TW200510580A - Electrolytic processing apparatus and method - Google Patents

Electrolytic processing apparatus and method

Info

Publication number
TW200510580A
TW200510580A TW093111696A TW93111696A TW200510580A TW 200510580 A TW200510580 A TW 200510580A TW 093111696 A TW093111696 A TW 093111696A TW 93111696 A TW93111696 A TW 93111696A TW 200510580 A TW200510580 A TW 200510580A
Authority
TW
Taiwan
Prior art keywords
workpiece
processing
electrodes
processing apparatus
electrode section
Prior art date
Application number
TW093111696A
Other languages
Chinese (zh)
Inventor
Itsuki Kobata
Yasushi Toma
Yuzo Mori
Original Assignee
Ebara Corp
Yuzo Mori
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Yuzo Mori filed Critical Ebara Corp
Publication of TW200510580A publication Critical patent/TW200510580A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

The present invention provides an electrolytic processing apparatus which can suppress the growth of a gas, which is inevitably generated during electrochemical processing, into bubbles thereby effectively preventing the formation of pits in a surface of a workpiece. The electrolytic processing apparatus includes an electrode section (44) including processing electrodes (76) and feeding electrodes (78) both having a diameter of not more than 1 mm, a substrate holder (42) for holding a workpiece (W), a power source (46) for applying a voltage between the processing electrodes and the feeding electrodes, a fluid supply section (72) for supplying a fluid between the electrode section and the workpiece, and a drive section (56, 62) for moving the electrode section and the workpiece relative to each other in such a manner that the processing electrodes pass every point in a processing surface of the workpiece.
TW093111696A 2003-04-28 2004-04-27 Electrolytic processing apparatus and method TW200510580A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003124236A JP2004322292A (en) 2003-04-28 2003-04-28 Electrochemical machining device

Publications (1)

Publication Number Publication Date
TW200510580A true TW200510580A (en) 2005-03-16

Family

ID=33410155

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111696A TW200510580A (en) 2003-04-28 2004-04-27 Electrolytic processing apparatus and method

Country Status (4)

Country Link
US (1) US20060289298A1 (en)
JP (1) JP2004322292A (en)
TW (1) TW200510580A (en)
WO (1) WO2004097078A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006062031B3 (en) * 2006-12-29 2008-06-19 Advanced Micro Devices, Inc., Sunnyvale Electrochemical etching assembly has drive unit in frame above electrochemical vat

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6497800B1 (en) * 2000-03-17 2002-12-24 Nutool Inc. Device providing electrical contact to the surface of a semiconductor workpiece during metal plating
US6482307B2 (en) * 2000-05-12 2002-11-19 Nutool, Inc. Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing
JP4141114B2 (en) * 2000-07-05 2008-08-27 株式会社荏原製作所 Electrolytic processing method and apparatus
TWI277473B (en) * 2002-01-31 2007-04-01 Ebara Corp Electrolytic processing apparatus and method, fixing method, fixing structure for ion exchanging member
JP2004084054A (en) * 2002-07-02 2004-03-18 Ebara Corp Electrolytic processing method and device

Also Published As

Publication number Publication date
WO2004097078A1 (en) 2004-11-11
JP2004322292A (en) 2004-11-18
US20060289298A1 (en) 2006-12-28

Similar Documents

Publication Publication Date Title
TW200509227A (en) Plasma processing system and cleaning method for the same
KR100407888B1 (en) Electrochemical Discahrge Machining Device
AU2003296050A1 (en) Method and apparatus for treating a substrate
DE69608579T2 (en) ELECTROLYTIC METHOD FOR CLEANING ELECTRICALLY CONDUCTING SURFACES
ATE267897T1 (en) METHOD AND DEVICE FOR CLEANING AND/OR COATING METAL SURFACES USING ELECTROPLASMA TECHNOLOGY
EP1162646A3 (en) Plasma treatment apparatus and method
DE602005008385D1 (en) Method and device for generating machining pulses for EDM machining
MY146073A (en) Apparatus and method for plating semiconductor wafers
UA94114C2 (en) Device for removal of coating and method for use thereof
SE0001367D0 (en) Apparatus and method for electrochemical processing of substrates
TW200600618A (en) Electrolytic processing apparatus and electrolytic processing method
WO2016136940A1 (en) Electrochemical machining device and electrochemical machining method
MY120869A (en) Plasma treatment apparatus and method
KR20160009816A (en) Silicon wafer slicing device using wire electric discharge machining
KR101874519B1 (en) Apparatus for electrochemical discharge machining and method therefor
DE60308484D1 (en) PROCESS FOR CLEANING A MATERIAL SURFACE COATED WITH AN ORGANIC SUBSTANCE, GENERATOR AND DEVICE FOR CARRYING OUT THE METHOD
CN1302155C (en) Method and device for electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
TW200510580A (en) Electrolytic processing apparatus and method
EP1179616A3 (en) Method and apparatuses for electrochemically treating an article
EP0956922A3 (en) Process for electric discharge machining and apparatus therefor
TW200605979A (en) Power source device for electric discharge processing machine and method for controlling the power source
TW200512057A (en) Electrolytic processing apparatus and electrolytic processing method
ATE356693T1 (en) GRINDER
EP1197284A3 (en) NON-submersion electrodischarge machining using conditioned water as a medium
TW200728520A (en) Method and device for removing conductive metal oxide thin film