TW200414858A - Apparatus and method for aligning and attaching solder columns to a substrate - Google Patents
Apparatus and method for aligning and attaching solder columns to a substrate Download PDFInfo
- Publication number
- TW200414858A TW200414858A TW093100748A TW93100748A TW200414858A TW 200414858 A TW200414858 A TW 200414858A TW 093100748 A TW093100748 A TW 093100748A TW 93100748 A TW93100748 A TW 93100748A TW 200414858 A TW200414858 A TW 200414858A
- Authority
- TW
- Taiwan
- Prior art keywords
- solder
- electrical contacts
- alignment plate
- substrate
- holes
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 72
- 239000000758 substrate Substances 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000000919 ceramic Substances 0.000 claims abstract description 25
- 239000003779 heat-resistant material Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229920006351 engineering plastic Polymers 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 238000000605 extraction Methods 0.000 claims 1
- 150000001247 metal acetylides Chemical class 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000009933 burial Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003006464A JP2004221287A (ja) | 2003-01-15 | 2003-01-15 | カラム吸着治具 |
JP2003010817A JP2004228125A (ja) | 2003-01-20 | 2003-01-20 | カラム搭載治具およびカラム搭載方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200414858A true TW200414858A (en) | 2004-08-01 |
Family
ID=32599314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093100748A TW200414858A (en) | 2003-01-15 | 2004-01-13 | Apparatus and method for aligning and attaching solder columns to a substrate |
Country Status (6)
Country | Link |
---|---|
US (1) | US20040144834A1 (ko) |
EP (1) | EP1439744A3 (ko) |
KR (1) | KR20040066023A (ko) |
CN (1) | CN1518084A (ko) |
SG (1) | SG116531A1 (ko) |
TW (1) | TW200414858A (ko) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10258324B4 (de) * | 2002-12-13 | 2008-03-27 | Voith Patent Gmbh | Verfahren zur Herstellung von Garnituren für das Mahlen von wasserhaltigem Papierfaserstoff |
JP3793969B2 (ja) * | 2002-12-17 | 2006-07-05 | 千住金属工業株式会社 | カラム整列装置 |
CA2451951A1 (en) * | 2003-12-03 | 2005-06-03 | Ibm Canada Limited-Ibm Canada Limitee | Apparatus for mounting columns for grid array electronic packages |
US7523852B2 (en) * | 2004-12-05 | 2009-04-28 | International Business Machines Corporation | Solder interconnect structure and method using injection molded solder |
KR100742975B1 (ko) * | 2007-03-15 | 2007-07-26 | 주식회사 고려반도체시스템 | 땜납볼 어태치 머신 및 그 방법 |
EP2834037A4 (en) * | 2012-03-20 | 2016-03-16 | Alpha Metals | LOTFORFORM AND SOLDER ALLOY ASSEMBLY METHOD |
US8723323B2 (en) * | 2012-07-12 | 2014-05-13 | Bae Systems Information And Electronic Systems Integration Inc. | Method for fabricating solder columns for a column grid array package |
CN102856215B (zh) * | 2012-07-27 | 2014-11-26 | 北京时代民芯科技有限公司 | 一种陶瓷柱栅阵列元器件的植柱装置及方法 |
US9768142B2 (en) * | 2013-07-17 | 2017-09-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mechanisms for forming bonding structures |
CN103706992B (zh) * | 2014-01-16 | 2015-06-10 | 广州三晶电气有限公司 | 一种三相光伏并网逆变器的单管焊接治具 |
CN103831568B (zh) * | 2014-03-11 | 2016-01-20 | 西安永电电气有限责任公司 | 一种igbt模块的热敏电阻焊接工装及焊接方法 |
US9437566B2 (en) | 2014-05-12 | 2016-09-06 | Invensas Corporation | Conductive connections, structures with such connections, and methods of manufacture |
US9793198B2 (en) | 2014-05-12 | 2017-10-17 | Invensas Corporation | Conductive connections, structures with such connections, and methods of manufacture |
DE102014009588A1 (de) | 2014-06-27 | 2016-01-14 | Andritz Fiedler Gmbh | Garnitur für das mechanische Bearbeiten, insbesondere Mahlen von suspendiertem Faserstoffmaterial |
CN104227299A (zh) * | 2014-09-06 | 2014-12-24 | 广州三晶电气有限公司 | 一种单相光伏并网逆变器的单管焊接治具及焊接方法 |
TWI648828B (zh) * | 2016-09-22 | 2019-01-21 | 唐虞企業股份有限公司 | 電路接腳定位結構及焊接電路元件之製造方法 |
TW201818521A (zh) * | 2016-11-04 | 2018-05-16 | 唐虞企業股份有限公司 | 電路接腳定位結構及焊接電路元件之製造方法 |
CN108461409B (zh) * | 2018-03-29 | 2024-06-18 | 中国电子科技集团公司第四十三研究所 | 一种ccga器件植柱装置和方法 |
CN110116252A (zh) * | 2019-06-19 | 2019-08-13 | 西安微电子技术研究所 | 一种lccc器件植柱焊接工装及采用其对lccc器件植柱的方法 |
USD908648S1 (en) * | 2019-12-12 | 2021-01-26 | Topline Corporation | Adjustable fixture for aligning column grid array substrates |
US10868401B1 (en) | 2020-03-04 | 2020-12-15 | Onanon, Inc. | Robotic wire termination system |
CN111390318B (zh) * | 2020-04-14 | 2022-11-22 | 江西省晶能半导体有限公司 | Smd器件焊接控制***及焊接控制方法 |
WO2021247414A1 (en) * | 2020-06-03 | 2021-12-09 | Kulicke And Soffa Industries, Inc. | Ultrasonic welding systems, methods of using the same, and related workpieces including welded conductive pins |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3811186A (en) * | 1972-12-11 | 1974-05-21 | Ibm | Method of aligning and attaching circuit devices on a substrate |
US4664309A (en) * | 1983-06-30 | 1987-05-12 | Raychem Corporation | Chip mounting device |
US4646435A (en) * | 1985-10-04 | 1987-03-03 | Raychem Corporation | Chip carrier alignment device and alignment method |
DE69009259T2 (de) * | 1989-02-02 | 1994-10-13 | Matsushita Electric Ind Co Ltd | Verfahren zum Zusammensetzen von Halbleiteranordnungen. |
US5324892A (en) * | 1992-08-07 | 1994-06-28 | International Business Machines Corporation | Method of fabricating an electronic interconnection |
US5626278A (en) * | 1994-04-15 | 1997-05-06 | Tang; Ching C. | Solder delivery and array apparatus |
US5591941A (en) * | 1993-10-28 | 1997-01-07 | International Business Machines Corporation | Solder ball interconnected assembly |
US5454159A (en) * | 1994-02-18 | 1995-10-03 | Unisys Corporation | Method of manufacturing I/O terminals on I/O pads |
CA2135508C (en) * | 1994-11-09 | 1998-11-03 | Robert J. Lyn | Method for forming solder balls on a semiconductor substrate |
JP3271461B2 (ja) * | 1995-02-07 | 2002-04-02 | 松下電器産業株式会社 | 半田ボールの搭載装置および搭載方法 |
US5620129A (en) * | 1995-02-17 | 1997-04-15 | Rogren; Philip E. | Device and method for forming and attaching an array of conductive balls |
US5718367A (en) * | 1995-11-21 | 1998-02-17 | International Business Machines Corporation | Mold transfer apparatus and method |
US5762258A (en) * | 1996-07-23 | 1998-06-09 | International Business Machines Corporation | Method of making an electronic package having spacer elements |
US6068174A (en) * | 1996-12-13 | 2000-05-30 | Micro)N Technology, Inc. | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
TW394716B (en) * | 1997-02-18 | 2000-06-21 | Edm Supplies Inc | Method and apparatus for placing and attaching solder balls to substrates |
JP3252748B2 (ja) * | 1997-04-25 | 2002-02-04 | 松下電器産業株式会社 | 導電性ボールの移載方法 |
SG67424A1 (en) * | 1997-09-26 | 1999-09-21 | Advanced Systems Automation Li | Solder ball placement with flux template and laser tag |
US6105851A (en) * | 1998-08-07 | 2000-08-22 | Unisys Corp | Method of casting I/O columns on an electronic component with a high yield |
US6186216B1 (en) * | 1998-12-10 | 2001-02-13 | International Business Machines Corporation | Cast column grid array extraction apparatus and method |
US6206272B1 (en) * | 1999-04-08 | 2001-03-27 | Intel Corporation | Alignment weight for floating field pin design |
US6276596B1 (en) * | 2000-08-28 | 2001-08-21 | International Business Machines Corporation | Low temperature solder column attach by injection molded solder and structure formed |
-
2004
- 2004-01-13 TW TW093100748A patent/TW200414858A/zh unknown
- 2004-01-14 KR KR1020040002612A patent/KR20040066023A/ko not_active Application Discontinuation
- 2004-01-14 US US10/756,344 patent/US20040144834A1/en not_active Abandoned
- 2004-01-14 SG SG200401180A patent/SG116531A1/en unknown
- 2004-01-15 CN CNA2004100058992A patent/CN1518084A/zh active Pending
- 2004-01-15 EP EP04250191A patent/EP1439744A3/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
SG116531A1 (en) | 2005-11-28 |
US20040144834A1 (en) | 2004-07-29 |
EP1439744A2 (en) | 2004-07-21 |
KR20040066023A (ko) | 2004-07-23 |
CN1518084A (zh) | 2004-08-04 |
EP1439744A3 (en) | 2005-04-13 |
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