Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Union Technology CorpfiledCriticalTaiwan Union Technology Corp
Priority to TW092130564ApriorityCriticalpatent/TW200514822A/en
Publication of TW200514822ApublicationCriticalpatent/TW200514822A/en
A composition of epoxy resin material for copper-clad laminate is provided The composition comprises 100 parts by weight of epoxy, 2.2~3.5 parts by weight of Dicyandiamide curing agent or 20~60 parts by weight of phenol curing agent, 0.01~2.0 parts by weight of catalyst, 15~90 parts by weight of filler and 0.1~5.0 parts by weight of dispersant. The addition of fillers improves the resin flow property of epoxy gel film, and increases the dimensional stability of laminate. The fillers are inorganic compound with a diameter of 1~100 μm, including talc, CaCO3, Al(OH)3, SiO2 and Al2O3.
TW092130564A2003-10-312003-10-31Composition of copper-clad laminate with high dimensional stability
TW200514822A
(en)