200422623 玖、發明說明 (發明說明應_ :發明臓之技術領域、先前技術、內容、讎方式細式簡單說明) 【發明所屬之技術領域】 本發明係有關於一種固態陀螺儀及三軸向慣性量測儀，特別是 其採用微機械技術，而達到可感測垂直於其結構表面之轴向（定義 為z軸向）的角速度’且兼具感測平行該結構表面之軸向加速度者。 【先前技術】 習知以微機械技術製作之固態陀螺儀，其角速度感測轴向大部 份均是平行於其結構表面，例如美國專利第5,392,650號、第 5,〇16,072號及第5,757，103號。再者，若需同時量測三軸向之角 速度及加速度的狀況下，角速度感測軸向若能垂直於其結構表 面，則可將量測三軸向之陀螺儀及加速儀製作於同一基片上，而 大幅降低成本及體積。因此，產生另一類形式之固態陀螺儀，例 如美國專利第6,257,059號及第5,992,233號。 【發明内容】 《所欲解決之問題》 上述習知美國專利第6,257,059號之固態陀螺儀之結構如第一 圖所示，其感測轴向垂直於結構表面，包含兩個慣性質量塊3及 梳狀結構31、32。質量塊3及梳狀結構31、32以數個彈性樑6、 61、62銜接至固定錨60，固定錨60固定於基板71。質量塊3包 含許多排列整齊之小孔3h ,其下方之基板71表面包含許多平行 於驅動轴向（y轴向）之長形電極對91、92，並分別連接至接線板 9p及9n，沿X軸向之小孔間距與二長形電極對之間距相等；兩組 長形電極91、92與質量塊3之表面形成感測電容器e9p、c9n。 質量塊3、梳狀結構31、32及彈性樑6、6卜62之材質可為金屬、 摻雜質矽晶、矽晶、或多晶矽。彈性樑6、61、62之長度、寬度 及厚度被設計成較易沿平行於結構表面之二軸向彎曲運動。 兩個外側梳狀驅動器31各以一 Dc偏壓及一反向交流電壓驅 200422623 動，驅動交流電壓之頻率為機械共振頻率，使二質量塊沿y軸反 向振動。兩個内側梳狀驅動器32各以一 DC偏壓及一高頻反向交 流電壓驅動，主要是用於驅動振幅量測與回授，以控制驅動振幅。 若沿z軸向輸入一角速度，則將產生柯氏力使二質量塊3各沿X 軸向反向振動，使感測器c9p、c9n之電容值改變。感測器c9p、 c9n各以一 DC偏壓及一高頻反向交流電壓驅動，又左右兩側之感 測器c9p、c9n所加之電壓反向，由輸出端GN之感測電流正比於 二質量塊3之位移差。 為感測質量塊3沿X轴向之運動量，另有一種形式之感測電 容器，即梳狀電容器（未顯示於第一圖中）：當質量塊3沿X軸運 動時，電容器之間距改變，其電容值即改變，故亦可感測位移量。 上述習知之第二種形式之固態陀螺儀雖可感測垂直於結構 表面之角速度，但欲製作出實用之梳狀電容靜電驅動器或梳狀感 測電容器則較困難，因必須製作出兩面深且間距窄的垂直平面， 故僅適合以晶片溶解法、表面微細加工法、乾式钱刻法製作，且 其所能達到的「深寬比」隨深度加深而降低，靈敏度亦受限；對 於結構尺寸較大之整體微細加工法等則較不適合。 《解決問題之技術手段〉 本發明之主要特徵在於：驅動器及感測器均採邊緣效應之長 形電容器架構，其製程簡單，無需製作兩面深且間距窄的垂直平 面，無高「深寬比」之特殊製程需求問題，適合多種加工法。 《相較於先前技術之功效》 綜上所述，本發明乃揭示：（1)一種z軸向固態陀螺儀，可感 測垂直於結構表面之角速度，且可感測平行於結構表面之一軸向 之加速度；（2)將兩個z軸向固態陀螺儀與兩個感測軸向平行於結 構表面之固態陀螺儀設計於同一晶片上，於一次製程同時完成三 軸向陀螺儀及加速儀，形成一功能完整之平面式慣性量測儀，可 200422623 大幅降低其體積、製作及組裝成本。 再者，查同類案號（美國專利第6,257,059號B1，7/2001， 73/504.02 及第 5,992,233 號 11/1999, 73/504.02)之 z 軸向固態陀 螺儀，並未揭示本發明所述及之相同特徵，故本案應符合「新穎 性」之專利要件。其次，本發明之平面式慣性量測儀製程簡單， 可大幅降低其體積、製作及組裝成本，故本案應符合「產業利用 性」及「進步性」之專利要件，爰依專利法之規定提出本項發明 之專利申請。 【實施方式】 首先，請參閱第二(a)圖，本發明可行實施例之微型z軸向固 態陀螺儀之主結構示意圖。其結構係以具導電性材料製作而成， 包含一外框架2，及一個中間固定錨21 ;外框架2内包含兩組慣 性質量塊3及驅動器本體51、52 ;各個質量塊3各以至少一個感 測彈性樑4銜接於其兩個驅動器本體51、52,兩個驅動器本體51、 52之間並以兩個連接樑5連接；各個質量塊3及其驅動器本體 51、52各以數個驅動彈性樑6銜接於一共同連接樑61，共同連接 樑61經由共同彈性樑62固定於中央固定錨60，各個質量塊3及 其驅動器本體51、52亦可以另增彈性樑65、66懸吊於外框架2。 另二片玻璃平板71、72分別置於主結構之正面與背面，並 與外框架2、及固定錨60結合在一起，使上述其餘各元件懸吊於 二片玻璃平板71、72之間。上述感測樑4使質量塊3較易於沿平 行於平板表面之一特定方向（定義為X軸向）移動，驅動樑6、共同 連接樑61、共同彈性樑62、彈性樑65、66等則使質量塊3及驅 動器本體51、52較易於沿平行於平板表面之另一方向（定義為y 軸向）移動；質量塊3之兩表面各含數個垂直於X軸向之長形凹槽 3t，驅動器本體51、52之兩表面各含數個垂直於y軸向之長形凹 槽5t。 玻璃片71、72面對矽晶片之表面、對應各驅動器本體51表 200422623 且平s行於長形凹…長形電極㈣’ 圖之橫截面圖所示，故夂耐如时丄A ^ 關位置如第二 板81、82各形A + 驅動裔本體51表面與其對應之長形電極 72面對石夕動電容器C81P、C81n°同理’玻璃片71、 六伊且平―曰曰於具表面、對應各驅動器本體52表面含有兩組相互 二二、8^ :久形凹槽&之長形電極81、82，並分別連接至接線 P n ’各形成另兩組驅動電容器C82p、c82n。 玻璃片71、72面對矽晶片之表面、對應各個質量塊3表面 之長形凹槽3t亦各含有兩組相互交錯且平行於長形凹槽&之長形 電極9卜92，並分別連接至接線板9p、％ ;質量塊3各表面與其 對應之長形電極91' 92各形成兩組感測電容器c9p、咖。 兩個外側驅動器c8lp、c81n各以一 DC偏壓及一反向交流電 壓驅動，驅動交流電壓之頻率為機械共振頻率，使二f量塊沿丫 軸向反向振動。兩個内側驅動器c82p、c82n各以一 dc偏壓及一 高頻反向交流電壓㈣，主要是用於驅動振幅量測與回授，200422623 发明, description of the invention (invention description _: the technical field of the invention, the prior art, the content, and the detailed description of the method) [technical field to which the invention belongs] The present invention relates to a solid-state gyroscope and triaxial inertia The measuring instrument, in particular, uses micro-mechanical technology to achieve an angular velocity that can sense the axial direction (defined as the z-axis) perpendicular to the surface of the structure, and can also sense the axial acceleration parallel to the surface of the structure. [Prior art] Most of the solid-state gyroscopes manufactured by micro-mechanical technology have an angular velocity sensing axis that is mostly parallel to the structure surface, such as US Patent Nos. 5,392,650, 5,016,072, and 5,757, Number 103. Furthermore, if the angular velocity and acceleration of the three axes need to be measured at the same time, if the angular velocity sensing axis can be perpendicular to its structural surface, the gyroscope and accelerometer for measuring the three axes can be made on the same base. On-chip, while greatly reducing cost and volume. As a result, another type of solid-state gyroscope is produced, such as U.S. Patent Nos. 6,257,059 and 5,992,233. [Summary of the Problem] "Problems to be Solved" The structure of the solid-state gyroscope of the above-mentioned conventional U.S. Patent No. 6,257,059 is shown in the first figure, and its sensing axis is perpendicular to the structure surface, including two inertial masses 3 and Comb structure 31,32. The mass 3 and the comb-like structures 31 and 32 are connected to the anchor 60 by a plurality of elastic beams 6, 61 and 62. The anchor 60 is fixed to the base plate 71. The mass 3 includes a plurality of regularly arranged holes 3h, and the surface of the substrate 71 below it includes a plurality of long electrode pairs 91 and 92 parallel to the driving axis (y-axis), and is connected to the wiring boards 9p and 9n, respectively. The spacing between the small holes in the X axis is equal to the distance between the two elongated electrode pairs; the two sets of elongated electrodes 91, 92 and the surface of the mass 3 form sensing capacitors e9p, c9n. The materials of the mass 3, the comb-like structures 31, 32 and the elastic beams 6, 6 and 62 may be metal, doped silicon crystal, silicon crystal, or polycrystalline silicon. The length, width, and thickness of the elastic beams 6, 61, and 62 are designed to be easier to bend in two axial directions parallel to the surface of the structure. The two outer comb drivers 31 are driven by a DC bias voltage and a reverse AC voltage drive 200422623. The frequency of the drive AC voltage is a mechanical resonance frequency, which causes the two masses to vibrate in the reverse direction along the y-axis. The two inner comb drivers 32 are each driven by a DC bias voltage and a high-frequency reverse AC voltage, which are mainly used for driving amplitude measurement and feedback to control the driving amplitude. If an angular velocity is input along the z axis, a Coriolis force will be generated to cause the two masses 3 to vibrate in the opposite direction along the x axis, thereby changing the capacitance values of the sensors c9p and c9n. The sensors c9p, c9n are each driven by a DC bias voltage and a high-frequency reverse AC voltage, and the voltages applied by the sensors c9p, c9n on the left and right sides are reversed, and the sensing current of the output terminal GN is proportional to two. Difference in displacement of mass 3. In order to sense the amount of movement of the mass 3 along the X axis, there is another form of sensing capacitor, namely a comb capacitor (not shown in the first figure): When the mass 3 moves along the X axis, the distance between the capacitors changes The capacitance value changes, so it can also sense the displacement. Although the above-mentioned conventional second form of solid-state gyroscope can sense the angular velocity perpendicular to the surface of the structure, it is more difficult to make a practical comb-shaped capacitive electrostatic driver or comb-shaped sensing capacitor. Vertical planes with narrow pitches are only suitable for fabrication by wafer dissolution, surface microfabrication, and dry money engraving, and the "aspect ratio" that can be achieved decreases with depth and sensitivity is limited; for structural dimensions Larger overall microfabrication methods are less suitable. "Technical Means for Solving the Problem" The main feature of the present invention is that the driver and sensor adopt edge capacitors with long capacitor structure. The manufacturing process is simple, there is no need to make vertical planes with two sides deep and narrow spacing, and there is no high "aspect ratio The problem of special process requirements is suitable for a variety of processing methods. "Effects compared to the prior art" In summary, the present invention discloses: (1) a z-axis solid state gyroscope that can sense the angular velocity perpendicular to the structure surface and can sense one of the structures parallel to the structure surface Axial acceleration; (2) Design two z-axis solid-state gyroscopes and two solid-state gyroscopes whose sensing axis is parallel to the structure surface on the same chip, and complete three-axis gyroscopes and acceleration at the same time in one process Instrument, forming a fully functional flat-type inertial measurement instrument, can greatly reduce its volume, manufacturing and assembly costs. Furthermore, the z-axis solid-state gyroscope of the same case number (U.S. Patent No. 6,257,059 B1, 7/2001, 73 / 504.02 and 5,992,233 11/1999, 73 / 504.02) did not disclose the present invention and The same characteristics, so this case should meet the "newness" patent requirements. Secondly, the planar inertial measuring instrument of the present invention has a simple manufacturing process, which can greatly reduce its volume, production and assembly costs. Therefore, this case should meet the patent requirements of "industrial availability" and "progressiveness", and is proposed in accordance with the provisions of the Patent Law. Patent application for this invention. [Embodiment] First, please refer to the second (a) diagram of the main structure of a miniature z-axis solid state gyroscope according to a feasible embodiment of the present invention. Its structure is made of conductive material and includes an outer frame 2 and an intermediate fixed anchor 21; the outer frame 2 contains two sets of inertial masses 3 and driver bodies 51 and 52; each mass 3 is at least One sensing elastic beam 4 is connected between its two driver bodies 51 and 52, and the two driver bodies 51 and 52 are connected by two connecting beams 5. Each mass 3 and its driver bodies 51 and 52 are each connected by several The driving elastic beam 6 is connected to a common connecting beam 61, and the common connecting beam 61 is fixed to the central anchor 60 via the common elastic beam 62. Each mass 3 and its driver body 51 and 52 can also be suspended by additional elastic beams 65 and 66.于 外 FRAME 2. The other two glass plates 71 and 72 are respectively placed on the front and back of the main structure, and are combined with the outer frame 2 and the fixing anchor 60, so that the other components mentioned above are suspended between the two glass plates 71 and 72. The above-mentioned sensing beam 4 makes it easier for the mass 3 to move in a specific direction (defined as the X-axis) parallel to the surface of the flat plate. The driving beam 6, the common connecting beam 61, the common elastic beam 62, the elastic beams 65, 66, etc. Make the mass 3 and the driver body 51, 52 easier to move in the other direction (defined as the y-axis) parallel to the flat surface; the two surfaces of the mass 3 each include several long grooves perpendicular to the x-axis 3t, each of the two surfaces of the driver body 51, 52 contains a plurality of elongated grooves 5t perpendicular to the y-axis. The glass plates 71 and 72 face the surface of the silicon wafer, corresponding to each driver body 51, 200422623, and horizontally running in the elongated recess ... The elongated electrode is shown in the cross-sectional view of the figure, so it is resistant to the time 丄 A ^ Off Positioned as the second plate 81, 82, the surface of the A + driver body 51 and its corresponding elongated electrode 72 facing the Shi Xi capacitors C81P, C81n ° Similarly, the glass sheet 71, Liu Yi and Ping-said Yu Yu The surface, corresponding to the surface of each driver body 52, contains two sets of two and two, 8 ^: long-shaped grooves & long electrodes 81, 82, and are respectively connected to the wiring P n 'to form another two sets of driving capacitors C82p, c82n . The surfaces of the glass plates 71, 72 facing the silicon wafer, and the long grooves 3t corresponding to the surfaces of the respective masses 3 also each contain two sets of long electrodes 9 and 92 that are interlaced and parallel to the long grooves & Connected to the wiring board 9p,%; each surface of the mass 3 and its corresponding long electrode 91 '92 each form two sets of sensing capacitors c9p, coffee. The two outer drivers c8lp and c81n are each driven by a DC bias voltage and a reverse AC voltage, and the frequency of the driving AC voltage is a mechanical resonance frequency, which causes the two f gauge blocks to vibrate in the reverse direction along the Y-axis. The two inner drivers c82p and c82n each use a dc bias and a high-frequency reverse AC voltage ㈣, which are mainly used to drive amplitude measurement and feedback.
制驅動振幅。 I 若沿z軸向輪入一角速度，則將產生柯氏力使二質量塊3各 沿一X軸向反向振動’·若沿，軸向亦輸入一加速度時，慣性力亦將 使一貝里塊3產生沿X軸向同向位移；由於長形電容器面積改變， 故兩者皆可使感測器c9p、C9n之電容值改變。 感測器♦ c9n各以一 DC偏壓及一高頻反向交流電壓驅 動’左右兩側之感測器c9p、c9n所加之電壓反向，由輸出端gn ^測電流正㈣二質量塊3之位移差。由角速度所產生的信號 ^父流信號’由加速度所產生的信號為低頻或直流信號，經師 ^處理技術可分離出z轴向角速度及心向加速度信號。感測電 各益C9p、c9n之長形電極9!、92亦可部份分割出來，如第 圖之回授電極9f，以作為陀螺儀制衡回授驅動器之用。 質量塊3及驅動器本體51、52可有許多其他不同的形式， 200422623 例如第四及第五圖’在質量塊3或驅動器本體5卜52之表面 之長形凹槽3t、5t内再蝕刻許多深孔3h、5h，甚或將其蝕刻穿 ^減輕驅動器之負荷，提昇驅動性能。又第四圖中將連接樑$取 消，直接以感測樑4連接兩個驅動器本體51、52 ;第五圖中將 接樑5及感測樑4取消，f量塊3及驅動器本體5卜52直接銜 在起，感測樑4之功能改由共同連接樑61承擔。 本結構可利用晶片溶解法、表面微細加工法、乾式蝕刻 IGA、整體微細加工法等製成，無需製作兩面深且間距小之 、'面’無「深寬比」之特殊製程需求條件問題。 紅ί結構若以⑽㈣晶片11利用整體微細加工法製作，复处 圖：配合(11W晶片濕式 性， ^ =元件：Γ平行四邊形，任二邊之爽角皆為 轉夕晶片製作具有—優點，即因其具垂直》二 特性、自動蝕刻停止功能，舲 不做剔 精確控制驅動樑及感測樑之寬/ 率，提昇製程成功率及感測性*…，控制測共振頻 ^ ^ 109.48» ^ 4 ^ 的sin(109.48。）倍或sin(70.52。·，故有效柯^力降低為原來 〇94倍。 Z )倍，即0.94倍，亦即靈敏度降低 疋義一新座標糸統（X’，y’ W ^ _-θ㈣48。）角度而成，原座標系統(x，y，z)繞2轴 行於y，軸。故驅動方向為y 動樑平行於x軸，則感測樑平 軸向角速度1。 @ ’而感顚c9P'c9n可感測出z 上述兩個Z轴向陀螺儀及 曰Η ^ 加曰啊久兩個平面内軸向陀螺儀可設計於同 一日日片上，可形成一個具三軸向 一 能之平面式三轴向慣性量測儀。"f儀及二軸向加速儀之疋整功 第七圖所示係本發明用於 需之感測轴向平行於結構表面之X轴向固態陀螺二ί意 200422623 圖：第七（a)圖為主結構之上視圖；第七（b)圖為玻璃平板表面之驅 動電容器之長形電極板及感測電容器之電極板示意圖。第七圖之 X軸向固態陀螺儀之結構與第二圖之z軸向固態陀螺儀大同小 異，主要之差異有二：（l)x軸向固態陀螺儀之感測樑4使質量塊 3較易於沿z轴向移動’而第二圖之z轴向固態陀螺儀之感測標4 使質量塊3較易於沿X軸向移動；（2) X軸向固態陀螺儀之感測電 極板對應各個質量塊3之各表面為單一電極板9，而z軸向固態 陀螺儀之感測電極板對應各個質量塊3之各表面為兩組長形電極 板 91 、 92 。Control drive amplitude. I If an angular velocity is entered along the z-axis, a Coriolis force will be generated to cause the two masses 3 to vibrate in the X-axis in the opposite direction. If the acceleration is also input in the axial direction, the inertial force will also cause a The Bailey block 3 is displaced in the same direction along the X axis; both the capacitance values of the sensors c9p and C9n can be changed due to the change in the area of the elongated capacitor. Sensors c9n are each driven by a DC bias and a high-frequency reverse AC voltage. The voltages applied to the left and right sensors c9p, c9n are reversed, and the output terminal gn ^ measures the current. The difference in displacement. The signal generated by the angular velocity ^ Parent flow signal 'The signal generated by the acceleration is a low-frequency or DC signal. The processing technique of the teacher can separate the z-axis angular velocity and the cardiac acceleration signal. The sensing electrodes C9p, c9n's long electrodes 9 !, 92 can also be partially divided, such as the feedback electrode 9f in the figure, as a gyro balance feedback driver. The mass 3 and the driver body 51, 52 can have many other different forms. 200422623 For example, the fourth and fifth figures, 'Large grooves 3t, 5t on the surface of the mass 3 or the driver body 5 and 52 are etched many more. Deep holes 3h, 5h, or even etch them through to reduce the load on the driver and improve the driving performance. In the fourth figure, the connecting beam $ is canceled, and the two driver bodies 51 and 52 are directly connected by the sensing beam 4; in the fifth figure, the connecting beam 5 and the sensing beam 4 are cancelled, and the f gauge block 3 and the driver body 5 are used. 52 is directly connected, and the function of the sensing beam 4 is assumed by the common connection beam 61 instead. This structure can be made by wafer dissolving method, surface microfabrication method, dry etching IGA, overall microfabrication method, etc. It is not necessary to make the two sides deep and the distance between them is small, and the "face" has no special process requirements such as "aspect ratio". If the red structure is manufactured by using the overall microfabrication method of the wafer 11, the resumption diagram is: (11W wafer wetness, ^ = element: Γ parallelogram, and the cool angle of any two sides is a turning wafer. It has the advantage That is, because of its vertical characteristics and automatic etch stop function, it is not necessary to accurately control the width / rate of the driving beam and the sensing beam to improve the process success rate and sensitivity * ..., and control the measured resonance frequency ^ ^ 109.48 »^ 4 ^ sin (109.48.) Times or sin (70.52 ..., so the effective force is reduced to 094 times the original. Z) times, which is 0.94 times, that is, the sensitivity is reduced. A new coordinate system (X ', Y' W ^ _-θ㈣48.), The original coordinate system (x, y, z) travels around the 2 axis on the y, axis. Therefore, if the driving direction is y and the moving beam is parallel to the x axis, the sensing beam Horizontal axial angular velocity 1. @ '而 感 顚 c9P'c9n can sense z. The above two Z-axis gyroscopes and Η 加 ^ Jia Yue Ah Jiu two in-plane axial gyroscopes can be designed on the same day and day. , Can form a plane-type three-axis inertia measuring instrument with three axes and one energy. &Quot; F instrument and two-axis accelerometer integration The seventh figure shows the X-axis solid-state gyroscope used in the present invention for sensing the axial parallel to the structure surface. 200422623 Figure: The seventh (a) figure is the top view of the main structure; the seventh (b) The figure is a schematic diagram of the long electrode plate of the driving capacitor and the electrode plate of the sensing capacitor on the surface of the glass flat plate. The structure of the X-axis solid-state gyroscope in Figure 7 is similar to the z-axis solid-state gyroscope in Figure 2. The main differences There are two: (l) The sensing beam 4 of the x-axis solid-state gyroscope makes the mass 3 easier to move along the z-axis' and the sensing mark 4 of the z-axis solid-state gyroscope of the second figure makes the mass 3 more Easy to move along the X-axis; (2) Each surface of the mass electrode 3 corresponding to the sensing electrode plate of the X-axis solid-state gyroscope is a single electrode plate 9, and the sensing electrode plate of the z-axis solid-state gyroscope corresponds to each mass. Each surface of the block 3 is two sets of elongated electrode plates 91, 92.
為組成一平面式三軸向慣性量測儀尚需一 y軸向固態陀螺 儀，其結構與X軸向固態陀螺儀相同，只是繞z軸旋轉90° 。 當驅動軸及感測軸正交時，組成一平面式三軸向慣性量測儀 所需之四個固態陀螺儀、各軸向陀螺儀之驅動軸向、感測軸向、 及其角速度輸入袖向及加速度輸入轴向等之安排歸納如表（一）： 表（一）··驅動軸及感測軸正交時各陀螺儀之軸向安排 項次 驅動軸 感測軸 角速度 輸入轴 加速度 輸入軸 G1 Dy Dz Wx Az G2 Dx Dz Wy Az G3 Dy Dx Wz Ax G4 Dx Dy Wz AyIn order to form a planar three-axis inertial measurement instrument, a y-axis solid-state gyroscope is required. Its structure is the same as that of the X-axis solid-state gyroscope, except that it is rotated 90 ° around the z-axis. When the driving axis and the sensing axis are orthogonal, the four solid-state gyroscopes needed to form a planar triaxial inertial measurement instrument, the driving axis of each axial gyroscope, the sensing axis, and its angular velocity input The arrangement of sleeve direction and acceleration input axis are summarized as table (1): Table (1) · The axial arrangement of each gyroscope when the drive shaft and the sense axis are orthogonal The drive shaft senses the angular velocity of the input shaft acceleration Input shaft G1 Dy Dz Wx Az G2 Dx Dz Wy Az G3 Dy Dx Wz Ax G4 Dx Dy Wz Ay
由表（一）可知，z軸向之陀螺度及加速度均有兩組輸出信號 可用。 若以一個Z軸向陀螺儀及兩個平面内軸向陀螺儀組成一個平 面式三軸向慣性量測儀，則Z軸向加速度分量Az仍有兩組信號， 但將缺少一個平面内軸向之加速度分量的信號，例如若選用G3 安排，則將缺少一個Ay加速度分量；若選用G4安排，則將少一 個Αχ加速度分量。為補足所欠缺的Αχ或Ay加速度分量的信號， 可另增加一 Αχ或Ay加速儀。 11 200422623 第八（a)圖所示為本發明以四個固態陀螺儀組成之平面式三 軸向慣性量測儀之主結構示意圖，其中Gl、G2、G3、G4各固態 陀螺儀之驅動軸向、感測軸向、及其角速度輸入軸向及加速度輸 入軸向等之安排與表（一）相同。 若以（110)矽晶片利用整體微細加工法製作三軸向平面式慣 性量測儀，則其各軸向陀螺儀之驅動軸向及感測軸向之安排、及 其角速度輸入軸向、加速度輸入軸向如表（二）所示： 表（二）：驅動軸及感測軸非正交時各陀螺儀之軸向安排 項次 驅動軸 感測軸 角速度 感測軸 加速度 感測軸 Gl Dy Dz Wx Az G2 Dx， Dz Wy， Az G3 Dy Dx’ Wz Ax， G4 Dx， Dy Wz AyAs can be seen from Table (1), there are two sets of output signals available for the gyroscope degree and acceleration in the z-axis. If a Z-axis gyroscope and two in-plane axial gyroscopes are used to form a planar three-axis inertial measurement device, the Z-axis acceleration component Az still has two sets of signals, but one in-plane axial will be missing. The signal of the acceleration component, for example, if the G3 arrangement is used, it will lack an Ay acceleration component; if the G4 arrangement is used, it will have one Aχ acceleration component less. In order to make up for the lack of Ax or Ay acceleration component signals, an additional Ax or Ay accelerometer can be added. 11 200422623 Figure 8 (a) shows the main structure diagram of a planar triaxial inertial measurement device composed of four solid-state gyroscopes according to the present invention, among which Gl, G2, G3, G4 drive shafts of solid-state gyroscopes The arrangement of the direction, the sensing axis, the angular velocity input axis, and the acceleration input axis are the same as those in Table (1). If a triaxial planar inertial measuring instrument is manufactured by using the (110) silicon wafer with the overall microfabrication method, the arrangement of the driving axis and the sensing axis of each axial gyroscope, and the angular velocity input axis and acceleration The input axis is shown in Table (II): Table (II): The axial arrangement of each gyroscope when the drive axis and the sensing axis are non-orthogonal. The drive axis senses the axis angular velocity, the axis acceleration, and the axis Gl Dy. Dz Wx Az G2 Dx, Dz Wy, Az G3 Dy Dx 'Wz Ax, G4 Dx, Dy Wz Ay
第八(b)圖所示為本發明利用（110)矽晶片經整體微細加工法 製作、以四個固態陀螺儀組成之平面式三軸向慣性量測儀之主結 構示意圖，其中Gl、G2、G3、G4各固態陀螺儀之驅動軸向、感 測軸向、及其角速度輸入軸向及加速度輸入軸向等之安排與表（二） 相同。 鲁 若以（110)矽晶片利用整體微細加工法製作三軸向平面式慣 性量測儀，最後所獲得之信號均為：Wx、Wy’、Wz三個角速度 分量，及Ax’、Ay、Az三個加速度分量。因X轴與y’軸、X’軸與 7軸非正交，故(\\^，\^’）、（八乂’，八7)需轉換至一正交的座標系統： (x，y，z)或（x’，y’，z)。設系統之工作座標為（x，y，z)座標，則由第八 (b)圖之二座標系統關係圖，可得：The eighth (b) diagram is a schematic diagram of the main structure of a planar three-axis inertial measurement instrument made of (110) silicon wafers by the overall microfabrication method and composed of four solid-state gyroscopes, in which Gl, G2 The arrangement of the driving axis, sensing axis, and angular velocity input axis and acceleration input axis of each solid-state gyroscope of G3, G4, and G4 are the same as those in Table (2). Lu Ruo used the (110) silicon wafer to make a triaxial planar inertial measurement instrument using the overall microfabrication method. The signals obtained at the end are: three angular velocity components of Wx, Wy ', and Wz, and Ax', Ay, and Az Three acceleration components. Because the X axis is not orthogonal to the y 'axis, and the X' axis is not orthogonal to the 7 axis, (\\ ^, \ ^ '), (Hachi', 8) need to be converted to an orthogonal coordinate system: (x, y, z) or (x ', y', z). Let the working coordinate of the system be (x, y, z) coordinate, then from the eighth (b) figure two coordinate system relationship diagram, we can get:
Wy -Wxsin(0) +Wy, c〇s(e) (i) 12 200422623Wy -Wxsin (0) + Wy, c〇s (e) (i) 12 200422623
Ax,+Ay sin(0) 上述本發明之功能完整之平面式三軸向慣性量測儀，其輸出 信號包含三個軸向角速度分量及三個軸向加速度分量；若只需較 少功能，則只需適當簡化其結構即可。 雖然本發明已以一具體實施例揭露如上，然其並非用以限定 本發明，任何熟悉此技藝者，在不脫離本發明之精神和範圍内， 當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申 請專利範圍所界定者為準。Ax, + Ay sin (0) The above-mentioned fully functional triaxial inertial measurement instrument of the present invention, the output signal of which includes three axial angular velocity components and three axial acceleration components; if fewer functions are needed, You just need to simplify the structure appropriately. Although the present invention has been disclosed as above with a specific embodiment, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and decorations without departing from the spirit and scope of the present invention. The scope of protection shall be determined by the scope of the attached patent application.
【圖式簡單說明】 為期能對本發明之目的、功效及構造特徵有更詳盡明確的瞭 解，茲舉可行實施例並配合圖式說明如後： 第一圖所示係習知可感測垂直於結構表面之角速度之固態 陀螺儀結構示意圖。 第二圖所示係本發明可行實施例之z軸向固態陀螺儀之結構 示意圖：（a)圖為主結構之上視圖；（b)圖為玻璃平板表面之驅動電 容器及感測電容器之長形電極板示意圖。[Brief description of the drawings] In order to have a more detailed and clear understanding of the purpose, effect and structural features of the present invention, the feasible embodiments are illustrated in conjunction with the illustrations as follows: The first picture shows that the sensing can be perpendicular to Schematic diagram of the structure of the solid-state gyroscope with angular velocity on the structure surface. The second figure shows the structure of a z-axis solid-state gyroscope according to a feasible embodiment of the present invention: (a) the top view of the main structure; (b) the length of the driving capacitor and the sensing capacitor on the surface of the glass plate Shaped electrode plate.
第三圖所示係驅動電容器或感測電容器之長形電容器之結 構橫截面示意圖。 第四圖及第五圖係本發明之另二可行實施例之z軸向固態陀 螺儀之結構示意圖： 第六圖係本發明以（110)矽晶片經整體微細加工法製作之z轴 向固態陀螺儀之結構示意圖：（a)圖為主結構之上視圖；（b)圖為玻 璃平板表面之驅動電容器及感測電容器之長形電極板示意圖。 第七圖所示係本發明用於組成平面式三軸向慣性量測儀所 需之感測軸向平行於結構表面之X軸向固態陀螺儀之結構示意 圖：（a)圖為主結構之上視圖；（b)圖為玻璃平板表面之驅動電容器 之長形電極板及感測電容器之電極板示意圖。 第八圖所示係本發明以四個固態陀螺儀組成之平面式三軸 13 200422623 向慣性量測儀之主結構示意圖··（a)圖為外形為長方形或正方形之 結構；（b)圖為以（110)矽晶片經整體微細加工法製作之平行四邊形 結構。 【元件符號說明】 11 : (110)矽晶片 2 :外框架 3:慣性質量塊 31、32 :内、外側梳狀驅動器 3t:質量塊3表面垂直於感測軸之長形凹槽 3h:質量塊3表面長形凹槽内之深凹槽或穿透孔 4:感測彈性樑 5 :連接樑 51、52 ··驅動器本體 5t ··驅動器本體51、52表面垂直於驅動轴之長形凹槽 5h ··驅動器本體51、52表面長形凹槽内之深凹槽或穿透孔 6:驅動彈性樑 60 :中央固定錨 61、62 :共同連接樑、共同彈性樑 65、66 :彈性樑 71、72 :玻璃平板 81、82 :玻璃板上驅動器之長形電極板 81ρ、81η :玻璃板上外側驅動器之長形電極組之接線板 c81p、c81n :驅動電容器 82ρ、82η :玻璃板上内側驅動器之長形電極組之接線板 c82p、c82n :驅動電容器 91、92 :玻璃板上感測器之長形電極板 9p、9n ··玻璃板上感測器之長形電極組之接線板 c9p、c9n :感測電容器 200422623 9f、9fb :玻璃板上之回授電極板、及其接線板 G、GN :與矽晶片接觸之電極板、及其接線板 Gl、G2、G3、G4 :組成平面式三軸向慣性量測儀所需之四個陀 螺儀The third figure shows a schematic cross-sectional view of the structure of a long capacitor for a driving capacitor or a sensing capacitor. The fourth and fifth figures are structural schematic diagrams of a z-axis solid state gyroscope according to another feasible embodiment of the present invention: The sixth figure is a z-axis solid state produced by the entire microfabrication method of a (110) silicon wafer of the present invention Schematic diagram of the gyroscope structure: (a) The top view of the main structure; (b) The schematic diagram of the long electrode plate of the driving capacitor and the sensing capacitor on the surface of the glass plate. The seventh diagram shows the structure of an X-axis solid-state gyroscope whose sensing axis is parallel to the structure surface required by the present invention for forming a planar triaxial inertial measurement instrument: (a) The main structure Top view; (b) is a schematic diagram of a long electrode plate for a driving capacitor and an electrode plate for a sensing capacitor on the surface of a glass flat plate. The eighth figure is a schematic diagram of the main structure of the planar three-axis 13 200422623 inertial measuring instrument of the present invention composed of four solid-state gyroscopes. (A) The figure shows a rectangular or square structure; (b) It is a parallelogram structure made by (110) silicon wafer through the overall microfabrication method. [Description of component symbols] 11: (110) Silicon wafer 2: Outer frame 3: Inertial mass block 31, 32: Inner and outer comb drive 3t: Mass block 3 The surface of the long groove perpendicular to the sensing axis 3h: Mass Deep grooves or penetrating holes in the long grooves on the surface of the block 3 4: Sensitive elastic beams 5: Connecting beams 51, 52 · Drive body 5t · Long recesses on the surfaces of the drive bodies 51 and 52 perpendicular to the drive shaft Slot 5h · Deep groove or penetration hole in the long groove on the surface of the driver body 51, 52 6: Driving elastic beam 60: Central anchor 61, 62: Common connecting beam, Common elastic beam 65, 66: Elastic beam 71, 72: Glass flat plates 81, 82: Long electrode plates 81ρ, 81η of the driver on the glass plate: Terminal plates c81p, c81n of long electrode groups of the outer driver on the glass plate: Drive capacitors 82ρ, 82η: Inside of the glass plate Terminal plates c82p, c82n of the long electrode group of the driver: Drive capacitors 91, 92: Long electrode plates 9p, 9n of the sensor on the glass plate ·· C9p terminal plate of the long electrode group of the sensor on the glass plate , C9n: sensing capacitor 200422623 9f, 9fb: feedback electrode plate on glass plate, and Panel G, GN: an electrode plate in contact with the silicon chip, and the wiring board Gl, G2, G3, G4: Composition of the desired planar triaxial four inertial measurement instrument gyroscope
續次頁（發明說明頁不敷使用時，請註記並使用續頁） 15Continued pages (Notes and use of continuation pages when the invention description page is insufficient) 15