TW200409405A - Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material reel, adhering device, adhesive agent-tape cassette, method of press-conducting adhesive agent using same, and anisotropic electroconductive tape - Google Patents

Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material reel, adhering device, adhesive agent-tape cassette, method of press-conducting adhesive agent using same, and anisotropic electroconductive tape Download PDF

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Publication number
TW200409405A
TW200409405A TW092120892A TW92120892A TW200409405A TW 200409405 A TW200409405 A TW 200409405A TW 092120892 A TW092120892 A TW 092120892A TW 92120892 A TW92120892 A TW 92120892A TW 200409405 A TW200409405 A TW 200409405A
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Taiwan
Prior art keywords
adhesive
tape
adhesive tape
substrate
patent application
Prior art date
Application number
TW092120892A
Other languages
Chinese (zh)
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TWI321868B (en
Inventor
Takahiro Fukutomi
Takashi Tatsuzawa
Yasushi Gotoh
Masami Yusa
Naoki Fukushima
Motohiro Arifuku
Isao Tsukagoshi
Original Assignee
Hitachi Chemical Co Ltd
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Publication date
Priority claimed from JP2002221225A external-priority patent/JP2004059776A/en
Priority claimed from JP2002370622A external-priority patent/JP2004196540A/en
Priority claimed from JP2002370623A external-priority patent/JP4032961B2/en
Priority claimed from JP2002370624A external-priority patent/JP4477823B2/en
Priority claimed from JP2002371889A external-priority patent/JP4608839B2/en
Priority claimed from JP2002371888A external-priority patent/JP4239585B2/en
Priority claimed from JP2002371887A external-priority patent/JP2004203944A/en
Priority claimed from JP2003002095A external-priority patent/JP2004210524A/en
Priority claimed from JP2003002093A external-priority patent/JP4333140B2/en
Priority claimed from JP2003002092A external-priority patent/JP2004211017A/en
Priority claimed from JP2003002094A external-priority patent/JP2004210523A/en
Priority claimed from JP2003118286A external-priority patent/JP2004323621A/en
Priority claimed from JP2003118287A external-priority patent/JP4654566B2/en
Priority claimed from JP2003130196A external-priority patent/JP2004331833A/en
Priority claimed from JP2003130197A external-priority patent/JP4238626B2/en
Priority claimed from JP2003176322A external-priority patent/JP2005330297A/en
Priority claimed from JP2003176321A external-priority patent/JP2005330296A/en
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200409405A publication Critical patent/TW200409405A/en
Publication of TWI321868B publication Critical patent/TWI321868B/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
    • B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
    • B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
    • B65H19/1842—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact
    • B65H19/1852—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact taking place at a distance from the replacement roll
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H21/00—Apparatus for splicing webs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/462—Form of splice
    • B65H2301/4621—Overlapping article or web portions
    • B65H2301/46212—Overlapping article or web portions with C-folded trailing edge for embedding leading edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/37—Tapes
    • B65H2701/377—Adhesive tape
    • B65H2701/3772—Double-sided
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)

Abstract

The present invention provides a method of connecting adhesive material tapes, used for connecting one adhesive material tape wound on one reel and the other tape wound on the other reel, an adhesive agent for electrode connection being applied on base materials of the tapes. The end portion of the one adhesive material tape is turned over, and an adhesive agent face of the one adhesive material tape and an adhesive agent layer of the other adhesive material tape are laid over each other. Then, the laid over portion is heated and pressed so as to connect them. By applying the present invention to exchange the adhesive material reels, the end portion of an adhesive material tape having been paid out, and the start potion of an adhesive material tape to be newly installed are adhered to each other using the adhesive agents of the adhesive material tapes. Therefore, work including exchange of take-up tapes at every replacement of a new adhesive material tape, and installation of the start portion of a new adhesive material tape to a take-up reel is not required. The replacement to a new adhesive material tape requires less time, and then productivity of electronic equipment is increased.

Description

200409405 (1) 玖、發明說明 【發明所屬之技術領域】 本發明係關係電子構件及電路基板、或電路基板間之 黏著固定、以及實施兩者之電極間之電性連接之黏著材膠 帶、其連接方法、製造方法、壓著方法、黏著材膠帶盤、 黏著裝置、黏著劑膠帶盒、及使用其之黏著劑壓著方法， 尤其是，和捲成盤狀之黏著材膠帶、其連接方法、製造方 法、壓著方法、黏著材膠帶盤、黏著裝置、黏著劑膠帶盒 、使用其之黏著劑壓著方法、及向異導電材膠帶相關。 【先前技術】 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間的電性連接 手段，係採用黏著材膠帶。 日本特開2 00 1 -2 8400 5號公報，係記載著將在基材塗 布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶的長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 -6 - (2) (2)200409405 其次，黏著材盤之黏著材膠帶用完時’拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置’並將黏著材膠帶之始知裝設於捲取盤上。 【發明內容】 近年來，隨著PDP等之面板畫面之大型化，電路基 板之黏著面積（或周圍之一邊尺寸）亦增大’一次使用之 黏著劑的使用量亦增加。又，因爲黏著劑用途之擴大，黏 著劑之使用量亦增加。因此，電子機器之製造工廠之黏著 材盤的更換更爲頻繁，因爲黏著材盤之更換十分麻煩，故 有無法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 的捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此’本發明之目的係在提供一種黏著材膠帶之連接 方法、黏著材膠帶、其製造方法、壓著方法、黏著材膠帶 盤、黏著裝置、黏著劑膠帶盒、使用其之黏著劑壓著方法 、及向異導電材膠帶，使黏著材盤之更換十分簡單，且可 (3) (3)200409405 提高電子機器之生產效率。 申請專利範圍第1項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，將一方之黏著材膠帶 之終端部反折，使一方之黏著材膠帶之黏著劑面及另一方 之黏著材膠帶之黏著劑面重疊，並實施兩者之重疊部份的 加熱壓著使其連接。 此申請專利範圍第丨項記載之發明時，係利用黏著材 膠帶之黏著劑來黏著全部捲出之黏著材膠帶之終端部、及 新裝著之黏著材膠帶之始端部，實施黏著材盤之更換，故 很簡單即可將新黏著材膠帶裝著至黏著裝置。又，因爲無 需在每次更換新黏著材膠帶時都更換捲取膠帶、將新黏著 材膠帶之始端裝設至捲取盤之作業、以及在特定路徑設定 導引銷等之作業，只需要較少時間即可更換新黏著材盤， 故可提高電子機器之生產效率。 因係將全部捲出之黏著材膠帶之終端部反折，並將黏 著材膠帶之黏著劑面及新裝著之黏著材膠帶之黏著劑面重 疊黏著，故具有較高之連接強度。 連接部份之加熱壓著若採用裝著著黏著材盤之黏著裝 置的加熱加壓頭，則可合理利用黏著裝置。 申請專利範圍第2項記載之發明’係如申請專利範圍 第1項記載之發明，其特徵爲，一方之黏著材膠帶之終端 部標示著結束標記。 200409405200409405 (1) 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to an adhesive tape for electronic components and circuit boards, or adhesion and fixation between circuit boards, and an electrical connection between the two electrodes, Connection method, manufacturing method, pressing method, adhesive material tape reel, adhesive device, adhesive tape case, and adhesive pressing method using the same, in particular, with adhesive tape rolled into a disc shape, connection method thereof, A manufacturing method, a pressing method, an adhesive material tape tray, an adhesive device, an adhesive tape case, an adhesive pressing method using the same, and an anisotropic conductive tape. [Prior technology] In general, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, bare chip packages, and circuit substrates, or the adhesion and fixation between circuit substrates, and both The means of electrical connection between the electrodes is an adhesive tape. Japanese Patent Application Laid-Open No. 2 00 1 -2 8400 5 describes a case in which an adhesive material tape on which a substrate is coated with an adhesive material is rolled into a disc shape. The width of such a conventional adhesive tape is approximately 1 to 3 mm, and the length of the tape wound up to the disc is approximately 50 m. When the adhesive tape is mounted on the adhesive device, a tray of adhesive tape (hereinafter referred to as "adhesive material tray") is mounted on the adhesive device, and the beginning end of the adhesive tape is pulled out and mounted on the take-up tray. Next, from the base material side of the adhesive material tape rolled out from the self-adhesive material tray, the adhesive is pressed onto the circuit board or the like with a heating and pressing head, and the remaining substrate is taken up by a take-up disk. -6-(2) (2) 200409405 Second, when the adhesive tape of the adhesive material tray is used up, 'remove the used disk and the take-up coil of the base material, and put the new take-up disk and the new adhesive material disk It is mounted on the adhesive device 'and the adhesive tape is installed on the take-up reel. [Summary of the Invention] In recent years, with the enlargement of panel screens of PDPs and the like, the adhesion area (or the size of one of the sides of the circuit board) of the circuit board has also increased. The amount of adhesive used at one time has increased. In addition, due to the expansion of the use of adhesives, the amount of adhesives used has also increased. Therefore, the replacement of the adhesive material plate in the manufacturing plant of electronic equipment is more frequent. Because the replacement of the adhesive material plate is very troublesome, there is a problem that the production efficiency of the electronic device cannot be improved. In view of this problem, you can consider increasing the number of adhesive tapes wound to the disk to increase the adhesive dose per disk to reduce the frequency of disk replacement. However, because the width of the adhesive tape is narrower 1 ~ 3mm. Increasing the number of rolls may lead to loose coiling. Furthermore, if the number of rolls is increased, the pressure applied to the adhesive tape rolled into the shape of a tape increases, which may cause the adhesive to leak from both sides of the tape and become a cause of blockage. In addition, if the number of rolls of adhesive tape is increased, the diameter of the disk will also increase, and the existing adhesive device may not be used because it cannot be mounted on the existing adhesive device. Therefore, the purpose of the present invention is to provide a method for connecting an adhesive tape, an adhesive tape, a manufacturing method, a pressing method, an adhesive tape tray, an adhesive device, an adhesive tape box, and an adhesive pressing method using the adhesive tape. , And anisotropic conductive material tape, making the replacement of the adhesive material plate very simple, and (3) (3) 200409405 can improve the production efficiency of electronic equipment. The invention described in the first item of the scope of the patent application is for connecting the adhesive coated tape for electrode connection on the substrate to one of the adhesive tapes wound on one of the disks, and the other wound on the other disk. The adhesive material tape connection method of one adhesive material tape is characterized in that the terminal portion of one adhesive material tape is folded back so that the adhesive surface of one adhesive material tape and the adhesive surface of the other adhesive material tape overlap. , And the heating and pressing of the overlapping part of the two are connected to each other. When the invention described in item 丨 of the patent scope of this application is, the end of all the rolled adhesive tape and the beginning of the newly installed adhesive tape are adhered with the adhesive of the adhesive tape to implement the adhesive material tray. Replace, so it is very easy to attach the new adhesive tape to the adhesive device. In addition, because there is no need to change the winding tape every time a new adhesive tape is replaced, the operation of installing the new end of the new adhesive tape to the take-up tray, and setting the guide pin in a specific path, etc. The new adhesive material plate can be replaced in less time, so the production efficiency of electronic equipment can be improved. Because the terminal part of all the rolled adhesive tape is folded back, and the adhesive surface of the adhesive tape and the adhesive surface of the newly installed adhesive tape are overlapped and overlapped, it has a high connection strength. If the heating and pressing of the connection part uses a heating and pressing head equipped with an adhesive device with an adhesive material plate, the adhesive device can be used reasonably. The invention described in item 2 of the scope of patent application is the invention described in item 1 of the scope of patent application, characterized in that the terminal portion of one of the adhesive tapes is marked with an end mark. 200409405

此申請專利範圍第2項記載之發明時，除了具有和申 請專利範圍第1項記載之發明相同之作用效果以外，尙可 在結束標記露出時實施全部捲出之黏著材膠帶之切斷，故 實施切斷及連接作業之部份容易解開，而且，可利用必要 最小之位置實施連接，而可防止黏著材膠帶之浪費。 申請專利範圍第3項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，另一方之黏著材膠帶 之始端部係利用將前導膠帶貼附於捲附至盤上之黏著材膠 帶基材面來使其停止，在將一方之黏著材膠帶之終端部反 折後’再使前導膠帶之黏著劑面和一方之黏著材膠帶之終 端部之黏著劑面重疊，實施重疊部份之加熱壓著。 此申請專利範圍第3項記載之發明時，和申請專利範 圍第1項記載之發明相同，很簡單即可將新黏著材膠帶裝 著至黏著裝置，又，只需要較少時間即可更換新黏著材盤 ，故可提高電子機器之生產效率。 此外’因爲係利用黏著材膠帶之前導膠帶來黏著全部 捲出之黏著材膠帶之終端部、及新裝著之黏著材膠帶之始 端部，故很簡單即可實施黏著材膠帶間之黏著。 申請專利範圍第4項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，另一方之黏著材膠帶 (5) (5)200409405 之始端部係利用將前導膠帶貼附於捲附至盤上之黏著材膠 帶基材面來使其停止，使前導膠帶之黏著劑面和一方之黏 著材膠帶之終端部之黏著劑面重疊，實施重疊部份之加熱 壓著。 此申請專利範圍第4項記載之發明時，和申請專利範 圍第1項記載之發明相同，很簡單即可將新黏著材膠帶裝 著至黏著裝置，又，只需要較少時間即可更換新黏著材盤 ，故可提高電子機器之生產效率。 此外’因爲無需反折全部捲出之黏著材膠帶，將黏著 材膠帶捲取至捲取盤時，可防止可能發生之捲取散亂。 申請專利範圍第5項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，使一方之黏著材膠帶 之終端部、及另一方之黏著材膠帶之始端部重疊，在兩者 之重疊部份***卡止銷來實施連接。 此申請專利範圍第5項記載之發明時，因爲係以卡止 銷固定全部捲出之黏著材膠帶之終端部、及新裝著之黏著 材膠帶之始端部，故連接十分簡單。又，因爲無需在每次 更換新黏著材膠帶時都更換捲取膠帶、將新黏著材膠帶之 始端裝設至捲取盤之作業、以及在特定路徑設定導引銷等 之作業’只需要較少時間即可更換新黏著材盤，故可提高 電子機器之生產效率。 申請專利範圍第6項記載之發明，係利用卡止構件來 •10- (6) (6)200409405 連接用以連接基材上塗布著電極連接用黏著劑之捲取至一 方之盤上之一方之黏著材膠帶、及捲取至另一方之盤上之 另一方之黏著材膠帶的黏著材膠帶之黏著材膠帶連接方法 ，其特徵爲，卡止構件具有配設於一方及另一方端部之爪 部、及配設於爪部間之彈性構件，一方之黏著材膠帶之終 端部及另一方之黏著材膠帶之始端部會互相抵接，配設於 卡止構件之一端之爪部會卡止於一方之黏著材膠帶之終端 部，配設於另一端之爪部會卡止於另一方之黏著材膠帶之 始端部，以彈性構件拉近兩方之爪部。 此申請專利範圍第6項記載之發明時，因爲使卡止構 件之一方之爪部卡止於一方之黏著材膠帶之終端部，而且 ，使卡止構件之另一方之爪部卡止於另一方之黏著材膠帶 之始端部，實施兩者之互相連接，故連接十分容易。又， 因爲一方之爪部及另一方之爪部之間具有彈性構件，故， 彈性構件可伸展而使卡止構件之另一方之爪部卡止於另一 方之黏著材膠帶之始端部之任意位置上，而爲具有高自由 度之連接。 又，因係使一方之黏著材膠帶之終端部、及另一方之 黏著材膠帶之始端部互相抵接之狀態實施連接，而無需使 膠帶互相重疊，可利用必要最小之位置實施連接，而可防 止黏著材膠帶之浪費。 申請專利範圍第7項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 -11 - (7) (7)200409405 的黏著材膠帶連接方法，其特徵爲，使一方之黏著材膠帶 之終端部、及另一方之黏著材膠帶之始端部重疊，以橫剖 面略呈〕字形之可彈性變形之夾子實施兩者之重疊部份的 夾持固定。 此申請專利範圍第7項記載之發明時，因爲只需以夾 子夾住一方之黏著材膠帶之終端部、及另一方之黏著材膠 帶之始端部之重疊部份即可實施連接，連接作業十分容易 〇 申請專利範圍第8項記載之發明，其特徵爲，係以橫 剖面略呈〕字形之金屬製夾持片夾住一方之黏著材膠帶及 另一方之黏著材膠帶之重疊部份，並從重疊部份之兩面壓 扇夾持片來連接兩者。 此申請專利範圍第8項記載之發明時，因係從重疊部 份之兩面壓扁夾持片來連接兩者，故可提高黏著材膠帶之 重疊部份的連接強度。 申請專利範圍第9項記載之發明，係用以連接基材上 塗布著電極連接用黏著劑之捲取至一方之盤上之一方之黏 著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶 的黏著材膠帶連接方法，其特徵爲，使.一方之黏著材膠帶 之終端部 '及另一方之黏著材膠帶之始端部之其中任何一 方之黏者劑面重疊於另一方之基材面上，兩者之重疊長度 爲黏著劑膠帶寬度之2至50倍之範圍，以兩者之加熱壓 著實施連接。 此申請專利範圍第9項記載之發明時，因係利用黏著 -12- (8) (8)200409405 材膠帶之黏著劑黏著已用完之黏著材膠帶之終端部、及新 裝著之黏著材膠帶之始端部來實施黏著材盤之更換，故很 簡單即可將新黏著材盤裝著至黏著裝置上。又，因爲無需 在每次更換新黏著材盤時都更換捲取盤、及將新黏著材之 始端裝設至捲取盤之作業，只需要較少時間即可更換新黏 著材盤，故可提高電子機器之生產效率。 重疊部份之長度爲黏著材膠帶寬度之2倍至50倍， 其理由如下所示，小於2倍時無法獲得充分之連接強度， 大於5 0倍時則連接部份使用之黏著材會增加過多而造成 黏著材之浪費。 連接部份之加熱壓著，若採用裝著著黏著材盤之黏著 裝置的加熱加壓頭，則可合理利用黏著裝置。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑者，亦可以爲只有絕緣性黏著劑者，或者 ，將絕緣性隔件粒子分散於這些黏著劑中者。 申請專利範圍第1 〇項記載之發明，係用以連接基材 上塗布著電極連接用黏著劑之捲取至一方之盤上之一方之 黏著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠 帶的黏著材膠帶連接方法，其特徵爲，將一方之黏著材膠 帶之終端部折向黏著劑相對之方向，而將另一方之黏著材 膠帶之始端部折向黏著劑相對之方向，使兩者之彎折部份 互相卡止重疊且使兩者之黏著材面相對，實施重疊部份之 加熱壓著。 此申請專利範圍第1 0項記載之發明時，除了具有和 -13- (9) (9)200409405 申請專利範圍第1項記載之發明相同之作用效果以外，一 方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端部 會互相形成鈎狀卡止，且兩者之黏著劑面會互相連接，故 有較闻之連接強度。 申請專利範圍第1 1項記載之發明，係如申請專利範 圍第9或丨〇項記載之發明，一方之黏著材膠帶之終端部 會標示著結束標記。 此申請專利範圍第1 1項記載之發明時，除了具有和 申請專利範圍第9或1 0項記載之發明相同之作用效果以 S爲一方之黏著材膠帶之終端部係利用結束標記部份 ’幸λ行連接作業之部份容易解開且可利用必要最小之位置 # %連接，而可防止黏著材膠帶之浪費。又，可自動檢測 '結$標記部份，故可利用該檢測信號控制裝置，若能發出 警報，則可提高作業效率。 申請專利範圍第1 2項記載之發明，係如申請專利範 圍第9〜1丨項之其中任一項記載之發明，其特徵爲，以形 成凹凸之一方之模具、及和其咬合之另一方之模具，夾住 一方之黏著材膠帶及另一方之黏著材膠帶之重疊部份，實 施加熱壓著。 此申請專利範圍第1 2項記載之發明時，除了具有和 申請專利範圍第9〜1 1項之其中任一項記載之發明相同之 作用效果以外，因爲連接部份會形成凹凸而可擴大連接面 積，同時，可利用凹凸部之卡合來提高黏著材膠帶之拉伸 方向（縱向）之連接強度。 -14- (10) (10)200409405 申請專利範圍第1 3項記載之發明，係如申請專利範 圍第9〜1 1項之其中任一項記載之發明，其特徵爲，在一 方之黏著材膠帶及另一方之黏著材膠帶之重疊部份形成貫 通孔後，實施重疊部份之加熱壓著。 此申請專利範圍第1 3項記載之發明時，除了具有如 申請專利範圍第9〜1 1項之其中任一項記載之發明相同之 作用效果以外，因爲連接部份會形成貫通孔，黏著劑會滲 出至貫通孔之內緣，而增加黏著劑之黏著面積，故可進一 步提高連接強度。 申請專利範圍第丨4項記載之發明，係用以連接矽處 理基材上塗布著電極連接用黏著劑之捲取至一方之盤上之 一方之黏著材膠帶、及捲取至另一方之盤上之另一方之黏 著材膠帶的黏著材膠帶連接方法，其特徵爲，一方之黏著 材膠帶之終端部及另一方之黏著材膠帶之始端部會重疊或 抵接，以跨越兩黏著材膠帶之矽處理基材之表面部份的方 式貼附矽粘著膠帶，實施兩黏著材膠帶之連接。 此申請專利範圍第1 4項記載之發明時，已捲取一方 之黏著材膠帶之黏著材盤、及只捲取黏著材膠帶之基材之 捲取盤係裝著於黏著裝置上，黏著材盤之黏著材膠帶用完 時’已用完之黏著材膠帶（一方之黏著材膠帶）之終端部 、及新裝著之黏著材盤之黏著材膠帶（另一方之黏著材膠 帶）之始端部會以砂粘著膠帶連接，新黏著材盤會取代已 用完之黏著材盤而裝著於黏著裝置上。 本發明時，只需連接已用完之黏著材膠帶及新黏著材 -15- (11) 200409405 膠帶即可更換連接盤，故很容易即可將新黏著材盤裝著至 黏者裝置上。又，因爲無需在每次更換新黏者材盤時都更 換捲取盤、或將新黏著材膠帶之始端裝設至捲取盤並引導 黏著材膠帶之作業，故只需要較少時間即可更換新黏著材 盤’而可提高電子機器之生產效率。When the invention described in item 2 of this patent application has the same function and effect as the invention described in item 1 of the patent application, the entire adhesive tape can be cut off when the end mark is exposed. The part that performs the cutting and connection operations is easy to disengage, and the connection can be performed at the minimum necessary position, thereby preventing waste of adhesive tape. The invention described in item 3 of the scope of the patent application is for connecting an adhesive tape for one side of a substrate coated with an electrode connection adhesive to a substrate, and the other is wound onto another disk. The adhesive tape connection method of one adhesive tape is characterized in that the starting end portion of the other adhesive tape is stopped by using a leading tape attached to the base material surface of the adhesive tape that is rolled onto the disc. After the terminal portion of one adhesive tape is folded back, the adhesive surface of the leading tape and the adhesive surface of the terminal portion of one adhesive tape are overlapped, and the overlapped portion is heated and pressed. When the invention described in the third scope of the patent application is the same as the invention described in the first scope of the patent application, the new adhesive tape can be easily attached to the adhesive device, and it can be replaced with a new one in less time. Adhesive material plate can improve the production efficiency of electronic equipment. In addition, because the front end of the adhesive tape is used to adhere all the terminal portions of the rolled adhesive tape and the beginning of the newly installed adhesive tape, it is very easy to perform the adhesion between the adhesive tapes. The invention described in item 4 of the scope of the patent application is used to connect a substrate coated with an electrode connection adhesive to a roll of one of the adhesive tapes on one of the discs and a roll of the other to the other disc. Adhesive material tape connection method of one adhesive tape, characterized in that the other end of the adhesive material tape (5) (5) 200409405 uses the adhesive tape base which is used to attach the leading tape to the disk. Stop the material surface, make the adhesive side of the leading tape and the adhesive side of the terminal part of one side of the adhesive tape overlap, and apply heat and pressure to the overlapped part. When the invention described in the fourth patent scope of this application is the same as the invention described in the first patent scope, the new adhesive tape can be easily attached to the adhesive device, and it can be replaced with a new one in less time. Adhesive material plate can improve the production efficiency of electronic equipment. In addition, because it is not necessary to fold back all the adhesive tape that is rolled out, the adhesive tape can be prevented from being scattered when the adhesive tape is wound up to the take-up tray. The invention described in item 5 of the scope of the patent application is for connecting the adhesive coated tape for electrode connection on the substrate to one of the adhesive tapes wound on one of the disks, and the other wound on the other disk. The adhesive tape connection method of one adhesive tape is characterized in that the terminal portion of one adhesive tape and the start end of the other adhesive tape are overlapped, and a locking pin is inserted at the overlapping portion of the two Implement the connection. In the invention described in the fifth item of this patent application, since the terminal part of all the rolled adhesive tape and the beginning of the newly installed adhesive tape are fixed by the locking pin, the connection is very simple. In addition, because there is no need to change the take-up tape every time a new adhesive tape is replaced, the operation of setting the beginning of the new adhesive tape to the take-up tray, and the operation of setting guide pins in a specific path, etc. The new adhesive material plate can be replaced in less time, so the production efficiency of electronic equipment can be improved. The invention described in item 6 of the scope of the patent application uses a locking member to connect the 10- (6) (6) 200409405 connection to the substrate and the electrode coated adhesive is wound onto one of the disks. The adhesive material tape connection method of the adhesive material tape and the adhesive material tape wound on the other party's disk on the other party's disk is characterized in that the locking member has a disposition on one end and the other end. The claw portion and the elastic member disposed between the claw portions, the terminal portion of the adhesive tape on one side and the beginning portion of the adhesive tape on the other side will abut each other, and the claw portion disposed on one end of the locking member will be stuck. The terminal portion of the adhesive material tape stopped on one side, the claw portion arranged on the other end will be locked on the beginning end portion of the adhesive material tape on the other side, and the claw portions of the two sides are approached by the elastic member. In the invention described in claim 6 of this application, the claw portion of one of the locking members is locked at the terminal portion of the adhesive tape of one side, and the claw portion of the other locking member is locked at the other The first end of the adhesive tape is connected to each other, so the connection is very easy. In addition, since there is an elastic member between one claw portion and the other claw portion, the elastic member can be extended so that the other claw portion of the locking member is locked at any one of the starting ends of the adhesive tape of the other Position, but a connection with a high degree of freedom. In addition, since the terminal portion of one adhesive tape and the beginning of the other adhesive tape are connected to each other in a state where they are in contact with each other, the tapes need not be overlapped with each other, and the connection can be performed at the minimum necessary position. Prevent waste of adhesive tape. The invention described in item 7 of the scope of the patent application is for connecting an adhesive tape on one substrate to a substrate coated with an electrode connection adhesive coated on the substrate, and another adhesive tape wound on the other disk. Adhesive material tape connection method on one side-(7) (7) 200409405 Adhesive material tape connection method, characterized in that the terminal portion of one adhesive material tape and the beginning end portion of the other adhesive material tape overlap, and The elastically deformable clip in the shape of a cross section is clamped and fixed by overlapping the two parts. When applying the invention described in item 7 of this patent scope, since only the terminal part of the adhesive tape of one side and the overlapping part of the beginning of the adhesive tape of the other side can be connected with a clip, the connection operation is very It is easy to apply for the invention described in item 8 of the scope of patent application, which is characterized by sandwiching the overlapping portion of one adhesive tape and the other adhesive tape with a metal holding sheet with a shape of a cross section]. Press the fan clamps from both sides of the overlap to connect the two. In the invention described in the eighth aspect of the patent application, since the clamping pieces are pressed from both sides of the overlapping portion to connect the two, the connection strength of the overlapping portion of the adhesive tape can be improved. The invention described in item 9 of the scope of the patent application is for connecting an adhesive tape for one side of a substrate coated with an electrode connection adhesive to a substrate, and the other is wound onto another disk. The adhesive tape connection method of one adhesive tape is characterized in that the adhesive surface of one of the terminal portion of one adhesive tape and the beginning of the other adhesive tape overlaps the other side. On the substrate surface, the overlap length of the two is in the range of 2 to 50 times the width of the adhesive tape, and the two are connected by heating and pressing. When the invention described in item 9 of the scope of this application is applied, the terminal part of the used adhesive tape and the newly installed adhesive material are adhered with the adhesive of the adhesive -12- (8) (8) 200409405 tape. The beginning of the tape is used to replace the adhesive material plate, so it is very easy to attach the new adhesive material plate to the adhesive device. In addition, because there is no need to change the reeling tray every time a new adhesive material tray is replaced, and to install the new end of the new adhesive material to the reeling tray, it only takes less time to replace the new adhesive material tray. Improve the production efficiency of electronic equipment. The length of the overlapped part is 2 to 50 times the width of the adhesive tape. The reason is as follows. If the length is less than 2 times, sufficient connection strength cannot be obtained. If it is greater than 50 times, the adhesive used in the connection part will increase too much. This results in waste of adhesive materials. If the connection part is heated and pressed, if a heating and pressure head equipped with an adhesive device with an adhesive material plate is used, the adhesive device can be reasonably used. The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or may be an insulating adhesive alone, or may be one in which insulating spacer particles are dispersed in these adhesives. The invention described in item 10 of the scope of the patent application is used to connect the adhesive coated with the electrode connection adhesive on the substrate to one of the adhesive tapes on one of the disks, and the adhesive to the other disk. The adhesive material tape connecting method of the other adhesive material tape is characterized in that the terminal portion of one adhesive material tape is folded toward the opposite direction of the adhesive, and the other end of the adhesive material tape is folded toward the adhesive. In the direction, the bent portions of the two are locked and overlapped with each other, and the adhesive material surfaces of the two are opposed to each other, and the overlapped portions are heated and pressed. When the invention described in item 10 of the patent scope of this application has the same function and effect as the invention described in item 1 of -13- (9) (9) 200409405, the terminal part of one adhesive tape and The other ends of the adhesive tapes on the other side will form hook-like latches with each other, and the adhesive faces of the two will be connected to each other, so they have a stronger connection strength. The invention described in item 11 of the patent application scope is the invention described in item 9 or 丨 0 of the patent application scope, and the end portion of one side of the adhesive tape is marked with an end mark. When the invention described in item 11 of this patent application has the same function and effect as the invention described in item 9 or 10 of the patent application, the end portion of the adhesive tape with S as one side uses the end mark portion. Fortunately, the part of the λ line connection operation is easy to untie and can be connected using the minimum necessary position #%, which can prevent the waste of adhesive tape. In addition, it can automatically detect the "$$ mark" part, so the detection signal control device can be used. If an alarm can be issued, the operation efficiency can be improved. The invention described in item 12 of the scope of patent application is the invention described in any one of items 9 to 1 of the scope of patent application, and is characterized in that a mold forming one of the unevenness and the other engaged with the mold In the mold, the overlapped part of the adhesive tape of one side and the adhesive tape of the other side is sandwiched, and heating and pressing are performed. When the invention described in item 12 of this patent application has the same effect as the invention described in any one of claims 9 to 11 of the patent application, the connection part can be expanded because of unevenness. At the same time, the connection strength of the adhesive material tape in the tensile direction (longitudinal direction) can be improved by engaging the concave and convex portions. -14- (10) (10) 200409405 The invention described in item 13 of the scope of patent application is the invention described in any one of the scope of patent applications 9 to 11 and is characterized in that the adhesive material on one side is After the overlapping portion of the adhesive tape and the adhesive tape of the other side forms a through hole, the overlapping portion is heated and pressed. When the invention described in item 13 of this patent application has the same function and effect as the invention described in any one of item 9 to 11 of patent application, the connection part will form through holes and adhesives. It will ooze out to the inner edge of the through hole and increase the adhesion area of the adhesive, so the connection strength can be further improved. The invention described in item 4 of the scope of the patent application is used to connect a silicon-treated substrate coated with an electrode connection adhesive and wound to one of the adhesive tapes on one of the disks and to the other disk. The adhesive material tape connection method of the other adhesive material tape is characterized in that the terminal portion of the adhesive material tape of one side and the beginning end portion of the adhesive material tape of the other are overlapped or abutted to span the two adhesive material tapes. A silicon adhesive tape is attached to the surface portion of the silicon-treated substrate to implement the connection between two adhesive tapes. In the invention described in item 14 of the scope of this patent application, an adhesive material disk on which one adhesive material tape has been wound, and a winding disk on which only the substrate of the adhesive material tape has been wound are attached to an adhesive device, and the adhesive material When the adhesive tape of the tray is used up, the terminal part of the used adhesive tape (one adhesive tape) and the starting end of the newly installed adhesive tape (the other adhesive tape) It will be connected with sand adhesive tape, and the new adhesive material plate will replace the used adhesive material plate and be mounted on the adhesive device. In the present invention, it is only necessary to connect the used adhesive tape and the new adhesive material. -15- (11) 200409405 The adhesive tape can be replaced, so the new adhesive material plate can be easily mounted on the adhesive device. In addition, because there is no need to change the take-up tray every time a new adhesive material tray is replaced, or to install the beginning of the new adhesive tape to the take-up tray and guide the operation of the adhesive tape, it takes less time. Replacement of new adhesive material tray 'can improve the production efficiency of electronic equipment.

黏著材膠帶之基材係利用矽實施表面處理，使用之粘 著膠帶亦使用矽粘著劑，可減少兩者之表面張力的差異而 提高密著力，故可實現傳統上較困難之兩者的黏著。 黏著材膠帶之黏著劑可以爲將導電粒子分散於絕緣性 黏著劑中之向異導電性黏著者，亦可以爲只有絕緣性黏著 劑者’或者，將絕緣性隔件粒子分散於這些黏著劑中者。 申請專利範圍第1 5項記載之發明，其特徵爲，申請 專利範圍第1 4項記載之矽粘著膠帶之粘著劑面之表面張 力及黏著材膠帶之矽處理基材之表面張力之差爲10 mN/m (10dyne/cm)以下。The base material of the adhesive tape is surface treated with silicon, and the adhesive tape used also uses silicon adhesive, which can reduce the difference in surface tension between the two and improve adhesion, so it can achieve the traditionally difficult two. Sticky. The adhesive of the adhesive tape may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or it may be only an insulating adhesive 'or the insulating spacer particles may be dispersed in these adhesives. By. The invention described in item 15 of the scope of patent application is characterized by the difference between the surface tension of the adhesive surface of the silicon adhesive tape and the surface tension of the silicon-treated substrate of the adhesive tape described in item 14 of the patent scope. It is 10 mN / m (10dyne / cm) or less.

此申請專利範圍第1 5項記載之發明時，除了具有和 申請專利範圍第1 4項記載之發明相同之作用效果以外， 因爲矽粘著膠帶之粘著劑面之表面張力及黏著材膠帶之矽 處理基材之表面張力之差爲l〇mN/m(10dyne/cm)以下， 可獲得較強之密著力，而可確實黏著兩者。表面張力係以 潮濕試劑或接觸角來檢測。 黏著材膠帶之矽處理基材及矽粘著膠帶之粘著劑面的 表面張力差應爲 〇〜5mN/m(5dyne/cm)。表面張力之差 愈小愈好，若超過1 〇mN/m ( 1 Odyne/cm )則可能無法獲得 -16- (12) (12)200409405 充分密著強度。 申請專利範圍第1 6項記載之發明，係如申請專利範 圍第2項記載之發明，其特徵爲，矽粘著膠帶之黏著力係 100g/25mm 以上。 此申請專利範圍第1 6項記載之發明時，除了具有和 申請專利範圍第2項記載之發明相同之作用效果以外，一 方及另一方之黏著材膠帶的連接係利用對兩者之黏著劑面 張貼矽粘著膠帶來實施黏著，一方及另一方之黏著材膠帶 可獲得兩面之黏著（或密著），故可以高強度實施黏著。 尤其是，因爲黏著力爲100g/25mm以上，一方及另 一方之黏著材膠帶之兩黏著劑面的黏著會更爲強固。 黏著強度愈大可得到愈強之黏著強度，然而，小於 100g/2 5mm則可無法獲得特定強度。 申請專利範圍第1 7項記載之發明，其特徵爲，使一 方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端部 重疊或抵接，並將申請專利範圍第1 6項記載之矽粘著膠 帶張貼於兩黏著材膠帶之兩面來實施連接。 此申請專利範圍第1 7項記載之發明時，除了具有和 申請專利範圍第1 6項記載之發明相同之作用效果以外， 係以其兩面實施一方及另一方之黏著材膠帶之連接，故"丨 得到更爲強固之連接。 申請專利範圍第1 8項記載之發明，係用以連接矽處 理基材上塗布著電極連接用黏著劑之捲取至一方之盤上广 一方之黏著材膠帶、及捲取至另一方之盤上之另一方广趴 Μ -17- (13) (13)200409405 著材膠帶的黏著材膠帶連接方法’其特徵爲，以一方之黏 著材膠帶之終端部及另〜方之黏著材膠帶之始端部間夾著 兩面塗布著砂粘著劑之矽粘著膠帶之方式來實施兩黏著材 膠帶之連接’兩面之矽粘著劑和矽基材之表面張力之差爲 10mN/m( lOdyne/cm)以下，且黏著力爲 1()()g/25mm 以上 c 此申請專利範圍第1 8項記載之發明時，因爲使用兩 面粘著劑之矽粘著膠帶，而可以一方及另一方之黏著材膠 帶間夾著兩面矽粘著膠帶之方式來實施兩者之黏著（或密 著），故兩者之連接十分簡單且容易。 申請專利範圍第1 9項記載之發明，係用以連接基板 上塗布著電極連接用黏著劑之捲取至一方之盤上之一方之 黏著材膠帶、及捲取至另一方之盤上之另一方之黏著材膠 帶的黏著材膠帶連接方法，其特徵爲，一方之黏著材膠帶 之終端部、及另一方之黏著材膠帶之始端部會重疊或抵接 ，使糊狀之樹脂製黏著劑附著於重疊部份或抵接部份，並 以糊狀之樹脂製黏著劑之硬化來實施兩者之連接。 此申請專利範圍第1 9項記載之發明時，因爲已用完 之黏著材膠帶之終端部、及新裝著之黏著材膠帶之始端部 係以糊狀之樹脂製黏著劑實施固定，故連接十分簡單。又 ，因爲無需在每次更換新黏著材膠帶時都更換捲取膠帶、 將新黏著材膠帶之始端裝設至捲取盤之作業、以及在特定 路徑設定導引銷等之作業，只需要較少時間即可更換新黏 著材盤，故可提高電子機器之生產效率。 -18- (14) (14)200409405 因爲一方之黏著材膠帶之終端部、及另一方之黏著材 膠帶之始端部的重疊部份或抵接部份附著著樹脂製黏著劑 ，故連接具有高自由度。 申請專利範圍第2 0項記載之發明，係如申請專利範 圍第1 9項記載之發明’其特徵爲，樹脂製黏著劑係從熱 硬化性樹脂、光硬化性樹脂、及熱金屬黏著劑之群組中選 取之至少1種材料所構成。 此申請專利範圍第20項記載之發明時，除了具有和 申請專利範圍第1 9項記載之發明相同之作用效果以外， 因爲可從熱硬化性樹脂、光硬化性樹脂、熱金屬黏著劑之 群組中選取適合用於黏著材膠帶間之連接的樹脂製黏著劑 ，故可提高黏著材膠帶間之連接強度。 申請專利範圍第2 1項記載之發明，其特徵爲，裝著 著黏著材膠帶之黏著裝置上，裝設著用以供應申請專利範 圍第1 9或2 0項記載之樹脂製黏著劑的充塡機。 此申請專利範圍第2 1項記載之發明時，因爲黏著裝 置內配設著用以供應申請專利範圍第1 9或2 0項記載之樹 脂製黏著劑的充塡機，故無另行準備充塡機，而可防止連 接作業之浪費。 又，黏著裝置內除了充塡機以外，亦可具有以實施熱 硬化性樹脂之硬化爲目的之加熱器、或以實施光硬化性樹 脂之光照射爲目的之紫外線。 申請專利範圍第22項記載之發明，係用以將基材上 塗布著電極連接用黏著劑之黏著材膠帶捲取至盤之黏著材 -19- (15) (15)200409405 膠帶盤，其特徵爲，黏著材膠帶盤在膠帶之寬度方向配設 著複數黏著材膠帶之捲部。 此申請專利範圍第22項記載之發明時，因爲配設著 複數黏著材膠帶之捲部（捲部），複數之捲部當中，捲取 至一方之捲部之黏著材膠帶之全部捲出時，會將配置於全 部捲出之捲部之旁邊的另一方之捲部之黏著材膠帶裝設至 捲取盤。 如此，因爲一方之黏著材膠帶全部捲出時，會將另一 方之黏著材膠帶裝設至捲取盤，而實施黏著材膠帶之更換 ，故無需將新黏著材膠帶盤裝著至黏著裝置上。因此，新 黏著材膠帶盤之更換作業會較少，故可提高電子機器之生 產效率。 因爲可依序使用捲取至複數捲部之黏著材膠帶，無需 增加1個黏著材膠帶盤之黏著材膠帶的捲數，即可大幅增 加1次更換作業之可使用的黏著劑量。又，因爲無需增加 黏著材膠帶之捲數，故可防止捲取散亂，同時，可防止黏 著劑從膠帶之寬度方向滲出而使已捲取之黏著材膠帶間發 生黏著，亦即，可防止阻塞，而且，亦可防止因爲基材較 長而容易發生之伸展等弊病。 申請專利範圍第2 3項記載之發明，係如申請專利範 圍第22項記載之發明，其特徵爲，一方之黏著材膠帶之 終端部及另一方之黏著材膠帶之始端部間，具有用以連接 兩者之連結膠帶，一方之黏著材膠帶之全部捲出時，會接 著開始捲出另一方之黏著材膠帶。 -20- (16) (16)200409405 此申請專利範圍第2 3項記載之發明時，除了具有和 申請專利範圍第2 2項記載之發明相同之作用效果以外， 因爲一方之黏著材膠帶之終端部及另一方之黏著材膠帶之 始端部係以連結膠帶實施連接，無需在一方之捲部之黏著 材膠帶之全部捲出後將另一方之捲部之黏著材膠帶裝設至 捲取盤上之作業，故可進一步提高電子機器之生產效率。 申請專利範圍第2 4項記載之發明，係具有申請專利 範圍第23項記載之黏著材膠帶盤、黏著材膠帶之捲取盤 、配設於黏著材膠帶盤及捲取盤之間且以加熱加壓頭將黏 著材膠帶之黏著材壓著至電子機器之電路基板的壓著部、 以及用以檢測連結膠帶之膠帶檢測手段的黏著裝置，其特 徵爲，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通過 壓著部爲止，會將連結膠帶捲取至捲取盤。 此申請專利範圍第24項記載之發明時，因爲連結膠 帶會自動捲取至捲取盤，故一方之捲部之黏著材膠帶全部 捲出後，會依序從下一捲部捲出黏著材膠帶。 又，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通 過壓著部爲止，會自動將連結膠帶捲取至捲取盤，故可省 略捲取之麻煩。 又，黏著裝置具有膠帶檢測手段，係由成對之發光部 及受光部所構成，用以實施連結膠帶之光學檢測。另一方 面，連結膠帶之兩端配設著有顏色之（例如黑色）標記， 受光部會利用發光部發出之雷射光檢測連結膠帶兩端之標 記來檢測連結膠帶。又，除了在連結膠帶附加標記以外， -21 - (17) 200409405 可採用使連結膠帶之寬度和黏著材膠帶之寬度不同的方法 、或在連結膠帶上形成複數之孔的方法。 申請專利範圍第2 5項記載之發明，係利用卡止具連 接一方之黏著材膠帶之終端部及另一方之黏著材膠帶之始 端部的黏著材膠帶盤，其特徵爲，連接部份係以黏著材膠 帶覆蓋卡止具。The invention described in item 15 of this patent application has the same effect as the invention described in item 14 of the patent application, except for the surface tension of the adhesive surface of the silicon adhesive tape and the adhesive tape. The difference in surface tension of the silicon-treated substrate is 10 mN / m (10 dyne / cm) or less, a strong adhesion can be obtained, and both can be surely adhered. Surface tension is measured with moist reagents or contact angles. The difference in surface tension between the silicon-treated substrate of the adhesive tape and the adhesive surface of the silicon adhesive tape should be 0 to 5 mN / m (5dyne / cm). The smaller the surface tension difference, the better. If it exceeds 10 mN / m (1 Odyne / cm), it may not be possible to obtain -16- (12) (12) 200409405 sufficient adhesion strength. The invention described in item 16 of the patent application scope is the invention described in item 2 of the patent application scope, characterized in that the adhesive force of the silicon adhesive tape is 100 g / 25 mm or more. When the invention described in item 16 of this patent application has the same effect as the invention described in item 2 of the patent application, the connection of the adhesive tape of one and the other uses the adhesive surface of the two. Silicone adhesive tape is used for adhesion. One or the other adhesive tape can obtain adhesion (or adhesion) on both sides, so it can be adhered with high strength. In particular, because the adhesive force is 100g / 25mm or more, the adhesion of the two adhesive surfaces of the adhesive tape of one side and the other will be stronger. The greater the adhesive strength, the stronger the adhesive strength can be obtained, however, less than 100g / 2 5mm cannot obtain a specific strength. The invention described in item 17 of the scope of the patent application is characterized in that the terminal portion of the adhesive tape of one side and the beginning of the other side of the adhesive tape are overlapped or abutted. Silicone adhesive tape is affixed on both sides of the two adhesive tapes for connection. When the invention described in item 17 of this patent application has the same effect as the invention described in item 16 of the patent application, the adhesive tape of one and the other is connected on both sides. Therefore, " 丨 Get a stronger connection. The invention described in item 18 of the scope of the patent application is for connecting a silicon-treated substrate coated with an electrode connection adhesive to a roll of one adhesive tape on one side and a roll of the adhesive tape to the other side. The other party can lie on the other side. M -17- (13) (13) 200409405 Adhesive tape connection method of adhesive tape 'It is characterized by the terminal part of one adhesive tape and the beginning of the other ~ adhesive tape Between the two sides, a silicon adhesive tape coated with a sand adhesive is used to connect the two adhesive tapes. The difference in surface tension between the silicon adhesive on both sides and the silicon substrate is 10 mN / m (lOdyne / cm ) Below, and the adhesive force is 1 () () g / 25mm or more. C When applying the invention described in item 18 of the patent scope of this application, one side and the other side can be adhered by using the silicon adhesive tape with double-sided adhesive. The two sides of the silicon adhesive tape are used to implement the adhesion (or adhesion) of the two sides, so the connection between the two is very simple and easy. The invention described in item 19 of the scope of the patent application is used to connect the substrate coated with the electrode connection adhesive to the one side of the adhesive tape wound on one of the disks and the other to the other disk. The adhesive tape connection method of one adhesive tape is characterized in that the terminal portion of one adhesive tape and the beginning end of the other adhesive tape overlap or abut, so that a paste-like resin adhesive is attached. At the overlapped part or the abutment part, the two are connected by the hardening of the pasty resin adhesive. In the invention described in item 19 of this application, the terminal portion of the used adhesive tape and the beginning of the newly installed adhesive tape are fixed with a paste-like resin adhesive, so the connection is made. It's very simple. In addition, because there is no need to change the winding tape every time a new adhesive tape is replaced, the operation of setting the beginning of the new adhesive tape to the take-up tray, and setting the guide pin in a specific path, etc. The new adhesive material plate can be replaced in less time, so the production efficiency of electronic equipment can be improved. -18- (14) (14) 200409405 Because the terminal part of the adhesive tape on one side and the beginning or end of the adhesive tape on the other side are covered with a resin adhesive, the connection has high Degrees of freedom. The invention described in item 20 of the scope of application for patent is the invention described in item 19 of the scope of application for patent, which is characterized in that the resin adhesive is made of a thermosetting resin, a photocurable resin, and a hot metal adhesive. Consists of at least one material selected from the group. The invention described in item 20 of this patent application has the same functions and effects as the invention described in item 19 of the patent application, because it can be used from the group of thermosetting resins, photocuring resins, and hot metal adhesives. In the group, a resin adhesive suitable for the connection between the adhesive tapes is selected, so the connection strength between the adhesive tapes can be improved. The invention described in item 21 of the scope of patent application is characterized in that the adhesive device equipped with an adhesive tape is provided with a resin supply for supplying the resin adhesive described in item 19 or 20 of the scope of patent application.塡 机. When the invention described in the scope of patent application No. 21 of this application, the filling device is equipped with a filling machine for supplying the resin adhesive described in the scope of patent application No. 19 or 20, so no separate preparation is required. Machine, which prevents wasted connection work. In addition to the filling machine, the adhesive device may include a heater for the purpose of curing the thermosetting resin or ultraviolet rays for the purpose of light irradiation of the photocurable resin. The invention described in item 22 of the scope of patent application is for winding the adhesive material tape coated with the electrode connection adhesive on the substrate to the adhesive material of the tray. 19- (15) (15) 200409405 The adhesive tape tray is provided with a plurality of rolls of the adhesive tape in the width direction of the tape. In the invention described in item 22 of this application, because a plurality of rolls (rolls) of the adhesive tape are provided, among the plurality of rolls, all of the adhesive tapes wound up to one of the rolls are rolled out. , The adhesive tape arranged on the other side of the roll section beside all the rolled sections will be installed on the take-up tray. In this way, since the adhesive tape of one side is completely rolled out, the adhesive tape of the other side is mounted on the take-up tray, and the replacement of the adhesive tape is performed, so there is no need to attach a new adhesive tape to the adhesive device. . Therefore, the replacement operation of the new adhesive tape tape will be less, so the production efficiency of electronic equipment can be improved. Because the adhesive tape that is rolled up to multiple rolls can be used in sequence, there is no need to increase the number of adhesive tapes of an adhesive tape tray, which can greatly increase the amount of adhesive that can be used in one replacement operation. In addition, since it is not necessary to increase the number of rolls of the adhesive material tape, it can prevent the coiling from being scattered, and at the same time, can prevent the adhesive from seeping out from the width direction of the adhesive tape and cause adhesion between the rolled adhesive material tapes, that is, can prevent Blockage can also prevent ill effects such as stretching that can easily occur due to long substrates. The invention described in item 23 of the scope of patent application is the invention described in item 22 of the scope of patent application, which is characterized in that between the terminal portion of one adhesive tape and the beginning of the other adhesive tape When the two adhesive tapes connecting the two are rolled out, the other adhesive tape will then be rolled out. -20- (16) (16) 200409405 When the invention described in item 23 of this patent application has the same effect as the invention described in item 22 of the patent application, it is because of the terminal of the adhesive tape The first end of the adhesive tape of the other part and the other side is connected by a connecting tape. It is not necessary to install the adhesive tape of the other roll part on the take-up tray after the entire adhesive tape of the one roll part is rolled out. Operations, it can further improve the production efficiency of electronic equipment. The invention described in item 24 of the scope of the patent application has the adhesive tape tray, the take-up tray of the adhesive tape described in item 23 of the patent scope, and is disposed between the adhesive tape tray and the take-up tray and is heated. The pressurizing head presses the adhesive material of the adhesive material tape to the pressing portion of the circuit board of the electronic device, and the adhesive device for detecting the adhesive tape detection means. When the adhesive tape detection means detects the adhesive tape, The connecting tape is wound up to the take-up tray until the connecting tape passes through the pressing portion. When the invention described in item 24 of this patent application is applied, the connecting tape is automatically wound up to the take-up tray. Therefore, after all the adhesive tapes of one roll part are rolled out, the adhesive materials are sequentially rolled out from the next roll part. tape. In addition, when the connecting tape is detected by the tape detecting means, the connecting tape is automatically wound up to the take-up disc until the connecting tape passes through the crimping portion, so the trouble of winding can be omitted. In addition, the adhesive device has a tape detection means, which is composed of a pair of a light-emitting portion and a light-receiving portion, and is used to perform optical detection of the connecting tape. On the other hand, both ends of the connecting tape are provided with colored (for example, black) marks, and the light receiving section detects the marks on both ends of the connecting tape using laser light emitted from the light emitting section. In addition to adding a mark to the connecting tape, -21-(17) 200409405 can be a method in which the width of the connecting tape is different from the width of the adhesive tape, or a method of forming a plurality of holes in the connecting tape. The invention described in item 25 of the scope of the patent application is an adhesive tape tray that connects the terminal part of one adhesive tape with the start end of the other adhesive tape with a stopper. The connection part is characterized by Adhesive tape covers the clip.

此申請專利範圍第2 5項記載之發明時，因爲利用卡 止具來連接全部捲出之黏著材膠帶之終端部及新裝著之黏 著材膠帶之始端部，實施黏著材膠帶盤之更換，故將新黏 著材膠帶盤裝著至黏著裝置十分簡單。又，因爲無需在每 次更換新黏著材膠帶盤時都更換捲取膠帶、將新黏著材膠 帶之始端裝設至捲取盤之作業、以及在特定路徑設定導引 銷等之作業，只需較少時間即可更換新黏著材膠帶盤，故 可提高電子機器之生產效率。In the invention described in item 25 of this patent application, because the terminal part of all the rolled adhesive tape is connected with the start end of the newly installed adhesive tape by using a locking device, the adhesive tape tray is replaced. Therefore, it is very easy to mount the new adhesive tape to the adhesive device. In addition, because there is no need to change the take-up tape every time a new adhesive tape tray is replaced, the operation of installing the new end of the new adhesive tape to the take-up tray, and setting the guide pin in a specific path, etc. The adhesive tape reel can be replaced with a new one in less time, so the production efficiency of electronic equipment can be improved.

因爲係依序使用黏著材膠帶，無需增加1個黏著材膠 帶盤之黏著材膠帶的捲數，即可大幅增加1次更換作業之 可使用的黏著劑量。又，因爲無需增加黏著材膠帶之捲數 ，故可防止捲取散亂，同時，可防止黏著劑從膠帶之寬度 方向滲出而使已捲取之黏著材膠帶間發生黏著，亦即，可 防止阻塞，而且，亦可防止因爲基材較長而容易發生之伸 展等弊病。 又，一方之黏著材膠帶之終端部及另一方之黏著材膠 帶之始端部之連接部份，因爲係以黏著材膠帶覆蓋卡止具 ，故外觀良好，同時，可防止連接部份之卡止具接觸黏著 -22- (18) (18)200409405 材膠帶而傷害到黏著材膠帶、或卡止具傷害到黏著裝置之 加熱加壓頭或支持台等構成構件。 又’以黏著材膠帶覆蓋卡止具之方法，應爲在以卡止 具連接一方之黏著材膠帶之終端部及另一方之黏著材膠帶 之始端部後，將連接部份朝膠帶之縱向反折〗8 〇度，使黏 著材膠帶覆蓋卡止具。 又’亦可以其他黏著材膠帶捲住連接部份來覆蓋卡止 具 ° 申請專利範圍第2 6項記載之發明，係具有申請專利 範圍第1項記載之黏著材膠帶盤、黏著材膠帶之捲取盤、 配設於黏著材膠帶盤及捲取盤之間且以加熱加壓頭將黏著 材膠帶之黏著材壓著至電子機器之電路基板的壓著部、以 及用以檢測膠帶之連接部份的連接部檢測手段之黏著裝置 ’其特徵爲，連接部檢測手段檢測到膠帶之連接部份時， 至連接部份通過壓著部爲止，會將一方之黏著材膠帶捲取 至捲取盤。 此申請專利範圍第2 6項記載之發明時，連接部檢測 手段若檢測到連接部份，則因爲至連接部份通過壓著部爲 止’會將一方之黏著材膠帶捲取至捲取盤，故可防止連接 部份到達壓著部時實施壓著動作之問題。又，至連接部份 通過壓著部爲止，因爲會自動將一方之黏著材膠帶捲取至 捲取盤，故可省略捲取之麻煩。 申請專利範圍第27項記載之發明，係如申請專利範 圍第2 6項記載之發明，其特徵爲，連接部檢測手段係 -23- (19) (19)200409405 c c D攝影機、厚度檢測感測器、及透射率檢測感測器之 其中之一。 此申請專利範圍第2 7項記載之發明時，除了具有和 申請專利範圍第2 6項記載之發明相同之作用效果以外， 以簡單之構成即可實施連接部份之檢測，而且，可利用這 些手段提高檢測精度。 例如’採用CCD攝影機做爲連接部檢測手段時，可 使連接部份之表面顯示於監視畫面，以比較圖素之濃淡來 檢測連接部份。又，採用厚度檢測感測器時，因爲連接部 份之厚度會大於黏著材膠帶之厚度，因可以比較厚度之變 化來檢測連接部份。又，採用透射率感測器時，會因爲連 接部份之厚度較厚，且因爲有卡止具而使透射率降低，故 可以比較透射率之値來檢測連接部份。 申請專利範圍第2 8項記載之黏著材膠帶連接方法， 其特徵爲，利用卡止具連接一方之黏著材膠帶之終端部及 另一方之黏著材膠帶之始端部，連接部份會以黏著材膠帶 覆蓋卡止具。 此申請專利範圍第2 8項記載之發明時，係利用卡止 具連接全部捲出之黏著材膠帶之終端部及新裝著之黏著材 膠帶之始端部來實施黏著材膠帶盤之更換，故將新黏著材 膠帶盤裝著至黏著裝置十分簡單。又，因爲無需在每次更 換新黏著材膠帶盤時都更換捲取膠帶、將新黏著材膠帶之 始端裝設至捲取盤之作業、以及在特定路徑設定導引銷等 之作業，只需較少時間即可更換新黏著材膠帶盤，故可提 -24- (20) (20)200409405 高電子機器之生產效率。 因爲係依序使用黏著材膠帶，無需增加1個黏著材膠 帶盤之黏著材膠帶的捲數，即可大幅增加1次更換作業之 可使用的黏著劑量。又，因爲無需增加黏著材膠帶之捲數 ，故可防止捲取散亂，同時，可防止黏著劑從膠帶之寬度 方向滲出而使已捲取之黏著材膠帶間發生黏著，亦即，可 防止阻塞，而且，亦可防止因爲基材較長而容易發生之伸 展等弊病。 又，一方之黏著材膠帶之終端部及另一方之黏著材膠 帶之始端部之連接部份，因爲係以黏著材膠帶覆蓋卡止具 ，故外觀良好，同時，可防止連接部份之卡止具接觸黏著 材膠帶而傷害到黏著材膠帶、或卡止具傷害到黏著裝置之 加熱加壓頭或支持台等構成構件。 又，以黏著材膠帶覆蓋卡止具之方法，應爲在以卡止 具連接一方之黏著材膠帶之終端部及另一方之黏著材膠帶 之始端部後，將連接部份朝膠帶之縱向反折1 8 0度，使黏 著材膠帶覆蓋卡止具。 又，亦可以其他黏著材膠帶捲住連接部份來覆蓋卡止 具。 申請專利範圍第2 9項記載之發明，係在基材上塗布 黏著劑，並捲成盤狀之黏著劑膠帶，其特徵爲，基材上會 在膠帶之縱向上配置著複數條黏著劑。 此申請專利範圍第29項記載之發明時，若使用黏著 劑膠帶’將已捲取黏著劑膠帶之盤及空盤裝著至黏著裝置 -25- (21) (21)200409405 ，對電路基板實施黏著劑之加熱加壓後，並以將基材捲至 空盤之方式裝著。 其次，對電路基板實施黏著劑之加熱加壓時，將配設 於基材之寬度方向的複數條黏著劑當中之]條壓著至電路 基板，壓著後之殘餘黏著劑條會和基材同時被捲取至空盤 。其次，盤上之黏著劑膠帶全部捲出後，會使盤之旋轉方 向逆轉，而使黏著劑膠帶之供應方向逆轉。如此，在各次 使用1條黏著劑後，會同時捲取殘餘之黏著劑及基材，並 重複依序使用殘餘之黏著劑條。因此，因爲會依序逐條使 用複數條黏著劑，故無需增加膠帶之捲數，即可大幅增加 1盤（2倍以上）可使用之黏著劑量。 本發明時，無需增加黏著劑膠帶之捲數，可大幅增加 使用黏著劑量。而且，因爲未增加黏著劑膠帶之捲數，故 可防止捲取散亂，同時，可防止黏著劑從膠帶之寬度方向 滲出而使已捲取之黏著材膠帶間發生黏著，亦即，可防止 阻塞，此外，亦可防止因爲基材較長而容易發生之伸展等 弊病（基材之損傷或切斷）。 因電子構件之製造工廠可減少新黏著劑膠帶之更換次 數，故可提高製造效率。 又，黏著劑膠帶之製造上，因爲每1盤之黏著劑量較 多，可減少盤材及濕氣防止材之使用量’故可降低製造成 本。 又，結束第1條黏著劑之壓著而將黏著劑膠帶捲取至 空盤後，爲了使用下1條黏著劑，不逆轉旋轉方向而更換 -26- (22) (22)200409405 裝著於黏著裝置之2個盤亦可。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑，亦可以爲只有絕緣性黏著劑者，或者， 將絕緣性隔件粒子分散於這些黏著劑中者。 基材之寬度應爲5mm〜1 000mm，然而，可依1條黏 著劑之寬度或黏著劑之條數而任意選取。1條黏著劑之寬 度應爲 〇.5mm〜10.0mm。 基材之寬度應爲 5mm〜1000mm，基材之寬度低於 5mm時，配設於基材上之黏著劑之條數及黏著劑之寬度 會受到制限，大於1 000mm時，則無裝著至既存之黏著裝 置。 申請專利範圍第3 0項記載之發明，係如申請專利範 圍第29項記載之發明，其特徵爲，複數條黏著劑之相鄰 的黏著劑條具有間隔。 此申請專利範圍第3 0項記載之發明時，除了具有和 申請專利範圍第29項記載之發明相同的作用效果以外， 同時，因爲相鄰之黏著劑條間爲互相分離，故容易實施黏 著劑之逐條壓著。 申請專利範圍第3 1項記載之發明，係如申請專利範 圍第29項記載之發明，其特徵爲，黏著劑係利用在膠帶 之縱向上形成縫隙來分離成複數條。 此申請專利範圍第3 1項記載之發明時，除了具有和 申請專利範圍第2 9項相同的作用效果以外，同時，在基 材之單面全面塗布黏著劑，並將黏著劑壓著至電路基板之 -27- (23) (23)200409405 前一瞬間，亦即，在使用黏著劑膠帶之前一瞬間，尙以切 刃等使黏著劑具有切痕之方式來形成縫隙。 又，縫隙之形成上，亦可在製造黏著劑膠帶時，以切 刃等使黏著劑具有切痕而形成縫隙。 縫隙之形成上，除了利用切刃以外，亦可利用雷射或 電熱線等來形成。 本發明時，可增加配置於基材上之黏著劑條的條數。 申請專利範圍第3 2項記載之發明，係在基材上塗布 黏著劑，並將其捲成盤狀之黏著劑膠帶製造方法，其特徵 爲，以在基材之寬度方向具有間隔之方式配置之塗布器， 對以連續方式搬運之基材面上供應黏著劑來對基材實施複 數條黏著劑之塗布。 此申請專利範圍第3 2項記載之發明時，可以利用既 存設備製造如申請專利範圍第3 0項記載之黏著劑膠帶。 塗布器可以爲配設於基材之寬度方向的複數滾筒，亦 可以爲噴嘴。 申請專利範圍第3 3項記載之發明，係在基材上塗布 黏著劑，並將其捲成盤狀之黏著劑膠帶製造方法，其特徵 爲，在一方之基材之單面全面塗布黏著劑，並在黏著劑上 形成縱向之縫隙後，在黏著劑面上配置另一方之基材，以 一方及另一方之基材夾住黏著劑，然後再使一方之基材及 另一方之基材互相分離，一方及另一方之基材上分別交互 貼附著複數條黏著劑，而在一方及另一方之基材上以具有 間隔之方式配置複數條黏著劑。 -28- (24) (24)200409405 此申請專利範圍第3 3項記載之發明時，因爲可以同 時製造2個如申請專利範圍第2項記載之黏著劑膠帶，故 具有良好製造效率。 申請專利範圍第3 4項記載之發明，係在基材上塗布 黏著劑，並利用捲成盤狀之黏著劑膠帶將黏著劑壓著至電 路基板之黏著劑壓著方法’其特徵爲，基材之單面全面會 塗布著黏著劑，對黏著劑膠帶之寬度方向的部份黏著劑從 基材側沿膠帶之縱向實施加熱加壓形成條狀，降低經過加 熱之部份之黏著劑的凝聚力並壓著至電路基板，壓著後， 將殘餘之黏著劑和基材同時捲成盤狀，並再度利用捲成盤 狀之黏著劑膠帶對電路基板實施殘餘之黏著劑的加熱加壓 〇 此申請專利範圍第3 4項記載之發明時，以對部份黏 著劑加熱來降低該部份之凝聚力（以下簡稱爲「凝聚力降 低線」），從凝聚力降低線將經過加熱之部份的黏著劑壓 著至電路基板，而和基材分離。殘餘之黏著劑會保持殘留 於基材上之情形下，和基材同時被捲取至空盤。 本發明時，因爲只是使黏著劑膠帶之寬度較傳統稍爲 寬一點而已，故可直接利用既存設備製造黏著劑膠帶。、 此外，壓著至電路基板之黏著劑寬度，可以改變加熱 區域來進行任意設定，故壓著黏著劑寬度具有較高之自由 度。 又，和申請專利範圍第2 9項記載之發明相同，黏著 劑膠帶全部捲出至空盤時，使盤之旋轉方向逆轉，而使膠 -29- (25) (25)200409405 帶之供應方向逆轉 '或保持盤之旋轉方向但將盤相互交換 。利用此方式，因爲會依逐條對基材上之黏著劑加熱並壓 著至電路基板，可在不增加膠帶之捲數的情形下，大幅增 加1盤可使用之黏著劑量。 又，和申請專利範圍第2 9項記載之發明相同，因爲 未增加捲數卻可增加黏著劑量，故可防止捲取散亂，同時 ’得到可防止因黏著劑之滲出而造成之阻塞、及防止因基 材之伸展而造成之弊病等之效果。 膠帶寬度應爲5mm〜1000mm，壓著至電路基板之黏 者劑應爲〇.5mm〜1.5mm。膠帶寬度爲5mm〜1000mm之 理由如下，因爲膠帶寬度低於5 m m時，每1盤之黏著劑 壓著次數會較少，而大於1000mm時，將無法裝著至既存 之黏著裝置。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑、亦可以爲只有絕緣性黏著劑者、或者將 絕緣性之隔件粒子分散於這些黏著劑中者。 申請專利範圍第3 5項記載之發明，係在基材上塗布 黏著劑，並捲成盤狀之黏著劑膠帶，其特徵爲，黏著劑膠 帶之寬度爲和電路基板之一邊之長度相同或以上，且在膠 帶之寬度方向上配置著複數條黏著劑。 此申請專利範圍第3 5項記載之發明時，係以寬度和 電路基板之一邊重疊的方式來配置黏著劑膠帶，故可直接 沿著電路基板之一邊對配設於黏著劑膠帶之寬度方向的1 條黏著劑實施加熱加壓。 -30· (26) (26)200409405 因爲黏著劑膠帶之寬度爲電路基板之一邊之長度以上 ，黏著劑膠帶只需拉出黏著劑之條寬即可。 其次，將黏著劑壓著至電路基板之一邊後，旋轉電路 基板，使另一邊位於黏著劑膠帶之寬度方向的位置，對另 一邊實施黏著劑條之加熱加壓。如此，依序對電路基板之 其他邊實施黏著劑之壓著，很容易即可對電路基板之四周 實施黏著劑之壓著。 因此，因爲可依序逐條使用具有電路基板之一邊之長 度以上之黏著劑，而一次之使用量爲黏著劑條之寬度尺寸 份，無需增加黏著劑膠帶之捲數，即可大幅增加1盤可使 用之黏著劑量。 而且，因爲未增加黏著劑膠帶之捲數，故可防止捲取 ‘ 散亂，同時，可防止因爲黏著劑從膠帶之寬度方向滲出而 · 使捲取之膠帶間發生黏著所導致之阻塞，此外，亦可防止 因爲基材較長而容易發生之伸展等弊病（基材之損傷或切 斷）。 φ 另一方面，因電子構件之製造工廠可減少新黏著劑膠 帶之更換次數，故可提高製造效率。 又，黏著劑膠帶之製造上，因每1盤之黏著劑量會較 多，可減少盤材及濕氣防止材之使用量，故可降低製造成 本。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著劑，亦可以爲只有絕緣性黏著劑者，或者， 將絕緣性隔件粒子分散於這些黏著劑中者。 -31 - (27) 200409405 黏著劑膠帶之寬度爲電路基板之一邊之尺寸以上，例 如，5mm〜3 00 0mm。又，即使尺寸小於電路基板之一邊 之尺寸的黏著劑膠帶，亦可以在黏著劑膠帶之寬度方向配 置複數條相鄰接之方式來使其具有電路基板之一邊之尺寸 。此時，因很容易即可對應不同尺寸之電路基板故可提高 生產效率。1條黏著劑之寬度應爲例如0.5 mm〜1 0.0 mm。 黏著劑膠帶之寬度爲5mm〜3000mm之理由如下，電 路基板之一邊之尺寸很少會小於 5 m m，而大於 3 0 0 0 m m 時’盤之寬度會太寬，而可能無法裝著至既存之黏著裝置 申請專利範圍第3 6項記載之發明，係如申請專利範 圍第3 5項記載之發明，其特徵爲，以相鄰之黏著劑條具 有間隔之方式配設複數條黏著劑。Because the adhesive tape is used sequentially, it is not necessary to increase the number of adhesive tapes of the adhesive tape reel, which can greatly increase the amount of adhesive that can be used in one replacement operation. In addition, since it is not necessary to increase the number of rolls of the adhesive material tape, it can prevent the coiling from being scattered, and at the same time, can prevent the adhesive from seeping out from the width direction of the adhesive tape and cause adhesion between the rolled adhesive material tapes. Blockage can also prevent ill effects such as stretching that can easily occur due to long substrates. In addition, the connecting portion of the terminal portion of the adhesive tape on one side and the beginning portion of the adhesive tape on the other side has a good appearance because the locking device is covered with the adhesive tape, and at the same time, the locking of the connecting portion can be prevented. Contacting the components such as -22- (18) (18) 200409405 tape may damage the adhesive tape, or the locking fixture may damage the heating and pressure head or the supporting table of the adhesive device. The method of covering the locking device with the adhesive tape should be to connect the terminal part of the adhesive tape of one side and the starting end of the adhesive tape of the other side with the locking device, and then reverse the connecting part toward the longitudinal direction of the tape. Fold it at 80 degrees, so that the adhesive tape covers the clamp. You can also use other adhesive tape to wrap the connection part to cover the locking device. The invention described in the 26th patent application scope is a roll of the adhesive tape tape disk and the adhesive tape described in the first patent application scope. A take-up plate, a pressing portion arranged between the adhesive material tape disk and the take-up disk and pressing the adhesive material of the adhesive material tape to a circuit substrate of an electronic device by a heating and pressing head, and a connecting portion for detecting the adhesive tape It is characterized in that when the connecting portion detecting means detects the connecting portion of the adhesive tape, it will take up one of the adhesive tape to the take-up disk until the connecting portion passes the pressing portion. . When applying the invention described in item 26 of the patent scope, if the connecting part detection means detects the connecting part, it will take up one adhesive tape to the take-up disc until the connecting part passes the pressing part. Therefore, it is possible to prevent the problem that the pressing operation is performed when the connecting portion reaches the pressing portion. In addition, until the connecting portion passes through the crimping portion, one side of the adhesive tape is automatically wound up to the winding plate, so the trouble of winding can be omitted. The invention described in item 27 of the scope of patent application is the invention described in item 26 of the scope of patent application, characterized in that the detection means of the connecting portion is -23- (19) (19) 200409405 cc D camera, thickness detection sensor Sensor and one of the transmittance detection sensors. When the invention described in the 27th patent scope of the present application has the same effect as the invention described in the 26th patent scope, the connection part can be detected with a simple structure, and these can be used Means to improve detection accuracy. For example, when a CCD camera is used as the detection means of the connection part, the surface of the connection part can be displayed on the monitoring screen, and the connection part can be detected by comparing the density of the pixels. In addition, when a thickness detection sensor is used, since the thickness of the connecting portion is larger than the thickness of the adhesive tape, it is possible to compare the change in thickness to detect the connecting portion. In addition, when a transmittance sensor is used, the thickness of the connection part is thicker, and the transmittance is reduced because of the locking device. Therefore, the connection part can be detected by comparing the transmittance. The adhesive material tape connection method described in item 28 of the scope of the patent application is characterized in that the terminal part of the adhesive tape of one side and the beginning of the adhesive tape of the other side are connected by a locking device, and the connecting part is made of adhesive material The tape covers the clips. When the invention described in item 28 of this patent application scope, the terminal part of all the rolled adhesive tape is connected to the start end of the newly installed adhesive tape with a stopper to replace the adhesive tape tray. It is very easy to mount the new adhesive tape to the adhesive device. In addition, because there is no need to change the take-up tape every time a new adhesive tape tray is replaced, the operation of installing the new end of the new adhesive tape to the take-up tray, and setting the guide pin in a specific path, etc. It can be replaced with a new adhesive tape in less time, so it can improve the production efficiency of -24- (20) (20) 200409405. Because the adhesive tape is used sequentially, it is not necessary to increase the number of adhesive tapes of the adhesive tape reel, which can greatly increase the amount of adhesive that can be used in one replacement operation. In addition, since it is not necessary to increase the number of rolls of the adhesive material tape, it can prevent the coiling from being scattered, and at the same time, can prevent the adhesive from seeping out from the width direction of the adhesive tape and cause adhesion between the rolled adhesive material tapes, that is, can prevent Blockage can also prevent ill effects such as stretching that can easily occur due to long substrates. In addition, the connecting portion of the terminal portion of the adhesive tape on one side and the beginning portion of the adhesive tape on the other side has a good appearance because the locking device is covered with the adhesive tape, and at the same time, the locking of the connecting portion can be prevented. The components such as the heating and pressure head or the support table of the adhesive device may be injured by contact with the adhesive tape and may cause damage to the adhesive tape. In addition, the method of covering the locking device with the adhesive tape should be to connect the terminal portion of the adhesive tape of one side and the beginning of the adhesive tape of the other side with the locking device, and then reverse the connecting portion toward the longitudinal direction of the tape. Fold 180 degrees to cover the clamp with adhesive tape. In addition, the connecting portion may be wrapped by other adhesive tape to cover the locking device. The invention described in item 29 of the scope of the patent application is an adhesive tape coated with an adhesive on a substrate and rolled into a disc shape. It is characterized in that a plurality of adhesives are arranged on the substrate in the longitudinal direction of the tape. When the invention described in item 29 of this application, if an adhesive tape is used, the disk and the empty disk on which the adhesive tape has been wound are mounted to the adhesive device -25- (21) (21) 200409405, and the circuit board is implemented. After the adhesive is heated and pressurized, it is mounted by rolling the substrate to an empty tray. Second, when the circuit substrate is heated and pressurized with an adhesive, one of the plurality of adhesives arranged in the width direction of the substrate is pressed onto the circuit substrate, and the remaining adhesive strips after pressing are bonded to the substrate. At the same time it is coiled to an empty disk. Secondly, after all the adhesive tape on the disk is rolled out, the rotation direction of the disk is reversed, and the supply direction of the adhesive tape is reversed. In this way, after using one adhesive each time, the remaining adhesive and the substrate are taken up at the same time, and the remaining adhesive strips are repeatedly used in sequence. Therefore, since a plurality of adhesives are used one by one in order, it is possible to greatly increase the amount of adhesive that can be used on one plate (more than two times) without increasing the number of tapes. In the present invention, there is no need to increase the number of rolls of the adhesive tape, which can greatly increase the amount of adhesive used. In addition, because the number of rolls of the adhesive tape is not increased, the coiling can be prevented from being scattered, and at the same time, the adhesive can be prevented from oozing out from the width direction of the adhesive tape to cause adhesion between the rolled adhesive tapes, that is, can be prevented In addition, blocking can also prevent disadvantages such as stretching that easily occur due to the long substrate (damage or cutting of the substrate). Since the manufacturing plant of electronic components can reduce the number of replacements of new adhesive tapes, manufacturing efficiency can be improved. In addition, in the manufacture of the adhesive tape, since the amount of the adhesive per plate is large, the amount of use of the plate material and the moisture-proof material can be reduced ', thereby reducing the manufacturing cost. In addition, after the pressure of the first adhesive is finished and the adhesive tape is wound up to an empty disk, in order to use the next adhesive, the rotation direction is not reversed and replaced -26- (22) (22) 200409405 Two disks of the adhesive device are also available. The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or it may be an insulating adhesive alone, or an insulating spacer particle may be dispersed in these adhesives. The width of the substrate should be 5mm to 1,000mm. However, it can be arbitrarily selected according to the width of one adhesive or the number of adhesives. The width of one adhesive should be 0.5mm ~ 10.0mm. The width of the substrate should be 5mm ~ 1000mm. When the width of the substrate is less than 5mm, the number of adhesives and the width of the adhesive will be limited. When it is greater than 1 000mm, there is no loading to Existing adhesive device. The invention described in item 30 of the scope of patent application is the invention described in item 29 of the scope of patent application, which is characterized in that the adjacent adhesive strips of the plurality of adhesives have a space. When the invention described in the 30th patent scope of this application has the same function and effect as the invention described in the 29th patent scope, it is easy to implement the adhesive because the adjacent adhesive strips are separated from each other. They are pressed one by one. The invention described in item 31 of the scope of patent application is the invention described in item 29 of the scope of patent application, characterized in that the adhesive is separated into a plurality of pieces by forming a gap in the longitudinal direction of the tape. The invention described in item 31 of this patent application has the same effects as those in item 29 of the patent application except that the adhesive is fully coated on one side of the substrate and the adhesive is pressed to the circuit. -27- (23) (23) 200409405 of the substrate The moment before, that is, immediately before the adhesive tape is used, the gap is formed by cutting the edge of the adhesive with a cutting edge or the like. Moreover, in the formation of the gap, when the adhesive tape is manufactured, the adhesive may be cut with a cutting edge or the like to form a gap. The slits may be formed by using a laser or a heating wire in addition to a cutting edge. In the present invention, the number of the adhesive strips arranged on the substrate can be increased. The invention described in item 32 of the scope of patent application is a method for manufacturing an adhesive tape by applying an adhesive on a substrate and rolling it into a disk shape, and is characterized by being arranged with a gap in the width direction of the substrate. The applicator supplies an adhesive to the surface of the substrate conveyed in a continuous manner to apply a plurality of adhesives to the substrate. When applying the invention described in item 32 of the scope of patent application, the adhesive tape as described in item 30 of the scope of patent application can be manufactured using existing equipment. The applicator may be a plurality of rollers arranged in the width direction of the substrate, or may be a nozzle. The invention described in item 33 of the scope of patent application is a method for manufacturing an adhesive tape by applying an adhesive on a substrate and rolling it into a disc shape, which is characterized in that the adhesive is fully coated on one side of one substrate After forming a longitudinal gap in the adhesive, arrange the other substrate on the adhesive surface, sandwich the adhesive with one and the other substrate, and then make one substrate and the other substrate Separate from each other, a plurality of adhesives are adhered to each other on the substrate of one side and the other, and a plurality of adhesives are arranged on the substrate of one and the other in a spaced manner. -28- (24) (24) 200409405 When applying for the invention described in item 33 of the scope of patent application, two adhesive tapes as described in item 2 of the scope of patent application can be manufactured at the same time, so it has good manufacturing efficiency. The invention described in item 34 of the scope of the patent application is an adhesive pressing method of applying an adhesive on a substrate and pressing the adhesive onto a circuit board using an adhesive tape rolled into a disc shape. The adhesive is coated on one side of the material. Part of the adhesive in the width direction of the adhesive tape is heated and pressed from the substrate side along the longitudinal direction of the tape to form a strip, reducing the cohesion of the heated part of the adhesive. Then, it is pressed to the circuit board. After the pressing, the remaining adhesive and the substrate are rolled into a disk shape at the same time, and the remaining adhesive is heated and pressed on the circuit substrate by using the rolled adhesive tape. When applying for the invention described in item 34 of the patent scope, heating part of the adhesive to reduce the cohesion of the part (hereinafter referred to as "cohesion reducing line"), from the cohesive force reducing line to the heated part of the adhesive It is pressed to the circuit board and separated from the substrate. Residual adhesive will remain on the substrate at the same time as the substrate is taken up to an empty tray. In the present invention, since the width of the adhesive tape is only slightly wider than the conventional one, the adhesive tape can be manufactured directly by using the existing equipment. In addition, the width of the adhesive that is pressed to the circuit board can be changed arbitrarily by changing the heating area, so the width of the adhesive has a high degree of freedom. In addition, as with the invention described in item 29 of the scope of patent application, when all the adhesive tape is rolled out to an empty disk, the rotation direction of the disk is reversed, and the supply direction of the rubber -29- (25) (25) 200409405 is reversed. Reverse 'or keep the direction of rotation of the discs but swap the discs with each other. With this method, since the adhesive on the substrate is heated and pressed to the circuit board one by one, the usable adhesive amount can be increased significantly without increasing the number of tapes. Also, the invention is the same as the invention described in item 29 of the scope of patent application, because the adhesive dose can be increased without increasing the number of rolls, so that the coiling can be prevented from being scattered, and at the same time, the blocking caused by the bleeding of the adhesive can be prevented, The effect of preventing ills caused by stretching of the substrate. The width of the tape should be 5mm ~ 1000mm, and the adhesive pressure to the circuit board should be 0.5mm ~ 1.5mm. The reason why the tape width is 5mm ~ 1000mm is as follows. When the tape width is less than 5mm, the number of pressures of the adhesive per disc will be less, and if it is more than 1000mm, it will not be able to fit the existing adhesive device. The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or may be an insulating adhesive alone, or an insulating spacer particle may be dispersed in these adhesives. The invention described in item 35 of the scope of the patent application is an adhesive tape coated with an adhesive on a substrate and rolled into a disc shape, characterized in that the width of the adhesive tape is the same as or longer than the length of one side of the circuit board A plurality of adhesives are arranged in the width direction of the tape. In the invention described in the 35th item of this patent application, the adhesive tape is arranged in such a way that the width overlaps one side of the circuit board. Therefore, the adhesive tape disposed in the width direction of the adhesive tape can be directly aligned along one side of the circuit board. One adhesive is heated and pressurized. -30 · (26) (26) 200409405 Because the width of the adhesive tape is more than the length of one side of the circuit board, the adhesive tape only needs to be pulled out by the width of the adhesive tape. Next, after pressing the adhesive to one side of the circuit board, the circuit board is rotated so that the other side is located in the width direction of the adhesive tape, and the other side is heated and pressed. In this way, by sequentially pressing the other side of the circuit board with an adhesive, it is easy to press the periphery of the circuit board with an adhesive. Therefore, because the adhesive with the length of one side of the circuit board can be used one by one in sequence, and the amount of use at a time is the width dimension of the adhesive strip, without increasing the number of rolls of adhesive tape, a large increase can be achieved. Usable adhesive dose. In addition, because the number of rolls of the adhesive tape is not increased, the coiling can be prevented from being scattered, and at the same time, the blocking between the wound tapes due to the adhesive from seeping from the width of the tape can be prevented. It can also prevent the disadvantages (such as damage or cutting of the substrate) that are easy to occur due to the long substrate. φ On the other hand, since the manufacturing plant of electronic components can reduce the number of replacements of new adhesive tapes, the manufacturing efficiency can be improved. In addition, in the manufacture of adhesive tapes, the amount of adhesive per disc will be larger, which can reduce the amount of disc material and moisture-proof material used, so the manufacturing cost can be reduced. The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or it may be an insulating adhesive alone, or an insulating spacer particle may be dispersed in these adhesives. -31-(27) 200409405 The width of the adhesive tape is greater than the size of one side of the circuit board, for example, 5mm ~ 300mm. In addition, even if the size of the adhesive tape is smaller than the size of one side of the circuit board, a plurality of adjacent ways can be arranged in the width direction of the adhesive tape to have the size of one side of the circuit board. In this case, since it is easy to support circuit boards of different sizes, production efficiency can be improved. The width of one adhesive should be, for example, 0.5 mm to 1 0.0 mm. The reason why the width of the adhesive tape is 5 mm to 3000 mm is as follows. The size of one side of the circuit board is rarely less than 5 mm, and when it is greater than 300 mm, the width of the disk is too wide, and it may not fit to the existing one. The invention described in item 36 of the patent application of the adhesive device is the invention described in item 35 of the patent application, which is characterized in that a plurality of adhesives are arranged in such a manner that adjacent adhesive tapes are spaced apart.

此申請專利範圍第3 6項記載之發明時，除了具有和 申請專利範圍第3 5項記載之發明相同之作用效果以外， 因爲鄰接之黏著劑條爲分離，很容易即可將黏著劑逐條從 基材剝離並實施壓著。 申請專利範圍第3 7項記載之發明，係如申請專利範 圍第3 5項記載之發明，其特徵爲，黏著劑係利用形成於 膠帶之寬度方向的縫隙而分離成複數條。 此申請專利範圍第3 7項記載之發明時，除了具有和 申請專利範圍第3 5項相同的作用效果以外，同時，黏著 劑膠帶係採用將黏著劑塗布於基材之單面全面並使其乾燥 者，在將黏著劑壓著至電路基板之前一瞬間，亦即，在使 •32- (28) (28)200409405 用黏著劑膠帶之前一瞬間’利用以切刃等使黏著劑具有切 痕而形成縫隙。 又，縫隙之形成上，亦可在製造黏著劑膠帶時以切刃 等使黏著劑具有切痕而形成縫隙，除了切刃以外，亦可利 用雷射或電熱線等來形成。 本發明時，除了可增加配置於基材上之黏著劑條的_ 數以外，在膠帶之寬度方向配置複數條黏著劑之黏著劑jg 帶的製造更爲容易。 申請專利範圍第3 8項記載之發明，係在基材上塗布 黏著劑，並將其捲成盤狀之黏著劑膠帶製造方法，其特徵 爲，將黏著劑塗布於一方之基材之全面，並在黏著劑上沿 者膠帶之寬度方向形成縫隙後’在黏著劑面上配置另—·方 之基材，以一方及另一方之基材夾住黏著劑，然後再使一 方之基材及另一方之基材互相分離，一方及另一方之基材 上分別交互貼附著複數條黏著劑，而在一方及另一方之.基 材上以具有間隔之方式配置著複數條黏著劑。 此申請專利範圍第3 8項記載之發明時，因爲可以利 用既存設備同時製造2個如申請專利範圍第2項記載之黏 著劑膠帶，故具有良好製造效率.。 申請專利範圍第3 9項記載之發明，係一種黏著劑膠 帶壓著方法’其特徵爲，將申請專利範圍第3 5〜3 7項之 其中任一項記載之黏著劑膠帶配置於電路基板上，沿著寬 度方向對黏著劑膠帶實施加熱加壓，將黏著劑條壓著至電 路基板之一邊。此壓著方法亦可採用如下之方式，亦即， -33- (29) (29)200409405 將黏著劑膠帶配置於電路基板上，沿著寬度方向對黏著劑 膠帶實施加熱加壓，將黏著劑條壓著至電路基板之一邊， 其次，變更電路基板之位置，並沿著黏著劑膠帶之寬度方 向對電路基板之另一邊實施黏著劑膠帶之加熱加壓，將下 一黏著劑條壓著至電路基板之另一邊。 此申請專利範圍第3 9項記載之發明時，除了具有和 申請專利範圍第3 5〜3 7項之其中任一項記載之作用效果 以外，將黏著劑膠帶裝著於黏著裝置後，可將電路基板之 一邊配置於黏著劑膠帶之寬度方向，將黏著劑壓著至電路 基板之一邊，其次，將電路基板旋轉大約9 0度，使電路 基板之另一邊位於和黏著劑膠帶之寬度方向成爲平行之位 置上，並將黏著劑壓著至電路基板之另一邊。如此，可依 序將電路基板旋轉90度並實施回黏著劑之壓著，很簡單 即可將黏著劑壓著於電路基板之四周，而提高電子構件之 製造工廠的作業效率。 申請專利範圍第4 0項記載之發明的特徵如下，至少 在移動電路基板之搬運路上配置2條申請專利範圍第3 5 〜3 7項之其中任一項記載之黏著劑膠帶，一方之黏著劑 膠帶之配置上，其寬度方向和搬運路成垂直，另一方之黏 著劑膠帶之配置上，其寬度方向係沿著搬運路之方向，一 方之黏著劑膠帶係針對電路基板之相對2邊沿著寬度方向 實施黏著劑膠帶之加熱加壓將黏著劑條壓著至電路基板之 相對2邊，其次，使電路基板朝另一方之黏著劑膠帶移動 ’針對電路基板之其餘2邊從基材側沿著寬度方向實施黏 •34- (30) 200409405 著劑膠帶之加熱加壓，將黏著劑條壓著於電路基板之四闺When the invention described in item 36 of this patent application has the same effect as the invention described in item 35 of the patent application, because the adjacent adhesive strips are separated, it is easy to separate the adhesives one by one. It peels from a base material, and performs pressure bonding. The invention described in item 37 of the scope of patent application is the invention described in item 35 of the scope of patent application, characterized in that the adhesive is separated into a plurality of strips by using slits formed in the width direction of the tape. When the invention described in item 37 of this patent application has the same function and effect as item 35 in the patent application, the adhesive tape is made by coating the adhesive on one side of the substrate and making it full. Dryer, use the cutting edge, etc., to make the adhesive short before pressing the adhesive onto the circuit board, that is, immediately before using the adhesive tape with 32- (28) (28) 200409405. A gap is formed. In addition, in the formation of the gap, the slit may be formed by cutting the adhesive with a cutting edge or the like when manufacturing the adhesive tape, and in addition to the cutting edge, a laser or a heating wire may be used. In the present invention, in addition to increasing the number of the adhesive strips arranged on the substrate, it is easier to manufacture an adhesive jg strip having a plurality of adhesives arranged in the width direction of the tape. The invention described in item 38 of the scope of application for a patent is a method for manufacturing an adhesive tape by applying an adhesive on a substrate and rolling it into a disc shape, which is characterized in that the adhesive is applied to one of the substrates. And after forming a gap along the width direction of the adhesive tape on the adhesive, 'the other side of the substrate is arranged on the surface of the adhesive, sandwich the adhesive with one and the other substrate, and then make one substrate and the The substrate of the other party is separated from each other, and a plurality of adhesives are adhered to each other on the substrate of the other party, and a plurality of adhesives are arranged on the substrate of the one party and the other party in a spaced manner. When the invention described in item 38 of this patent application is applied, it is possible to simultaneously manufacture two adhesive tapes as described in item 2 of the patent application using existing equipment, so it has good manufacturing efficiency. The invention described in item 39 of the scope of patent application is a method for pressing an adhesive tape. It is characterized in that the adhesive tape described in any one of the scope of patent applications 35 to 37 is arranged on a circuit board. , Heating and pressing the adhesive tape along the width direction, and pressing the adhesive strip to one side of the circuit substrate. This pressing method can also adopt the following method, that is, -33- (29) (29) 200409405 Place the adhesive tape on the circuit board, apply heat and pressure to the adhesive tape in the width direction, and place the adhesive The strip is pressed to one side of the circuit substrate. Next, the position of the circuit substrate is changed, and the other side of the circuit substrate is heated and pressed along the width direction of the adhesive tape to press the next adhesive strip to The other side of the circuit board. When the invention described in item 39 of this patent application has the same effect as that described in any one of items 35 to 37 in the patent application scope, after the adhesive tape is attached to the adhesive device, the One side of the circuit board is arranged in the width direction of the adhesive tape, and the adhesive is pressed to one side of the circuit board. Next, the circuit board is rotated by about 90 degrees, so that the other side of the circuit board is positioned in the width direction of the adhesive tape. Parallel position, and press the adhesive to the other side of the circuit board. In this way, the circuit board can be sequentially rotated by 90 degrees and the pressure of the adhesive can be pressed back. It is very simple to press the adhesive around the circuit board, thereby improving the operating efficiency of the electronic component manufacturing factory. The features of the invention described in item 40 of the scope of patent application are as follows. At least two of the adhesive tapes described in any one of the scope of patent application scope 35 to 37 are arranged on the transportation circuit of the mobile circuit board. In the configuration of the adhesive tape, the width direction is perpendicular to the conveying path. In the configuration of the other adhesive tape, the width direction is along the conveying path. The adhesive tape on one side is aligned with the width of the two opposite sides of the circuit board. The heating and pressure of the adhesive tape is applied in the direction to press the adhesive strips to the opposite two sides of the circuit board, and then, the circuit board is moved toward the other side of the adhesive tape. 34- (30) 200409405 Adhesive tape is heated and pressed in the width direction, and the adhesive tape is pressed against the fourth board of the circuit board.

此申請專利範圍第4 0項記載之發明時，除了具有和 申請專利範圍第35〜37項記載之作用效果以外，無需旋 轉電路基板而將其移至一方之黏著劑膠帶及另一方之黏著 劑膠帶之位置，在各位置上沿著寬度方向實施加熱加壓， 而很容易即可將黏著劑壓著於電路基板之四周，具有良好 作業效率。 申請專利範圍第4 1項記載之發明，係在基材之單面 全面塗布黏著劑，並利用捲成盤狀之黏著劑膠帶對電路基 板實施黏著劑之壓著的黏著劑膠帶壓著方法，其特徵爲， 黏著劑膠帶之寬度爲電路基板之一邊之長度以上，從寬度 方向實施黏著劑膠帶之寬度方向之部份黏著劑的加熱加_ ，降低加熱部份之黏著劑的凝聚力，將黏著劑壓著至電路 基板。When the invention described in the 40th patent scope of this application has the same effects as those described in the 35th to 37th patent scope of application, it is not necessary to rotate the circuit board and move it to one of the adhesive tapes and the other adhesive The position of the tape is heated and pressed along the width direction at each position, and the adhesive can be easily pressed around the circuit board, which has good operating efficiency. The invention described in item 41 of the scope of the patent application is an adhesive tape pressing method for coating an adhesive on one side of a substrate and applying a pressure-sensitive adhesive to a circuit board by using a rolled adhesive tape. It is characterized in that the width of the adhesive tape is greater than the length of one side of the circuit board, and the heating of the part of the adhesive in the width direction of the adhesive tape is performed from the width direction to reduce the cohesive force of the adhesive in the heating part, and the adhesion The agent is pressed onto the circuit substrate.

此申請專利範圍第4 1項記載之發明時，在將黏著劑 壓著至電路基板之周圍時，係將黏著劑膠帶裝著至黏著裝 置並沿著寬度方向實施黏著劑膠帶之加熱加壓，降低該部 份之聚力（以下簡稱爲「凝聚力降低線」）’加熱部份 之黏著劑會沿著凝聚力降低線從基材分離而壓著至電路基 板上。其次，將電路基板旋轉約9 0度，使相鄰之邊位於 黏著劑膠帶之寬度方向之位置上，沿著寬度方向實施下一 黏著劑條之加熱加壓，將黏著劑條之黏著劑壓著至相鄰之 邊。如此，可依序將黏著劑壓著至電路基板之四邊，而有 -35- (31) (31)200409405 良好作業效率。 又，因爲只需在黏著劑膠帶之全面塗布黏著劑即可， 故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑的寬度，可利用改變 加熱加壓區域來實施任意設定，故壓著之黏著劑寬度具有 高自由度。 又，和申請專利範圍第3 5項記載之發明相同，因爲 未增加捲數卻可增加黏著劑量，故可防止捲取散亂，同時 ，得到可防止因黏著劑之滲出而造成之阻塞、及防止因基 材之伸展而造成之弊病等之效果。 申請專利範圍第42項記載之發明的特徵，係具有一 方之盤、另一方之盤、以及用以收容以可自由旋轉方式裝 設之這些盤的殼體，一方之盤上捲繞著在基材上塗布著黏 著劑之黏著劑膠帶，另一方之盤則固定著黏著劑膠帶之一 端，黏著劑膠帶上沿著膠帶之縱向至少配置著2條黏著劑 〇 此申請專利範圍第42項記載之發明時，將黏著劑膠 帶盒裝著至黏著裝置，以和電路基板之一邊重疊之方式， 對配置於黏著劑膠帶之寬度方向上之至少2條沿著縱向形 成之黏著劑的1條，從基材側實施加熱加壓，使1條之黏 著劑壓著至電路基板。如此，可依序將黏著劑壓著至電路 基板，從一方之盤依序捲出黏著劑膠帶，同時，將殘餘之 1條塗布著黏著劑之黏著劑膠帶捲取至另一方之盤。其次 ，捲繞於一方之盤的黏著劑膠帶全部捲出時，將盒反轉並 -36- (32) (32)200409405 再度裝著至壓著裝置。 利用此方式’因爲一方之盤及另一方之盤會互換，而 變成從另一方之盤捲出黏著劑膠帶，可再實施]條黏著劑 之壓著。 在黏著劑膠帶上形成2條以上之黏著劑時，亦可改變 寬度方向之位置，並以依序或以具有間隔之方式實施壓著 〇 如Jl所示’本發明時，黏著劑板上至少在寬度方向上 並排著2條黏著劑，並可逐條使用，至1盤至少可使用2 盤份’而可在無需增.加黏著劑膠帶之捲數的情形，使！盤 可使用之黏著劑量增加成2倍以上。 而且’因爲未增加黏著劑膠帶之捲數，故可防止捲取 散喬L ’同時’可防止因爲黏著劑從膠帶之寬度方向滲出而 使捲取之膠帶間發生黏著所導致之阻塞，此外，亦可防止 sms材較長而容易發生之伸展等弊病（基材之損傷或切 斷）。 另一方面’形成2條黏著劑時，電子構件之製造工廠 在用完1盤份（1條黏著劑）時只需反轉盒即可，故下一 裝著更爲容易。 又’因黏著劑膠帶係採盒方式，故在黏著裝置上將黏 著劑膠帶裝設於盤上時沒有繁複之步驟，只要將盒裝著至 黏者裝置即可，故處理上十分容易，而且具有良好之裝設 及更換作業性。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 -37- (33) (33)200409405 異導電性黏著劑，亦可以爲只有絕緣性黏著劑者’或考， 將絕緣性隔件粒子分散於這些黏著劑中者。 申請專利範圍第43項記載之發明，係如申請專利範 圍第42項記載之發明，其特徵爲，複數條黏著劑之相鄰 之黏著劑條具有間隔。 此申請專利範圍第4 3項記載之發明時，除了具有和 申請專利範圍第42項記載之發明相同之作用效果以外， 相鄰之黏著劑條會分離，很容即可從基材逐條拉離黏著劑 並實施壓著。 申請專利範圍第4 4項記載之發明，係如申請專利範 圍第42項記載之發明，其特徵爲，黏著劑係利用膠帶之 寬度方向上形成之縫隙來分離成複數條。 此申請專利範圍第44項記載之發明時，除了具有和 申請專利範圍第4 2項相同的作用效果以外，同時，黏著 劑膠帶係採用將黏著劑塗布於基材之單面全面並使其乾燥 者’在將黏著劑壓著至電路基板之前一瞬間，亦即，在使 用黏著劑膠帶之前一瞬間，利用以切刃等使黏著劑具有切 痕而形成縫隙。 又’縫隙之形成上，亦可在製造黏著劑膠帶時以切刃 等使黏著劑具有切痕而形成縫隙，除了切刃以外，亦可利 用雷射或電熱線等來形成。 申請專利範圍第4 5項記載之發明的特徵，係將：具 有一方之盤、另一方之盤、以及用以收容以可自由旋轉方 式裝設之這些盤的殼體；及一方之盤上捲繞著在基材上塗 -38- (34) (34)200409405 布著黏著劑之黏著劑膠帶’而另一方之盤固定著黏著劑膠 帶之一端；之黏著劑膠帶盒’裝著至壓著裝置，從黏著劑 膠帶盒將黏著劑膠帶拉出至電路基板上’對黏著劑膠帶之 寬度方向之一部份進行加熱加壓，降低加熱部份之黏著劑 的凝聚力，將寬度方向之部份黏著劑壓著至電路基板。 此申請專利範圍第45項記載之發明時，利用對黏著 劑膠帶之寬度方向的一部份實施加熱加壓，降低該部份之 黏著劑之凝聚力（以下簡稱爲「凝聚力降低線」），可從 凝聚力降低線使加熱部份之黏著劑從基材分離並壓著至電 路基板。 本發明時，因爲黏著劑膠帶只需在基材之全面塗布黏 著劑即可，故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑的寬度，可利用改變 加熱加壓區域來實施任意設定’故壓著之黏著劑寬度具有 尚自由度。 申請專利範圍第4 6項記載之發明’係一種利用黏著 劑膠帶盒之黏著劑壓著方法，其特徵爲，將：具有一方之 盤、另一方之盤、以及用以收容以可自由旋轉方式裝設之 這些盤的殼體；及一方之盤上捲繞著在基材上塗布著黏著 劑之黏著劑膠帶，而另一方之盤則固定著黏著劑膠帶之一 端；之黏著劑膠帶盒，裝著至壓著裝置，從黏著劑膠帶盒 將黏著劑膠帶拉出至電路基板上，對黏著劑膠帶之寬度方 向的一部份實施加熱加壓，降低加熱部份之黏著劑的凝聚 力，將寬度方向之部份黏著劑壓著至電路基板，捲取至一 -39- (35) (35)200409405 方之盤上之黏著劑膠帶全部捲出後，將黏著劑膠帶盒反轉 ’再將殘餘之部份黏著劑壓著至電路基板。 此申請專利範圍第4 6項記載之發明時，除了具有和 申請專利範圍第4 5項相同的作用效果以外，同時，捲取 至一方之盤上之黏著劑膠帶全部捲出時，將盒反轉並再度 裝著S壓著裝置，而將殘餘部份之黏著劑壓著至電路基板 ’故和申請專利範圍第丨項記載之發明相同，在未增加捲 數之情形下可增加黏著劑量，故可防止捲取散亂，同時， 得到可防止因黏著劑之滲出而造成之阻塞、及防止因基材 之伸展而造成之弊病等之效果。此外，電子構件之製造工 廠在1盤份（1條份之黏著劑）全部捲出時，只要反轉盒 即可’下一裝著會更爲容易。因爲採用盒之方式，處理上 更爲容易，且具有良好之裝設及更換作業性。 申請專利範圍第4 7項記載之發明，係塗布於基材上 之捲成盤狀之黏著劑膠帶，其特徵爲，基材具有熱熔融劑 層及支持層。 此申請專利範圍第4 7項記載之發明時，若使用黏著 材膠帶，將捲取黏著材膠帶之盤及空盤裝著至黏著裝置， 對電路基板實施黏著材之加熱加壓後，會將基材捲取至空 盤。其次，使已全部捲出之捲取至一方之盤上之一方之黏 著材膠帶之終端部、及新捲取至另一方之盤上之另一方之 黏著材膠帶之始端部互相重疊或抵接’對此部份進行加熱 ，使熱熔融劑層熔融後，利用冷卻來使熱熔融劑固化’用 以連接黏著材膠帶。 -40- (36) (36)200409405 利用黏著材膠帶之基材黏著全部捲出之黏著材膠帶之 終端部及新裝著之黏著材膠帶之始端部，來實施黏著材盤 之更換，故很簡單即可將新黏著材盤裝著至黏著裝置。又 ’因爲無需每次更換新黏者材盤時都更換捲取盤、將新黏 著材之始端裝設至捲取盤、及捲附至導引銷之作業，只需 要較少時間即可更換新黏著材盤，故可提高電子機器之生 產效率。 連接部份之加熱壓著，若採用裝著著黏著材盤之黏著 裝置的加熱加壓頭，則可合理利用黏著裝置。 申請專利範圍第4 8項記載之發明，係如申請專利範 圓第1項記載之發明，其特徵爲，支持層夾於熱熔融劑層 之間。 此申請專利範圍第4 8項記載之發明時，除了具有和 申請專利範圍第1項記載之發明相同之作用效果以外，因 爲熱熔融劑層位於基材之表面，可將始端部之黏著劑面重 疊於一方之黏著材膠帶之終端部之熱熔融劑層，對此部份 進行加熱壓著來連接兩者，故連接十分簡單。又’因爲熱 熔融劑層形成於膠帶之縱向全體，重疊長度無需嚴格定位 ，故連接具有高自由度。 申請專利範圍第4 9項記載之發明，係如申請專利範 ®第1項記載之發明，其特徵爲，熱熔融劑層夾於支持層 之間。 此申請專利範圍第4 9項記載之發明時’除了具有和 申請專利範圍第47項記載之發明相同之作用效果以外， -41 - (37) (37)200409405 黏著材膠帶之連接上，係在一方之黏著材膠帶之終端部及 另一方之黏著材膠帶之始端部互相抵接之位置上，利用黏 著裝置之加熱加壓頭進行加熱。加熱時熱熔融劑會熔解滲 出，利用冷卻來使熱溶融劑固化，實施黏著材膠帶間之連 接。此時，因爲熱熔融劑層係夾於支持層之間，故可防止 熔融劑層曝露於大氣之下而因爲濕氣之吸濕或灰塵等之附 著而降低熱熔融劑層之黏著強度。 申請專利範圍第5 0項記載之發明，係用以連接捲取 至一方之盤之一方之黏著材膠帶、及捲取至另一方之盤上 之另一方之黏著材膠帶的黏著材膠帶連接方法，其特徵爲 ，黏著材膠帶具有以脫模劑實施表面處理之基材及黏著劑 ，除去其中任何一方之黏著材膠帶之基材端部之脫模劑， 使另一方之黏著材膠帶之黏著劑面重疊於該部份，以實施 兩者之重疊部份的加熱壓著來進行連接。 此申請專利範圍第5 0項記載之發明時，在其中任何 一方之黏著材膠帶之基材面上重疊另一方之黏著材膠帶之 黏著劑面，實施重疊部份之加熱壓著，利用連接全部捲出 之黏著材膠帶之終端部及新裝著之黏著材膠帶之始端部來 實施黏著材盤之更換，故很簡單即可將新黏著材盤裝著至 黏著裝置。 因爲無需每次更換新黏著材盤時都更換捲取盤、將新 黏著材膠帶之始端裝設至捲取盤之作業、以及在特定路徑 設定導引銷等之作業，只需要較少時間即可更換新黏著材 盤，故可提高電子機器之生產效率。 -42- (38) (38)200409405 又，在黏著材膠帶捲繞於盤上之狀態下，爲了避免|占 著劑面及基材面發生黏著，基材之表面上會塗布脫模劑。 本發明時’會除去一*方之黏者材膠帶之脫f吴劑，並將另·^ 方之黏著材膠帶之黏著劑面重疊於該部份並進行黏著，故 黏著材膠帶間之連接十分簡單。 連接部份之加熱壓著上，若採用裝著著黏著材盤之I占 著裝置的加熱加壓頭，則可合理利用黏著裝置。 申請專利範圍第5 1項記載之發明，係如申請專利範 圍第5 0項記載之發明，其特徵爲，脫模劑之除去係利用 電漿放電、紫外線照射、雷射照射之其中任何一種方式來 實施。 此申請專利範圍第5 1項記載之發明時，除了具有和 申請專利範圍第5 0項記載之發明相同之作用效果以外， 因係利用電漿放電、紫外線照射、雷射照射之其中任何一 種方法來除去脫模劑，和以手剝離時相比，可以更短之時 間、更正確地除去脫模劑。 脫模劑之除去方法上，採用電漿放電時，係使處於電 漿狀態之氣體分解而成爲容易產生之狀態（激發狀態）， 並以對基材之表面實施放電來除去脫模劑。又，紫外線照 射時，例如，採用水銀燈當做光源，利用照射一定時間之 來自水銀燈之紫外線來實施。又，雷射照射時，係以利用 雷射振盪器照射之雷射光來對脫模劑進行加熱並使其熔解 ，用以除去脫模劑。 申請專利範圍第5 2項記載之發明，係將基材上塗布 -43- (39) (39)200409405 著電極連接用黏著劑之黏著材膠帶捲取至盤之黏著材膠帶 盤，其特徵爲，黏著材膠帶盤之膠帶之寬度方向上配設著 複數之黏著材膠帶之捲部。 此申請專利範圍第5 2項記載之發明時’因配設著複 數之黏著材膠帶捲部（捲部），複數捲部當中之捲繞於一 方之捲部的黏著材膠帶全部捲出時，會捲取配置於全部捲 出之捲部之隔壁的另一方之捲部的黏著材膠帶並將其裝設 至盤。 如此，一方之黏著材膠帶全部捲出時，會將另一方之 黏著材膠帶裝設至盤，而實施黏著材膠帶之更換，故無需 將新黏著材膠帶盤裝著至黏著裝置。因此，只需較少之新 黏著材膠帶盤之更換作業，故可提局電子機器之生產效率 〇 因爲係依序使用捲繞於複數捲部之黏著材膠帶，無需 增加1個黏著材膠帶盤之黏著材膠帶的捲數，即可大幅增 加1次更換作業之可使用的黏著劑量。又，因爲無需增加 黏著材膠帶之捲數，故可防止捲取散亂，同時，可防止黏 著劑從膠帶之寬度方向滲出而使已捲取之黏著材膠帶間發 生黏著，亦即，可防止阻塞，而且，亦可防止因爲基材較 長而容易發生之伸展等弊病。 申請專利範圍第5 3項記載之發明，係如申請專利範 圍第52項記載之發明，其特徵爲，一方之黏著材膠帶之 終端部及另一方之黏著材膠帶之始端部之間具有用以連接 兩者之連結膠帶，一方之黏著材膠帶全部捲出時，會接著 -44- (40) (40)200409405 開始捲出另一方之黏著材膠帶。 此申請專利範圍第5 3項記載之發明時，除了具有和 申請專利範圍第5 2項記載之發明相同之作用效果以外， --方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端 部係利用連結膠帶實施連接，一方之捲部之黏著材膠帶全 部捲出後，無需將另一方之捲部之黏著材膠帶捲取至盤之 裝設作業，故可進一步提高電子機器之生產效率。 申請專利範圍第5 4項記載之發明，係具有如申請專 利範圍第5 3項記載之黏著材膠帶盤、黏著材膠帶之捲取 盤、配設於黏著材膠帶盤及捲取盤之間且以加熱加壓頭將 黏著材膠帶之黏著材壓著至電子機器之電路基板上之壓著 部、以及用以檢測連結膠帶之膠帶檢測手段之黏著裝置， 其特徵爲，膠帶檢測手段檢測到連結膠帶時，至連結膠帶 通過壓著部爲止會將連結膠帶捲取至捲取盤。 此申請專利範圍第5 4項記載之發明時，因爲連結膠 帶會自動捲取至捲取盤，一方之捲部之黏著材膠帶全部捲 出後，會依序從下一捲部捲出黏著材膠帶。 又，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通 過壓著部爲止，會自動將連結膠帶捲取至捲取盤，故可省 略捲取之麻煩。 又，膠帶檢測手段上，例如黏著裝置具有一對發光部 及受光部，以光學方式檢測連結膠帶。另一方面，連結膠 帶之兩端配設著有顏色之（例如黑色）標記，受光部會利 用發光部發出之雷射光檢測連結膠帶兩端之標記來檢測連 •45- (41) (41)200409405 結膠帶。又，除了在連結膠帶附加標記以外，可採用使連 結膠帶之寬度和黏著材膠帶之寬度不同的方法、或在連結 膠帶上形成複數之孔的方法。 申請專利範圍第5 9項記載之發明，係具有一方之盤 、另一方之盤、使一方之盤及另一方之盤連動旋轉之齒輪 單元、收容前述諸元件之殻體、配置於殼體之開口部之加 熱構件、以及對加熱構件供應電力之電源手段之黏著具， 其特徵爲，一方之盤上捲繞著在基材上塗布著黏著劑之黏 著劑膠帶，另一方之盤則固定著黏著劑膠帶之一端，加熱 構件具有利用供應之電力實施發熱之電熱構件，將捲取至 一方之盤上之黏著劑膠帶拉至殼體之開口部，以加熱構件 從基材側對位於開口部之黏著劑膠帶實施加熱加壓，將黏 著劑壓著至電路基板，以另一方之盤捲取黏著劑被剝離之 基材。 此申請專利範圍第5 9項記載之發明，在將黏著劑壓 著至電路基板時，係以單手握持殼體，將露出黏著劑膠帶 之開口部壓抵電路基板，配設於開口部之黏著劑膠帶基材 側之加熱構件會抵接位於開口部之黏著劑膠帶，而將黏著 劑壓著至電路基板。其次，在抵接位於加熱構件下之黏著 劑膠帶的情形下使黏著具前進，會從一方之盤拉出黏著劑 膠帶，而在從盤拉出黏著劑膠帶時，盤會旋轉，故固定於 一方之盤之同軸上的齒輪會旋轉，而和其齒合之另一方之 盤之齒輪亦會旋轉，以另一方之盤捲取黏著劑已被剝離之 基材。 _ 46 - (42) 200409405 對加熱構件之電力供應上，可以利用配設於殼體之開 關來切換電力之供應，或者，亦可在加熱構件上配設感壓 開關’加熱構件被推壓時，可感測到該推壓而對加熱構件 供應電力。 黏著劑可以爲將導電粒子分散於絕緣性黏著劑中之向 異導電性黏著，亦可以爲只有絕緣性黏著劑者，或者，爲 將絕緣性隔件粒子分散於黏著劑中者。In the invention described in item 41 of this application, when the adhesive is pressed around the circuit board, the adhesive tape is attached to the adhesive device and the adhesive tape is heated and pressed in the width direction. Decrease the cohesion of the part (hereinafter referred to as "cohesion reduction line") The adhesive of the heating portion will be separated from the substrate along the cohesion reduction line and pressed onto the circuit board. Next, rotate the circuit board by about 90 degrees so that the adjacent edges are located in the width direction of the adhesive tape, and the next adhesive strip is heated and pressed along the width direction to press the adhesive of the adhesive strip. To the adjacent side. In this way, the adhesive can be sequentially pressed to the four sides of the circuit board, and -35- (31) (31) 200409405 has good operating efficiency. In addition, since only the entire surface of the adhesive tape needs to be coated with the adhesive, the existing equipment can be used to make the adhesive tape directly. In addition, the width of the adhesive to be pressed onto the circuit board can be arbitrarily set by changing the heating and pressing area, so the width of the adhesive to be pressed has a high degree of freedom. In addition, the invention is the same as the invention described in item 35 of the scope of patent application, because the adhesive amount can be increased without increasing the number of rolls, so that the coiling can be prevented from being scattered, and at the same time, the blocking caused by the bleeding of the adhesive can be prevented, and The effect of preventing ills caused by stretching of the substrate. The feature of the invention described in claim 42 is that it has a disc of one side, a disc of the other side, and a housing for accommodating these discs that can be installed in a freely rotatable manner. The adhesive tape is coated on the material, and the other disk is fixed to one end of the adhesive tape. At least two adhesives are arranged along the longitudinal direction of the tape on the adhesive tape. In the invention, the adhesive tape box was mounted to the adhesive device, and one of the adhesives formed in the longitudinal direction of at least two adhesive tapes arranged in the width direction of the adhesive tape was overlapped with one side of the circuit board. The substrate side is heated and pressurized so that one adhesive is pressed against the circuit board. In this way, the adhesive can be sequentially pressed onto the circuit board, and the adhesive tape can be rolled out from one disk in order. At the same time, the remaining one of the adhesive-coated adhesive tape can be rolled up to the other disk. Next, when all the adhesive tape wound on one of the discs is unrolled, the case is reversed and the -36- (32) (32) 200409405 is reloaded to the pressing device. In this way, because one disk and the other disk are interchangeable, the adhesive tape is rolled out from the other disk, and the pressing of the adhesive can be performed again. When two or more adhesives are formed on the adhesive tape, the position in the width direction can also be changed, and the pressing can be performed sequentially or in a spaced manner. As shown in Jl. 'In the present invention, at least the adhesive board Two adhesives are arranged side by side in the width direction, and can be used one by one. At least two reels can be used for one tray. It can be used without increasing the number of rolls of adhesive tape. The amount of adhesive that can be used on the plate is more than doubled. And 'because the number of rolls of the adhesive tape is not increased, it is possible to prevent the loosening of the adhesive tape. At the same time, it can prevent blockage caused by the adhesion between the wound tapes because the adhesive leaks out from the width direction of the tape. In addition, It can also prevent the shortcomings such as long and easy to stretch of the sms material (damage or cutting of the substrate). On the other hand, when two adhesives are formed, the electronic component manufacturing factory only needs to invert the box when it runs out of one tray (one adhesive), so the next installation is easier. Also, because the adhesive tape is a box collection method, there is no complicated step when installing the adhesive tape on the disk on the adhesive device, as long as the box is mounted to the adhesive device, it is very easy to handle, and Has good installation and replacement workability. The adhesive may be a direction in which conductive particles are dispersed in an insulating adhesive. (37) (33) (33) 200409405 Heteroconductive adhesive, or only an insulating adhesive, or an insulating spacer Particles are dispersed in these adhesives. The invention described in item 43 of the scope of patent application is the invention described in item 42 of the scope of patent application, which is characterized in that the adjacent adhesive strips of the plurality of adhesives have a space. When the invention described in item 43 of this patent application scope has the same effect as the invention described in item 42 of the patent application scope, the adjacent adhesive strips will be separated, so they can be pulled from the substrate one by one. Remove the adhesive and apply pressure. The invention described in item 44 of the scope of patent application is the invention described in item 42 of the scope of patent application, characterized in that the adhesive is separated into a plurality of pieces by using a gap formed in the width direction of the tape. The invention described in item 44 of this patent application has the same function and effect as item 42 of the patent application, and at the same time, the adhesive tape is made by coating the adhesive on one side of the substrate and drying it. One moment before the adhesive is pressed onto the circuit board, that is, immediately before the adhesive tape is used, a slit is formed by using the cutting edge or the like to make the adhesive cut. In the formation of the gap, the slit may be formed with a cutting edge or the like when the adhesive tape is produced during the production of the adhesive tape. In addition to the cutting edge, a laser or a heating wire may be used. The features of the invention described in item 45 of the scope of the patent application are: a disk with one side, a disk with the other side, and a housing for accommodating these disks that can be installed in a freely rotatable manner; Around the substrate coated with -38- (34) (34) 200409405 Adhesive tape with adhesive on it, and the other disk holds one end of the adhesive tape; the adhesive tape box is on the pressing device , Pull the adhesive tape from the adhesive tape box onto the circuit board 'heat and press a part of the adhesive tape in the width direction to reduce the cohesive force of the heated part of the adhesive and adhere the width part The agent is pressed onto the circuit substrate. In the invention described in item 45 of this application, by applying heat and pressure to a part of the adhesive tape in the width direction, the cohesive force of the adhesive in this part is reduced (hereinafter referred to as "cohesive force reduction line"). From the cohesive force reduction line, the adhesive of the heating portion is separated from the substrate and pressed to the circuit board. In the present invention, since the adhesive tape only needs to be fully coated with the adhesive on the base material, the existing equipment can be used to manufacture the adhesive tape directly. In addition, the width of the adhesive to be pressed to the circuit board can be arbitrarily set by changing the heating and pressing area. Therefore, the width of the adhesive to be pressed has a high degree of freedom. The invention described in item 46 of the scope of the patent application is an adhesive pressing method using an adhesive tape box, which is characterized by having one disk, the other disk, and a freely rotatable method for accommodating the disk. The shells of these disks are installed; and one of the disks is wound with an adhesive tape coated with an adhesive on a substrate, and the other disk is fixed with one end of the adhesive tape; an adhesive tape box, Installed to the pressing device, pull out the adhesive tape from the adhesive tape box onto the circuit board, and heat and press a part of the adhesive tape in the width direction to reduce the cohesive force of the heated part of the adhesive. A part of the adhesive in the width direction is pressed onto the circuit board, and rolled up to a -39- (35) (35) 200409405. After all the adhesive tape on the square plate is rolled out, the adhesive tape box is reversed. The remaining part of the adhesive is pressed onto the circuit board. When the invention described in item 46 of this patent application has the same function and effect as in item 45 of the patent application, at the same time, when all the adhesive tape wound on one of the discs is rolled out, the box is reversed. Turn and install the S pressure device again, and press the remaining part of the adhesive to the circuit board, so it is the same as the invention described in the patent application No. 丨, and the adhesive dose can be increased without increasing the number of rolls. Therefore, the coiling can be prevented from being scattered, and at the same time, the effects of preventing clogging due to the bleeding of the adhesive, and preventing malaise caused by stretching of the substrate can be obtained. In addition, when the electronic component manufacturing factory rolls out a single set (one piece of adhesive), it is only necessary to invert the box. The next installation will be easier. Because the box method is adopted, it is easier to handle, and it has good installation and replacement workability. The invention described in item 47 of the scope of the patent application is a disc-shaped adhesive tape coated on a substrate, which is characterized in that the substrate has a hot-melt agent layer and a support layer. In the invention described in item 47 of this patent application range, if an adhesive tape is used, the tray and the empty tray on which the adhesive tape is wound are mounted to an adhesive device. After the circuit substrate is heated and pressurized, the adhesive The substrate is taken up to an empty tray. Secondly, the entire end of the rolled-up adhesive tape on one side of the one side of the adhesive tape and the beginning of the other rolled adhesive tape on the other side of the disk are overlapped or abutted on each other. 'This part is heated to melt the hot-melt agent layer, and then the hot-melt agent is solidified by cooling.' It is used to connect the adhesive tape. -40- (36) (36) 200409405 Use the base material of the adhesive tape to adhere the terminal portion of all the rolled adhesive tape and the beginning of the newly installed adhesive tape to replace the adhesive material tray. Simply attach the new adhesive material tray to the adhesive device. And 'because there is no need to change the reel every time you replace the new adhesive material plate, install the new end of the new adhesive material to the coil plate, and attach the coil to the guide pin, which can be replaced in less time. The new adhesive material plate can improve the production efficiency of electronic equipment. If the connection part is heated and pressed, if a heating and pressure head equipped with an adhesive device with an adhesive material plate is used, the adhesive device can be reasonably used. The invention described in item 48 of the scope of patent application is the invention described in item 1 of the patent application circle, and is characterized in that the support layer is sandwiched between the hot-melt agent layers. The invention described in item 48 of this patent application has the same effect as the invention described in item 1 of the patent application except that the hot-melt layer is located on the surface of the base material, and the adhesive surface at the beginning can be adjusted. The hot-melt layer that overlaps the terminal part of one adhesive tape is heated and pressed to connect the two, so the connection is very simple. Also, since the hot-melt layer is formed in the entire longitudinal direction of the tape, the overlapping length does not need to be strictly positioned, so the connection has a high degree of freedom. The invention described in item 49 of the scope of patent application is the invention described in item 1 of patent application ®, characterized in that the hot-melt agent layer is sandwiched between the support layers. In the case of the invention described in item 49 of the scope of patent application, except for the same effect as the invention described in item 47 of the scope of patent application, -41-(37) (37) 200409405 At the position where the terminal portion of one adhesive tape and the starting end of the other adhesive tape contact each other, the heating and pressing head of the adhesive device is used for heating. The hot melt agent melts and oozes during heating. The hot melt agent is solidified by cooling, and the adhesive tape is connected. At this time, since the hot-melt agent layer is sandwiched between the support layers, it is possible to prevent the hot-melt agent layer from being exposed to the atmosphere and reduce the adhesive strength of the hot-melt agent layer due to moisture absorption or adhesion of dust and the like. The invention described in claim 50 of the scope of patent application is an adhesive material tape connection method for connecting an adhesive material tape wound to one side of a disk and an adhesive material tape wound to the other side of a disk on the other side It is characterized in that the adhesive tape has a substrate and an adhesive that are surface-treated with a release agent, and the release agent at the end of the substrate of any one of the adhesive tape is removed to make the other adhesive tape adhere. The agent surface is overlapped on this part, and the heating and pressing of the overlapping part of the two are used for connection. In the invention described in item 50 of the scope of this application, the base material surface of any one of the adhesive material tapes is superposed on the adhesive surface of the other adhesive material tape, and the overlapped portion is heated and pressed. The end of the rolled adhesive tape and the beginning of the newly installed adhesive tape are used to replace the adhesive tray, so it is easy to install the new adhesive tape to the adhesive device. Because there is no need to change the reel every time you replace the new adhesive material tray, install the new end of the new adhesive tape to the reel, and set the guide pin in a specific path, it only takes less time. The new adhesive material plate can be replaced, so the production efficiency of electronic equipment can be improved. -42- (38) (38) 200409405 In the state where the adhesive tape is wound on the disc, in order to avoid the adhesion of the occupant surface and the substrate surface, a release agent is coated on the surface of the substrate. In the present invention, the agent for removing the adhesive tape of one square is removed, and the adhesive surface of the adhesive tape of the other square is overlapped on the part and adhered, so the connection between the adhesive tapes It's very simple. If the connection part is heated and pressed, if the heating and pressure head of the I-occupying device with the adhesive material plate is used, the adhesive device can be used reasonably. The invention described in item 51 of the scope of patent application is the invention described in item 50 of the scope of patent application, characterized in that the release agent is removed by any one of plasma discharge, ultraviolet irradiation, and laser irradiation. To implement. The invention described in item 51 of this patent application has the same effect as the invention described in item 50 of the patent application, except that it uses any one of plasma discharge, ultraviolet irradiation, and laser irradiation. To remove the release agent, the release agent can be removed more accurately and in a shorter time than when peeled by hand. In the method of removing the release agent, when plasma discharge is used, the gas in the plasma state is decomposed to a state easily generated (excited state), and the release agent is removed by discharging the surface of the substrate. In the case of ultraviolet irradiation, for example, a mercury lamp is used as a light source, and ultraviolet rays from the mercury lamp are irradiated for a certain period of time. In the case of laser irradiation, the release agent is heated and melted by using laser light irradiated by a laser oscillator to remove the release agent. The invention described in item 52 of the scope of the patent application is a method of winding an adhesive tape of -43- (39) (39) 200409405 with an electrode connection adhesive onto a substrate, and the adhesive tape tape tray is characterized in that: A plurality of rolls of the adhesive tape are arranged in the width direction of the adhesive tape of the adhesive tape tray. When the invention described in item 52 of the scope of this application is' because a plurality of adhesive tape roll sections (roll sections) are provided, when all the adhesive tapes wound around one of the multiple roll sections are rolled out, The adhesive tape placed on the other roll part of the partition next to all the rolled parts is taken up and mounted on the tray. In this way, when all the adhesive tapes of one side are rolled out, the other adhesive tapes will be installed on the tray, and the adhesive tapes will be replaced, so there is no need to install a new adhesive tape to the adhesive device. Therefore, less replacement work of new adhesive tapes is needed, so the production efficiency of electronic equipment can be improved. Because the adhesive tapes wound around multiple rolls are used sequentially, there is no need to add an adhesive tape. The number of rolls of adhesive tape can greatly increase the amount of adhesive that can be used in one replacement operation. In addition, since it is not necessary to increase the number of rolls of the adhesive material tape, it can prevent the coiling from being scattered, and at the same time, can prevent the adhesive from seeping out from the width direction of the adhesive tape and cause adhesion between the rolled adhesive material tapes, that is, can prevent Blockage can also prevent ill effects such as stretching that can easily occur due to long substrates. The invention described in item 53 of the scope of patent application is the invention described in item 52 of the scope of patent application, characterized in that a terminal portion of one adhesive tape and a start portion of the other adhesive tape are provided between them. When the two adhesive tapes connecting the two are completely rolled out, the adhesive tape of -44- (40) (40) 200409405 will be rolled out. When the invention described in item 53 of this patent application has the same effect as the invention described in item 52 of the patent application, the terminal part of one side of the adhesive tape and the other side of the adhesive tape The starting end is connected with a connecting tape. After all the adhesive tapes of one coil are rolled out, there is no need to wind the adhesive tapes of the other coil to the installation of the tray, so the production of electronic equipment can be further improved. effectiveness. The invention described in item 54 of the scope of patent application has the adhesive material tape reel, the adhesive material tape reel as described in item 53 of the patent application scope, and is disposed between the adhesive material tape reel and the reel, and The heat and pressure head is used to press the adhesive material of the adhesive material tape to the pressing part on the circuit board of the electronic device, and the adhesive device for detecting the adhesive tape detection means. The characteristic is that the adhesive tape detection means detects the connection. In the case of the adhesive tape, the connecting tape is wound up to a take-up tray until the connecting tape passes through the pressing portion. When the invention described in item 54 of this application, because the connecting tape is automatically taken up to the take-up tray, after all the adhesive tape of one roll part is rolled out, the adhesive material is sequentially taken out from the next roll part. tape. In addition, when the connecting tape is detected by the tape detecting means, the connecting tape is automatically wound up to the take-up disc until the connecting tape passes through the crimping portion, so the trouble of winding can be omitted. In addition, for the tape detection means, for example, the adhesive device includes a pair of light emitting sections and light receiving sections, and optically detects the connecting tape. On the other hand, both ends of the connecting tape are provided with colored (for example, black) marks, and the light receiving unit will detect the marks on both ends of the connecting tape using laser light emitted from the light emitting section to detect the connection. 45- (41) (41) 200409405 Knot the tape. In addition to adding a mark to the connecting tape, a method of making the width of the connecting tape different from the width of the adhesive tape, or a method of forming a plurality of holes in the connecting tape. The invention described in item 5 of the scope of the patent application is a disk unit having one disk, the other disk, a gear unit that rotates one disk and the other disk, a housing that houses the aforementioned components, and a housing that is arranged in the housing. The heating member of the opening and the adhesive for power supply means for supplying power to the heating member are characterized in that an adhesive tape on which a substrate is coated with an adhesive is wound on one disk, and the other disk is fixed. At one end of the adhesive tape, the heating member has an electric heating member that generates heat by using the supplied power, and the adhesive tape wound on one of the disks is pulled to the opening of the casing, and the heating member is located at the opening from the substrate side. The pressure-sensitive adhesive tape is heated and pressurized, and the pressure-sensitive adhesive is pressed to the circuit board, and the substrate from which the pressure-sensitive adhesive is peeled off is rolled by the other coil. In the invention described in item 59 of this application, when the adhesive is pressed onto the circuit board, the housing is held with one hand, and the opening exposed by the adhesive tape is pressed against the circuit board, and is arranged on the opening The heating member on the base material side of the adhesive tape contacts the adhesive tape located at the opening, and presses the adhesive to the circuit board. Next, when the adhesive tape is advanced while abutting the adhesive tape under the heating member, the adhesive tape is pulled out from one of the disks, and when the adhesive tape is pulled out from the disk, the disk is rotated, so it is fixed to The gears on the coaxial plate of one disc will rotate, while the gears of the other disc meshed with its teeth will also rotate, and the substrate on which the adhesive has been peeled off will be wound on the other disc. _ 46-(42) 200409405 For the power supply to the heating element, you can use a switch installed in the housing to switch the power supply, or you can also install a pressure sensitive switch on the heating element when the heating element is pressed , It can sense the pushing to supply power to the heating member. The adhesive may be an anisotropic conductive adhesive in which conductive particles are dispersed in an insulating adhesive, or it may be an insulating adhesive alone, or an insulating spacer particle may be dispersed in the adhesive.

申請專利範圍第6 0項記載之發明，係塗布於基材上 之黏著材膠帶，其特徵爲，基材係金屬膜或芳香族聚醯胺 膜所構成。 此申請專利範圍第60項記載之發明時，因爲黏著材 膠帶之基材係採用金屬膜（或金屬箔）或芳香族聚醯胺膜 ，即使基材之厚度較薄時，亦可防止基材伸展或切斷等問 題。The invention described in claim 60 of the scope of patent application is an adhesive tape applied to a substrate, and is characterized in that the substrate is composed of a metal film or an aromatic polyimide film. In the invention described in item 60 of this application, since the base material of the adhesive tape is a metal film (or metal foil) or an aromatic polyurethane film, the base material can be prevented even when the thickness of the base material is thin. Problems such as stretching or cutting.

因此 '利用由厚度較薄之基材所構成之黏著材膠帶， 可以增加每1盤之捲數，而增加1盤可使用之黏著劑量。 又，使用本發明之黏著材膠帶，每1盤之捲數會增多，電 子構件之製造工廠只需較少新黏著材膠帶之更換次數即可 ，故可提高作業效率。此外，黏著材膠帶之製造上，因可 以減少製造之盤數，且可減少盤材及濕氣防止材之使用量 ，故可降低製造成本。 金屬膜應採用伸展性較高之金屬，例如，銅、鋁、不 绣鋼、鐵、錫等。 芳香族聚醯胺膜之具體實例如對位芳香族聚醯胺纖維 -47- (43) (43)200409405 膜（Μ I C T R Ο N ; T O R A Y株式會社製商品名稱）等。 黏著劑係採用熱可塑性樹脂、熱硬化性樹脂、或熱可 塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系係以 苯乙烯樹脂系及聚酯樹脂系爲代表，熱硬化性樹脂系則以 環氧樹脂系、壓克力樹脂系、以及矽樹脂系爲代表。 黏著劑亦可分散著導電粒子。導電粒子係如A u、A g 、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子、或碳、 石墨等，亦可在前述之物及/或非導電性之玻璃、陶瓷、 塑膠等高分子核材等覆蓋前述導電層等來形成導電粒子。 此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒 子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金 屬、或塑膠等之高分子核材上形成導電層者，會具有因加 熱加壓或加壓而產生變形之變形性，故連接後之電極間距 離會縮小，連接時可增加和電路接觸之面積，而可提高信 賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有 融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得 到很容易即可對應電極之厚度及平坦性之誤差的連接構件 〇 申請專利範圍第6 1項記載之發明，係如申請專利範 圍第60項記載之發明，其特徵爲，基材之厚度爲l//m〜 2 5 // m。 基材之厚度爲l//m〜25//m之理由如下，基材之厚 度低於1 // m時，基材無法得到充分之拉伸強度，而容易 斷裂。又，基材之厚度若超過2 5//m時，每1盤之捲數 -48- (44) 200409405 方回無法得到可滿足之捲數。 申請專利範圍第6 2項記載之發明，係如申請專利範 圍第6 0或6 1項記載之發明，其特徵爲，基材之拉伸強度 在2 5 □時爲3 0 0 Μ P a以上。 基材之拉伸強度爲3 00MPa以上之理由如下，基材之 拉伸強度小於3 0 0 Μ P a時，基材容易延展，且黏著材膠帶 容易斷裂。Therefore, 'Using an adhesive tape made of a thin substrate can increase the number of rolls per reel and increase the amount of adhesive that can be used per reel. In addition, with the adhesive tape of the present invention, the number of rolls per reel is increased, and the electronic component manufacturing factory only needs to replace the new adhesive tape with fewer times, so the operation efficiency can be improved. In addition, in the manufacture of adhesive tapes, the number of discs manufactured can be reduced, and the amount of discs and moisture-proof materials can be reduced, so the manufacturing cost can be reduced. The metal film should be made of highly stretchable metal, such as copper, aluminum, stainless steel, iron, tin, etc. Specific examples of the aromatic polyamide film include para-aramid fiber -47- (43) (43) 200409405 film (M I C T R ION; trade name of TO R AY Co., Ltd.) and the like. The adhesive is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. Thermoplastic resins are represented by styrene resins and polyester resins, while thermosetting resins are represented by epoxy resins, acrylic resins, and silicone resins. The adhesive can also disperse conductive particles. The conductive particles are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or carbon, graphite, etc., and can also be used in the foregoing and / or non-conductive glass and ceramics. Polymer core materials such as plastic, plastic, etc. cover the aforementioned conductive layer to form conductive particles. In addition, it is also possible to use insulating film particles that cover the above-mentioned conductive particles with an insulating layer, or conductive particles and insulating particles for use. Forming a conductive layer on a hot molten metal such as solder or a polymer core material such as plastic will have deformability due to heat and pressure or pressure, so the distance between electrodes after connection will be reduced. Can increase the area of contact with the circuit, and improve reliability. In particular, it is better to use polymers as the core material. For example, because the solder has no melting point, it can be controlled in a softened state at a wide range of connection temperatures, and it is easy to get the thickness and flatness of the electrode. The connecting member 0 invention described in item 61 of the scope of patent application is the invention described in item 60 of the scope of patent application, characterized in that the thickness of the base material is 1 // m to 2 5 // m. The reason why the thickness of the base material is 1 // m to 25 // m is as follows. When the thickness of the base material is less than 1 // m, the base material cannot obtain sufficient tensile strength and is easily broken. In addition, if the thickness of the substrate exceeds 2 5 // m, the number of rolls per disc is -48- (44) 200409405. The number of rolls that cannot be satisfied can not be obtained in a square turn. The invention described in item 62 of the scope of patent application is the invention described in item 60 or 61 of the scope of patent application, and is characterized in that the tensile strength of the base material is 300 MPa or more when the tensile strength is 25 . The reason why the tensile strength of the base material is 300 MPa or more is as follows. When the tensile strength of the base material is less than 300 MPa, the base material is easy to expand and the adhesive tape is easily broken.

申請專利範圍第6 3項記載之發明，係如申請專利範 圍第60至62項之其中任一項記載之發明，其特徵爲，基 材對黏著劑之厚度比爲0.0 1〜1 . 0。 基材對黏著劑之厚度比爲〇 · 〇 1〜1 . 0之理由如下，基 材對黏著劑之厚度比低於0.0 1時，基材會太薄，而使黏 著材膠帶無法具有足充分之強度。又，基材對黏著劑之厚 度比超過1.0時，基材之厚度會過厚，每1盤之捲數會不 夠多。The invention described in item 63 of the scope of patent application is the invention described in any one of the scope of patent applications 60 to 62, characterized in that the thickness ratio of the base material to the adhesive is 0.0 1 to 1.0. The reason for the thickness ratio of the substrate to the adhesive is 0.001 ~ 1.0. The reason is as follows. When the thickness ratio of the substrate to the adhesive is less than 0.01, the substrate may be too thin, and the adhesive tape may not have sufficient The intensity. When the thickness ratio of the base material to the adhesive exceeds 1.0, the thickness of the base material becomes too thick, and the number of rolls per reel is insufficient.

申請專利範圍第64項記載之發明，係如申請專利範 圍第6 0至6 3項之其中任一項記載之發明，其特徵爲，基 材之表面粗細度Rm ax爲0.5 m以下。 基材之表面粗細度R m a X應爲〇 . 5 // m以下之理由如下 ，Rm ax若超過0.5 // m，則因爲基材表面之凹凸，將黏著 劑壓著至電路基板時，黏著劑不易從基材分離。 申請專利範圍第65項記載之發明，係利用在基材上 塗布黏著劑並捲成盤狀之黏著材膠帶在被覆體上形成黏著 劑之黏著材膠帶黏著材形成方法’其特徵爲，分別從複數 -49- (45) (45)200409405 盤拉出黏著材膠帶，使各黏著材膠帶重疊成一體，剝離_ 方之基材即可在被覆體上形成重疊成一體之黏著劑。 此申請專利範圍第6 5項記載之發明時，從〜方之盤 捲出之黏著材膠帶之黏著劑面、及從另一方之盤捲出之黏 著材膠帶之黏著劑面會重疊而使黏著材膠帶成爲〜體。g 一方之黏著材膠帶之基材會會捲取至捲取用盤，而重疊成 一體之黏著材膠帶之黏著劑則會被加壓加熱頭壓著至被s 體。被覆體係電子構件或電路基板，如引線框架或引，線框 架之晶片等。 如此，在被覆體上形成黏著劑之前一步驟，可使一方 之黏著材膠帶之黏著劑、及另一方之黏著材膠帶之黏著劑 重疊，在得到期望之黏著劑厚度再在被覆體上形成黏著劑 ，在增多黏著材膠帶之捲數的情形，卻可縮小每1盤之黏 著材膠帶的捲繞直徑。因此，可增加每1盤之黏著材膠帶 之捲數，而大幅增加1次更換作業之可使用的黏著劑量。 因此，只需較少之新黏著材膠帶之更換作業即可，故可提 筒電子機器之生產效率。 申請專利範圍第6 6項記載之發明，係如申請專利範 圍第1項記載之發明，其特徵爲，只有一方之黏著材膠帶 之黏著劑含有硬化劑。 此申請專利範圍第66項記載之發明時，除了具有和 申請專利範圍第65項記載之發明相同之作用效果以外， 因爲只有一方之黏著材膠帶之黏著劑含有硬化劑，故另一 方之黏著材膠帶之黏著劑不需要硬化劑。因此，未含有硬 -50· (46) (46)200409405 化劑之黏著劑之黏著材膠帶無需低溫管理。因此’可減少 ;必須實施低溫管理之黏著材膠帶的數量，而可使黏著材^ 帶之運送及保管獲得有效率之管理。又，未調合硬化劑之 黏著材膠帶、及調合著硬化劑之黏著材膠帶的黏著劑’ ί系 以不會和硬化劑產生反應之成分做爲另一方之黏著劑’除 了以不會和硬化劑產生反應之成分做爲硬化劑以外’尙以 使用之黏著劑做爲一方之黏著劑，故可提高黏著劑之保存 安定性。 申請專利範圍第6 7項記載之發明係向異導電材膠帶 ’其特徵爲，在芯材之縱向上實施具有膜狀黏著劑之向異 導電材之多數次捲繞積層。 又，申請專利範圍第6 8項記載之發明，係如申請專 利範圍第6 7項記載之向異導電材膠帶，其特徵爲，上述 向異導電材係在膜狀黏著劑之單面配設基材膜之2層構造 的向異導電材。 又，申請專利範圍第6 9項記載之發明，係如申請專 利範圍第67項記載之向異導電材膠帶，其特徵爲，上述 向異導電材係在膜狀黏著劑之兩面配設基材膜之3層構造 之向異導電材。 又，申請專利範圍第7 0項記載之發明，係如申請專 利範圍第68或69項記載之向異導電材膠帶，其特徵爲， 對基材膜之單面或兩面實施剝離處理。 又，申請專利範圍第7 1項記載之發明，係如申請專 利範圍第6 7至7 0項之其中任一項記載之向異導電材膠帶 -51 - (47)200409405 ，膜狀黏 又， 利範圍第 ，基材膜 度爲1 00 透明之著 ，亦很容 【實施方 其次 明。又， 同符號。 首先 〜4項記： 第1 材盤間之 部份（A 帶之端膠 材膠帶來 之黏著劑 的剖面圖 黏著 配設著捲 7。亦即， 著劑之寬度爲0.5〜5mm。 申請專利範圍第7 2項記載之發明，係如申請專 6 8至7 1項之其中任一項記載之向異導電材膠帶 之強度爲12kg/mm2以上、伸展爲60〜2 0 0 %、厚 V ιώ以下。其次，若基材膜爲有色透明或有色不 色時，很容即可實施基材膜及黏著劑之判別，又 易判別捲出部之位置，故可提高作業性。 式】 ，參照附錄圖面，針對本發明之實施形態進行說 以下之說明中，同一或同等之構成要素會附與相 ’參照第1圖〜第5圖，針對申請專利範圍第1 β之發明之實施形態進行說明。 圖係第1實施形態之黏著材膠帶連接方法之黏著 連接的斜視圖，第2圖Α及Β係第1圖之連接 >之連接步驟圖，第2圖A係已使用之黏著材膠 帶的剖面斜視圖，第2圖B係反折已使用之黏著 連接新黏著材膠帶之斜視圖，第3圖係黏著裝置 壓著步驟的槪略圖，第4圖係電路基板間之黏著 ，第5圖係黏著材膠帶之製造方法的步驟圖。 材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 軸5、及配置於黏著材膠帶1之兩寬度側之側板 各盤3、3 a具有捲軸5、及分別配置於黏著材 •52- (48) (48)200409405 膠帶1之兩寬度側之側板7。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏者劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子 、或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶 瓷、塑膠等高分子核材等覆蓋構成前述導電粒子13之材 料所構成之導電層等來形成導電粒子1 3。此外，亦可應 用以絕緣層覆蓋前述導電粒子1 3之絕緣覆膜粒子、或倂 用導電粒子1 3及絕緣粒子等。在焊錫等之熱熔融金屬、 或塑膠等之高分子核材上形成導電層者，會具有因加熱加 S ^力卩壓而產生變形之變形性，故連接後之電極間距離會 ϋ /j、’連接時可增加和電路之接觸面積，而可提高信賴性 °尤其是’以高分子類做爲核材更佳，因導電粒子1 3如 火旱ί易並沒有融點，在廣泛之連接溫度下亦可控制於軟化狀 -53- (49) (49)200409405 態’而可得到很容易即可對應電極之厚度及平坦性之誤差 的連接構件。 其次’針對本實施形態之黏著材膠帶1之使用方法進 行說明。如第3圖所示，將黏著材膠帶1之盤3 a、及捲 取盤17裝著至黏著裝置15，將捲繞於盤3a上之黏著材 膠帶1的前端經由導引銷22裝設至捲取盤1 7，並捲出黏 著材膠帶1 (第3圖中之箭頭E )。其次，將黏著材膠帶 1配置於電路基板2 1上，以配置於兩盤3 a、1 7間之加熱 加壓頭1 9從基材9側實施黏著材膠帶1之壓接，將黏著 劑11壓著至電路基板2丨。其後，將基材9捲取至捲取盤 17。 上述壓著後（暫時連接），實施電路基板21之電極 及配線電路（電子構件）2 3之電極的定位並進行正式連 接。正式連接如第4圖所示，在壓著至電路基板21上之 黏著劑1 1上配置配線電路（或電子構件）2 3，必要時， 可將例如聚四氟乙烯材2 4當做緩衝材，以加熱加壓頭1 9 對電路基板2 1實施配線電路2 3之加熱加壓。利用此方式 ，可連接電路基板2 1之電極2 1 a及配線電路2 3之電極 23a 〇 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較 多，一次使用之黏著劑11的使用量會遠大於傳統上之使 用量。因此’捲繞於盤3 a上之黏著材膠帶1之使用量亦 會變多，捲繞於盤3a上之黏著材膠帶1在相對較短之時 -54- (50) (50)200409405 間內會被捲取至捲取盤1 7，而露出捲繞於盤3 a上之黏著 材膠帶1之結束標記2 8 (參照第1圖）。 本發明之黏著材膠帶之連接方法可以分成下述2種， C a )直接使用捲取盤1 7，更換已使用之黏著材膠帶1之 殘餘捲數變少的黏著劑膠帶，並連接新黏著劑膠帶及捲取 盤1 7， （ b )將已使用之黏著材膠帶1之殘餘捲數變少的 黏著劑膠帶當做捲取盤1 7使用，並連接新黏著劑膠帶及 殘餘捲數變少的黏著劑膠帶。 (b )時，如第1圖所示，爲了將盤3 a更換成新黏著 材盤3，在盤3 a之黏著材膠帶1上會實施盤3 a之黏著材 膠帶（一方之黏著材膠帶）1之終端部3 0、及捲繞於新黏 著材盤3上之黏著材膠帶（另一方之黏著材膠帶）1之始 端部3 2之連接。 此黏著材膠帶1之連接上，在露出已使用之盤3&之 黏著材膠帶1之結束標記2 8時，會如第2圖A所示’會 從黏著材膠帶1之結束標記2 8附近切斷（B ) ’並將黏著 材膠帶1之終端部3 0反折，使黏著材膠帶1之黏著劑1 1 面位於上側（第2圖B )。其次’將新黏著材盤3之黏著 材膠帶1之始端部3 2之黏著劑1 1面重疊於已使用之盤 3 a之黏著材膠帶1之終端部3 〇之黏著劑1 1面上（第2 圖B )。 其次，如第4圖所示，將兩者之重β部份置於工作台 104上，以黏著裝置15之加熱加壓頭I9實施加熱加壓進 行黏著。利用此方式，即可連接捲繞於已使用之盤3a上 -55- (51) (51)200409405 之黏著材膠帶1、及捲繞於新盤3上之黏著材膠帶1。其 次，將已使用之盤3 a及新盤3互相對換，將新盤3裝著 至黏著裝置15。因此，無需實施將黏著材膠帶1裝著至 捲取盤1 7之作業。又，因以黏著劑1 1面間之重疊來進行 黏著，故有較高之連接強度。 又，黏著材膠帶1上之結束標記2 8之位置，當黏著 材膠帶1從已使用之盤（黏著材膠帶1完全捲出之盤）3a 延伸至加熱加壓頭1 9爲止時，應爲從黏著材膠帶1固定 於已使用之盤3 a上之固定位置至加熱加壓頭1 9爲止之長 度的位置上。此時，從結束標記2 8之附近切斷，即使從 必要之最小位置切斷黏著材膠帶1，除了可防止黏著材膠 帶1之浪費以外，當可避免將拆下已使用之盤3a並移動 已使用之盤3 a使結束標記2 8到達加熱加壓頭1 9之位置 的繁複作業。 此實施形態時，因黏著裝置I 5具有加熱加壓頭1 9， 並利用此加熱加壓頭1 9來實施已使用之盤3 a之黏著材膠 帶1之終端部3 0之黏著劑11、及新黏著材盤3之黏著材 膠帶1之始端部3 2之黏著劑1 1的連接，故無需另外使用 以實施黏著劑1 1間之壓著爲目的之壓著用器具’即可實 施已捲繞著黏著材膠帶1之盤3、3a之更換。 直接使用（a )之捲取盤1 7 ’將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶’並 實施新黏著劑膠帶及捲取盤之連接時，在露出已使用 之盤3 a之黏著材膠帶1之結束標記2 8時從黏著材膠帶1 -56- (52) (52)200409405 之結束標記2 8附近切斷，將殘留於捲取盤1 7側之黏著 膠帶之終端部反折，使黏著劑1 1面成爲上側。其次， 此黏著材膠帶1之終端部之黏著劑1 1面、及新黏著材 3之黏著材膠帶1之始端部32之黏著劑11面互相重疊 其次，將兩者之重疊部份置於工作台1 04上’以黏著裝 1 5之加熱加壓頭1 9進行加熱加壓實施黏著。利用此方 ，可連接捲繞於捲取盤1 7上之黏著材膠帶1、及捲繞 新盤3上之黏著材膠帶1。利用此方式’因爲捲取盤 只會捲取基材9，故可捲取數個黏著材盤份，減少捲取 1 7之更換次數，而有良好之作業效率。 此處，參照第5圖，針對本實施形態之黏著材膠帶 之製造方法進行說明。 在從捲出機 25捲出之基材（separator ) 9上，以 布機2 7塗布由樹脂及導電粒子1 3混合而成之黏著劑 ，並以乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材 。被捲取之黏著材膠帶1之原始材料，以切割機3 3切 特定寬度並捲取至捲軸後，從兩側將側板7、7裝著於 軸上，或者，捲取至附側板之捲軸上，將其和除濕材一 綑包，實施低溫（-5 °C〜-1 〇 °C ).之管理並進行出貨。 其次，針對本發明之第2實施形態進行說明，以下 說明係以和上述實施形態不同之點爲主。 第6圖所示之第2實施形態時，係利用新黏著材盤 之黏著材膠帶1之始端部32具有之前導膠帶41，實施 黏著材盤3之黏著材膠帶1、及捲繞於已使用之盤3a -57- (53) (53)200409405 之黏著材膠帶1之連接。前導膠帶4 1係由基材6 3及其背 面之黏著劑4 3面所構成’新黏著材盤3之黏著材膠帶1 之始端部3 2，係利用前導膠帶4 1貼附於捲附至盤上之黏 著材膠帶1之基材9面來固定。其次’從基材9面剝離前 導膠帶4 1，並使其和反折之黏著材膠帶1之終端部3 0之 黏著劑1 1面重疊。將兩者之重疊部份置於工作台1 0 4上 ，以黏著裝置1 5之加熱加壓頭1 9進行加熱加壓實施黏著 。如此，因爲利用黏著材膠帶1之前導膠帶4 1實施全部 捲出之黏著材膠帶1之終端部3 0、及新裝著之黏著材膠 帶1之始端部3 2的黏著’故黏著材膠帶1間之連接十分 簡單。此時，配設於前導膠帶41之基材63之背面側的黏 著劑4 3面具有粘著性’亦可只利用使其重疊於反折之黏 著材膠帶1之終端部3 0之黏著劑1 1面的方式來實施連接 〇 本發明並未受限於上述之實施形態’只要在未背離本 發明之要旨的範圍內，可實施各種變形。 例如，上述之第2實施形態時’不反折捲繞於已使用 之盤3a上之黏著材膠帶1，而如第7圖所示，從基材9 面剝離新裝著之黏者材膠帶1之始贿部J 2之則導膠帶4 1 ，並將其貼附於背面之黏著劑1 1面，使前導膠帶4 1連接 於已使用之黏著材膠帶1之終端部3 0之黏著劑1 1面，再 以黏著裝置1 5之加熱加壓頭1 9進行加熱加壓實施黏著亦 可。此時，因無需反折全部捲出之黏著材膠帶1，故可防 止將黏著材膠帶1捲取至捲取盤時可能發生之捲取散亂。 -58- (54) (54)200409405 此時，從基材9面剝離黏著材膠帶1之始端部3 2之 前導膠帶4 1，並將前導膠帶4 1黏著於已使用之黏著材膠 帶1之基材9面亦可。 其次，針對申請專利範圍第5〜8項記載之發明進行 說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第5〜8項記載之發明之背 景技術進行說明。 一般而言，液晶面板、P D P (電漿顯示面板）、E L ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間的電性連接 方法，係採用黏著材膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3 mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 •59- (55) (55)200409405 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材盤的更換更 爲頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電 子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3 mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第5〜8項記載之發明的目的， 係在提供一種黏著材膠帶之連接方法，可使黏著材盤之更 換較爲簡單，而提高電子機器之生產效率。 其次，參照第8圖A〜C、第3圖〜第5圖，針對本 發明之第1實施形態進行說明。第8圖A〜C係第1實施 形態之黏著材膠帶之連接方法圖，第8圖· A係黏著材盤 間之連接的斜視圖，第8圖B係第8圖A之連接部份之 -60· (56) (56)200409405 連接方法的斜視圖，第8圖c係第8圖A之連接部份之 平面圖。 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7。本實施形態時，黏著材膠帶1之長度約爲5 0m、寬度 W約爲5 m m。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 AU、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子 、或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶 瓷、塑膠等高分子核材等覆蓋構成前述導電粒子13之材 料所構成之導電層等來形成導電粒子1 3。此外，亦可應 用以絕緣層覆蓋前述導電粒子1 3之絕緣覆膜粒子、或倂 用導電粒子1 3及絕緣粒子等。在焊錫等之熱熔融金屬、 -61 - (57) (57)200409405 或塑膠等之高分子核材上形成導電層者，會具有因加熱加 壓或加壓而產生變形之變形性，故連接後之電極間距離會 縮小，連接時可增加和電路之接觸面積，而可提高信賴性 。尤其是，以高分子類做爲核材更佳，因導電粒子1 3如 焊錫並沒有融點，在廣泛之連接溫度下亦可控制於軟化狀 態，而可得到很容易即可對應電極之厚度及平坦性之誤差 的連接構件。 其次，針對本實施形態之黏著材膠帶1之使用方法進 行說明。如第3圖所示，將黏著材膠帶1之盤3 a、及捲 取盤17裝者至黏者裝置15’將捲繞於盤3a上之黏著材 膠帶1之前端經由導引銷22裝設至捲取盤17，並捲出黏 著材膠帶1(第3圖中之箭頭E)。其次，將黏著材膠帶 1配置於電路基板2 1上，以配置於兩盤3 a、〗7間之加熱 加壓頭1 9從基材9側實施黏著材膠帶1之壓接，將黏著 劑1 1壓著至電路基板2 1。其後，將基材9捲取至捲取盤 17° 上述壓著後（暫時連接），實施電路基板2 1之電極 及配線電路（電子構件）23之電極的定位並進行正式連 接。正式連接如第4 .圖所示，在壓著至電.路基板2 1上之 黏著劑1 1上配置配線電路（或電子構件）2 3，必要時， 可將例如聚四氟乙烯材2 4當做緩衝材，以加熱加壓頭1 9 對電路基板2 1實施配線電路2 3之加熱加壓。利用此方式 ，可連接電路基板2 1之電極2 1 a及配線電路2 3之電極 23a ° -62- (58) (58)200409405 利用本實施形態之黏著材膠帶1之P D P，其尺寸會較 大，有時會對p D P之周圍全體實施壓著，連接部份會較 多，一次使用之黏著劑1 1的使用量會遠大於傳統上之使 用量。因此，捲繞於盤3 a上之黏著材膠帶1之使用量亦 會變多，捲繞於盤3 a上之黏著材膠帶1在相對較短之時 間內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著 材膠帶1之結束標記2 8 (參照第8圖A )。 本發明之黏著材膠帶之連接方法可以分成下述2種， (a )直接使用捲取盤1 7，更換已使用之黏著材膠帶]之 殘餘捲數變少的黏著劑膠帶，並連接新黏著劑膠帶及捲取 盤1 7，（ b )將已使用之黏著材膠帶1之殘餘捲數變少的 黏著劑膠帶當做捲取盤1 7使用，並連接新黏著劑膠帶及 殘餘捲數變少的黏著劑膠帶。 (b )時，如第8圖A所示，爲了將盤3 a更換成新黏 著材盤3，在盤3 a之黏著材膠帶1露出結束標記2 8時， 會實施盤3a之黏著材膠帶（一方之黏著材膠帶）1之終 端部30、及捲繞於新黏著材盤3上之黏著材膠帶（另— 方之黏著材膠帶）之始端部3 2之連接（參照第8圖a ) 〇 此黏著材膠帶1之連接上，如第8圖B及C所示， 會針對黏著材盤3 a之黏著材膠帶1之終端部3 0、及新黏 著材盤3之黏著材膠帶1之始端部32，使始端部32之|占 著劑1 1面重疊於終端部3 0之基材9面上。其次，將略μ 口字形之卡止銷46***重疊部份，實施黏著材膠帶1之 -63- (59) (59)200409405 終端部3 0、及新黏著材盤3之黏著材膠帶1之始部」2 之連接。 利用此方式，可實施捲繞於已使用之盤3 a上之黏著 材膠帶1、及捲繞於新盤3上之-黏著材膠帶1之連接。如 此，可以卡止銷4 6固定已全部捲出之黏著材膠帶1之終 端部3 0、及新裝著之黏著材膠帶1之始端部3 2，故連接 十分簡單。 其次，將已使用之盤3 a及新盤3互相對換，將新盤 3裝著至黏著裝置1 5。因此，無需實施將新黏著材膠帶1 裝著至捲取盤17之作業。 直接使用（a )之捲取盤1 7，將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶’並 實施新黏著劑膠帶及捲取盤1 7之連接時’在露出已使用 之盤3 a之黏著材膠帶1之結束標記2 8時從黏著材膠帶1 之結束標記2 8附近切斷’使殘留於捲取盤1 7側之黏著材 膠帶之終端部3 0、及新黏著材盤3之黏著材膠帶1之始 端部32重疊。其次，將略呈〕字形之卡止銷46***兩者 之重疊部份，實施黏著材膠帶〗之終端部3 0、及新黏著 材盤3之黏著材膠帶1之始端部3 2之連接。 因爲捲取盤17只會捲取基材9，故可捲取數個黏著 材盤份。因此，可減少捲取盤1 7之更換次數，而有良好 之作業效率。 其次，針對申請專利範圍第5〜8項記載之發明的第 2〜第4實施形態進行說明’以下說明之實施形態中，相 -64 - (60) (60)200409405 同部份會附與相同符號並省略該部份之詳細說明，以下 說明係以和上述第1實施形態不同之點爲主。 第9圖所示之第2實施形態時，係利用具有配設於 方及另一方之端部之爪部4 8、4 9、及連結兩端之爪部 、4 9之彈性構件5 0的卡止構件4 7，實施一方之黏著材 帶1之終端部3 0及另一方之黏著材膠帶1之始端部3 2 連接。具體而言，使一方之黏著材膠帶1之終端部3 0 另一方之黏著材膠帶1之始端部3 2互相抵接，使配設 卡止構件4 7之一端之爪部4 8卡止於終端部3 0，並使 設於另一端之爪部49卡止於始端部32，並以彈性構件 拉近一方之爪部48及另一方之爪部49。又，爪部48、 係在板構件之背面配設前端爲尖形之複數爪5 1者。 因係使配設於卡止構件47之一端之爪部48卡止於 端部3 0，並使配設於另一端之爪部4 9卡止於始端部 來連接兩者，故連接十分容易。又，因爲一方之爪部 及另一方之爪部4 9之間具有彈性構件5 0，彈性構件 可伸展而將卡止構件47之另一方之爪部49卡止於另一 之黏著材膠帶1之始端部3 2之任意位置上，故連接具 高自由度。 第1 0圖所示之第3實施形態時，會針對捲繞於已 用之盤3 a上之黏著材膠帶1之終端部3 0、及新黏著材 3之黏著材膠帶1之始端部3 2，使始端部3 2之黏著劑 面重疊於終端部3 0之基材9面上，其次，以橫剖面略 3字形之可彈性變形之夾子5 3夾住重疊部份實施固定 -65- (61) (61)200409405 因爲只以夾子5 3夾住重疊部份來實施連接，故連接作業 十分容易。 第1 1圖所示之第4實施形態時，係在第1實施形態 中，以橫剖面略呈〕字形之金屬製夾持片5 5覆蓋重疊部 份，並從重疊部份之兩面壓扁夾持片55來連接兩者。因 係從重疊部份之兩面壓扁夾持片5 5來實施連接，故可利 用重疊部份獲得強固之連接。 申請專利範圍第5〜8項記載之發明並未受限於上述 實施形態，只要未背離申請專利範圍第5〜8項記載之發 明之要旨的範圍內，可實施各種變形。 例如，上述之第1實施形態時，卡止銷46並非略呈 ^字形，而爲1支線狀銷亦可，此時，應以複數個銷來固 定重疊部份。 第2實施形態時，亦可配合黏著材膠帶1之寬度來使 用複數個卡止構件47。 第3實施形態及第4實施形態時，亦可使用複數個夾 子5 3或夾持片5 5，並分別從黏著材膠帶1之重疊部份之 兩側進行固定。 其次，針對申請專利範圍第9〜1 3項記載之發明進行 說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第9〜1 3項記載之發明之背 -66- (62) (62)200409405 景技術進行說明。 一般而言，液晶面板、P D P (電發顯示面板）、E L ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開2 00 1 -2 8400 5號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3 m m程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤’將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大’ 一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大’黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材盤的更換更 爲頻繁，因爲黏著材盤之更換十分麻煩’故有無法提高電 子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 •67- (63) (63)200409405 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3 mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高’可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第9〜1 3項記載之發明的目的， 係在提供一種黏著材膠帶之連接方法，可使黏著材盤之更 換較爲簡單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第9〜1 3項 記載之發明之實施形態進行說明，首先，參照第1 2圖A 、：B、第3圖〜第5圖，針對申請專利範圍第9〜1 3項記 載之發明之第1實施形態進行說明。第1 2圖A〜C係第1 實施形態之黏著材膠帶之連接方法圖，第1 2圖A係黏著 材盤間之連接的斜視圖，第1 2圖B係第1 2價A之連接 部份之連接方法的斜視圖。 黏著材膠帶1係分別捲繞於盤3、3a，各盤3、3a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 7。本實施形態時，黏著材膠帶1之長度約爲5 0m、寬度 W約爲3mm。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 -68- (64) (64)200409405 k強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由opp (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之P E T (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基醋系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 An、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子 、或碳、石墨等’亦可在前述之物及/或非導電性之玻璃 、陶瓷、塑膠等局分子核材等覆蓋前述導電層等來形成。 此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒 子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金 屬、或塑膠等之局分子核材上形成導電層者，會具有因加 熱加壓或加壓而產生變形之變形性，故連接後之電極間距 離會縮小，連接時可增加和電路接觸之面積，而可提高信 賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有 融點，在廣泛之連接溫度下亦可控制於軟|化狀態，而可得 到很容易即可對應電極之厚度及平坦性之誤差的連接構件 〇 其次，針對本貧施形態之黏著材膠帶之使用方法進行 說明。如第3圖所示，將黏著材膠帶1之盤3a、及捲取 -69- (65) (65)200409405 盤1 7裝者至黏著裝置1 5，捲繞於盤3 a上之黏著材膠帶1 之前端裝設至捲取盤7，並捲出黏著材膠帶ι(第3圖中 之⑥頭E )。其次，將黏著材膠帶1配置於電路基板2 1 上’以配置於兩盤3 a、1 7間之加熱加壓頭]9從基材9側 貫施黏著材膠帶1之壓接，將黏著劑1 1壓著至電路基板 2 ]。其後，將基材9捲取至捲取盤1 7。 上述壓者後（暫時連接），實施電路基板21之電極 及配線電路（電子構件）2 3之電極的定位並進行正式連 接。正式連接上，如第4圖所示，在壓著至電路基板2 ! 上之黏著劑1 1上配置配線電路（或電子構件）2 3 ,必要 時’可將例如聚四氟乙烯材24當做緩衝材，以加熱加壓 頭1 9對電路基板2 1實施配線電路23之加熱加壓。利用 此方式，可連接電路基板2 1之電極2 1 a及配線電路2 3之 電極23a。 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大’有時會對PDP之周圍全體實施壓著，連接部份會較 多’一次使用之黏著劑1 1的使用量會遠大於傳統上之使 用量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦 會變多，捲繞於盤3 a上之黏著材膠帶1在相對較短之時 間內會被捲取至捲取盤1 7，而露出捲繞於盤3 a上之黏著 材膠帶1之結束標記2 8 (參照第1 2圖A )。 申請專利範圍第9〜1 3項記載之發明之黏著材膠帶之 連接方法可以分成下述2種，（a )直接使用捲取盤1 7， 更換已使用之黏著材膠帶1之殘餘捲數變少的黏著劑膠帶 -70- (66) 200409405 ，並連接新黏著劑膠帶及捲取盤17， （ b )將已使用之黏 著材膠帶1之殘餘捲數變少的黏著劑膠帶當做捲取盤I 7 使用，並連接新黏著劑膠帶及殘餘捲數變少的黏著劑膠帶The invention described in item 64 of the scope of patent application is the invention described in any one of the scope of patent applications 60 to 63, characterized in that the surface roughness Rm ax of the substrate is 0. 5 m or less. The surface roughness R m a X of the substrate should be 0.  5 // The reason below m is as follows, if Rm ax exceeds 0. 5 // m, because of the unevenness on the surface of the substrate, the adhesive cannot be easily separated from the substrate when the adhesive is pressed to the circuit substrate. The invention described in the patent application No. 65 is an adhesive material forming method for forming an adhesive material on a covering body by using an adhesive material tape coated with an adhesive on a substrate and rolled into a disc shape. The characteristics are as follows: Plural -49- (45) (45) 200409405 Pull out the adhesive tape to make the adhesive tapes overlap each other. Peel off the square substrate to form an overlapping adhesive on the cover. In the invention described in item 65 of this application, the adhesive surface of the adhesive tape rolled from the square of the first side and the adhesive surface of the adhesive tape rolled from the other side of the disk overlap to make the adhesive. The tape becomes ~ body. The base material of the adhesive tape on one side will be wound up to the winding tray, and the adhesive agent of the laminated adhesive tape will be pressed by the pressure heating head to the body s. Cover system electronic components or circuit substrates, such as lead frames or leads, wafers for wire frames, etc. In this way, one step before the adhesive is formed on the covering body, the adhesive of the adhesive tape of one side and the adhesive of the adhesive tape of the other can be overlapped, and then the adhesive is formed on the covering body after the desired thickness of the adhesive is obtained. When the number of rolls of the adhesive tape is increased, the winding diameter of the adhesive tape per disc can be reduced. Therefore, the number of rolls of adhesive tape per reel can be increased, and the amount of adhesive that can be used in one replacement operation can be greatly increased. Therefore, fewer replacements of new adhesive tapes are required, which can improve the production efficiency of electronic machines. The invention described in item 6 of the scope of patent application is the invention described in item 1 of the scope of patent application, which is characterized in that only one adhesive of the adhesive tape includes a hardener. When the invention described in the scope of patent application No. 66 of this application has the same function and effect as the invention described in the scope of patent application No. 65, only the adhesive of one adhesive tape contains a hardener, so the other adhesive material The adhesive of the tape does not require a hardener. Therefore, adhesive tapes that do not contain hard -50 · (46) (46) 200409405 adhesives do not require low temperature management. Therefore, ′ can reduce the number of adhesive tapes that must be managed at low temperature, and it is possible to achieve efficient management of the transportation and storage of adhesive tapes. In addition, the adhesive of the adhesive tape without the curing agent and the adhesive of the adhesive tape with the curing agent are used as the adhesive of the other side, except that the component does not react with the curing agent. The component that reacts with the agent is used as an adhesive other than the hardening agent, and the adhesive used is used as one of the adhesives, so the storage stability of the adhesive can be improved. The invention described in item 67 of the scope of the patent application is an anisotropic conductive tape. It is characterized in that the anisotropic conductive material with a film-like adhesive is wound in multiple layers in the longitudinal direction of the core material. The invention described in item 68 of the scope of patent application is an anisotropic conductive tape as described in item 67 of the scope of patent application, characterized in that the anisotropic conductive material is arranged on one side of the film-shaped adhesive. An anisotropic conductive material having a two-layer structure of a base film. In addition, the invention described in the scope of the patent application No. 69 is the tape of the anisotropic conductive material described in the scope of the patent application No. 67, characterized in that the aforementioned anisotropic conductive material is provided with a base material on both sides of the film-shaped adhesive An anisotropic conductive material with a 3-layer structure. The invention described in claim 70 of the scope of patent application is an anisotropic conductive tape as described in claim 68 or 69 of the scope of patent application, and is characterized in that a peeling treatment is performed on one or both sides of the base film. The invention described in item 71 of the scope of patent application is the anisotropic conductive tape -51-(47) 200409405 described in any one of the scope of claims 67 to 70 of the scope of patent application. The first is the range of benefits, and the substrate film is 100 transparent, which is also very easy to understand [implemented by the second. Again, the same symbol. First ~ 4 notes: Section 1 of the section between the material plate (the tape of the adhesive tape from the end of the A tape) Adhesive is equipped with a volume 7. That is, the width of the adhesive is 0. 5 ~ 5mm. The invention described in item 72 of the scope of the patent application is the strength of the anisotropic conductive tape described in any one of the applications 68 to 71, and the strength is 12 kg / mm2 or more, and the stretch is 60 to 2000%. Thick V ο following. Secondly, if the base film is colored or transparent or colored, the identification of the base film and the adhesive can be easily carried out, and the position of the roll-out portion can be easily determined, thereby improving workability. [Formula] With reference to the drawings of the appendix, the following describes the embodiment of the present invention. In the following description, the same or equivalent constituent elements will be attached to each other. An embodiment will be described. The figure is a perspective view of the adhesive connection of the adhesive material tape connection method of the first embodiment. Figs. 2A and B are the connection step diagrams of the connection of Fig. 1 and Fig. 2A is the used adhesive tape. Sectional perspective view, Fig. 2B is a perspective view of a re-folded used adhesive connection new adhesive tape, Fig. 3 is a schematic diagram of the pressing step of the adhesive device, Fig. 4 is the adhesion between circuit boards, Fig. 5 It is a process chart of the manufacturing method of an adhesive tape. The material tape 1 is wound around the discs 3 and 3 a, the upper shaft 5 of each of the discs 3 and 3 a, and the side plates 3 and 3 a arranged on the two width sides of the adhesive material tape 1 each have the reels 5 and are disposed separately. To the adhesive material • 52- (48) (48) 200409405 Side plate 7 on both width sides of the adhesive tape 1. The adhesive tape 1 is composed of a substrate 9 and an adhesive 11 applied to one side surface of the substrate 9. In terms of strength and peelability of the adhesive constituting the anisotropic conductive material, the substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or silicon-treated PET (polyethylene terephthalate). ), Etc., however, it is not limited to this. The adhesive 1 1 is a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a thermal metal system. Thermoplastic resins are typified by styrene resins and polyester resins, while thermosetting resins are typified by epoxy resins, vinyl ester resins, acrylic resins, and silicone resins. Conductive particles 1 3 are dispersed in the adhesive agent 1 1. The conductive particles 1 3 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or carbon, graphite, etc., and can also be used in the foregoing and non-conductive glass, ceramics, and plastics. The conductive particles 13 are formed by covering a conductive layer or the like made of a material constituting the conductive particles 13 with a polymer core material or the like. In addition, it is also possible to apply an insulating coating particle that covers the aforementioned conductive particles 13 with an insulating layer, or to use conductive particles 13 and insulating particles with an insulating layer. Forming a conductive layer on a hot molten metal such as solder or a polymer core material such as plastic will have deformability due to heating and S ^ pressure, so the distance between the electrodes after connection will be ϋ / j , 'When connecting, it can increase the contact area with the circuit, which can improve the reliability. Especially, it is better to use a polymer as the core material, because conductive particles 13 such as fire and drought are easy to melt and have no melting point. The connection temperature can also be controlled in the softened state -53- (49) (49) 200409405 ', and a connection member that can easily cope with errors in thickness and flatness of the electrode can be obtained. Next, a method of using the adhesive tape 1 according to this embodiment will be described. As shown in FIG. 3, the disk 3 a of the adhesive tape 1 and the take-up disk 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disk 3 a is installed via the guide pin 22. Go to the take-up tray 17 and roll out the adhesive tape 1 (arrow E in Figure 3). Next, the adhesive tape 1 is arranged on the circuit board 21, and the heating and pressing heads 19 arranged between the two plates 3a and 17 are pressed against the adhesive tape 1 from the substrate 9 side, and the adhesive is applied. 11 is pressed to the circuit substrate 2 丨. Thereafter, the base material 9 is taken up onto a take-up tray 17. After the above-mentioned pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 2 3 are positioned and formally connected. As shown in FIG. 4, the wiring circuit (or electronic component) 2 3 is arranged on the adhesive 11 pressed onto the circuit substrate 21. If necessary, for example, a polytetrafluoroethylene material 2 4 can be used as a buffer material. The heating and pressing head 19 is used to apply heat and pressure to the circuit board 2 1 and the wiring circuit 2 3. In this way, the electrode 2 1 a of the circuit substrate 21 and the electrode 23 a of the wiring circuit 2 3 can be connected. 〇 The PDP using the adhesive tape 1 of this embodiment has a large size, and may sometimes affect the entire periphery of the PDP. When the pressing is performed, there will be more connecting parts, and the amount of the adhesive 11 used at a time will be much larger than the traditional amount. Therefore, the amount of the adhesive material tape 1 wound on the disk 3 a will also increase. When the adhesive material tape 1 wound on the disk 3 a is relatively short -54- (50) (50) 200409405 The inside is wound up to a take-up reel 17 and the end mark 2 8 of the adhesive tape 1 wound on the reel 3 a is exposed (see FIG. 1). The connection method of the adhesive tape of the present invention can be divided into the following two types. C a) Use the take-up disk 17 directly, replace the used adhesive tape with the remaining number of the adhesive tape 1 reduced, and connect the new adhesive Adhesive tape and take-up tray 17, (b) Use the adhesive tape with less remaining rolls of the used adhesive tape 1 as the take-up tray 17 and connect the new adhesive tape and the remaining rolls with less. Adhesive tape. (b), as shown in Fig. 1, in order to replace the disc 3a with a new adhesive material disc 3, the adhesive material tape 1 of the disc 3a (one adhesive material tape is applied to the adhesive material tape 1 of the disc 3a). ) 1 is connected to the terminal part 30 of the 1 and the starting end part 3 2 of the adhesive tape (the other adhesive tape) 1 wound on the new adhesive tray 3. On the connection of this adhesive tape 1, when the end mark 2 8 of the used adhesive tape 1 of the disc 3 & is exposed, as shown in FIG. 2A, the end of the adhesive tape 1 will be near the end mark 2 8 Cut (B) 'and fold back the terminal portion 30 of the adhesive tape 1 so that the adhesive 1 1 side of the adhesive tape 1 is on the upper side (Fig. 2B). Secondly, the first side of the adhesive 3 of the adhesive tape 1 of the new adhesive plate 3 is superposed on the first side of the adhesive 3 of the adhesive tape 1 of the used disk 3 a on the first side of the adhesive 1 of the adhesive tape 1 ( Figure 2 B). Next, as shown in FIG. 4, the weight β portion of the two is placed on the table 104, and the heating and pressing head I9 of the adhesive device 15 is used for heating and pressing to perform adhesion. In this way, the adhesive tape 1 wound on the used disc 3a -55- (51) (51) 200409405 and the adhesive tape 1 wound on the new disc 3 can be connected. Next, the used disk 3 a and the new disk 3 are exchanged with each other, and the new disk 3 is mounted to the adhesive device 15. Therefore, it is not necessary to carry out the operation of mounting the adhesive tape 1 to the take-up reel 17. In addition, since the adhesion is performed by the overlap between the surfaces of the adhesive 11, the bonding strength is high. At the position of the end mark 2 8 on the adhesive tape 1, when the adhesive tape 1 extends from the used disk (the disk where the adhesive tape 1 is completely rolled out) 3a to the heating and pressing head 19, it should be From the fixed position of the adhesive tape 1 on the used disk 3 a to the position of the length up to the heating and pressing head 19. In this case, cut off from the vicinity of the end mark 28, and even if the adhesive tape 1 is cut from the necessary minimum position, in addition to preventing waste of the adhesive tape 1, it is possible to avoid removing the used disk 3a and moving it The used disc 3 a is a complicated operation for bringing the end mark 2 8 to the position of the heating and pressing head 19. In this embodiment, the adhesive device I 5 has a heating and pressing head 19, and the heating and pressing head 19 is used to implement the adhesive 11 of the terminal portion 30 of the adhesive tape 1 of the used disk 3a. Connection with the adhesive 11 of the starting end 3 2 of the adhesive tape 1 of the new adhesive plate 3, so there is no need to use another pressing device 'for the purpose of performing the pressing between the adhesive 1 and 1'. Replace the discs 3 and 3a around which the adhesive tape 1 is wound. When using (a) the take-up reel 1 7 'replace the used adhesive tape 1 with a reduced number of remaining adhesive tapes and replace it with a new adhesive tape' and implement a new adhesive tape and reel connection When the end mark 2 of the adhesive tape 1 of the used disk 3 a is exposed, it is cut from the vicinity of the end mark 2 of the adhesive tape 1 -56- (52) (52) 200409405, and it will be left on the reel The terminal part of the adhesive tape on the 7 side is folded back, so that the 11 side of the adhesive becomes the upper side. Next, the adhesive 11 side of the terminal portion of the adhesive tape 1 and the adhesive 11 side of the starting end portion 32 of the adhesive tape 1 of the new adhesive 3 overlap each other, and the overlapping portion of the two is placed in the work. On the stage 104, a heating and pressure head 19 for bonding 15 is used for heating and pressing to perform adhesion. With this method, the adhesive tape 1 wound on the take-up reel 17 can be connected to the adhesive tape 1 wound on the new reel 3. Using this method ', because the winding disk can only take up the base material 9, several adhesive material disks can be taken up, the number of replacement times of the winding 17 can be reduced, and the operation efficiency is good. Here, a method for manufacturing the adhesive tape of the present embodiment will be described with reference to Fig. 5. On the substrate 9 (separator) 9 unwound from the unwinder 25, an adhesive made of resin and conductive particles 1 3 is coated with a cloth machine 2 7 and dried in a drying oven 2 9 to be wound. Machine 3 1 takes up the original material. The original material of the rolled adhesive tape 1 is cut with a specific width by a cutter 3 and 3 and wound onto a reel, and then the side plates 7, 7 are mounted on the shaft from both sides, or it is wound onto a reel with a side plate On the bale and the dehumidification material, low temperature (-5 ° C ~ -10 ° C). Manage and ship. Next, a second embodiment of the present invention will be described. The following description will focus on the differences from the above embodiment. In the second embodiment shown in FIG. 6, the first end portion 32 of the adhesive material tape 1 with a new adhesive material plate has a front guide tape 41, and the adhesive material tape 1 of the adhesive material plate 3 is wound and used. Connection of the 3a -57- (53) (53) 200409405 of the adhesive tape 1. The leading tape 4 1 is composed of the base material 6 3 and the adhesive 4 on the backside of the 3 side. The starting end 3 2 of the adhesive tape 1 of the new adhesive plate 3 is attached to the roll with the leading tape 41. The base material 9 of the adhesive tape 1 on the plate is fixed. Next, the leading tape 41 is peeled off from the 9-side surface of the substrate, and is superposed on the 1-side surface of the adhesive 30 on the terminal portion 30 of the folded-back adhesive tape 1. The overlapping part of the two is placed on the workbench 104, and the heating and pressing head 19 of the adhesive device 15 is used for heating and pressing to perform adhesion. In this way, the adhesive tape 1 is used because the end portion 30 of the rolled adhesive tape 1 and the starting end portion 3 2 of the newly installed adhesive tape 1 are all adhered using the leading tape 4 1 of the adhesive tape 1. The connection is very simple. At this time, the adhesive 4 disposed on the back side of the base material 63 of the leading tape 41 has adhesiveness on the 3 sides. It is also possible to use only the adhesive that overlaps the terminal portion 30 of the adhesive tape 1 that is folded back. The connection is implemented in a one-sided manner. The present invention is not limited to the above-described embodiments. As long as it does not deviate from the gist of the present invention, various modifications can be made. For example, in the second embodiment described above, the adhesive tape 1 wound on the used disk 3a is not folded back, and as shown in FIG. 7, the newly installed adhesive tape is peeled off from the 9 side of the substrate. The first bribe of J 1 is the guide tape 4 1, and it is attached to the adhesive 1 on the back side, so that the leading tape 4 1 is connected to the terminal 30 of the used adhesive tape 1. 1 1 side, and then heating and pressing the heating device 19 of the adhesive device 15 to carry out heating and pressure for adhesion. At this time, since it is not necessary to fold back all the adhesive tape 1 rolled up, it is possible to prevent the coiling disorder which may occur when the adhesive tape 1 is wound up to the take-up tray. -58- (54) (54) 200409405 At this time, peel the starting end 3 of the adhesive tape 1 from the 9 side of the base material 2 and guide the tape 4 1 and adhere the leading tape 4 1 to the used adhesive tape 1 9 sides of the base material may be sufficient. Next, the inventions described in claims 5 to 8 of the scope of patent application will be described. These inventions relate to an adhesive tape for electronic components and a circuit board, or an adhesive fixation between circuit boards, and an electrical connection between the two electrodes, and in particular, to a method for connecting a tape-shaped adhesive tape. Next, the background technology of the inventions described in claims 5 to 8 will be described. Generally speaking, electronic components such as liquid crystal panels, PDP (plasma display panels), EL (fluorescent display) panels, bare chip packages, and circuit substrates, or the adhesion and fixation between circuit substrates, and The method of sexual connection uses adhesive tape. Japanese Patent Application Laid-Open No. 200 1-284005 describes a case in which an adhesive material tape on which a substrate is coated with an adhesive material is rolled into a disc shape. The width of this conventional adhesive tape is about 1 to 3 mm, and the length of the tape wound up to the disc is about 50 m. When the adhesive tape is mounted on the adhesive device, a tray of adhesive tape (hereinafter referred to as "adhesive material tray") is mounted on the adhesive device, and the beginning end of the adhesive tape is pulled out and mounted on the take-up tray. Next, from the base material side of the adhesive material tape rolled out from the self-adhesive material tray, the adhesive is pressed onto the circuit board or the like with a heating and pressing head, and the remaining substrate is taken up by a take-up disk. Second, when the adhesive tape of the adhesive material tray is used up, remove the used disk • 59- (55) (55) 200409405, and the reel of the substrate, and take up the new coil and new adhesive plate It is mounted on the adhesive device, and the beginning of the adhesive tape is mounted on the take-up reel. However, in recent years, with the enlargement of panel screens such as PDPs, the adhesion area of circuit substrates has also increased, and the amount of adhesive used at one time has also increased. In addition, as the use of the adhesive is expanded, the amount of the adhesive used is also increased. Therefore, the replacement of the adhesive material plate in the electronic equipment manufacturing factory is more frequent. Because the replacement of the adhesive material plate is very troublesome, there is a problem that the production efficiency of the electronic device cannot be improved. To solve this problem, you can consider increasing the number of adhesive tapes wound to the disk to increase the adhesive dose per disk to reduce the frequency of disk replacement. However, because the width of the adhesive tape is narrow 1 ~ 3 mm. Increasing the number of coils may cause the coiling to be scattered. Furthermore, if the number of rolls is increased, the pressure applied to the adhesive tape rolled into the shape of a tape increases, which may cause the adhesive to leak from both sides of the tape and become a cause of blockage. In addition, if the number of rolls of adhesive tape is increased, the diameter of the disk will also increase, and the existing adhesive device may not be used because it cannot be mounted on the existing adhesive device. Therefore, the purpose of the inventions described in claims 5 to 8 is to provide a method for connecting adhesive tapes, which can make the replacement of adhesive trays simpler and improve the production efficiency of electronic equipment. Next, a first embodiment of the present invention will be described with reference to Figs. 8 to A and C, and Figs. 3 to 5. Fig. 8 A to C are diagrams of the connection method of the adhesive tape of the first embodiment, Fig. 8 · A perspective view of the connection between the A plate of adhesive material, and Fig. 8 B of the connection part of Fig. 8 A -60 · (56) (56) 200409405 A perspective view of the connection method, and Fig. 8c is a plan view of the connection part of Fig. 8A. The adhesive tape 1 is wound around the disks 3 and 3a, respectively. Each of the disks 3 and 3a is provided with a reel 5 and side plates 7 arranged on both width sides of the adhesive tape 1. In this embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 5 m. The adhesive tape 1 is composed of a substrate 9 and an adhesive 11 applied to one side surface of the substrate 9. In terms of strength and peelability of the adhesive constituting the anisotropic conductive material, the substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or silicon-treated PET (polyethylene terephthalate). ), Etc., however, it is not limited to this. The adhesive 1 1 is a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a thermal metal system. Thermoplastic resins are typified by styrene resins and polyester resins, while thermosetting resins are typified by epoxy resins, vinyl ester resins, acrylic resins, and silicone resins. Conductive particles 1 3 are dispersed in the adhesive 11. The conductive particles 1 3 are metal particles such as AU, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or carbon, graphite, etc., and can also be used in the foregoing and non-conductive glass, ceramics, and plastics. The conductive particles 13 are formed by covering a conductive layer or the like made of a material constituting the conductive particles 13 with a polymer core material or the like. In addition, it is also possible to apply an insulating coating particle that covers the aforementioned conductive particles 13 with an insulating layer, or to use conductive particles 13 and insulating particles with an insulating layer. Forming a conductive layer on a hot-melt metal such as solder or a polymer core material such as -61-(57) (57) 200409405 or plastic will have deformability due to heat and pressure or pressure, so the connection The distance between the rear electrodes will be reduced, and the contact area with the circuit can be increased when connected, which can improve reliability. In particular, it is better to use polymers as the core material. Since the conductive particles 13 such as solder do not have a melting point, they can be controlled in a softened state at a wide range of connection temperatures, and it is easy to get the thickness of the electrode. And the flatness of the connection member. Next, a method of using the adhesive tape 1 according to this embodiment will be described. As shown in FIG. 3, the disk 3a of the adhesive tape 1 and the take-up disk 17 are mounted to the adhesive device 15 ', and the front end of the adhesive tape 1 wound on the disk 3a is installed through the guide pin 22. It is set to the take-up reel 17, and the adhesive tape 1 is wound out (arrow E in FIG. 3). Next, the adhesive tape 1 is arranged on the circuit board 21, and the heating and pressing heads 19 arranged between the two plates 3a and 7 are pressed against the adhesive tape 1 from the substrate 9 side, and the adhesive is applied. 1 1 is pressed to the circuit board 21. Thereafter, the substrate 9 is wound up to a take-up reel of 17 °. After the above compression (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and formally connected. Formally connected as in Section 4. As shown in the press to electricity. Wiring circuit (or electronic component) 2 3 is arranged on the adhesive 11 on the circuit substrate 2 1. If necessary, for example, a polytetrafluoroethylene material 2 4 can be used as a buffer material to heat the pressure head 1 9 to the circuit substrate 2 1 Apply heat and pressure to the wiring circuit 2 3. In this way, the electrode 2 1 a of the circuit board 21 and the electrode 23 a of the wiring circuit 2 3 can be connected. -62- (58) (58) 200409405 Using the PDP of the adhesive tape 1 of this embodiment, the size will be smaller than Large, sometimes the entire periphery of the p DP is pressed, and the connection part will be more. The amount of the adhesive 11 used at a time will be much larger than the traditional amount. Therefore, the amount of the adhesive tape 1 wound on the disk 3 a will also increase, and the adhesive tape 1 wound on the disk 3 a will be wound to the take-up disk 17 in a relatively short period of time. Then, the end mark 2 8 of the adhesive material tape 1 wound on the disc 3a is exposed (see FIG. 8A). The connection method of the adhesive tape of the present invention can be divided into the following two types. (A) Use the take-up reel 17 directly, and replace the used adhesive tape. Adhesive tape and take-up tray 17 (b) Use the adhesive tape with less remaining rolls of the used adhesive tape 1 as the take-up tray 17 and connect the new adhesive tape and the remaining rolls to reduce Adhesive tape. At (b), as shown in FIG. 8A, in order to replace the disc 3a with a new adhesive material disc 3, when the adhesive tape 1 of the disc 3a is exposed to the end mark 28, the adhesive tape of the disc 3a will be implemented. (One side of the adhesive tape) 1 is connected to the terminal portion 30 of the new adhesive tape 3 (the other side of the adhesive tape) and the starting end portion 3 2 (refer to Figure 8 a) 〇The connection of this adhesive tape 1 is shown in Figures 8 and 8B. It will target the terminal 30 of the adhesive tape 1 of the adhesive plate 3 a and the adhesive tape 1 of the new adhesive plate 3. The starting end portion 32 is such that the | occupant 1 1 side of the starting end portion 32 overlaps the base 9 side of the terminal portion 30. Next, insert a slightly μ-shaped locking pin 46 into the overlapped portion, and implement the adhesive tape 1-63- (59) (59) 200409405 terminal 30 and the adhesive tape 1 of the new adhesive plate 3 Start "2 connection. In this way, the adhesive tape 1 wound on the used disk 3 a and the adhesive tape 1 wound on the new disk 3 can be connected. In this way, the locking pin 4 6 can be used to fix the end 30 of the adhesive tape 1 that has been completely rolled out, and the starting end 32 of the newly installed adhesive tape 1, so the connection is very simple. Next, the used disk 3 a and the new disk 3 are exchanged with each other, and the new disk 3 is mounted on the adhesive device 15. Therefore, it is not necessary to perform the operation of mounting the new adhesive tape 1 on the take-up reel 17. Directly use the take-up reel 17 of (a), replace the used adhesive tape with less remaining rolls of the adhesive tape 1 with new adhesive tape 'and implement the new adhesive tape and reel 17 At the time of connection, 'the end mark 2 of the adhesive tape 1 of the used disk 3 a is exposed at 8 o'clock, and it is cut from the vicinity of the end mark 2 of the adhesive tape 1 at 8' so that the adhesive tape left on the winding disk 17 side The terminal portion 30 and the starting end portion 32 of the adhesive tape 1 of the new adhesive plate 3 overlap. Next, the locking pin 46 in the shape of [] is inserted into the overlapped portion of the two, and the end portion 30 of the adhesive tape is connected to the starting end portion 32 of the adhesive tape 1 of the new adhesive plate 3. Since the take-up disc 17 only takes up the base material 9, several adhesive material discs can be taken up. Therefore, the number of replacements of the reel 17 can be reduced, and the operation efficiency can be improved. Next, the second to fourth embodiments of the inventions described in items 5 to 8 of the scope of patent application will be described. 'In the embodiments described below, the same parts as -64-(60) (60) 200409405 will be attached with the same parts. The detailed description of this part is omitted, and the following description is mainly based on the differences from the first embodiment. In the second embodiment shown in FIG. 9, the elastic members 50 having the claw portions 4 8 and 4 9 disposed at the ends of the square and the other side, and the claw portions connecting the two ends and the 49 are used. The locking member 47 is connected to the terminal portion 30 of the one adhesive tape 1 and the start portion 3 2 of the other adhesive tape 1. Specifically, the end portion 3 0 of one of the adhesive tapes 1 is brought into contact with each other, and the claw portion 48 of one end of the disposition locking member 47 is locked to each other. The terminal portion 30 engages the claw portion 49 provided on the other end to the start end portion 32, and draws one claw portion 48 and the other claw portion 49 close to each other with an elastic member. In addition, the claw portion 48 is a plurality of claws 51 each having a pointed tip on the back surface of the plate member. The claw portion 48 provided on one end of the locking member 47 is locked at the end portion 30, and the claw portion 49 provided at the other end is locked at the beginning portion to connect the two, so the connection is very easy. . Moreover, since one elastic member 50 is provided between one claw portion and the other claw portion 49, the elastic member can be extended to lock the other claw portion 49 of the locking member 47 to the other adhesive tape 1 The starting end 32 is at any position, so the connection has a high degree of freedom. In the third embodiment shown in FIG. 10, the terminal portion 30 of the adhesive material tape 1 wound around the used disk 3a and the starting end portion 3 of the adhesive material tape 1 of the new adhesive material 3 are targeted. 2. Make the adhesive side of the starting end 3 2 overlap the 9 side of the base material 30 of the terminal end 30. Secondly, elastically deformable clips with a shape of 3 in cross section 5 3 Hold the overlapping part and fix it -65- (61) (61) 200409405 Because only the overlapped part is clamped by the clip 5 3 to perform the connection, the connection operation is very easy. In the fourth embodiment shown in FIG. 11, in the first embodiment, a metal holding piece 5 5 with a shape of a cross section in the shape of a cross section covers the overlapped portion, and is flattened from both sides of the overlapped portion. The clamping piece 55 connects the two. Since the clamping is performed by squeezing the clamping pieces 55 from both sides of the overlapping portion, a strong connection can be obtained by using the overlapping portion. The inventions described in claims 5 to 8 of the scope of patent application are not limited to the above-mentioned embodiments, and various modifications can be made as long as they do not depart from the gist of the invention described in claims 5 to 8 of the scope of patent application. For example, in the first embodiment described above, the locking pin 46 is not slightly ^ -shaped, but may be a linear pin. In this case, a plurality of pins should be used to fix the overlapping portion. In the second embodiment, a plurality of locking members 47 may be used in accordance with the width of the adhesive tape 1. In the third embodiment and the fourth embodiment, a plurality of clips 5 3 or clips 5 5 may be used and fixed from both sides of the overlapping portion of the adhesive tape 1 respectively. Next, the inventions described in items 9 to 13 of the scope of patent application will be described. These inventions relate to an adhesive tape for electronic components and a circuit board, or an adhesive fixation between circuit boards, and an electrical connection between the two electrodes, and in particular, to a method for connecting a tape-shaped adhesive tape. Next, the descriptions of the inventions described in the 9th to 13th of the scope of patent application -66- (62) (62) 200409405 will be described. Generally speaking, electronic components such as liquid crystal panels, PDPs (electrical display panels), EL (fluorescent display) panels, bare chip packages, and circuit substrates, or the adhesion and fixation between circuit substrates, and the electricity between the two electrodes The method of sexual connection uses adhesive tape. Japanese Patent Application Laid-Open No. 2 00 1 -2 8400 5 describes that an adhesive material tape, which is an adhesive material coated on a substrate, is rolled into a disc shape. The width of this conventional adhesive tape is about 1 ~ 3 mm, and the length of the tape rolled up to the disc is about 50m. When the adhesive tape is mounted on the adhesive device, a tray of adhesive tape (hereinafter referred to as "adhesive material tray") is mounted on the adhesive device, and the beginning end of the adhesive tape is pulled out and mounted on the take-up tray. Next, from the base material side of the adhesive material tape rolled out from the self-adhesive material tray, the adhesive is pressed onto the circuit board or the like with a heating and pressing head, and the remaining substrate is taken up by a take-up disk. Secondly, when the adhesive tape of the adhesive material tray is used up, remove the used disk and the take-up coil of the base material. The beginning of the tape is mounted on the take-up reel. However, in recent years, with the increase in the size of panel screens such as PDPs, the adhesion area of circuit boards has also increased. The amount of adhesive used at one time has also increased. In addition, the use of the adhesive has been increased because the use of the adhesive has been increased. Therefore, the replacement of the adhesive material plate in the manufacturing plant of electronic equipment is more frequent. Because the replacement of the adhesive material plate is very troublesome, there is a problem that the production efficiency of the electronic device cannot be improved. In view of this problem, you can consider increasing the number of rolls of adhesive tape that is wound to the disc 67- (63) (63) 200409405 to increase the adhesive dose per disc to reduce the frequency of disc replacement. However, because The tape width of the adhesive tape is 1 to 3 mm, which is narrower. If the number of rolls is increased, the winding may be scattered. Moreover, if the number of rolls is increased, the pressure applied to the adhesive tape rolled into the shape of a tape will increase ', which may cause the adhesive to leak out from both sides of the tape and cause blockage. In addition, if the number of rolls of adhesive tape is increased, the diameter of the disk will also increase, and the existing adhesive device may not be used because it cannot be mounted on the existing adhesive device. Therefore, the purpose of the inventions described in claims 9 to 13 is to provide a method for connecting adhesive tapes, which can make the replacement of adhesive trays simpler and improve the production efficiency of electronic equipment. Next, referring to the drawings of the appendix, the embodiments of the inventions described in items 9 to 13 of the scope of patent application will be described. First, referring to FIGS. 12 and A, B, and 3 to 5 of the scope of patent application, the scope of patent application A first embodiment of the invention described in items 9 to 13 will be described. Fig. 12 A to C are the connection method diagrams of the adhesive tape of the first embodiment, Fig. 12 A is a perspective view of the connection between the adhesive material discs, and Fig. 12 B is the connection of the 12th price A Partial connection method. The adhesive tape 1 is wound around the disks 3 and 3a, respectively. Each of the disks 3 and 3a is provided with a reel 5 and side plates 7 arranged on both width sides of the adhesive tape 1. In this embodiment, the adhesive tape 1 has a length of about 50 m and a width W of about 3 mm. The adhesive tape 1 is composed of a substrate 9 and an adhesive 11 applied to one side surface of the substrate 9. -68- (64) (64) 200409405 k In terms of strength and peelability of the adhesive constituting the anisotropic conductive material, the substrate 9 should be made of opp (extended polypropylene), polytetrafluoroethylene, or silicon-treated It is made of PET (polyethylene terephthalate) and the like, however, it is not limited to this. The adhesive 1 1 is a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a thermal metal system. Thermoplastic resins are typified by styrene resins and polyester resins, while thermosetting resins are typified by epoxy resins, vinyl acetate resins, acrylic resins, and silicone resins. Conductive particles 1 3 are dispersed in the adhesive 11. The conductive particles 1 3 are metal particles such as An, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, etc., or carbon, graphite, etc., which can also be used in the foregoing and / or non-conductive glass and ceramics. Local molecular nuclear materials, such as plastic, and plastic, are formed by covering the aforementioned conductive layer. In addition, it is also possible to use insulating film particles that cover the above-mentioned conductive particles with an insulating layer, or conductive particles and insulating particles for use. Forming a conductive layer on a hot molten metal such as solder or a local molecular core material such as plastic will have deformability due to heat and pressure or pressure, so the distance between electrodes after connection will be reduced. Can increase the area of contact with the circuit, and improve reliability. In particular, it is better to use polymers as the core material. For example, because the solder has no melting point, it can be controlled in a softened state at a wide range of connection temperatures, and it is easy to obtain the thickness and flatness of the electrode. The error connection member. Secondly, the method of using the adhesive tape of the poor application form will be described. As shown in Fig. 3, roll the disc 3a of the adhesive tape 1 and take -69- (65) (65) 200409405 from the tray 1 to the adhesive device 15 and wind the adhesive on the tray 3a. The front end of the adhesive tape 1 is mounted on the take-up tray 7 and the adhesive tape ι is rolled out (⑥head E in Fig. 3). Next, the adhesive material tape 1 is arranged on the circuit substrate 2 1 'with a heating and pressing head disposed between the two plates 3 a and 17]. 9 The pressure-sensitive adhesive tape 1 is applied from the base material 9 side to adhere the adhesive. The agent 11 is pressed onto the circuit substrate 2]. After that, the base material 9 is taken up to a take-up tray 17. After the above pressure (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 2 3 are positioned and formally connected. Formally connected, as shown in FIG. 4, a wiring circuit (or electronic component) 2 3 is arranged on the adhesive 1 1 pressed onto the circuit substrate 2!, And if necessary, the Teflon material 24 can be used as an example. The buffer material is heated and pressurized to the circuit board 21 by the heating and pressing head 19. In this way, the electrode 2 1a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. The size of the PDP using the adhesive tape 1 of this embodiment will be relatively large. 'Sometimes, the entire periphery of the PDP is pressed, and the connection part will be large.' The amount of the adhesive 1 1 used at one time will be much larger than Traditionally used. Therefore, the amount of adhesive material tape 1 wound on the disk 3a will also increase, and the adhesive material tape 1 wound on the disk 3a will be wound up to the take-up disk 17 in a relatively short period of time. Then, the end mark 2 8 of the adhesive tape 1 wound on the disk 3 a is exposed (see FIG. 12A). The method of connecting the adhesive tapes of the invention described in the scope of application patents Nos. 9 to 13 can be divided into the following two types. (A) Use the take-up reel 1 7 directly, and change the number of remaining rolls of the used adhesive tape 1. Less adhesive tape -70- (66) 200409405, and connect the new adhesive tape and take-up tray 17, (b) use the adhesive tape with less remaining rolls of the used adhesive tape 1 as the take-up tray I 7 Use and connect new adhesive tape and adhesive tape with less residual volume

(b )時，如第1 2圖A所示，爲了將盤3 a更換成新 黏著材盤3，在盤3a之黏著材膠帶1上會實施盤3a之黏 著材膠帶（一方之黏著材膠帶）1之終端部3 0、及捲繞於 新黏著材盤3上之黏著材膠帶（另一方之黏著材膠帶）1 之始端部3 2之連接（參照第1 2圖A )。(b), as shown in Fig. 12A, in order to replace the disc 3a with a new adhesive material disc 3, the adhesive material tape 1 of the disc 3a (one adhesive material tape is applied to the adhesive tape 1 of the disc 3a ) 1 is connected to the terminal portion 30 of the adhesive tape 1 (the other adhesive tape) wound around the new adhesive plate 3 (refer to FIG. 12A).

此黏著材膠帶1之連接上，如第1 2圖B所示，會針 對黏著材盤3 a之黏著材膠帶1之終端部3 0、及新黏著材 盤3之黏著材膠帶1之始端部3 2，使始端部3 2之黏著劑 11面重疊於終端部30之基材9面上。兩者之重疊長度Η 爲黏著劑膠帶1之寬度W的大約2.5倍，將其置於工作 台3 6上，以黏著裝置1 5之加熱加壓頭1 9進行加熱加壓 實施黏著。利用此方式，可實施捲繞於已使用之盤3 a上 之黏著材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連 接。其次，將已使用之盤3 a及新盤3互相對換，將新盤 3裝著至黏著裝置1 5。因此，無需實施將新黏著材膠帶1 裝著至捲取盤17之作業。 此實施形態因係利用加熱加壓頭1 9，無需另行採用 黏著劑間之壓著用器具，即可更換捲繞著黏著材1之盤3 、3 a 〇 直接使用（a)之捲取盤17，將已使用之黏著材膠帶 -71 - (67) (67)200409405 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶，並 實施新黏著劑膠帶及捲取盤1 7之連接時，在露出已使用 之盤3 a之黏著材膠帶1之結束標記2 8時從黏著材膠帶1 之結束標記2 8附近切斷，使殘留於捲取盤1 7側之黏著材 膠帶之終端部30、及新黏著材盤3之黏著材膠帶1之始 端部3 2互相重疊。其次，以黏著裝置1 5之加熱加壓頭 1 9對兩者之重疊部份進行加熱加壓實施黏著。因爲捲取 盤1 7只會捲取基材9，故可捲取數個黏著材盤份，減少 捲取盤1 7之更換次數，而有良好之作業效率。 此處，參照第5圖，針對本實施形態之黏著材膠帶i 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗 布機2 7塗布由樹脂及導電粒子1 3混合而成之黏著劑1 ! ，並以乾燥爐2 9實施乾燥後’以捲取機3 1捲取原始材料 。被捲取之黏著材膠帶之原始材料，以切割機3 3切成特 定寬度並捲取至捲軸後’從兩側將側板7、7裝著於捲軸 上，或者，捲取至附側板之捲軸上，將其和除濕材一起綑 包，實施低溫（-5 °C〜-1 0 °C )之管理並進行出貨。 其次，針對申請專利範圍第9〜1 3項記載之發明之其 他實施形態進行說明，以下說明之實施形態中，和上述實 施形態相同之部份會附與相同符號並省略該部份之詳細說 明，以下之說明係以和上述實施形態不同之點爲主。 第13圖所不之第2實施形態時，以表面爲參差不齊 (凹凸）44而爲互相嵌合之一方之模具56、及另一方之 -72- (68) (68)200409405 模具5 7夾持黏著材膠帶1之重疊部份3 4，使重疊部份3 4 形成凹凸5 8。如此，利用形成凹凸5 8，可增加重疊部份 34之黏著面積，且利用重疊部份34之凹凸58的卡合可 提高拉伸方向（黏著材膠帶之縱向）之強度。形成凹凸時 ，黏著劑1 1會流動而以黏著劑黏著重疊部份之端面間， 可進一步提高重疊部份3 4之拉伸方向的強度。 第1 4圖A及第1 4圖B所示之第3實施形態時，會 將捲取至新黏著材1之盤3之始端部3 2彎折成略呈V字 形，捲繞於已使用之盤3 a上之黏著材膠帶1之終端部3 0 亦彎折成略呈V字形，使兩者成爲鈎狀必須黏著劑1 1互 相相對並卡止（第1 4圖A )，以加熱加壓頭1 9實施加熱 加壓來連接兩者（第1 4圖B )。此第3實施形態時，因 終端部3 0及始端部3 2係以鈎狀連結而可獲得強固之連結 ，同時，因利用黏著劑1 1之重疊來連接，故可得到更爲 強固之連接。和上述相同，因爲黏著劑會在重疊部份流動 並黏著端面，故可獲得更強固之連接。 第1 5圖A及第1 5圖B所示之第4實施形態，係在 第1實施形態之加熱加壓前、或加熱加壓之同時在重疊部 份3 4形成貫通孔5 9。利用形成貫通孔5 9，加熱加壓時可 使黏著劑11從貫通孔59之周圍滲出並實施黏著而提高黏 著力，重疊部3 4可獲得強固之連接。 申請專利範圍第9〜1 3項記載之發明並未受限於上述 之貫施形態’只要不背離申請專利範圍第9〜1 3項記載之 發明之要旨的範圍內，可實施各種變形。 -73- (69) (69)200409405 例如，上述之第2實施形態時，凹凸5 8不必爲山型 ，亦可以爲具弧形之九形。 第4實施形態時，貫通孔5 9之數並無特別限制，可 以爲任何數量。又，貫通孔5 9之直徑並無限制。又，第 2、第3實施形態時，亦可進一步在重疊部份3 4上形成貫 通孑L 5 9。 其次，針對申請專利範圍第1 4〜1 8項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第1 4〜1 8項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開2 00 1 -2 8400 5號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3 mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。黏著材盤之裝著後， -74 - (70) (70)200409405 從自黏著材盤捲出之黏著材膠帶之基材側以加熱加壓頭將 黏著劑壓著至電路基板等上’再以捲取盤捲取殘餘之基材 〇 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤’將新捲取盤及新黏著材盤裝著於 黏著裝置，將黏著材膠帶之始端經由黏著裝置之導引銷裝 設至捲取盤。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材盤的更換更 爲頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電 子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率’然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 貝IJ作用於捲成膠帶狀之黏著材膠帶的壓力會升高，而可能 S爲黏著劑從膠帶兩側滲出而成.爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 另一方面，以粘黏著材膠帶貼附黏著材膠帶及黏著材 膠帶並無法充分黏著力實施黏著。爲了使黏著材膠帶具有 -75- (71) (71)200409405 良好黏著材剝離性，會在其上塗布氟系脫模劑或砂系脫模 劑等，而上述情形就是因爲其影響。 因此，申請專利範圍第1 4〜1 8項記載之發明的目的 ’係在提供一種黏著材膠帶之連接方法，尤其是黏著材膠 帶之基材採用經過矽處理之基材時，亦可使黏著材盤之更 換較爲簡單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第1 4〜1 8 項記載之發明之實施形態進行說明，首先，參照第1 6圖 A、B、第3圖〜第5圖，針對申請專利範圍第1 4〜1 8項 記載之發明之第1實施形態進行說明。第1 6圖A及B係 第1實施形態之黏著材膠帶之連接方法圖，第1 6圖A係 黏著材盤間之連接的斜視圖，第1 6圖B係第1 6圖A之 連接部份（b )之連接方法的斜視圖。 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 配設著捲軸5 '及配置於黏著材膠帶1之兩寬度側之側板 7 〇 黏著材膠帶1係由矽處理基材9、及塗布於矽處理基 材9之一側面之黏著劑丨丨所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 矽處理基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或 PET (聚對苯二甲酸乙二酯）等之基材所構成，其表面利 用矽樹脂等實施表面處理。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 -76- (72) (72)200409405 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子]3係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子 、或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶 瓷、塑膠等高分子核材等覆蓋前述導電層等來形成導電粒 子。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆 膜粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔 融金屬、或塑膠等之高分子核材上形成導電層者，會具有 因加熱加壓或加壓而產生變形之變形性，故連接後之電極 間距離會縮小，連接時可增加和電路接觸之面積，而可提 高信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因 沒有融點，在廣泛之連接溫度下亦可控制於軟化狀態，而 可得到很容易即可對應電極之厚度及平坦性之誤差的連接 構件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第3圖所示，將黏著材膠帶1之盤3 a、及捲取 盤17裝著至黏著裝置15，將捲繞於盤3a上之黏著材膠 帶1之前端裝設至捲取盤17，並捲出黏著材膠帶1 (第3 圖中之箭頭E )。其次，將黏著材膠帶1配置於電路基板 2 1上’以配置於以配置於兩盤3 a、1 7間 配置之加熱加 壓頭19從矽處理基材9側實施黏著材膠帶1之壓接，將 黏著劑1 1壓著至電路基板2 1。其後，將矽基材9捲取至 -77- (73) (73)200409405 捲取盤1 7。 上述壓著後（暫時連接），實施電路基板2 !之電極 及配線電路（電子構件）2 3之電極的定位並進行正式連 接。正式連接上，如第4圖所示，在壓著至電路基板2】 上之黏者劑1 1上配置配線電路（或電子構件）2 3，必要 時，可將例如聚四氟乙烯材24當做緩衝材，以加熱加壓 頭1 9對電路基板2 1實施配線電路2 3之加熱加壓。利用 此方式，可連接電路基板2 1之電極2 1 a及配線電路2 3之 電極2 3 a。 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較 多，一次使用之黏著劑1 1的使用量會遠大於傳統上之使 用量。因此，捲繞於盤3a上之黏著材膠帶1之使用量亦 會變多，捲繞於盤3 a上之黏著材膠帶1在相對較短之時 間內會被捲取至捲取盤17，而露出捲繞於盤3a上之黏著 材膠帶1之結束標記2 8 (參照第1 6圖A )。 申請專利範圍第1 4〜1 8項記載之發明之黏著材膠帶 之連接方法可以分成下述2種，（a )直接使用捲取盤1 7 ，更換已使用之黏著材膠帶〗之殘餘捲數變少的黏著劑膠 帶，並連接新黏著劑膠帶及捲取盤17， （b)將已使用之 黏著材膠帶1之殘餘捲數變少的黏著劑膠帶當做捲取盤 1 7使用，並連接新黏著劑膠帶及殘餘捲數變少的黏著劑 膠帶。 (b)時，如第16圖A所示，爲了將盤3a更換成新 -78- (74) (74)200409405 黏著材盤3，在盤3 a之黏著材膠帶1上會實施盤3 a之黏 著材膠帶（一方之黏著材膠帶）1之終端部3 0、及捲繞於 新黏著材盤3上之黏著材膠帶（另一方之黏著材膠帶）] 之始端部3 2之連接。 此黏著材膠帶1之連接上，如第1 6圖B所示，黏著 材盤3 a之黏著材膠帶1之終端部3 0、及新黏著材盤3之 黏著材膠帶1之始端部3 2會互相抵接，以跨越兩黏著材 膠帶1、1之矽處理基材9、9之表面的方式貼附矽粘著膠 帶6 0，實施兩黏著材膠帶1、1之連接。 此矽粘著膠帶60係由基材63及塗布於基材63之單 面之矽粘著劑6 2所構成。基材6 3之材質並無特別限制’ 然而，本實施形態係聚醯亞胺樹脂材。又，第1 6圖B中 ，黏著材膠帶之黏著劑1 1及矽粘著膠帶60之粘著劑部份 4 3分別以斜線表示。 此處，針對矽粘著膠帶6 0之黏著進行說明。一方及 另一方之黏著材膠帶1、1之矽處理基材9、9因爲分別覆 蓋著矽，故難以利用黏著劑進行黏著’然而’本實施形態 時，因矽粘著膠帶6 0之粘著劑4 3係採用砂樹脂，兩砂處 理基材9、9之表面張力差會較小’利用密著（黏著）可 使一方之黏著材膠帶1之終端部3 0及另一方之黏著材膠 帶1之始端部3 2有良好之連接。砂粘著膠帶60之砂粘著 劑62表面、及矽處理基材9、9表面之表面張力差應爲 1 OmN/m ( 1 Odyne/cm )以下，本實施形態時’幾乎沒有表 面張力差。 -79- (75) (75)200409405 一般而言’一方之黏著材膠帶】之終端部3〇及另一 方之黏著材膠帶1之兩矽處理基材9、9之表面張力爲 2 5mN/m 〜6 0mN/m ( 25 〜60dyne/cm )，例如，表面張力 爲3 0mN/m時，矽粘著膠帶60之矽粘著劑62之表面張力 應設定成20mN/m以上、40mN/m以下。 石夕系粘著劑主要係由矽橡膠及矽樹脂所構成，一般而 言，係使兩者產生少許縮合反應而具有粘著性，其次，利 用過氧化物、白金觸媒之矽氫化反應使其交聯，玻璃轉移 溫度爲-1 〇 〇 C以下者。上述皆爲市販品，可選擇適當者使 用。 如此’利用矽粘著膠帶6 0實施捲繞於已使用之黏著 材盤3a上之黏著材膠帶1、及捲繞於新黏著材盤3上之 黏著材膠帶1之連接。其次’將已使用之黏著材盤3a及 新黏著材盤3互相對換，將新黏著材盤3裝著於黏著裝置 15。因此，無需拉出新黏著材盤3之黏著材膠帶1並將黏 著材膠帶裝著至捲取盤17、或將新黏著材膠帶1裝設至 黏著裝置15之導引銷36之作業，故黏著材盤3、3a之更 換有良好之作業效率。如此，因爲已全部捲出之黏著材膠 帶1之終端部3 0、及新裝著之黏著材膠帶】之始端部3 2 係以矽粘著膠帶進行連接，故連接十分簡單。 其次，將已使用之盤3 a及新盤3互相對換，將新盤 3裝著至黏著裝置15。因此，無需將新黏著材膠帶1裝著 至捲取盤1 7之作業。 直接使用（a )之捲取盤1 7，將已使用之黏著材膠帶 -80- (76) (76)200409405 I之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶、 實施新黏著劑膠帶及捲取盤1 7之連接時’已使用之盤 之黏著材膠帶〗之結束標記2 8露出時，會在黏著材膠 1之結束標記2 8附近實施切斷，使殘留於捲取盤1 7側 黏著材膠帶之終端部3 0 '及新黏著材盤3之黏著材膠帶 之始端部3 2互相抵接。其次，在兩者之抵接部份利用 粘著膠帶實施黏著材膠帶1之終端部3 0、及新黏著材盤 之黏著材膠帶1之始端部3 2的連接。因爲捲取盤1 7只 捲取基材 9，故可捲取數個黏著材盤份，減少捲取盤 之更換次數，而有良好之作業效率。 其次，參照第5圖，針對本實施形態之黏著材膠帶 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以 布機2 7塗布樹脂及導電粒子混合而成之黏著劑，並以 燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料。被捲 之黏著材膠帶之原始材料，以切割機3 3切成特定寬度 捲取至捲軸後，從兩側將側板7、7裝著於捲軸上，或 ’捲取至附側板之捲軸上，將其和除濕材一起綑包，實 低溫（-5 °C〜-1 〇 °C )之管理並進行出貨。 其次，針對申請專利範圍第1 4〜1 8項記載之發明 其他實施形態進行說明，和上述實施形態相同之部份會 與相同符號並省略該部份之詳細說明，以下之說明係以 上述實施形態不同之點爲主。 第1 7圖所示之第2實施形態時，除了如上述之第 -81 - (77) (77)200409405 實施形態以外，在一方之黏著材膠帶1之終端部3 0、及 另一方之黏著材膠帶之始端部3 2之黏著劑1 1面側亦貼附 著矽粘著膠帶6 0。此第2實施形態之矽粘著膠帶6 0之矽 粘著劑62，其黏著力爲100g/25mm以上，本實施形態時 則爲7〇〇g/25mm〜1400g/25mm。又，矽粘著膠帶60之矽 粘著劑62之表面張力的設定上，係和上述實施形態相同 ，一方及另一方之黏著材膠帶之矽基材之表面張力差爲 1 OmN/m ( 1 Odyne/cm )以下。此第2實施形態時，一方之 黏著材膠帶1之終端部3 0及另一方之黏著材膠帶之始端 部3 2之兩面，因以矽粘著膠帶60實施黏著，可以較第1 實施形態更高之強度來實施兩黏著材膠帶1、1之黏著。 第1 8圖所示之第3實施形態，係以重疊方式配置一 方之黏著材膠帶1之終端部3 0及另一方之黏著材膠帶1 之始端部3 2，其矽處理基材9側面及黏著材1 1側面則貼 附著第2實施形態之矽粘著膠帶6 0，利用此第3實施形 態，可獲得和第2實施形態相同之作用效果。 第1 9圖所示之第4實施形態，係在一方之黏著材膠 帶1之終端部3 0、及另一方之黏著材膠帶1之始端部3 2 之間，存在基材之兩面塗布著矽粘著劑62之砂粘著膠帶 6 1，用以連接終端部3 0及始端部3 2。利用此第4實施形 態，因係使用兩面之矽粘著膠帶6 1，一方之黏著材膠帶1 之終端部3 0及另一方之黏著材膠帶1之始端部3 2的連接 更爲十分簡單且容易。 其次，針對申請專利範圍第1 9〜2 1項記載之發明進 -82- (78) (78)200409405 行說明。 适些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ’尤其是，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第1 9〜2 1項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開2 0 0 1 - 2 8 4 0 0 5號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3 mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 -83- (79) (79)200409405 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材盤的更換更 爲頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電 子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第1 9〜2 1項記載之發明的目的 ，係黏著材膠帶之連接方法，可使黏著材盤之更換較爲簡 單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第1 9〜第 2 1項記載之發明之實施形態進行說明，首先，參照第20 圖A〜C、第21圖、第4圖、及第5圖，針對申請專利範 圍第1 9〜2 1項記載之發明之第1實施形態進行說明。第 20圖A〜C係本實施形態之黏著材膠帶之連接方法圖，第 20圖A係黏著材盤間之連接的斜視圖，第20圖B及C 係第20圖A之連接部份之連接方法的剖面圖。 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 -84- (80) (80)200409405 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 Ί。 余占者材w 1係由基材9、及塗布於基材9之一側囬 之黏著劑1 1所構成。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、以及經過 矽處理之PET (聚對苯二甲酸乙二酯）等所構成，然而， 並不限於此。 黏者劑】1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑U內分散著導電粒子1 3。導電粒子1 3係如 An、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子 、或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶 瓷、塑膠等高分子核材等覆蓋前述導電層而形成者。此外 ，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子、 或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬、 或塑膠等之高分子核材上形成導電層者，會具有因加熱加 壓或加壓而產生變形之變形性，故連接後之電極間距離會 縮小，連接時可增加和電路接觸之面積，而可提高信賴性 。尤其是，以高分子類做爲核材更佳，如焊錫因沒有融點 ’在廣泛之連接溫度下亦可控制於軟化狀態，而可得到很 -85- (81) (81)200409405 容易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第2 1圖所示，將黏著材膠帶1之盤3 a、及捲取 盤1 7裝著至黏著裝置1 5，將捲繞於盤3 a上之黏著材膠 帶1之前端經由導引銷22裝設至捲取盤1 7，並捲出黏著 材膠帶1 (第2 1圖中之箭頭E )。其次，將黏著材膠帶1 配置於電路基板2 1上，利用配置於兩盤3、1 7間之加熱 加壓頭1 9從基材9側實施黏著材膠帶1之壓接，將黏著 劑1 1壓著至電路基板2 1。其後，將基材9捲取至捲取盤 17。 上述之壓著後（暫時連接），實施電路基板2 1之電 極及配線電路（電子構件）2 3之電極的定位並進行正式 連接。正式連接上，如第4圖所示，在壓著至電路基板 2 1上之黏著劑1 1上配置配線電路（或電子構件）23，必 要時，可將例如聚四氟乙烯材24當做緩衝材，以加熱加 壓頭1 9對電路基板2 1實施配線電路2 3之加熱加壓。利 用此方式，可連接電路基板2 1之電極2 1 a及配線電路2 3 之電極2 3 a。 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 大，有時會對PDP之周圍全體實施壓著，連接部份會較 多，一次使用之黏著劑1 1的使用量會遠大於傳統上之使 用量。因此，捲繞於盤3 a上之黏著材膠帶1之使用量亦 會變多，捲繞於盤3 a上之黏著材膠帶1在相對較短之時 間內會被捲取至捲取盤1 7，而露出捲繞於盤3 a上之黏著 -86- (82) 200409405 材膠帶1之結束標記2 8 (參照第2 0圖A )。 申請專利範圍第1 9〜2 1項記載之發明之黏著材膠帶 之連接方法可以分成下述2種，（a )直接使用捲取盤1 7 ，更換已使用之黏著材膠帶1之殘餘捲數變少的黏著劑膠 帶，並連接新黏著劑膠帶及捲取盤17， （ b )將已使用之As shown in FIG. 12 and FIG. 2B, the connection of the adhesive tape 1 will be directed to the terminal portion 30 of the adhesive tape 1 of the adhesive plate 3 a and the starting end portion of the adhesive tape 1 of the new adhesive plate 3 32, so that the surface of the adhesive 11 on the starting end portion 32 overlaps the surface of the base material 9 on the terminal end portion 30. The overlapping length Η of the two is approximately 2.5 times the width W of the adhesive tape 1, and it is placed on the worktable 36, and heated and pressed by the heating and pressing head 19 of the adhesive device 15 to perform adhesion. In this way, it is possible to connect the adhesive tape 1 wound on the used disk 3 a and the adhesive tape 1 wound on the new disk 3. Next, the used disk 3 a and the new disk 3 are exchanged with each other, and the new disk 3 is mounted on the adhesive device 15. Therefore, it is not necessary to perform the operation of mounting the new adhesive tape 1 on the take-up reel 17. In this embodiment, the heating and pressure head 19 is used, and it is possible to replace the coils 3 and 3 a around which the adhesive material 1 is wound without using a separate pressing device between adhesives. The coiling disc of (a) can be directly used. 17. Replace the used adhesive tape -71-(67) (67) 200409405 1 with a small number of remaining adhesive tapes and replace them with new adhesive tapes, and implement new adhesive tapes and take-up disks 1 of 7 At the time of connection, the end mark 2 of the adhesive tape 1 of the used disk 3 a is exposed at 8 when it is cut off from the vicinity of the end mark 2 8 of the adhesive tape 1 so that the adhesive tape remaining on the winding plate 17 side The terminal portion 30 and the starting end portion 3 2 of the adhesive tape 1 of the new adhesive plate 3 overlap each other. Next, the heating and pressing head 19 of the adhesive device 15 is used to heat and press the overlapped portion of the two to carry out the adhesion. Because the winding plate 17 can only take up the base material 9, several adhesive material plates can be taken up, the number of replacement times of the winding plate 17 can be reduced, and the operation efficiency is good. Here, the manufacturing method of the adhesive tape i of this embodiment is demonstrated with reference to FIG. On the separator 9 unwound from the unwinder 25, an adhesive 1 made of a mixture of resin and conductive particles 1 3 is coated with a coating machine 2 7, and dried in a drying furnace 2 9. Winder 3 1 rolls up the original material. The raw material of the rolled adhesive tape is cut into a specific width by a cutting machine 3 and rolled onto the reel. 'Side plates 7, 7 are mounted on the reel from both sides, or rolled to the reel with side plate. Then, it is packed with dehumidifying material, and it is managed at low temperature (-5 ° C ~ -10 ° C) and shipped. Next, other embodiments of the invention described in items 9 to 13 of the scope of patent application will be described. In the embodiments described below, the same parts as the above embodiments will be assigned the same symbols and detailed descriptions of the parts will be omitted. The following description is mainly based on the differences from the above embodiment. In the second embodiment shown in FIG. 13, the surface 56 is uneven (concave and convex) 44 and one of the molds 56 is fitted to each other, and the other one is -72- (68) (68) 200409405 mold 5 7 The overlapped portion 3 4 of the adhesive tape 1 is sandwiched so that the overlapped portion 3 4 forms unevenness 5 8. In this way, by forming the irregularities 5 8, the adhesive area of the overlapping portion 34 can be increased, and the engagement of the irregularities 58 of the overlapping portion 34 can increase the strength in the stretching direction (the longitudinal direction of the adhesive tape). When the unevenness is formed, the adhesive 11 flows and the adhesive adheres between the end faces of the overlapped portion, which can further increase the strength of the overlapped portion 34 in the tensile direction. In the third embodiment shown in FIG. 14A and FIG. 14B, the first end portion 3 2 of the disc 3 that is wound up to the new adhesive material 1 is bent into a slightly V shape, and is wound around the used The terminal 3 0 of the adhesive tape 1 on the plate 3 a is also bent into a slightly V-shape, so that the two become hook-shaped. The adhesives 1 1 must be opposed to each other and locked (Figure 14A) to heat. The pressure head 19 is heated and pressurized to connect the two (Fig. 14B). In this third embodiment, since the terminal portion 30 and the beginning portion 32 are connected in a hook shape, a strong connection can be obtained, and at the same time, the connection is made by the overlap of the adhesive 11, so a stronger connection can be obtained. . Same as above, because the adhesive will flow in the overlapping part and adhere to the end face, a stronger connection can be obtained. In the fourth embodiment shown in Figs. 15A and 15B, the through-holes 59 are formed in the overlapping portion 34 before the heating and pressing of the first embodiment or at the same time as the heating and pressing. By forming the through-holes 59, the adhesive 11 can be exuded from the surroundings of the through-holes 59 under heat and pressure, and adhesion can be improved to improve the adhesion force. The overlapping portions 34 can obtain a strong connection. The inventions described in claims 9 to 13 of the scope of patent application are not limited to the above-mentioned conventional application forms', as long as they do not depart from the spirit of the inventions described in claims 9 to 13 of the scope of patent application, various modifications can be made. -73- (69) (69) 200409405 For example, in the second embodiment described above, the unevenness 5 8 does not need to be a mountain shape, and may be a nine shape with an arc shape. In the fourth embodiment, the number of through holes 59 is not particularly limited, and may be any number. The diameter of the through holes 59 is not limited. Further, in the second and third embodiments, a continuous passage L 5 9 may be further formed on the overlapping portion 3 4. Next, the inventions described in items 14 to 18 of the scope of patent application will be described. These inventions relate to an adhesive tape for electronic components and a circuit board, or an adhesive fixation between circuit boards, and an electrical connection between the two electrodes, and in particular, to a method for connecting a tape-shaped adhesive tape. Next, the background art of the inventions described in claims 14 to 18 in the scope of patent application will be described. Generally speaking, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, bare chip packages, and circuit substrates, or the adhesion and fixation between circuit substrates, and the electricity between the two electrodes The method of sexual connection uses adhesive tape. Japanese Patent Application Laid-Open No. 2 00 1 -2 8400 5 describes that an adhesive material tape, which is an adhesive material coated on a substrate, is rolled into a disc shape. The width of this conventional adhesive tape is about 1 to 3 mm, and the length of the tape wound up to the disc is about 50 m. When the adhesive tape is mounted on the adhesive device, a tray of adhesive tape (hereinafter referred to as "adhesive material tray") is mounted on the adhesive device, and the beginning end of the adhesive tape is pulled out and mounted on the take-up tray. After mounting the adhesive material plate, -74-(70) (70) 200409405 from the base material side of the adhesive material tape rolled out from the adhesive material plate with a heating and pressing head to press the adhesive onto the circuit board, etc. Take up the remaining substrate with a take-up disc. Second, when the adhesive tape of the adhesive material disc runs out, remove the used disc and the take-up disc of the take-up substrate. 'Rewind the disc and the new adhesive material. The disk is mounted on the adhesive device, and the beginning of the adhesive tape is mounted on the take-up disk via the guide pin of the adhesive device. However, in recent years, with the enlargement of panel screens such as PDPs, the adhesion area of circuit substrates has also increased, and the amount of adhesive used at one time has also increased. In addition, as the use of the adhesive is expanded, the amount of the adhesive used is also increased. Therefore, the replacement of the adhesive material plate in the electronic equipment manufacturing factory is more frequent. Because the replacement of the adhesive material plate is very troublesome, there is a problem that the production efficiency of the electronic device cannot be improved. To solve this problem, you can consider increasing the number of adhesive tapes wound to the disk to increase the adhesive dose per disk to reduce the frequency of disk replacement. However, because the width of the adhesive tape is narrower 1 ~ 3mm. Increasing the number of rolls may lead to loose coiling. In addition, if the number of rolls is increased, the pressure of the shell IJ on the adhesive tape rolled into a tape shape will increase, and S may be caused by the adhesive oozing from both sides of the tape. It is the cause of the blockage. In addition, if the number of rolls of adhesive tape is increased, the diameter of the disk will also increase, and the existing adhesive device may not be used because it cannot be mounted on the existing adhesive device. On the other hand, sticking an adhesive tape and an adhesive tape with an adhesive tape does not provide sufficient adhesive force for adhesion. In order to make the adhesive tape have a good peelability of -75- (71) (71) 200409405, a fluorine-based release agent or a sand-based release agent is applied to the adhesive tape, and the above situation is due to its influence. Therefore, the purpose of the inventions described in the claims Nos. 14 to 18 of the scope of patent application is to provide a method for connecting adhesive tapes, especially when the substrate of the adhesive tape is a silicon-treated substrate, which can also make the adhesive adhere. The replacement of the material plate is relatively simple, and the production efficiency of the electronic machine is improved. Next, referring to the drawings of the appendix, the embodiments of the inventions described in items 14 to 18 of the scope of patent application will be described. First, referring to FIGS. 16A, B, 3 to 5 A first embodiment of the invention described in items 14 to 18 will be described. Figures 16 and A are the connection method diagrams of the adhesive tape of the first embodiment, Figure 16 is a perspective view of the connection between the adhesive material discs, and Figure 16B is the connection of Figure 16A An oblique view of the connection method of part (b). Adhesive material tape 1 is wound around discs 3 and 3 a, and each of the discs 3 and 3 a is provided with a reel 5 ′ and side plates 7 disposed on both width sides of the adhesive material tape 1. Adhesive material tape 1 is made of silicon. The processing substrate 9 and an adhesive applied to one side of the silicon processing substrate 9 are composed. In terms of strength and peelability of the adhesive constituting the anisotropic conductive material, the silicon-treated substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or PET (polyethylene terephthalate), etc. The surface of the substrate is treated with a silicone resin or the like. The adhesive 1 1 is a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a thermal metal system. Heat-76- (72) (72) 200409405 Plastic resins are represented by styrene resins and polyester resins, while thermosetting resins are epoxy resins, vinyl ester resins, and acrylic resins. And silicone resins. Conductive particles 1 3 are dispersed in the adhesive 11. Conductive particles] 3 series of metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or carbon, graphite, etc., can also be in the foregoing and non-conductive glass, ceramics, plastics A polymer core material or the like covers the conductive layer or the like to form conductive particles. In addition, it is also possible to apply an insulating film particle that covers the aforementioned conductive particles with an insulating layer, or a conductive particle and an insulating particle for use. Forming a conductive layer on a hot molten metal such as solder or a polymer core material such as plastic will have deformability due to heat and pressure or pressure, so the distance between electrodes after connection will be reduced. Can increase the area of contact with the circuit, and improve reliability. In particular, it is better to use polymers as the core material. For example, because the solder has no melting point, it can be controlled in a softened state at a wide range of connection temperatures, and it is easy to get the thickness and flatness of the electrode. Connection building blocks. Next, a method of using the adhesive tape of this embodiment will be described. As shown in FIG. 3, the disk 3 a of the adhesive tape 1 and the take-up tray 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disk 3 a is attached to the take-up tray 17. And roll out the adhesive tape 1 (arrow E in Figure 3). Next, the adhesive material tape 1 is arranged on the circuit substrate 21, so as to be arranged on a heating and pressure head 19 arranged between two plates 3a, 17 and the pressure of the adhesive material tape 1 is applied from the silicon-treated substrate 9 side. Then, the adhesive 11 is pressed to the circuit substrate 21. Thereafter, the silicon substrate 9 is wound up to -77- (73) (73) 200409405 take-up reel 17. After the above-mentioned pressing (temporary connection), the electrodes of the circuit substrate 2 and the electrodes of the wiring circuit (electronic component) 2 3 are positioned and formally connected. Formally connected, as shown in FIG. 4, a wiring circuit (or electronic component) 2 3 is arranged on the adhesive 1 1 pressed on the circuit substrate 2]. If necessary, for example, a polytetrafluoroethylene 24 As a buffer material, the circuit board 21 is heated and pressurized by the heating and pressing head 19 to the circuit board 21. In this way, the electrode 2 1 a of the circuit board 21 and the electrode 2 3 a of the wiring circuit 2 3 can be connected. The size of the PDP using the adhesive tape 1 of this embodiment is relatively large, and sometimes the entire PDP is pressed around, and there are many connected parts. The amount of the adhesive 11 used at a time will be much larger than Traditionally used. Therefore, the amount of the adhesive tape 1 wound on the disk 3a will also increase, and the adhesive tape 1 wound on the disk 3a will be wound to the take-up disk 17 in a relatively short period of time. The end mark 2 8 of the adhesive tape 1 wound on the disk 3 a is exposed (see FIG. 16A). The method of connecting the adhesive tapes of the inventions described in the items No. 14 to 18 of the scope of the patent application can be divided into the following two types. (A) Use the reel 17 directly and replace the remaining number of the used adhesive tapes. Reduce the amount of adhesive tape, and connect the new adhesive tape and take-up tray 17, (b) Use the adhesive tape with less remaining rolls of the used adhesive tape 1 as the take-up tray 17 and connect them New adhesive tapes and adhesive tapes with reduced number of remaining rolls. (b), as shown in Figure 16A, in order to replace the disc 3a with a new -78- (74) (74) 200409405 adhesive material disc 3, the disc 3a is implemented on the adhesive tape 1 of the disc 3a. The end 30 of the adhesive tape (one adhesive tape) 1 and the start end 32 of the adhesive tape (the other adhesive tape) wound on the new adhesive tray 3 are connected. As shown in FIG. 16B, the adhesive material tape 1 is connected to the terminal portion 30 of the adhesive material tape 1 of the adhesive material plate 3 a and the starting end portion 3 of the adhesive material tape 1 of the new adhesive material plate 3 2 The silicon adhesive tapes 60 are affixed to each other so as to span the surfaces of the silicon-treated substrates 9 and 9 of the two adhesive tapes 1 and 1, and the two adhesive tapes 1 and 1 are connected. The silicon adhesive tape 60 is composed of a substrate 63 and a silicon adhesive 62 applied to one side of the substrate 63. The material of the substrate 63 is not particularly limited. However, the polyimide resin material according to this embodiment is a polyimide resin material. In Fig. 16B, the adhesive 11 of the adhesive tape and the adhesive portion 4 3 of the silicon adhesive tape 60 are indicated by oblique lines, respectively. Here, the adhesion of the silicon adhesive tape 60 will be described. The silicon-treated substrates 9 and 9 of the one and the other adhesive tapes 1 and 1 are respectively covered with silicon, so it is difficult to adhere with an adhesive. However, in this embodiment, the adhesive of the silicon adhesive tape 60 is adhered. Agent 4 3 is made of sand resin. The difference in surface tension between the two sand-treated substrates 9 and 9 will be small. 'Using adhesion (adhesion) enables the terminal part 30 of one adhesive tape 1 and the other adhesive tape. The starting end 3 of 1 has a good connection. The surface tension difference between the surface of the sand adhesive 62 of the sand adhesive tape 60 and the surfaces of the silicon-treated substrates 9 and 9 should be 1 OmN / m (1 Odyne / cm) or less. In this embodiment, 'there is almost no surface tension difference. . -79- (75) (75) 200409405 Generally, the surface tension of the two silicon-treated substrates 9 and 9 of the terminal portion 30 of the 'adhesive tape of one side' and the adhesive tape 1 of the other side is 2 5mN / m ~ 60mN / m (25 ~ 60dyne / cm). For example, when the surface tension is 30mN / m, the surface tension of the silicon adhesive 62 of the silicon adhesive tape 60 should be set to 20mN / m or more and 40mN / m or less. . Shixi adhesives are mainly composed of silicone rubber and silicone resins. Generally speaking, they have a little condensation reaction and have adhesiveness. Secondly, the hydrosilylation reaction of peroxide and platinum catalyst is used. It is crosslinked, and the glass transition temperature is lower than -100 ° C. The above are all commercially available products, and you can use them as appropriate. In this way, the bonding of the adhesive material tape 1 wound on the used adhesive material plate 3a and the adhesive material tape 1 wound on the new adhesive material plate 3 is performed using the silicon adhesive tape 60. Secondly, the used adhesive material plate 3a and the new adhesive material plate 3 are exchanged with each other, and the new adhesive material plate 3 is mounted on the adhesive device 15. Therefore, there is no need to pull out the adhesive tape 1 of the new adhesive tray 3 and mount the adhesive tape to the take-up tray 17 or install the new adhesive tape 1 to the guide pin 36 of the adhesive device 15, so The replacement of the adhesive material plates 3 and 3a has good operation efficiency. In this way, since the terminal portion 30 of the adhesive material tape 1 which has been completely rolled out, and the starting end portion 3 2 of the newly installed adhesive material tape are connected by a silicon adhesive tape, the connection is very simple. Next, the used disk 3a and the new disk 3 are exchanged with each other, and the new disk 3 is mounted on the adhesive device 15. Therefore, there is no need to mount the new adhesive tape 1 to the take-up tray 17. Directly use the take-up tray 17 of (a), and replace the used adhesive tape -80- (76) (76) 200409405 I with a reduced number of remaining adhesive tapes with new adhesive tapes and implement new adhesion When the adhesive tape and the winding disk 17 are connected, when the end mark 2 8 of the used disk adhesive tape is exposed, it will be cut off near the end mark 2 8 of the adhesive tape 1 so that it remains in the winding. The end portion 30 ′ of the adhesive tape on the side of the disk 17 and the start end portion 3 2 of the adhesive tape on the new adhesive plate 3 abut each other. Next, the abutment portion of the two is connected with the end portion 30 of the adhesive material tape 1 and the start end portion 32 of the adhesive material tape 1 of the new adhesive material plate by using an adhesive tape. Because there are 17 reels and 9 substrates in the reeling tray, it is possible to wind up several adhesive material disks, reduce the number of times the coiling tray is replaced, and have good operating efficiency. Next, a method for manufacturing the adhesive tape of the present embodiment will be described with reference to Fig. 5. On the separator 9 rolled out from the unwinder 25, a cloth 27 is coated with an adhesive made of a mixture of resin and conductive particles, and dried in a drying oven 2 9 before being wound by a winder 3 1 Take up the original material. The original material of the rolled adhesive tape is cut into a specific width by a cutting machine 33 and wound onto the reel, and the side plates 7, 7 are mounted on the reel from both sides, or 'rolled onto the reel with the side plate, It is packaged with dehumidifying material, and it is managed at low temperature (-5 ° C ~ -10 ° C) and shipped. Next, other embodiments of the invention described in items 14 to 18 of the scope of patent application will be described. The same parts as the above embodiments will be designated by the same symbols and detailed descriptions of those parts will be omitted. The following description is based on the above implementation. The main difference is the shape. In the second embodiment shown in FIG. 17, in addition to the aforementioned -81-(77) (77) 200409405 embodiment, the end portion 30 of the adhesive tape 1 on one side and the adhesion on the other side Silicone adhesive tape 60 is also attached to the adhesive 1 1 on the front end 3 2 of the adhesive tape. The silicon adhesive 62 of the silicon adhesive tape 60 of this second embodiment has an adhesive force of 100 g / 25 mm or more, and in this embodiment, it is 700 g / 25 mm to 1400 g / 25 mm. The setting of the surface tension of the silicon adhesive 62 of the silicon adhesive tape 60 is the same as the above embodiment, and the difference in surface tension of the silicon substrate of the adhesive tape of one and the other is 1 OmN / m (1 Odyne / cm). In this second embodiment, the two ends of the end portion 30 of the one adhesive tape 1 and the start end portion 32 of the other adhesive tape can be adhered with the silicon adhesive tape 60, which can be more than the first embodiment. The two adhesive tapes 1 and 1 are adhered with high strength. The third embodiment shown in FIG. 18 is a configuration in which the terminal portion 30 of one adhesive tape 1 and the start portion 3 2 of the other adhesive tape 1 are arranged in an overlapping manner. The silicon adhesive tape 60 of the second embodiment is adhered to the side surface of the adhesive material 11 and the third embodiment can obtain the same effect as the second embodiment. The fourth embodiment shown in FIG. 19 is between the terminal portion 30 of one adhesive tape 1 and the starting end portion 3 2 of the other adhesive tape 1, and silicon is coated on both sides of the substrate. The sand adhesive tape 61 of the adhesive 62 is used to connect the terminal portion 30 and the beginning portion 32. With this fourth embodiment, since the silicon adhesive tape 61 on both sides is used, the connection between the terminal portion 30 of the adhesive tape 1 on one side and the beginning portion 3 2 of the adhesive tape 1 on the other side is more simple and convenient. easily. Next, the inventions described in item 19 to 21 of the scope of patent application will be described in -82- (78) (78) 200409405. Applicable inventions relate to an adhesive tape for electronic components and a circuit board, or an adhesive fixation between circuit boards, and an electrical connection between the electrodes of the two, and in particular, to a method for connecting a tape-shaped adhesive tape. . Next, the background art of the inventions described in claims 19 to 21 of the scope of patent application will be described. Generally speaking, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, bare chip packages, and circuit substrates, or the adhesion and fixation between circuit substrates, and the electricity between the two electrodes The method of sexual connection uses adhesive tape. Japanese Patent Application Laid-Open No. 2000- 2 8 0 0 5 describes a case in which an adhesive material tape on which a substrate is coated with an adhesive material is rolled into a disc shape. The width of this conventional adhesive tape is about 1 to 3 mm, and the length of the tape wound up to the disc is about 50 m. When the adhesive tape is mounted on the adhesive device, a tray of adhesive tape (hereinafter referred to as "adhesive material tray") is mounted on the adhesive device, and the beginning end of the adhesive tape is pulled out and mounted on the take-up tray. Next, from the base material side of the adhesive material tape rolled out from the self-adhesive material tray, the adhesive is pressed onto the circuit board or the like with a heating and pressing head, and the remaining substrate is taken up by a take-up disk. Secondly, when the adhesive tape of the adhesive material tray is used up, remove the used disk and the take-up disk of the winding substrate, mount the new take-up disk and the new adhesive material tray on the adhesive device, and attach the adhesive material. The beginning of the tape is mounted on the take-up reel. However, in recent years, with the enlargement of panel screens such as PDPs, the adhesion area of circuit substrates has also increased, and the amount of adhesive used at one time -83- (79) (79) 200409405 has also increased. In addition, as the use of the adhesive is expanded, the amount of the adhesive used is also increased. Therefore, the replacement of the adhesive material plate in the electronic equipment manufacturing factory is more frequent. Because the replacement of the adhesive material plate is very troublesome, there is a problem that the production efficiency of the electronic device cannot be improved. To solve this problem, you can consider increasing the number of adhesive tapes wound to the disk to increase the amount of adhesive per disk to reduce the frequency of disk replacement. However, because the width of the adhesive tape is narrower 1 ~ 3mm. Increasing the number of rolls may lead to loose coiling. Furthermore, if the number of rolls is increased, the pressure applied to the adhesive tape rolled into the shape of a tape increases, which may cause the adhesive to leak from both sides of the tape and become a cause of blockage. In addition, if the number of rolls of adhesive tape is increased, the diameter of the disk will also increase, and the existing adhesive device may not be used because it cannot be mounted on the existing adhesive device. Therefore, the purpose of the invention described in the claims 19 to 21 of the patent application scope is the connection method of the adhesive material tape, which can make the replacement of the adhesive material plate simpler, and improve the production efficiency of electronic equipment. Next, referring to the drawings of the appendix, the embodiments of the inventions described in the scope of patent application Nos. 19 to 21 will be described. First, refer to FIGS. 20 to A, C, 21, 4, and 5 The first embodiment of the invention described in claims 19 to 21 of the scope of patent application will be described. Fig. 20A to C are diagrams showing the connection method of the adhesive tape in this embodiment, Fig. 20A is a perspective view of the connection between the adhesive material discs, and Figs. 20B and C are the connection parts of Fig. 20A Sectional view of the connection method. Adhesive material tape 1 is wound on discs 3 and 3 a respectively. Each disc 3 and 3 a -84- (80) (80) 200409405 is equipped with a reel 5 and is disposed on both width sides of adhesive material tape 1 Side plate Ί. The remaining material w 1 is composed of a base material 9 and an adhesive 11 applied to one side of the base material 9. In terms of strength and peelability of the adhesive constituting the anisotropic conductive material, the substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, and silicon-treated PET (polyethylene terephthalate). ), Etc., however, it is not limited to this. Adhesive] 1 is a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a hot metal system. Thermoplastic resins are typified by styrene resins and polyester resins, while thermosetting resins are typified by epoxy resins, vinyl ester resins, acrylic resins, and silicone resins. Conductive particles 1 3 are dispersed in the adhesive U. The conductive particles 1 3 are metal particles such as An, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or carbon, graphite, etc., and can also be used in the foregoing and non-conductive glass, ceramics, and plastics. The polymer core material is formed by covering the conductive layer. In addition, it is also possible to apply an insulating film particle that covers the aforementioned conductive particles with an insulating layer, or conductive particles and insulating particles for use. Forming a conductive layer on a hot molten metal such as solder or a polymer core material such as plastic will have deformability due to heat and pressure or pressure, so the distance between electrodes after connection will be reduced. Can increase the area of contact with the circuit, and improve reliability. In particular, it is better to use polymers as the core material. For example, because the solder has no melting point, it can be controlled in a softened state at a wide range of connection temperatures, and it can be obtained very easily. -85- (81) (81) 200409405 A connection member that can cope with errors in thickness and flatness of electrodes. Next, a method of using the adhesive tape of this embodiment will be described. As shown in FIG. 21, the disk 3a of the adhesive material tape 1 and the take-up disk 17 are mounted to the adhesive device 15, and the front end of the adhesive material tape 1 wound on the disk 3a is guided. The pin 22 is attached to the take-up tray 17 and rolls out the adhesive tape 1 (arrow E in FIG. 21). Next, the adhesive tape 1 is arranged on the circuit board 21, and the heating and pressing head 19 arranged between the two plates 3 and 17 is used to perform pressure bonding of the adhesive tape 1 from the substrate 9 side, and the adhesive 1 1 is pressed to the circuit board 2 1. Thereafter, the base material 9 is taken up onto a take-up tray 17. After the above-mentioned pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 23 are positioned and formally connected. For the formal connection, as shown in FIG. 4, a wiring circuit (or electronic component) 23 is arranged on the adhesive 11 pressed onto the circuit substrate 21, and if necessary, for example, a polytetrafluoroethylene material 24 can be used as a buffer. The circuit board 2 1 is heated and pressurized with a heating and pressing head 19 to the circuit board 21. In this way, the electrode 2 1 a of the circuit board 21 and the electrode 2 3 a of the wiring circuit 2 3 can be connected. The size of the PDP using the adhesive tape 1 of this embodiment is relatively large, and sometimes the entire PDP is pressed around, and there are many connected parts. The amount of the adhesive 11 used at a time will be much larger than Traditionally used. Therefore, the amount of the adhesive tape 1 wound on the disk 3 a will also increase, and the adhesive tape 1 wound on the disk 3 a will be wound up to the take-up disk 1 in a relatively short period of time. 7, while exposing the adhesive tape-86- (82) 200409405 wound on the disc 3a, the end mark 2 8 of the tape 1 (see FIG. 20A). The connection method of the adhesive tape of the invention described in the scope of the patent application No. 19 ~ 2 1 can be divided into the following two types. (A) Use the reel 17 directly, and replace the remaining number of the used adhesive tape 1. Reduce the amount of adhesive tape and connect a new adhesive tape to the take-up reel 17, (b) will be used

黏著材膠帶1之殘餘捲數變少的黏著劑膠帶當做捲取盤 1 7使用，並連接新黏著劑膠帶及殘餘捲數變少的黏著劑 膠帶。 (b )時，如第2 0圖A所示，爲了將盤3 a更換成新 黏著材盤3，在盤3 a之黏著材膠帶1露出結束標記2 8時 ，盤3a之黏著材膠帶（一方之黏著材膠帶）1之終端部 3 0、及捲繞於新黏著材盤3上之黏著材膠帶（另一方之黏 著材膠帶）1之始端部3 2係利用樹脂製黏著劑64實施連 接。An adhesive tape with a small number of remaining rolls of the adhesive tape 1 is used as a take-up reel 17 and a new adhesive tape and an adhesive tape with a small number of remaining rolls are connected. (b), as shown in FIG. 20A, in order to replace the disc 3a with a new adhesive material disc 3, when the adhesive tape 1 of the disc 3a exposes the end mark 28, the adhesive tape of the disc 3a ( One end of the adhesive tape 1) 30, and the end of the adhesive tape (the other adhesive tape) 1 wound around the new adhesive tray 3 The first end 3 2 is connected by a resin adhesive 64 .

樹脂製黏著劑64係例如環氧樹脂、氰酸樹脂、二馬 來醯亞胺樹脂、酚樹脂、尿素樹脂、三聚氰胺樹脂、醇酸 樹脂、壓克力樹脂、不飽和聚酯樹脂、苯二酸二烯丙酯樹 脂、5夕樹脂、間苯二酣甲醒樹脂、二甲苯樹脂、呋喃樹脂 、聚胺酯樹脂、酮樹脂、三聚烯丙基胺氰樹脂等。 此黏著材膠帶1之連接如第20圖B所示，針對黏著 材盤3 a之黏著材膠帶1之終端部3 0、及新黏著材盤3之 黏著材膠帶1之始端部3 2，使始端部3 2之黏著劑1 !面 重疊於終端部3 0之基材9面。其次，利用組合於黏著裝 置1 5之充塡機65將糊狀之樹脂製黏著劑64塗布於重疊 -87- (83) (83)200409405 部份。其次，如第2 0圖c所示，此樹脂製黏著劑6 4爲熱 硬化性樹脂時，利用組合於黏著裝置1 5之加熱器66之加 熱實施硬化，連接黏著材膠帶〗之終端部3 0、及新黏著 材盤3之黏著材膠帶1之始端部3 2。 利用此方式’可實施捲繞於已使用之盤3 a上之黏著 材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連接。如 此，以樹脂製黏著劑6 4固定已全部捲出之黏著材膠帶1 之終端邰3 0、及新裝著之黏著材膠帶1之始端部3 2，故 連接十分簡單。 其次，將已使用之盤3 a及新盤3互相對換，將新盤 3裝著至黏著裝置1 5。因此，無需實施將新黏著材膠帶1 裝著至捲取盤17之作業。 直接使用（a )之捲取盤1 7，將已使用之黏著材膠帶 1之殘餘捲數變少的黏著劑膠帶更換成新黏著劑膠帶，並 實施新黏著劑膠帶及捲取盤1 7之連接時，已使用之盤3 a 之黏著材膠帶1之結束標記2 8露出時會從黏著材膠帶1 之結束標記2 8附近實施切斷，使殘留於捲取盤1 7側之黏 著材膠帶之終端部3 0及新黏著材盤3之黏著材膠帶1之 始端部3 2重疊。其次，在兩者之重疊部份塗布糊狀之樹 脂製黏著劑64，依據使用之樹脂製黏著劑之種類實施加 熱、紫外線照射等使其發揮黏著力，實施終端部3 0、及 新黏著材盤3之黏著材膠帶1之始端部3 2之連接。因爲 捲取盤1 7只會捲取基材9，故可捲取數個黏著材盤份， 減少捲取盤1 7之更換次數，而有良好之作業效率。 -88- (84) (84)200409405 此處’爹照弟5圖，針對本貫施形態之黏著材膠帶】 之製造方法進行說明。 在從捲出機25捲出之基材（separator )上，以塗布 機2 7塗布由樹脂及導電粒子丨3混合而成之黏著劑n . 並以乾燥爐2 9實施乾燥後，以捲取機3丨捲取原始材料。 被捲取之黏著材膠帶之原始材料，以切割機3 3切成特定 寬度並捲取至捲軸後，從兩側將側板7、7裝著於捲軸上 ，或者，捲取至附側板之捲軸上，將其和除濕材一起綑包 ，實施低溫（-5 °C〜-1 0 °C )之管理並進行出貨。 申請專利範圍第1 9〜2 1項記載之發明並未受限於上 述之實施形態，只要未背離申請專利範圍第1 9〜2 1項記 載之發明之要旨的範圍內，可實施各種變形。 本實施形態時，樹脂製黏著劑64係以熱硬化性樹脂 爲例，然而，亦可以光硬化性樹脂取代熱硬化性樹脂，以 紫外線等之光照射實施硬化性樹脂之硬化，實施黏著材膠 帶1間之連接。 此時，光硬化性樹脂可採用在具有丙烯酸基或甲基丙 烯酸基之樹脂調合光聚合起動劑之組成物、或含有芳香族 重偶氮鹽、二烯丙基碘氫基鹽、鎏鹽等光硬化劑之環氧樹 脂等。 又，樹脂製黏著劑亦可採用以乙烯乙酸乙烯酯樹脂或 聚稀煙樹脂爲主成分之熱金屬黏著材，例如板狀之熱金屬 黏著材時，將板狀之熱金屬黏著劑置於黏著材膠帶1間之 重疊部份上，以加熱器66對熱金屬黏著劑進行加熱使其 -89- (85) (85)200409405 熔融後，再以冷卻使熱金屬黏著劑固化，實施黏著材膠帶 1間之連接。 使用於黏著材膠帶1之連接之樹脂製黏著劑，亦可從 熱硬化性樹脂、光硬化性樹脂、及熱金屬黏著劑所構成之 群組中選取複數種來使用。 上述之實施形態時，使黏著材盤3 a之黏著材膠帶1 之終端部30之基材9面、及新黏著材盤3之黏著材膠帶 1之始端部3 2之黏著劑1 1面互相重疊，並塗布樹脂製黏 著劑之熱硬化性樹脂來實施連接，然而，亦可反折黏著材 盤3 a之黏著材膠帶1之終端部3 0，並以重疊黏著劑1 1 面來實施兩者之黏著後，再以熱硬化性樹脂固定。 其次，針對申請專利範圍第22〜24項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶盤及黏著裝置相關。 其次，針對申請專利範圍第22〜24項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 曰本特開2001-284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 -90- (86) (86)200409405 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲5 0 m程度。 將黏著材膠帶裝著於黏著裝置時，將捲繞著黏著材膠 帶之黏著材膠帶盤裝設於黏著裝置上，拉出黏著材膠帶之 始端部並裝設至捲取盤。其次，從黏著材膠帶盤捲出之黏 著材膠帶之基材側以加熱加壓頭將黏著劑壓著至電路基板 等，再以捲取盤捲取殘餘之基材。 其次，一方之黏著材膠帶盤之黏著材膠帶用完時，拆 下用完之盤、及捲取基材之捲取盤，將新捲取盤及新黏著 材膠帶盤裝著至黏著裝置，並將黏著材膠帶之始端裝設於 捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材膠帶盤的更 換更爲頻繁，因爲黏著材膠帶盤之更換十分麻煩，故有無 法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 -91 - (87) (87)200409405 會增大，可能因無法裝著於既存之黏著裝置上而無法使闬 既存之黏著裝置。 因此’申g靑專利軔圍第2 2〜2 4項記載之發明的目的 ，係在提供一種黏著材膠帶盤、及黏著裝置，可使黏著材 Mw盤之更換更爲簡卓’而提局電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第2 2〜2 4 項記載之發明之實施形態進行說明，首先，參照第22圖 A〜C、桌2 3圖、第4圖、及第5圖，針對申請專利範圍 第2 2〜2 4項記載之發明之第1實施形態進行說明。第2 2 圖A〜C係第1實施形態之黏著材膠帶盤圖，第22圖a 係黏著材膠帶盤的斜視圖，第22圖B係第22圖A之正 面圖，第22圖C係第22圖A之連結膠帶之平面圖，第 2 3圖係黏著裝置之黏著劑壓著步驟的槪略圖。 如第2 2圖A所示，本實施形態之黏著材膠帶盤A具 有複數之黏著材膠帶之捲部（以下簡稱爲捲部）2、2a， 捲部2、2 a之盤3、3 a上分別捲繞著黏著材膠帶1。各盤 3、3 a上配設著捲軸5、及配置於黏著材膠帶1之兩寬度 側之側板7。如第2 3圖所示，黏著材膠帶1係由基材9、 及塗布於基材9之一側面的黏著劑1 1所構成。 複數之捲部2、2a當中，捲繞於一方之捲部2之黏著 材膠帶（以下稱爲一方之黏著材膠帶）1之終端部3 0、及 捲繞於另一方之捲部之黏著材膠帶（以下稱爲另一方之黏 著材膠帶）1之始端部3 2間，配設著用以連接兩者之連 結膠帶41。從一方之黏著材膠帶1之終端部3 0沿著盤3 -92- (88) (88)200409405 之側板7之內側面配置著連結膠帶6 7，前述連結膠帶6 7 會卡止於側板7之上部之切口部份6 8而連接於另一方之 黏著材膠帶1之始端部3 2。 又，一方及另一方之黏著材膠帶1、及連結膠帶67 之連接部份，會標示著用以辨識連結膠帶6 7之標記6 9、 70，以膠帶檢測手段（發光部7 1、受光部72 )檢測到標 記69、70時，會跳過連結膠帶67部份而不對連結膠帶 6 7部份實施壓著。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 硬化性樹脂系則以環氧樹脂系、乙烯基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 Αυ、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子 、或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶 瓷、塑膠等高分子核材等覆蓋前述之導電層等而形成者。 此外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒 子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金 屬、或塑膠等之高分子核材上形成導電層者，會具有因加 -93- (89) (89)200409405 熱加壓或加壓而產生變形之變形性，故連接後之電極間距 離會縮小，連接時可增加和電路接觸之面積，而可提高信 賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有 融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得 到很容易即可對應電極之厚度及平坦性之誤差的連接構件 〇 其次，針對本實施形態之黏著材膠帶盤A之使用方 法進行說明。如第2 3圖所示，將黏著材膠帶盤A、及捲 取盤1 7裝著至黏著裝置1 5，經由導引銷2 2將一方之黏 著材膠帶1之始端部3 2裝設至捲取盤1 7，並捲出黏著材 膠帶1 (第23圖中之箭頭E )。其次，將黏著材膠帶1配 置於電路基板2 1上，利用配置於兩盤3、1 7間之加熱加 壓頭1 9從基材9側實施黏著材膠帶1之壓接，將黏著劑 1 1壓著至電路基板2 1。其後，將基材9捲取至捲取盤1 7 〇 上述之壓著後（暫時連接），實施電路基板2 1之電 極及配線電路（電子構件）2 3之電極的定位並進行正式 連接。正式連接上，如第4圖所示，在壓著至電路基板 2 1上之黏著劑1 1上配置配線電路（或電子構件）2 3，必 要時，可將例如聚四氟乙烯材24當做緩衝材，以加壓加 壓頭1 9對電路基板2 1實施配線電路2 3之加熱加壓。利 用此方式，可連接電路基板2 1之電極2 1 a及配線電路2 3 之電極2 3 a及 連接。 利用本實施形態之黏著材膠帶1之PDP，其尺寸會較 (90) (90)200409405 大，有時會對PDP之周圍全體實施壓著，連接部份會_ 多，一次使用之黏著劑1 1的使用量會遠大於傳統上之使 用量。因此，捲繞於盤3上之黏著材膠帶1之使用量亦會 變多，捲繞於盤3上之黏著材膠帶1在相對較短之時間內 會被捲取至捲取盤1 7。 一方之黏著材膠帶1全部捲出時，連結膠帶67會脫 離切口部份6 8，接著，會捲出另一方之黏著材膠帶〗。本 實施形態時，因爲在一方之黏著材膠帶1之終端部3 0及 另一方之黏著材膠帶1之始端部3 2之間，具有用以連接 兩者之連結膠帶67，故一方之黏著材膠帶1全部捲出時 ，會接著開始捲出另一方之黏著材膠帶1。因此，無需實 施在一方之黏著材膠帶1之全部捲出後將新黏著材膠帶1 裝設至捲取盤17之作業，故可提高電子機器之生產效率 〇 又，如第23圖所示，黏著裝置15具有一對發光部 7 1及受光部72，用以實施連結膠帶67之光學檢測。用以 連接一方之黏著材膠帶1及另一方之黏著材膠帶1之兩者 的連結膠帶67之兩端上，標示著黑色標記69、70。發光 部7 1會對黏著材膠帶1連續發出雷射光，受光部72則會 接收其反射光，並將檢測信號傳送至控制裝置7 9。受光 部72會接收到連結膠帶67之兩端之標記69、70之反射 光’並將該檢測信號傳送至控制裝置7 9。 接收到檢測信號之控制裝置79，會對用以驅動黏著 裝置1 5之兩盤3、1 7之馬達輸出控制信號，利用馬達驅 -95- (91) (91)200409405 動器開始對馬達輸出驅動脈衝。其次，馬達會對應馬達驅 動器施加之脈衝數實施旋轉，使兩盤3、1 7以比通常速度 更快之速度移動，並使黏著材膠帶1朝捲出方向移動對應 連結膠帶6 7之長度的距離。 利用此方式，另一方之黏著材膠帶1會自動捲出至加 熱加壓頭1 9之位置，可省略以使另一方之黏著材膠帶！ 之始端部3 2位於加熱加壓頭1 9之位置而捲出連結膠帶 6 7之作業。 又，因爲捲取盤1 7只會捲取基材9，故可捲取數個 黏著材膠帶盤份而減少捲取盤1 7之更換次數，而有良好 之作業效率。 此處，參照第5圖，針對本實施形態之黏著材膠帶盤 A之製造方法進行說明。 在從捲出機 25捲出之基材（separator) 9上，以塗 布機27塗布樹脂及導電粒子混合而成之黏著劑，並以乾 燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料。被捲取 之黏著材膠帶之原始材料，以切割機3 3切成特定寬度並 捲取至捲軸後，從兩側將側板7、7裝著於捲軸上，或者 ，捲取至附側板之捲軸上，將其和除濕材一起綑包，實施 低溫（_ 5 °C〜-1 0 °C )之管理並進行出貨。 其次’針對申請專利範圍第2 2〜2 4項記載之發明之 其他實施形態進行說明’以下說明之實施形態中，和上述 實施形態相同之部份會附與相同符號並省略該部份之詳細 說明，以下之說明係以和上述實施形態不同之點爲主。 -96- (92) (92)200409405 第2 4圖所示之第2實施形態時，因爲連結膠帶6 7之 寬度T小於前後之黏著材膠帶1之寬度W，故可辨識連 結膠帶6 7。又，黏著裝置丨5上，夾著黏著材膠帶】之相 對位置上配設著和第1實施形態相同之發光部及受光部k 此時，利用受光部接收透射連結膠帶6 7之寬度較狹部份 的雷射光來辨識連結膠帶6 7。 第2 5圖所示之第3實施形態時，連結膠帶6 7會形成 用以辨識連結膠帶6 7之多數孔5 3。此時，亦可利用受光 部接收透射連結膠帶67之孔53的雷射光來辨識連結膠帶 61。 第2 6圖所示之第4實施形態時，並未利用連結膠帶 6 7實施黏著材膠帶1間之連接，而在一方之黏著材膠帶1 全部捲出時，捲出另一方之黏著材膠帶1使其捲附於盤 1 7上來實施黏著材膠帶1之更換。此時，因爲無需將新 黏著材膠帶盤裝著至黏著裝置，而只需較少之新黏著材膠 帶盤之更換作業’故可提高電子機器之生產效率。 申請專利範圍第22〜24項記載之發明並未受限於上 述之實施形態’只要在未背離申請專利範圍第2 2〜2 4項 記載之發明之要旨的範圍內，可實施各種變形。 例如’上述之第1及第2實施形態時，捲部2、2 a之 個數並無任何限制’而可以爲任何個數。 第1至第3實施形態係以光學方式檢測連結膠帶67 ，然而，亦可在連結膠帶6 7上附加磁性膠帶並以磁性感 測器來進行檢測。 -97- (93) (93)200409405 其次，針對申請專利範圍第2 5〜2 8項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之#奢固疋、以及兩者之電極間之電性連接的黏著材膠帶 。又，係關於在將半導體元件（晶片）黏著 固定至引線 框架之固定用支持基板或引線框架之晶片、或半導體元件 載置用支持基板之半導體裝置上所使用之黏著材膠帶，尤 其是，和捲成盤狀之黏著材膠帶盤、黏著裝置、及黏著材 膠帶之連接方法相關。 其次，針對申請專利範圍第2 5〜2 8項記載之發明之 背景技術進行說明。 一般而言，液晶面板、P D P (電漿顯示面板）、E L ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。又，黏著材膠帶亦被應用於引 線框架之引線固定膠帶、L0C膠帶、晶粒結著膠帶、微 BGA CSP等之黏著膜等，其目的則在提高半導體裝置全 體之生產性及信賴性。 日本特開200 1 -2.84005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統電極連接用黏著材膠帶之寬度爲1〜3mm程 度，捲取至盤之膠帶之長度爲5 0m程度。 將黏著材膠帶裝著於黏著裝置時，將捲繞著黏著材膠 帶之黏著材膠帶盤裝設於黏著裝置上，拉出黏著材膠帶之 -98- (94) (94)200409405 始端部並裝設至捲取盤。其次，從自黏著材膠帶盤捲出之 黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至電路基 板等，再以捲取盤捲取殘餘之基材。 其次，一方之黏著材膠帶盤之黏著材膠帶用完時 '拆 下用完之盤、及捲取基材之捲取盤，將新捲取盤及新黏著 材膠帶盤裝著至黏著裝置，並將黏著材膠帶之始端裝設於 捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材膠帶盤的更 換更爲頻繁，因爲黏著材膠帶盤之更換十分麻煩，故有無 法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第25〜28項記載之發明的目的 ，係在提供一種黏著材膠帶盤、黏著裝置、及連接方法， -99- (95) (95)200409405 可使黏著材膠帶盤之更換更爲簡單，而提高電子機器之生 產效率。 其次’參照附錄圖面，針對申請專利範圍第2 5〜2 8 項記載之發明之實施形態進行說明，首先，參照第2 7圖 A〜C、第28圖、第4圖、第29圖、及第5圖，針對申 請專利範圍第2 5〜2 8項記載之發明之第1實施形態進行 說明。第2 7圖A〜C係第1實施形態之黏著材膠帶盤圖 ’第2 7圖A係黏著材膠帶盤的斜視圖，第2 7圖B係第 27圖A之正面圖，第27圖C係第27圖A之連接部份之 剖面圖，第2 8圖係黏著裝置之黏著劑壓著步驟的槪略圖 ，第29圖係PDP之黏著劑之使用狀態的斜視圖。 本實施形態之黏著材膠帶盤A具有複數之黏著材膠 帶1之捲部（以下稱爲捲部）2、2a，捲部2、2a具有捲 繞著黏著材膠帶1之盤3、3 a。各盤3、3 a上配設著捲軸 5、及配置於黏著材膠帶1之兩寬度側之側板7。如第2 8 圖所示，黏著材膠帶1係由基材9、及塗布於基材9之一 側面之黏著劑1 1所構成。 複數之捲部2、2a當中，捲繞於一方之捲部2之黏著 材膠帶（以下稱爲一方之黏著材膠帶）1之終端部3 0、及 捲繞於另一方之捲部2a之黏著材膠帶（以下稱爲另一方 之黏著材膠帶）1之始端部32係以卡止具76實施連接。 卡止具7 6係例如剖面略呈口字形之卡止銷，使一方之黏 著材膠帶1之終端部30及另一方之黏著材膠帶1之始端 部3 2互相重疊，將卡止銷***此重疊部份來連接兩者。 -100- (96) (96)200409405 其次’本實施形態時，連接部份7 4如第2 7圖C所示 ’以卡止具7 6連接終端部3 0及始端部3 2之後，將連接 部份7 4朝膠帶之縱向反折〗8 〇度，使黏著材膠帶〗覆蓋 卡止具7 6。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由〇 p p (延伸聚丙烯）、聚四氟乙烯、以及經過 矽處理之PET (聚對苯二甲酸乙二酯）等所構成，然而， 並不限於此。 黏著劑1 1係熱可塑性樹脂'熱硬化性樹脂、或熱可 塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系係以 苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹脂系 則以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表。 黏著劑1 1內亦可分散著導電粒子1 3。導電粒子1 3 係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬 粒子、或碳、石墨等，亦可在前述之物及/或非導電性之 玻璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形 成。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆 膜粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔 融金屬、或塑膠等之高分子核材上形成導電層者，會具有 因加熱加壓或加壓而產生變形之變形性，故連接後之電極 間距離會縮小，連接時可增加和電路接觸之面積，而可提 高信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因 沒有融點，在廣泛之連接溫度下亦可控制於軟化狀態，而 可得到很容易即可對應電極之厚度及平坦性之誤差的連接 -101 - (97) (97)200409405 構件。 其次，針對本實施形態之黏著材膠帶盤之使用方法進 行說明。如第2 8圖所示，將黏著材膠帶盤A、及捲取盤 1 7裝著至黏著裝置1 5，經由導引銷22將一方之黏著材膠 帶〗之始端部3 2裝設至捲取盤1 7，並捲出黏著材膠帶1 (第28圖中之箭頭E)。其次，將黏著材膠帶1配置於 電路基板2 1上’以配置於兩盤3、1 7間之加熱加壓頭1 9 從基材9側實施黏著材膠帶1之壓接，將黏著劑1 1壓著 至電路基板2 1。其後，將基材9捲取至捲取盤1 7。 其次，如第4圖所示，在壓著至電路基板21上之黏 著劑1 1上配置配線電路（或電子構件）2 3，可將聚四氟 乙烯材24當做緩衝材，以加熱加壓頭1 9對電路基板2 1 實施配線電路2 3之加熱加壓。利用此方式，可連接電路 基板21之電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1之PDP 26之連接部份所示，黏著劑11係壓著於PDP 26之周圍 全體，故一次使用之黏著劑1 1之使用量明顯遠大於傳統 上之使用量。因此，黏著材膠帶1之使用量亦會變多，捲 繞於盤3、3 a上之黏.著材膠帶1在相對較短之時間內會被 捲取至捲取盤1 7。 本實施形態時，一方之黏著材膠帶1全部捲出時，連 接部份74會脫離切口 75，接著，會捲出另一方之黏著材 膠帶1 (第27圖B )。本實施形態時，係以卡止具76連 接一方之黏著材膠帶1之終端部30及另一方之黏著材膠 •102- (98) (98)200409405 帶1之始端部32，一方之黏著材膠帶1全部捲出時，會 接著開始捲出另一方之黏著材膠帶1。因此，無需實施在 一方之黏著材膠帶1之全部捲出後將新黏著材膠帶1裝設 至捲取盤1 7之作業，故可提高電子機器之生產效率。又 ，連接部份74上因以黏著材膠帶1覆蓋卡止具76，故外 觀良好，同時，可防止連接部份74之卡止具76接觸黏著 材膠帶]而傷害到黏著材膠帶1。 又，如第2 8圖所示，黏著裝置1 5具有當做連接部檢 測感測器4 7使用之厚度檢測感測器，實施連接部份74之 光學檢測，使加熱加壓頭1 9跳過連接部份74。一方之黏 著材膠帶1及另一方之黏著材膠帶1之連接部份74的厚 度，如第27圖C所示，會大於黏著材膠帶1之厚度，以 檢測不同厚度來辨識連接部份74。厚度檢測感測器47會 隨時檢測黏著材膠帶1之厚度，並將檢測信號傳送至控制 裝置79。 接收到檢測信號之控制裝置79，會對用以驅動黏著 裝置1 5之兩盤3、1 7之馬達輸出控制信號，利用馬達驅 動器開始對馬達輸出驅動脈衝。其次，馬達會對應馬達驅 動器施加之脈衝數實施旋轉，使兩盤3、1 7以比通常速度 更快之速度旋轉，並使黏著材膠帶1朝捲出方向移動對應 連接部份74之搬運方向之長度的特定距離。 利用此方式，另一方之黏著材膠帶1會移動至加熱加 壓頭19之位置，故可防止一方及另一方之黏著材膠帶1 之連接部份74移至加熱加壓頭1 9之位置並執行壓著動作 -103- (99) 200409405 之問題。又，至連接部份4 1通過加熱加壓頭 自動地將一方之黏著材膠帶1捲取至捲取盤 略捲取之麻煩。 又，利用厚度檢測感測器4 7辨識連接部必 部4 1 a及後端部4 1 b，並只避開連接部份74， 用黏著材膠帶1。 又，因爲捲取盤1 7只會捲取基材9，故 黏著材膠帶盤份而減少捲取盤1 7之更換次數 之作業效率。 此處，參照第5圖，針對本實施形態之黏 之製造方法進行說明。 在從捲出機 25捲出之基材（separator) 布機2 7塗布樹脂及導電粒子1 3混合之黏著劑 爐2 9實施乾燥後，以捲取機3 1捲取原始材料 黏著材膠帶之原始材料，以切割機3 3切成特 取至捲軸後，從兩側將側板7、7裝著於捲軸 除濕材一起綑包，實施低溫（-5 °C〜-1 〇 T：) 行出貨。 其次，針對申請專利範圍第2 5〜2 8項記 其他實施形態進行說明，和上述實施形態相同 與相同符號並省略該部份之詳細說明，以下之 上述實施形態不同之點爲主。 第3 0圖所示之第2實施形態時，未使用 部2、2a之黏著材膠帶盤A，而使用具有1個 1 9爲止，會 1 7，故可省 ί 7 4之前端 則可有效利 可捲取數個 ，而有良好 著材膠帶1 9上，以塗 ，並以乾燥 。被捲取之 定寬度並捲 上，將其和 之管理並進 載之發明之 之部份會附 說明係以和 具有複數捲 捲部之黏著 -104- (100) (100)200409405 材膠帶盤2 C。此時，黏著材膠帶】係捲繞於捲取盤1 7， 當一方之黏著材膠帶1露出結束標記28時，爲了將一方 之黏者材膠帶盤2b更換至新黏著材膠帶盤2c，而連接一 方之黏著材膠帶1之終端部3 0、及另一方之黏著材膠帶】 之始端部3 2。 此時’亦利用連接部檢測手段之厚度檢測感測器77 檢測連接部份7 4，而使加熱加壓頭1 9避開連接部份7 4。 申請專利範圍第2 5〜2 8項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第2 5〜2 8項 記載之發明之要旨的範圍內，可實施各種變形。 例如，上述之第1及第2實施形態時，用以連接黏著 材膠帶1間之卡止具7 6並未限定爲卡止銷，其方法亦可 以橫剖面略呈3字形之可彈性變形之夾子來夾住並固定兩 者之重疊部份，或者，亦可以橫剖面略呈π字形之金屬片 夾住兩者之重疊部份，並從重疊部份之兩面壓扁夾持片來 連接兩者。 第1及第2實施形態係利用厚度檢測感測器47檢測 連接部份74之厚度來辨識連接部份74，然而，並不限於 此，亦可利用透射率檢測感測器來辨識連接部份74、或 利用C C D攝影機使連接部份之表面呈現於監視畫面並以 圖素之濃淡比較來檢測連接部份。 第31圖Α、第31圖Β、第32圖Α〜C係用以實施引 線框架之固定用支持基板、半導體元件載置用支持基板、 或引線框架之晶片和半導體元件之連接之黏著材膠帶當中 -105- (101) (101)200409405 ，將半導體元件黏著 固定於引線框架之固定用支持基板 及引線框架之LOC(LeadonChip)構造之1實例。 實施厚度50/im之表面處理之聚醯亞胺膜等支持膜 78之兩面，係採用兩面具有厚度25//m之聚醛亞胺系黏 著劑層等之黏著劑層80之具有如第31圖A之構成之黏 著材膠帶，而可得到第31圖B所示之LOC構造之半導體 裝置。將第31圖A所示之黏著材膠帶，以第32圖A〜C 所示之黏著裝置之冲切模具8 7 (公模（凸部）9 5、母模 (凹部）9 6 )冲切成細長形，例如，在厚度0.2 m m之鐵-鎳合金製引線框架上，以400 °C、3 MPa之壓力、3秒鐘之 加壓實施壓著，形成〇 · 2 m m間隔、〇 . 2 m m寬度之內引線 ，製成附有半導體用黏著膜之引線框架。其次，在其他步 驟實施3 5 0 °C之溫度、3MPa之壓力、3秒鐘之加壓，將半 導體元件壓著至此附有半導體用黏著膜之引線框架之黏著 劑層面，其後，以金線實施引線框架及半導體元件之絲焊 ，以連續成形使用環氧樹脂成形材料等密封材實施密封， 得到第31圖B所示之半導體裝置。第31圖A、B中，81 係以黏著材膠帶冲切所得之半導體用黏著膜，82係半導 體元件，83係引線框架，84係密封材，85係焊絲，86係 匯流排條。第3 2圖A、B、C係黏著裝置，第3 2圖A、B 中，8 7係冲切模具，8 8係引線框架搬運部，6 1係黏著劑 膠帶冲切貼附部，90係加熱器部，9 1係黏著材膠帶盤（ 黏著材膠帶捲出部）’92係黏著材膠帶（半導體用黏著 膜），93係黏著材膠帶捲出滾輪。又，第32圖C中，94 -106· (102) (102)200409405 係黏著材膠帶（半導體用黏著膜）’ 9 5係公模（凸部） ，9 6係母模（凹部），9 7係膜壓板。黏著材膠帶9 2會從 黏著材膠帶盤（黏著材膠帶捲出部）91連續捲出，並在 黏著材膠帶冲切貼附部8 9冲切成細長形且黏著至引線框 架之引線部份，將其視爲附有半導體用黏著膜之引線框架 而從引線框架搬運部搬出。冲切所得之黏著材膠帶則從黏 著材膠帶捲出滾輪93搬出。 和上述相同，利用黏著材膠帶將半導體元件連接至半 導體元件載置用支持基板。又，以同樣方法實施引線框架 之晶片及半導體元件之連接 黏著。黏著材膠帶只單純用 於黏著 固定時，可以電極間之接觸、或以導電性粒子實 施電性連接，而對應目的來選擇使用之黏著劑，若利用支 持膜，則有時會單純由黏著劑所構成。 其次，針對申請專利範圍第2 9〜3 4項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著劑膠帶 ’尤其是’和捲成盤狀之黏著劑膠帶、黏著劑膠帶之製造 方法、及黏著劑膠帶之壓著方法相關。 其次’針對申請專利範圍第2 9〜3 4項記載之發明之 背景技術進行說明。 一般而言，液晶面板、P D P (電漿顯示面板）、E L ( 營光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 -107- (103) (103)200409405 方法，係採用黏著劑膠帶。 曰本特開2 0 0 1 - 2 8 4 0 0 5號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者。 此種傳統黏著劑膠帶之寬度爲1〜3 mm程度，捲取至 盤之膠帶之長度爲5 0m程度，黏著劑膠帶被從盤捲出並 將黏著劑壓著至電路基板等後，即不再使用。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，上述之電子機器之製造工廠之捲繞著黏著 劑膠帶之盤的更換更爲頻繁，因爲新盤之更換十分麻煩， 故有無法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著劑膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著劑膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著劑膜的壓力會升高，而可能從 黏著劑膠帶之兩邊滲出而成爲阻塞之原因。 此外’黏著劑膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第2 9〜3 4項記載之發明的目的 ，係在提供一種黏著劑膠帶、黏著劑膠帶之製造方法、及 黏著劑膠帶之壓著方法，可在無需增加黏著劑膠帶之捲數 -108- (104) (104)200409405 的情形下增加黏著劑量。 其次，參照附錄圖面，針對申請專利範圍第 2 9〜3 4 項記載之發明之實施形態進行說明，首先，參照第3 3圖 Α、β、第3圖、第4圖、第34圖、第5圖、第35圖， 針對申請專利範圍第2 9〜3 4項記載之發明之第1實施形 態進行說明。第3 3圖A及B係黏著劑膠帶圖，第3 3圖 A係捲繞著黏著劑膠帶之盤之斜視圖，第3 3圖B係第3 3 圖A之A-A剖面圖，第34圖係PDP之黏著劑之使用狀態 的斜視圖，第3 5圖係在基材上塗布黏著劑之步驟的剖面 圖。 本實施形態之黏著劑膠帶1係捲繞於盤3，盤3上配 設著捲軸5及配置於黏著劑膠帶1之兩寬度側之側板7。 本實施形態時，黏著劑膠帶1之長度約爲5 0 m、寬度W 約爲1 0 m m。 黏著劑膠帶1係由基材9、及塗布於基材9上之黏著 劑1 1所構成，基材9上以具有間隔之方式配置著每條寬 度爲0.5 m m之5條黏著劑1 1。 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）.、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，熱 •109- 200409405 ^ 2 1 n '，.....f: Γή· (105) W 〜 硬化性樹脂系則以環氧樹脂系 '乙稀基酯系樹脂、壓克力 樹脂系、矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子]3係如 A u、A g、P t、N i、C u、W、S b、S η、焊錫等之金屬粒子 、或碳、石墨等，亦可在前述之物及/或非導電性之玻璃 、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成。 此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒 子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金 屬、或塑膠等之高分子核材上形成導電層者，會具有因加 熱加壓或加壓而產生變形之變形性，故連接後之電極間距 離會縮小，連接時可增加和電路接觸之面積，而可提高信 賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有 融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得 到很容易即可對應電極之厚度及平坦性之誤差的連接構件 〇 其次，針對本實施形態之黏著劑膠帶之使用方法進行 說明。將黏著劑膠帶1之盤3、及空盤17裝著至黏著裝 置1 5，將捲繞於盤3之黏著劑膠帶1之前端裝設至空盤 1 7，並捲出黏著劑膠帶1 (第3圖中之箭頭E )。其次.， 在電路基板2 1上配置黏著劑膠帶1，以配置於兩盤3、j 7 間之加熱加壓頭1 9從基材9側實施將黏著劑膠帶1之壓 接，將1條份之黏著劑1 1壓著至電路基板。其後，將殘 餘黏著劑Π和基材9 一起捲取至空盤17。 上述之壓著後（暫時連接），實施電路基板21之電 -110- (106) (106)200409405 極及配線電路（電子構件）2 3之電極的定位並進行正式 連接。正式連接上，在壓著於電路基板2 1上之黏著劑1 1 上配置配線電路（或電子構件）2 3，必要時，可將例如聚 四氟乙嫌材2 4當做緩衝材，以加熱加壓頭1 9對電路基板 2 1實施配線電路2 3之加熱加壓。利用此方式，可連接電 路基板2 1之電極2 1 a及配線電路2 3之電極2 3 a。 如第3 4圖所示，利用本實施形態之黏著劑膠帶丨之 PDP 26之連接部份，會對Pdp之周圍全體實施黏著，一 次使用之黏著劑1 1之使用量會遠大於傳統之使用量。因 此，捲繞於盤3上之黏著劑膠帶1之使用量亦會變多，捲 繞於盤3上之黏著劑膠帶1在相對較短之時間內會被捲取 至空盤17，盤3會變成空的。 當盤3變成空的時，分別使盤3及盤1 7逆轉，此時 ’會以空的盤3捲取，而使黏著劑膠帶1朝相反方向移動 (第3圖中之箭頭F )。 如此’每1條黏著劑1 1都會依序改變黏著劑膠帶1 之捲取方向（E、F)，而將黏著劑11壓著至電路基板21 〇 此處’參照第5圖及第3 5圖，針對本實施形態之黏 著劑膠帶1之製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上，以塗 布機2 7塗布由樹脂及導電粒子1 3混合而成之黏著劑！ ，並以乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料 。如第35圖所示，相對於基材9之1 0mm寬度配置著5 • 111 - (107) (107)200409405 個塗布機27，塗布l〇mm寬度之5條黏著劑u。被捲取 之黏著劑膠帶之原始材料，以切割機3 3切成特定寬度並 捲取至捲軸後’從兩側將側板7、7裝著於捲軸上，或者 ’捲取至附側板之捲軸上，將其和除濕材一起綑包，實施 低溫（-5 °C〜- l〇t )之管理並進行出貨。 其次’針封申請專利範圍第2 9〜3 4項記載之發明之 其他實施形態進行說明，和上述實施形態相同之部份會附 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 第3 6圖A〜C所示之第2實施形態時，黏著劑膠帶] 之基材之單面全面上塗布著寬度 W之黏著劑，利用形成 於基材之縱向的縫隙3 5將黏著劑隔離成寬度w方向上之 複數條。此第2實施形態之黏著劑膠帶1時，縫隙3 5應 在將盤3裝著於黏著裝置15後、將黏著劑膠帶1壓著至 電路基板2 1之前一瞬間形成。此時，亦可在黏著裝置！ 5 之盤裝著部附近（如第3圖之S所示）裝設工作面而在捲 出之黏著劑膠帶1之黏著劑1 1上形成縫隙3 5，亦可將在 第5圖所示之黏著劑膠帶之製造時之整修步驟中形成縫隙 者捲取至盤者，亦可在塗工步驟時之乾燥後、以捲取機 3 1捲取之前一瞬間形成縫隙者。 將第2實施形態之黏著劑膠帶丨使用於黏著裝置1 5 時’和第1實施形態相同，以縫隙3 5隔離之黏著劑會逐 條以加熱加壓頭1 9從基材9側實施壓著，而如第3 6圖A 、：B、C所示，依序逐條使用。 -112- (108) 200409405 此弟2貫施形態時，只需在以和傳統 到之基材上之黏著劑形成縫隙3 5，即可 著劑1 1，十分容易製造。 第3 7圖A〜C所示之第3實施形態 面塗布著黏著劑11(第37圖A)，基材 之寬度 W，係和上述實施形態相同之5 〃 ，使用時亦和第1實施形態相同’將其 1 5，將從盤3捲出之黏著劑膠帶1配置K ，對黏著劑膠帶1之寬度W方向之部份黏 實施加熱加壓（第3 7圖B )，降低該部 有加熱加壓之部份黏著劑會從基材剝離而 21 (第 37 圖 C )。 此時，會沿著加熱加壓頭1 9之邊線 線，實施加熱加壓部份之全部黏著劑應爲 簡易指標爲1 0 0 0泊以下）而未開始黏著 或低位狀態（簡易指標爲反應率20%以下 對應使用之黏著劑系來進行選擇。 此第3實施形態時，黏著劑1 1在使 度W當中之1條份會軟化流動化且被壓 故和上述之實施形態相同，只要利用黏著 及空盤的正轉及逆轉，即可使用複數次份 又，如上述之實施形態在黏著劑Π 需分成複數條來配設，而只需在較寬之基 布黏著劑1 1即可，故黏著劑膠帶之製造十 相同之步驟所得 得到複數條之黏 時，基材9之全 _ 9及黏著劑I〗 ^ 1 0 0 0mm -其次 裝著至黏著裝置 〉電路基板2 1上 :著劑（1條份） 份之凝聚力，只 壓著至電路基板 形成凝聚力降低 呈現軟化流動（ 劑之硬化反應、 )，加熱溫度應 用時，只有在寬 著至基板電路， 劑膠帶1之盤3 〇 多成縫隙3 5，無 材的單面全面塗 >分容易。 -113- (109) (109)200409405 第3 8圖A〜C所示之第4實施形態，係第I實施形 態之黏著劑膠帶的其他製造方法，在塗布於基材9a上之 黏著劑1 1上形成縫隙9 8後（第3 8圖A )，以使黏著劑 1 1夾於基材9a、9b之間之方式，在黏著劑1 1上貼附另 一方之基材9b (第38圖B)。其次，剝離一方及另一方 之基材9a、9b，各基材9a、9b上會以間隔1條之式配置 著黏著劑條1 1 a、1 1 b。此第4實施形態時，爲了在一方 及另一方之基材9a、9b上交互配置黏著劑條丨la、1 lb， 可從一方之基材9 a或9 b側以間隔1條之方式實施黏著劑 條1 1 a、1 1 b之加熱加壓，而將黏著劑條〗丨a、：π b以間隔 1條之方式配置於各基材9a、9b上。 申請專利範圍第2 9〜3 4項記載之發明並未受限於上 述之實施形態’只要在未背離申請專利範圍第2 9〜3 4項 記載之發明之要旨的範圍內，可實施各種變形。 例如，上述之實施形態時，亦可爲黏著劑I 1內未分 散著導電粒子1 3之絕緣性黏著劑。 上述之實施形態時，形成於基材9上之黏著劑的條數 可以爲任意條，至少爲2條以上即可。 其次，針對申請專利範圍第3 5〜4 1項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接之黏著劑膠帶 、黏著劑膠帶之製造方法、及黏著劑膠帶之壓著方法。 其次，針對申請專利範圍第3 5〜4 1項記載之發明之 -114- (110) (110)200409405 背景技術進行說明。 一般而言，液晶面板、P D P (電漿顯示面板）、E L ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 日本特開2 00 1 - 2 8400 5號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者。 此種傳統黏著劑膠帶之寬度爲1〜3 m m程度，捲取至 盤之膠帶之長度爲50m程度。其次，在將黏著劑壓著至 電路基板之四周時，會沿著電路基板之一邊拉出黏著劑膠 帶並實施黏著劑之壓著，因係針對電路基板之四周，故會 將黏著劑壓著至電路基板之四周。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積（一邊之尺寸）亦會增大，一次使用 之黏著劑的使用量亦增加。又，因爲黏著劑之用途之擴大 ，黏著劑之使用量亦增加。因此，上述之電子機器之製造 工廠之捲繞著黏著劑膠帶之盤的更換更爲頻繁，因爲盤之 更換十分麻煩，故有無法提高電子機器之生產效率之問題 〇 針對此問題，可以考慮以增加捲取至盤之黏著劑膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著劑膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著劑膠帶的壓力會升高，而可能 -115- (111) 200409405 使黏著劑從膠帶之雨邊滲出而成爲阻塞之原因。 因此，申請專利範圍第3 5〜4 1項記載之發明的 ，係在提供一種黏著劑膠帶、黏著劑膠帶之製造方法 黏著劑膠帶之壓著方法，可在未增加黏著劑膠帶之捲 情形下增加黏著劑量。 其次，參照附錄圖面，針對申請專利範圍第35 項記載之發明之實施形態進行說明，首先，參照第3 A、B、第40圖、第34圖、第5圖、第41圖，針對 專利範圍第3 5〜4 1項記載之發明之第1實施形態進 明。第3 9圖A及B係黏著劑膠帶圖，第3 9圖A係 著黏著劑膠帶之盤之斜視圖，第3 9圖B係從從黏著 觀看第39圖A之黏著劑膠帶時之平面圖，第40圖 著裝置之黏著劑壓著步驟的斜視圖。 本實施形態之黏著劑膠帶1係捲繞於盤3上者， 上配設著捲軸5、及配置於黏著劑膠帶1之兩側的側 。本實施形態時，黏著劑膠帶1之長度約爲5 0m，寬 則爲和電路基板之一邊大致相同尺寸之約1 5 0 0 m m。 黏著劑膠帶1係由基材9、及塗布於基材9上之 劑11所構成，基材9上之膠帶之寬度方向上，以等 方式配置著1條寬度爲0 · 5 m m之黏著劑1 1。 從強度、及構成向異導電材之黏著劑之剝離性而 基材9應由Ο P P (延伸聚丙烯）、聚四氟乙烯、或經 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而 不限於此。 目的 、及 數的 〜4 1 9圖 甲δ円 行說 捲繞 劑側 係黏 盤3 板7 度W 黏著 間隔 言， 過石夕 ，並 -116- (112) (112)200409405 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化，桂樹脂之混合物、或熱金屬系。 熱可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表， 又’熱硬化性樹脂系係以環氧樹脂系、壓克力系、乙烯基 酯系樹脂系、及矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 An、Ag、Pt、Ni、Cn、W、Sb、Sn、焊錫等之金屬粒子 、或碳、石墨等，亦可在前述之物及非導電性之玻璃、陶 瓷、塑膠等高分子核材等覆蓋前述導電層而形成者。此外 ，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒子、 或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金屬、 或塑膠等之高分子核材上形成導電層者，會具有因加熱加 壓或加壓而產生變形之變形性，故連接後之電極間距離會 縮小，連接時可增加和電路接觸之面積，而可提高信賴性 。尤其是，以高分子類做爲核材更佳，如焊錫因沒有融點 ，在廣泛之連接溫度下亦可控制於軟化狀態，而可得到很 容易即可對應電極之厚度及平坦性之誤差的連接構件。 其次，針對本實施形態之黏著劑膠帶1之使用方法進 行說明。將黏著劑膠帶1之盤3、及空盤1 7裝著至黏著 裝置1 5，將捲繞於盤3上之黏著劑膠帶1之前端裝設空 盤17並捲出黏著劑膠帶1(第40圖中之箭頭E)。其次 ，在電路基板2 1上配置黏著劑膠帶1，以配置於兩盤3、 1 7間之加熱加壓頭1 9從基材9側實施黏著劑膠帶1之壓 接，將1條份之黏著劑1 1壓著至黏著劑膠帶之寬度方向 -117- (113) (113)200409405 上之電路基板之一邊’只有該條份之黏著劑1 1會被捲取 至空盤17。 其次，將電路基板2 1旋轉約9 0度，使電路基板2 1 之鄰邊位於黏著劑膠帶1之寬度方向上，利用加熱加壓頭 1 9將黏著劑1 1壓著至電路基板2 1之另一邊。如此，將 電路基板2 1旋轉約9 0度並壓著黏著劑1 1，可將黏著劑 11壓著至電路基板21之四周。 上述壓著後（暫時連接），實施電路基板2 1之電極 及配線電路（電子構件）2 3之電極的定位並進行正式連 接。正式連接上，將黏著劑1 1壓著至電路基板2〗之四周 後，在黏著劑1 1上配置配線電路（或電子構件）23，必 要時’可將例如聚四氟乙烯材2 4當做緩衝材，以加熱加 壓頭1 9對電路基板2 1實施配線電路2 3之加熱加壓（參 照第4圖）。利用此方式，可連接固定電路基板21之電 極21a及配線電路23之電極23a。 如第3 4圖所示，利用本實施形態之黏著劑膠帶1之 PDP 26之連接部份，會對PDP之周圍全體實施黏著，一 次使用之黏著劑1 1之使用量會遠大於傳統之使用量。然 而，因爲黏著劑膠帶1之寬度W和電路基板21之一邊之 長度Η大致相等，即使和黏著劑膠帶1之寬度w較大之 傳統者相同之捲數，其黏著劑量亦遠多於傳統之物，故盤 之更換次數遠少於傳統之物。 此處，參照第5圖及第41圖，針對本實施形態之黏 著劑膠帶1之製造方法進行說明。 •118- (114) (114)200409405 在從捲出機25捲出之基材（separat〇r) 9上，以_ 布機2 7塗布由樹脂及導電粒子丨3混合而成之黏著劑j丨 ，並以乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料 。塗布機2 7會左右移動，以等間隔在基材9上塗布條狀 黏著劑。被捲取之黏著劑膠帶之原始材料，以切割機3 3 切成特定寬度並捲取至捲軸後，從兩側將側板7、7裝著 於捲軸上，或者，捲取至附側板之捲軸上，將其和除濕材 一起綑包，實施低溫（-5 °C〜-1 0 °C )之管理並進行出貨 〇 其次’針對申請專利範圍第3 5〜4 1項記載之發明之 其他實施形態進行說明，和上述實施形態相同之部份會附 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 第4 1圖所示之第2實施形態時，黏著裝置1 5上有2 處裝著至黏著劑膠帶1，以互相垂直之方式裝設一方之黏 著劑膠帶1及另一方之黏著劑膠帶1。其次，一方之黏著 劑膠帶1將黏著劑1 1壓著至電路基板2 1之相對縱邊N 上（第1步驟），另一方之黏著劑膠帶1則將黏著劑1 1 壓著至相對橫邊Μ上（第2步驟），2個步驟即可將黏著 劑壓著至電路基板21之四周。此第2實施形態時，在第 1步驟及第2步驟之間無需旋轉電路基板2 1之方向，可 將第1步驟中載置之電路基板21直接移至第2步驟，故 可實現黏著劑之自動壓著，此外，亦可提高作業效率。此 時，亦可將電路基板2 1載置於搬運帶而實現自動搬運。 -119· (115) (115)200409405 第42圖A〜C所示之第3實施形態時，基材之單面 全面上會塗布寬度W之黏著劑，利用形成於基材之寬度 W方向上之縫隙3 5，寬度W方向上將黏著劑分隔成複數 條。此第3實施形態之黏著劑膠帶1時，縫隙3 5應形成 於將盤3裝著於黏著裝置1 5後、將黏著劑膠帶1壓著至 電路基板2 1之前一瞬間。此時，亦可在黏著裝置1 5之盤 裝著部附近（如第40圖之S所示）裝設工作面而在捲出 之黏著劑膠帶1之黏著劑1 1上形成縫隙3 5，亦可將在第 5圖所示之黏著劑膠帶之製造時之整修步驟中形成縫隙者 捲取至盤者，亦可在塗工步驟時之乾燥後、以捲取機3 1 捲取之前一瞬間形成縫隙者。又，無論何種實施形態，工 作面亦可爲在黏著劑板1之寬度W方向往返移動者。 又，將第3實施形態之黏著劑膠帶1使用於黏著裝置 1 5時，和第1實施形態相同，以縫隙3 5隔離之黏著劑會 逐條以加熱加壓頭從基材9側實施壓著，而從前端側依序 逐條使用。 此第3實施形態時，只需在以和傳統相同之步驟所得 到之基材上之黏著劑形成縫隙3 5，即可得到配設於寬度 方向之複數條黏著劑11，十分容易製造。 第43圖A〜C所示之第4實施形態時，係在基材9 之單面全面塗布黏著劑11(第43圖A)，基材9及黏著 劑1 1之寬度W和上述貫施形恶相同，係和電路基板之一* 邊長度大致相同之尺寸。其次’使用時係以和第1實施形 態相同之方式裝著，對黏著劑膠帶1之寬度W方向之部 -120- (116) (116)200409405 份黏著劑（1條份）實施加熱加壓（第4 3圖B )，降低該 部份之凝聚力，只有實施加熱加壓之部份的黏著劑會從基 材分離並壓著至電路基板21 (第43圖C)。 此時，會沿著加熱加壓頭1 9之邊線形成凝聚力降低 線，加熱加壓部份之全部黏著劑應爲呈現軟化流動（簡易 指標爲1 〇 〇 〇泊以下）而未開始黏著劑之硬化反應、或低 位狀態（簡易指標爲反應率20%以下），加熱溫度應對應 使用之黏著劑系來進行選擇。 此第4實施形態時，黏著劑1 1在使用時，會逐條使 寬度W方向上之1條份軟化流動化並壓著至基板電路。 又，如上述之實施形態在黏著劑1 1形成縫隙3 5，無 需分成複數條來配設，而只需在較寬之基材的單面全面塗 布黏著劑1 1即可，故黏著劑膠帶之製造十分容易。 第4 4圖A〜C所示之第5實施形態，係第1實施形 態之黏著劑膠帶1之其他製造方法，在塗布於基材9 a上 之黏著劑1 1上形成縫隙9 8後（第4 4圖A )，以使黏著 劑1 1夾於基材9a、9b之間之方式，在黏著劑〗1上貼附 另一方之基材9b (第44圖B)。其次，剝離一方及另一 方之基材9a、9b，各基材9a、9b上會以間隔1條之方式 配置著黏著劑條1 1 a、1 1 b。此第5實施形態時，爲了在 一方及另一方之基材 9a、9b上交互配置黏著劑條 1 la、 1 1 b，亦可從一方之基材9 a或9 b側以間隔1條之方式實 施黏著劑條1 1 a、1 lb之加熱加壓，而將黏著劑條〗丨a、 1 lb依序貼附至各基材9a、9b。 -121 - (117) (117)200409405 申請專利範圍第3 5〜4 1項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第3 5〜4 1項 記載之發明之要旨的範圍內，可實施各種變形。 例如，上述之實施形態時，亦可爲黏著劑1 1內未分 散著導電粒子1 3之絕緣性黏著劑。 其次，針對申請專利範圍第4 2〜4 6項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接之黏著劑膠帶 盒、及利用黏著劑膠帶盒之黏著劑壓著方法。 其次，針對申請專利範圍第4 2〜4 6項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者。 此種傳統黏著劑膠帶之寬度爲1〜3 mm程度，捲取至 盤之膠帶之長度爲50m程度。其次，在將黏著劑壓著至 電路基板之四周時，會沿著電路基板之一邊拉出黏著劑膠 帶並實施黏著劑之壓著，因係針對電路基板之四周，故會 將黏著劑壓著至電路基板之四周。 然而’近年來’隨者PDP等之面板畫面之大型化， -122- (118) (118)200409405 電路基板之黏著面積（一邊之尺寸）亦會增大，一次使用 之黏著劑的使用量亦增加。又，因爲黏著劑之用途之擴大 ，黏著劑之使用量亦增加。因此，上述之電子機器之製造 工廠之捲繞著黏著劑膠帶之盤的更換更爲頻繁’因爲盤之 更換十分麻煩，故有無法提高電子機器之生產效率之問題 〇 針對此問題，可以考慮以增加捲取至盤之黏著劑膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著劑膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著劑膠帶的壓力會升高’而可能 使黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 因此，申請專利範圍第42〜46項記載之發明的目的 ，係在提供一種黏著劑膠帶盒、及利用黏著劑膠帶盒之黏 著劑壓著方法，可在未增加黏著劑膠帶之捲數的情形下增 加黏著劑量，且盤之更換更爲簡易。 其次，參照添附圖面，針對申請專利範圍第42〜46 項記載之發明之實施形態進行說明，首先，參照第45圖 A、B、第46圖、第47圖、第4圖、第34圖、及第48 圖，針對申請專利範圍第42〜46項記載之發明之第1實 施形態進行說明。爲了說明上之方便，針對黏著劑膠帶配 置2條黏著劑時進行說明，然而，亦可形成複數條。第 4 5圖A及B係申請專利範圍第4 2〜4 6項記載之發明之第 1實施形態之黏著劑膠帶盒圖，第4 5圖A係黏著劑膠帶 -123- (119) (119)200409405 盒之斜視圖，第4 5圖B係第4 5圖A之A - A切剖面圖， 第4 6圖係第4 5圖A及B所示之膠帶盒之盤裝設狀態的 剖面圖，第4 7圖係黏著裝置之黏著劑壓著步驟的正面圖 ，第4 8圖係黏著劑膠帶盒之製造方法的步驟圖。 本實施形態之黏著劑膠帶盒1 00之主要構成係一方之 盤3、另一方之盤17、以及收容前述盤之殼體99，一方 之盤3上捲繞著黏著劑膠帶1，黏著劑膠帶1之另一端9 a 則固定於另一方之盤1 7。 殼體9 9之一側會形成開口 1 1，可從此開口 1 1拉出 黏著劑膠帶1。又，開口 1 1之兩側則配設著用以導引黏 著劑膠帶1之移動的導引件3 1、3 1。 殼體99係由半殻體99a、99b嵌合而成，配設於黏著 裝置27 (後述）上之滑軸17 (參照第46圖）嵌插於一方 及另一方之盤3、5上，而嵌合於各盤3、5。 此處，參照第46圖針對各盤3、5、及各盤3、5及 殼體99之嵌合進行說明。各盤3、5之內緣側會形成可嵌 合黏著裝置2 7之滑軸1 7的嵌合條1 9，而外圍側則會形 成以可旋轉之方式嵌合於殼體99之突部7c的嵌合溝21 〇 如第45圖B所示，黏著劑膠帶1之基材9之單面上 ’在寬度方向上會塗布著2條並排之黏著劑11a、lib。2 條黏著劑1 1 a、1 1 b間會有間隔。 本實施形態時，黏著劑膠帶1之長度約爲5 0 m，寬度 W則約爲4mm。各條黏著劑1 la、1 lb之寬度約爲1 .2mm -124- (120) 200409405 從強度、及構成向異導電材之黏著劑之剝離 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、 處理之P E T (聚對苯二甲酸乙二酯）等所構成， 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金 可塑丨生樹脂系係以本乙;烯樹脂系及聚酯樹脂系爲 ，熱硬化性樹脂系係以環氧樹脂系、壓克力系、 系樹脂系、及矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之 、或碳、石墨等，亦可在前述之物及非導電性之 瓷、塑膠等高分子核材等覆蓋前述導電層等來形 ’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆 或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔 或塑膠等之高分子核材上形成導電層者，會具有 壓或加壓而產生變形之變形性，故連接後之電極 縮小，連接時可增加和電路接觸之面積，而可提 。尤其是，以高分子類做爲核材更佳，焊如焊錫 點，在廣泛之連接溫度下亦可控制於軟化狀態， 很容易即可對應電極之厚度及平坦性之誤差的連 其次，針對本實施形態之黏著劑膠帶盒100 法進行說明。如第47圖所示，將黏著劑膠帶盒 性而言， 或經過矽 然而，並 樹脂、或 屬系。熱 代表，又 乙烯基酯 13係如 金屬粒子 玻璃、陶 成。此外 膜粒子、 融金屬、 因加熱加 間距離會 高信賴性 因沒有融 而可得到 接構件。 之使用方 100裝著 -125- (121) (121)200409405 至黏著裝置27。黏著裝置27以具有間隔之方式配設著盒 用之滑軸1 7、1 7 (參照第4 6圖），使滑軸1 7、1 7卡合 於黏著劑膠帶盒1 0 0之各盤3、5。因此，黏著劑膠帶盒 1 00之裝著只需單觸即可完成，而無需實施傳統上將捲繞 於盤之黏著劑膠帶1之另一端9a裝設至空盤之作業等。 其次，從黏著劑膠帶盒1 00拉出黏著劑膠帶1，穿過 黏著裝置27之導引件31、31。 其次，驅動黏著裝置27之滑軸17捲出黏著劑膠帶1 (第47圖之箭頭E方向），將黏著劑膠帶1配置於電路 基板2 1上，以加熱加壓頭1 9從基材9側實施黏著劑膠帶 1之壓接，寬度方向之一側上的1條份黏著劑1 1 a被壓著 至電路基板2 1之一邊，殘餘之1條黏著劑1 1 b及基材9 會被捲取至另一方之盤17。如此，可將黏著劑lla壓著 至電路基板21之四周。 其次，在捲繞於一方之盤3之黏著劑膠帶1全部捲出 後，將黏著劑膠帶盒100拆下並以反向裝著，重複上述之 步驟。黏著劑膠帶上形成2條以上之黏著劑時，可改變寬 度方向之位置依序或以間隔方式實施壓著。 上述壓著後（暫時連接），實施電路基板21之電極 3 3 a及配線電路（電子構件）3 7之電極3 7 a的定位並進行 正式連接。正式連接上，在將黏著劑1 1 a壓著至電路基板 2 1之四周後，在黏著劑1 1 a上配置配線電路（或電子構 件）3 7，必要時，可將例如聚四氟乙烯材3 9當做緩衝材 ，以加熱加壓頭1 9對電路基板2 1實施配線電路2 3之加 -126- (122) (122)200409405 熱加壓（參照第4圖）。利用此方式，可連接固定電路基 板2 1之電極3 3 a及配線電路2 3之電極3 7 a。 如第3 4圖所示，利用本實施形態之黏著劑膠帶盒 1 〇 〇實施黏著之P D P 2 6之連接部份，在本實施形態中係 會黏著於PDP 26之周圍全體，一次使用之黏著劑1 1的使 用量會遠大於傳統上之使用量。然而，因爲黏著劑膠帶1 之寬度W方向上配置著2條黏著劑；i丨a、η b，即使爲和 傳統相同之捲數，其黏著劑量可爲傳統之2倍，故可減少 盒之更換次數。 又’黏著劑膠帶1係採用盒1之型式，故更換、處理 、及裝著都十分容易，而具有良好之作業性。 此處，參照第48圖，針對本實施形態之黏著劑膠帶 盒1 〇 〇之製造方法進行說明。 在從捲出機25捲出之基材（separator) 23上，以塗 布機2 8塗布由樹脂及導電性粒子3 〇混合而成之黏著劑 1 1，並以乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材 料。塗布機28會在基材9上塗布多數條黏著劑。被捲取 之黏著劑膠帶之原始材料，整修步驟時，以切割機3 3切 成特定寬度（2條黏著劑條之寬度）並捲取至盤3後，以 夾於半殼體99a、99b之間的方式嵌合盤3及空盤5，製 成黏著劑膠帶盒100。 將黏著劑膠帶盒1 〇 〇和除濕材一起綑包，實施低溫 (-5 °C〜· 1 (ΓC )之管理並進行出貨。 其次，針對申請專利範圍第42〜46項記載之發明之 -127- (123) (123)200409405 其他實施形態進行說明，以下說明之實施形態中，和上述 實施形態相同之部份會附與相同符號並省略該部份之詳細 說明，以下之說明係以和上述實施形態不同之點爲主。 第4 9圖所示之第2實施形態時，係一次即將黏著劑 11壓著至電路基板21之一邊全體者，黏著裝置27上配 設著可從黏著劑膠帶盒1 00拉出很長之黏著劑膠帶1的導 引件1 0 1。此第2貫施形態時，因係一次即將黏著劑壓著 至電路基板2 1之一邊全體，而有良好之作業效率。 桌50圖所不之桌3貫施形態時，在基材9之單面全 面塗布寬度W之黏著劑1 1，並利用縫隙丨〇 2將黏著劑分 隔成2條。此第3實施形態之黏著劑膠帶1時，縫隙」〇2 應形成於將黏著劑膠帶盒1 0 0裝著至黏著裝置2 7後、將 黏著劑膠帶1壓著至電路基板2 1之前一瞬間。此時，亦 可在黏著裝置27之盒裝著部附近（如第47圖之S所示） 裝設工作面而在捲出之黏著劑膠帶1之黏著劑1 1上形成 縫隙1 02，亦可將第4 8圖所示之黏著劑膠帶之製造時之 整修步驟中形成縫隙者捲取至盤3者，亦可在塗工步驟乾 燥後，以捲取機3 1捲取之前一瞬間形成縫隙1 〇2者。 此第3實施形態時，只需在以和傳統相同之步驟所得 到之基材9上之黏著劑1 1形成縫隙1 02，即可得到2條 黏著劑1 1 a、1 1 b，十分容易製造。 第5 1圖A及B所示之第4實施形態時，基材9之單 面全面塗布著黏著劑1 1 (第5 1圖A )，將收容此黏著劑 膠帶1之黏著劑膠帶盒1 〇〇以和第1賨施形態相同之方式 -128 - (124) (124)200409405 裝著至黏著裝置2 7，對黏著劑膠帶1之寬度W方向之部 份黏著劑11 ( 1條份）實施加熱加壓，降低該部份之凝聚 力，只有加熱加壓之部份黏著劑1 1 a會從基材9剝離而壓 著至電路基板21(第51圖B)。 此時，會沿著加熱加壓頭1 9之周圍形成凝聚力降低 線1 03 (第5 1圖A )，實施加熱加壓部份之全部黏著劑 應爲呈現軟化流動（簡易指標爲1 000泊以下）而未開始 黏著劑之硬化反應、或低位狀態（簡易指標爲反應率20% 以下），加熱溫度應對應使用之黏著劑系來進行選擇。 此第4實施形態時，黏著劑1 1在使用時，只有寬度 W方向之1條份2 5 a會軟化流動化而被壓著至基板電路。 其次，針對申請專利範圍第47〜49項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板同 間之黏著固定及兩者之電極間之電性連接的黏著材膠帶， 尤其是，和捲成盤狀之黏著材膠帶相關。 其次，針對申請專利範圍第47〜49項記載之發明之 背景技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 -129- (125) (125)200409405 此種傳統黏著材膠帶之寬度爲1〜3 m m程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新捲取盤及新黏著材盤裝著於 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材盤的更換更 爲頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電 子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率’然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 -130· (126) (126)200409405 既存之黏著裝置。 因此，申請專利範圍第4 7〜4 9項記載之發明的目的 ，係在提供一種黏著材膠帶，可使黏著材盤之更換較爲簡 單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第4 7〜4 9 項記載之發明之貫施形態進行說明。 參照第52圖A、B、第3圖、第4圖、第29圖、及 第5圖，針對申請專利範圍第47〜49項記載之發明之第 1實施形態進行說明。第5 2圖A及B係本實施形態之黏 著材膠帶之連接圖，第52圖A係黏著材盤間之連接的斜 視圖，第5 2圖B係第5 2圖A之連接部份的剖面圖。 黏者材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 Ί。 黏者材膠帶1係由基材9、及塗布於基材9之一側面 之黏者劑1 1所構成。 基材9·具有支持層9b、及從兩側夾住前述支持層9b 之熱熔融劑層（熱金屬層）9a，構成熱熔融劑層9a之熱 熔融劑（熱金屬）係採用熱可塑性樹脂之聚乙烯、S B S ( 本乙；I# 丁二烯苯乙烯嵌段共聚物）、耐綸等，支持層9b 則係使用OPP (延伸聚丙烯）、聚四氟乙烯、或PET (聚 對苯二甲酸乙二酯）等之塑膠、玻璃纖維、芳香族聚醯胺 纖維、或碳纖維等之強化纖維。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 -131 - (127) (127)200409405 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系 係以本乙細樹曰系及聚醋樹脂系爲代表，又、熱硬化性樹 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表 〇 黏著劑1 1內亦可分散著導電粒子1 3。導電粒子！ 3 係如 Au、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬 粒子、或碳、石墨等，亦可在前述之物及/或非導電性之 玻璃、陶瓷、塑膠等高分子核材等覆蓋前述之導電層而形 成者。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣 覆膜粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱 熔融金屬、或塑膠等之高分子核材上形成導電層者，會具 有因加熱加壓或加壓而產生變形之變形性，故連接後之電 極間距離會縮小，連接時可增加和電路接觸之面積，而可 提高信賴性。尤其是，以高分子類做爲核材更佳，如焊錫 因沒有融點，在廣泛之連接溫度下亦可控制於軟化狀態， 而可得到很容易即可對應電極之厚度及平坦性之誤差的連 接構件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第3圖所示，將黏著材膠帶1之盤3 a、及捲取 盤17裝著至黏著裝置15，將捲繞於盤3a上之黏著材膠 帶1之前端經由導引銷22裝設至捲取盤7 ’並捲出黏著 材膠帶1(第3圖中之箭頭E)。其次’將黏著材膠帶1 配置於電路基板2 1上，以配置於兩盤3 a、1 7間之加熱加 壓頭1 9從基材9側實施黏著材膠帶1之壓接’將黏著劑 -132- (128) (128)200409405 1 1壓著至電路基板2 1。其後，將基材9捲取至捲取盤1 7 〇 其次，如第4圖所示，在壓著至電路基板21上之黏 著劑1 1上配置配線電路（或電子構件）2 3，將聚四氟乙 烯材24當做緩衝材，以加熱加壓頭丨9對電路基板2 1實 施配線電路2 3之加熱加壓。利用此方式，可連接電路基 板2 1之電極2 1 a及配線電路2 3之電極2 3 a。 如第29圖之利用本實施形態之黏著材膠帶1之PDP 26之連接部份所示，黏著劑1 1會壓著至PDP 26之周圍 全體，一次使用之黏著劑1 1的使用量會明顯大於傳統上 之使用量。因此，捲繞於盤3 a上之黏著材膠帶1之使用 量亦會變多，因爲捲繞於盤3 a上之黏著材膠帶1會在相 對較短之時間內被捲取至捲取盤1 7，而露出捲繞於盤3 a 上之黏著材膠帶1之結束標記2 8 (參照第5 2圖A )。 如第52圖A所示，在盤3a之黏著材膠帶1露出結束 標記2 8時，爲了將盤3 a更換成新黏著材盤3，連接盤3 a 之黏著材膠帶（一方之黏著材膠帶）1之終端部3 0、及捲 繞於新黏著材盤3上之黏著材膠帶（另一方之黏著材膠帶 )1之始端部3 2。 此黏著材膠帶1之連接上，如第5 2圖B所示，針對 黏著材盤3a之黏著材膠帶1之終端部30、及新黏著材盤 3之黏著材膠帶1之始端部3 2，使始端部3 2之黏著劑1 1 面重疊於終端部30之基材9之熱熔融劑層9a上，並將此 部份置於工作台1〇4上。其次，以黏著裝置15之加熱加 -133- (129) (129)200409405 壓頭1 9實施重疊部份之加熱，使熱熔融劑層9 a溶融後， 利用冷卻來使熱熔融劑固化，實施終端部3 0及始端部3 2 之連接。利用此方式，可實施捲繞於已使用之盤3 a上之 黏著材膠帶1、及捲繞於新盤3上之黏著材膠帶1之連接 〇 其次，將已使用之盤3 a及新盤3互相對換，將新盤 3裝著至黏著裝置15。因此，無需實施將新黏著材膠帶！ 裝著至捲取盤1 7之作業。又，因爲捲取盤1 7係只捲取基 材9，故可捲取數個黏著材盤份，減少捲取盤1 7之更換 次數，而有良好之作業效率。 此處，參照第5圖，針對本實施形態之黏著材膠帶！ 之製造方法進行說明。 在從捲出機25捲出之基材（separator)上，以塗布 機2 7塗布由樹脂及導電粒子1 3混合而成之黏著劑1 1， 並以乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料。 被捲取之黏著材膠帶1之原始材料，以切割機3 3切成特 定寬度並捲取至捲軸後，從兩側將側板裝著至捲軸，將其 和除濕材一起綑包’實施低溫（-5 °C〜-1 0 °C )之管理並 進行出貨。 其次’針對申請專利範圍第4 7〜4 9項記載之發明之 其他實施形態進行說明，以下說明之實施形態中，和上述 實施形態相同之部份會附與相同符號並省略該部份之詳細 說明’以下之說明係以和上述實施形態不同之點爲主。 第5 3圖所示之第2實施形態時，黏著材膠帶1之基 -134- (130) 200409405 材9上，熱熔融劑層9 a會夾於支持層9 b之間。此 第3圖所示，爲了實施黏著材膠帶1間之連接，在 黏著材膠帶1之終端部3 0及另一方之黏著材膠帶 端部3 2互相抵接之位置上，以黏著裝置I 5之加熱 1 9實施熱熔融劑層9a之加熱。實施加熱會使熱熔 熱熔融劑層9 a滲出，利用冷卻來使熱熔融劑固化 黏著材膠帶1間之連接。如此，因熱熔融劑層9 a 支持層9 b之間，而可防止因爲濕氣之吸濕或灰塵 著而降低熱熔融劑層9a之黏著強度。 申請專利範圍第4 7〜4 9項記載之發明並未受 述之實施形態，只要在未背離申請專利範圍第4 7〜 記載之發明之要旨的範圍內，可實施各種變形。 弟1貫施形態時’基材9係由支持層9 b、及 夾住支持層9 b之熱熔融劑層9 a之3層所構成，然 不限於此，亦可以爲4層以上。 本實施形態時，連接部份之加熱壓著係利用黏 1 5之加熱加壓頭1 9，然而，亦可採用其他加熱器 加熱加壓頭1 9，對連接部份進行加熱，實施黏著材 間之連接。 其次，針對申請專利範圍第5 0〜5 1項記載之 行說明。 這些發明係關於電子構件及電路基板、或電路 之黏著固定及兩者之電極間之電性連接的黏著材膠 ’係關於在將半導體元件（晶片）黏著 固定至引 時，如 一方之 1之始 加壓頭 融劑從 ，實施 係夾於 等之附 限於上 ^ 49項 從兩側 而，並 著裝置 來取代 膠帶1 發明進 基板間 帶。又 線框架 -135- (131) (131)200409405 之固定用支持基板或引線框架之晶片、或半導體元件載置 用支持基板之半導體裝置上所使用之黏著材膠帶，尤其是 ，和捲成盤狀之黏著材膠帶之連接方法相關。 其次，針對申請專利範圍第5 0〜5 1項記載之發明之 背景技術進行說明。 一般而言’液晶面板、P D P (電漿顯示面板）、E L ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 又’黏著材膠帶亦被應用於引線框架之引線固定膠帶 、LOC膠帶、晶粒結著膠帶、微BGA CSP等之黏著膜 等，其目的則在提高半導體裝置全體之生產性及信賴性。 曰本特開200 1 -2 8400 5號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統之黏著材膠帶，爲了避免黏著劑固著於基材 上、或較容易剝離，會在基材之兩面實施矽處理。 將黏著材膠帶裝著於黏著裝置時，將黏著材膠帶之盤 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上，拉出黏 著材膠帶之始端部並裝設至捲取盤。其次，從自黏著材盤 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下用完之盤 、及捲取基材之捲取盤，將新黏著材盤裝著至黏著裝置， 並將黏著材膠帶之始端裝設於捲取盤上。 -136- (132) (132)200409405 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材盤的更換更 爲頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電 子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因。 此外，黏著材膠帶之捲數若增加，則盤之直徑尺寸亦 會增大，可能因無法裝著於既存之黏著裝置上而無法使用 既存之黏著裝置。 因此，申請專利範圍第5 0〜5 1項記載之發明的目的 ’係提供一種黏著材膠帶之連接方法，可使黏著材盤之更 換較爲簡單，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第5 0〜5 1 項記載之發明之實施形態進行說明。首先，參照第5 4圖 A〜C、第55圖、第56圖、第4圖、及第29圖，針對申 請專利範圍第5 0〜5 1項記載之發明之第1實施形態進行 δ兌明。弟5 4圖A〜C係弟5 5圖之連接部份之連接步驟的 剖面圖，第5 4圖A係放電前之黏著材膠帶之狀態，第5 4 -137- (133) (133)200409405 圖B係放電後之黏著材膠帶之狀態，第5 4圖C係連接部 份之加熱壓著圖。第5 5圖係黏著材膠帶連接方法之黏著 材盤間之連接的斜視圖，第5 6圖係黏著裝置之黏著劑壓 著步驟的槪略圖。 黏著材膠帶1係分別捲繞於盤3、3 a，各盤3、3 a上 配設著捲軸5、及配置於黏著材膠帶1之兩寬度側之側板 Ί。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 從強度、及黏著劑1 1之剝離性而言，基材9應採用 OPP (延伸聚丙烯）、聚四氟乙烯、及PET (聚對苯二甲 酸乙二酯）等，以脫模劑9a實施表面處理。脫膜劑係採 用烯系脫模劑、乙二醇廿八碳酸酯、棕櫚蠟、石油系蠟等 低融點蠟、低分子量氟樹脂、矽系或氟系之界面活性劑、 油、蠟、樹脂、聚酯變性矽樹脂等，一般爲矽樹脂。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系 係以苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表 〇 黏著劑1 1內亦可分散著導電粒子1 3。導電粒子j 3 係如 An、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬 粒子、或碳、石墨等，亦可在前述之物及/或非導電性之 玻璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形 •138- (134) 200409405 成。此外，亦可應用以絕緣層覆蓋前述導電粒子 膜粒子、或倂用導電粒子及絕緣粒子等。在焊錫 融金屬、或塑膠等之高分子核材上形成導電層者 因加熱加壓或加壓而產生變形之變形性，故連接 間距離會縮小，連接時可增加和電路接觸之面積 高信賴性。尤其是，以高分子類做爲核材更佳， 沒有融點，在廣泛之連接溫度下亦可控制於軟化 可得到很容易即可對應電極之厚度及平坦性之誤 構件。 其次，針對本實施形態之黏著材膠帶之使用 說明。如第5 6圖所示，將黏著材膠帶1之盤3 a 盤17裝著至黏著裝置15，將捲繞於盤3a上之 帶1之前端經由導引銷22裝設至捲取盤17，並 材膠帶1(第56圖中之箭頭E)。其次，將黏著 配置於電路基板2 1上，利用配置於兩盤3、1 7 加壓頭1 9從基材9側實施黏著材膠帶1之壓接 劑1 1壓著至電路基板21。其後，將基材9捲取 17° 其次，如第4圖所示，在壓著至電路基板2 著劑1 1上配置配線電路（或電子構件）2 3，將 烯材24當做緩衝材，以加熱加壓頭1 9對電路基 施配線電路2 3之加熱加壓。利用此方式，可連 板21之電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶Resin adhesive 64 is, for example, epoxy resin, cyanate resin, dimaleimide resin, phenol resin, urea resin, melamine resin, alkyd resin, acrylic resin, unsaturated polyester resin, phthalic acid Diallyl resin, May resin, m-xylene resin, xylene resin, furan resin, polyurethane resin, ketone resin, triallylamine cyanide resin, and the like. The connection of the adhesive tape 1 is shown in FIG. 20B, and the terminal portion 30 of the adhesive tape 1 of the adhesive plate 3 a and the starting end portion 3 2 of the adhesive tape 1 of the new adhesive plate 3 are used, so that The adhesive 1 surface of the start portion 32 is superposed on the 9 surface of the base material of the end portion 30. Next, a paste-like resin-made adhesive 64 was applied to the superimposed -87- (83) (83) 200409405 portion using a filling machine 65 combined with the adhesive device 15. Next, as shown in FIG. 20C, when the resin adhesive 64 is a thermosetting resin, it is cured by heating by the heater 66 combined with the adhesive device 15 and connected to the terminal portion 3 of the adhesive tape. 0, and the first end portion 3 of the adhesive material tape 1 of the new adhesive material plate 3. In this way, the connection of the adhesive tape 1 wound on the used disk 3a and the adhesive tape 1 wound on the new disk 3 can be performed. In this way, the terminal 邰 30 of the fully rolled adhesive tape 1 and the start end 32 of the newly installed adhesive tape 1 are fixed with the resin adhesive 64, so the connection is very simple. Next, the used disk 3 a and the new disk 3 are exchanged with each other, and the new disk 3 is mounted on the adhesive device 15. Therefore, it is not necessary to perform the operation of mounting the new adhesive tape 1 on the take-up reel 17. Directly use the take-up tray 17 of (a), replace the used adhesive tape 1 with the remaining amount of adhesive tape 1 to be reduced to a new adhesive tape, and implement a new adhesive tape and take-up tray 17 When connecting, the end mark 2 of the adhesive tape 1 of the used disk 3 a is exposed from the vicinity of the end mark 2 8 of the adhesive tape 1 when exposed, so that the adhesive tape remaining on the 7 side of the take-up disk 17 The terminal end 30 and the start end 32 of the adhesive tape 1 of the new adhesive tray 3 overlap. Next, a paste-like resin adhesive 64 is applied to the overlapping portion of the two, and heating, ultraviolet irradiation, etc. are performed according to the type of resin adhesive used to exert the adhesive force, and the terminal portion 30 and the new adhesive material are implemented. Connection of the starting end portion 32 of the adhesive tape 1 of the disc 3. Because the take-up tray 17 can only take up the substrate 9, several adhesive material trays can be taken up, the number of replacements of the take-up tray 17 can be reduced, and the operation efficiency is good. -88- (84) (84) 200409405 Here, “Dad Photo 5” illustrates the manufacturing method of the adhesive tape according to the present embodiment. On the substrate (separator) unwound from the unwinder 25, a coating machine 2 7 is used to coat an adhesive n made of a mixture of resin and conductive particles 丨 3.  After drying in a drying furnace 29, the original material is taken up by a winder 3 丨. The original material of the rolled adhesive tape is cut into a specific width by a cutting machine 3 and rolled onto the reel, and the side plates 7, 7 are mounted on the reel from both sides, or rolled to the reel with the side plate Then, it is packed with dehumidifying material, and it is managed at low temperature (-5 ° C ~ -10 ° C) and shipped. The inventions described in items 19 to 21 of the scope of patent application are not limited to the above-mentioned embodiments, as long as they do not depart from the spirit of the inventions described in items 19 to 21 of the scope of patent application, various modifications can be implemented. In the present embodiment, the resin adhesive 64 is a thermosetting resin as an example. However, a photocurable resin may be used in place of the thermosetting resin, and the hardening resin may be cured by irradiation with light such as ultraviolet rays to implement an adhesive tape. 1 connection. In this case, as the photocurable resin, a composition containing an acrylic or methacrylic group-containing resin as a photopolymerization starter, or an aromatic diazonium salt, diallyl iodohydrogen salt, sulfonium salt, or the like may be used. Light hardener of epoxy resin, etc. In addition, as the resin adhesive, a hot metal adhesive material mainly composed of ethylene vinyl acetate resin or polysmoky resin, such as a plate-shaped hot metal adhesive material, may be used. On the overlapping part of the adhesive tape 1, the hot metal adhesive is heated with a heater 66 to make -89- (85) (85) 200409405 melt, and then the cooling is performed to solidify the hot metal adhesive to implement the adhesive tape. 1 connection. A plurality of resin adhesives used for the connection of the adhesive tape 1 may be selected from a group consisting of a thermosetting resin, a photocurable resin, and a hot metal adhesive. In the above embodiment, the base material 9 side of the terminal portion 30 of the adhesive material tape 1 of the adhesive material plate 3 a and the adhesive agent 1 1 surface of the starting end portion 3 2 of the adhesive material tape 1 of the new adhesive material plate 3 are made to each other. Overlap and apply a thermosetting resin made of a resin adhesive to make the connection. However, it is also possible to reversely fold the terminal portion 30 of the adhesive tape 1 of the adhesive plate 3 a and overlap the adhesive 1 1 surface. After adhesion, fix it with thermosetting resin. Next, the inventions described in items 22 to 24 of the scope of patent application will be described. These inventions relate to adhesive tapes for electronic components and circuit substrates, or the adhesion and fixation between circuit substrates, and the electrical connection between the electrodes of the two, and in particular, to the adhesive tape tapes and adhesive devices rolled into a disc shape . Next, the background art of the inventions described in claims 22 to 24 will be described. Generally speaking, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, bare chip packages, and circuit substrates, or the adhesion and fixation between circuit substrates, and the electricity between the two electrodes The method of sexual connection uses adhesive tape. Japanese Patent Application Laid-Open No. 2001-284005 describes a case in which an adhesive material tape on which a substrate is coated with an adhesive material is rolled into a disc shape. -90- (86) (86) 200409405 The width of this traditional adhesive tape is about 1 ~ 3mm, and the length of the tape rolled up to the disc is about 50m. When the adhesive tape is mounted on the adhesive device, the adhesive tape tray on which the adhesive tape is wound is mounted on the adhesive device, and the starting end of the adhesive tape is pulled out and mounted on the take-up tray. Next, the base material side of the adhesive material tape rolled out from the adhesive material tape tray is pressed to the circuit board by a heating and pressing head, and then the remaining substrate is taken up by a take-up disk. Second, when the adhesive tape on one of the adhesive tape trays is used up, remove the used tray and the take-up tray on which the substrate is wound, and mount the new take-up tray and the new adhesive tape tray to the adhesive device. The beginning of the adhesive tape is mounted on the take-up reel. However, in recent years, with the enlargement of panel screens such as PDPs, the adhesion area of circuit substrates has also increased, and the amount of adhesive used at one time has also increased. In addition, as the use of the adhesive is expanded, the amount of the adhesive used is also increased. Therefore, the adhesive tape reels of electronic equipment manufacturing plants are changed more frequently. Because the replacement of adhesive tape reels is very troublesome, there is a problem that the production efficiency of electronic equipment cannot be improved. To solve this problem, you can consider increasing the number of adhesive tapes wound to the disk to increase the amount of adhesive per disk to reduce the frequency of disk replacement. However, because the width of the adhesive tape is narrower 1 ~ 3mm. Increasing the number of rolls may lead to loose coiling. Furthermore, if the number of rolls is increased, the pressure applied to the adhesive tape rolled into the shape of a tape increases, which may cause the adhesive to leak from both sides of the tape and become a cause of blockage. In addition, if the number of rolls of adhesive tape is increased, the diameter of the disc will also increase -91-(87) (87) 200409405, which may not be able to be mounted on the existing adhesive device and the existing adhesive device may not be installed. . Therefore, the purpose of the invention described in "Shen G 靑 Patent No. 22 ~ 24" is to provide an adhesive tape tape and an adhesive device, which can make the replacement of the adhesive Mw disk easier. Production efficiency of electronic machines. Next, referring to the drawings of the appendix, the embodiments of the inventions described in items 22 to 24 of the scope of patent application will be described. First, referring to FIGS. 22 to A, 22, 23, 4, and 5 The first embodiment of the invention described in claims 22 to 24 of the scope of patent application will be described. Fig. 2 2 A to C are diagrams of the adhesive tape tape of the first embodiment, Fig. 22 a is a perspective view of the adhesive tape tape tray, Fig. 22 B is a front view of Fig. 22 A, and Fig. 22 C Figure 22 is a plan view of the connecting tape, and Figures 2 and 3 are schematic diagrams of the adhesive pressing step of the adhesive device. As shown in FIG. 2 and FIG. 2A, the adhesive material tape tray A of this embodiment has a plurality of roll portions (hereinafter referred to as roll portions) 2, 2a of the adhesive tape, and the rolls 3, 3a of the roll portions 2, 2a. The adhesive tape 1 is wound around each. Each of the plates 3 and 3a is provided with a reel 5 and side plates 7 arranged on both width sides of the adhesive tape 1. As shown in Figs. 23 and 3, the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9. Among the plurality of roll portions 2 and 2a, the terminal portion 30 of the adhesive material tape wound on one roll portion 2 (hereinafter referred to as one adhesive material tape) 1 and the adhesive material wound on the other roll portion A connecting tape 41 for connecting the two ends of the adhesive tape (hereinafter referred to as the other adhesive tape) 1 is provided with a connecting tape 41. A connecting tape 6 7 is arranged along the inner side surface of the side plate 7 of the tray 3 -92- (88) (88) 200409405 from the terminal portion 30 of the adhesive tape 1 on one side, and the connecting tape 6 7 is locked on the side plate 7 The upper cut portion 6 8 is connected to the other end of the adhesive tape 1 at the beginning end 3 2. In addition, the connecting portions of the adhesive tape 1 and the connecting tape 67 on one side and the other are marked with a mark 6 9 or 70 for identifying the connecting tape 6 7, and the tape detection means (light emitting section 71, light receiving section 72) When the marks 69 and 70 are detected, the portion 67 of the connecting tape is skipped without pressing the portion 67 of the connecting tape. In terms of strength and peelability of the adhesive constituting the anisotropic conductive material, the substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or silicon-treated PET (polyethylene terephthalate). ), Etc., however, it is not limited to this. The adhesive 1 1 is a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a thermal metal system. Thermoplastic resins are typified by styrene resins and polyester resins, while thermosetting resins are typified by epoxy resins, vinyl ester resins, acrylic resins, and silicone resins. Conductive particles 1 3 are dispersed in the adhesive 11. The conductive particles 1 3 are metal particles such as Αυ, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or carbon, graphite, etc., and can also be used in the foregoing and non-conductive glass, ceramics, and plastics. The polymer core material is formed by covering the aforementioned conductive layer and the like. In addition, it is also possible to use insulating film particles that cover the aforementioned conductive particles with an insulating layer, or conductive particles and insulating particles for fluorene. Forming a conductive layer on a hot-melt metal such as solder or a polymer core material such as plastic will have deformability due to heat-pressing or pressing with -93- (89) (89) 200409405. The distance between the electrodes after connection will be reduced, and the area in contact with the circuit can be increased during connection, which can improve reliability. In particular, it is better to use polymers as the core material. For example, because the solder has no melting point, it can be controlled in a softened state at a wide range of connection temperatures, and it is easy to get the thickness and flatness of the electrode. Next, the method of using the adhesive tape tray A of this embodiment will be described. As shown in FIG. 23, the adhesive tape tray A and the take-up tray 17 are mounted to the adhesive device 15 and the leading end 3 of one adhesive tape 1 is mounted to the adhesive tape 1 through the guide pin 22. Take up the tray 17 and roll out the adhesive tape 1 (arrow E in Fig. 23). Next, the adhesive tape 1 is arranged on the circuit board 21, and the heating and pressing head 19 arranged between the two plates 3 and 17 is used to perform pressure bonding of the adhesive tape 1 from the substrate 9 side, and the adhesive 1 1 is pressed to the circuit board 2 1. After that, the base material 9 is wound up onto the take-up disk 17. After the above-mentioned pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 2 3 are positioned and formally connected. . For formal connection, as shown in FIG. 4, a wiring circuit (or electronic component) 2 3 is arranged on the adhesive 11 pressed onto the circuit substrate 2 1. If necessary, for example, a polytetrafluoroethylene 24 can be used as the The buffer material is heated and pressurized to the circuit board 2 1 by the pressurizing head 19. In this way, the electrode 2 1 a of the circuit board 21 and the electrode 2 3 a of the wiring circuit 2 3 can be connected. The size of the PDP using the adhesive tape 1 of this embodiment is larger than that of (90) (90) 200409405. Sometimes, the entire PDP is pressed, and the connection part will be _ more. One-time use of the adhesive 1 The usage of 1 will be much larger than traditional usage. Therefore, the amount of the adhesive tape 1 wound on the disk 3 will also increase, and the adhesive tape 1 wound on the disk 3 will be wound up to the take-up disk 17 in a relatively short period of time. When all the adhesive tapes 1 on one side are rolled out, the connecting tape 67 is separated from the cut portion 6 8 and then the other adhesive tape is rolled off. In this embodiment, since there is a connecting tape 67 for connecting the terminal portion 30 of one adhesive tape 1 and the starting end portion 32 of the other adhesive tape 1, the adhesive material on one side is provided. When all the adhesive tape 1 is unrolled, the other adhesive tape 1 will then be unrolled. Therefore, it is not necessary to perform the operation of mounting the new adhesive tape 1 on the take-up tray 17 after all the one adhesive tape 1 is rolled out, so that the production efficiency of the electronic device can be improved. As shown in FIG. 23, The adhesive device 15 includes a pair of light-emitting portions 71 and a light-receiving portion 72 for performing optical detection of the connecting tape 67. Black marks 69 and 70 are marked on both ends of the connecting tape 67 for connecting the adhesive tape 1 on one side and the adhesive tape 1 on the other side. The light emitting section 71 continuously emits laser light to the adhesive tape 1, and the light receiving section 72 receives the reflected light and transmits a detection signal to the control device 79. The light receiving unit 72 receives the reflected light 'from the marks 69 and 70 at both ends of the connecting tape 67 and transmits the detection signal to the control device 79. After receiving the detection signal, the control device 79 outputs a control signal to the motors used to drive the two disks 3 and 17 of the adhesive device 15. The motor drive -95- (91) (91) 200409405 actuator starts to output to the motor Drive pulse. Secondly, the motor rotates according to the number of pulses applied by the motor driver, so that the two plates 3, 17 are moved at a faster speed than usual, and the adhesive tape 1 is moved in the direction of the unwinding by the distance corresponding to the length of the connecting tape 6 7 . In this way, the other adhesive tape 1 will automatically roll out to the position of the heating and pressing head 19, which can be omitted to make the other adhesive tape! The initial end portion 3 2 is located at the position of the heating and pressing head 19 to roll out the connecting tape 67. In addition, since the take-up tray 17 can only take up the substrate 9, several adhesive tape tapes can be taken up and the number of replacements of the take-up tray 17 can be reduced, and the operation efficiency is good. Here, a method for manufacturing the adhesive tape tape A according to this embodiment will be described with reference to FIG. 5. On the separator 9 unwound from the unwinder 25, a coating agent 27 is used to coat an adhesive made of a mixture of resin and conductive particles, and dried in a drying oven 2 9 and then wound on a reel 3 1 roll. Take the original material. The original material of the rolled adhesive tape is cut into a specific width by a cutting machine 3 and rolled onto the reel, and the side plates 7, 7 are mounted on the reel from both sides, or rolled to the reel with the side plate It is packaged with a dehumidifier, and is managed at a low temperature (_ 5 ° C ~ -10 ° C) and shipped. Next, "Description of other embodiments of the invention described in Items 2 to 24 of the scope of patent application" In the embodiments described below, the same parts as the above embodiments will be given the same reference numerals, and the details of this part will be omitted Note that the following description is mainly based on the differences from the above embodiment. -96- (92) (92) 200409405 In the second embodiment shown in Fig. 24, since the width T of the connecting tape 67 is smaller than the width W of the adhesive tape 1 before and after, the connecting tape 67 can be identified. In addition, the light emitting unit and the light receiving unit k which are the same as those in the first embodiment are arranged at the relative positions of the adhesive device 5 and the adhesive tape therebetween. At this time, the light receiving unit receives the transmission connection tape 67 with a narrow width. Part of the laser light to identify the connecting tape 6 7. In the third embodiment shown in Figs. 25 and 5, the connecting tape 67 is formed with a plurality of holes 53 for identifying the connecting tape 67. At this time, the connection tape 61 can also be identified by the light receiving unit receiving laser light transmitted through the hole 53 of the connection tape 67. In the fourth embodiment shown in FIGS. 2 to 6, the connection between the adhesive tapes 1 is not performed by using the connecting tape 67, and when all the adhesive tapes 1 are rolled out, the other adhesive tape is rolled up. 1 Make it roll on the tray 17 to replace the adhesive tape 1. At this time, since it is not necessary to mount the new adhesive tape tape to the adhesive device, and less replacement work of the new adhesive tape tape is needed ', the production efficiency of the electronic machine can be improved. The inventions described in claims 22 to 24 of the scope of patent application are not limited to the above-mentioned embodiments. As long as they do not depart from the spirit of the inventions described in claims 22 to 24 of the scope of patent application, various modifications can be made. For example, "in the above-mentioned first and second embodiments, the number of the roll portions 2 and 2a is not limited" and may be any number. In the first to third embodiments, the connection tape 67 is optically detected. However, a magnetic tape may be added to the connection tape 67 and detected by a magnetic sensor. -97- (93) (93) 200409405 Next, the inventions described in items 25 to 28 of the scope of patent application will be explained. These inventions relate to adhesive tapes for electronic components and circuit boards, or between the circuit boards, and the electrical connection between the electrodes of the two. Further, it relates to an adhesive tape used for a semiconductor device (wafer) adhesively fixed to a lead frame for a fixing support substrate or a lead frame wafer or a semiconductor device for supporting a semiconductor element mounting substrate, and in particular, and The adhesive tape roll, the adhesive device, and the connection method of the adhesive tape rolled into a disk shape are related. Next, the background art of the inventions described in claims 25 to 28 will be described. Generally speaking, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, bare chip packages, and circuit substrates, or the adhesion and fixation between circuit substrates, and the electricity between the two electrodes The method of sexual connection uses adhesive tape. In addition, adhesive tapes have also been applied to lead frame tapes, L0C tapes, die-bonding tapes, micro-BGA CSP, and other adhesive films. Their purpose is to improve the overall productivity and reliability of semiconductor devices. Japanese Patent Laid-Open No. 200 1 -2. Gazette No. 84005 describes a case where an adhesive material tape on which an adhesive material is applied to a base material is rolled into a disc shape. The width of the conventional adhesive tape for electrode connection is 1 to 3 mm, and the length of the tape wound to the disk is about 50 m. When attaching the adhesive tape to the adhesive device, install the adhesive tape tray around which the adhesive tape is wound on the adhesive device, and pull out the -98- (94) (94) 200409405 from the beginning of the adhesive tape. Set to the reel. Next, from the base material side of the adhesive material tape rolled out from the self-adhesive material tape tray, the adhesive is pressed to the circuit board by a heating and pressing head, and then the remaining substrate is taken up by a take-up disk. Second, when the adhesive tape on one of the adhesive tape trays is used up, 'remove the used disk and the take-up coil of the substrate, and mount the new take-up tray and the new adhesive tape tray to the adhesive device. The beginning of the adhesive tape is mounted on the take-up reel. However, in recent years, with the enlargement of panel screens such as PDPs, the adhesion area of circuit substrates has also increased, and the amount of adhesive used at one time has also increased. In addition, as the use of the adhesive is expanded, the amount of the adhesive used is also increased. Therefore, the adhesive tape reels of electronic equipment manufacturing plants are changed more frequently. Because the replacement of adhesive tape reels is very troublesome, there is a problem that the production efficiency of electronic equipment cannot be improved. To solve this problem, you can consider increasing the number of adhesive tapes wound to the disk to increase the amount of adhesive per disk to reduce the frequency of disk replacement. However, because the width of the adhesive tape is narrower 1 ~ 3mm. Increasing the number of rolls may lead to loose coiling. Furthermore, if the number of rolls is increased, the pressure applied to the adhesive tape rolled into the shape of a tape increases, which may cause the adhesive to leak from both sides of the tape and become a cause of blockage. In addition, if the number of rolls of adhesive tape is increased, the diameter of the disk will also increase, and the existing adhesive device may not be used because it cannot be mounted on the existing adhesive device. Therefore, the purpose of the invention described in the scope of application for patents Nos. 25 to 28 is to provide an adhesive tape reel, an adhesive device, and a connection method. -99- (95) (95) 200409405 enables the replacement of the adhesive tape reel It is simpler and improves the production efficiency of electronic machines. Secondly, referring to the drawings of the appendix, the embodiments of the invention described in the 25th to 28th patent application scope will be described. First, refer to FIGS. 27 to A, 28, 4, 4, and 29, Fig. 5 and Fig. 5 describe the first embodiment of the invention described in items 25 to 28 of the scope of patent application. Fig. 27 is a perspective view of the adhesive tape tape plate of the first embodiment according to Fig. 27 to Fig. 27. Fig. 27 is a perspective view of the adhesive tape tape plate of the A-type adhesive tape. C is a cross-sectional view of the connection part of FIG. 27A, FIG. 28 is a schematic view of the adhesive pressing step of the adhesive device, and FIG. 29 is a perspective view of the use state of the PDP adhesive. The adhesive material tape tray A of this embodiment has a plurality of rolled portions (hereinafter referred to as rolled portions) 2, 2a of the adhesive tape 1, and the rolled portions 2, 2a have the disks 3, 3a around which the adhesive tape 1 is wound. Each of the disks 3 and 3a is provided with a reel 5 and side plates 7 disposed on both width sides of the adhesive tape 1. As shown in FIG. 28, the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9. Among the plurality of roll portions 2 and 2a, the end portion 30 of the adhesive material tape wound around one of the roll portions 2 (hereinafter referred to as one adhesive tape) 1 and the adhesion of the other roll portion 2a The starting end portion 32 of the material tape (hereinafter referred to as the other adhesive material tape) 1 is connected by the locking device 76. The locking device 7 6 is, for example, a locking pin with a slightly square cross-section, so that the terminal portion 30 of one adhesive tape 1 and the starting end 3 2 of the other adhesive tape 1 overlap each other, and the locking pin is inserted here. Overlap to connect the two. -100- (96) (96) 200409405 Next, in this embodiment, the connecting portion 7 4 is shown in FIG. 2C as shown in FIG. 2C. After the terminal portion 30 and the start portion 32 are connected with the locking device 7 6, The connecting portion 74 is folded back toward the longitudinal direction of the tape by 80 degrees, so that the adhesive tape covers the locking device 76. In terms of strength and peelability of the adhesive constituting the anisotropic conductive material, the substrate 9 should be made of 0pp (extended polypropylene), polytetrafluoroethylene, and silicon-treated PET (polyethylene terephthalate). Esters), etc., however, it is not limited to this. Adhesive 11 is a thermoplastic resin 'thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. Thermoplastic resin systems are typified by styrene resin systems and polyester resin systems, and thermosetting resin systems are typified by epoxy resin systems, acrylic resin systems, and silicone resin systems. Conductive particles 1 3 may also be dispersed in the adhesive 11. The conductive particles 1 3 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, etc., or carbon, graphite, etc., and can also be used in the foregoing and / or non-conductive glass and ceramics. Polymer core materials such as plastic and plastic are formed by covering the aforementioned conductive layer. In addition, it is also possible to apply an insulating film particle that covers the aforementioned conductive particles with an insulating layer, or a conductive particle and an insulating particle for use. Forming a conductive layer on a hot molten metal such as solder or a polymer core material such as plastic will have deformability due to heat and pressure or pressure, so the distance between electrodes after connection will be reduced. Can increase the area of contact with the circuit, and improve reliability. In particular, it is better to use polymers as the core material. For example, because the solder has no melting point, it can be controlled in a softened state at a wide range of connection temperatures, and it is easy to get the thickness and flatness of the electrode. Connection -101-(97) (97) 200409405 component. Next, a method of using the adhesive material tape reel according to this embodiment will be described. As shown in FIG. 28, the adhesive tape tray A and the take-up tray 17 are mounted to the adhesive device 15 and the leading end 3 of one of the adhesive tape tapes 2 is installed to the roll through the guide pin 22. Take the tray 17 and roll out the adhesive tape 1 (arrow E in Figure 28). Next, the adhesive tape 1 is arranged on the circuit board 21 to heat and press the head 1 9 disposed between the two plates 3 and 17 to perform the pressure bonding of the adhesive tape 1 from the substrate 9 side, and the adhesive 1 1 is pressed to the circuit board 2 1. After that, the base material 9 is taken up to a take-up tray 17. Secondly, as shown in FIG. 4, a wiring circuit (or an electronic component) 2 3 is arranged on the adhesive 11 pressed onto the circuit substrate 21, and the polytetrafluoroethylene material 24 can be used as a buffer material to be heated and pressurized. The head 19 applies heat and pressure to the circuit board 2 1 and the wiring circuit 23. In this way, the electrode 21a of the circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in the connection part of PDP 26 using the adhesive tape 1 of this embodiment in FIG. 29, the adhesive 11 is pressed against the entire periphery of the PDP 26, so the amount of the adhesive 11 used at a time is significantly larger. For traditional usage. Therefore, the amount of adhesive tape 1 will also increase, and it will be wound on the sticks 3, 3a. The adhesive tape 1 is wound up to the take-up tray 17 in a relatively short time. In this embodiment, when all the adhesive tapes 1 on one side are rolled out, the connecting portion 74 is separated from the cutout 75, and then the other adhesive tape 1 is rolled off (Fig. 27B). In this embodiment, the terminal portion 30 of the adhesive tape 1 on one side and the adhesive material adhesive on the other side are connected by the locking device 76. 102- (98) (98) 200409405 The starting end portion 32 of the belt 1 and the adhesive material on one side When all the adhesive tape 1 is unrolled, the other adhesive tape 1 will then be unrolled. Therefore, it is not necessary to perform the operation of mounting the new adhesive tape 1 to the take-up tray 17 after all the one adhesive tape 1 has been rolled out, so that the production efficiency of electronic equipment can be improved. In addition, the connecting portion 74 is covered with the adhesive tape 1 to cover the locking member 76, so the appearance is good, and at the same time, the locking member 76 of the connecting portion 74 can be prevented from contacting the adhesive tape 1.] In addition, as shown in FIG. 28, the adhesive device 15 has a thickness detection sensor used as the connection part detection sensor 47, and performs optical detection of the connection part 74, so that the heating and pressure head 19 is skipped Connection section 74. As shown in FIG. 27C, the thickness of the connecting portion 74 of the adhesive tape 1 on one side and the adhesive tape 1 on the other side is greater than the thickness of the adhesive tape 1, and the connecting portion 74 is identified by detecting different thicknesses. The thickness detection sensor 47 detects the thickness of the adhesive tape 1 at any time, and transmits a detection signal to the control device 79. After receiving the detection signal, the control device 79 outputs a control signal to the motors used to drive the two disks 3 and 17 of the adhesive device 15 and uses the motor driver to start outputting driving pulses to the motor. Secondly, the motor rotates according to the number of pulses applied by the motor driver, so that the two disks 3, 17 are rotated at a faster speed than usual, and the adhesive tape 1 is moved in the unwinding direction corresponding to the carrying direction of the connecting portion 74. A specific distance of length. In this way, the other adhesive tape 1 will move to the position of the heating and pressing head 19, so it is possible to prevent the connection portion 74 of the one and the other adhesive tape 1 from moving to the position of the heating and pressing head 19 and Issue with performing crimp action -103- (99) 200409405. In addition, to the connecting portion 41, one of the adhesive tapes 1 is automatically wound up to a take-up tray by a heating and pressing head, which is slightly troublesome. In addition, the thickness detecting sensor 47 recognizes the connecting portion 4 1 a and the rear end portion 4 1 b, avoids only the connecting portion 74, and uses an adhesive tape 1. In addition, since the take-up tray 17 can only take up the substrate 9, the adhesive tape tape portion reduces the operation efficiency of the replacement times of the take-up tray 17. Here, referring to Fig. 5, a method for manufacturing the adhesive according to this embodiment will be described. After the substrate (separator) unrolled from the unwinder 25 is spreader 2 7 coated with resin and conductive particles 1 3 is mixed in an adhesive furnace 2 9 and dried, the coiler 3 1 is used to take up the original material adhesive tape. The raw materials are cut with a cutting machine 3 3 and taken to the reel, and then the side plates 7, 7 are mounted on the reel dehumidifying material from both sides and packed together. goods. Next, other embodiments of items 25 to 28 in the scope of the patent application will be described, which are the same as the above-mentioned embodiments and have the same reference numerals and detailed descriptions of this part are omitted. The differences between the above-mentioned embodiments are mainly described below. In the second embodiment shown in FIG. 30, the adhesive tape tray A of the part 2 and 2a is not used, and it will be 1 7 if it is used with 1 to 9, so it is effective to save the front end of 7 4 Ricoh can take up several pieces, and there are 19 well-adhesive tapes to coat and dry. The part of the invention that is wound up with a fixed width is rolled up, and the part of the invention that manages and loads it is attached with a description of the adhesion with a plurality of winding parts -104- (100) (100) 200409405 material tape tray 2 C. At this time, the adhesive tape is wound on the take-up reel 17. When one end of the adhesive tape 1 is exposed at the end mark 28, in order to replace the one adhesive tape 2b with a new adhesive tape 2c, Connect the terminal end 30 of one adhesive tape 1 and the start end 32 of the other adhesive tape]. At this time ', the thickness detecting sensor 77 of the detecting means of the connecting portion is also used to detect the connecting portion 74, and the heating and pressing head 19 is avoided from the connecting portion 74. The inventions described in claims 25 to 28 of the scope of patent application are not limited to the above-mentioned embodiments, as long as they do not depart from the spirit of the inventions described in claims 25 to 28 of the scope of patent application, various modifications can be implemented. . For example, in the above-mentioned first and second embodiments, the locking device 76 used to connect the adhesive material tape 1 is not limited to the locking pin, and the method can also be elastically deformed with a slightly 3-shaped cross section. A clip is used to clamp and fix the overlapped portion of the two, or a metal sheet with a cross-section in the shape of a π-shaped cross section can be used to clamp the overlapped portion of the two, and the clamping pieces are compressed from both sides of the overlapped portion to connect the two By. The first and second embodiments use the thickness detection sensor 47 to detect the thickness of the connection portion 74 to identify the connection portion 74. However, the present invention is not limited to this, and the transmittance detection sensor may be used to identify the connection portion. 74. Or use a CCD camera to make the surface of the connection part appear on the monitoring screen and detect the connection part by comparing the density of the pixels. Figure 31A, Figure 31B, and Figure 32A to Figure C are adhesive tapes used to implement the lead frame fixing support substrate, the semiconductor element mounting support substrate, or the lead frame wafer and semiconductor element connection. Among them, -105- (101) (101) 200409405 is an example of a LOC (LeadonChip) structure for fixing and fixing a semiconductor element to a lead frame fixing support substrate and a lead frame. Both sides of the support film 78 such as polyimide film with a surface treatment of 50 / im thickness are made by using an adhesive layer 80 having a polyaldimine-based adhesive layer with a thickness of 25 // m on both sides. With the adhesive tape of the structure shown in FIG. A, a semiconductor device having the LOC structure shown in FIG. 31 can be obtained. The adhesive tape shown in Fig. 31A is punched with a die 8 8 (male (convex) 9 and female (concave) 9 6)) of the adhesive device shown in Figs. 32A to 32C. Into an elongated shape, for example, at a thickness of 0. A 2 mm m lead frame made of iron-nickel alloy was pressed at 400 ° C, a pressure of 3 MPa, and a pressure of 3 seconds to form an interval of 0.2 mm.  Inner leads with a width of 2 mm are made into a lead frame with an adhesive film for semiconductors. Next, in other steps, a temperature of 350 ° C, a pressure of 3 MPa, and a pressure of 3 seconds are applied to press the semiconductor element to the adhesive layer of the lead frame with the semiconductor adhesive film attached thereto, and thereafter, gold is applied. Wire bonding of the lead frame and the semiconductor element is performed, and sealing is performed by continuous molding using a sealing material such as an epoxy molding material to obtain a semiconductor device shown in FIG. 31B. In FIGS. 31A and B, 81 is a semiconductor adhesive film obtained by die-cutting with an adhesive tape, 82 is a semiconductor device, 83 is a lead frame, 84 is a sealing material, 85 is a welding wire, and 86 is a bus bar. Figure 32, A, B, and C are adhesive devices. In Figure 32, Figures A and B, 8 and 7 series die-cutting dies, 8 and 8 lead frame handling sections, and 6 1 series of adhesive tape die-cutting and attaching sections, 90 It is a heater part, 9 1 type adhesive material tape tray (adhesive material tape roll-out part) '92 type adhesive material tape (adhesive film for semiconductors), and 93 type adhesive material tape roll out. In Fig. 32C, 94 -106 · (102) (102) 200409405 series adhesive tape (adhesive film for semiconductor) '9 5 series male mold (convex part), 9 6 series female mold (concave part), 9 7 series film pressure plate. The adhesive tape 9 2 is continuously rolled out from the adhesive tape tray (adhesive tape roll-out section) 91, and is die-cut into an elongated shape and adhered to the lead portion of the lead frame , And regard it as a lead frame with an adhesive film for semiconductors, and carry it out from the lead frame conveyance part. The die-cut adhesive tape is carried out from the adhesive tape take-up roller 93. In the same manner as described above, the semiconductor element is connected to the supporting substrate for mounting a semiconductor element using an adhesive tape. In addition, the bonding of the lead frame wafer and the semiconductor element was performed in the same manner. Adhesive tape is only used for adhesion and fixation. It can be used for contact between electrodes or electrically connected with conductive particles, and the adhesive used is selected according to the purpose. If a support film is used, sometimes it is simply made of adhesive. Made up. Next, the inventions described in claims 29 to 34 are described. These inventions are related to the adhesive tape 'especially' of electronic components and circuit boards, or between circuit boards, and the electrical connection between the two electrodes, and the adhesive tape and adhesive tape rolled into a disc shape. The manufacturing method and the pressing method of the adhesive tape are related. Next, the background art of the inventions described in claims 29 to 34 is described. Generally speaking, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (camping light display) panels, bare chip packages, and circuit substrates, or the adhesion and fixation between circuit substrates, and the electricity between the two electrodes Sexual connection -107- (103) (103) 200409405 method, using adhesive tape. Japanese Patent Application Laid-Open No. 2000- 2 8 0 0 0 5 describes an adhesive tape on which a substrate is coated with an adhesive tape to take up a disk. The width of this conventional adhesive tape is about 1 ~ 3 mm, and the length of the tape rolled up to the disk is about 50m. After the adhesive tape is rolled out of the disk and the adhesive is pressed to the circuit board, etc. reuse. However, in recent years, with the enlargement of panel screens such as PDPs, the adhesion area of circuit substrates has also increased, and the amount of adhesive used at one time has also increased. In addition, as the use of the adhesive is expanded, the amount of the adhesive used is also increased. Therefore, the disks wound with adhesive tapes of the above-mentioned electronic equipment manufacturing factory are replaced more frequently, because the replacement of new disks is very troublesome, so there is a problem that the production efficiency of electronic equipment cannot be improved. To solve this problem, you can consider increasing the number of adhesive tapes wound to the disk to increase the adhesive dose per disk to reduce the frequency of disk replacement. However, because the width of the adhesive tape is narrower 1 ~ 3mm. Increasing the number of rolls may lead to loose coiling. Moreover, if the number of rolls is increased, the pressure applied to the adhesive film rolled into the shape of a tape increases, and it may leak out from both sides of the adhesive tape and cause a blockage. In addition, if the number of rolls of the 'adhesive tape' is increased, the diameter of the disk will also increase, and the existing adhesive device may not be used because it cannot be mounted on the existing adhesive device. Therefore, the purpose of the invention described in the patent application Nos. 29 to 34 is to provide an adhesive tape, a method for manufacturing the adhesive tape, and a method for pressing the adhesive tape, which can be used without adding an adhesive tape. In the case of the volume number -108- (104) (104) 200409405, increase the adhesive dose. Next, referring to the drawings of the appendix, the embodiments of the inventions described in the scope of patent applications Nos. 29 to 34 will be described. First, referring to Figs. 3A, 3B, 3, 4, 4, and 34, FIG. 5 and FIG. 35 illustrate the first embodiment of the invention described in claims 29 to 34 in the scope of patent application. Figure 3 3 is a diagram of adhesive tape A and B, Figure 33 is a perspective view of a disk wrapped with adhesive tape, Figure 33 is a cross-sectional view taken along line AA of Figure 33 and Figure 34 It is a perspective view of the use state of the adhesive of the PDP, and FIGS. 3 to 5 are cross-sectional views of a step of applying the adhesive on a substrate. The adhesive tape 1 of this embodiment is wound on a disk 3, and the disk 3 is provided with a reel 5 and side plates 7 disposed on both width sides of the adhesive tape 1. In this embodiment, the length of the adhesive tape 1 is about 50 m, and the width W is about 10 m. The adhesive tape 1 is composed of a substrate 9 and an adhesive 11 coated on the substrate 9. The substrate 9 is arranged in a spaced manner with each strip having a width of 0. 5 m m of 5 adhesives 1 1. From the strength and peelability of the adhesive constituting the anisotropic conductive material, the substrate 9 should be made of OPP (extended polypropylene). , Polytetrafluoroethylene, or silicon-treated PET (polyethylene terephthalate), but it is not limited to this. The adhesive 1 1 is a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a thermal metal system. Thermoplastic resins are typified by styrene resins and polyester resins. Heat • 109- 200409405 ^ 2 1 n ',. . . . . f: Γή · (105) W ~ Curable resins are represented by epoxy resins, vinyl resins, acrylic resins, and silicone resins. Conductive particles 1 3 are dispersed in the adhesive 11. Conductive particles] 3 are metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sη, solder, etc., or carbon, graphite, etc. A non-conductive polymer core material such as glass, ceramics, and plastic is formed by covering the aforementioned conductive layer and the like. In addition, it is also possible to use insulating film particles that cover the above-mentioned conductive particles with an insulating layer, or conductive particles and insulating particles for use. Forming a conductive layer on a hot molten metal such as solder or a polymer core material such as plastic will have deformability due to heat and pressure or pressure, so the distance between electrodes after connection will be reduced. Can increase the area of contact with the circuit, and improve reliability. In particular, it is better to use polymers as the core material. For example, because the solder has no melting point, it can be controlled in a softened state at a wide range of connection temperatures, and it is easy to get the thickness and flatness of the electrode. The connecting member 0. Next, the method of using the adhesive tape of this embodiment will be described. Mount the disk 3 of the adhesive tape 1 and the empty disk 17 to the adhesive device 15; mount the front end of the adhesive tape 1 wound on the disk 3 to the empty disk 17; and roll out the adhesive tape 1 ( Arrow E in Figure 3). Secondly. An adhesive tape 1 is arranged on the circuit board 21, and a heating and pressing head 19 arranged between the two plates 3 and j 7 is used to press-contact the adhesive tape 1 from the substrate 9 side, and one piece is The adhesive 11 is pressed onto the circuit board. Thereafter, the residual adhesive agent Π and the substrate 9 are wound up to the empty disk 17. After the above-mentioned pressing (temporary connection), the electric circuit board 21 is positioned -110- (106) (106) 200409405 and the wiring circuit (electronic component) 2 3 is positioned and formally connected. For formal connection, a wiring circuit (or electronic component) 2 3 is arranged on the adhesive 1 1 pressed on the circuit substrate 2 1. If necessary, for example, a PTFE material 2 4 can be used as a buffer material for heating. The pressure head 19 applies heat and pressure to the circuit board 21 and the wiring circuit 23. In this way, the electrode 2 1 a of the circuit substrate 21 and the electrode 2 3 a of the wiring circuit 2 3 can be connected. As shown in Figures 3 and 4, the connection part of PDP 26 using the adhesive tape of this embodiment will adhere to the entire Pdp. The amount of adhesive 1 1 used at a time will be much larger than traditional use. the amount. Therefore, the usage amount of the adhesive tape 1 wound on the disc 3 will also increase, and the adhesive tape 1 wound on the disc 3 will be taken up to the empty disc 17 and the disc 3 in a relatively short time. Will become empty. When the disk 3 becomes empty, the disk 3 and the disk 17 are reversed respectively. At this time, ′ is wound up with the empty disk 3 and the adhesive tape 1 is moved in the opposite direction (arrow F in FIG. 3). In this way, 'the adhesive direction 1 of each adhesive tape 1 will change the winding direction (E, F) of the adhesive tape 1 in order, and the adhesive agent 11 is pressed to the circuit board 21. Here, refer to FIG. 5 and FIG. 3 5 The figure illustrates the manufacturing method of the adhesive tape 1 of this embodiment. On the separator 9 rolled out from the unwinder 25, an adhesive made of resin and conductive particles 1 3 is coated with a coater 2 7! After drying in a drying furnace 29, the original material is taken up by a winding machine 31. As shown in FIG. 35, 5 • 111-(107) (107) 200409405 coaters 27 are arranged with respect to the 10 mm width of the base material 9 to apply 5 adhesives u with a width of 10 mm. The raw material of the rolled adhesive tape is cut into a specific width by a cutting machine 3 and rolled onto the reel. 'Side plates 7, 7 are mounted on the reel from both sides, or' rolled to the reel with side plate. ' Then, it is packaged with the dehumidifying material, and it is managed at a low temperature (-5 ° C ~-10t) and shipped. Secondly, other embodiments of the invention described in items 2 to 9 of the scope of the needle seal application patent will be described. The same parts as the above embodiments will be given the same symbols and detailed descriptions of those parts will be omitted. The following description is It is mainly different from the above embodiment. In the second embodiment shown in FIGS. 3 to 6 in the second embodiment, the adhesive tape] is coated with an adhesive having a width of W on one side of the substrate, and the adhesive is formed by using a slit 3 5 formed in the longitudinal direction of the substrate. Separated into a plurality of bars in the width w direction. When the adhesive tape 1 of this second embodiment is used, the gap 35 is formed immediately after the disk 3 is mounted on the adhesive device 15 and then the adhesive tape 1 is pressed against the circuit board 21. At this time, you can also stick the device! A working surface is installed near the mounting portion of the plate 5 (shown as S in FIG. 3) to form a gap 3 5 in the adhesive 1 1 of the rolled-out adhesive tape 1. Those who formed the gap in the repair step during the manufacture of the adhesive tape are wound up to the tray, or after the drying in the coating step, the gap is formed immediately by the winder 31 before being wound up. When the adhesive tape of the second embodiment is used in the adhesive device 15, the same as in the first embodiment, the adhesive separated by the gap 3 5 will be heated one by one to apply pressure from the substrate 9 side. As shown in Figures 3, 6A, B, and C, use them one by one in order. -112- (108) 200409405 When applying this form to the second step, it is only necessary to form the gap 3 5 with the conventional adhesive on the substrate, and then the adhesive 11 can be manufactured, which is very easy to manufacture. The third embodiment shown in Figs. 3 to 7A is coated with an adhesive 11 (Fig. 37A), and the width W of the substrate is the same as that of the previous embodiment. It is also 5 实施 when used. The shape is the same. 'Place it 15 and place K on the adhesive tape 1 rolled out from the tray 3, and apply heat and pressure to the part of the adhesive tape 1 in the width W direction (Figure 37B) to lower the part. Part of the adhesive with heat and pressure will peel off from the substrate and 21 (Figure 37C). At this time, along the edge line of the heating and pressing head 19, all the adhesives in the heating and pressing part should be simple indicators below 1 00 poise without starting to stick or low position (simple indicators are reactions The ratio of 20% or less is selected according to the adhesive system to be used. In this third embodiment, the adhesive 11 will soften and fluidize one part of the degree W, so it is the same as the above embodiment, as long as By using the forward and reverse of the adhesive and empty disk, multiple copies can be used. As in the above embodiment, the adhesive Π needs to be divided into a plurality of strips to configure, and only the wider base cloth adhesive 1 1 Yes, so when the same number of sticky tapes are obtained from the ten steps of manufacturing the adhesive tape, all of the substrate 9_9 and the adhesive agent I〗 ^ 1 0 0 0mm-next to the adhesive device> circuit board 2 1 : Adhesive (1 part) Cohesive force, only pressed to the circuit board to form a cohesive force, showing a softened flow (hardening reaction of the agent,), when heating temperature is applied, it is only widened to the substrate circuit, the adhesive tape 1 disk 3 〇 more than a gap 3 5, no material Full coating on one side> Easy to separate. -113- (109) (109) 200409405 The fourth embodiment shown in Figures 3 to 8 of Figure 38 is another method of manufacturing the adhesive tape of the first embodiment. After a gap 98 is formed in the adhesive 11 on the substrate 9a (FIG. 38A), the adhesive 11 is sandwiched between the substrates 9a and 9b, and then the adhesive 11 is attached. The other substrate 9b (Fig. 38B). Next, one and the other substrates 9a and 9b are peeled off, and each of the substrates 9a and 9b is provided with an adhesive strip 1 1 at a distance of one. 1 1 b. In this fourth embodiment, in order to alternately arrange the adhesive strips 1a, 1 lb on one and the other substrates 9a, 9b, one substrate 9a or 9b side can be spaced by 1 The adhesive strips 1 1 a, 1 1 b are heated and pressurized in the manner of strips, and the adhesive strips 〖a ,: π b are arranged on the substrates 9a, 9b at intervals of one strip. Scope of patent application The inventions described in items 29 to 34 are not limited to the above-mentioned embodiments. As long as they do not depart from the spirit of the inventions described in claims 29 to 34, various modifications can be made. For example, in the above embodiment, it may be an insulating adhesive in which the conductive particles 13 are not dispersed in the adhesive I 1. In the above embodiment, the number of the adhesives formed on the substrate 9 may be arbitrary. It is sufficient that there are at least two or more. Next, the inventions described in the 35th to 41st patent application scope will be described. These inventions relate to electronic components and circuit boards, or adhesion and fixation between circuit boards, and both. An adhesive tape for electrically connecting the electrodes, a method for manufacturing the adhesive tape, and a method for pressing the adhesive tape. Next, the background art of -114- (110) (110) 200409405 of the inventions described in the 35th to 41st patent application scope will be described. Generally speaking, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, bare chip packages, and circuit substrates, or the adhesion and fixation between circuit substrates, and the electricity between the two electrodes The method of sexual connection uses an adhesive tape. Japanese Patent Laid-Open No. 2 00 1-2 8400 5 describes that an adhesive tape on which a substrate is coated with an adhesive is wound into a disk shape. The width of this conventional adhesive tape is about 1 to 3 mm, and the length of the tape wound to the disk is about 50 m. Secondly, when the adhesive is pressed to the periphery of the circuit substrate, the adhesive tape is pulled out along one side of the circuit substrate and the pressure of the adhesive is applied. Since the adhesive is directed to the periphery of the circuit substrate, the adhesive is pressed. To the periphery of the circuit board. However, in recent years, with the enlargement of panel screens such as PDPs, the adhesion area (size of one side) of circuit substrates has also increased, and the amount of adhesive used at one time has also increased. In addition, due to the expansion of the use of adhesives, the use of adhesives has also increased. Therefore, the above-mentioned electronic equipment manufacturing plant has more frequent replacement of disks with adhesive tapes. Because the replacement of the disks is very troublesome, there is a problem that the production efficiency of electronic equipment cannot be improved. In view of this problem, it can be considered to Increasing the number of rolls of adhesive tape wound to the disk to increase the adhesive dose per disk to reduce the frequency of disk replacement. However, because the width of the adhesive tape is 1 to 3 mm narrower, if you increase the volume The number may lead to scattered coils. In addition, if the number of rolls is increased, the pressure applied to the adhesive tape rolled into a tape shape will increase, and -115- (111) 200409405 may cause the adhesive to leak out from the rain of the tape and become a cause of blockage. Therefore, the invention described in the claims 35 to 41 of the patent application scope is to provide an adhesive tape, a method for manufacturing the adhesive tape, and a method for pressing the adhesive tape without adding a roll of the adhesive tape. Increase the adhesive dose. Next, referring to the drawings of the appendix, the embodiment of the invention described in item 35 of the scope of patent application will be described. First, referring to 3A, B, 40, 34, 5, 5 and 41, The first embodiment of the invention described in the range of 3 to 5 to 41 is clear. Fig. 39 and Fig. A and B are diagrams of the adhesive tape, Fig. 39 and Fig. A are perspective views of the disk with the adhesive tape, and Fig. 39 and Fig. B are plan views when the adhesive tape of Fig. 39A is viewed from the adhesion. Fig. 40 is an oblique view of the adhesive pressing step of the device. The adhesive tape 1 of this embodiment is wound on a disk 3, and a reel 5 and sides disposed on both sides of the adhesive tape 1 are arranged thereon. In this embodiment, the length of the adhesive tape 1 is about 50 m, and the width is about 150 m that is approximately the same size as one side of the circuit board. The adhesive tape 1 is composed of a base material 9 and an agent 11 coated on the base material 9. In the width direction of the tape on the base material 9, an adhesive with a width of 0. 5 mm is arranged in an equal manner. 1 1. From the strength and the peelability of the adhesive constituting the anisotropic conductive material, the substrate 9 should be made of 0 PP (extended polypropylene), polytetrafluoroethylene, or treated PET (polyethylene terephthalate), etc. The composition is not limited to this. The purpose and number of ~ 4 1 9 Figure A δ 円 说 说 卷绕 卷绕 黏 卷绕 卷绕 系 系 系 系 系 系 系 系 系 系 系 系 黏 黏 系 黏 3 plates 7 degrees W Adhesive spacer It is a thermoplastic resin, thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin, or a thermometallic resin. Thermoplastic resins are represented by styrene resins and polyester resins, and 'thermosetting resins are represented by epoxy resins, acrylics, vinyl ester resins, and silicone resins. . Conductive particles 1 3 are dispersed in the adhesive 11. The conductive particles 1 3 are metal particles such as An, Ag, Pt, Ni, Cn, W, Sb, Sn, solder, or carbon, graphite, etc., and can also be used in the foregoing and non-conductive glass, ceramics, and plastics. The polymer core material is formed by covering the conductive layer. In addition, it is also possible to apply an insulating film particle that covers the aforementioned conductive particles with an insulating layer, or conductive particles and insulating particles for use. Forming a conductive layer on a hot molten metal such as solder or a polymer core material such as plastic will have deformability due to heat and pressure or pressure, so the distance between electrodes after connection will be reduced. Can increase the area of contact with the circuit, and improve reliability. In particular, it is better to use polymers as the core material. For example, because the solder has no melting point, it can be controlled in a softened state at a wide range of connection temperatures, and it is easy to get the thickness and flatness of the electrode. Connection building blocks. Next, a method of using the adhesive tape 1 according to this embodiment will be described. The disk 3 of the adhesive tape 1 and the empty disk 17 are mounted to the adhesive device 15. The empty disk 17 is mounted on the front end of the adhesive tape 1 wound on the disk 3 and the adhesive tape 1 is rolled out (No. Arrow E in Figure 40). Next, an adhesive tape 1 is arranged on the circuit board 21, and a heating and pressing head 19 disposed between the two plates 3, 17 is pressed against the adhesive tape 1 from the substrate 9 side, and one piece is Adhesive 11 is pressed to the width direction of the adhesive tape -117- (113) (113) 200409405 One side of the circuit board 'only the adhesive 11 of this amount will be wound up to the empty disk 17'. Next, the circuit substrate 21 is rotated by about 90 degrees so that the adjacent edge of the circuit substrate 21 is located in the width direction of the adhesive tape 1. The adhesive 11 is pressed onto the circuit substrate 2 by a heating and pressing head 19. On the other side. In this way, the circuit substrate 21 is rotated by about 90 degrees and the adhesive 11 is pressed, so that the adhesive 11 can be pressed around the circuit substrate 21. After the above-mentioned pressing (temporary connection), the electrodes of the circuit board 21 and the electrodes of the wiring circuit (electronic component) 2 3 are positioned and formally connected. Formally connected, after pressing the adhesive 11 to the periphery of the circuit board 2, a wiring circuit (or electronic component) 23 is arranged on the adhesive 11, and if necessary, 'for example, a polytetrafluoroethylene 2 4 can be used as The buffer material is heated and pressurized by the heating and pressing head 19 to the circuit board 21 and the wiring circuit 2 3 (see FIG. 4). In this way, the electrode 21a of the fixed circuit board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Figure 34, using the connection part of PDP 26 of the adhesive tape 1 of this embodiment, the entire periphery of the PDP will be adhered, and the amount of adhesive 1 1 used at a time will be much larger than the traditional use the amount. However, because the width W of the adhesive tape 1 and the length Η of one side of the circuit substrate 21 are approximately the same, even if the number of rolls is the same as that of the conventional one with a larger width w, the adhesive dose is much more than the traditional Therefore, the number of disk replacements is much less than the traditional ones. Here, a method for manufacturing the adhesive tape 1 according to this embodiment will be described with reference to Figs. 5 and 41. • 118- (114) (114) 200409405 On the base material (separat〇r) 9 unrolled from the unwinder 25, apply an adhesive made of resin and conductive particles 丨 3 with _ cloth machine 2 7 After the drying is performed in a drying furnace 29, the original material is taken up by a winding machine 31. The applicator 27 is moved left and right, and a strip-shaped adhesive is applied to the substrate 9 at regular intervals. The raw material of the rolled adhesive tape is cut into a specific width by a cutter 3 3 and rolled onto a reel, and then the side plates 7, 7 are mounted on the reel from both sides, or rolled to the reel with the side plate In the above, it is packed with dehumidifying material, and it is managed and shipped at low temperature (-5 ° C ~ -10 ° C). Secondly, it is for other inventions described in the 35th to 41st patent scope of the application. The embodiment will be described. The same parts as those in the above embodiment will be denoted by the same reference numerals and detailed descriptions of those portions will be omitted. The following description is mainly based on the differences from the above embodiments. In the second embodiment shown in FIG. 41, the adhesive device 1 is provided with an adhesive tape 1 at two places, and one adhesive tape 1 and the other adhesive tape 1 are installed perpendicular to each other. . Next, the adhesive tape 1 on one side presses the adhesive 11 on the opposite longitudinal side N of the circuit board 21 (step 1), and the other adhesive tape 1 presses the adhesive 1 1 on the opposite side. On the side M (the second step), the adhesive can be pressed to the periphery of the circuit board 21 in two steps. In this second embodiment, it is not necessary to rotate the direction of the circuit substrate 21 between the first step and the second step, and the circuit substrate 21 placed in the first step can be directly moved to the second step, so that an adhesive can be realized. The automatic pressing can also improve the working efficiency. At this time, the circuit board 21 may be placed on a conveyer belt to realize automatic conveyance. -119 · (115) (115) 200409405 In the third embodiment shown in Figs. 42A to 42C, an adhesive with a width of W is applied on one side of the substrate, and the substrate is formed in the width W direction of the substrate The gap is 3, 5 and the adhesive is separated into a plurality of strips in the width W direction. In the case of the adhesive tape 1 of the third embodiment, the gap 35 should be formed immediately after the disk 3 is mounted on the adhesive device 15 and then the adhesive tape 1 is pressed to the circuit board 21. At this time, a working surface can also be installed near the disk mounting portion of the adhesive device 15 (as shown in S in FIG. 40) to form a gap 3 5 in the adhesive 11 of the rolled adhesive tape 1. It is also possible to wind up those who have formed the gaps in the repair step during the manufacturing of the adhesive tape shown in Figure 5 to the tray, or after the drying in the coating step, use the winder 3 1 to wind up the previous one. Those who form gaps instantly. Regardless of the embodiment, the working surface may be a person who moves back and forth in the width W direction of the adhesive sheet 1. In addition, when the adhesive tape 1 of the third embodiment is used in the adhesive device 15 as in the first embodiment, the adhesive separated by the gap 35 is pressed one by one by a heating and pressing head to apply pressure from the substrate 9 side. While using one by one from the front side. In this third embodiment, a plurality of adhesives 11 arranged in the width direction can be obtained simply by forming the gaps 35 in the adhesive on the substrate obtained by the same steps as in the conventional method, which is very easy to manufacture. In the fourth embodiment shown in FIGS. 43A to C, the adhesive 11 is completely coated on one side of the substrate 9 (FIG. 43A), and the width W of the substrate 9 and the adhesive 11 is as described above. The shape is the same, and it is the same size as one of the circuit board * side lengths. Next, 'when used, it is mounted in the same manner as in the first embodiment, and heat-pressurizes the part -120- (116) (116) 200409405 parts of the adhesive tape 1 in the width W direction of the adhesive tape 1 (Fig. 43B), to reduce the cohesive force of this part, only the adhesive of the part subjected to heat and pressure will be separated from the substrate and pressed to the circuit board 21 (Fig. 43C). At this time, a cohesive force reduction line will be formed along the edge of the heating and pressing head 19, and all the adhesives in the heating and pressing part should show a softened flow (the simple index is below 1000 poise) without starting the adhesive. Hardening reaction, or low state (simple index is below 20% reaction rate), the heating temperature should be selected according to the adhesive system used. In this fourth embodiment, when the adhesive 11 is used, one part in the width W direction is softened and fluidized one by one, and pressed to the circuit board. In addition, as in the above-mentioned embodiment, the gap 3 5 is formed in the adhesive 1 1, and it is not necessary to be divided into a plurality of strips to configure. Instead, it is only necessary to fully apply the adhesive 1 1 on one side of a wide base material. It is very easy to manufacture. The fifth embodiment shown in FIGS. 4 to 4A to C is another manufacturing method of the adhesive tape 1 of the first embodiment, and a gap 9 8 is formed in the adhesive 11 coated on the substrate 9 a ( (Fig. 44A), the other substrate 9b is attached to the adhesive 1 so that the adhesive 11 is sandwiched between the substrates 9a and 9b (Fig. 44B). Next, the substrates 9a and 9b on one side and the other are peeled off. Adhesive strips 1 1 a and 1 1 b are arranged on each of the substrates 9 a and 9 b at intervals. In this fifth embodiment, in order to alternately arrange the adhesive strips 1 la and 1 1 b on one and the other substrates 9 a and 9 b, one strip may be spaced from one of the substrate 9 a or 9 b sides. In the method, the adhesive strips 1 1 a and 1 lb are heated and pressed, and the adhesive strips 1 a and 1 lb are sequentially attached to the respective substrates 9 a and 9 b. -121-(117) (117) 200409405 The invention described in the 35th to 41st scope of the patent application is not limited to the above embodiment, as long as it does not depart from the invention described in the 35th to 41st scope of the patent application. Various modifications are possible within the scope of the gist. For example, in the above embodiment, it may be an insulating adhesive in which the conductive particles 13 are not dispersed in the adhesive 11. Next, the inventions described in the patent application scope Nos. 42 to 46 will be described. These inventions relate to an adhesive tape case for adhesively fixing an electronic component and a circuit board, or between circuit boards, and an electrical connection between the two electrodes, and an adhesive pressing method using the adhesive tape case. Next, the background art of the inventions described in claims 42 to 46 in the scope of patent application will be described. Generally speaking, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, bare chip packages, and circuit substrates, or the adhesion and fixation between circuit substrates, and the electricity between the two electrodes The method of sexual connection uses an adhesive tape. Japanese Patent Application Laid-Open No. 200 1-284005 describes a case where an adhesive tape on which a substrate is coated with an adhesive is wound into a disk shape. The width of this conventional adhesive tape is about 1 to 3 mm, and the length of the tape wound up to the disk is about 50 m. Secondly, when the adhesive is pressed to the periphery of the circuit substrate, the adhesive tape is pulled out along one side of the circuit substrate and the pressure of the adhesive is applied. Since the adhesive is directed to the periphery of the circuit substrate, the adhesive is pressed. To the periphery of the circuit board. However, in recent years, the size of panel screens such as PDPs has increased, and the adhesion area (size of one side) of the circuit board will also increase, and the amount of adhesive used at one time will also increase. increase. In addition, due to the expansion of the use of adhesives, the use of adhesives has also increased. Therefore, the above-mentioned electronic equipment manufacturing plant has more frequent replacement of the disk wrapped with adhesive tape. 'Because the replacement of the disk is very troublesome, there is a problem that the production efficiency of the electronic device cannot be improved. For this problem, it can be considered to Increasing the number of rolls of adhesive tape wound to the disk to increase the adhesive dose per disk to reduce the frequency of disk replacement. However, because the width of the adhesive tape is 1 to 3 mm narrower, if you increase the volume The number may lead to scattered coils. Moreover, if the number of rolls is increased, the pressure applied to the adhesive tape rolled into the shape of a tape increases, and the adhesive may leak from both sides of the tape and become a cause of blockage. Therefore, the object of the invention described in the patent application Nos. 42 to 46 is to provide an adhesive tape box and an adhesive pressing method using the adhesive tape box, which can increase the number of adhesive tapes without increasing the number of adhesive tapes. Increase the adhesive dose, and the replacement of the disk is easier. Next, with reference to the attached drawings, the embodiments of the invention described in claims 42 to 46 of the scope of patent application will be described. First, refer to FIG. 45, A, B, 46, 47, 4, and 34. Fig. 48 and Fig. 48 illustrate the first embodiment of the invention described in claims 42 to 46 in the scope of patent application. For convenience of explanation, the case where two adhesives are provided for the adhesive tape will be described, however, a plurality of adhesives may be formed. Figures 4 and 5 are the adhesive tape case of the first embodiment of the invention described in Items 4 2 to 46 in the scope of the patent application. Figure 4 and Figure 5 A are adhesive tapes -123- (119) (119 200409405 perspective view of the box, Fig. 4 5 B is a cross-sectional view taken along A-A of Fig. 4 5 A, and Fig. 4 6 is a cross-sectional view of the disk installation state of the tape box shown in Fig. 4 5 A and B Figs. 4 to 7 are front views of an adhesive pressing step of an adhesive device, and Fig. 4 to 8 are steps of a method for manufacturing an adhesive tape case. The main components of the adhesive tape box 100 of this embodiment are one disk 3, the other disk 17, and a housing 99 for accommodating the aforementioned disks. One disk 3 is wound with the adhesive tape 1 and the adhesive tape. The other end of 1 9 a is fixed to the other side's disk 1 7. An opening 11 is formed on one side of the housing 9 9, and the adhesive tape 1 can be pulled out from the opening 11. Guides 3 1 and 31 are provided on both sides of the opening 11 to guide the movement of the adhesive tape 1. The casing 99 is formed by fitting the half casings 99a and 99b, and the sliding shaft 17 (refer to FIG. 46) arranged on the adhesive device 27 (described later) is inserted into one and the other disks 3 and 5, And fitted to each of the plates 3 and 5. Here, the fitting of each of the discs 3 and 5 and each of the discs 3 and 5 and the case 99 will be described with reference to Fig. 46. The inner edges of each of the plates 3 and 5 will form a fitting bar 19 that can fit the sliding shaft 17 of the adhesive device 2 7, and the outer side will form a protrusion that fits into the housing 99 in a rotatable manner. The fitting groove 21 of 7c. As shown in FIG. 45B, on one side of the base material 9 of the adhesive tape 1, two side-by-side adhesives 11a and lib are coated in the width direction. There is a gap between the two adhesives 1 1 a and 1 1 b. In this embodiment, the length of the adhesive tape 1 is about 50 m, and the width W is about 4 mm. The width of each adhesive 1 la, 1 lb is about 1. 2mm -124- (120) 200409405 The peeling substrate 9 from the strength and the adhesive constituting the anisotropic conductive material should be made of OPP (extended polypropylene), polytetrafluoroethylene, treated PET (polyethylene terephthalate) It is not limited to this. The adhesive 1 1 is made of a thermoplastic resin, a mixture of a thermosetting thermoplastic resin and a thermosetting resin, or a thermo-gold plastic. The raw resin is based on ethylene, olefin and polyester resins, and is thermosetting. Resin systems are represented by epoxy resin systems, acrylic systems, resin systems, and silicone resins. Conductive particles 1 3 are dispersed in the adhesive 11. The conductive particles Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, etc., or carbon, graphite, etc., can also be covered on the aforementioned objects and non-conductive ceramic and plastic core materials such as polymer The shape of the conductive layer and the like can also be applied to an insulating coating that covers the aforementioned conductive particles with an insulating layer, or conductive particles and insulating particles. Forming a conductive layer on a hot melt such as solder or a polymer core material such as plastic will have the deformability of being deformed by pressure or pressure, so the electrode after connection is reduced, and the area in contact with the circuit can be increased during connection. But mentionable. In particular, it is better to use polymers as the core material. Soldering, such as solder joints, can also be controlled in a softened state at a wide range of connection temperatures. It is easy to respond to the thickness and flatness errors of the electrode, followed by The method of the adhesive tape case 100 of this embodiment will be described. As shown in Figure 47, the adhesive tape is box-shaped in terms of properties, or through silicon, but resin, or metal. Representative of heat, and vinyl ester 13 series such as metal particles, glass, ceramics. In addition, the film particles, molten metal, and high distance due to heating will have high reliability. Because there is no melting, the connection member can be obtained. User 100 is equipped with -125- (121) (121) 200409405 to the adhesive device 27. The adhesive device 27 is provided with the slide shafts 17 and 17 for the box in a spaced manner (refer to FIG. 46), and the slide shafts 17 and 17 are engaged with the trays of the adhesive tape box 100 3, 5. Therefore, the mounting of the adhesive tape box 100 can be completed with a single touch, and there is no need to perform the operation of conventionally mounting the other end 9a of the adhesive tape 1 wound on the disk to an empty disk. Next, the adhesive tape 1 is pulled out from the adhesive tape case 100 and passed through the guides 31, 31 of the adhesive device 27. Next, the sliding shaft 17 of the adhesive device 27 is driven to roll out the adhesive tape 1 (direction of arrow E in FIG. 47), and the adhesive tape 1 is arranged on the circuit board 21 to heat the pressure head 19 from the substrate 9 One side of the adhesive tape 1 is pressed on one side, and one part of the adhesive 1 1 a on one side in the width direction is pressed to one side of the circuit board 2 1. The remaining one adhesive 1 1 b and the substrate 9 will Taken to the other side's plate 17. In this way, the adhesive 11a can be pressed around the circuit substrate 21. Next, after all of the adhesive tape 1 wound on one of the discs 3 is unrolled, the adhesive tape case 100 is removed and loaded in reverse, and the above steps are repeated. When two or more adhesives are formed on the adhesive tape, the positions in the width direction can be changed sequentially or at intervals. After the above-mentioned pressing (temporary connection), the electrodes 3 3 a of the circuit board 21 and the electrodes 3 7 a of the wiring circuit (electronic component) 37 are positioned and formally connected. For formal connection, after pressing the adhesive 1 1 a to the periphery of the circuit substrate 21, a wiring circuit (or electronic component) 3 7 is arranged on the adhesive 1 1 a. If necessary, for example, polytetrafluoroethylene The material 3 9 is used as a buffer material, and the heating and pressing head 19 is applied to the circuit board 2 1 and the wiring circuit 2 3 is added. -126- (122) (122) 200409405 Thermal pressurization (refer to Figure 4). In this way, the electrode 3 3 a of the fixed circuit substrate 21 and the electrode 3 7 a of the wiring circuit 23 can be connected. As shown in FIG. 34, the connection part of the PDP 26 which is adhered by the adhesive tape box 100 of this embodiment is adhered to the entire periphery of the PDP 26 in this embodiment. The amount of agent 11 used will be much larger than the traditional amount. However, because two adhesives are arranged in the width W direction of the adhesive tape 1; i 丨 a, η b, even if the number of rolls is the same as the traditional one, the adhesive dose can be twice that of the traditional one, so the number of boxes can be reduced. Number of replacements. The 'adhesive tape 1' is of the type of the box 1, so it is easy to replace, handle, and install, and has good workability. Here, the manufacturing method of the adhesive tape case 1000 of this embodiment is demonstrated with reference to FIG. The separator 23 rolled out from the unwinder 25 is coated with an adhesive 11 made of a mixture of resin and conductive particles 30 with a coating machine 2 8 and dried in a drying furnace 29. Take up the original material with a winder 3 1. The coater 28 applies a plurality of adhesives to the substrate 9. The original material of the rolled adhesive tape is cut with a cutter 33 to a specific width (width of the 2 adhesive tapes) during the refurbishing step and wound up to the tray 3, and then clamped to the half shells 99a, 99b The disc 3 and the empty disc 5 are fitted in between to form an adhesive tape case 100. The adhesive tape box 100 is packed with a dehumidifying material, and is managed and shipped at a low temperature (-5 ° C ~ · 1 (ΓC). Secondly, the invention described in the 42nd to 46th scope of the patent application -127- (123) (123) 200409405 Other embodiments will be described. In the embodiments described below, the same parts as the above embodiments will be given the same symbols and detailed descriptions of those parts will be omitted. The following description is based on In the second embodiment shown in Figs. 4 and 9, the adhesive 11 is pressed to the whole side of the circuit board 21 at one time, and the adhesive device 27 is provided to allow the adhesive to be removed from the adhesive. The adhesive tape box 100 pulls out the long guide 1 0 1 of the adhesive tape 1. In the second embodiment, the adhesive tape is pressed to the whole side of the circuit board 21 at one time, which is good. When the table 3 is applied in the same manner as shown in the table 50, the adhesive agent 1 with a width W is fully coated on one side of the substrate 9 and the adhesive is separated into two by a gap. 3 When the adhesive tape 1 of the embodiment is used, the gap is formed. After the adhesive tape box 100 is mounted to the adhesive device 27, the adhesive tape box 1 is pressed to the circuit board 21 immediately before this time. At this time, it may also be near the boxed part of the adhesive device 27 (such as the first (Shown in S of FIG. 47) A working surface is installed to form a gap 102 on the adhesive 11 of the rolled adhesive tape 1, and the repair steps in the manufacturing of the adhesive tape shown in FIGS. 4 to 8 can also be performed. Those who have formed a gap in the process of winding up to the tray 3, or those who have formed the gap 10 in a moment before being wound up by the winder 31 after the drying step in the coating process. In this third embodiment, The adhesive 1 1 on the substrate 9 obtained by the same traditional procedure forms a gap 10 2, and 2 adhesives 1 1 a and 1 1 b can be obtained, which is very easy to manufacture. In the fourth embodiment, the adhesive agent 1 1 is completely coated on one side of the substrate 9 (FIG. 51A), and the adhesive tape box 100 containing the adhesive tape 1 is the same as the first application mode. Method -128-(124) (124) 200409405 Attach to the adhesive device 27, and apply the adhesive 11 (one piece) to the width W part of the adhesive tape 1 Heat and pressure reduce the cohesion of the part. Only the part of the adhesive 1 1 a that is heated and pressed will be peeled from the substrate 9 and pressed to the circuit board 21 (Figure 51B). A cohesive force reduction line 1 03 is formed around the pressure head 19 (Fig. 51 A). All the adhesives in the heating and pressurizing part should show a softened flow (the simple index is less than 1,000 poise) without starting the adhesive. The hardening reaction or low-position state (the simple indicator is a reaction rate of 20% or less), the heating temperature should be selected according to the adhesive system used. In this fourth embodiment, when the adhesive 11 is used, only one part 2 5 a in the width W direction is softened and fluidized and is pressed to the circuit board. Next, the inventions described in claims 47 to 49 of the scope of patent application will be described. These inventions are related to adhesive tapes for electronic components and circuit boards, or for the adhesion and fixation of the circuit boards to each other, and for the electrical connection between the two electrodes, and more particularly to the adhesive tapes rolled into a disk shape. Next, the background art of the inventions described in claims 47 to 49 will be described. Generally speaking, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, bare chip packages, and circuit substrates, or the adhesion and fixation between circuit substrates, and the electricity between the two electrodes The method of sexual connection uses adhesive tape. Japanese Patent Application Laid-Open No. 200 1-284005 describes a case in which an adhesive material tape on which a substrate is coated with an adhesive material is rolled into a disc shape. -129- (125) (125) 200409405 The width of this traditional adhesive tape is about 1 ~ 3 mm, and the length of the tape wound to the disk is about 50m. When the adhesive tape is mounted on the adhesive device, a tray of adhesive tape (hereinafter referred to as "adhesive material tray") is mounted on the adhesive device, and the beginning end of the adhesive tape is pulled out and mounted on the take-up tray. Next, from the base material side of the adhesive material tape rolled out from the self-adhesive material tray, the adhesive is pressed onto the circuit board or the like with a heating and pressing head, and the remaining substrate is taken up by a take-up disk. Secondly, when the adhesive tape of the adhesive material tray is used up, remove the used disk and the take-up disk of the winding substrate, mount the new take-up disk and the new adhesive material tray on the adhesive device, and attach the adhesive material. The beginning of the tape is mounted on the take-up reel. However, in recent years, with the enlargement of panel screens such as PDPs, the adhesion area of circuit substrates has also increased, and the amount of adhesive used at one time has also increased. In addition, as the use of the adhesive is expanded, the amount of the adhesive used is also increased. Therefore, the replacement of the adhesive material plate in the electronic equipment manufacturing factory is more frequent. Because the replacement of the adhesive material plate is very troublesome, there is a problem that the production efficiency of the electronic device cannot be improved. To solve this problem, you can consider increasing the number of adhesive tapes wound to the disk to increase the adhesive dose per disk to reduce the frequency of disk replacement. However, because the width of the adhesive tape is narrower 1 ~ 3mm. Increasing the number of rolls may lead to loose coiling. Furthermore, if the number of rolls is increased, the pressure applied to the adhesive tape rolled into the shape of a tape increases, which may cause the adhesive to leak from both sides of the tape and become a cause of blockage. In addition, if the number of rolls of adhesive tape is increased, the diameter of the disk will also increase. It may not be used because it cannot be mounted on an existing adhesive device. -130 · (126) (126) 200409405 Existing adhesive device. Therefore, the purpose of the inventions described in claims 47 to 49 is to provide an adhesive tape, which can make the replacement of the adhesive tray easier and improve the production efficiency of electronic equipment. Next, with reference to the drawings of the appendix, the embodiments of the invention described in items 47 to 49 of the scope of patent application will be described. The first embodiment of the invention described in claims 47 to 49 will be described with reference to Figs. 52A, B, 3, 4, 4, 29, and 5. Fig. 52 and Fig. A and B are connection diagrams of the adhesive tape of this embodiment, Fig. 52 is a perspective view of the connection between the adhesive discs, and Fig. 52 and Fig. B are the connection parts of Fig. 52 and Fig. A. Sectional view. The adhesive tape 1 is wound around the disks 3 and 3a, respectively. Each of the disks 3 and 3a is provided with a reel 5 and side plates Ί arranged on both width sides of the adhesive tape 1. The adhesive material tape 1 is composed of a base material 9 and an adhesive agent 1 1 applied to one side surface of the base material 9. Substrate 9 · It has a support layer 9b and a hot-melt agent layer (hot metal layer) 9a sandwiching the support layer 9b from both sides. The hot-melt agent (hot metal) constituting the hot-melt agent layer 9a is made of a thermoplastic resin. Polyethylene, SBS (benzene; I # butadiene styrene block copolymer), nylon, etc. The support layer 9b is made of OPP (extended polypropylene), polytetrafluoroethylene, or PET (poly-p-phenylene Reinforced fibers such as ethylene diformate), plastics, glass fibers, aromatic polyamide fibers, or carbon fibers. Adhesive 1 1 is a mixture of thermoplastic resin, thermosetting resin, or -131-(127) (127) 200409405 thermoplastic resin and thermosetting resin. The thermoplastic resin system is represented by the Bentosan system and the polyester resin system, and the thermosetting resin system is represented by the epoxy resin system, the acrylic resin system, and the silicone resin system. 0 Adhesive 1 The conductive particles 1 3 may also be dispersed in 1. Conductive particles! 3 It is metal particles such as Au, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, etc., or carbon, graphite, etc. It can also be used in the foregoing and / or non-conductive glass, ceramics, plastics, etc. A polymer core material is formed by covering the aforementioned conductive layer. In addition, it is also possible to apply an insulating coating particle that covers the conductive particles with an insulating layer, or a conductive particle or an insulating particle for use. Forming a conductive layer on a hot molten metal such as solder or a polymer core material such as plastic will have deformability due to heat and pressure or pressure, so the distance between electrodes after connection will be reduced. Can increase the area of contact with the circuit, and improve reliability. In particular, it is better to use polymers as the core material. For example, because the solder has no melting point, it can be controlled in a softened state at a wide range of connection temperatures, and it is easy to get the thickness and flatness of the electrode. Connection building blocks. Next, a method of using the adhesive tape of this embodiment will be described. As shown in FIG. 3, the disk 3 a of the adhesive tape 1 and the take-up disk 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disk 3 a is installed through the guide pin 22. Go to the take-up tray 7 ′ and roll out the adhesive tape 1 (arrow E in FIG. 3). Next, 'the adhesive tape 1 is arranged on the circuit board 21, and the heating and pressing head 19 arranged between the two plates 3a and 17 is used to perform the pressure bonding of the adhesive tape 1 from the substrate 9 side.' -132- (128) (128) 200409405 1 1 is pressed to the circuit board 2 1. Thereafter, the base material 9 is wound up to a take-up tray 170. Next, as shown in FIG. 4, a wiring circuit (or electronic component) 2 3 is arranged on the adhesive 11 pressed onto the circuit substrate 21, The polytetrafluoroethylene material 24 is used as a buffer material, and the heating and pressing head 9 is used to heat and press the wiring substrate 2 1 to the wiring circuit 2 3. In this way, the electrode 2 1 a of the circuit substrate 21 and the electrode 2 3 a of the wiring circuit 2 3 can be connected. As shown in the connection part of PDP 26 using the adhesive tape 1 of this embodiment in FIG. 29, the adhesive 11 is pressed to the entire periphery of the PDP 26, and the amount of the adhesive 1 1 used at a time will be obvious. More than traditionally used. Therefore, the amount of the adhesive tape 1 wound on the disk 3 a will also increase, because the adhesive tape 1 wound on the disk 3 a will be wound up to the take-up disk in a relatively short time. 17 and the end mark 2 8 of the adhesive material tape 1 wound on the disk 3 a is exposed (see FIG. 5A and FIG. 5A). As shown in FIG. 52A, when the adhesive tape 1 of the disc 3a is exposed to the end mark 28, in order to replace the disc 3a with a new adhesive disc 3, the adhesive tape of the disc 3a (one adhesive tape) ) 1 The terminal part 30 and the starting end part 3 2 of the adhesive tape (the other adhesive tape) 1 wound on the new adhesive tray 3. As shown in FIG. 5B, the connection of the adhesive tape 1 is directed to the terminal portion 30 of the adhesive tape 1 of the adhesive plate 3a and the starting end portion 3 2 of the adhesive tape 1 of the new adhesive plate 3, The adhesive 1 1 side of the starting end portion 3 2 is overlapped on the hot-melt agent layer 9 a of the base material 9 of the terminal end portion 30, and this portion is placed on the table 104. Next, the heating of the adhesive device 15 and the -133- (129) (129) 200409405 indenter 19 are used to heat the overlapping portion to melt the hot-melt agent layer 9a, and the hot-melt agent is solidified by cooling. Connection between the terminal section 30 and the start section 32. In this way, the adhesive tape 1 wound on the used disk 3 a and the adhesive tape 1 wound on the new disk 3 can be connected. Second, the used disk 3 a and the new disk can be connected. 3 are swapped with each other, and a new disk 3 is mounted to the adhesive device 15. Therefore, there is no need to implement a new adhesive tape! Load the work to the reel 17. In addition, since the take-up tray 17 only takes up the base material 9, it can take up several adhesive material trays, reduce the number of replacements of the take-up tray 17, and have good operating efficiency. Here, referring to FIG. 5, the adhesive tape of this embodiment! The manufacturing method will be described. An adhesive 11 made of a mixture of resin and conductive particles 13 was coated on a base material (separator) rolled out from a winder 25 with a coating machine 27, and dried in a drying furnace 29, and then rolled. Take the machine 3 1 to take the original material. The raw material of the rolled adhesive tape 1 is cut to a specific width by a cutting machine 3 3 and wound onto a reel, then the side panels are mounted on the reel from both sides, and they are packed together with the dehumidifying material. -5 ° C ~ -1 0 ° C). Secondly, 'the other embodiments of the invention described in items 47 to 49 of the scope of patent application will be described. In the embodiments described below, the same parts as the above embodiments will be assigned the same symbols and detailed descriptions of those parts will be omitted. Explanation 'The following description is mainly based on the differences from the above embodiment. In the second embodiment shown in Fig. 53, in the base of the adhesive tape 1 -134- (130) 200409405, the hot melt layer 9a is sandwiched between the support layers 9b. As shown in FIG. 3, in order to implement the connection between the adhesive tapes 1, the terminal 30 of the adhesive tape 1 and the other end of the adhesive tape 3 32 are in contact with each other, and the device I 5 is adhered. The heating 19 is performed by heating the hot-melt agent layer 9a. The heating causes the hot-melt hot-melt agent layer 9a to ooze, and the hot-melt is solidified by cooling, and the connection between the adhesive material tapes 1 is performed. In this way, since the hot-melt agent layer 9a is between the support layers 9b, it is possible to prevent the adhesive strength of the hot-melt agent layer 9a from being lowered due to moisture absorption or dust. Embodiments not covered by the inventions described in items 47 to 49 in the scope of the patent application can be modified in various ways as long as they do not depart from the spirit of the inventions described in the scope of the patent application in areas 47 to 47. In the first embodiment, the 'base material 9' is composed of a support layer 9b and three layers of a hot-melt agent layer 9a sandwiching the support layer 9b, but it is not limited to this, and may be four or more layers. In this embodiment, the heating and pressing of the connection part uses a heating and pressure head 19 that is adhesive 15; however, other heaters can also be used to heat the pressure head 19 to heat the connection part and implement the adhesive material. Between connections. Next, the descriptions of the items in the scope of patent applications No. 50 to 51 will be described. These inventions are related to the adhesive bonding of electronic components and circuit substrates, or circuits, and the electrical connection between the two electrodes. They are related to the adhesion and fixation of semiconductor elements (chips) to the lead, such as one of one. Initially press the head from the melt, implement the attachment clip, etc. The attachment is limited to the above 49 items from both sides, and the device is replaced to replace the tape 1 invention into the inter-substrate belt. Wire frame -135- (131) (131) 200409405 Fixing support substrates or lead frame wafers, or adhesive tapes used on semiconductor devices for supporting semiconductor substrates for mounting substrates, in particular, rolls into reels The connection method of the adhesive tape is shaped. Next, the background art of the inventions described in claims 50 to 51 in the scope of patent application will be described. In general, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, bare chip packages, and circuit substrates, or the adhesion and fixation between circuit substrates, and electricity between the two electrodes The method of sexual connection uses adhesive tape. Adhesive tapes are also used in the adhesive films of lead frames, LOC tapes, die attach tapes, micro-BGA CSPs, etc. The purpose is to improve the productivity and reliability of semiconductor devices as a whole. Japanese Patent Application Laid-Open No. 200 1 -2 8400 5 describes a case in which an adhesive material tape on which a substrate is coated with an adhesive material is rolled into a disc shape. In order to prevent the adhesive from being fixed on the substrate or to be easily peeled off, the conventional adhesive tape is treated with silicon on both sides of the substrate. When the adhesive tape is mounted on the adhesive device, a tray of adhesive tape (hereinafter referred to as "adhesive material tray") is mounted on the adhesive device, and the beginning end of the adhesive tape is pulled out and mounted on the take-up tray. Next, from the base material side of the adhesive material tape rolled out from the self-adhesive material tray, the adhesive is pressed onto the circuit board or the like with a heating and pressing head, and the remaining substrate is taken up by a take-up disk. Second, when the adhesive tape of the adhesive material tray is used up, remove the used disk and the take-up disk of the winding substrate, mount the new adhesive material tray to the adhesive device, and install the beginning of the adhesive tape On the take-up reel. -136- (132) (132) 200409405 However, in recent years, with the enlargement of panel screens of PDPs and the like, the adhesion area of circuit boards has also increased, and the amount of adhesive used at one time has also increased. In addition, as the use of the adhesive is expanded, the amount of the adhesive used is also increased. Therefore, the replacement of the adhesive material plate in the electronic equipment manufacturing factory is more frequent. Because the replacement of the adhesive material plate is very troublesome, there is a problem that the production efficiency of the electronic device cannot be improved. To solve this problem, you can consider increasing the number of adhesive tapes wound to the disk to increase the amount of adhesive per disk to reduce the frequency of disk replacement. However, because the width of the adhesive tape is narrower 1 ~ 3mm. Increasing the number of rolls may lead to loose coiling. Furthermore, if the number of rolls is increased, the pressure applied to the adhesive tape rolled into the shape of a tape increases, which may cause the adhesive to leak from both sides of the tape and become a cause of blockage. In addition, if the number of rolls of adhesive tape is increased, the diameter of the disk will also increase, and the existing adhesive device may not be used because it cannot be mounted on the existing adhesive device. Therefore, the object of the invention described in the scope of application for patents Nos. 50 to 51 is to provide a method for connecting adhesive tapes, which can make the replacement of adhesive trays simpler and improve the production efficiency of electronic equipment. Next, with reference to the drawings of the appendix, the embodiments of the invention described in the scope of application for patents Nos. 50 to 51 will be described. First, referring to FIGS. 54 to A, 55, 55, 56, 4, and 29, a δ conversion is performed on the first embodiment of the invention described in items 50 to 51 in the scope of patent application. Bright. Brother 5 4 Figure A ~ C is a sectional view of the connection steps of the connecting part of Brother 5 5 Figure. Figure 5 4 Figure A is the state of the adhesive tape before discharge, Figure 5 4 -137- (133) (133) 200409405 Figure B is the state of the adhesive tape after discharge, and Figure 5 4 is the heating and pressing figure of the connection part. Fig. 55 is an oblique view of the connection between the adhesive plates and the adhesive tape connection method, and Fig. 56 is a schematic diagram of the adhesive pressing step of the adhesive device. The adhesive tape 1 is wound around the disks 3 and 3 a, respectively. Each of the disks 3 and 3 a is provided with a reel 5 and side plates Ί arranged on both width sides of the adhesive tape 1. The adhesive tape 1 is composed of a substrate 9 and an adhesive 11 applied to one side surface of the substrate 9. In terms of strength and peelability of the adhesive 11, the substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, and PET (polyethylene terephthalate), etc., as the release agent 9a. Implement surface treatment. The release agent is olefinic release agent, ethylene glycol octacarbonate, palm wax, petroleum wax and other low melting point wax, low molecular weight fluororesin, silicon or fluorine-based surfactant, oil, wax, Resins, polyester modified silicone resins, etc. are generally silicone resins. The adhesive 11 is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. Thermoplastic resins are typified by styrene resins and polyester resins, and thermosetting resins are typified by epoxy resins, acrylic resins, and silicones. Adhesives 1 1 The conductive particles 1 3 may be dispersed. The conductive particles j 3 are metal particles such as An, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, etc., or carbon, graphite, etc., and may be included in the foregoing and / or non-conductive glass and ceramics. Polymer core materials such as plastic, plastic, etc. cover the aforementioned conductive layers, etc. • 138- (134) 200409405. In addition, the conductive particles, film particles, or conductive particles, insulating particles, etc. may be applied to cover the conductive particles with an insulating layer. The conductive layer formed on a polymer core material such as solder metal or plastic is deformable due to heat and pressure or pressure, so the distance between connections will be reduced, and the area in contact with the circuit will increase during connection. Sex. In particular, it is better to use a polymer as the core material. It has no melting point and can be controlled to soften at a wide range of connection temperatures. It is easy to obtain a component that can easily cope with the thickness and flatness of the electrode. Next, the use of the adhesive tape of this embodiment will be described. As shown in FIGS. 5 and 6, the disk 3 a disk 17 of the adhesive tape 1 is mounted to the adhesive device 15, and the front end of the tape 1 wound on the disk 3 a is mounted to the winding disk 17 via the guide pin 22. , And the tape 1 (arrow E in Figure 56). Next, the circuit board 21 is adhered to the circuit board 21, and the pressure-bonding agent 11 of the adhesive tape 1 is applied to the circuit board 21 from the substrate 9 side by the pressure heads 19 arranged on the two plates 3, 17. Thereafter, the base material 9 is wound up by 17 °. Next, as shown in FIG. 4, a wiring circuit (or electronic component) 2 3 is arranged on the pressure-sensitive adhesive 11 on the circuit board 2, and the olefin material 24 is used as a buffer material. The heating and pressing head 19 applies heat and pressure to the circuit base wiring circuit 23. In this way, the electrode 21a of the board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in Fig. 29, the adhesive tape of this embodiment is used.

之絕緣覆 等之熱熔 ，會具有 後之電極 ，而可提 如焊錫因 狀態，而 差的連接 方法進行 、及捲取 黏著材膠 捲出黏著 材膠帶1 間之加熱 ，將黏著 至捲取盤 1上之黏 聚四氟乙 板21實 接電路基 1 之 PDP -139- (135) (135)200409405 26之連接部份所示，黏著劑11會壓著至PDP 26之周圍 全體，可知一次使用之黏著劑1 1的使用量會遠大於傳統 上之使用量。因此，捲繞於盤3a上之黏著材膠帶1之使 用量亦會增多，捲繞於盤3 a上之黏著材膠帶1在相對較 短之時間內會被捲取至捲取盤1 7，而露出捲繞於盤3 a上 之黏著材膠帶1之結束標記2 8 (參照第5 5圖）。 如第55圖所示，爲了將盤3a更換成新黏著材盤3’ 會在盤3a之黏著材膠帶1上連接盤3a之黏著材膠帶（一 方之黏著材膠帶）1之終端部3 0、及捲繞於新黏著材盤3 上之黏著材膠帶（另一方之黏著材膠帶）1之始端部32。 此黏著材膠帶1之連接上，如第5 4圖B所示’將已 使用之盤3 a之黏著材膠帶1之終端部3 0置於放電機1 05 之照射位置。其次，對基材9之表面實施放電’去除脫模 劑9a。 其次，使另一*方之黏著材膠帶1之始％部32之黏者 劑1 1面重疊於已去除脫模劑9a之基材9面（第54圖c )。將兩者之重疊部份置於工作台，以黏著裝置1 5之加 熱加壓頭1 9進行加熱加壓實施黏著。利用此方式’可實 施捲繞於已使用之盤3 a上之黏著材膠帶1、及捲繞於新 盤3上之黏著材膠帶1之連接。 其次，將已使用之盤3 a及新盤3互相對換，將新盤 3裝著至黏著裝置15。因此，無需實施將新黏著材膠帶1 裝著至捲取盤17之作業。 此實施形態因係利用加熱加壓頭1 9，而無需使用其 -140- (136) (136)200409405 他黏著材膠帶1間之連接器具，即可更換已捲繞著黏著材 膠帶1之盤3、3 a。又，因爲捲取盤1 7只會捲取基材9， 故可捲取數個黏著材盤份，減少捲取盤1 7之更換次數， 而有良好之作業效率。 申請專利範圍第5 0〜5 1項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第5 0〜5 1項 記載之發明之要旨的範圍內，可實施各種變形。 例如，上述之實施形態時，去除已結束捲取之一方之 黏著材膠帶1之基材9之脫模劑9a，將新黏著材膠帶！ 之黏著劑1 1面重疊於此部份，並以加熱加壓頭1 9實施加 熱加壓進行黏著來連接兩者，然而，亦可去除新黏著材膠 帶1之基材9之脫模劑9 a，將已結束捲取之一方之黏著 材膠帶1之黏著劑1 1面重疊於此部份來連接兩者。 去除脫模劑9 a之方法，除了電漿放電以外，亦可以 爲紫外線照射或雷射照射之方法，紫外線照射時，例如將 水銀燈當做光源使用，實施一定時間之水銀燈的紫外線照 射。其次，雷射照射時，則利用以雷射振盪器照射之雷射 光來分解飛散脫模劑9a，去除脫模劑9a。 上述係針對電子構件及電路基板、以及電路基板間之 黏著固定時進行說明，然而，亦可應用於將半導體元件（ 晶片）黏著 固定至引線框架之固定用支持基板、引線框 架之晶片、半導體元件載置用支持基板之半導體裝置所使 用之黏著材膠帶。 其次，針對申請專利範圍第5 2〜5 8項記載之發明進 -141 - (137) 200409405 行說明。 這些發明係關於電子構件及電路基板、或電路 之黏著固定及兩者之電極間之電性連接的黏著材膠 ’係關於在將半導體兀件（晶片）黏者 固疋至引 之固定用支持基板或引線框架之晶片、或半導體元 用支持基板所使用之半導體裝置使用之黏著材膠帶 是，和捲成盤狀之黏著材膠帶盤相關。 其次，針對申請專利範圍第5 2〜5 8項記載之 背景技術進行說明。 一般而言，液晶面板、P D P (電漿顯示面板） 螢光顯示）面板、裸晶片封裝等之電子構件及電路 或電路基板間之黏著固定、以及兩者之電極間之電 方法，係採用黏著材膠帶。 又’黏著材膠帶亦被應用於引線框架之引線固 、：L Ο C膠帶、晶粒結著膠帶等，例如，使用引線固 之目的’係用以固定引線框架之引線銷，提高引線 體或半導體裝置全體之生產性及信賴性。 隨著電子機器之小型 輕量化發展，半導體裝 展被稱爲微B G A (球形陣列）或c S P (晶片尺寸封 小型封裝之開發，前述微BGA (球形陣列）或CSp 尺寸封裝）係在半導體裝置（封裝）下部以區域陣 置其外部端子，這些封裝之構造上，係在具有1層 配線構造之玻璃環氧基板或聚醯亞胺基板等半導體 置用支持基板上，利用黏著劑載置半導體元件（晶 基板間 帶。又 線框架 件載置 ，尤其 發明之 、EL ( 基板、 性連接 定膠帶 定膠帶 框架自 置亦推 裝）之 (晶片 列狀配 或多層 元件載 片）， -142- (138) (138)200409405 半導體元件側之端子及基板之配線板側端子則以絲焊或倒 裝晶片方式連接，連接部、及晶片上面部或端面部以環氧 系密封材或環氧系液狀密封材進行密封，在配線基板背面 以區域陣列狀配置焊球等金屬端子。又，Q F N ( Q u a d F I a t Non-leaded Package )或 SON ( Small Outline Non-leaded Package )等亦採用黏著材膠帶。其次，在電子機器之基 板上，以迴焊方式實施高密度之複數個上述封裝之全面一 齊安裝。其次，利用黏著劑載置引線框架之晶片及半導體 元件（晶片），以絲焊連接半導體元件側之端子及引線框 架端子，以環氧系密封材或環氧系液狀密封材密封連接部 、及晶片上面部或端面部。此種半導體裝置之黏著劑亦採 用黏著材膠帶。 曰本特開200 1 -284005號公報中，電極間之電性連接 方法係將基材上塗布著黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3mm程度，捲取至 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將盤上捲繞著黏著 材膠帶之黏著材膠帶盤裝設至黏著裝置，拉出黏著材膠帶 之始端部並裝設至捲取盤。其次，從自.黏著材膠帶盤捲出 之黏著材膠帶之基材側以加熱加壓頭將黏著劑壓著至電路 基板等，再以捲取盤捲取殘餘之基材。 其次’ 一^方之黏者材膠帶盤之黏著材膠帶用完時，拆 下用完之盤、及捲取基材之捲取盤，將新捲取盤及新黏著 材膠帶盤裝著至黏著裝置，並將黏著材膠帶之始端裝設於 -143- (139) (139)200409405 捲取盤上。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材膠帶盤的更 換更爲頻繁，因爲黏著材膠帶盤之更換十分麻煩，故有無 法提高電子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之膠帶寬度爲較狹窄之1〜 3mm，若增多捲數可能導致捲取散亂。又，若增多捲數， 則作用於捲成膠帶狀之黏著材膠帶的壓力會升高，可能使 黏著劑從膠帶之兩邊滲出而成爲阻塞之原因，或者，盤之 直徑尺寸增大而可能因無法裝著於既存之黏著裝置上而無 法使用既存之黏著裝置。 其次，黏著材膠帶盤若使黏著材膠帶直接曝露於大氣 下，則可能因爲灰塵或濕氣而導致品質降低。 因此，申請專利範圍第5 2〜5 8項記載之發明的目的 ，係在提供一種黏著材膠帶盤，黏著材膠帶盤之更換比較 簡單，而可提高電子機器之生產效率及維持黏著材膠帶之 品質。 其次，參照附錄圖面，以電極連接用之黏著材膠帶爲 例，針對申請專利範圍第52〜58項記載之發明之實施形 態進行說明，然而，半導體元件連接用之黏著材膠帶亦相 -144- (140) (140)200409405 同。首先，參照第57圖A〜C、第3圖、第4圖、第29 圖、及第5 8圖，針對申請專利範圍第5 2〜5 8項記載之發 明之第1實施形態進行說明。第5 7圖A〜C係第1實施 形態之黏著材膠帶盤圖，第5 7圖A係黏著材膠帶盤的斜 視圖，第5 7圖B係第5 7圖A之正面圖，第5 7圖C係第 57圖A之蓋體構件之正面圖，第58圖係黏著材膠帶之製 造方法的步驟圖。 本實施形態之黏著材膠帶盤A，具有複數之黏著材膠 帶1之捲部（以下簡稱爲捲部）2、2a，捲部2、2a具有 已捲繞著黏著材膠帶1之盤3、3a。各盤3、3a上配設著 捲軸5、及配置於黏著材膠帶1之兩寬度側之側板7、7a 、7b。如第3圖所示，黏著材膠帶1係由基材9、及塗布 於基材9之一側面之黏著劑1 1所構成。未使用之捲部2a 上，覆蓋捲繞於盤3a上之黏著材膠帶1之周圍的蓋體構 件8，以可自由裝卸之方式裝設於盤3 a上。 又，捲部2、2a之內側之側板7a上，配設著乾燥劑 1 〇之收容部（收容空間）1 2，收容剖1 2內收容著矽凝膠 等乾燥劑1 〇，用以從內部去除未使用之捲部2 a內之濕氣 〇 從強度、及構成向異導電材之黏著劑之剝離性而言， 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 -145- (141) (141)200409405 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系 係以苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表 〇 黏著劑1 1內亦可分散著導電粒子1 3。導電粒子1 3 係如 An、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬 粒子、或碳、石墨等，亦可在前述之物及/或非導電性之 玻璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形 成。此外’亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆 膜粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔 融金屬、或塑膠等之高分子核材上形成導電層者，會具有 因加熱加壓或加壓而產生變形之變形性，故連接後之電極 間距離會縮小’連接時可增加和電路接觸之面積，而可提 高信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因 沒有融點，在廣泛之連接溫度下亦可控制於軟化狀態，而 可得到很容易即可對應電極之厚度及平坦性之誤差的連接 構件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第3圖所示，將黏著材膠帶盤A、及捲取盤17 裝著至黏著裝置15，將一方之黏著材膠帶1之始端部經 由導引銷22裝設至捲取盤17，並捲出黏著材膠帶1 (第 3圖中之箭頭E)。其次，將黏著材膠帶1配置於電路基 板2 1上，利用配置於兩盤3、1 7間之加熱加壓頭1 9從基 材9側實施黏著材膠帶1之壓接，將黏著劑Π壓著至電 -146 - (142) 200409405 路基板2 1。其後，將基材9捲取至捲取盤1 7。 其次，如第4圖所示，在壓著至電路基板2 1上 著劑1 1上配置配線電路（或電子構件）2 3，將聚四 烯材2 4當做緩衝材，以加熱加壓頭1 9對電路基板' 施配線電路2 3之加熱加壓。利用此方式，可連接電 板21之電極21a及配線電路23之電極23a。 如第29圖之利用本實施形態之黏著材膠帶1之 26之連接部份所示，黏著劑1 1會被壓著至PDP 26 圍全體，一次使用之黏著劑1 1的使用量會遠大於傳 之使用量。因此，黏著材膠帶1之使用量亦較多，捲 盤3、3a上之黏著材膠帶1會在相對較短之時間內被 至捲取盤1 7。 在一方之捲部2之黏著材膠帶1上露出結束標記 將其更換成新捲部2a之黏著材膠帶1。本實施形態 未使用之捲部2a上，配設著蓋體構件8，拆下此蓋 件8後，捲出黏著材膠帶1並將其裝設至捲取盤1 7。 如此，一方之捲部2全部捲出時，可將另一方之 2a之黏著材膠帶1裝設至捲取盤17而實施黏著材膠 之更換，故無需將新黏著材膠帶盤裝著至黏著裝置 因此，只需較少之新黏著材膠帶盤之更換作業，故可 電子機器之生產效率。 又，因爲未使用之捲部2a上配設著蓋體構件8 著材膠帶1不會直接曝露於大氣下，故黏著材膠帶1 因灰塵或濕氣而發生黏著力降低等情形。因此，即使 之黏 氟乙 實 路基 PDP 之周 統上 繞於 捲取 時， 時， 體構 捲部 帶1 15° 提高 ，黏 不易 配設 -147- (143) (143)200409405 著複數捲部2、2 a時，亦可利用在未使用之捲部2 a上配 設蓋體構件8來防止黏著材膠帶1之品質降低。 又，因爲捲取盤1 7只會捲取基材9，故可捲取數個 黏著材膠帶盤份而減少捲取盤1 7之更換次數，而有良好 之作業效率。 此處’參照第5 8圖，針對本實施形態之黏著材膠帶 盤A之製造方法進行說明。 在從捲出機25捲出之基材（separator)上，以塗布 機2 7塗布由樹脂及導電粒子1 3混合而成之黏著劑，並以 乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料。被捲 取之黏著材膠帶之原始材料，以切割機3 3切成特定寬度 並捲取至捲軸後，從兩側將側板7、7 a、7 b裝著於捲軸上 ，然後，實施蓋體構件8之裝著，將其和除濕材一起綑包 ，實施低溫（-5 °C〜-1 〇t )之管理並進行出貨。 其次，針對申請專利範圍第5 2〜5 8項記載之發明之 其他實施形態進行說明，和上述實施形態相同之部份會附 與相同符號並省略該部份之詳細說明，以下之說明係以和 上述實施形態不同之點爲主。 第59圖所示之第2實施形態時，裝設於捲部2、2a 之蓋體構件8，具有黏著材膠帶1之拉出口 1〇6。此時， 因爲可從蓋體構件8之拉出口 106捲出黏著材膠帶1，不 拆下捲部2、2 a之蓋體構件8亦可從捲部2、2 a直接捲出 黏著材膠帶1。 第6 0圖A及B所示之第3實施形態時，捲部2、2 a -148- (144) (144)200409405 、2 b係不同之個體，以可自由滑動方式，裝設於黏著裝 置15本體上之軸1〇7上。其次，一方之捲部2全部捲出 時，拆下裝設於軸1 0 7之前端的蓋帽1 0 8，從黏著裝置1 5 取下一方之捲部2。其次，使另一方之捲部2 a移動至黏 著位置並拆下蓋體構件8後，將另一方之捲部2a之黏著 材膠帶1捲裝至捲取盤17，實施黏著材膠帶1之更換。 此時，因爲複數之捲部2、2a、2b係不同之個體，故很容 易處理。 第6 1圖所示之第4實施形態時，和第3實施形態相 同，捲部2、2a、2b係不同之個體，使捲部2、2a、2b之 側板7、7a互相嵌合，將其裝著至黏著裝置1 5。如第6 1 圖所示，另一方之捲部2a之側板7a上，配設著橫剖面略 呈π字形之被嵌合部1 1 0，將配設於一方之捲部2之側板 7上之被嵌合部4 9，從上側嵌合至被嵌合部1 1 0，可連接 兩者。將全部捲出之一方之捲部2從黏著裝置1 5拆下時 ，只要將一方之捲部2向上提起即可解除嵌合，很簡單即 可拆下一方之捲部2。 申請專利範圍第5 2〜5 8項記載之發明並未受限於上 述之實施形態，只要在未背離申請專利範圍第5 2〜5 8項 記載之發明之要旨的範圍內，可實施各種變形。 例如，上述之實施形態時，捲部2、2 a之數量並無特 別限制，可以爲任意個。 第4實施形態時，係以使側板7、7a上下滑動來嵌合 一方及另一方之捲部2、2a，然而，亦可在一方之側板7 -149- (145) (145)200409405 上形成嵌合孔，而在另一方之側板7 a上配設嵌合突起， 並從膠帶之寬度方向將嵌合突起壓入嵌合孔內來使兩者嵌 合。 第3 1圖A、B係用以實施引線框架之固定用支持基 板、半導體元件載置用支持基板、或引線框架之晶片和半 導體元件之連接1黏著材膠帶當中，將半導體元件黏著 固定於引線框架之固定用支持基板及引線框架之L0C ( Lead on Chip)構造的1個實例。 實施厚度50// m之表面處理之聚醯亞胺膜等支持膜 78之兩面，係採用兩面具有厚度25/zm之聚醛亞胺系黏 著劑層等之黏著劑層80之具有如第31圖A之構成之黏 著材膠帶，而可得到第31圖B所示之LOC構造之半導體 裝置。將第31圖A所示之黏著材膠帶，以第32圖A〜C 所示之黏著裝置之冲切模具8 7 (公模（凸部）9 5、母模 (凹部）9 6 )冲切成細長形，例如，在厚度0.2 m m之鐵-鎳合金製引線框架上，以4〇〇 °C、3 MPa之壓力、3秒鐘之 加壓實施壓著，形成0.2 m m間隔、〇 . 2 m m寬度之內引線 ，製成附有半導體用黏著膜之引線框架。其次，在其他步 驟實施3 5 (TC之溫度、3 Μ P a之壓力、3秒鐘之加壓，將半 導體元件壓著至此附有半導體用黏著膜之引線框架之黏著 劑層面，其後，以金線實施引線框架及半導體元件之絲焊 ’以連續成形使用環氧樹脂成形材料等密封材實施密封， 得到第31圖B所示之半導體裝置。第31圖A、B中，81 係以黏著材膠帶冲切所得之半導體用黏著膜，54係半導 -150- (146) (146)200409405 體兀件’ 8 3係引線框架’ 8 4係密封材，8 5係焊絲，8 6係 匯流排條。第3 2圖A、B、C係黏著裝置，第3 2圖A、B 中’ 8 7係冲切模具，8 8係引線框架搬運部，6 1係黏著劑 膠帶冲切貼附部，9 0係加熱器部，9丨係黏著材膠帶盤（ 黏著材膠帶捲出部），92係黏著材膠帶（半導體用黏著 膜），93係黏著材膠帶捲出滾輪。又，第32圖c中，94 係黏著材膠帶（半導體用黏著膜），95係公模（凸部） ，9 6係母模（凹部）’ 9 7係膜壓板。黏著材膠帶9 2會從 黏著材膠帶盤（黏著材膠帶捲出部）91連續捲出，並在 黏著材膠帶冲切貼附部8 9冲切成細長形且黏著至引線框 架之引線部份，將其視爲附有半導體用黏著膜之引線框架 而從引線框架搬運部搬出。冲切所得之黏著材膠帶則從黏 著材膠帶捲出滾輪93搬出。 和上述相同，利用黏著材膠帶將半導體元件連接至半 導體元件載置用支持基板。又，以同樣方法實施引線框架 之晶片及半導體元件之連接 黏著。黏著材膠帶只單純用 於黏著 固定時，可以電極間之接觸、或以導電性粒子實 施電性連接，而對應目的來選擇使用之黏著劑，若利用支 持膜，則有時會單純由黏著劑所構成。 其次，針對申請專利範圍第5 9項記載之發明進行說 明。 此發明係關於將電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接之黏著劑壓著 至電路基板之黏著具。 -151 - (147) (147)200409405 其次，針對申請專利範圍第5 9項記載之發明之背景 技術進行說明。 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著劑膠帶。 日本特開200 1 -284005號公報，係記載著將在基材上 塗布黏著劑之黏著劑膠帶捲取盤狀者，將此黏著劑膠帶之 盤（以下稱爲「黏著劑盤」）裝著於自動黏著機械來使用 〇 自動黏著機械具有黏著劑盤之裝著部、空盤之裝著部 、配設於前述盤間之加熱加壓構件、以及用以載置基板之 工作台’從黏著劑盤將黏著劑膠帶拉出至基板上，利用加 熱加壓構件從基材之背面側實施黏著劑膠帶之加熱加壓， 將黏著劑壓著至基板上。 然而，傳統之自動黏著機械較爲大型，欲在部份基板 上實施黏著劑之壓著時、壓著黏著劑之面積較小時、或暫 時壓著時等，會因爲較爲大型，反而有不易操作之問題。 另一方面，若爲和此種大型自動黏著機械不同之小型 卻可很簡單地進行操作，故在局部或暫時壓著時，希望能 有不使用大型裝置卻可實施黏著劑之壓著的器具。 因此，申請專利範圍第5 9項記載之發明的目的，係 提供一種黏著具，十分小型且可以單手操作，並且很容易 即可對基板之一部份實施黏著劑之壓著。 -152- (148) (148)200409405 其次，參照附錄圖面，針對申請專利範圍第5 9項記 載之發明之實施形態進行說明。第62圖A及b係申請專 利範圍第5 9項記載之發明之第1實施形態之黏著具圖， 弟62圖A係黏者具之斜視圖’弟62圖B係第62圖A之 A-A剖面圖，第63圖係用以說明第62圖A及b所示之 黏著具之使用方法的側面圖，第64圖係黏著具之製造方 法的步驟圖。 本實施形態之黏著具1 1 1之主要構成係一方之盤（供 應盤）3、另一方之盤（空盤）5、以及收容前述盤之殼體 99，一方之盤3上捲繞著黏著劑膠帶1，黏著劑膠帶1之 一端9 a則固定於另一方之盤5。 殼體9 9之形成上，係可以單手把持之尺寸，從側面 觀看時，角部具有弧度而大致呈三角形，係容易把持之形 狀。略呈三角形之殼體99之角部上，會形成開口部 ，黏著劑膠帶9會從此開口部1 1 3露出。 又，開口部1 1 3上突設著加熱構件1〗4，從側面觀看 時，此加熱構件1 14亦略呈三角形，用以引導從上面13a 沿著下面1 3 b拉出之黏者劑膠帶1 ’其下面側配設著電熱 板 1 1 5。 加熱構件1 1 4之形狀呈棒狀’在以電熱板1 1 5覆蓋加 熱構件1 1 4之情形下拉出黏著材膠帶9時，可利用加熱構 件1 1 4之旋轉而順利拉出膠帶9。又，電熱板1 1 5之外側 若配設聚四氟乙烯、矽橡膠、或雙方，則實施黏著劑9之 壓著時，可獲得均一之壓力。 -153- (149) (149)200409405 殼體99係由半殼體99a、9 9b嵌合而成，一方及另一 方之盤3、5係收容於殼體內。殼體內配設著導引件1 6， 用以引導黏著劑膠帶丨之移動。又，殼體99a或7b之其 中任一方之底面之一方上，會形成板狀之導引件，在使此 導引件抵壓至電路基板之邊緣之情形下，將黏著劑壓著至 電路基板，則可沿著電路基板實施精度良好之黏著劑壓著 〇 一方之盤3上會以同軸方式固定著一方之齒輪116, 另一方之盤17上亦以同軸方式固定著另一方之齒輪117 ，一方之齒輪116及另一方之齒輪117會互相齒合，當一 方之盤3旋轉而使黏著劑膠帶1被拉出時，另一方之盤 I 7會實施黏著劑膠帶1之拉出量的旋轉，並捲取基材9。 又’齒輪單元118係由一方之齒輪116及另一方之齒輪 II 7所構成。 又，殼體9 9之側面配設著對加熱構件1 1 4供應電力 之第三殼體（電源手段）119，第三殼體119內除了收容 乾電池以外，尙會收容供應給加熱構件1 1 4之電力之調整 電路。又，第三殼體1 1 9上配設著電源開關1 2 0，可以把 持黏著具1 1 1之手的.手指實施ΟΝ/OFF之操作。 如第62圖B所示，黏著劑膠帶1上之基材9之單面 上塗布著黏著劑1 1。 本實施形態時，黏著劑膠帶1之長度約爲20m、寬度 W 約爲 1 . 2 m m。 從強度、及構成向異導電材之黏著劑之剝離性而言， -154- (150) (150)200409405 基材9應由OPP (延伸聚丙烯）、聚四氟乙烯、或經過矽 處理之PET (聚對苯二甲酸乙二酯）等所構成，然而，並 不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物、或熱金屬系。熱 可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代表，又 ，熱硬化性樹脂系係以環氧樹脂系、乙烯基酯系樹脂、壓 克力系樹脂、及矽樹脂系爲代表。 黏著劑1 1內分散著導電粒子1 3。導電粒子1 3係如 An、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬粒子 、或碳、石墨等，亦可在前述之物及/或非導電性之玻璃 、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形成。 此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆膜粒 子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔融金 屬、或塑膠等之高分子核材上形成導電層者，會具有因加 熱加壓或加壓而產生變形之變形性，故連接後之電極間距 離會縮小，連接時可增加和電路接觸之面積，而可提高信 賴性。尤其是，以高分子類做爲核材更佳，如焊錫因沒有 融點，在廣泛之連接溫度下亦可控制於軟化狀態，而可得 到很容易即可對應電極之厚度及平坦性之誤差的連接構件 〇 其次，針對本實施形態之黏著具111之使用方法進行 說明。如第63圖所示，以單手握持黏著具11 1，將電源 開關1 2 0切至ON。其次，使露出黏著劑膠帶1之開口部 -155- (151) (151)200409405 1 1 3抵壓電路基板2 7。因爲開口部1 1上之黏著劑膠帶】 之基材9側配設著加熱構件1 1 4，壓附位於加熱構件1 1 4 下面側之黏著劑膠帶1，對電路基板2 7實施黏著劑Π之 加熱壓著。 在將黏著具π 1壓向下方之狀態下朝前方（第63圖 中之箭頭E )移動，會依序拉出黏著劑膠帶1，加熱構件 1 1 4會朝E方向前進，同時，新黏著劑9會位於加熱構件 1 1 4之下，而將黏著劑1 1依序壓著至電路基板2 7。 如此，從一方之盤3拉出黏著劑膠帶1時，因一方之 盤3會旋轉，故和一方之盤3以同軸方式固定之一方之齒 輪116亦會旋轉，和其齒合之另一方之齒輪117亦會隨之 旋轉，而將已剝離黏著劑2 5之基材9捲取至另一方之盤 17。 利用本實施形態，欲將黏著劑1 1壓著至電路基板2 7 上之任意位置時，只要以單手握持黏著具111並向前推， 很簡單即可實施黏著劑1 1之壓著。如此，因爲很黏著劑 1 1之壓著很簡單，特別適合例如將電子構件（配線電路 )3 7暫時黏著於電路基板2 7上時、或只對電路基板2 7 之一部份實施電子構件（配線電路）3 7之壓著時。 上述之壓著後（暫時連接），實施電路基板27之電 極及電子構件（配線電路）3 7之電極的定位並進行正式 連接。正式連接上，對電路基板2 7實施黏著劑1 1之壓著 後’在黏著劑1 1上配置電子構件（配線電路）3 7，必要 時’可將聚四氟乙嫌材3 9當做緩衝材，以加熱加壓頭1 9 -156- (152) (152)200409405 對電路基板2 7實施電子構件（配線電路）3 7之加熱加障 (寥1照弟4圖）。利用此方式’可連接固定電路基板？ 7 之電極27a及電子構件（配線電路）37之電極37a。 又’因爲構成上，黏著劑膠帶1係收容於殼體9 9 Θ 且直接使用，故十分容易處理而具有良好之作業性。 此處，參照第64圖，針對本實施形態之黏著具ln 之製造方法進行說明。 在從捲出機25捲出之基材（separator) 23上，以涂 布機2 8塗布由樹脂及導電粒子1 3混合而成之黏著劑，並 以乾燥爐29實施乾燥後，以捲取機3 1捲取原始材料。被 捲取之黏著劑膠帶之原始材料，在整修步驟中以切割_ 33切成特定寬度並捲取至盤3後，以夾於半殼體99 a、 9 9b間之方式嵌合一方之盤3及另一方之盤（空盤）5, 且組裝收容著加熱構件1 1 4及乾電池等之第三殻體1〗9， 製成黏著具111。 將黏著具1 1 1和除濕材一起綑包，實施低溫（-5 t 〜-1 〇 °C )之管理並進行出貨。 其次，針對申請專利範圍第60〜64項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接的黏著材膠帶 ，尤其是，和捲成盤狀之黏著材膠帶相關。 其次，針對申請專利範圍第60〜64項記載之發明之 背景技術進行說明。 -157- (153) (153)200409405 一般而言，液晶面板、PDP (電漿顯示面板）、EL ( 螢光顯示）面板、裸晶片封裝等之電子構件及電路基板、 或電路基板間之黏著固定、以及兩者之電極間之電性連接 方法，係採用黏著材膠帶。 日本特開200 1 -2 84005號公報，係記載著將在基材上 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3 mm程度，捲取至 盤之膠帶之長度爲50m程度，黏著材膠帶從盤捲出並將 黏著劑壓著至電路基板等後，即不會再度使用。 然而，近年來，隨著PDP等之面板畫面之大型化， 電路基板之黏著面積亦增大，一次使用之黏著劑的使用量 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材盤的更換更 爲頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電 子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，因爲黏著材膠帶之厚度較厚，很難增加每1盤 之捲數。 又，若考慮減少黏著材膠帶之厚度，則因爲使用經過 矽處理之PET (聚對苯二甲酸乙二酯）當做基材，基材之 厚度若太薄，會有容易發生基材伸展或斷裂等之問題。 因此，申請專利範圍第60〜64項記載之發明的目的 ，係在提供一種黏著材膠帶，可增加每1盤之捲數，而提 -158- (154) 200409405 高電子機器之生產效率。The thermal insulation of the insulation coating and the like will have the latter electrode, which can be used to improve the connection method such as solder due to the state, and heating the adhesive tape to roll out the adhesive tape to heat the adhesive tape. The polytetrafluoroethylene board 21 on 1 is connected to the PDP -139- (135) (135) 200409405 26 of the circuit base 1 as shown in the connection part. The adhesive 11 will be pressed to the entire periphery of the PDP 26. It can be known once The amount of the used adhesive 11 will be much larger than the conventional amount. Therefore, the amount of the adhesive tape 1 wound on the disk 3a will also increase, and the adhesive tape 1 wound on the disk 3a will be wound up to the take-up disk 17 in a relatively short period of time. On the other hand, the end mark 2 8 of the adhesive tape 1 wound on the disk 3 a is exposed (see FIG. 5 5). As shown in FIG. 55, in order to replace the disc 3a with a new adhesive material disc 3 ', the adhesive material tape 1 of the disc 3a (one adhesive material tape) 1 is connected to the terminal part 3 of the adhesive material tape 1 of the disc 3a. And the starting end portion 32 of the adhesive tape (the other adhesive tape) 1 wound on the new adhesive tray 3. The connection of this adhesive tape 1 is as shown in Fig. 54B ', and the terminal portion 30 of the used adhesive tape 1 of the disc 3a is placed at the irradiation position of the discharger 105. Next, the surface of the substrate 9 is subjected to discharge 'to remove the release agent 9a. Next, the first side of the adhesive agent 11 of the first% portion 32 of the other adhesive tape 1 is superimposed on the 9 side of the base material from which the release agent 9a has been removed (Fig. 54c). The overlapping part of the two is placed on a workbench, and the heating and pressing head 19 of the adhesive device 15 is used for heating and pressing to perform adhesion. In this way, the connection of the adhesive tape 1 wound on the used disk 3a and the adhesive tape 1 wound on the new disk 3 can be performed. Next, the used disk 3a and the new disk 3 are exchanged with each other, and the new disk 3 is mounted on the adhesive device 15. Therefore, it is not necessary to perform the operation of mounting the new adhesive tape 1 on the take-up reel 17. In this embodiment, the heating and pressure head 19 is used, and it is not necessary to use the connecting device between the -140- (136) (136) 200409405 other adhesive material tape, and the disc on which the adhesive material tape 1 is wound can be replaced. 3 and 3 a. In addition, since the winding disk 17 can only take up the substrate 9, several adhesive material disks can be taken up, the number of replacements of the winding disk 17 can be reduced, and the operation efficiency is good. The inventions described in the scope of patent application No. 50 to 51 are not limited to the above-mentioned embodiments, as long as they do not depart from the spirit of the inventions described in scope of the patent application No. 50 to 51, various modifications can be implemented. . For example, in the above-mentioned embodiment, the release agent 9a of the base material 9 of the adhesive material tape 1 that has been wound up is removed, and a new adhesive material tape is removed! The adhesive 1 1 is superimposed on this part, and the heating and pressure head 19 is connected to the two by bonding under heat and pressure. However, the release agent 9 of the substrate 9 of the new adhesive tape 1 can also be removed. a. One side of the adhesive material 1 of the adhesive material tape 1 that has been wound up is superposed on this part to connect the two. In addition to the plasma discharge, the method for removing the release agent 9a may also be a method of ultraviolet irradiation or laser irradiation. In the case of ultraviolet irradiation, for example, a mercury lamp is used as a light source, and ultraviolet irradiation of the mercury lamp is performed for a certain period of time. Next, in the case of laser irradiation, the scattered light release agent 9a is decomposed and the release agent 9a is removed by using laser light irradiated with a laser oscillator. The above description is for electronic components and circuit substrates, and for adhesion between circuit substrates. However, it can also be applied to a support substrate for fixing a semiconductor element (chip) to a lead frame, a wafer for a lead frame, or a semiconductor element. Adhesive tape for semiconductor devices for supporting substrates for mounting. Next, the inventions described in Items 5 2 to 58 of the scope of application for patents will be described in -141-(137) 200409405. These inventions are related to the bonding of electronic components and circuit substrates, or the adhesion and fixation of circuits and the electrical connection between the two electrodes. They are related to the support for fixing the semiconductor element (chip) to the lead. The adhesive tape used on a substrate or a lead frame wafer or a semiconductor device used for a semiconductor element supporting substrate is related to a disk-shaped adhesive tape tape. Next, the background art described in items 52 to 58 of the scope of patent application will be described. In general, electronic components such as liquid crystal panels, PDP (plasma display panel) panels, bare chip packages, and circuits or circuit substrates are adhered and fixed, and the electrical method between the two electrodes is adhered. Wood tape. Also, 'adhesive tape is also used for lead frame lead: L OC tape, die-bonding tape, etc., for example, the purpose of using lead fixing' is to fix the lead pin of the lead frame, improve the lead body or Productivity and reliability of the entire semiconductor device. With the development of miniaturization and lightweight of electronic equipment, the semiconductor assembly exhibition is called micro BGA (spherical array) or c SP (development of chip-sized package small packages, the aforementioned micro-BGA (spherical array) or CSp-sized package) is used in semiconductor devices. (Packages) The external terminals are arranged in the area array in the lower part. The structure of these packages is on a semiconductor mounting support substrate such as a glass epoxy substrate or a polyimide substrate with a one-layer wiring structure, and the semiconductor is mounted with an adhesive. Components (belt between crystal substrates and wire frame components, especially the invention of EL (substrates, substrates, tapes, and tape frames are also installed by themselves) (wafer array or multilayer component carrier), -142 -(138) (138) 200409405 The terminals on the semiconductor element side and the terminals on the wiring board side of the substrate are connected by wire bonding or flip-chip, and the connecting part and the upper surface or end surface of the wafer are made of epoxy-based sealing material or epoxy. It is sealed with a liquid sealing material, and metal terminals such as solder balls are arranged in an area array on the back of the wiring substrate. QFN (Q uad FI at Non-leaded Package) or SON (Sma ll Outline Non-leaded Package) etc. also use adhesive tape. Secondly, on the substrate of electronic equipment, a high-density implementation of the above-mentioned multiple packages are installed together. Second, the lead frame is mounted with an adhesive. Wafers and semiconductor elements (wafers) are connected to terminals on the semiconductor element side and lead frame terminals by wire bonding, and the connection portion is sealed with an epoxy-based sealing material or an epoxy-based liquid sealing material, and the wafer upper surface or end surface portion. Adhesive tape is also used as an adhesive for semiconductor devices. In Japanese Patent Application Laid-Open No. 200 1-284005, an electrical connection method between electrodes is a method in which an adhesive tape coated with an adhesive on a substrate is rolled into a disc shape. The width of this type of traditional adhesive tape is about 1 ~ 3mm, and the length of the tape wound up to the tray is about 50m. When the adhesive tape is mounted on the adhesive device, the adhesive tape tape with the adhesive tape wound on the tray Install to the adhesive device, pull out the starting end of the adhesive tape and install it on the take-up tray. Next, heat from the base material side of the adhesive tape rolled out from the self-adhesive tape. The indenter presses the adhesive to the circuit substrate, etc., and then takes up the remaining substrate with a take-up disk. Next, when the adhesive tape of the one-sided adhesive tape tray is used up, remove the used disk, And a reel for winding the substrate, mount the new reel and the new adhesive tape tray to the adhesive device, and install the beginning of the adhesive tape at -143- (139) (139) 200409405 take-up tray However, in recent years, with the enlargement of panel screens such as PDPs, the adhesion area of circuit substrates has also increased, and the amount of adhesive used at one time has also increased. Moreover, due to the expansion of the use of adhesives, adhesives Its usage has also increased. Therefore, the adhesive tape reels of electronic equipment manufacturing plants are changed more frequently. Because the replacement of adhesive tape reels is very troublesome, there is a problem that the production efficiency of electronic equipment cannot be improved. To solve this problem, you can consider increasing the number of adhesive tapes wound to the disk to increase the amount of adhesive per disk to reduce the frequency of disk replacement. However, because the width of the adhesive tape is narrower 1 ~ 3mm. Increasing the number of rolls may lead to loose coiling. Moreover, if the number of rolls is increased, the pressure applied to the adhesive tape rolled into a tape shape may increase, which may cause the adhesive to leak out from both sides of the tape and cause blockage, or the diameter of the disk may increase due to the increase in the diameter. Cannot be mounted on an existing adhesive device and cannot be used. Second, if the adhesive tape is exposed directly to the atmosphere, the quality may be reduced due to dust or moisture. Therefore, the purpose of the inventions described in the 52nd to 58th patent applications is to provide an adhesive tape tray. The replacement of the adhesive tape tray is relatively simple, which can improve the production efficiency of electronic equipment and maintain the adhesive tape. quality. Next, referring to the drawings of the appendix, the adhesive material tape for electrode connection is taken as an example to describe the embodiment of the invention described in claims 52 to 58 of the patent application scope. However, the adhesive material tape for semiconductor device connection is also -144. -(140) (140) 200409405 Same. First, referring to Figs. 57 to A, Figs. 3, 4, 29, and 58, the first embodiment of the invention described in items 52 to 58 of the scope of patent application will be described. Figs. 5 to 7 are diagrams of the adhesive tape tape of the first embodiment, Fig. 57 is a perspective view of the adhesive tape tape of Fig. 5 to Fig. A, and Fig. 5 is a front view of Fig. 5 to Fig. Fig. 7C is a front view of the cover member in Fig. 57A, and Fig. 58 is a step diagram of a method for manufacturing an adhesive tape. The adhesive material tape tray A of this embodiment has a plurality of roll portions (hereinafter referred to as roll portions) 2, 2a of the adhesive material tape 1, and the roll portions 2, 2a have the disks 3, 3a on which the adhesive material tape 1 has been wound. . Each of the disks 3 and 3a is provided with a reel 5 and side plates 7, 7a, 7b arranged on both width sides of the adhesive tape 1. As shown in Fig. 3, the adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side surface of the base material 9. The unused roll portion 2a is provided with a cover member 8 covering the periphery of the adhesive tape 1 wound on the disk 3a, and is detachably mounted on the disk 3a. Further, the side plate 7a on the inner side of the roll sections 2 and 2a is provided with a storage section (storage space) 12 for the desiccant 10, and a desiccant 10 such as silicone gel is contained in the storage section 12 for Internally remove the moisture in the unused coil 2a. From the viewpoint of strength and peelability of the adhesive constituting the different conductive material, the substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or It is made of silicon-treated PET (polyethylene terephthalate), etc., however, it is not limited to this. Adhesive 1 1 is a mixture of thermoplastic resin, thermosetting resin, or -145- (141) (141) 200409405 thermoplastic resin and thermosetting resin. Thermoplastic resins are typified by styrene resins and polyester resins, and thermosetting resins are typified by epoxy resins, acrylic resins, and silicones. Adhesives 1 1 The conductive particles 1 3 may be dispersed. The conductive particles 1 3 are metal particles such as An, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, etc., or carbon, graphite, etc., and may be included in the foregoing and / or non-conductive glass and ceramics. Polymer core materials such as plastic and plastic are formed by covering the aforementioned conductive layer. In addition, it is also possible to use insulating film particles that cover the aforementioned conductive particles with an insulating layer, or conductive particles and insulating particles for use. When a conductive layer is formed on a hot molten metal such as solder or a polymer core material such as plastic, it will have deformability due to heat and pressure or pressure, so the distance between electrodes after connection will be reduced. Can increase the area of contact with the circuit, and improve reliability. In particular, it is better to use polymers as the core material. For example, because the solder has no melting point, it can be controlled in a softened state at a wide range of connection temperatures, and it is easy to get the thickness and flatness of the electrode. Connection building blocks. Next, a method of using the adhesive tape of this embodiment will be described. As shown in FIG. 3, the adhesive tape tape A and the take-up tray 17 are attached to the adhesive device 15, and the starting end of one adhesive tape 1 is attached to the take-up tray 17 via the guide pin 22, and Take out the adhesive tape 1 (arrow E in Fig. 3). Next, the adhesive tape 1 is arranged on the circuit board 21, and the heating and pressing head 19 disposed between the two plates 3 and 17 is used to perform pressure bonding of the adhesive tape 1 from the substrate 9 side, and the adhesive Π Crimp to electricity -146-(142) 200409405 circuit board 2 1. After that, the base material 9 is taken up to a take-up tray 17. Next, as shown in FIG. 4, a wiring circuit (or an electronic component) 2 3 is arranged on the adhesive 11 pressed onto the circuit substrate 21 1, and a polytetraene material 2 4 is used as a buffer material to heat the pressure head. 19 Apply heat and pressure to the circuit board 2 and apply the wiring circuit 2 3. In this way, the electrode 21a of the board 21 and the electrode 23a of the wiring circuit 23 can be connected. As shown in the connection part of the adhesive tape 1 26 of this embodiment shown in FIG. 29, the adhesive 11 will be pressed to the whole of the PDP 26, and the amount of the adhesive 1 1 used at a time will be much greater than The amount used. Therefore, the adhesive tape 1 is also used in a large amount, and the adhesive tape 1 on the reels 3 and 3a will be taken to the take-up tray 17 in a relatively short time. The end mark is exposed on the adhesive tape 1 of one of the rolls 2 and it is replaced with the adhesive tape 1 of a new roll 2a. A cover member 8 is disposed on the unused roll portion 2a of this embodiment. After removing the cover member 8, the adhesive tape 1 is rolled out and mounted on the take-up tray 17. In this way, when all the rolls 2 of one side are rolled out, the adhesive tape 1 of the other 2a can be mounted on the take-up tray 17 to replace the adhesive of the adhesive, so there is no need to install a new adhesive tape to the adhesive. The device therefore requires less replacement work of the new adhesive tape tape, so the production efficiency of the electronic machine can be improved. In addition, since the unused roll portion 2a is provided with a cover member 8 and the adhesive tape 1 is not directly exposed to the atmosphere, the adhesive tape 1 may have reduced adhesion due to dust or moisture. Therefore, even when the fluorinated vinyl roadbed PDP system is wound around the winding system, the structure roll section is raised by 15 °, and it is not easy to configure the sticky section. -147- (143) (143) 200409405 At 2 and 2 a, a cover member 8 may be provided on the unused roll 2 a to prevent the quality of the adhesive tape 1 from being lowered. In addition, since the take-up tray 17 can only take up the substrate 9, several adhesive tape tapes can be taken up and the number of replacements of the take-up tray 17 can be reduced, and the operation efficiency is good. Here, a method of manufacturing the adhesive tape tape A of this embodiment will be described with reference to Figs. On the substrate (separator) unwound from the unwinder 25, an adhesive made of a mixture of resin and conductive particles 13 was coated with a coating machine 27, and dried in a drying furnace 29, and then a winding machine was used. 3 1 Take up the original material. The raw material of the rolled adhesive tape is cut into a specific width by a cutting machine 3 3 and rolled up to the reel, and the side plates 7, 7 a, 7 b are mounted on the reel from both sides, and then the cover is implemented. The component 8 is mounted, and it is packed together with a dehumidifying material, and is managed at a low temperature (-5 ° C to -10 t) and shipped. Next, other embodiments of the invention described in the 52nd to 58th scope of the patent application will be described. The same parts as the above embodiments will be given the same symbols and detailed descriptions of the parts will be omitted. The following description is based on The difference from the above embodiment is mainly. In the second embodiment shown in FIG. 59, the cover member 8 attached to the roll portions 2 and 2a has a pull-out opening 106 of an adhesive tape 1. At this time, since the adhesive tape 1 can be rolled out from the pull-out opening 106 of the cover member 8, the adhesive member tape 8 can also be directly rolled out from the roll sections 2, 2a without removing the roll section 2, 2a. 1. In the third embodiment shown in FIGS. 60A and B, the rolls 2 and 2a -148- (144) (144) 200409405 and 2b are different individuals, and they can be attached to the adhesive in a freely sliding manner. The shaft of the device 15 is 107. Next, when all the rolls 2 are rolled out, the cap 108 attached to the front end of the shaft 107 is removed, and the one roll 2 is removed from the adhesive device 15. Next, after the other roll part 2 a is moved to the adhesion position and the cover member 8 is removed, the adhesive tape 1 of the other roll part 2 a is wound onto the take-up tray 17, and the adhesive tape 1 is replaced. . At this time, since the plural scroll sections 2, 2a, and 2b are different individuals, it is easy to handle. When the fourth embodiment shown in FIG. 61 is the same as the third embodiment, the roll sections 2, 2a, and 2b are different individuals, and the side plates 7, 7a of the roll sections 2, 2a, and 2b are fitted to each other, and It is mounted to the adhesive device 15. As shown in FIG. 61, the side plate 7a of the other roll portion 2a is provided with a fitted portion 1 1 0 having a cross-section having a substantially π-shaped cross section, and is arranged on the side plate 7 of one roll portion 2 The fitted portion 49 is fitted from the upper side to the fitted portion 1 10, and the two can be connected. When removing one of the rolled-up rolls 2 from the adhesive device 15, as long as one of the rolled-up rolls 2 is lifted up, the fitting can be released. It is easy to remove one of the rolled-up rolls 2. The inventions described in claims 5 2 to 58 are not limited to the above-mentioned embodiments, as long as they do not depart from the spirit of the inventions described in claims 5 2 to 58, various modifications can be made. . For example, in the above embodiment, the number of the roll portions 2 and 2a is not particularly limited, and may be any number. In the fourth embodiment, the side plates 7, 7a are slid up and down to fit one and the other roll portions 2, 2a. However, it may be formed on one side plate 7 -149- (145) (145) 200409405 The fitting hole is provided on the other side plate 7a, and the fitting protrusion is pressed into the fitting hole from the width direction of the tape to fit the two. Fig. 31 A and B are a support substrate for fixing a lead frame, a support substrate for mounting a semiconductor element, or a connection between a wafer of a lead frame and a semiconductor element. 1 An adhesive tape is used to adhere and fix a semiconductor element to a lead. An example of the L0C (Lead on Chip) structure of a support substrate for fixing a frame and a lead frame. Both sides of the supporting film 78 such as a polyimide film with a surface treatment of 50 // m in thickness are made by using an adhesive layer 80 having a polyaldimine-based adhesive layer with a thickness of 25 / zm on both sides. With the adhesive tape of the structure shown in FIG. A, a semiconductor device having the LOC structure shown in FIG. 31 can be obtained. The adhesive tape shown in Fig. 31A is punched with a die 8 8 (male (convex) 9 and female (concave) 9 6)) of the adhesive device shown in Figs. 32A to 32C. It is elongated, for example, on an iron-nickel alloy lead frame with a thickness of 0.2 mm, it is pressed at 400 ° C, a pressure of 3 MPa, and a pressure of 3 seconds to form a 0.2 mm interval, 0.2 Inner leads with a width of mm are made into lead frames with adhesive films for semiconductors. Next, in other steps, a temperature of 35 ° C, a pressure of 3 MPa, and a pressure of 3 seconds are applied to press the semiconductor element to the adhesive layer of the lead frame with the semiconductor adhesive film attached thereto, and thereafter, Wire bonding of lead frames and semiconductor elements with gold wires is used for continuous molding and sealing is performed using a sealing material such as an epoxy resin molding material to obtain a semiconductor device shown in FIG. 31B. In FIGS. 31A and B, 81 is based on Adhesive film for semiconductors obtained by die-cutting of adhesive tapes, 54 series semiconductor -150- (146) (146) 200409405 Physical components '8 3 series lead frames' 8 4 series sealing materials, 8 5 series welding wires, 8 6 series Bus bar. Figure 3 2 A, B, C series adhesive device, Figure 32 A, B '8 7 series die-cutting die, 8 8 series lead frame handling section, 6 1 series adhesive tape die-cutting paste Attachment section, 90 series heater section, 9 丨 series adhesive tape reel (adhesive material tape roll-out section), 92 series adhesive tape (semiconductor adhesive film), 93 series adhesive tape roll out roller. Also, the first In Fig. 32c, 94 series adhesive tape (adhesive film for semiconductor), 95 series male mold (convex part), 9 6 series female Die (concave) '7 7 series film pressing plate. The adhesive tape 9 2 is continuously rolled out from the adhesive tape tray (adhesive tape roll-out section) 91, and punched into the adhesive tape die-cut attachment section 8 9 The elongated and adhered lead portion to the lead frame is regarded as a lead frame with an adhesive film for semiconductors and is carried out of the lead frame conveying portion. The die-cut adhesive tape is carried out from the adhesive tape take-out roller 93 Same as above, the semiconductor element is connected to the supporting substrate for mounting the semiconductor element with an adhesive tape. The lead frame wafer and the semiconductor element are connected and adhered in the same way. The adhesive tape is only used for adhesive fixing. The contact between the electrodes or the electrical connection with conductive particles can be used, and the adhesive used for the purpose is selected. If a support film is used, the adhesive may be simply composed of the adhesive. The invention described in item 9 will be described. This invention relates to the adhesion and fixation of electronic components and circuit boards, or between circuit boards, and electrodes of both. The adhesive for the electrical connection between them is pressed to the adhesive of the circuit board. -151-(147) (147) 200409405 Next, the background technology of the invention described in item 59 of the scope of patent application will be described. Generally speaking, Electronic components such as liquid crystal panels, PDP (plasma display panels), EL (fluorescent display) panels, bare chip packages, and circuit substrates, or adhesion and fixation between circuit substrates, and electrical connection methods between the two electrodes, Adhesive tape is used. Japanese Patent Application Laid-Open No. 200 1-284005 describes that an adhesive tape coated with an adhesive on a substrate is wound into a disk shape, and the disk of the adhesive tape (hereinafter referred to as "adhesive" Agent plate ") is used by being mounted on an automatic adhesion machine. The automatic adhesion machine has a mounting portion for an adhesive plate, a mounting portion for an empty plate, a heating and pressing member disposed between the plates, and a substrate. The workbench 'pulls out the adhesive tape from the adhesive tray to the substrate, and applies heat and pressure to the substrate from the back side of the substrate by using a heating and pressing member to press the adhesive onto the substrate. However, the traditional automatic adhesive machinery is relatively large. When some adhesives are to be pressed on some substrates, when the area of the adhesive to be pressed is small, or temporarily pressed, etc., they will be larger and may be Difficult to operate. On the other hand, if it is a small one that is different from such a large-scale automatic adhesive machine, it can be easily operated. Therefore, when pressing locally or temporarily, it is desirable to have a device that can perform adhesive pressure without using a large device. . Therefore, the object of the invention described in claim 59 is to provide an adhesive, which is very small and can be operated with one hand, and it is easy to press the adhesive on a part of the substrate. -152- (148) (148) 200409405 Next, with reference to the drawings of the appendix, the embodiment of the invention described in item 59 of the scope of patent application will be described. Figures 62 and A are the adhesive tool diagrams of the first embodiment of the invention described in Item 59 of the scope of the patent application. Figure 62 is a perspective view of the adhesive tool. Figure 62 is B and AA of Figure 62A. Sectional view, FIG. 63 is a side view for explaining the method of using the adhesive tool shown in FIGS. 62A and 62B, and FIG. 64 is a step diagram of the method for manufacturing the adhesive tool. The main components of the adhesive device 1 1 1 in this embodiment are one disk (supply disk) 3, the other disk (empty disk) 5, and a housing 99 for accommodating the aforementioned disk. One disk 3 is wound with adhesive. The adhesive tape 1 and one end 9 a of the adhesive tape 1 are fixed to the other disc 5. The housing 9 9 is formed to be a size that can be held with one hand. When viewed from the side, the corners have a radian and are generally triangular, which is easy to hold. An opening is formed on the corner of the slightly triangular case 99, and the adhesive tape 9 is exposed from this opening 1 1 3. In addition, the heating member 1〗 4 is projected on the opening 1 1 3. When viewed from the side, the heating member 1 14 is also slightly triangular, and is used to guide the adhesive agent drawn from the upper 13a along the lower 1 3b. An electric heating plate 1 1 5 is arranged on the lower side of the adhesive tape 1 ′. The shape of the heating member 1 1 4 is in a rod shape. When the heating member 1 1 4 is covered with the electric heating plate 1 1 5 and the adhesive tape 9 is pulled out, the tape 9 can be smoothly pulled out by the rotation of the heating member 1 1 4. In addition, if polytetrafluoroethylene, silicone rubber, or both are provided on the outer side of the hot plate 1 1 5, uniform pressure can be obtained when pressing the adhesive 9. -153- (149) (149) 200409405 The case 99 is formed by fitting the half-shells 99a, 99b, and one and the other discs 3 and 5 are housed in the case. A guide member 16 is arranged in the casing to guide the movement of the adhesive tape 丨. In addition, a plate-shaped guide is formed on one of the bottom surfaces of either of the cases 99a or 7b. When the guide is pressed against the edge of the circuit board, the adhesive is pressed to the circuit. For the substrate, the adhesive can be pressed along the circuit substrate with good precision. One of the gears 116 will be coaxially fixed to one of the discs 3, and the other gear will be coaxially fixed to the other disc 17. 117, the gear 116 on one side and the gear 117 on the other side will mesh with each other. When the disk 3 on one side is rotated and the adhesive tape 1 is pulled out, the other disk I 7 will be pulled out by the adhesive tape 1. The rotation and take up the substrate 9. The gear unit 118 is composed of one gear 116 and the other gear II 7. A third casing (power supply means) 119 for supplying electric power to the heating member 1 1 4 is disposed on the side of the casing 9 9. The third casing 119 contains a dry battery and also supplies and supplies the heating member 1 1. 4 power adjustment circuit. In addition, the third casing 1 1 9 is provided with a power switch 1 2 0, which can hold the fingers of the 1 1 1 hand to perform ON / OFF operation. As shown in Fig. 62B, an adhesive 11 is coated on one side of the base material 9 on the adhesive tape 1. In this embodiment, the length of the adhesive tape 1 is about 20 m, and the width W is about 1.2 mm. In terms of strength and peelability of the adhesive constituting the anisotropic conductive material, -154- (150) (150) 200409405 The substrate 9 should be made of OPP (extended polypropylene), polytetrafluoroethylene, or silicon-treated It is made of PET (polyethylene terephthalate) and the like, however, it is not limited to this. The adhesive 1 1 is a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, or a thermal metal system. Thermoplastic resins are represented by styrene resins and polyester resins, and thermosetting resins are represented by epoxy resins, vinyl ester resins, acrylic resins, and silicone resins. . Conductive particles 1 3 are dispersed in the adhesive 11. The conductive particles 1 3 are metal particles such as An, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, or carbon, graphite, etc., and may be included in the foregoing and / or non-conductive glass and ceramics. Polymer core materials such as plastic and plastic are formed by covering the aforementioned conductive layer. In addition, it is also possible to use insulating film particles that cover the above-mentioned conductive particles with an insulating layer, or conductive particles and insulating particles for use. Forming a conductive layer on a hot molten metal such as solder or a polymer core material such as plastic will have deformability due to heat and pressure or pressure, so the distance between electrodes after connection will be reduced. Can increase the area of contact with the circuit, and improve reliability. In particular, it is better to use polymers as the core material. For example, because the solder has no melting point, it can be controlled in a softened state at a wide range of connection temperatures, and it is easy to get the thickness and flatness of the electrode. The connecting member 0. Next, the method of using the adhesive 111 of this embodiment will be described. As shown in Figure 63, hold the adhesive 11 1 with one hand, and turn the power switch 1 2 0 to ON. Next, the opening portion of the adhesive tape 1 -155- (151) (151) 200409405 1 1 3 is pressed against the circuit board 27. Because of the adhesive tape on the opening 11], the heating member 1 1 4 is arranged on the substrate 9 side, and the adhesive tape 1 on the lower side of the heating member 1 1 4 is pressed to apply an adhesive to the circuit board 2 7 Heating and pressing. When the adhesive π 1 is pressed downward and moved forward (arrow E in FIG. 63), the adhesive tape 1 is sequentially pulled out, and the heating member 1 1 4 advances in the E direction, and at the same time, the new adhesive The adhesive 9 is located below the heating member 1 1 4, and the adhesive 11 is sequentially pressed to the circuit substrate 27. In this way, when the adhesive tape 1 is pulled out from one of the discs 3, because one of the discs 3 is rotated, the gear 116 of one side which is fixed coaxially with the one of the discs 3 is also rotated, and the tooth of the other side is engaged with the tooth The gear 117 also rotates with it, and the base material 9 from which the adhesive agent 2 5 has been peeled is wound up to the other disc 17. With this embodiment, when the adhesive 11 is to be pressed to any position on the circuit board 27, as long as the adhesive 111 is held with one hand and pushed forward, the pressing of the adhesive 11 can be easily performed. . In this way, because the pressure of the adhesive 11 is very simple, it is particularly suitable, for example, when the electronic component (wiring circuit) 3 7 is temporarily adhered to the circuit substrate 27 or the electronic component is implemented only on a part of the circuit substrate 27. (Wiring circuit) When the pressure is 3 to 7. After the above-mentioned pressing (temporary connection), the electrodes of the circuit board 27 and the electrodes of the electronic component (wiring circuit) 37 are positioned and formally connected. Formally connect the circuit board 2 7 with the pressure of the adhesive 11 1 'to arrange the electronic components (wiring circuits) 3 7 on the adhesive 11 1 and if necessary,' teflon 3 9 can be used as a buffer Materials, to heat and pressurize the head 1 9 -156- (152) (152) 200409405 The electronic substrate (wiring circuit) 3 7 is heat-blocked to the circuit board 2 7 (as shown in Figure 4). In this way, can a fixed circuit board be connected? Electrode 27a of 7 and electrode 37a of electronic component (wiring circuit) 37. In addition, because the adhesive tape 1 is housed in the case 9 9 Θ and used directly, it is very easy to handle and has good workability. Here, the manufacturing method of the adhesive tool ln of this embodiment is demonstrated with reference to FIG. 64. The separator 23 rolled out from the unwinder 25 is coated with an adhesive made of a resin and conductive particles 1 3 by a coating machine 2 8 and dried in a drying furnace 29 before being taken up. Machine 3 1 takes up the original material. The original material of the rolled adhesive tape is cut to a specific width by cutting _ 33 in the refurbishing step and wound up to the disc 3, and then fits one of the discs between the half-shells 99 a and 9 9b. 3 and the other side of the plate (empty plate) 5, and the third case 1 9 containing the heating member 1 1 4 and the dry battery is assembled to make an adhesive 111. The adhesive 1 1 1 is packed together with the dehumidifying material, and the low temperature (-5 t to -10 ° C) is managed and shipped. Next, the inventions described in claims 60 to 64 of the scope of patent application will be described. These inventions are related to adhesive tapes for electronic components and circuit boards, or the adhesion and fixation between circuit boards, and the electrical connection between the electrodes of the two, and in particular, to the adhesive tapes rolled into a disc shape. Next, the background art of the inventions described in claims 60 to 64 will be described. -157- (153) (153) 200409405 Generally speaking, electronic components such as liquid crystal panels, PDPs (plasma display panels), EL (fluorescent display) panels, bare chip packages, and circuit boards, or the adhesion between circuit boards Adhesive tape is used for fixing and electrical connection between the two electrodes. Japanese Patent Application Laid-Open No. 200 1 -2 84005 describes a case in which an adhesive material tape on which an adhesive material is applied to a base material is rolled into a disc shape. The width of this traditional adhesive tape is about 1 ~ 3 mm, and the length of the tape rolled up to the disk is about 50m. After the adhesive tape is rolled out from the disk and the adhesive is pressed to the circuit board, it will not be repeated. use. However, in recent years, with the enlargement of panel screens such as PDPs, the adhesion area of circuit substrates has also increased, and the amount of adhesive used at one time has also increased. In addition, as the use of the adhesive is expanded, the amount of the adhesive used is also increased. Therefore, the replacement of the adhesive material plate in the electronic equipment manufacturing factory is more frequent. Because the replacement of the adhesive material plate is very troublesome, there is a problem that the production efficiency of the electronic device cannot be improved. To solve this problem, you can consider increasing the number of adhesive tapes rolled to the disk to increase the adhesive dose per disk to reduce the frequency of disk replacement. However, because the thickness of the adhesive tape is thick, it is difficult Increase the number of rolls per reel. In addition, if the thickness of the adhesive tape is considered to be reduced, since silicon-treated PET (polyethylene terephthalate) is used as the base material, if the thickness of the base material is too thin, the base material may easily be stretched or broken. Waiting. Therefore, the purpose of the invention described in the 60th to the 64th of the application for a patent is to provide an adhesive tape that can increase the number of rolls per reel and increase the production efficiency of electronic equipment.

