TW200512794A - Manufacturing system of semiconductor device and manufacturing method of semiconductor device - Google Patents

Manufacturing system of semiconductor device and manufacturing method of semiconductor device

Info

Publication number
TW200512794A
TW200512794A TW093126536A TW93126536A TW200512794A TW 200512794 A TW200512794 A TW 200512794A TW 093126536 A TW093126536 A TW 093126536A TW 93126536 A TW93126536 A TW 93126536A TW 200512794 A TW200512794 A TW 200512794A
Authority
TW
Taiwan
Prior art keywords
processor
semiconductor device
self
diagnostic system
manufacturing
Prior art date
Application number
TW093126536A
Other languages
Chinese (zh)
Other versions
TWI280603B (en
Inventor
Yukihiro Ushiku
Hidenori Kakinuma
Tatsuo Akiyama
Shunji Shuto
Masahiro Abe
Shigeru Komatsu
Akira Ogawa
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200512794A publication Critical patent/TW200512794A/en
Application granted granted Critical
Publication of TWI280603B publication Critical patent/TWI280603B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The object of the present invention is to properly manage a maintenance interval of a processor and to shorten a manufacturing process period of a semiconductor device. The solution of the present invention comprises a processor 14 for executing process treatment using a semiconductor substrate 17, a self-diagnostic system 11a for receiving device information from the processor 14 and performing self-management of the processor 14, an inspection device 19 for inspecting the result of the process treatment, and a computer 11 that judges whether or not to automatically restore the processor 14 based on the inspection result, and maintains a parameter of the self-diagnostic system 11a when the judgment result is valid and changes a parameter of the self-diagnostic system 11a when the judgment result is invalid.
TW093126536A 2003-09-08 2004-09-02 Manufacturing system of semiconductor device and manufacturing method of semiconductor device TWI280603B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003355684 2003-09-08

Publications (2)

Publication Number Publication Date
TW200512794A true TW200512794A (en) 2005-04-01
TWI280603B TWI280603B (en) 2007-05-01

Family

ID=34674780

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093126536A TWI280603B (en) 2003-09-08 2004-09-02 Manufacturing system of semiconductor device and manufacturing method of semiconductor device

Country Status (3)

Country Link
KR (1) KR100733590B1 (en)
CN (2) CN101937836B (en)
TW (1) TWI280603B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417715B (en) * 2005-08-18 2013-12-01 Brooks Automation Inc System and method for electronic diagnostics of a process vacuum environment
TWI497623B (en) * 2009-07-06 2015-08-21 Camtek Ltd A system and a method for automatic recipe validation and selection
US9418413B1 (en) 2009-07-06 2016-08-16 Camtek Ltd. System and a method for automatic recipe validation and selection
US10001774B2 (en) 2013-03-22 2018-06-19 Kabushiki Kaisha Toshiba Manufacturing supporting system, manufacturing supporting method, and manufacturing supporting program for electronic device
TWI709902B (en) * 2015-10-16 2020-11-11 南韓商三星電子股份有限公司 Semiconductor process simulation method, semiconductor process simulation device and computing device for performing semiconductor process simulation

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5572194B2 (en) * 2012-09-21 2014-08-13 株式会社東芝 Manufacturing management system, manufacturing management method, and manufacturing management program
US20140303912A1 (en) * 2013-04-07 2014-10-09 Kla-Tencor Corporation System and method for the automatic determination of critical parametric electrical test parameters for inline yield monitoring
CN103346105B (en) * 2013-06-27 2015-09-30 上海华力微电子有限公司 A kind of can according to the defect sampling observation method of technique wafer number load dynamic conditioning
CN103336518B (en) * 2013-07-08 2016-03-30 上海华力微电子有限公司 The method of metric data is obtained from external auxiliary analytic system
CN106486391B (en) * 2015-08-31 2020-08-07 北大方正集团有限公司 Semiconductor manufacturing control method and system based on MES system
US10310490B2 (en) * 2016-02-01 2019-06-04 Qoniac Gmbh Method and apparatus of evaluating a semiconductor manufacturing process
CN113642819A (en) * 2020-05-11 2021-11-12 上海华力集成电路制造有限公司 Automatic scheduling device and method for products in abnormal stations in interlinked allowable time zones
JP6983966B1 (en) * 2020-09-16 2021-12-17 株式会社東芝 Thickness measuring device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
US5711843A (en) * 1995-02-21 1998-01-27 Orincon Technologies, Inc. System for indirectly monitoring and controlling a process with particular application to plasma processes
US5910011A (en) * 1997-05-12 1999-06-08 Applied Materials, Inc. Method and apparatus for monitoring processes using multiple parameters of a semiconductor wafer processing system
KR100216066B1 (en) * 1997-05-20 1999-08-16 윤종용 Control system and control method for ic test process
US6763130B1 (en) 1999-07-21 2004-07-13 Applied Materials, Inc. Real time defect source identification
JP4409744B2 (en) 2000-10-20 2010-02-03 ライトロン株式会社 Etching process progress display method and etching process monitoring apparatus
JP4213871B2 (en) 2001-02-01 2009-01-21 株式会社日立製作所 Manufacturing method of semiconductor device
JP3993396B2 (en) * 2001-03-30 2007-10-17 株式会社東芝 Manufacturing method of semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417715B (en) * 2005-08-18 2013-12-01 Brooks Automation Inc System and method for electronic diagnostics of a process vacuum environment
TWI497623B (en) * 2009-07-06 2015-08-21 Camtek Ltd A system and a method for automatic recipe validation and selection
US9418413B1 (en) 2009-07-06 2016-08-16 Camtek Ltd. System and a method for automatic recipe validation and selection
US10001774B2 (en) 2013-03-22 2018-06-19 Kabushiki Kaisha Toshiba Manufacturing supporting system, manufacturing supporting method, and manufacturing supporting program for electronic device
TWI709902B (en) * 2015-10-16 2020-11-11 南韓商三星電子股份有限公司 Semiconductor process simulation method, semiconductor process simulation device and computing device for performing semiconductor process simulation

Also Published As

Publication number Publication date
TWI280603B (en) 2007-05-01
KR100733590B1 (en) 2007-06-28
KR20050025936A (en) 2005-03-14
CN101937836A (en) 2011-01-05
CN1595607A (en) 2005-03-16
CN101937836B (en) 2012-08-08

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees