TW200500807A - Positive photoresist composition for manufacturing substrate and method for forming resist pattern - Google Patents

Positive photoresist composition for manufacturing substrate and method for forming resist pattern

Info

Publication number
TW200500807A
TW200500807A TW093114985A TW93114985A TW200500807A TW 200500807 A TW200500807 A TW 200500807A TW 093114985 A TW093114985 A TW 093114985A TW 93114985 A TW93114985 A TW 93114985A TW 200500807 A TW200500807 A TW 200500807A
Authority
TW
Taiwan
Prior art keywords
positive photoresist
photoresist composition
resin component
resist pattern
alkali
Prior art date
Application number
TW093114985A
Other languages
Chinese (zh)
Other versions
TWI287173B (en
Inventor
Masaki Kurihara
Shinichi Hidesaka
Satoshi Niikura
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200500807A publication Critical patent/TW200500807A/en
Application granted granted Critical
Publication of TWI287173B publication Critical patent/TWI287173B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

A positive photoresist composition for a system LCD of low cost, which has a high linearity, a high image dissector, a high DOS property, a high inhibition of degassing and a high heating resistance, and more desirably can endure through volume consumption, and a method for forming the resist pattern using the positive photoresist composition are provided. The positive photoresist composition is for a system LCD and contains (A) an alkali soluble resin component or (A') an alkali insoluble resin component or a resin component which is not readily soluble in alkali, wherein the (A') resin component is altered to become alkali soluble due to acid action. The resin components are obtained by purification action of an ion exchange resin before use in the control of the resist composition.
TW093114985A 2003-06-16 2004-05-26 Positive photoresist composition for manufacturing substrate and method for forming resist pattern TWI287173B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003171029A JP2005010215A (en) 2003-06-16 2003-06-16 Positive photoresist composition for manufacture of circuit board having integrated circuit and liquid crystal display section fabricated on one board, and method for forming resist pattern

Publications (2)

Publication Number Publication Date
TW200500807A true TW200500807A (en) 2005-01-01
TWI287173B TWI287173B (en) 2007-09-21

Family

ID=34095657

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093114985A TWI287173B (en) 2003-06-16 2004-05-26 Positive photoresist composition for manufacturing substrate and method for forming resist pattern

Country Status (3)

Country Link
JP (1) JP2005010215A (en)
KR (1) KR100656136B1 (en)
TW (1) TWI287173B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107544209A (en) * 2016-06-27 2018-01-05 奇美实业股份有限公司 Positive photosensitive resin composition and use thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006120896A1 (en) * 2005-05-02 2006-11-16 Tokyo Ohka Kogyo Co., Ltd. Positive resist composition and method for forming resist pattern
JP5772181B2 (en) * 2011-04-20 2015-09-02 Jsr株式会社 Radiation sensitive resin composition, interlayer insulating film for display element and method for forming the same
CN111812236A (en) * 2020-07-06 2020-10-23 广州广电计量检测股份有限公司 Detection method of alpha, alpha' -tri (4-hydroxyphenyl) -1-ethyl-4-isopropylbenzene

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0465415A (en) * 1990-07-04 1992-03-02 Hitachi Chem Co Ltd Production of novolak resin having decreased inpurity metal content
US5378802A (en) * 1991-09-03 1995-01-03 Ocg Microelectronic Materials, Inc. Method for removing impurities from resist components and novolak resins
US6136504A (en) * 1998-03-30 2000-10-24 Fuji Photo Film Co., Ltd. Positive-working photoresist composition
US5955570A (en) * 1998-07-01 1999-09-21 Clariant International Ltd. Trace metal ion reduction by Ion Exchange Pack

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107544209A (en) * 2016-06-27 2018-01-05 奇美实业股份有限公司 Positive photosensitive resin composition and use thereof

Also Published As

Publication number Publication date
TWI287173B (en) 2007-09-21
JP2005010215A (en) 2005-01-13
KR100656136B1 (en) 2006-12-13
KR20040111039A (en) 2004-12-31

Similar Documents

Publication Publication Date Title
EP1249731A3 (en) Photosensitive composition and negative working lithographic printing plate
AU4963799A (en) Method of making optical replicas by stamping in photoresist and replicas formedthereby
EP1158364A3 (en) Photopolymerisable flexography elements with SIS/SBS mixtures as ligands for the preparation of flexographic printing plates
WO2005000912A3 (en) Novel positive photosensitive resin compositions
WO2004081663A3 (en) Novel photosensitive resin compositions
SG158792A1 (en) Chemically-amplified positive resist composition and patterning process thereof
WO2008156115A1 (en) Photosensitive resin composition, flexographic printing plate, and method for producing flexographic printing plate
EP0982628A3 (en) A chemical amplifying type positive resist composition
DE502004007228D1 (en) LASER ENGRAVABLE FLEXODRESTRUCTURE ELEMENT CONTAINS A CONDUCTIVE SOURCE AND METHOD FOR PRODUCING FLEXO PRESSURE FORMS
WO2002041079A3 (en) Positive type photosensitive epoxy resin composition and printed circuit board using the same
ATE449794T1 (en) POLYMER COMPOSITION CONTAINING A POLYMER HAVING POLYMER GRADIENT MORPHOLOGY
CN101590753A (en) There is not the application of pure fountain solution in the printing of glue seal multiple layer metal version
ATE329293T1 (en) PHOTOHARDABLE POLYMER COMPOSITION AND FLEXO PRINTING PLATES CONTAINING SAME
AU1882595A (en) Stable, ionomeric photoresist emulsion and process of preparation and use thereof
TW200500807A (en) Positive photoresist composition for manufacturing substrate and method for forming resist pattern
AU7315000A (en) Photosensitive resin compositions, photosensitive element containing the same, process for producing resist pattern, and process for producing printed circuit board
MY118218A (en) Polymer for photoresist, photoresist composition containing the same, and preparation method thereof
WO2004051372A3 (en) Method of forming resist pattern, positive resist composition, and layered product
TW200604747A (en) Positive resist composition and resist pattern formation method
EP1229390A4 (en) Positive type radiation-sensitive composition and process for producing pattern with the same
CA2389857A1 (en) Process for printing on tissue paper
TWI265376B (en) Positive resist composition
TW200512537A (en) Chemical amplification type positive photoresist composition and resist pattern forming method using the same
WO2000001487A3 (en) Trace metal ion reduction by ion exchange pack
MY122637A (en) Radiation-sensitive resin composition

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees