TW200505997A - Metal foil-clad laminate - Google Patents
Metal foil-clad laminateInfo
- Publication number
- TW200505997A TW200505997A TW093112851A TW93112851A TW200505997A TW 200505997 A TW200505997 A TW 200505997A TW 093112851 A TW093112851 A TW 093112851A TW 93112851 A TW93112851 A TW 93112851A TW 200505997 A TW200505997 A TW 200505997A
- Authority
- TW
- Taiwan
- Prior art keywords
- metal foil
- polyimide
- clad laminate
- layer
- polyimide layer
- Prior art date
Links
- 239000002184 metal Substances 0.000 title abstract 4
- 239000004642 Polyimide Substances 0.000 abstract 5
- 229920001721 polyimide Polymers 0.000 abstract 5
- 239000011888 foil Substances 0.000 abstract 2
- 239000012774 insulation material Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
The present invention provides a metal foil-clad laminate comprises at least one polyimide layer, at least one layer of insulation material, and at least one layer of metal foil, and the said polyimide layer comprises polyimide repeating units represented by the following general formula (I) in which the definitions of R and Φ as described in the specification. , The said polyimide has excellent properties of hot-press bonding strength, solvent solubility, heat resistance and low dielectric constant. The metal foil clad laminate comprising the said polyimide layer is useful for applications of the printing wiring board used in high frequency region.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003131722 | 2003-05-09 | ||
JP2003139990 | 2003-05-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200505997A true TW200505997A (en) | 2005-02-16 |
TWI343400B TWI343400B (en) | 2011-06-11 |
Family
ID=34379688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93112851A TWI343400B (en) | 2003-05-09 | 2004-05-07 | Metal foil-clad laminate |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN100473262C (en) |
TW (1) | TWI343400B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI419912B (en) * | 2006-07-18 | 2013-12-21 | Mitsubishi Gas Chemical Co | Polyimine resin |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4869662B2 (en) * | 2005-08-23 | 2012-02-08 | 日本メクトロン株式会社 | Method for manufacturing hybrid multilayer circuit board |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4094862A (en) * | 1974-03-05 | 1978-06-13 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Process for preparing thermoplastic aromatic polyimides |
US4915983A (en) * | 1985-06-10 | 1990-04-10 | The Foxboro Company | Multilayer circuit board fabrication process |
WO2001057112A1 (en) * | 2000-02-01 | 2001-08-09 | Nippon Steel Chemical Co., Ltd. | Adhesive polyimide resin and adhesive laminate |
-
2004
- 2004-05-07 TW TW93112851A patent/TWI343400B/en not_active IP Right Cessation
- 2004-05-09 CN CNB2004100421384A patent/CN100473262C/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI419912B (en) * | 2006-07-18 | 2013-12-21 | Mitsubishi Gas Chemical Co | Polyimine resin |
Also Published As
Publication number | Publication date |
---|---|
TWI343400B (en) | 2011-06-11 |
CN1551718A (en) | 2004-12-01 |
CN100473262C (en) | 2009-03-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |