TW200420621A - Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective film - Google Patents

Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective film

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Publication number
TW200420621A
TW200420621A TW93101668A TW93101668A TW200420621A TW 200420621 A TW200420621 A TW 200420621A TW 93101668 A TW93101668 A TW 93101668A TW 93101668 A TW93101668 A TW 93101668A TW 200420621 A TW200420621 A TW 200420621A
Authority
TW
Taiwan
Prior art keywords
photo
resin composition
organosiloxane polymer
curable resin
protective film
Prior art date
Application number
TW93101668A
Other languages
Chinese (zh)
Other versions
TWI318989B (en
Inventor
Kazuhiro Arai
Hideto Kato
Satoshi Asai
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003014274A external-priority patent/JP3944734B2/en
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200420621A publication Critical patent/TW200420621A/en
Application granted granted Critical
Publication of TWI318989B publication Critical patent/TWI318989B/zh

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Abstract

A novel organosiloxane polymer is obtained by addition reaction of an organohydrogenpolysiloxane (1), an alkenyl-containing organopolysiloxane (2) and an unsaturated compound of formula (3) or (4). Using the organosiloxane polymer, a photo-curable resin composition is prepared which can be exposed to radiation having a wide range of wavelength and developed to form a pattern.
TW93101668A 2003-01-23 2004-01-20 Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective film TW200420621A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003014274A JP3944734B2 (en) 2003-01-10 2003-01-23 Organosiloxane polymer compound, photocurable resin composition, pattern forming method, and film for protecting substrate

Publications (2)

Publication Number Publication Date
TW200420621A true TW200420621A (en) 2004-10-16
TWI318989B TWI318989B (en) 2010-01-01

Family

ID=45073573

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93101668A TW200420621A (en) 2003-01-23 2004-01-20 Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective film

Country Status (1)

Country Link
TW (1) TW200420621A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9653335B2 (en) 2011-07-27 2017-05-16 Shin-Etsu Chemical Co., Ltd. Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9653335B2 (en) 2011-07-27 2017-05-16 Shin-Etsu Chemical Co., Ltd. Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method

Also Published As

Publication number Publication date
TWI318989B (en) 2010-01-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees