TW200506097A - Copper electrolytic solution containing a dialkyl amino group-containing polymer having a specific skeleton and an organic sulfur compound as additives, and an electrolytic copper foil prepared by the same - Google Patents

Copper electrolytic solution containing a dialkyl amino group-containing polymer having a specific skeleton and an organic sulfur compound as additives, and an electrolytic copper foil prepared by the same

Info

Publication number
TW200506097A
TW200506097A TW093117890A TW93117890A TW200506097A TW 200506097 A TW200506097 A TW 200506097A TW 093117890 A TW093117890 A TW 093117890A TW 93117890 A TW93117890 A TW 93117890A TW 200506097 A TW200506097 A TW 200506097A
Authority
TW
Taiwan
Prior art keywords
copper foil
amino group
dialkyl amino
electrolytic
organic sulfur
Prior art date
Application number
TW093117890A
Other languages
English (en)
Other versions
TWI250226B (en
Inventor
Katsuyuki Tsuchida
Masashi Kumagai
Mikio Hanafusa
Original Assignee
Nikko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikko Materials Co Ltd filed Critical Nikko Materials Co Ltd
Publication of TW200506097A publication Critical patent/TW200506097A/zh
Application granted granted Critical
Publication of TWI250226B publication Critical patent/TWI250226B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Laminated Bodies (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
TW93117890A 2003-07-29 2004-06-21 Copper electrolytic solution containing a dialkyl amino group-containing polymer having a specific skeleton and an organic sulfur compound as additives, and an electrolytic copper foil prepared by the same TWI250226B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003202920 2003-07-29

Publications (2)

Publication Number Publication Date
TW200506097A true TW200506097A (en) 2005-02-16
TWI250226B TWI250226B (en) 2006-03-01

Family

ID=34100616

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93117890A TWI250226B (en) 2003-07-29 2004-06-21 Copper electrolytic solution containing a dialkyl amino group-containing polymer having a specific skeleton and an organic sulfur compound as additives, and an electrolytic copper foil prepared by the same

Country Status (5)

Country Link
JP (1) JP4255130B2 (zh)
KR (1) KR100729061B1 (zh)
CN (1) CN1806067B (zh)
TW (1) TWI250226B (zh)
WO (1) WO2005010239A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101886914B1 (ko) 2010-11-15 2018-08-08 제이엑스금속주식회사 전해 구리박
EP2735627A1 (en) 2012-11-26 2014-05-28 ATOTECH Deutschland GmbH Copper plating bath composition
JP5810197B2 (ja) * 2013-09-11 2015-11-11 古河電気工業株式会社 電解銅箔、フレキシブル配線板及び電池
KR102377286B1 (ko) 2017-03-23 2022-03-21 에스케이넥실리스 주식회사 리튬 이온 2차전지, 이 2차전지의 음극 전극을 구성하는 집전체 및 이 음극 집전체를 구성하는 전해동박

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57114685A (en) * 1981-01-07 1982-07-16 Kuraray Co Ltd Brightener for plating bath
JP3313277B2 (ja) * 1995-09-22 2002-08-12 古河サーキットフォイル株式会社 ファインパターン用電解銅箔とその製造方法
US5863410A (en) * 1997-06-23 1999-01-26 Circuit Foil Usa, Inc. Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby
JP3506411B2 (ja) * 1997-12-29 2004-03-15 日本表面化学株式会社 亜鉛めっき方法
LU90532B1 (en) * 2000-02-24 2001-08-27 Circuit Foil Luxembourg Trading Sarl Comosite copper foil and manufacturing method thereof
KR100389061B1 (ko) * 2002-11-14 2003-06-25 일진소재산업주식회사 전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법
JP4083171B2 (ja) * 2002-12-25 2008-04-30 日鉱金属株式会社 特定骨格を有する四級アミン化合物重合体及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔

Also Published As

Publication number Publication date
KR20060026963A (ko) 2006-03-24
TWI250226B (en) 2006-03-01
CN1806067B (zh) 2010-06-16
JPWO2005010239A1 (ja) 2006-09-07
WO2005010239A1 (ja) 2005-02-03
JP4255130B2 (ja) 2009-04-15
KR100729061B1 (ko) 2007-06-14
CN1806067A (zh) 2006-07-19

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