TW200424816A - Method for automatic configuration of a processing system - Google Patents

Method for automatic configuration of a processing system Download PDF

Info

Publication number
TW200424816A
TW200424816A TW093103894A TW93103894A TW200424816A TW 200424816 A TW200424816 A TW 200424816A TW 093103894 A TW093103894 A TW 093103894A TW 93103894 A TW93103894 A TW 93103894A TW 200424816 A TW200424816 A TW 200424816A
Authority
TW
Taiwan
Prior art keywords
configuration
scope
patent application
semiconductor manufacturing
manufacturing environment
Prior art date
Application number
TW093103894A
Other languages
Chinese (zh)
Other versions
TWI234056B (en
Inventor
Satoshi Harada
Edward C Hume Iii
James E Willis
Kevin A Chamness
Hieu A Lam
Hongyu Yue
David H Fatke
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200424816A publication Critical patent/TW200424816A/en
Application granted granted Critical
Publication of TWI234056B publication Critical patent/TWI234056B/en

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • General Factory Administration (AREA)

Abstract

A method of automatically configuring an Advanced Process Control (APC) system for a semiconductor manufacturing environment in which an autoconfiguration script is generated for executing an auto-configuration program. The auto-configuration script activates default values for input to the autoconfiguration program. The auto-configuration script is executed to generate an enabled parameter file output from the auto-configuration program. The enabled parameter file identifies parameters for statistical process control (SPC) chart generation.

Description

200424816200424816

五、發明說明(1) 【發明所屬之技術領域】 本發明係關於一處理系統之自動配構方法,特別關於 一用於批次間控制之自動配構處理系統的方法。 、 參之相關申請案 本申請案相關於美國臨時申請案第60/414,425號, 於2 002年9月30日所申請之「監控與控制一半導體製造流 程之方法與設備」;美國臨時申請案第號, 於2002年7月3日所申請之「自動安裝感應器之方法與設V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to an automatic configuration method for a processing system, and particularly to a method for an automatic configuration processing system for inter-batch control. Related applications related to this application This application is related to "Procedure and Equipment for Monitoring and Controlling a Semiconductor Manufacturing Process" filed on September 30, 002, U.S. Provisional Application No. 60 / 414,425; U.S. Provisional Application No., "Methods and Equipment for Automatically Installing Sensors," applied on July 3, 2002

備」;美國臨時申請案第60/393,091號,於2002年7月3 日所申請之「動態感應器組態設定與於執行期間執行之方 法」:美國臨時申請案第60 /383,619號,於20 02年5月29 日所申請之「監控器具效能之方法與設備」;美國臨時申 請案第60/374,486號,於2 〇〇2年4月23日所申請之「用於 簡化系統之組態設定的方法與設備」;美國臨時申請案第 60/368,162號,於2 002年3月29日所申請之「與狀態及控 制設備互動之方法」以及美國臨時申請案第6〇/4〇4,412 號’於2002年8月20日所申請之「根據資料内容處理資料"U.S. Provisional Application No. 60 / 393,091," Dynamic Sensor Configuration Settings and Methods for Implementation During Implementation "filed on July 3, 2002: U.S. Provisional Application No. 60/383, No. 619, "Methods and Equipment for Monitoring the Effectiveness of Apparatus", filed on May 29, 2002; U.S. Provisional Application No. 60 / 374,486, filed on "April 23, 2002" Method and Equipment for Simplifying System Configuration "; US Provisional Application No. 60 / 368,162," Method for Interacting with Status and Control Equipment "filed on March 29, 2000, and US Provisional Application Application No. 60 / 4〇4,412 'Application for "Processing Data Based on the Content of the Data" on August 20, 2002

之方法」。所有上述申請案的全部内容均以參照之方式包 含之。 一、【先别技術】 電細廣泛地運用於控制、監控及/或初始化製造流 私,如半導體製造工廠中的作業等。各種輸入/輸出(1Method ". The entire contents of all the above applications are incorporated by reference. I. [Advanced technology] Electrical fines are widely used to control, monitor, and / or initialize manufacturing flows, such as operations in semiconductor manufacturing plants. Various inputs / outputs (1

第8頁 200424816 五、發明說明(2) /〇)衣置則用以控制與監控 、曰 排程。而半導體製造工廠中存1 B曰®的狀態’並維持 材料蝕刻,乃至材料沈積與裝置檢杳的工具以完成如 作業的複雜步驟。大部分2 二 類出自於關鍵性 而完成,1中、、十' i :p刀具t裝的動作係利用顯示螢幕 部八。而〜Γ 丄 ap 1Cal User Interface )的一 刀P著麯導體製程工具是一項非常耗時的程序。 :導體的處理,製程狀態亦隨著時間而改變。於 ΐ::Π灸能夠反映製程性質惡化的製程資料的改變叙 法僅/、耩由參照所顯示之製程資料而偵測出來。偵測ς 之早期異常情形與性質惡化是相當困難的。往往非常需 由先進流程控制(Ape,Advanced Process Contro 1 )所 提供之預測與樣式辨識。 设備的控制工作通常係由某些具有各種控制器之個別 控制系統所執行。某些控制系統可能具有如觸碰式螢幕等 之人機介面’而其他控制系統可能僅蒐集與顯示一製程變 數。監控系統必須要能夠蒐集製程控制系統所需之列表顯 示的資料。監控系統之資料蒐集工作必須處理包含單變量 與多變量資料等之多種資料組合、包含資料分析與資料顯 示等之多種資料處理流程及/或多種資料選擇能力,包含 選擇欲蒐集之製程變數的能力。如果能夠自動顯示與偵測 製程資料,則我們能夠藉由統計流程控制(SPC, Statistical Process Control)圖表設定及控制量產生 產線之理想製程狀況。而設備監控的效能不彰將導致設備Page 8 200424816 V. Description of the invention (2) / 〇) The clothes are used to control and monitor the schedule. In the semiconductor manufacturing plant, the state of 1B is maintained, and the materials are etched, and the tools for material deposition and device inspection are performed to complete complex steps such as operations. Most of the second and second types are completed by the key, and the action of 1 middle, 10 'i: p cutters is equipped with a display screen. And ~ Γ 丄 ap 1Cal User Interface) is a very time-consuming process. : Conductor processing, process status also changes with time. Yu ΐ :: Π moxibustion can reflect the change in process data of the deterioration of the process data. The narrative can only be detected by referring to the process data displayed. It is quite difficult to detect early anomalies and deterioration in nature. Often it is very necessary to predict and style identification provided by Advanced Process Control (Ape, Advanced Process Contro 1). The control of the equipment is usually performed by some individual control systems with various controllers. Some control systems may have a human-machine interface 'such as a touch screen, while others may only collect and display one process variable. The monitoring system must be able to collect the data displayed in the list required by the process control system. The data collection of the monitoring system must handle multiple data combinations including univariate and multivariate data, multiple data processing processes including data analysis and data display, and / or multiple data selection capabilities, including the ability to select process variables to be collected . If the process data can be displayed and detected automatically, then we can generate the ideal process status of the production line by setting and controlling the statistical process control (SPC) chart. Ineffective device monitoring will lead to equipment

第9頁 200424816 五、發明說明(3) 停工進而增加整體的作業費用。 三、【發明内容】 一種用以自動設定一處理系統之組悲的方法,包含產 生一用以執行一自動設定組態程式之自動$又疋组悲腳本 (script)。上述自動設定組態腳本啟動用以輸入至自動 設定組態程式之預設值。而後執行自動設定組態腳本以產 生一輸出自自動設定組態程式之啟用參數檔。上述啟用參 數槽識別用於產生統計流程控制(SPC,Statist ical Process Control)圖表之參數。 茲將參照附隨的圖示,以說明本發明。在圖示中,相 似的參考符號指示類似的元件。 四、【實施方式】 圖1顯示於一半導體製造環境中一先進流程控制 (APC,Advanced Process Control )系統之例示方塊 圖。於例示的系統中,半導體製造環境丨〇 〇包含半導體加 工器具110、複數個製程模組12〇 PM1至PM4、感應器130、 感應器介面1 40與先進流程控制系統丨45。舉例而言,感應 器130可包含一用以監控電漿狀態之光學放射光譜(〇es : Optical Emission Spectroscopy)感應器、一用以監控 射頻訊號之,壓/電流探針(νιρ)及/或用以監控 力、質s流里率(mass flow rate)與溫度等其他 彖 數之類比感應器。先進流裎柝告|糸絲彳^ > 匕延机%控制糸統1 45可包含介面伺服Page 9 200424816 V. Description of the invention (3) The shutdown will increase the overall operating cost. III. [Summary of the Invention] A method for automatically setting a tragedy of a processing system, including generating an automatic script for executing a truncated configuration program. The above-mentioned automatic setting configuration script is started for inputting the default values into the automatic setting configuration program. Then execute the auto-setup configuration script to generate an activation parameter file output from the auto-setup configuration program. The above enabled parameter slot identification is used to generate the parameters of the Statistical Process Control (SPC) chart. Reference will be made to the accompanying drawings to illustrate the invention. In the illustration, similar reference signs indicate similar elements. 4. Embodiment FIG. 1 shows an exemplary block diagram of an advanced process control (APC, Advanced Process Control) system in a semiconductor manufacturing environment. In the illustrated system, the semiconductor manufacturing environment includes a semiconductor processing tool 110, a plurality of process modules 120 PM1 to PM4, a sensor 130, a sensor interface 140, and an advanced process control system 45. For example, the sensor 130 may include an optical emission spectrum (Oes: Optical Emission Spectroscopy) sensor for monitoring the state of the plasma, a voltage / current probe (νιρ) and / or a voltage / current probe for monitoring radio frequency signals. Analog sensors for monitoring other factors such as force, mass flow rate and temperature. Advanced Streaming Announcement | 糸 丝 彳 ^ >% control system 1 45 can include interface servo

第10頁 200424816 五、發明說明(4) 器( IS,Interface Server ) 150、先進流程控制伺服器 160、用戶端工作站170、圖形化使用者介面180與資料庫 190。舉例而言,介面伺服器(IS) 150可包含一有時稱之 為「資料中心」(Hub )之即時記憶體資料庫。 於例示之系統中,單一的器具1 1 0與四個製程模組1 2 〇 一併顯示。先進流程控制系統14 5可與包含群組器具等具 有一或多個製程模組之數個加工器具相接合連繫。舉例而 言,上述器具可用以執行钱刻、沈積、擴散、塗佈、氧 化、清洗、灰化、量測、傳送、載入與退載流程。此外, 先進流程控制系統1 4 5能夠蒐集、處理、儲存、顯示、輸 入與輸出來自於此類加工器具、製程模組與感應器之資 料。 、 再者,加工器具11 〇可包含一器具代理元件(未示於 圖)’其可為於裔具110上執行之軟體程序,並可提供事 件資訊、語境(context )資訊及用以同步化盥器具二程 之資料取得的啟始結束計時指♦。此外,先進流、程’控制 糸統145可包含一代理用戶端(未示於圖),其 體程序,可用以提供至器具代理元件之連線。、馮ΓPage 10 200424816 V. Description of the invention (4) IS (Interface Server) 150, Advanced Process Control Server 160, Client Workstation 170, Graphical User Interface 180 and Database 190. For example, the interface server (IS) 150 may include a real-time memory database sometimes referred to as a "data center" (Hub). In the illustrated system, a single appliance 110 and four process modules 1220 are displayed together. The advanced process control system 145 can be connected to several processing appliances including one or more process modules including group appliances. For example, the above-mentioned appliances can be used to perform the processes of engraving, depositing, spreading, coating, oxidizing, cleaning, ashing, measuring, transferring, loading and unloading. In addition, the advanced process control system 145 can collect, process, store, display, input and output data from such processing appliances, process modules and sensors. Further, the processing appliance 110 may include an appliance agent component (not shown), which may be a software program executed on the appliance 110, and may provide event information, context information, and synchronization information. The start and end timings of the data acquisition of the second journey of the toilet utensils means ♦. In addition, the advanced flow and program control system 145 may include an agent client (not shown), and its body program may be used to provide a connection to the appliance agent component. Feng Γ

於此實施例中,先進流程控制伺服器1 60將先淮治M 控制系統之配構加以自動化,以便食匕銳替 、 /;,L 定組態並啟始統計流程控制圖表的自產於:裝之後汉 間’可要求軟體之安裂程式提供 址、製程模組120之數目與類型) (如IP位 可針對預設之資料冤集自動設定)1之+、\訊/於安裝期間, 勒又疋上述系統之組態。預設之In this embodiment, the advanced process control server 160 automates the configuration of the first Huaizhi M control system, so that it can be used to determine the configuration and start the statistical process control chart. : After installation, Hanjian can request the software's security program to provide the address, the number and type of the process module 120) (such as the IP bit can be automatically set for the default data set) 1 +, \ News / during the installation Le also discussed the configuration of the above system. Preset

第11頁 200424816Page 11 200424816

組態設 以及所 定亦可 於 由統計 資利用 值、標 流程控 程變數 射頻功 可取得 製程之 如 執行自 定可提 有摘要 包含至 安裝後 流程控 的記錄 準差、 制圖表 之量測 率、射 之參數 特殊需 果改變 動組態 供所有 參數的 少一個 ,可自 制批次 參數中 最小值 時加以 與回報 頻反射 及統計 求而# 參數的 言史定。 器具層級之 計算工作。 外部感應器 動設定先進 規則之評估 每一個可取 、最大值等 採用。器具 值,對敍刻 功率、尖峰 數據係基於 啟用參數相 選擇,亦可 紀錄參數的資料 選擇性地,預設 流程控制 進行錯誤 得的摘要 )都可能 層級之紀 系統而言 間電壓、 安裝者或 對應。 於安裝後 系統之 偵測。 統計數 於自動 錄參數 例如氣 壓力、 操作者 蒐集工作 之組態設 組態以藉 每一個可 據(平均 產生統計 可包含製 體流速、 溫度等。 的建議及 的任何時點重新The configuration and setting can also be obtained from the statistical data utilization value, standard process control process variable radio frequency function. The process can be obtained. If you execute the self-definition, you can provide a summary including the recording standard deviation of the process control after installation, and the measurement rate of the chart. The special parameters of the shooting need to change the dynamic configuration for less than one of all parameters. You can add the minimum frequency of the batch parameter and the return frequency reflection and statistics to determine the #history of the parameter. Appliance-level calculations. External sensors automatically set advanced rules for evaluation. The instrument value, the scoring power, the peak data are selected based on the enabled parameters, and the parameter data can also be recorded. (Optionally, the preset process control is incorrectly summarized.) All are possible. Or corresponding. Detection of the system after installation. Statistics are automatically recorded in parameters such as gas pressure, operator's collection work, configuration settings to borrow every available data (average production statistics can include system flow rate, temperature, etc.) and recommendations at any point in time

一經安裝’當於執行斯間遇到新的製程配方時,可自 動產生統計流程控制圖表以追蹤於如蝕刻系統中之射頻步 縣等製,步驟期間所採用之受控制與未受控制之參數。$ 控制之參數包含具有設定點之記錄參數。於器具上之此類 參數被控制在與設定點間具一百分比誤差或絕對誤差之某 些谷忍範圍内。對於給定之製程配方與製程步驟而言,某 些叉控制之參數可具有其值為零的設定點。於此種情形 下’由於將使零成為除數,故無法使用與設定點間具百分 比决差的方法。未受控制之參數包含不具有設定點之記錄 參數。此類參數之值通常係視受控制之參數的設定點而μOnce installed, when a new process recipe is encountered during execution, a statistical process control chart can be automatically generated to track the RF step count and other systems in the etching system, and the controlled and uncontrolled parameters used during the step . $ Controlled parameters include recorded parameters with set points. Such parameters on the appliance are controlled within a certain tolerance range with a percentage error or absolute error from the set point. For a given process recipe and process step, certain fork-controlled parameters may have a set point with a value of zero. In this case, since zero will be a divisor, a method with a percentage difference from the set point cannot be used. Uncontrolled parameters include recorded parameters without set points. The value of such parameters usually depends on the set point of the controlled parameter.

第12頁 200424816 五、發明說明(6) 定。於在每_初6 之數量的晶圓, 【累積到-可進行設定 旗標,則可根據統;該參數已樑示出自動計算之 上層與:控制界限並:示i示ϊί:則之評估自動計算出 訊,者將提供關於器具之硬體組態的資 量的問題,而;;ί;:類例而言,可利用-定數 組後,則自動設定該製程模組之製程模 之貧料嵬集計畫係基於由安裝程汁晝。預設 程需求所提供之資气。*衣転工程師與可能是製 之參數都將於“產生有於資料冤集計晝中指定 產生統計流程控制圖表時之啟用參數4=;:。自動 腳本以及根據實際操作JL已知最佳心::2動組態 提供。上述自動組態腳本 ::^程需求加以 式而提供。“,安最佳的方 預設值,例如為選擇不同丄二疋、·且悲貝料檔覆寫 而啟用參數即為自動產:丄而5供之Excel試算表。 數。 產生、、先计k程控制圖表時所選擇的參 初始值係由自動組態腳本根據 的選擇而没疋’例如自動組態 自動 採用/略過旗標的 設定組態資料檔中所作 Excel試算表等。 。舉例而 安裝者於步 圖2例示描繪此種相互關係之流程圖2 Q Q 含有啟用參數的自動設定組態資料檔可由 200424816 五、發明說明(7) 驟210利用試算表產生,而於步驟22〇則產生一帶有啟用參 數的逗號分隔數值(CSV,Comma Separated Values)檔 23 0。啟用參數的清單23 0依據一自動組態腳本2 5〇之執行 由一自動組態程式240所讀取,其中逗號分隔數值(csv ) 檔230中所提供之資訊將覆寫預設值,並於永久性資料庫 中產生一啟用參數的表單26〇。 此外’自動組態腳本可包含任何下列項目:(1 )依 據需求請求關於器具組態之資訊以支援此項特徵;(2 ) 根據安裝者對於模組類型之選擇設定每一個製程模組設 的貧料蒐集計畫;(3 )以操作者(或安裝者)所提供之 實際操作上已知最佳方式為基礎建立預設的資料荒集計 畫;(4 )針對包含預設步驟修改資訊等提供預設資、斜7 集計,(5 )根據模組類型與實際操作上已知最佳的方 式,藉由如Excel試算表等自動設定組態資料檔 必要的資訊以選擇自動產生統計流程控制圖表時之、糸田,充 數;(6 )提供於安裝後的任何時點以製程使用 胃多 之一組啟用參數取代預設之該組啟用參數的可处所提供 用以取代之該組參數可於一例如Exc e丨試算表此’其中 定組態資料檔中指定。(7 )提供可於永久性動設 付自動產生統计流程控制圖表時啟用參數之、主、」 中取 及/或(8 )提供一系統層級的方法以啟用/月早的功能, 產生統計流程控制圖表」的功能。 τ用「自動 圖3例示一敘述自動產生統計流程控制 的流程圖。於步驟30 5,啟始自動統計流蓉 之方法3〇〇 低炫制的演算Page 12 200424816 V. Description of Invention (6). For the number of wafers in each of the first 6 [accumulated to-can set the flag, you can according to the system; this parameter has been shown to automatically calculate the upper layer and: control limits and: show The evaluation automatically calculates the information, and the person will provide questions about the hardware configuration of the appliance, and; ί ;: For example, after the-set array is available, the process module of the process module is automatically set. The lean material collection plan is based on the installation process. The resources provided by the preset process requirements. * The parameters of the clothing engineer and the system may be set to "Enable parameters when the statistical flow control chart is specified in the data inaccurate calculation day 4 =;:. Automatic script and according to the actual operation JL known best intentions: : 2 dynamic configuration provided. The above automatic configuration script:: ^ process requirements are provided in a formula. ", The best preset value, for example, to select different 丄, 悲, and 悲 料 material file override Enable the parameter is automatic production: 5 5 for the Excel spreadsheet. number. The initial values of the parameters selected when generating and calculating the k-control chart are not selected by the automatic configuration script according to the selection, such as the Excel spreadsheet in the configuration data file for automatic configuration to automatically adopt / skip the flag settings. Wait. . For example, the installer exemplifies a flow chart depicting such a relationship in step 2. QQ The configuration data file with automatic setting parameters that can be enabled can be obtained from 200424816 V. Description of the invention (7) Step 210 is generated using a trial balance, and at step 22 A Comma Separated Values (CSV) file 23 0 with the enable parameter is generated. The list of enabled parameters 23 0 is read by an automatic configuration program 240 according to the execution of an automatic configuration script 2 50. The information provided in the comma-separated value (csv) file 230 will overwrite the default value, and A form 26 of enabling parameters is generated in the permanent database. In addition, the 'automatic configuration script may contain any of the following items: (1) request information about appliance configuration to support this feature according to requirements; (2) set each process module setting according to the installer's choice of module type Poor material collection plan; (3) Establishing a default data collection plan based on the best known practical best practices provided by the operator (or installer); (4) Modifying information for including preset steps Provide preset data, 7 sets of slant, etc., (5) According to the best type of module type and actual operation, the necessary information is automatically set by the configuration data file, such as an Excel spreadsheet, to automatically generate the statistical process. (6) Provide a set of activation parameters to replace the preset set of activation parameters in the manufacturing process at any point in time after installation. The set of parameters provided for replacement can be used at An example is an Excel e spreadsheet, which is specified in the configuration data file. (7) Provide a parameter that can be enabled when a statistical process control chart is automatically generated in a permanent mobile device, and then select and / or (8) Provide a system-level method to enable the / monthly early function to generate statistics Flow Control Chart "function. τ uses "Automatic Fig. 3 to illustrate a flow chart describing the automatic generation of statistical flow control. At step 30, the method of automatic statistical flow measurement is started.

第14頁 200424816 五、發明說明(8) ΐ,ϊΐΓ:3裝1 執行一自動產生模式查詢;舉例而 方法30 0 #牛_ 或操作者回答一或多個問題。如果否, 万汝別0於步驟36〇結東。 步驟31 S你 η , 采如果自動產生模式為需要,則於 ’驟d 1 5作一判斷以識別 之該等參數。 萌刀〗欲自動產生之統計流程控制圖表 於步驟3 2 0,針對每一個夂叙 產生而士 9不#人了母個參數對統計流程控制圖表的 產生而5疋否符合選擇標準進行 符合選擇稃進,日,丨μ t 如果μ疋一參數不 -參;步驟345處理下-個參數。如果認定 該參數Θ 準,則於步驟325執行查詢以判斷針對 ί 3;0 Λ ^ ^ ^ ^ .i ^ 個參數。如果已纟’接著於步驟345處理下- 將參數登入至统ϊΐί統計流程控制圖表’則於步驟335 且八主統叶流程控制圖表。 於步驟340,執行查詢以判斷針對特定的絲斗$忽缺 制圖表是否存在有控制界限。如斷十對 驟345處理下一個灸缸 如果控制界限存在,則於步 〇 c η . >數。如果控制界限不存在’則於步驟 3 5 0執仃查珣以判斷 之資料it枇# V ^ 十〃 制表是否具有足夠數量 =貝十u供计异控制界限之用。如果是, 鼻控制界限。々Π S π ^ ^ ^cJbb θΤ 界限如果否,則於步驟345處理下一個彖势。告 於步驟345檢視了最後一辋夂數, 個參數田 目I丨士士&止傻個參數而未有額外的參數時, 則本方法3 0 0於步驟3 6 〇結束。 舉例而言,對於製程步驟而言具代表性的來#,如蝕 刻流程中之射頻步驟玺% &私4八衣泣的翏數,如蝕 控制圖表。如果圖表兀六产目丨丨a私* 的統计机私 木口表不存在,則自動產生之,惟不具上層Page 14 200424816 V. Description of the invention (8) ΐ, ϊΐΓ: 3 out of 1 to perform an automatic mode query; for example, and method 30 0 # 牛 _ or the operator answers one or more questions. If not, Wan Rubei ends the process at step 36. Step 31: If you need the automatic generation mode, make a judgment at step d 15 to identify the parameters. Meng Dao〗 The statistical process control chart to be automatically generated is shown in step 3 2 0. For each narrative generation, the person 9 does not use the parameters of the parent to control the statistical process control chart generation, and whether the 5 meets the selection criteria. Advance, day, μ t If μ is a parameter that is not-parameter; step 345 processes the next parameter. If the parameter Θ is found to be accurate, a query is performed at step 325 to determine that it is directed to ί 3; 0 Λ ^ ^ ^ ^ .i ^ parameters. If it has been “'followed by processing at step 345-log the parameters into the statistical flow control chart”, then at step 335 and the eight main control flow chart. In step 340, a query is executed to determine whether there is a control limit for a particular wire $$ missing chart. If the ten pairs are broken, the next moxibustion tank is processed in step 345. If the control limit exists, then the number is in step 〇 c η. If the control limit does not exist, then perform a check at step 3 5 0 to determine the information it 枇 # V ^ 〃 是否 whether the tabulation has a sufficient number = 十 十 u for the purpose of calculating different control limits. If yes, nasal control limits. 々Π S π ^ ^ ^ cJbb θΤ If the bound is not, the next pseudopotential is processed in step 345. In step 345, when the last number of parameters is examined, and the parameter field I taxi and no additional parameters, then the method 3 0 0 ends at step 3 6 0. For example, the representative of the process steps are, for example, the RF step in the etching process, and the number of electrodes, such as the etch control chart. If the statistical data of a private table in the chart is not existed, it will be generated automatically, but there is no upper layer.

200424816 五、發明說明(9) --- 與下控制界限。針對每一個模組、製程配方、參數與製程 步驟之結合均會產生新的圖表。因此,如果有1 〇個參數與 50個各具5個製程步驟的製程配方,則此製程將產生 2 ’ 5 0 0個統計流程控制圖表(所產生之統計流程控制圖表 的數目為參數的數目乘以製程配方的數目乘以每一個製程 配方中製程步驟的數目的乘積)。自動產生的統計流程控 制圖表必項要能夠與手動產生的圖表區分開來。尚未設定 曰 '、下控制界限之統計流程控制圖表並不受限於批次規 則之a平估,因此將不會產生任何警示。從而,針對所遭遇 =的2 —個模組、新製程配方、每一個啟用參數與每一個 製程步驟均會產| _你!# 個新的圖表。使用者將可以與存取手 勁屋生的統計流程轉法,丨圓+、 ,i , 的円矣r益山固制圖表相同的方式存取此種方式產生 的圖表(藉由一圖形化使用者介面)。 另一用以自動產生對—愈 量參數之統計流程控制圍本1^步驟而B具代表性之單變 可句人以T夕紅 制圖表的自動設定組態系統之實施例 碰母一個製程步驟定義為「一步 驟於其期間之摘要參數偵r斑/, _ ^ 1: Α μ掘士音、丄值(舉例而言,對一較低電極的 介面(GIH)可資利用以供值由」,(2)具一圖形化使用者 之摘要參數;用以定義製程步驟 使用者選擇臨界值;(4二:使:者介面可資利用以供 ^ ^ ^ ^ s「& )於執行期間,當遭遇到新的製 牲配方日守’如果「自動吝丄 於「μ ^ % θ +產生統計流程控制圖表」的功能處 ^ . ^ ^ ^ 加衣向未存在(手動或自動產生),則 可自動針對母一個對一鼾拓止前 射頻步驟而言具代表性之啟用參數200424816 V. Description of invention (9) --- and lower control limit. For each module, process recipe, parameter and process step combination, a new chart will be generated. Therefore, if there are 10 parameters and 50 process recipes each with 5 process steps, this process will generate 2 '500 statistical process control charts (the number of statistical process control charts generated is the number of parameters Multiply the number of process recipes times the number of process steps in each process recipe. Automatically generated statistical process control charts must be distinguishable from manually generated charts. The statistical process control chart for which the lower and lower control limits have not been set is not limited to the a-level estimation of the batch rule, so no warning will be generated. Therefore, for the 2 = modules encountered, new process recipes, each enabled parameter and each process step will be produced | _ 你! # New charts. Users will be able to access the statistical flow conversion method of the hand-housed statistics, circle +,, i, 益 r Yishan solid-made charts to access the charts generated in this way (through a graphical use User interface). Another statistical flow control method for automatically generating pair-healing parameters controls around 1 ^ steps and B is a representative single-variable sentence. The example of the automatic setting and configuration system of the chart made by T. Red touches a process of the mother. A step is defined as "a summary parameter detection step during which a step is performed, _ ^ 1: Α μ digging tone, threshold value (for example, a lower electrode interface (GIH) can be used for value "", (2) a graphical user summary parameter; used to define the user selection threshold of the process steps; (42: make: the user interface can be used for ^ ^ ^ ^ s "&) in During the implementation, when encountering a new animal formula formula, if the "automatically meets the function of" μ ^% θ + generate statistical process control chart "function ^. ^ ^ ^ The clothing direction does not exist (manually or automatically generated) ), It can automatically target an enabling parameter that is representative of the radio frequency steps before the extension.

第16頁 200424816 五、發明說明(10) 產生圖表;(5)每一個啟用參數可具有一旗標以標明手 動或自動設定界限;(6 )如果選擇「自動界限」,則最 初=^生之統計流程控制圖表不可具有上層或下控制界限 且可停用批次規則之評估;(7 )如果選擇「手動界 限」’則可根據輸入至試算表中之數值設定所產,生之每一 ,圖表上的界限,且可依據批次規則之評估之設定啟用批 $規則之評估。(8 )所自動產生之統計流程控制圖表可 〃有t寺有的名稱;(9 )以此種方式產生之統計流程控制 ® I可利用一般的統計流程控制圖表圖形化使用者介面加 ^ ’ ( 1 0 )除統計流程控制圖表以外,可自動產生分 j 1晝與策略;(1 以此種方式產生之相關的分析計畫 二ί ^可利用—般的分析計晝與策略圖形化使用者介面加 从編輯;Μ 9、么^ 士. 將 I 1 Z )自動產生之統計流程控制圖表可由使用者 八k II ί動產生之圖表相區別;(1 3 )自動產生之相關的 旦與策略可由使用者將之與手動產生之分析計晝與 針f + ^ ί別,及/或(14)以此種方式產生之警示可根據 千箱十頻步驟參數」統計流程控制圖表之預設的通知與 卞預設定依次產生通知與干預。 而左思者,自動產生之統計流程控制圖表以與手動產 奸^統計流程控制圖表相同的方式出現於分析策略中。一 =f生,即產生圖表群組而不問「自動產生統計流程控制 二2」、,旗標之狀態為何。因此,一經產生,如果不再需要 二二群組,則可手動自分析策略將每一個統計流程控制圖 录的關連性移除,而一圖形化使用者介面可作為自分析策Page 16 200424816 V. Description of the invention (10) Generate graphs; (5) Each enabling parameter can have a flag to indicate manual or automatic setting of the limit; (6) If "automatic limit" is selected, then = The statistical process control chart can not have upper or lower control limits and the evaluation of the batch rule can be disabled; (7) If you select "Manual limits", you can set the produced, according to the value entered in the trial balance, The limit on the chart, and the evaluation of the batch $ rule can be enabled according to the setting of the evaluation of the batch rule. (8) The statistical process control chart automatically generated may have the name of T Temple; (9) The statistical process control generated in this way ® I can use the general statistical process control chart graphical user interface plus ^ ' (1 0) In addition to the statistical process control chart, it can automatically generate j1 day and strategy; (1 related analysis plan 2 generated in this way. ^ Available—Analytical analysis of day and strategy graphical use The user interface is added from the editor; M 9, Mo ^ Shi. The statistical flow control chart automatically generated by I 1 Z) can be distinguished from the chart generated by the user's eight k II; (1 3) The automatically generated related data and The strategy can be distinguished by the user from the manually generated analysis meter day and needle f + ^ ί, and / or (14) the alert generated in this way can be based on the preset parameters of the statistical process control chart of the thousand-box ten steps Notifications and pre-settings in turn generate notifications and interventions. For left thinkers, the automatically generated statistical process control chart appears in the analysis strategy in the same way as the manual production process. One = f, that is, the chart group is generated without asking "Automatic statistical process control 2". What is the status of the flag. Therefore, once generated, if the two or two groups are no longer needed, the relevance of each statistical process control map can be manually removed from the self-analysis strategy, and a graphical user interface can be used as a self-analysis strategy

第17頁 200424816 五、發明說明(11) 略將分析計畫與圖表之關連性移除的工具。 為利於統計流程控制圖表與控制界限的自動產生,可 根據分配至圖表之點的標準差自動計算界限。於此例中, 例如一蝕刻系統中之射頻步驟等對一製程步驟而言具代表 性之參數將自動被登入至適當的統計流程控制圖表。一旦 圖f上點的數目達到一可進行設定的數目時(如足供統計 计异之用的數目),則將自動計算上述點之平均值與標準 差。於=算平均值與標準差之前,自動計算之例行程序將 ,除對資料集合而言不具代表性之點。於計算界限前所提 ^點數以「自動計算前所需要的點數」加以指示,且針 奘,個參數均加以指定。所需要的點數可於安裝後或安 以;得含間預先建立資料庫之資料= 裝前器具儲存声史;二;:可針對先進流程控制系統安 嘗:以此種方式計算之平均值與標準差接著 控制圖表之上層與下控制界限。更用以 千均值之某一百分屮tj貝運用,其即為 值。上層界限可以大二=平均值具數倍標準差差距之 5%至1〇%,或以平二,均值一百分比之方式計算之,如 差,如2至6 限加可上以特=數(係幻之標準如 計算之,如至1〇% ,或V/二平,值1分比之方式 ,’如2至6 σ。所使用之、:特定倍數之標準 加以指定,而一円报外庇 比或倍數係針對每一個夂鉍 而圖形化使用者介面罄萁γ ^ 邛個參數 丨面螢幕可作為輪入及//或 200424816 發明說明(12) ___ 編輯百分比與倍數之工具。此外, 表上亦可提供警示界限,且可以於某些統計流程控制圖 於建立控制界限後,便針對‘二的=式加以判斷。 之評估(使用哪一個批次規則)。,參數指定批次規則 -旦建立起上層與下控制界限,的圖表而言’ 則之評估。此夕卜,對-特定的圖^ ^圖表啟用批次規 層警示界限時,批次規則之評估亦可定上層與下 來的情形。 了匕含根據警示界限而 圖4例示一流程圖,其敘述一用 程控制圖表自動計算控制界限的方1子特定之統計流 始自動計算演算法。於步驟41〇m ^步驟4 05,啟 資料之界外值,而如果必要的:丰;;:步驟415 ’偵測 於步驟425,判斷欲建立之控制界^ 20將之移除: 使用標準差,則於步驟430藉由上控制心,二。,果欲 . t 制界限(UCL,UpperPage 17 200424816 V. Description of the invention (11) A tool that removes the correlation between the analysis plan and the chart. To facilitate the automatic generation of control charts and control limits for statistical processes, limits can be calculated automatically based on the standard deviation of the points assigned to the chart. In this example, parameters such as RF steps in an etching system that are representative of a process step are automatically logged into the appropriate statistical process control chart. Once the number of points on graph f reaches a settable number (such as the number for statistical calculation), the average and standard deviation of the above points will be calculated automatically. Before calculating the average and standard deviation, the routine for automatic calculation will be, except for those that are not representative of the data set. The number of points mentioned before calculating the limit is indicated by "the number of points required before automatic calculation", and the parameters and parameters are specified. The required points can be installed or installed; the information of the pre-built database can be obtained = the sound history of the equipment before installation; two: can be installed for the advanced process control system: the average value calculated in this way And the standard deviation then controls the upper and lower control limits of the chart. It is also used as a percentage of the thousand average value, which is the value. The upper limit can be greater than 2 = 5% to 10% of the average deviation with several times the standard deviation, or calculated as a flat 2 or a percentage of the mean. (The standard of the magic is calculated, such as to 10%, or V / two-level, a value of 1 point, 'such as 2 to 6 σ. The standard used: a specific multiple is specified, and The reported ratio or multiple is for each bismuth and the graphical user interface is full. Γ ^ 参数 parameters 丨 The screen can be used as a turn-in and / or 200424816 invention description (12) ___ Editing the percentage and multiple tools. In addition, warning limits can also be provided on the table, and after certain statistical process control charts have established control limits, they can be judged based on the 'two =' formula. Evaluation (which batch rule is used). The parameter specifies the batch Sub-rules-once the upper and lower control boundaries are established, the evaluation of the rules is performed. In addition, the evaluation of the batch rules can also be determined when the warning limits of the batch-level are enabled for the -specific chart ^ ^ chart. The upper and lower situations. 4 illustrates a flow chart, which describes a method for automatically calculating control limits using a process control chart. A specific statistic stream is used to automatically calculate the algorithm. At step 41m ^ step 4 05, open the out-of-bounds value of the data, if necessary : Feng ;; Step 415 'Detected in step 425, determine the control boundary to be established ^ 20 and remove it: Use standard deviation, then control the heart in step 430, two. Boundaries (UCL, Upper

Control Umit)=平均值+係數χ標準差的方 控制界限,而於步驟435藉由下控制界限(LCL,L〇wer Control Limit)=平均值一係數χ標準差的方式計算下 控制界限,其中係數是經選定以附加例如3 (3)等某倍數 =標準差。如果欲使用平均值之一百分比,則於步驟44〇 精由上控制界限=平均值+百分比X平均值的方式計算上 控制界限,而於步驟445藉由下控制界限=平均值—百分 比X平均值的方式計算下控制界限。 於步驟4 5 0,可啟用批次規則,而於步驟4 5 5,結束自Control Umit) = mean + coefficient x standard deviation square control limit, and in step 435, the lower control limit is calculated by means of lower control limit (LCL, Lower Control Limit) = mean-coefficient x standard deviation, where The coefficient is selected to add a multiple of, for example, 3 (3) = standard deviation. If a percentage of the average value is to be used, the upper control limit is calculated from the upper control limit = average + percent x average value at step 44, and the lower control limit = average-percent X average is calculated at step 445 Values are calculated under control limits. At step 4 5 0, the batch rule can be enabled, and at step 4 5 5 the end of

200424816 五、發明說明(13) 動計算演算法。於其他選擇性之實施例中,可使用類似的 方法判斷警示界限。 另一用以自動計算對一製程步驟而言具代表性之參數 之統計流程控制界限的自動設定組態系統之實施例可包含 ,意之下列功能:(1 )如果「統計流程控制圖表自動計 算」之旗標為「啟用狀態」則一旦自動統計流程控制圖表 已累積達一可進行設定之「點數」時,便可自動計算資 集合之平均值及標準差;(2)自動計算平均值及標準差 之功能可去除經判斷屬於界外值或對資料而言不具 的點;(3 )啟動自動計算平均值及標準差 =數」「此參數加以指定;(4)具-圖Si ^ 數」此參數之用;(5)藉此輸入之 平均ί之間的Τ大於3 (3)之數目;(6)可根據與 界限,而旗標可指定對每一個參 2來!動叶异 值加上標準差之擇^^十的/而式θ,上控制界限可以平均 差的方式,下β制ϊϊ; ί付’(8)如果選擇標準 計算而得;(9)且同可以平均值減去標準差之「倍數」 所使用之「倍數/',供輸入計算界限 用者,面供輸入計算界限所使用之「百二具;圖τ化使 用,(11)具一圖形化使用者介面供」(。)之 方式之用;(1 2 )可於栌制取卩p _ 擇使用哪一種計算 之評估;(13)可:ΪΪ二ίΓ…成後啟用批次規則 了以_曰丈抵次規則之評估(選用哪— 200424816 五、發明說明(14) -- 個批次規則);(14)批次規則之評估(選用哪一個批次 規則)可利用一圖形化使用者介面加以編輯;及/或 )自動建立之界限可利用一般統計流程控制圖表圖形化使 用者介面加以編輯。舉例而言,參數可為單變量或多變 量。 ^ 選擇性地,自動設定組態系統可提供針對穩定步驟持 繽期間自動產生統計流程控制圖表的功能。穩定步驟持續 期間包含於處理開始之前使製程模組中之狀態穩定的穩定 步驟。穩定步驟之持續期間是可變的,視製程‘ $之忑$ 與製程模組之狀態而定。器具製程配方指定了一供如:刻 系統中之壓力等特定的製程參數穩定下來的最長^間。^ 於於一穩定步驟期間紀錄參數不斷地變化,因此一 ^步驟 摘要參數(平均值、標準差、最小值、最大值)僅具^少 量或不具數值。 ' 預設上可包含針對每一個模組存在一「穩定步驟持續 期間」統計流程控制圖表。預設上,針對每一個模組而 言,「穩定步驟」統計流程控制圖表係與「穩定步驟持續 期間」參數相關連。而控制界限係針對每_個模組藉由 「穩定步驟」統計流程控制圖表加以指定。 、”曰 另一用以針對穩定步驟持續期間自動產生統計流程控 制圖表的自動設定組態糸統之實施例可包含任音之下列功 能:(1)於其後’穩定步驟定義為「一期間内盆摘要參 數值(舉例而言,對於一較低電極的正向射頻功率)小/於 臨界值之步驟」;(2)具一圖形化使用者介面供使用者 200424816 五、發明說明(15) 選擇用以定義製程步驟之摘要參數,例如蝕刻系統中之射 頻步驟等;(3 )具一圖形化使用者介面供使用者選擇臨 界值;(4)系統可具有產生一代表一穩定步驟之持續期 間的單一參*,且以秒的方式定義為穩定步驟之持續期間 的能力;(5 )於執灯期間’針對所選擇之每一個穩定+ 驟,可產生一代表穩定步驟之持續期間的新的摘要~變數"; 且其結果可登入至摘要計算表單;(6 )以此種方式選擇 之穩定步驟持續斯間可於永久性資料庫與内存 (in-memory )資料庫二者中加以維護;(7 )可針對每一 個製程模組產生一統計流程控制圖表供登入穩定步驟持續 期間之用;(8 )將每一個穩定步驟持續期間、參數^登入至貝 (每一個製程模組之「穩定步驟持續期間」統計流^程控制 圖表的作業可藉由設定「穩定步驟持續期間」m標加以控 制;(9)預設上’此圖表之下層與上控制界限可設 此目的所產生之預設之「穩定步驟持續期間」统"^程” 制圖表中之界限;(10)具一圖形化使用者介面供 更改「穩定步驟持續期間」統計流程控制圖表 控制界限;傳送至「穩定步,續_」 控制圖表的母一個點的背景資δίΐ (器具、制# — ” 配方、步驟、參數、數值、日期/時間)^二楔組二製程 制圖表資料庫取得;(丨2 )傳送至「穩定步^統計流程控 統計流程控制圖表的每一個點的背景資訊^-持續=間」 制圖表查看之;(1 3 )於執行期間,可針對Ί、、’先°十胤=控 控制批次規則的每一點產生「警示」; '每反統計流程 1 4 )可針對此警 200424816 五、發明說明(16) 示所執行之干預與通知可與目前統計流程控制之干預與通 知相同;(1 5 )警示可包含引發此警示之晶圓的背景^ ^ 訊;及/或(16)預設之干預與通知可藉由「穩定步驟 續期間之預設干預與通知」統計流程控制圖表加以指定。' 統計流程控制圖表可為含有單變量或多變量資料者。 選擇性地’自動设定組態系統可提供針對j u s τ P R 0 C E S S步驟持績期間自動產生統計流程控制圖表的能 力。如果自啟用參數之清單中加以選定,則可針對每— 非零之「JUST PROCESS」參數的出現產生圖表。原則I固 可存在與步驟數目相同數量之JUST PROCESS。但實際上 於一製程配方期間,通常僅能夠記錄有三個JUST 丁 PROCESS。於實際運作中,由於實際上通常僅有一個製 配方步驟使用例如具有終點偵測之蝕刻系統,故每一 \ 配方僅有一 JUST PROCESS。當JUST PROCESS參數為零^ 味著未呼叫任何終點。於此種情況下,此項特徵將兔恩 JUST PROCESS參數。如果啟用,則將針對每—個 : 所發現之非零的JUST PR0CESS參數產生一統計流程^ = 表。預設時,此圖之下層與上控制界限可設:團 產生之預設的「JUST PROCESS」統計流程控制「圖表: 的界限。統計流程控制圖表可為含有單變量:田^中 者。 4夕變$資料 另一用以針對jUST PR0CESS步驟持續期間自動 計流程控制圖表的自動設定組態系統之實施例可包人二 之下列功能:(1 )於其後,JUST PROCESS定義為匕每3一井思200424816 V. Description of the invention (13) Dynamic computing algorithm. In other alternative embodiments, a similar method can be used to determine the warning limit. Another embodiment of an automatic setting configuration system for automatically calculating statistical process control limits for parameters that are representative of a process step may include the following functions: (1) If "statistical process control charts are automatically calculated The flag of "" is "enabled", once the automatic statistical process control chart has accumulated to a set "points", the average value and standard deviation of the asset collection can be automatically calculated; (2) the average value is automatically calculated And the standard deviation function can remove the points that are judged to be out-of-bounds or not for the data; (3) Start automatic calculation of the average and standard deviation = number "" This parameter is specified; (4) with-graph Si ^ number The purpose of this parameter is; (5) the number of τ between the average ί input by this is greater than 3 (3); (6) can be based on the limit and the flag can be specified for each parameter 2! Different values of moving leaves plus the standard deviation of ^^ 10 / and the formula θ, the upper control limit can be averaged in the way of lower β; 付 付 '(8) if the standard calculation is selected; (9) and Same as the "multiplier" which can subtract the standard deviation from the average. "Multiples / 'is used to enter the calculation limit. For the input of the calculation limit," One hundred and twenty; Figure τ is used, (11) has one Graphical user interface is used for "(.)" Method; (1 2) can be selected in the evaluation of p _ which calculation is used; (13) can be: after the completion of the batch rules In order to evaluate the rule of _ Yue Zhang (which is selected — 200424816 V. Description of the invention (14)-batch rules); (14) The evaluation of batch rules (which batch rule is selected) can use a graphic The user interface can be used for editing; and / or) the automatically created boundaries can be edited using a general statistical process control chart graphical user interface. For example, the parameter can be univariate or multivariate. ^ Optionally, the automatic setting and configuration system can provide the function of automatically generating statistical process control charts for the stable steps. The stabilization step duration includes a stabilization step that stabilizes the state in the process module before processing begins. The duration of the stabilization step is variable, depending on the state of the process ‘$ 之 忑 $ and the process module. The device process formula specifies a longest time interval for which specific process parameters such as: pressure in the system are stabilized. ^ The recording parameters change continuously during a stabilization step, so the summary parameters (mean, standard deviation, minimum, maximum) of a ^ step have only a small amount or no value. '' By default, there can be a “stabilization step duration” statistical process control chart for each module. By default, for each module, the "stabilization step" statistical flow control chart is related to the "stability step duration" parameter. The control limit is specified for each module by the "stability step" statistical flow control chart. "" Another example of an automatic setting configuration system for automatically generating a statistical process control chart for the duration of the stabilization step may include the following functions of Ren Yin: (1) Thereafter, the stabilization step is defined as "a period Inner basin summary parameter value (for example, for a lower electrode's forward RF power) is less / critical than step "; (2) a graphical user interface for users 200424816 V. Description of the invention (15 ) Select the summary parameters used to define the process steps, such as RF steps in the etching system; (3) Have a graphical user interface for the user to select a critical value; (4) The system may have a method that generates a stable step A single parameter of the duration *, and the ability to define the duration of the stabilization step in seconds; (5) During the lighting period, 'for each stable + step selected, a representative of the duration of the stabilization step can be generated. New summary ~ variables; and the results can be logged into the summary calculation form; (6) The stable steps selected in this way can be continuously used in the permanent database and memory (in-m emory) The database is maintained in both; (7) A statistical process control chart can be generated for each process module for the duration of the login stabilization step; (8) The duration of each stabilization step and the parameters ^ login to (The "stabilization step duration" statistical flow of each process module ^ The operation of the process control chart can be controlled by setting the "stability step duration" m standard; (9) preset upper 'This chart is lower and upper The control limit can be set as the limit in the preset "stability step duration" system " ^ process "chart generated for this purpose; (10) a graphical user interface for changing the" stability step duration "statistical process Control chart control limit; transfer to "steady step, continued _" Background data of one point of the control chart's mother (tool, system # — ”recipe, step, parameter, value, date / time) ^ two wedge group two process system Obtained from the chart database; (丨 2) sent to the "stability step ^ statistical process control background information of each point of the statistical process control chart ^ -continuous = interval" to view the chart; (1 3) in During the trip, “Warning” can be generated for each point of the “先 ° 十 胤 = Control and control batch” rule; 'Each counter-statistical process 1 4) You can respond to this alarm 200424816 V. Description of invention (16) The intervention and notification may be the same as the intervention and notification of the current statistical process control; (1 5) the alert may include the background of the wafer that triggered the alert ^ ^ message; and / or (16) the preset intervention and notification may be made by The "statistical intervention and notification during the stabilisation step" statistical flow control chart is specified. '' Statistical process control charts can be those containing univariate or multivariate data. The optional 'automatic setting configuration system can provide the ability to automatically generate statistical process control charts for the steps of j u s τ P R 0 C E S S. If selected from the list of enabled parameters, a graph can be generated for each occurrence of a non-zero "JUST PROCESS" parameter. In principle, there can be as many JUST PROCESS as there are steps. However, in practice, only three JUST Ding PROCESS can be recorded during a process recipe. In practice, since there is usually only one recipe step using an etching system with endpoint detection, for example, there is only one JUST PROCESS per recipe. When the JUST PROCESS parameter is zero, it means that no destination is called. In this case, this feature will be JUST PROCESS parameters. If enabled, a statistical process will be generated for each of the: found non-zero JUST PR0CESS parameters ^ = table. By default, the lower and upper control limits of this graph can be set: the preset "JUST PROCESS" statistical process control "graph:" limit generated by the group. The statistical process control chart can include a single variable: Tian ^ zhong. 4夕 变 $ 数据 Another embodiment of the automatic setting and configuration system for automatically counting process control charts for the duration of the jUST PR0CESS step can include the following two functions: (1) After that, JUST PROCESS is defined as 3 Ichisui

麵 200424816 五、發明說明(17) 驟記錄一次以指示終點被呼叫的時間的參數值,而於先進 流程控制系統中有例如2 4個對應於目前器具軟體上所允許 之最大數量之步驟的此種參數;(2)具一圖形化 者 介面供使用者選擇JUST PR0CESS作為啟用參數以自動產生 統計流程控制圖表;(3 )於執行期間,可 PROCESS參數非為零之每一步驟產生統計流程=制圖表; (4)以此種方式選擇之JUST pR〇CESS持續期間可於永久 性貧料庫與内存資料庫二者中加以維護;(5)且一圖形 介面供使用者更改「順·ms」統計流程控 制圖表」之下層與上控制界限;(6)傳送至「 PROCESS」統計流程控制「圖# $ (器具、製程模組、製程配方、半驄^ ^幻月系貝汛 / 士叫、7丄^ , 征配方、步驟、參數、數值、日期 間)可由統計流程控制圖表資料 至JUST PROCESS統計流程控制岡矣沾 > ;、丨;得迗 ^ ^ ^ ^ 制圖表的母一個點的背景資訊 漱、土,从4 > 一有之,(8 )於執行期間,可針 對延反、,先叶k程控制批次規則的每一點產生「憨示 (9 )可針對此警示所執行箱 口 ’ 流程控制之干預與通知相同· 〃 、、、计 +夕a m从此旦次· , ( 10 )警示可包含引發此馨 蕤ώ ^ In月厅、貝訊,及/或(11 )預設之干預與通知可 J由「針對JUST PROCESS所預設之干預與通知」加以指了 ,然如上所述僅詳細說明本發明某些例示性之實 : = 此=之人將可輕易察覺例示之實施例中可 此存在“不致與本發明勒新的技術内容與優點具顯著:200424816 V. Description of the invention (17) The parameter value is recorded once to indicate the time when the destination is called. In the advanced process control system, for example, there are 2 4 steps corresponding to the maximum number of steps allowed on the current appliance software. (2) A graphical user interface is provided for the user to select JUST PR0CESS as the enable parameter to automatically generate a statistical flow control chart; (3) During the execution, a statistical flow can be generated for each step where the PROCESS parameter is non-zero = (4) The duration of JUST pROCESS selected in this way can be maintained in both the permanent lean library and the memory database; (5) and a graphical interface for the user to change "Shun · ms "Statistical process control chart" lower and upper control limits; (6) Send to "PROCESS" statistical process control "Figure # $ (apparatus, process module, process recipe, half a month ^ ^ 月 月 系 贝贝 / 士 叫, 7 丄 ^, sign formula, step, parameter, value, date period) from the statistical process control chart data to the JUST PROCESS statistical process control Gang Gangzhang >;丨; get ^ ^ ^ ^ ^ chart The background information of one point of the parent is from 4 > one of them, (8) During the execution, for each point of the deferred, first-step control batch rule, "憨 (9) 可" The intervention of the Hakkou 'process control for this warning is the same as the notification. 〃 ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, and · · (10) The warning may include the triggering of this sweet sale ^ In Yue Hall, Bei Xun, and / Or (11) Prescribed interventions and notifications can be referred to by "preset interventions and notifications for JUST PROCESS", but as mentioned above, only some exemplary facts of the present invention are explained in detail: = This = the person It will be easy to perceive that the exemplified embodiment may exist "without significant technical content and advantages of the present invention:

200424816 !200424816!

第25頁Page 25

200424816200424816

圖式簡單說明 五、【圖式簡單說明】 圖1例示一於一半導體製造環境中之一先進流程控制 (APC,Advanced Process Control)系統之概要方塊 Γ51 · 圖, 圖2顯示依據本發明之一實施例,一敘述自動設定一 先進流程控制系統之組態的流程圖; 圖3顯示依據本發明之一實施例,一敘述自動產生統 計流程控制(SPC,Statistical Process Control)圖表 的流程圖;而Brief description of the drawings V. [Schematic description of the drawings] FIG. 1 illustrates an outline block of an advanced process control (APC, Advanced Process Control) system in a semiconductor manufacturing environment. In the embodiment, a flowchart describing the configuration of an advanced process control system is automatically set; FIG. 3 shows a flowchart describing the automatic generation of a statistical process control (SPC) chart according to an embodiment of the present invention; and

圖4顯示依據本發明之一實施例’一敘述針對一統計 流程控制圖表自動計算控制界限的流程圖。 立件符蟓說明: 100 半導體製造環境 110 器具 120製程模組1 130感應器 140 感應器介面 145先進流程控制系統 150 介面伺服器 160先進流程控制伺服器 170用戶端工作站 180 圖形化使用者介面 190資料庫Fig. 4 shows a flowchart describing the automatic calculation of control limits for a statistical flow control chart according to an embodiment of the present invention. Article description: 100 semiconductor manufacturing environment 110 appliance 120 process module 1 130 sensor 140 sensor interface 145 advanced process control system 150 interface server 160 advanced process control server 170 client workstation 180 graphical user interface 190 data Library

第26頁 200424816 圖式簡單說明 20 0 自動設定一先進流程控制系統之組態的流程圖 210 於自動設定組態資料檔中設定啟用參數與旗標 220 產生逗號分隔數值檔 230 啟用參數作為逗號分隔數值檔 240 自動設定組態程式 250 自動設定組態腳本 260 啟用參數檔 30 0 自動產生統計流程控制圖表的方法 30 5 啟始自動統計流程控制Page 26 200424816 Simple illustration of the diagram 20 0 Flow chart for automatically setting the configuration of an advanced process control system 210 Set the enable parameters and flags in the automatic configuration configuration data file 220 Generate a comma-separated value file 230 Enable parameters as a comma-separation Numerical file 240 Automatically setting configuration program 250 Automatically setting configuration script 260 Enabling parameter file 30 0 Method of automatically generating statistical flow control chart 30 5 Starting automatic statistical flow control

310 自動產生模式 315 所有參數 320 參數符合選擇標準 325 存在圖表 330 產生圖表 33 5 將參數登入至圖表 340 存在界限 345 下一參數 3 5 0 圖表具有所需數量之點310 Automatic generation mode 315 All parameters 320 Parameters meet selection criteria 325 Exist graph 330 Generate graph 33 5 Register parameters to graph 340 Exist bound 345 Next parameter 3 5 0 The graph has the required number of points

35 5 計算界限 3 6 0 結束自動統計流程控制 400 針對特定之統計流程控制圖表自動計算控制界限的 方法 405 啟始自動計算 410 計算平均值與標準差35 5 Calculate the limit 3 6 0 End the automatic statistical process control 400 Automatically calculate the control limit for a specific statistical process control chart 405 Start automatic calculation 410 Calculate the average and standard deviation

第27頁 200424816 圖式簡單說明 415 界外值 420 移除界外值 * -- 425 平均值之百分比 430 上控制界限 = 平均值 + 係數 X 標準差 435 下控制界限 = 平均值 一 係數 X 標準差 440 上控制界限 = 平均值 + 百分 比 X 平均值 445 下控制界限 = 平均值 — 百分 比 X 平均值 450 啟用批次規則 45 5 結束自動計算Page 27 200424816 Simple illustration of the diagram 415 Outlier value 420 Remove outlier value *-425 Percentage of average value 430 Upper control limit = average value + coefficient X standard deviation 435 Lower control limit = average value-coefficient X standard deviation 440 up Control Limit = Average + Percent X Average 445 Lower Control Limit = Average — Percent X Average 450 Enable batch rule 45 5 Automatic calculation ends

第28頁Page 28

Claims (1)

200424816 六、申請專利範圍 1. 一種針對一半導體製造環境自動設定一系統之組態的 方法,包含: 產生一用以執行一自動設定組態程式之自動設定組態 腳本(s c r i p t ),其中該自動設定組態腳本啟動用以輸入 至該自動設定組態程式之預設值;以及 執行該自動設定組態腳本以產生一輸出自該自動設定 組態程式之啟用參數檔,其中該啟用參數檔識別用於產生 統計流程控制(SPC,Statistical Process Control)圖 表之參數。200424816 6. Scope of patent application 1. A method for automatically setting a system configuration for a semiconductor manufacturing environment, including: generating an automatic setting configuration script for executing an automatic setting configuration program, wherein the automatic The configuration configuration script is started for inputting default values into the automatic configuration configuration program; and the automatic configuration configuration script is executed to generate an activation parameter file output from the automatic configuration configuration program, wherein the activation parameter file is identified Parameters used to generate statistical process control (SPC) charts. 2. 如申請專利範圍第1項之針對一半導體製造環境自動設 定一系銑之組態的方法,更包含 產生一經設定以供該自動設定組態程式讀取之自動設 定組態資料檔,其中該自動設定組態資料檔包含一用以覆 寫該預設值之啟用參數與旗標之清單的至少其一。 3. 如申請專利範圍第1項之針對一半導體製造環境自動設 定一系統之組態的方法,更包含2. For example, the method for automatically setting a milling configuration for a semiconductor manufacturing environment according to item 1 of the scope of patent application, further includes generating an automatic setting configuration data file that is set for reading by the automatic setting configuration program, where The automatic setting configuration data file includes at least one of a list of enabling parameters and flags for overwriting the default value. 3. For example, the method for automatically setting the configuration of a system for a semiconductor manufacturing environment in item 1 of the scope of patent application, further including 針對該啟用參數之至少其一產生至少一統計流程控制 圖表,其中該產生動作包含每一次執行該自動設定組態腳 本即自動產生該統計流程控制圖表。 4. 如申請專利範圍第1項之針對一半導體製造環境自動設 定一系統之組態的方法,更包含Generate at least one statistical flow control chart for at least one of the enabling parameters, wherein the generating action includes automatically generating the statistical flow control chart each time the automatic configuration configuration script is executed. 4. For example, the method for automatically setting a system configuration for a semiconductor manufacturing environment in item 1 of the scope of patent application, further including 第29頁 200424816 六、申請專利範圍 針對該至少一統計流程控制圖表之至少其一產生控制 界限,其中該產生動作包含每一次執行該自動設定組態腳 本即自動計算該控制界限。 5. 如申請專利範圍第4項之針對一半導體製造環境自動設 定一系統之組態的方法,其中 該控制界限包含一上控制界限與一下控制界限之至少 其一。 6. 如申請專利範圍第4項之針對一半導體製造環境自動設 定一系統之組態的方法,其中 一旦於該統計流程控制圖表中達到一所需數量之資料 點即自動計算該控制界限。 7. 如申請專利範圍第6項之針對一半導體製造環境自動設 定一系統之組態的方法,其中 該所需數量之資料點的界外值將加以移除。 8. 如申請專利範圍第6項之針對一半導體製造環境自動設 定一系統之組態的方法,其中 該控制界限係根據一該統計流程控制圖表中之該所需 數量之資料點之一平均值的百分比加以計算。 9.如申請專利範圍第6項之針對一半導體製造環境自動設Page 29 200424816 6. Scope of patent application Control limits are generated for at least one of the at least one statistical process control chart, wherein the generating action includes automatically executing the automatic configuration configuration script every time the control limits are calculated. 5. The method for automatically setting the configuration of a system for a semiconductor manufacturing environment according to item 4 of the scope of patent application, wherein the control limit includes at least one of an upper control limit and a lower control limit. 6. For example, the method for automatically setting a system configuration for a semiconductor manufacturing environment according to item 4 of the scope of patent application, wherein the control limit is automatically calculated once a required number of data points are reached in the statistical flow control chart. 7. For the method for automatically setting the configuration of a system for a semiconductor manufacturing environment in item 6 of the patent application scope, the outlier of the required number of data points will be removed. 8. The method for automatically setting the configuration of a system for a semiconductor manufacturing environment according to item 6 of the scope of patent application, wherein the control limit is an average of one of the required number of data points in a control chart according to a statistical process The percentage is calculated. 9. If the patent application scope item 6 is set automatically for a semiconductor manufacturing environment 424816 申請專利範圍 定 """"糸統之< 該控制的方法’其中 數 量之資料5i限係根據一該統计流程控制圖表中之該所需 、U之一標準差與一係數之乘積加以計算。 1 0 · 如申譜直心从 4々 月寻利乾圍第8項之針對一半導體製造環境自動 扠疋二糸統之組態的方法,其中 "亥上控制界限(UCL,Upper Control Limit)係囍由 上控制界限=平均值+百分比x平均值加以決定, 而5亥下控制界限(LCL,Lower Control Limit)係葬由 控制界限=平均值一百分比χ平均值加以決^。下 11·如申請專利範圍第9項之針對一半導體製造環境自動 設定一系統之組態的方法,其中 該上控制界限係藉由上控制界限=平均值‘1 係數 X 標準差加以決定,而該下控制界限係藉由下控制界阳 = 平均值一係數X 標準差加以決定。 ^ ^ 12.如申請專利範圍第1 〇項之針對一半導體製造環境自動 設定一系統之組態的方法’其中 該百分比係由使用者加以指定。 13·如申請專利範圍第1 2項之針對一半導體製造環境自動 設定一系統之組態的方法,其中 該百分比係利用一試算表加以指定。424816 The scope of patent application is determined " " " " The system of control " The method of control 'where the amount of data 5i limit is based on a statistical process control chart of the required, one standard deviation and The product of a coefficient is calculated. 1 0 · Rushen Spectrum sincerely seeks the profit configuration from the 8th month of April. The 8th method for the automatic configuration of a semiconductor manufacturing environment and the second system configuration. Among them, "UCL (Upper Control Limit)" The system is determined by the upper control limit = average value + percentage x average value, and the lower control limit (LCL, Lower Control Limit) is determined by control limit = average value-percentage x average value. Next 11. The method for automatically setting the configuration of a system for a semiconductor manufacturing environment as described in item 9 of the scope of the patent application, wherein the upper control limit is determined by the upper control limit = average'1 coefficient X standard deviation, and The lower control limit is determined by the lower control boundary = mean = coefficient x standard deviation. ^ ^ 12. The method for automatically setting the configuration of a system for a semiconductor manufacturing environment according to item 10 of the patent application scope, wherein the percentage is specified by the user. 13. The method of automatically setting the configuration of a system for a semiconductor manufacturing environment as described in item 12 of the scope of patent application, wherein the percentage is specified using a trial balance. 200424816 六、申請專利範圍 14·如申請專利範圍第12項之針對一半導體製造環境自動 設定一系統之組態的方法,其中 該百分比係利用一圖形化使用者介面加以指定。 15. 如申請專利範圍第1 1項之針對一半導體製造環境自動 設定一系統之組態的方法,其中 該係數係由使用者加以指定。200424816 VI. Scope of Patent Application 14. The method for automatically setting the configuration of a system for a semiconductor manufacturing environment as described in item 12 of the patent application scope, wherein the percentage is specified using a graphical user interface. 15. For example, the method for automatically setting a system configuration for a semiconductor manufacturing environment according to item 11 of the scope of patent application, wherein the coefficient is specified by the user. 16. 如申請專利範圍第1 5項之針對一半導體製造環境自動 設定一系統之組態的方法,其中 該係數係利用一試鼻表加以指定。 17. 如申請專利範圍第1 5項之針對一半導體製造環境自動 設定一系統之組態的方法,其中 該係數係利用一圖形化使用者介面加以指定。16. For example, the method for automatically setting the configuration of a system for a semiconductor manufacturing environment according to item 15 of the scope of patent application, wherein the coefficient is specified using a nose test. 17. The method for automatically setting the configuration of a system for a semiconductor manufacturing environment, as described in item 15 of the scope of patent application, wherein the coefficient is specified using a graphical user interface. 18. 如申請專利範圍第6項之針對一半導體製造環境自動 設定一系統之組態的方法,其中 該所需數量之資料點係由使用者加以指定。 1 9.如申請專利範圍第1 8項之針對一半導體製造環境自動 設定一系統之組態的方法,其中 該所需數量之資料點係利用一試算表加以指定。18. For the method of automatically setting a system configuration for a semiconductor manufacturing environment according to item 6 of the patent application scope, wherein the required number of data points is specified by the user. 19. The method for automatically setting the configuration of a system for a semiconductor manufacturing environment according to item 18 of the scope of patent application, wherein the required number of data points is specified using a trial spreadsheet. 第32頁 200424816 六、申請專利範圍 2 0 ·如申請專利範圍第1 8項之針對一半導體製造環境自動 設定一系統之組態的方法,其中 該所需數量之資料點係利用一圖形化使用者介面加以 指定。 21·如申請專利範圍第6項之針對一半導體製造環境自動 設定一系統之組態的方法,其中 該所需數量之資料點包含某些於先進流程控制 (APC ’Advanced Process Control )系統之一預先建立 資料母體期間所取得之資料點。 22.如申請專利範圍第3項之針對一半導體製造環境自動 設定一系統之組態的方法,更包含 針對該至少一統計流程控制圖表設定批次規則之評估 (run rule evaluation ),並啟用該批次規則之評估。 23·如申請專利範圍第22項之針對一半導體製造環境自動 設定一系統之組態的方法’其中 該批次規則之評估係由使用者加以設定。 务白動 24.如申請專利範圍第23項之針對一半導體製造瓖私曰 設定一系統之組態的方法,其中 該批次規則之評估係利用一試算表加以設定。Page 32 200424816 VI. Application for patent scope 20 · For the method for automatically setting the configuration of a system for a semiconductor manufacturing environment such as the scope of patent application No. 18, wherein the required number of data points is used graphically User interface. 21 · The method for automatically setting the configuration of a system for a semiconductor manufacturing environment according to item 6 of the scope of patent application, wherein the required number of data points includes one of some advanced process control (APC 'Advanced Process Control) systems The data points obtained during the establishment of the data matrix in advance. 22. The method for automatically setting a system configuration for a semiconductor manufacturing environment according to item 3 of the scope of patent application, further comprising setting a run rule evaluation for the at least one statistical process control chart, and enabling the Evaluation of batch rules. 23. A method for automatically setting a system configuration for a semiconductor manufacturing environment according to item 22 of the scope of patent application, wherein the evaluation of the batch rules is set by the user. Business White 24. For example, a method for setting a system configuration for a semiconductor manufacturing company in the scope of patent application No. 23, wherein the evaluation of the batch rule is set using a trial balance. 第33頁 200424816Page 33 200424816 第34頁Page 34
TW093103894A 2003-02-18 2004-02-18 Method for automatic configuration of a processing system TWI234056B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US44831903P 2003-02-18 2003-02-18

Publications (2)

Publication Number Publication Date
TW200424816A true TW200424816A (en) 2004-11-16
TWI234056B TWI234056B (en) 2005-06-11

Family

ID=35912863

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093103894A TWI234056B (en) 2003-02-18 2004-02-18 Method for automatic configuration of a processing system

Country Status (2)

Country Link
CN (1) CN100468256C (en)
TW (1) TWI234056B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11302545B2 (en) 2020-03-20 2022-04-12 Nanya Technology Corporation System and method for controlling semiconductor manufacturing equipment
TWI761724B (en) * 2018-11-26 2022-04-21 荷蘭商Asml荷蘭公司 Method for determining root causes of events of a semiconductor manufacturing process and for monitoring a semiconductor manufacturing process
TWI770829B (en) * 2020-04-08 2022-07-11 南亞科技股份有限公司 System and method for controlling semiconductor manufacturing apparatus

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104750049B (en) * 2013-12-31 2018-05-08 北京北方华创微电子装备有限公司 The method and system of gas circuit configuration processing in semiconductor manufacturing
CN107203196B (en) * 2016-03-17 2021-03-02 深圳智造谷工业互联网创新中心有限公司 Industrial equipment detection system and method
CN107871698A (en) * 2017-11-07 2018-04-03 君泰创新(北京)科技有限公司 Process establishment, acquisition, guard method and the device of manufacture of solar cells equipment
CN113126485A (en) * 2021-04-21 2021-07-16 长鑫存储技术有限公司 Parameter dynamic control method and device, electronic equipment and storage medium

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5586041A (en) * 1992-12-14 1996-12-17 Ford Motor Company Method and system for real-time statistical process monitoring
US6445969B1 (en) * 1997-01-27 2002-09-03 Circuit Image Systems Statistical process control integration systems and methods for monitoring manufacturing processes
US6263255B1 (en) * 1998-05-18 2001-07-17 Advanced Micro Devices, Inc. Advanced process control for semiconductor manufacturing

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI761724B (en) * 2018-11-26 2022-04-21 荷蘭商Asml荷蘭公司 Method for determining root causes of events of a semiconductor manufacturing process and for monitoring a semiconductor manufacturing process
US11796978B2 (en) 2018-11-26 2023-10-24 Asml Netherlands B.V. Method for determining root causes of events of a semiconductor manufacturing process and for monitoring a semiconductor manufacturing process
US11302545B2 (en) 2020-03-20 2022-04-12 Nanya Technology Corporation System and method for controlling semiconductor manufacturing equipment
TWI770799B (en) * 2020-03-20 2022-07-11 南亞科技股份有限公司 System and method for controlling semiconductor manufacturing equipment
TWI770829B (en) * 2020-04-08 2022-07-11 南亞科技股份有限公司 System and method for controlling semiconductor manufacturing apparatus
US11675340B2 (en) 2020-04-08 2023-06-13 Nanya Technology Corporation System and method for controlling semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
TWI234056B (en) 2005-06-11
CN100468256C (en) 2009-03-11
CN1723423A (en) 2006-01-18

Similar Documents

Publication Publication Date Title
US8494798B2 (en) Automated model building and batch model building for a manufacturing process, process monitoring, and fault detection
US7213478B2 (en) Method for automatic configuration of processing system
TWI286682B (en) Method for configuring sensor(s) in semiconductor processing system using GUIs, and control system and GUIs for configuring sensor(s) in semiconductor processing system
TWI310525B (en) Method and system for controlling tool process parameters
CN101036092B (en) Method and system for dynamically controlling metrology work in progress
KR100734531B1 (en) A method for requesting trace data reports from fdc semiconductor fabrication processes and semiconductor fabrication processing system
JP6525044B1 (en) Monitoring system, learning apparatus, learning method, monitoring apparatus and monitoring method
TW200307972A (en) Correlation of end-of-line data mining with process tool data mining
TW200900921A (en) Graphical user interface for presenting multivariate fault contributions
TW200912582A (en) A tool to report the status and drill-down of an application in an automated manufacturing environment
CN114551271A (en) Method and device for monitoring machine operation condition, storage medium and electronic equipment
CN102473631A (en) Methods and arrangements for in-situ process monitoring and control for plasma processing tools
JP2009532897A (en) Time weighted moving average filter
CN104067232A (en) Bi-directional association and graphical acquisition of time-based equipment sensor data and material-based metrology statistical process control data
JP5443365B2 (en) Method and arrangement structure for creating a model for fine-tuning a recipe
TWI726401B (en) Data processing method, data processing device, data processing system, and computer-readable recording medium
JP2023052477A (en) Data processing method and data processing program
JP2009282703A (en) Production instruction evaluation support system, method and program
TW200424816A (en) Method for automatic configuration of a processing system
CN110928264B (en) Data processing, data processing apparatus, and computer-readable recording medium
KR20090095694A (en) method for maintaining statistical process used semiconductor manufacture equipment control system
US20130030760A1 (en) Architecture for analysis and prediction of integrated tool-related and material-related data and methods therefor
KR20100048186A (en) System of executing unified process-device-circuit simulation
TW531823B (en) Multi-variable monitoring method for semiconductor processing
TWI842961B (en) Data processing method, data processing device and computer readable recording medium

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees