TW200500807A - Positive photoresist composition for manufacturing substrate and method for forming resist pattern - Google Patents
Positive photoresist composition for manufacturing substrate and method for forming resist patternInfo
- Publication number
- TW200500807A TW200500807A TW093114985A TW93114985A TW200500807A TW 200500807 A TW200500807 A TW 200500807A TW 093114985 A TW093114985 A TW 093114985A TW 93114985 A TW93114985 A TW 93114985A TW 200500807 A TW200500807 A TW 200500807A
- Authority
- TW
- Taiwan
- Prior art keywords
- positive photoresist
- photoresist composition
- resin component
- resist pattern
- alkali
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
A positive photoresist composition for a system LCD of low cost, which has a high linearity, a high image dissector, a high DOS property, a high inhibition of degassing and a high heating resistance, and more desirably can endure through volume consumption, and a method for forming the resist pattern using the positive photoresist composition are provided. The positive photoresist composition is for a system LCD and contains (A) an alkali soluble resin component or (A') an alkali insoluble resin component or a resin component which is not readily soluble in alkali, wherein the (A') resin component is altered to become alkali soluble due to acid action. The resin components are obtained by purification action of an ion exchange resin before use in the control of the resist composition.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003171029A JP2005010215A (en) | 2003-06-16 | 2003-06-16 | Positive photoresist composition for manufacture of circuit board having integrated circuit and liquid crystal display section fabricated on one board, and method for forming resist pattern |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200500807A true TW200500807A (en) | 2005-01-01 |
TWI287173B TWI287173B (en) | 2007-09-21 |
Family
ID=34095657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093114985A TWI287173B (en) | 2003-06-16 | 2004-05-26 | Positive photoresist composition for manufacturing substrate and method for forming resist pattern |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2005010215A (en) |
KR (1) | KR100656136B1 (en) |
TW (1) | TWI287173B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107544209A (en) * | 2016-06-27 | 2018-01-05 | 奇美实业股份有限公司 | Positive photosensitive resin composition and use thereof |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006120896A1 (en) * | 2005-05-02 | 2006-11-16 | Tokyo Ohka Kogyo Co., Ltd. | Positive resist composition and method for forming resist pattern |
JP5772181B2 (en) * | 2011-04-20 | 2015-09-02 | Jsr株式会社 | Radiation sensitive resin composition, interlayer insulating film for display element and method for forming the same |
CN111812236A (en) * | 2020-07-06 | 2020-10-23 | 广州广电计量检测股份有限公司 | Detection method of alpha, alpha' -tri (4-hydroxyphenyl) -1-ethyl-4-isopropylbenzene |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0465415A (en) * | 1990-07-04 | 1992-03-02 | Hitachi Chem Co Ltd | Production of novolak resin having decreased inpurity metal content |
US5378802A (en) * | 1991-09-03 | 1995-01-03 | Ocg Microelectronic Materials, Inc. | Method for removing impurities from resist components and novolak resins |
US6136504A (en) * | 1998-03-30 | 2000-10-24 | Fuji Photo Film Co., Ltd. | Positive-working photoresist composition |
US5955570A (en) * | 1998-07-01 | 1999-09-21 | Clariant International Ltd. | Trace metal ion reduction by Ion Exchange Pack |
-
2003
- 2003-06-16 JP JP2003171029A patent/JP2005010215A/en not_active Withdrawn
-
2004
- 2004-05-26 TW TW093114985A patent/TWI287173B/en not_active IP Right Cessation
- 2004-06-14 KR KR1020040043715A patent/KR100656136B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107544209A (en) * | 2016-06-27 | 2018-01-05 | 奇美实业股份有限公司 | Positive photosensitive resin composition and use thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI287173B (en) | 2007-09-21 |
JP2005010215A (en) | 2005-01-13 |
KR100656136B1 (en) | 2006-12-13 |
KR20040111039A (en) | 2004-12-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |