TW200414858A - Apparatus and method for aligning and attaching solder columns to a substrate - Google Patents

Apparatus and method for aligning and attaching solder columns to a substrate Download PDF

Info

Publication number
TW200414858A
TW200414858A TW093100748A TW93100748A TW200414858A TW 200414858 A TW200414858 A TW 200414858A TW 093100748 A TW093100748 A TW 093100748A TW 93100748 A TW93100748 A TW 93100748A TW 200414858 A TW200414858 A TW 200414858A
Authority
TW
Taiwan
Prior art keywords
solder
electrical contacts
alignment plate
substrate
holes
Prior art date
Application number
TW093100748A
Other languages
English (en)
Chinese (zh)
Inventor
Shinichi Nomoto
Takashi Nauchi
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003006464A external-priority patent/JP2004221287A/ja
Priority claimed from JP2003010817A external-priority patent/JP2004228125A/ja
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of TW200414858A publication Critical patent/TW200414858A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
TW093100748A 2003-01-15 2004-01-13 Apparatus and method for aligning and attaching solder columns to a substrate TW200414858A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003006464A JP2004221287A (ja) 2003-01-15 2003-01-15 カラム吸着治具
JP2003010817A JP2004228125A (ja) 2003-01-20 2003-01-20 カラム搭載治具およびカラム搭載方法

Publications (1)

Publication Number Publication Date
TW200414858A true TW200414858A (en) 2004-08-01

Family

ID=32599314

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093100748A TW200414858A (en) 2003-01-15 2004-01-13 Apparatus and method for aligning and attaching solder columns to a substrate

Country Status (6)

Country Link
US (1) US20040144834A1 (ko)
EP (1) EP1439744A3 (ko)
KR (1) KR20040066023A (ko)
CN (1) CN1518084A (ko)
SG (1) SG116531A1 (ko)
TW (1) TW200414858A (ko)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10258324B4 (de) * 2002-12-13 2008-03-27 Voith Patent Gmbh Verfahren zur Herstellung von Garnituren für das Mahlen von wasserhaltigem Papierfaserstoff
JP3793969B2 (ja) * 2002-12-17 2006-07-05 千住金属工業株式会社 カラム整列装置
CA2451951A1 (en) * 2003-12-03 2005-06-03 Ibm Canada Limited-Ibm Canada Limitee Apparatus for mounting columns for grid array electronic packages
US7523852B2 (en) * 2004-12-05 2009-04-28 International Business Machines Corporation Solder interconnect structure and method using injection molded solder
KR100742975B1 (ko) * 2007-03-15 2007-07-26 주식회사 고려반도체시스템 땜납볼 어태치 머신 및 그 방법
EP2834037A4 (en) * 2012-03-20 2016-03-16 Alpha Metals LOTFORFORM AND SOLDER ALLOY ASSEMBLY METHOD
US8723323B2 (en) * 2012-07-12 2014-05-13 Bae Systems Information And Electronic Systems Integration Inc. Method for fabricating solder columns for a column grid array package
CN102856215B (zh) * 2012-07-27 2014-11-26 北京时代民芯科技有限公司 一种陶瓷柱栅阵列元器件的植柱装置及方法
US9768142B2 (en) * 2013-07-17 2017-09-19 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for forming bonding structures
CN103706992B (zh) * 2014-01-16 2015-06-10 广州三晶电气有限公司 一种三相光伏并网逆变器的单管焊接治具
CN103831568B (zh) * 2014-03-11 2016-01-20 西安永电电气有限责任公司 一种igbt模块的热敏电阻焊接工装及焊接方法
US9437566B2 (en) 2014-05-12 2016-09-06 Invensas Corporation Conductive connections, structures with such connections, and methods of manufacture
US9793198B2 (en) 2014-05-12 2017-10-17 Invensas Corporation Conductive connections, structures with such connections, and methods of manufacture
DE102014009588A1 (de) 2014-06-27 2016-01-14 Andritz Fiedler Gmbh Garnitur für das mechanische Bearbeiten, insbesondere Mahlen von suspendiertem Faserstoffmaterial
CN104227299A (zh) * 2014-09-06 2014-12-24 广州三晶电气有限公司 一种单相光伏并网逆变器的单管焊接治具及焊接方法
TWI648828B (zh) * 2016-09-22 2019-01-21 唐虞企業股份有限公司 電路接腳定位結構及焊接電路元件之製造方法
TW201818521A (zh) * 2016-11-04 2018-05-16 唐虞企業股份有限公司 電路接腳定位結構及焊接電路元件之製造方法
CN108461409B (zh) * 2018-03-29 2024-06-18 中国电子科技集团公司第四十三研究所 一种ccga器件植柱装置和方法
CN110116252A (zh) * 2019-06-19 2019-08-13 西安微电子技术研究所 一种lccc器件植柱焊接工装及采用其对lccc器件植柱的方法
USD908648S1 (en) * 2019-12-12 2021-01-26 Topline Corporation Adjustable fixture for aligning column grid array substrates
US10868401B1 (en) 2020-03-04 2020-12-15 Onanon, Inc. Robotic wire termination system
CN111390318B (zh) * 2020-04-14 2022-11-22 江西省晶能半导体有限公司 Smd器件焊接控制***及焊接控制方法
WO2021247414A1 (en) * 2020-06-03 2021-12-09 Kulicke And Soffa Industries, Inc. Ultrasonic welding systems, methods of using the same, and related workpieces including welded conductive pins

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3811186A (en) * 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate
US4664309A (en) * 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4646435A (en) * 1985-10-04 1987-03-03 Raychem Corporation Chip carrier alignment device and alignment method
DE69009259T2 (de) * 1989-02-02 1994-10-13 Matsushita Electric Ind Co Ltd Verfahren zum Zusammensetzen von Halbleiteranordnungen.
US5324892A (en) * 1992-08-07 1994-06-28 International Business Machines Corporation Method of fabricating an electronic interconnection
US5626278A (en) * 1994-04-15 1997-05-06 Tang; Ching C. Solder delivery and array apparatus
US5591941A (en) * 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly
US5454159A (en) * 1994-02-18 1995-10-03 Unisys Corporation Method of manufacturing I/O terminals on I/O pads
CA2135508C (en) * 1994-11-09 1998-11-03 Robert J. Lyn Method for forming solder balls on a semiconductor substrate
JP3271461B2 (ja) * 1995-02-07 2002-04-02 松下電器産業株式会社 半田ボールの搭載装置および搭載方法
US5620129A (en) * 1995-02-17 1997-04-15 Rogren; Philip E. Device and method for forming and attaching an array of conductive balls
US5718367A (en) * 1995-11-21 1998-02-17 International Business Machines Corporation Mold transfer apparatus and method
US5762258A (en) * 1996-07-23 1998-06-09 International Business Machines Corporation Method of making an electronic package having spacer elements
US6068174A (en) * 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
TW394716B (en) * 1997-02-18 2000-06-21 Edm Supplies Inc Method and apparatus for placing and attaching solder balls to substrates
JP3252748B2 (ja) * 1997-04-25 2002-02-04 松下電器産業株式会社 導電性ボールの移載方法
SG67424A1 (en) * 1997-09-26 1999-09-21 Advanced Systems Automation Li Solder ball placement with flux template and laser tag
US6105851A (en) * 1998-08-07 2000-08-22 Unisys Corp Method of casting I/O columns on an electronic component with a high yield
US6186216B1 (en) * 1998-12-10 2001-02-13 International Business Machines Corporation Cast column grid array extraction apparatus and method
US6206272B1 (en) * 1999-04-08 2001-03-27 Intel Corporation Alignment weight for floating field pin design
US6276596B1 (en) * 2000-08-28 2001-08-21 International Business Machines Corporation Low temperature solder column attach by injection molded solder and structure formed

Also Published As

Publication number Publication date
SG116531A1 (en) 2005-11-28
US20040144834A1 (en) 2004-07-29
EP1439744A2 (en) 2004-07-21
KR20040066023A (ko) 2004-07-23
CN1518084A (zh) 2004-08-04
EP1439744A3 (en) 2005-04-13

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