TW200505997A - Metal foil-clad laminate - Google Patents

Metal foil-clad laminate

Info

Publication number
TW200505997A
TW200505997A TW093112851A TW93112851A TW200505997A TW 200505997 A TW200505997 A TW 200505997A TW 093112851 A TW093112851 A TW 093112851A TW 93112851 A TW93112851 A TW 93112851A TW 200505997 A TW200505997 A TW 200505997A
Authority
TW
Taiwan
Prior art keywords
metal foil
polyimide
clad laminate
layer
polyimide layer
Prior art date
Application number
TW093112851A
Other languages
Chinese (zh)
Other versions
TWI343400B (en
Inventor
Shuta Kihara
Ko Kedo
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of TW200505997A publication Critical patent/TW200505997A/en
Application granted granted Critical
Publication of TWI343400B publication Critical patent/TWI343400B/en

Links

Landscapes

  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

The present invention provides a metal foil-clad laminate comprises at least one polyimide layer, at least one layer of insulation material, and at least one layer of metal foil, and the said polyimide layer comprises polyimide repeating units represented by the following general formula (I) in which the definitions of R and Φ as described in the specification. , The said polyimide has excellent properties of hot-press bonding strength, solvent solubility, heat resistance and low dielectric constant. The metal foil clad laminate comprising the said polyimide layer is useful for applications of the printing wiring board used in high frequency region.
TW93112851A 2003-05-09 2004-05-07 Metal foil-clad laminate TWI343400B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003131722 2003-05-09
JP2003139990 2003-05-19

Publications (2)

Publication Number Publication Date
TW200505997A true TW200505997A (en) 2005-02-16
TWI343400B TWI343400B (en) 2011-06-11

Family

ID=34379688

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93112851A TWI343400B (en) 2003-05-09 2004-05-07 Metal foil-clad laminate

Country Status (2)

Country Link
CN (1) CN100473262C (en)
TW (1) TWI343400B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419912B (en) * 2006-07-18 2013-12-21 Mitsubishi Gas Chemical Co Polyimine resin

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4869662B2 (en) * 2005-08-23 2012-02-08 日本メクトロン株式会社 Method for manufacturing hybrid multilayer circuit board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4094862A (en) * 1974-03-05 1978-06-13 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Process for preparing thermoplastic aromatic polyimides
US4915983A (en) * 1985-06-10 1990-04-10 The Foxboro Company Multilayer circuit board fabrication process
WO2001057112A1 (en) * 2000-02-01 2001-08-09 Nippon Steel Chemical Co., Ltd. Adhesive polyimide resin and adhesive laminate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419912B (en) * 2006-07-18 2013-12-21 Mitsubishi Gas Chemical Co Polyimine resin

Also Published As

Publication number Publication date
TWI343400B (en) 2011-06-11
CN1551718A (en) 2004-12-01
CN100473262C (en) 2009-03-25

Similar Documents

Publication Publication Date Title
TW200742520A (en) Resin composition, resin film, coverlay film, interlayer adhesive, metal clad laminate, and multilayer printer circuit board
EP1273609A4 (en) Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet and copper foil with resin for forming insulating layer using the resin compound, and copper-clad laminate using them
EP1550678A4 (en) Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same
MY180785A (en) Resin-clad copper foil, copper-clad laminated plate, and printed wiring board
MY139325A (en) Copper foil for printed - wiring board and copper - clad laminate using copper foil for printed-wiring board
WO2009041137A1 (en) Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board
EP1985654A4 (en) Thermocurable resin composition comprising semi-ipn-type complex, and varnish, prepreg and metal-clad laminate sheet using the same
EP1300444A4 (en) Epoxy resin composition and cured object obtained therefrom
WO2003074268A1 (en) Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
TW200631977A (en) Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same
TW200702171A (en) Laminate for printed circuit board and method of manufacturing the same
TW200613357A (en) Thermosetting resin composition and laminate and circuit board including thermosetting resin composition
TW200610647A (en) Printed circuit board material for embedded passive devices
TW200707581A (en) Electronic parts for high frequency
AU2003235203A1 (en) Flame-retarded epoxy resin composition, prepregs containing the same, laminated sheets and printed wiring boards
SG100804A1 (en) Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards
WO2005033161A3 (en) Epoxy resin compositions, processes utilzing same and articles made therefrom
EP1555862A3 (en) Process for producing circuit board having built-in electronic part
TW200745211A (en) Resin composition for forming insulating layer
JP2015106629A (en) Printed wiring board for high-frequency circuit
TW200518928A (en) Laminates having a low dielectric, low dissipation factor bond core and method of making same
TW200516126A (en) Adhesive composition for semiconductor devices, coverlay films, adhesive sheets and copper-clad polyimide films using the composition
TW200505997A (en) Metal foil-clad laminate
TW200509771A (en) Metal-clad laminate
JP2014138020A (en) Printed wiring substrate for high-frequency circuit

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees