TW200504376A - Electronic component testing apparatus (2) - Google Patents

Electronic component testing apparatus (2)

Info

Publication number
TW200504376A
TW200504376A TW093114909A TW93114909A TW200504376A TW 200504376 A TW200504376 A TW 200504376A TW 093114909 A TW093114909 A TW 093114909A TW 93114909 A TW93114909 A TW 93114909A TW 200504376 A TW200504376 A TW 200504376A
Authority
TW
Taiwan
Prior art keywords
chip
moving device
held
output terminal
input
Prior art date
Application number
TW093114909A
Other languages
English (en)
Inventor
Akihiko Ito
Kazuyuki Yamashita
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200504376A publication Critical patent/TW200504376A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C29/56016—Apparatus features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW093114909A 2003-05-30 2004-05-26 Electronic component testing apparatus (2) TW200504376A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/006835 WO2004106954A1 (ja) 2003-05-30 2003-05-30 電子部品試験装置

Publications (1)

Publication Number Publication Date
TW200504376A true TW200504376A (en) 2005-02-01

Family

ID=33485800

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093114909A TW200504376A (en) 2003-05-30 2004-05-26 Electronic component testing apparatus (2)

Country Status (7)

Country Link
US (1) US7511522B2 (zh)
JP (1) JPWO2004106945A1 (zh)
KR (1) KR100815490B1 (zh)
CN (1) CN1788205A (zh)
AU (1) AU2003241977A1 (zh)
TW (1) TW200504376A (zh)
WO (1) WO2004106954A1 (zh)

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US7960992B2 (en) * 2009-02-25 2011-06-14 Kingston Technology Corp. Conveyor-based memory-module tester with elevators distributing moving test motherboards among parallel conveyors for testing
JP2011086880A (ja) * 2009-10-19 2011-04-28 Advantest Corp 電子部品実装装置および電子部品の実装方法
KR20110099556A (ko) * 2010-03-02 2011-09-08 삼성전자주식회사 반도체 패키지 테스트장치
TWI418811B (zh) * 2011-02-14 2013-12-11 Youngtek Electronics Corp 封裝晶片檢測與分類裝置
JP2013024829A (ja) * 2011-07-26 2013-02-04 Seiko Epson Corp 電子部品搬送装置及び電子部品搬送方法
JP2013053991A (ja) 2011-09-06 2013-03-21 Seiko Epson Corp ハンドラー及び部品検査装置
US8807318B2 (en) * 2011-09-20 2014-08-19 International Business Machines Corporation Multi-generational carrier platform
JP2013145134A (ja) * 2012-01-13 2013-07-25 Advantest Corp ハンドラ装置および試験装置
KR101350214B1 (ko) * 2012-07-06 2014-01-16 주식회사 미르기술 비접촉식 발광다이오드 검사장치와 이를 이용한 검사방법
KR101362524B1 (ko) * 2012-07-27 2014-02-17 세메스 주식회사 전자 부품 수납 장치
TWI472778B (zh) * 2013-08-30 2015-02-11 Chroma Ate Inc System - level IC test machine automatic retest method and the test machine
KR101508433B1 (ko) * 2013-09-11 2015-04-07 주식회사 엘지씨엔에스 Ic칩 리더기 및 그것의 동작 방법
EP3115794A1 (en) * 2013-11-11 2017-01-11 Rasco GmbH An assembly and method for handling components
JP2015232446A (ja) * 2014-06-09 2015-12-24 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
SG11201707232TA (en) * 2015-07-31 2017-10-30 Ismeca Semiconductor Holding Sa An assembly and method for handling components
CN106959409A (zh) * 2015-10-30 2017-07-18 精工爱普生株式会社 电子部件搬运装置以及电子部件检查装置
CN107176450A (zh) * 2016-03-09 2017-09-19 精工爱普生株式会社 电子部件运送装置、以及电子部件检查装置
TW201738577A (zh) * 2016-03-29 2017-11-01 三角設計公司 積體電路測試點視像對準系統
CN107632656A (zh) * 2016-07-19 2018-01-26 扬智科技股份有限公司 集成电路结构
CN107931154B (zh) * 2016-10-13 2019-07-26 泰克元有限公司 电子部件测试用分选机及其示教点调整方法
US10473714B2 (en) * 2017-03-06 2019-11-12 Asm Technology Singapore Pte Ltd Method and apparatus for aligning electronic components
US10297043B2 (en) * 2017-04-07 2019-05-21 Advantest Corporation Detector for detecting position of IC device and method for the same
US10324127B2 (en) * 2017-06-08 2019-06-18 Advantest Corporation Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method
US11961220B2 (en) * 2018-01-23 2024-04-16 Texas Instruments Incorporated Handling integrated circuits in automated testing
TWI729822B (zh) * 2020-05-22 2021-06-01 美商第一檢測有限公司 環境控制設備及晶片測試系統
CN113835019B (zh) * 2021-11-25 2022-02-18 河北圣昊光电科技有限公司 一种芯片自动对位装置及对位方法
CN116343213B (zh) * 2023-05-31 2023-08-25 成都数之联科技股份有限公司 模型训练及芯片的字符识别方法、装置、设备和介质

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WO2004106953A1 (ja) * 2003-05-30 2004-12-09 Advantest Corporation 電子部品試験装置
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Also Published As

Publication number Publication date
JPWO2004106945A1 (ja) 2006-07-20
WO2004106945A2 (ja) 2004-12-09
WO2004106954A1 (ja) 2004-12-09
CN1788205A (zh) 2006-06-14
KR20060003110A (ko) 2006-01-09
WO2004106945A3 (ja) 2005-02-17
US20070069752A1 (en) 2007-03-29
KR100815490B1 (ko) 2008-03-24
AU2003241977A1 (en) 2005-01-21
US7511522B2 (en) 2009-03-31

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