平均地分在兩個被分隔很開的偏動裝置上，讓一該推動力量可被很平衡地施加到晶圓載具搬運器815的水平導引件8 1 7上。第11圖為一後視圖，其顯示第9A_9B圖及第1〇圖的晶圓載具搬運器8 1 5被可操作地耦合至一批經制器843，該Fig. 10 is a rear view of a wafer carrier carrier 815 of a certain carrier station 8 (Π9A-9B). As shown in Fig. 1G,-the biasing device 809 is consumed To each of the two vertical guides 821 of the wafer carrier carrier 815. This structure divides the generation of the driving force approximately equally on the two spaced apart biasing devices, allowing one to one The driving force can be applied to the horizontal guide 8 1 7 of the wafer carrier carrier 815 in a well-balanced manner. FIG. 11 is a rear view showing the wafer carrier carrier 8 in FIGS. 9A-9B and FIG. 10. 15 is operatively coupled to a batch of warp controllers 843, which

控制器843被進一步耦合到一不斷電系統845且被設計來透過該不斷電系統845所提供的電力來操作該晶圓^具搬運器815,用以造成該晶圓載具搬運器815的端施作器8ΐι 從該晶圓載具裝載站801(第9A-9B圖）的傳送帶8〇3(第 9A-9B圖）上縮回’如在一停電或緊急停機事件中縮回 (如，該不斷電系統可提供電力給控制器843及晶圓載具搬運器815)。如第11圖中所示的，第9 A-9B圖及第1〇圖中的偏動裝置809並沒有出現在該晶圓裁具搬運器815的垂 48 200521059 直導引件821上。該不斷電系統845被設計成可命令控制器8 43來造成該晶圓載具搬運器815將該端施作器811從與該晶圓载具傳送系統805(笫9A-9B圖）的交會上縮回，並在沒有正常電力時，提供緊急電力給控制器843及晶圓載具搬運器815。The controller 843 is further coupled to a UPS system 845 and is designed to operate the wafer carrier 815 by the power provided by the UPS system 845 to cause the wafer carrier carrier 815 to The end effector 8ΐι is retracted from the conveyor 803 (pictures 9A-9B) of the wafer carrier loading station 801 (pictures 9A-9B) 'as retracted in the event of a power outage or emergency shutdown (e.g., This uninterruptible power system can provide power to the controller 843 and the wafer carrier handler 815). As shown in Fig. 11, the biasing device 809 in Figs. 9A-9B and Fig. 10 does not appear on the vertical guide 4821 of the wafer cutter carrier 815. The uninterruptible power system 845 is designed to command the controller 8 43 to cause the wafer carrier handler 815 to transfer the end effector 811 from the intersection with the wafer carrier transfer system 805 (笫 9A-9B) It retracts and supplies emergency power to the controller 843 and the wafer carrier carrier 815 when there is no normal power.

在操作時，當在一晶圓載具卸除處理期間該晶圓載具搬運器815與該晶圓載具傳送系統805(第9A-9B圖）暫時交會時，一突發事件，像是一停電或緊急停機事件，發生了。該不斷電系統845提供緊急電力給該控制器843用以防止控制器843在功能上的中斷，並命令控制器843操作該晶圓載具搬運器815，用以造成該晶圓載具搬運器815 消除在該與該晶圓載具傳送系統805(第9A-9B圖）之間於突發事件發生時已存在的暫時交會。控制器8 4 3據以操作該晶圓載具搬運器8 1 5，且該暫時交會被消除掉了，最好是在該突發事件一發生時即被消除掉。In operation, when a wafer carrier handler 815 and the wafer carrier transfer system 805 (Figures 9A-9B) temporarily meet during a wafer carrier removal process, an emergency event, such as a power outage or An emergency shutdown event happened. The uninterruptible power system 845 provides emergency power to the controller 843 to prevent the controller 843 from interrupting its functions and instructs the controller 843 to operate the wafer carrier carrier 815 to cause the wafer carrier carrier 815 Eliminate the temporary rendezvous that already existed at the time of the emergency between this and the wafer carrier transfer system 805 (Figures 9A-9B). The controller 8 4 3 operates the wafer carrier carrier 8 1 5 and the temporary rendezvous is eliminated, preferably as soon as the emergency occurs.

在一較佳的實施例中，控制器843被設計來依據一預定的縮回常式來控制晶圓載具搬運器815。在一此種實施例中’該預定的縮回常式包含住在該控制器843内的電腦程式碼。在另一此種實施例中，該預定的縮回常式包含被儲存在該控制器8 4 3之外的媒體中的電腦程式碼，其雖然沒存在控制器中，但仍可在突發事件發生時被控制器8 4 3 存取。在一實施例中，控制器8 4 3被設計來將由該不斷電系統845所提供的緊急電力分配給晶圓載具搬運器8丨5，用 49 200521059 以讓該晶圓載具搬運器8 1 5可以繼續作用，以消除該交會。在另一實施例中（未示出），該不斷電系統845被設計成直接提供緊急電力給該晶圓载具搬運器815,不需要控制器843來間接地分配電力。在一較佳的實施例中，控= 器843讓水肀導引件8〗7以及垂直導引件821都參與7消除該交會的操作，其中該水平導引件8丨7用來提供與該晶圓載具傳送系統805(第9A-9B圖）相隔開的水平間距是與該晶圓載具傳送系統805的晶圓載具支撐件8〇8(第 9A-9B圖）·之間的間距），及該垂直導引件821則是用來提供必要的垂直間距。在一實施例中，控制器843只會讓垂直導引件821藉由提供垂直間距來參與該交會的消除操作。在另一實施例中，空制器可被設計成當該控制器接收到來自於該不斷電系統的電力時即會促使該基材載具搬運器的端施作器從該傳送帶的傳送路徑縮回。第12圖為用來將該晶圓裝載站8〇1的端施作器8ΐι 移竭11亥傳送帶8 〇 3的縮回機構的一簡化的前視圖。參照第 12 圖， ’一延長部1201被安裝至或形成在至少一垂直導引件 8 2 1 μ 。一凸輪表面1203被形成在該延長部12〇1上。其它的凸輪表面形狀亦可被使用。一開關1 205被安裝在該水平導引件817上，及一滾輪 1 2 0 7 姑說人做祸。至該開關1 207且被設計成可沿著該延長部 1201的凸輪表面1 203滚動，該延長部1201被放置在當該端施作器811進入到一個介於該端施作器811 (及/或被該 50 200521059 端施作器811所支撐的載具8〇7)與該傳送帶8〇3(或被該傳送帶803所支撐的一載具8〇7)之間之所不想要的交會會發生的區域内時，該滾輪12〇7只會接觸到該延長部1201的位置。如第12圖所示，一氣動氣缸12〇9被用來將該端施作器8 11偏動至該水平導引件8丨7的上方。例如，在該晶圓載具裝載站801的正常操作期間，該氣動氣缸12〇9會被完全地伸展（如圖所示）。當水平導引件8 1 7沿著垂直導引件82 1被升高時，滚子1207與延長部1201的凸輪表面12〇3接觸並朝向開關 1205移動’啟動開關1205。開關1205的啟動可形成一電流（未示出），其可讓該端施作器8〗丨朝向水平導引件8 i 7 縮回以回應停電或其它突發事件。例如，該氣動氣缸1209 可被作動而縮回以回應停電或其它突發事件。應注意的是，因為延長部1201及開關1205的關係，端施作器811 的縮回只有在端施作器8 11位在介於該端施作器8丨丨（及/ 或被該端施作器811所支撐的載具8〇7)與該傳送帶8〇3(或被該傳送帶803所支撐的一載具807)之間之所不想要的交會會發生的位置上時才會發生。亦即，端施作器8丨丨將不會縮回（在停電的事件或其它突發事件中）如果該水平導引件817是位在該延長部12〇ι的底下的話。因此，在端施作器811(及/或該載具807)與儲存位置及/或對接站（由標號 1 2 1 1所代表者）之間導因於端施作器8 11的縮回之不注意的碰撞可被避免掉。 51 200521059 雖然本發明已用晶圓為例來加以說明，但應被瞭解的是，本發明亦可用於其它基材，像是矽基材，罩幕，光罩，玻璃板等等’不論是有圖案的或是沒有圖案的；及/或與用來傳送及/或處理這些基材的設備一起使用。又，雖然本發明已經以本發明的特定實施例來揭示，但應被暸解的是，其它的實施例亦會落入到由以下的申請專利範圍所界定之本發明的精神與範圍内。【圖式簡單說明】第1圖為一處理工具及一相關的晶圓載具裝載及儲存設備的傳統結構的頂視圖；第2A圖為依據本發明的一基材裝載站的前視圖；第2B圖為第2A圖所示的基材裝載站的一部分的側視圏，其可用來說明該基材裝載站的第一感測器的實施例； & 第2C圖為第2A圖的端施作器的—部分的立體圖，其顯不第2A圖中之基材裝載站的_舉例性的第二實施例.'、第2D圖為第2C圖的一部分的— ’ 啊一放大立體圖；第2E圖為2A圖的端施作器的一示被設置在偵測一載具卡合件的_ P刀的立體圖，其顯第3圖為-流程圖，其顯示依據：：第二感測器；性處理’用纟將-晶圓栽具從—移日月實施的-舉例第4A-4E圖為示意側視圖，其顯示傳送帶上卸下；的不同階段；不第3圖所示之處理 52 200521059 第5圖為一流程圖，其顯示依據本發明實施的一舉例性處理，用來將一晶圓載具裝載到一移動的傳送帶上；第6A-6E圖為示意側視圖，其顯示第5圖所示之處理的不同階段；第7A及7B圖為與第2圖類似之本發明的晶圓裝載站的簡化前視圖；In a preferred embodiment, the controller 843 is designed to control the wafer carrier handler 815 according to a predetermined retraction routine. In one such embodiment, 'the predetermined retraction routine contains computer code residing in the controller 843. In another such embodiment, the predetermined retraction routine includes computer code stored in a medium other than the controller 8 4 3, which may not be stored in the controller, but may still be in a burst. It is accessed by the controller 8 4 3 when the event occurs. In one embodiment, the controller 8 4 3 is designed to distribute the emergency power provided by the uninterruptible power system 845 to the wafer carrier carrier 8 丨 5, and 49 200521059 to make the wafer carrier carrier 8 1 5 can continue to work to eliminate the rendezvous. In another embodiment (not shown), the uninterruptible power system 845 is designed to provide emergency power directly to the wafer carrier carrier 815 without the need for a controller 843 to indirectly distribute power. In a preferred embodiment, the controller 843 allows the leeches guide 8 and 7 and the vertical guide 821 to participate in the operation of eliminating the rendezvous, wherein the horizontal guide 8 and 7 are used to provide The horizontal distance between the wafer carrier transfer system 805 (Fig. 9A-9B) is the distance from the wafer carrier support 808 (Fig. 9A-9B) · of the wafer carrier transfer system 805) , And the vertical guide 821 is used to provide the necessary vertical spacing. In one embodiment, the controller 843 only allows the vertical guide 821 to participate in the resection operation of the intersection by providing a vertical distance. In another embodiment, the air controller can be designed to cause the end effector of the substrate carrier carrier to be transferred from the conveyor belt when the controller receives power from the uninterruptible power system. The path is retracted. FIG. 12 is a simplified front view of a retracting mechanism used to remove the end applicator 8ΐ of the wafer loading station 801. Referring to FIG. 12, 'an extension 1201 is mounted to or formed on at least one vertical guide 8 2 1 μ. A cam surface 1203 is formed on the extension portion 1201. Other cam surface shapes can be used. A switch 1 205 is mounted on the horizontal guide 817, and a roller 1 2 0 7 tells people to do evil. To the switch 1 207 and designed to roll along the cam surface 1 203 of the extension 1201, the extension 1201 is placed when the end applicator 811 enters an end applicator 811 ( And / or undesired between the carrier 807 supported by the 50 200521059 end applicator 811 and the carrier 803 (or a carrier 807 supported by the conveyor 803) In the area where the rendezvous occurs, the roller 1207 will only touch the position of the extension 1201. As shown in Fig. 12, a pneumatic cylinder 1209 is used to bias the end effector 8 11 above the horizontal guide 8 丨 7. For example, during normal operation of the wafer carrier loading station 801, the pneumatic cylinder 1209 is fully extended (as shown). When the horizontal guide 8 1 7 is raised along the vertical guide 82 1, the roller 1207 comes into contact with the cam surface 1203 of the extension 1201 and moves toward the switch 1205 'to activate the switch 1205. The activation of the switch 1205 can form a current (not shown), which can cause the end effector 8 to retract toward the horizontal guide 8 i 7 in response to a power outage or other emergency event. For example, the pneumatic cylinder 1209 can be actuated and retracted in response to a power outage or other emergency. It should be noted that, due to the relationship between the extension 1201 and the switch 1205, the end effector 811 is retracted only at the end effector 8 and the 11 bit is located between the end effector 8 丨丨 (and / or by the end Occurs only when an unwanted rendezvous occurs between the carrier 807 supported by the caster 811 and the conveyor 803 (or a carrier 807 supported by the conveyor 803). . That is, the end effector 8 will not be retracted (in the event of a power outage or other emergency) if the horizontal guide 817 is located under the extension 120m. Therefore, the retraction of the end effector 8 11 between the end effector 811 (and / or the carrier 807) and the storage location and / or the docking station (represented by reference numeral 1 2 1 1) Inadvertent collisions can be avoided. 51 200521059 Although the present invention has been described using a wafer as an example, it should be understood that the present invention can also be applied to other substrates, such as silicon substrates, masks, photomasks, glass plates, etc. Patterned or unpatterned; and / or used with equipment used to transport and / or process these substrates. In addition, although the present invention has been disclosed with specific embodiments of the present invention, it should be understood that other embodiments will also fall within the spirit and scope of the present invention as defined by the following claims. [Brief description of the drawings] FIG. 1 is a top view of a conventional structure of a processing tool and an associated wafer carrier loading and storage device; FIG. 2A is a front view of a substrate loading station according to the present invention; FIG. 2B The figure is a side view of a part of the substrate loading station shown in FIG. 2A, which can be used to explain an embodiment of the first sensor of the substrate loading station; & FIG. 2C is an end application of FIG. 2A A partial perspective view of the working device, which shows an exemplary second embodiment of the substrate loading station in FIG. 2A. ', FIG. 2D is a part of FIG. 2C-' A magnified perspective view; Figure 2E is a perspective view of the end applicator of Figure 2A, which is set to detect the _ P knife of a carrier engagement part. The display is shown in Figure 3 as a flowchart, which is based on: the second sensing The processing of the wafer is carried out by using a wafer-moving tool from the sun to the moon. Examples 4A-4E are schematic side views showing the unloading from the conveyor; different stages; not shown in Figure 3. Process 52 200521059 FIG. 5 is a flowchart showing an exemplary process implemented in accordance with the present invention for The carrier is loaded on a moving conveyor; Figures 6A-6E are schematic side views showing different stages of processing shown in Figure 5; Figures 7A and 7B are wafers of the present invention similar to Figure 2 Simplified front view of the loading station;

第 7C-7D圖為簡化的示意側視圖，其顯示一與第 4A-4E圖6Α·6Ε圖類.似之移動的傳送帶；第8A-8D圖為本發明的端施作器的舉例性運動情形；第9Α-9Β圖為與一晶圓載具傳送系統的一轉動的傳送帶相鄰之依據本發明的一晶圓載具裝載站的側視圖，其中該晶圓裝載站包含一偏動裝置；第10圖為一後視圖，其顯示第9Α-9Β圖中之晶圓載具裝載站的晶圓載具搬運器，該晶圓載具搬運器包含一耦合至該晶圓載具搬運器的每一垂直導件上之偏動裝置；Figures 7C-7D are simplified schematic side views showing a conveyor belt similar to Figures 4A-4E and Figures 6A and 6E; Figures 8A-8D are exemplary movements of the end effector of the present invention Situations; Figures 9A-9B are side views of a wafer carrier loading station according to the present invention adjacent to a rotating conveyor belt of a wafer carrier transfer system, wherein the wafer loading station includes a biasing device; FIG. 10 is a rear view showing the wafer carrier carrier of the wafer carrier loading station in FIGS. 9A-9B. The wafer carrier carrier includes each vertical guide coupled to the wafer carrier carrier. On the biasing device;

第11圖為一後視圖，其顯示第9Α-9Β圖中之晶圓載具裝載站的晶圓載具搬運器，該晶圓載具搬運器可操作地耦合至一控制器，該控制器進一步耦合至一不斷電系統；及第12圖為另一縮回機構之簡化的前視圖，該縮回機構是用來將一晶圓裝載站的一端施作器從一傳送帶上移走。【主要元件符號說明】 111 裝載及儲存設備 113 處理工具 53 200521059 115 工廠界面（FI) 117 無塵室壁 119 FI 機器人 120 基材載具 121 負載鎖定室 123 傳送室 125 處理室 127 輔助處理室 129 基材搬運機器人 131 基材 133 存放架 135 工廠裝載位置 137 基材載具搬運器 201 基材裝載站 203 對接站 207 基材載具 209 埠 211 對接扣爪 213 基材載具開啟件 215 基材載具搬運器 217 垂直導引件 219 垂直導引件 221 水平導引件 223 支撐件 225 端施作器 227 平台 229 運動學上的特徵結構 23 1 傳送帶 233,235 感測器 233e 1,233a1 ) 第一對感 233b，233b 5 第二對感測；器 237 控制器 240a， 240b 編碼器 2172 i5219a 上】瑞 221a 上游侧 401 載具卡合件 402 凸緣 243 槽 π 241 光束 247 架子 407 特徵結構 409 基材載具 249 傳送帶的一部分 251 槽 a 701 上游極限點 702 下游極限點 703 上限點 704 下限點 54 200521059 801 晶圓載具裝載站 803 傳送帶 805 晶圓載具傳送系統 808 晶圓載具支撐件 807 晶圓載具 809 偏動裝置 811 端施作器 813 骨架 815 晶圓載具搬運器 825 推進機構 829 彈性件 827 殼體 831 柱塞 833 遠端 821 垂直導引件 817 水平導引件 835 第一高度 837 第二高度 841 晶圓載具 843 控制器 845 不斷電系統 1201 延長部 1203 凸輪表面 1205 開關 1207 滾輪 1209 氣動氣缸 1211 對接站/儲存位置 55FIG. 11 is a rear view showing the wafer carrier carrier of the wafer carrier loading station in FIGS. 9A-9B, the wafer carrier carrier being operatively coupled to a controller, the controller being further coupled to A uninterruptible power system; and FIG. 12 is a simplified front view of another retraction mechanism for removing an end effector of a wafer loading station from a conveyor. [Description of main component symbols] 111 Loading and storage equipment 113 Processing tools 53 200521059 115 Factory interface (FI) 117 Clean room wall 119 FI robot 120 Substrate carrier 121 Load lock chamber 123 Transfer chamber 125 Processing chamber 127 Auxiliary processing chamber 129 Substrate handling robot 131 Substrate 133 Storage rack 135 Factory loading position 137 Substrate carrier carrier 201 Substrate loading station 203 Docking station 207 Substrate carrier 209 Port 211 Docking claws 213 Substrate carrier opening 215 Substrate Vehicle carrier 217 Vertical guide 219 Vertical guide 221 Horizontal guide 223 Support 225 End applicator 227 Platform 229 Kinematic features 23 1 Conveyor 233,235 Sensor 233e 1,233a1) First pair 233b, 233b 5 second pair of sensors; controller 237 controller 240a, 240b encoder 2172 i5219a upper] Rui 221a upstream side 401 carrier engagement member 402 flange 243 slot π 241 Beam 247 Shelf 407 Characteristic structure 409 Substrate carrier 249 Part of the conveyor 251 Slot a 701 Upstream limit point 702 Downstream limit point 703 Upper limit point 704 Lower limit point 54 200521059 801 Wafer carrier loading station 803 Conveyor belt 805 Wafer carrier transfer system 808 Crystal Round carrier support 807 Wafer carrier 809 Biasing device 811 End applicator 813 Skeleton 815 Wafer carrier 825 Propulsion mechanism 829 Elastic member 827 Housing 831 Plunger 833 Far end 821 Vertical guide 817 Horizontal guide 835 first height 837 second height 841 wafer carrier 843 controller 845 UPS system 1201 extension 1203 cam surface 1205 switch 1207 roller 1209 pneumatic cylinder 1211 docking station / storage position 55

Claims

200521059 拾、:申讀專利範圍： 1· 一種供應基材至一處理工具的設備，其至少包含：一基材載具搬運器，其被設計來將一基材載具傳送至一第一對接站（docking station)，該基材載具搬運器包括一端施作器其被設計來支撐該基材載具；及一控制器，其耦合至該基材載具搬運器上且可操作用以控制該基材載具搬運器使得該基材載具搬運器的端施作器在該基材載具在移動中時讓該基材載具與一基材傳送帶脫離；其中該控制器可操作用以自動地將該端施作器從該傳送帶縮回以回應一突發事件。 2·如申請專利範圍第1項所述之設備，其中該突發事件為該控制器接收到來自一不斷電系統的電力。 3·如申請專利範圍第1項所述之設備’其中該突發事件為一緊急停機例行程序。 · 4·如申請專利範圍第1項所述之設備，其中該突發事件為喪失電力。 5.如申請專利範圍第1項所述之设備，其更包含一不斷電系統其耦合至該控制器且被設计成可在一喪失電力的事件中供應電力給該控制器。 56 200521059 6. 如申請專利範圍冑5項所述之設備，其中该不斷電系統被進一步耦合至該基材載具搬運器且被設#十成〃" 喪失電力的事件中供應電力給該控制器。 7. 如申請專利範圍第5項所述之設備，其中該控制器進一步被設計成可將該不斷電系統的電力直接導引到該基材載具搬運器。 8. —種用來傳送基材載具來回於一基材載具傳送系統的設備，其至少包含：一基材載具搬運器，其被設計成與一傳送路徑相交會，一基材载具傳送系統會沿著該傳送路徑傳送基材載具，用以從該基材載具傳送系統揀取一基材載具或將基材載具置於該基材載具傳送系統上。 9. 如申請專利範圍第8項所述之設備，其中基材載具搬運器的一部分為一端施作器，其被設計成可楝取或放置一基材載具。 10. 如申請專利範圍第8項所述之設備，其中該基材載具搬運器被設計成可選擇性地與該傳送路徑交會。 57 200521059 1 1 ·如申請專利範圍第9項所述之設備，其中該基材載具搬運器被進一步設計成可沿著該傳送路徑移動該端施作器部分。 12.如申請專利範圍第9項所述之設傷，其中該基材載具搬運器被進一步設計成可沿著該傳送路徑移動該端施作器用以與一沿著該路徑被傳送的基材載具的速度相匹配。 13·如申請專利範圍第9項所述之設備，其中該基材載具搬運器被進一步設計成可沿著該傳送路徑移動該端施作器用以同時與一沿著該路徑被傳送的基材载具的速度及位置相匹配。 14.如申請專利範圍第8項所述之設備，其中該基材載具搬運器被設計成可在與該傳送路徑交會時壓制該偏動機 15·如申請專利範圍第8項所述之設備，其中該偏動機構被設計成只在該基材搬運器正在與該傳送路徑相交會時才會施加力量至該基材載具搬運器。 16·如申請專利範圍第8項所述之設備，其中該偏動機構施加到該基材搬運器上的力量只有在沒有來自於該基材 58 200521059 載具搬運器之相反的推力時，才足以將該端施作器移離開該傳送路禮。 1 7·如申請專利範圍第8項所述之設備，其中該偏動機構包含一彈性件，其被設計成可儲存能量，用以將該端施作器移離開該路徑。 18.如申請專利範圍第8項所述之設備，其中該偏動機構包含一彈簧。 i9·如申請專利範圍第8項所述之設備，其中該偏動機構包含一氣缸。 2 〇 · —種調節交會的方法，該交會係介於一被設計來沿著一路徑傳送基材載具之基材載具傳送系統與一被設計來與該路徑交會用以從該基材載具傳送系統揀取基材載具或將基材載具放置在該基材載具傳送系統上的基材載具搬運器之間的交會，該方法至少包含：提供一基材載具搬運器，其被設計成可選擇性地與一路徑交會，一基材載具傳送系統可沿著該路徑傳送基材載具；提供一偏動機構’其被設計成可施加一力量至該基材載具搬運器用以消除介於該基材載具搬運器與該路徑之間 59 200521059 的交會；施加一第一電源至該基材載具搬運器，其足以讓該基材載具搬運器移動該端施作器抵抗該偏動機構的力量並進入到該路徑中；促使該基材載具搬運器將該端施作器移入到該路徑中，用以產生該基材載具搬運器與該路徑之間的交會；在交會期間，將該第一電源從該基材載具搬運器上奪走；及讓該偏動機構的力量能夠將該端施作器移離開該路徑，用以消除該交會。200521059: Application scope: 1. A device for supplying substrates to a processing tool, which at least comprises: a substrate carrier carrier, which is designed to transfer a substrate carrier to a first docking station A docking station, the substrate carrier carrier including an end applicator designed to support the substrate carrier; and a controller coupled to the substrate carrier carrier and operable to Controlling the substrate carrier carrier so that the end applicator of the substrate carrier carrier releases the substrate carrier from a substrate conveyor while the substrate carrier is in motion; wherein the controller is operable Used to automatically retract the end effector from the conveyor in response to an emergency. 2. The device as described in item 1 of the scope of patent application, wherein the unexpected event is that the controller receives power from a UPS system. 3. The device as described in item 1 of the scope of the patent application, wherein the emergency is a routine emergency shutdown procedure. · 4. The device as described in item 1 of the scope of patent application, wherein the emergency is a loss of power. 5. The device described in item 1 of the scope of patent application, further comprising an uninterruptible power system coupled to the controller and designed to supply power to the controller in the event of a power loss. 56 200521059 6. The device as described in the scope of patent application No. 5 item, wherein the uninterruptible power system is further coupled to the substrate carrier carrier and is set to supply power to the # 十成〃 " power loss event The controller. 7. The device according to item 5 of the scope of patent application, wherein the controller is further designed to direct the power of the uninterruptible power system directly to the substrate carrier. 8. A device for transferring a substrate carrier to and from a substrate carrier transfer system, comprising at least: a substrate carrier carrier, which is designed to intersect with a transport path, and a substrate carrier The tool conveying system conveys the substrate carrier along the conveying path, and is used for picking a substrate carrier from the substrate carrier conveying system or placing the substrate carrier on the substrate carrier conveying system. 9. The device according to item 8 of the patent application scope, wherein a part of the substrate carrier is an end applicator, which is designed to pick up or place a substrate carrier. 10. The device according to item 8 of the scope of patent application, wherein the substrate carrier carrier is designed to selectively intersect the conveying path. 57 200521059 1 1 · The device according to item 9 of the patent application scope, wherein the substrate carrier carrier is further designed to move the end effector portion along the conveying path. 12. The injury according to item 9 of the scope of the patent application, wherein the substrate carrier carrier is further designed to move the end effector along the conveying path for communicating with a substrate conveyed along the path. The speed of the material carrier matches. 13. The device according to item 9 of the scope of patent application, wherein the substrate carrier carrier is further designed to move the end effector along the conveying path for simultaneous and a substrate being conveyed along the path. The speed and position of the material carrier match. 14. The device according to item 8 of the scope of patent application, wherein the substrate carrier carrier is designed to suppress the biasing machine when meeting with the conveying path. 15. The device according to item 8 of scope of patent application The biasing mechanism is designed to apply force to the substrate carrier carrier only when the substrate carrier is intersecting the transport path. 16. The device according to item 8 of the scope of patent application, wherein the force exerted by the biasing mechanism on the substrate carrier is only when there is no opposite thrust from the substrate 58 200521059 carrier carrier It is sufficient to remove the end effector from the teleporter. 17. The device according to item 8 of the scope of patent application, wherein the biasing mechanism includes an elastic member which is designed to store energy for moving the end effector off the path. 18. The device as claimed in claim 8 wherein the biasing mechanism includes a spring. i9. The device according to item 8 of the scope of patent application, wherein the biasing mechanism includes a cylinder. 2 〇—A method of regulating rendezvous, the rendezvous is between a substrate carrier conveying system designed to convey a substrate carrier along a path and a substrate designed to intersect the path to remove the substrate from the substrate The carrier transport system picks up a substrate carrier or places a substrate carrier on a substrate carrier transporter on the substrate carrier transport system, the method at least includes: providing a substrate carrier transport Device, which is designed to selectively intersect a path, and a substrate carrier transfer system can transport the substrate carrier along the path; a biasing mechanism is provided, which is designed to apply a force to the substrate The material carrier carrier is used to eliminate the intersection between the substrate carrier carrier and the path 59 200521059; applying a first power source to the substrate carrier carrier is sufficient for the substrate carrier carrier Move the end applicator to resist the force of the biasing mechanism and enter the path; cause the substrate carrier carrier to move the end applicator into the path to generate the substrate carrier carrier Rendezvous with the path; at the rendezvous During this period, the first power source is taken away from the substrate carrier carrier; and the force of the biasing mechanism can move the end applicator away from the path to eliminate the rendezvous.