其次，參照附錄圖面，針對申請專利範圍第 6 0〜6 4 項記載之發明之實施形態進行說明。參照第6 5圖A、B、 第3圖、第4圖、第2 9圖、及第5圖，針對申請專利範 圍第60〜64項記載之發明之第1實施形態進行說明。第 65圖A及B係第1實施形態之黏著材膠帶圖，第65圖A 係黏著材盤的斜視圖，第65圖B係第65圖A之A-A剖 面圖。 黏著材膠帶1係捲繞於盤3者，盤3上配設著捲軸5 、及配置於黏著材膠帶1之兩寬度側之側板7。 黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。Next, with reference to the drawings of the appendix, the embodiments of the invention described in claims 60 to 64 of the scope of patent application will be described. The first embodiment of the invention described in the patent application scope 60 to 64 will be described with reference to FIGS. 65, A, B, 3, 4, 4, 29, and 5. Figs. 65A and B are views of the adhesive tape of the first embodiment, Fig. 65A is a perspective view of the adhesive material plate, and Fig. 65B is a cross-sectional view taken along the line A-A of Fig. 65A. The adhesive tape 1 is wound on a disk 3, and the disk 3 is provided with a reel 5 and side plates 7 arranged on both width sides of the adhesive tape 1. The adhesive tape 1 is composed of a substrate 9 and an adhesive 11 applied to one side surface of the substrate 9.

基材9係採用銅膜（銅箔）。基材9之厚度（第65 圖B中之S)爲l〇em，基材9之25它時之拉伸強度爲 5 0 0MPa，基材9對黏著劑1 1之厚度比（S/T)爲0·5，黏 著劑1 1之厚度爲20 m。基材9之表面粗細度Rmax爲 0 · 2 5 // m。 又，亦製成採用芳香族聚醯胺膜（MIC TRON )當做 基材9者。製作上，基材9之厚度、拉伸強度、及基材9 對黏著劑1 1之厚度比（S/T )皆和銅膜相同。 其次，針對上述之黏著材膠帶之使用方法進行說明。 如第3圖所示，將黏著材膠帶1之盤3、及捲取盤17裝 著至黏著裝置15，捲繞於盤3上之黏著材膠帶1之前端 會經由導引銷22裝設至捲取盤17並捲出黏著材膠帶1 ( -159- (155) (155)200409405 第3圖中之箭頭e )。其次，將黏著材膠帶1配置於電路 基板2 1上，以配置於兩盤3、1 7間之加熱加壓頭1 9從基 材9側壓接黏著材膠帶丨，將黏著劑丨1壓著至電路基板 2 1。其後，將基材9捲取至捲取盤1 7。 其次，如第4圖所示，在壓著至電路基板21上之黏 著劑1 1上配線電路（或電子構件）2 3，將聚四氟乙烯材 24當做緩衝材，以加熱加壓頭1 9對電路基板2 1實施配 線電路2 3之加熱加壓。利用此方式，可連接電路基板2 1 之電極2 1 a及配線電路2 3之電極2 3 a。 如第29圖之利用本實施形態之黏著材膠帶1之PDP 26之連接部份所示，黏著劑1 1會壓著至PDP之周圍全體 ，可知一次使用之黏著劑1 1的使用量會遠大於傳統上之 使用量。因此，捲繞於盤3上之黏著材膠帶1之使用量亦 會增多，捲繞於盤3上之黏著材膠帶1在相對較短之時間 內會被捲取至捲取盤17，而使盤3成爲空的。 盤3成爲空的時，更換已使用之盤3及新盤，將新盤 裝著至黏著裝置1 5。其次，如上面所述，重複將黏著劑 11壓著至電路基板21並將基材9捲取至捲取盤17之動 作。 結果，採用銅膜做爲基材9者、及採用芳香族聚醯胺 膜做爲基材9者，皆和傳統黏著材膠帶1同樣容易處理， 且沒有基材9伸展或斷裂之問題。其次，相對於基材1 1 之厚度較傳統品（50//m)爲薄之部份’黏著材膠帶之捲 數會增多，故可減少盤之更換頻率而提高生產性。 -160 - 200409405 帶 膠 材 著 黏 之 態 形 施 實 本 對 針 圖。 5 明 第說 照行 參進 ’ 法 56)處方 ㈧ 此造 ¾ 之 在從捲出機25捲出之基材（separator)上，以塗布 機2 7塗布由樹脂及導電粒子1 3混合而成之黏著劑1 ]， 並以乾燥爐2 9實施乾燥後，以捲取機3 1捲取原始材料。 被捲取之黏著材膠帶1之原始材料，以切割機3 3切成特 定寬度並捲取至捲軸後，從兩側將側板7、7裝著於捲軸 5上，將其和除濕材一起綑包，實施低溫（_ 5 t〜_ ；! 〇 t ) 之管理並進行出貨。 又，針對基材9之厚度爲4//m、20/im、25/im之銅 膜及芳香族聚醯胺膜，製作黏著材膠帶1，如上面所述之 實際使用上，未發生基材9之伸展或斷裂等之問題。 又，針對基材9對黏著劑1 1之厚度比（s /T )爲0 · 0 1 、0.05、1.0之銅膜及芳香族聚醯胺膜，製作黏著材膠帶 1，如上面所述之實際使用上，未發生基材9之伸展或斷 裂等之問題。 其次，針對申請專利範圍第6 5〜6 6項記載之發明進 行說明。 這些發明係關於電子構件及電路基板、或電路基板間 之黏著固定、以及兩者之電極間之電性連接黏著材膠帶之 黏著材形成方法。又，係關於在將半導體元件（晶片）黏 著 固定至引線框架之固定用支持基板或引線框架之晶片 、或半導體元件載置用支持基板之半導體裝置上所使用之 黏著材膠帶之黏著材形成方法，尤其是，和捲成盤狀之黏 -161 - (157) 200409405 著材膠帶盤之黏著材形成方法相關。 其次，針對申請專利範圍第 6 5〜6 6項記載 背景技術進行說明。 一般而言，液晶面板、P D P (電漿顯示面板 螢光顯示）面板 '裸晶片封裝等之電子構件及電 或電路基板間之黏著固定、以及兩者之電極間之 方法，係採用黏著材膠帶。又，黏著材膠帶亦被 線框架之引線固定膠帶、LOC膠帶、晶粒結著 BGA CSP寺之黏者膜等’其目的則在提高半導 體之生產性及信賴性。 日本特開200 1 -284005號公報，係記載著將 塗布黏著材之黏著材膠帶捲成盤狀者。 此種傳統黏著材膠帶之寬度爲1〜3 m m程度 盤之膠帶之長度爲50m程度。 將黏著材膠帶裝著於黏著裝置時，將黏著材 (以下簡稱爲「黏著材盤」）裝設於黏著裝置上 著材膠帶之始端部並裝設至捲取盤。其次，從自 捲出之黏著材膠帶之基材側以加熱加壓頭將黏著 電路基板等上，再以捲取盤捲取殘餘之基材。 其次，黏著材盤之黏著材膠帶用完時，拆下 、及捲取基材之捲取盤，新黏著材盤及新捲取盤 黏著裝置，並將黏著材膠帶之始端裝設於捲取盤 然而，近年來，隨著PDP等之面板畫面之 電路基板之黏著面積亦增大，一次使用之黏著劑 :之發明之 )、EL ( 路基板、 電性連接 應用於引 膠帶、微 體裝置全 在基材上 ，捲取至 膠帶之盤 ，拉出黏 黏著材盤 劑壓著至 用完之盤 裝著至 上。 大型化， 的使用量 -162- (158) (158)200409405 亦增加。又，因爲黏著劑之用途之擴大，黏著劑之使用量 亦增加。因此，電子機器之製造工廠之黏著材盤的更換更 爲頻繁，因爲黏著材盤之更換十分麻煩，故有無法提高電 子機器之生產效率之問題。 針對此問題，可以考慮以增加捲取至盤之黏著材膠帶 之捲數，來增加每1盤之黏著劑量，用以降低盤之更換頻 率，然而，黏著材膠帶之捲數若增加，盤之黏著材膠帶捲 繞直徑之尺寸（以下稱爲「捲繞直徑」）亦會較大，可能 因無法裝著於既存之黏著裝置上而無法使用既存之黏著裝 置。 因此，申請專利範圍第6 5〜6 6項記載之發明的目的 ’係在提供一種黏著材膠帶之形成方法，可不增加黏著材 膠帶之捲繞直徑，而提高電子機器之生產效率。 其次，參照附錄圖面，針對申請專利範圍第65〜66 項記載之發明之實施形態進行說明。參照第66圖A及B 、第67圖、第68圖、第4圖、第29圖、及第5圖，針 對申請專利範圍第65〜66項記載之發明之第1實施形態 進行說明。第66圖A及B係第1實施形態之黏著材膠帶 之黏著樹形成步驟圖，第66圖A係將各黏著材膠帶重疊 成一體並將一方之基材捲取至捲取用盤之步驟的槪略圖， 第66圖B係第66圖A之黏著劑間之重疊部份的剖面圖 ’第67圖係在被覆體上形成黏著裝置之黏著劑之步驟的 槪略圖，第6 8圖係捲繞著黏著材膠帶之盤之斜視圖，第 4圖係電路基板間之黏著的剖面圖，第29圖係PDP之黏 -163- (159) (159)200409405 著劑之使用狀態的斜視圖，第5圖係黏著材膠帶之製造方 法的步驟圖。 黏著材膠帶1分別捲繞於盤3、1 2 1，各盤3、1 2 1上 配設著捲軸5、及配置於黏著材膠帶！之兩寬度側之側板 7。黏著材膠帶1係由基材9、及塗布於基材9之一側面 之黏著劑1 1所構成。 從強度、及黏著劑之剝離性而言，基材9應由OPP ( 延伸聚丙烯）、聚四氟乙烯、或經過矽處理之PET (聚對 苯二甲酸乙二酯）等所構成，然而，並不限於此。 黏著劑1 1係採用熱可塑性樹脂、熱硬化性樹脂、或 熱可塑性樹脂及熱硬化性樹脂之混合物。熱可塑性樹脂系 係以苯乙烯樹脂系及聚酯樹脂系爲代表，又，熱硬化性樹 脂系係以環氧樹脂系、壓克力樹脂系、及矽樹脂系爲代表 〇 黏著劑1 1內亦可分散著導電粒子1 3。導電粒子1 3 係如 An、Ag、Pt、Ni、Cu、W、Sb、Sn、焊錫等之金屬 粒子、或碳、石墨等，亦可在前述之物及/或非導電性之 玻璃、陶瓷、塑膠等高分子核材等覆蓋前述導電層等來形 成。此外，亦可應用以絕緣層覆蓋前述導電粒子之絕緣覆 膜粒子、或倂用導電粒子及絕緣粒子等。在焊錫等之熱熔 融金屬、或塑膠等之高分子核材上形成導電層者，會具有 因加熱加壓或加壓而產生變形之變形性，故連接後之電極 間距離會縮小，連接時可增加和電路接觸之面積，而可提 高信賴性。尤其是，以高分子類做爲核材更佳，如焊錫因 -164- (160) (160)200409405 沒有融點，在廣泛之連接溫度下亦可控制於軟化狀態，而 可得到很容易即可對應電極之厚度及平坦性之誤差的連接 構件。 其次，針對本實施形態之黏著材膠帶之使用方法進行 說明。如第6 6圖A所示，將2個黏著材膠帶1之盤3、 121、及捲取用之盤17、18裝著至黏著裝置15，將捲繞 於一方之盤3上之黏著材膠帶1之前端經由導引銷22裝 設至一方之捲取盤17，並捲出黏著材膠帶1(第66圖A 甲箭頭E )。又，捲繞於另一方之盤1 2 1上之黏著材膠帶 1之前端亦裝設至另一方之捲取盤18，並捲出黏著材膠帶 1 ° 從盤3、1 2 1捲出之黏著材膠帶1，會利用配置於盤3 、1 2 1及加熱加壓頭1 9之間之壓著滾輪1 22，使各黏著材 膠帶1重疊成一體。其次，將另一方之黏著材膠帶1之基 材9捲取至捲取盤1 8。 其次，將一方之黏著材膠帶1配置於電路基板2 1上 ，以加熱加壓頭1 9從基材9側實施黏著材膠帶1之壓接 ，將黏著劑1 1壓著至被覆體之電路基板2 1。其後，將基 材9捲取至捲取盤1 7。 其次，如第4圖所示，在壓著至電路基板21上之黏 著劑1 1上配置配線電路（或電子構件）2 3，將聚四氟乙 烯材24當做緩衝材，以加熱加壓頭1 9對電路基板2 1實 施配線電路2 3之加熱加壓。利用此方式，可連接電路基 板21之電極21a及配線電路23之電極23a。 -165- (161) 200409405 如第2 9圖之利用本實施形態之黏著材膠帶1之 26之連接部份所示，黏著劑1 1會被壓著至PDP 26 圍全體，一次使用之黏著劑1 1的使用量會遠大於傳 之使用量。因此，捲繞於盤3、1 2 1之黏著材膠帶1 用量亦會增多，捲繞於盤3、121之黏著材膠帶1會 對較短之時間內被捲取至捲取盤1 7、1 8。 此實施形態時，將黏著劑1 1壓著至電路基板2 1 一步驟中，會使一方之黏著材膠帶1之黏著劑11、 一方之黏著材膠帶1之黏著劑1 1重疊，得到期望之 劑1 1之厚度後，再將黏著劑1 1壓著至電路基板21 各黏著材膠帶1之厚度只要一半即可。因此，可增加 盤之黏著材膠帶1之捲數，而可大幅增加1次更換作 可使用的黏著劑量。因此，只需較少之新黏著材膠帶 更換作業，故可提高電子機器之生產效率。 此處’參照第5圖，針對本實施形態之黏著材膠 製造方法進行說明。 在從捲出機25捲出之基材（separator) 9上， 度爲通常之大約一半的方式利用塗布機27塗布由樹 導電粒子1 3混合而成之黏著劑1 1，並以乾燥爐2 9 乾燥後，以捲取機3 1捲取原始材料。被捲取之黏著 帶1之原始材料，以切割機3 3切成特定寬度並捲取 軸5後，從兩側將側板7、7裝著於捲軸5上，將其 濕材一起綑包，實施低溫（-5 °C〜· 1 〇 °c )之管理並 出貨。又，黏著材膠帶1亦可以爲黏著劑n中含有 PDP 之周 統上 之使 在相 之前 及另 黏著 ，故 每1 業之 1之 ms -v 以厚 脂及 實施 材膠 至捲 和除 進行 後述 -166- (162) (162)200409405 之硬化劑者。 其次，針對申請專利範圍第6 5〜6 6項記載之發明之 其他實施形態進行說明，以下說明之實施形態中，和上述 實施形態相同之部份會附與相同符號並省略該部份之詳細 說明，以下之說明係以和上述實施形態不同之點爲主。 第69圖A所示之第2實施形態時，亦可製作黏著劑 1 1 a含有硬化劑及導電粒子1 3之黏著材膠帶1 a、及不含 有硬化劑及導電粒子13之黏著材膠帶lb，如第69圖A 所示，使含有硬化劑等之黏著材膠帶la、及不含有硬化 劑等之黏著材膠帶lb重疊成一體，再將重疊之物壓著至 電路基板2 1。此時，因爲只有一方之黏著材膠帶1 a之黏 著劑U a含有硬化劑，另一方之黏著材膠帶1 b之黏著劑 1 1 b即無需含有硬化劑。因此，未含有硬化劑之黏著劑 1 1 b之黏著材膠帶1 b無需實施低溫管理。 因此，可減少需要低溫管理之黏著材膠帶1 a之數， 黏著材膠帶之運送及保管可實現較有效率之管理。 又，黏著劑爲環氧樹脂系時，環氧樹脂之硬化劑應爲 咪唑系、胺醯亞胺、銨鹽、聚胺類、及聚硫醇等。 又，如第69圖B所示，含有硬化劑之一方之黏著材 膠帶la之黏著劑11a含有導電粒子13而爲2層構成，因 被壓著側未含有導電粒子，樹脂會流動，不會從導電粒子 相對峙之電路間流出，加熱加壓時可確實使導電粒子i 3 保持留在電極2 1 a及電極2 3 a之間。 申請專利範圍第65〜66項記載之發明並未受限於上 -167- (163) (163)200409405 述之實施形態，申請專利範圍第6 5〜6 6項記載之發明之 要旨的範圍內，可實施各種變形。 第1實施形態時，黏著劑1 1係含有導電粒子1 3，然 而，亦可以爲未含有導電粒子1 3之黏著劑1 I。 上面所述係針對電子構件及電路基板、以及電路基板 間之黏著固定時進行說明，然而，亦可應用於將半導體元 件（晶片）黏著 固定於引線框架之固定用支持基板、引 線框架之晶片、或半導體元件載置用支持基板之半導體裝 置上。 其次，針對申請專利範圍第 6 7〜7 2項記載之發明進 行說明。 這些發明係關於例如液晶面板、PDP面板、EL面板 、裸晶片封裝等之電子構件及電路板、或電路板間之黏著 固定、以及以提供用以實施兩者之電極間之電性連接之向 異導電材爲目的之向異導電材膠帶，尤其是，和向異導電 材之捲取形態相關。 其次，針對申請專利範圍第67〜72項記載之發明之 背景技術進行說明。 利用向異導電材膠帶之電子構件及電路板、或電路板 間之連接方法，係利用相對峙之電極間夾著膜狀黏著劑之 向異導電材，以加熱加壓實施電子構件及電路板、或電路 板間之連接。膜狀之黏著劑中，混合著以實現電極間之導 通爲目的之導電粒子，採用之樹脂爲熱可塑性樹脂、熱硬 化性樹脂、熱可塑性樹脂及熱硬化性樹脂之混合物、以及 -168- (164) (164)200409405 光硬化性樹脂（例如，參照日本特開昭5 5 - 1 0 4 0 0 7號公報 )° 又，採用不含導電粒子而只由樹脂所構成之向異導電 材的電路連接方法亦爲大家所熟知（例如，參照日本特開 昭60-26243 0號公報）。 熱可塑性樹脂系係以苯乙烯樹脂系及聚酯樹脂系爲代 表，又，熱硬化性樹脂系則以環氧樹脂系、矽樹脂系、及 壓克力樹脂系爲代表。熱可塑性樹脂系及熱硬化性樹脂系 之連接上，皆需要實施加熱加壓。其目的係爲了使熱可塑 性樹脂系之樹脂流動並得到和被覆體間之密著力、以及爲 了使熱硬化性樹脂系能獲得進一步之樹脂之硬化反應。近 年來，以連接信賴性之角度而言，係以熱可塑性樹脂及熱 硬化性樹脂之混合物、及熱硬化性樹脂系爲主流。又，可 以低溫度實施連接之光硬化樹脂系亦開始被應用於工業上 〇 又，近年來，爲了防止被連接體之反翹及伸展，要求 向異導電材之連接時之連接溫度的低溫化。又，隨著向異 導電材之連接用途的擴大、以及液晶面板、PDP面板、 EL面板、及裸晶片封裝等之需要的擴大，對連接時之工 作時間之短時間化的要求愈來愈強。 又，隨著向異導電材之連接需要及用途之擴大，不但 要求短時間之連接，尙要求能提高生產性。因爲液晶面板 、PDP面板、EL面板、及裸晶片封裝等之需要的擴大， 向異導電材之使用量亦增加。另一方面，隨著液晶面板之 •169- (165) 200409405 大畫面及PDP面板等大畫面平板之需要的 電材之1片面板所使用之使用量亦增加。傳 電材之提供係採用將膜狀之黏著劑重疊捲繞 芯材上的盤形狀，盤之更換時間妨礙生產性, 另一方面，隨著液晶面板之細邊緣化， 朝狹窄化發展，傳統上捲繞於同一圓芯狀之 發生捲取散亂，進而導致製造步驟之廢料率I 有鑑於上述缺點，申請專利範圍第6 7〜 發明的目的，係在提供一種向異導電材膠帶 更換時間之間隔，且以避免捲取散亂所導致 低，而可提高生產性。 其次，針對申請專利範圍第67〜72項 實施形態進行說明。 第70圖係申請專利範圍第67〜72項記 1實施形態之模式圖。 如第7 0圖所示，本實施形態之向異導 將由膜狀黏著劑U、及兩面經過剝離處理 材）9之2層構造所構成之向異導電材，以 層於芯材5之縱向上而成爲捲線狀，第70 材之供應形態。第70圖中，芯材5之兩端 側板7。又，向異導電材膠帶係由基材膜9 材膜9上之向異導電材之膜狀黏著劑11所 電材膠帶因係應用於高精細化之電子構件之 防止無機及有機物之異物及污染，基材膜9 擴大，向異導 統上，向異導 於剖面爲圓形 之提高。 向異導電材亦 盤形狀很容易 均惡化。 -72項記載之 ，可延長盤之 之作業性的降 記載之發明之 載之發明之第 電材膠帶，係 之基材膜（基 多捲數方式積 圖係向異導電 部分別配設著 、及塗布於基 構成，向異導 連接上，爲了 會位於黏著劑 -170- (166) (166)200409405 之外側。 採用向異導電材之連接上，要求縮短工作時間，且要 求向異導電材之迅速轉錄性。如上面所述，將向異導電材 以多捲數方式積層於附有側板7之芯材（捲軸）5之縱向 上而成捲線狀，可提供不會發生捲取散亂之長方形向異導 電材。因此，可延長向異導電材膠帶之更換時間之間隔而 提高生產性。 上述向異導電材膠帶時，基材膜9之拉伸強度應爲 12kg/mm2以上、基材膜9之斷裂伸展應爲60〜200%。因 此，基材膜9因爲具有強度且伸展較小，在將構成向異導 電材之膜狀黏著劑U轉錄至電路基板等連接構件之前的 過程中，可防止膜狀黏著劑1 1伸展、厚度變薄、以及寬 度變細。又，以處理及環境保護之角度而言，基材膜9之 厚度應爲l〇〇//m以下。因爲基材膜9太薄會導致上述效 果之劣化，故基材膜9之厚度應爲〇. 5 // m以上。 其次，上述向異導電材膠帶所採用之基材膜9，從強 度、及構成向異導電材之黏著劑之剝離性的角度而言，應 採用經過矽及氟剝離處理之PP (聚丙烯）、OPP (延伸聚 丙烯）、及PET (聚對苯二甲酸乙二酯）等，然而，並不 限於此。 基材膜9之剝離處理，以矽或氟處理即可實現，只在 基材膜9之單面實施剝離處理的話，可使基材膜9之表面 及背面具有不同之脫模性，而可防止對基材膜9之背面轉 錄。又，對基材膜9之兩面實施剝離處理時，對膜狀黏著 -171 - (167) (167)200409405 劑1 1面實施矽及氟處理，而使膜狀黏著劑u面具有剝離 性。 膜狀之黏著劑1 1係使用具高信賴性之熱硬化性樹脂 系之環氧樹脂系、以黏著劑之低應力化爲目的而且具有良 好黏著劑相溶性之矽樹脂系、以及可以較上述爲低之溫度 及較短之時間實施連接之自由基系之物，然而，膜狀之黏 著劑並未受限於此。自由基系之黏著劑1 1係以壓克力系 黏著劑爲主。 第7 1圖係申請專利範圍第67〜72項記載之發明之第 2實施形態的模式圖。又，第7 1圖中，和第7 0圖相同之 構成要素會附與相同符號並省略詳細說明。 如第7 1圖所示，本實施形態之向異導電材膠帶有2 種基材膜，除了採用以前述基材模夾住黏著劑之方式構成 之向異導電材以外，其餘構成和第1實施形態之向異導電 體膠帶相同。亦即，本實施形態之向異導電材如第7 1圖 所示，係由膜狀之黏著劑1 1、及黏著劑1 1面實施過剝離 處理之2種基材9a、9b之3層構造所構成。 構成向異導電材之黏著劑較軟時，可以利用捲軸側之 如下所示之基材膜來防止黏著劑變形。 其次，基材膜9a、9b之物性値上，基材膜9a、9b之 拉伸強度應爲1.21^/1111112以上、基材膜93、91)之斷裂伸 展應爲60〜2 00%之理由，和第1實施形態時相同。利用 此方式，基材膜9a、9b可得到物理強度，而可防止因爲 膜狀黏著劑之伸展而產生薄膜化、以及寬度方向之變細。 -172· (168) 200409405 又’基材9a、9b之厚度應爲i〇〇#m以下 作及環境保護都可有良好之對應。 又’上述第1及第2實施形態時，若構 之目莫狀黏著劑1 1爲無粘著性且不會出現阻 可在無基材膜9或9a、9b之狀態下單獨其！ 捲成捲線狀。 以下’針對實施例進行說明，然而，申 67〜72項記載之發明並未受限於這些實施例 (實施例1 ) (1)向異導電材膜之製作 製作乙酸乙酯之30重量百分率溶液， 粒徑爲2.5//m、5體積百分率之Ni粉。其 乙酯溶液添加當做膜形成材之苯氧基樹脂（ 樹脂）50g、環氧樹脂20g、及咪唑5g，得 用溶液。另一方面，準備在著色成淡藍色之 50#m之聚對苯二甲酸乙二酯膜（斷裂強 、斷裂伸展爲130% )之兩面實施矽處理之 ，在此基材膜之單面上以滾塗機塗布上述溶 °C之5分鐘乾燥，得到厚度5 0 // m之向異 繞物。 (2)向異導電材膠帶之製作 將上述向異導電材膜之捲繞物切割成寬 ，如此，在操 成向異導電材 基現象者’則 莫狀黏著劑1 1 請專利範圍第 對其添加平均 次，上述乙酸 高分子量環氧 到黏著劑形成 透明、厚度爲 i 爲 25kg/mm2 基材膜。其次 液，實施1 1 〇 導電材膜的捲 度 1 . 5 mm，以 -173- (169) 200409405 多捲數方式積層於附有側板之直徑4 8 m m、寬度1 〇 〇 m ηι之 芯材（捲軸）之縱向上而成爲捲線狀，得到3 00m長度之 向異導電材膠帶。The base material 9 is a copper film (copper foil). The thickness of the substrate 9 (S in Fig. 65B) is 10em, the tensile strength of the substrate 9 at 25 is 500 MPa, and the thickness ratio of the substrate 9 to the adhesive 11 (S / T ) Is 0.5, and the thickness of the adhesive 11 is 20 m. The surface roughness Rmax of the substrate 9 is 0 · 2 5 // m. In addition, 9 made of an aromatic polyimide film (MIC TRON) was used as the base material. In manufacturing, the thickness, tensile strength, and thickness ratio (S / T) of the substrate 9 to the adhesive 11 are the same as those of the copper film. Next, a method of using the above-mentioned adhesive tape is described. As shown in FIG. 3, the disk 3 of the adhesive tape 1 and the take-up disk 17 are attached to the adhesive device 15, and the front end of the adhesive tape 1 wound on the disk 3 is mounted to the guide pin 22 to Take-up reel 17 and roll out adhesive tape 1 (-159- (155) (155) 200409405 arrow e in Fig. 3). Next, the adhesive tape 1 is arranged on the circuit board 21, and the heating and pressing head 19 arranged between the two plates 3 and 17 is pressed against the adhesive tape 丨 from the substrate 9 side, and the adhesive 丨 1 is pressed. Attach to the circuit board 2 1. After that, the base material 9 is taken up to a take-up tray 17. Next, as shown in FIG. 4, the circuit (or electronic component) 2 3 is wired on the adhesive 1 1 pressed onto the circuit substrate 21, and the polytetrafluoroethylene material 24 is used as a buffer material to heat the pressure head 1. 9 Apply heat and pressure to the circuit board 2 1 and the wiring circuit 2 3. In this way, the electrode 2 1 a of the circuit substrate 2 1 and the electrode 2 3 a of the wiring circuit 2 3 can be connected. As shown in the connection part of PDP 26 using the adhesive tape 1 of this embodiment in FIG. 29, the adhesive 11 will be pressed to the entire periphery of the PDP. It can be seen that the amount of the adhesive 1 1 used at a time will be much larger. For traditional usage. Therefore, the amount of the adhesive tape 1 wound on the disc 3 will also increase, and the adhesive tape 1 wound on the disc 3 will be wound to the take-up disc 17 in a relatively short time, so that Disk 3 becomes empty. When the disc 3 becomes empty, the used disc 3 and a new disc are replaced, and the new disc is mounted on the adhesive device 15. Next, as described above, the operation of pressing the adhesive 11 onto the circuit board 21 and winding the base material 9 onto the take-up tray 17 is repeated. As a result, those using a copper film as the substrate 9 and those using an aromatic polyamide film as the substrate 9 are as easy to handle as the conventional adhesive tape 1, and there is no problem that the substrate 9 is stretched or broken. Second, the thickness of the substrate 1 1 is thinner than that of the conventional product (50 // m). The number of rolls of the adhesive tape will increase, so the frequency of disk replacement can be reduced and productivity can be improved. -160-200409405 Adhesive material with adhesive material. 5 Mingdi said to participate according to the method 56) prescription ㈧ This ¾ is made on the substrate (separator) unrolled from the unwinder 25, coated with a coating machine 2 7 coated with resin and conductive particles 1 3 The adhesive 1] is dried in a drying furnace 29, and then the original material is taken up by a winding machine 31. The raw material of the rolled adhesive tape 1 is cut into a specific width by a cutter 3 3 and wound up on a reel, and then the side plates 7 and 7 are mounted on the reel 5 from both sides and bundled with the dehumidified material. Package, implement low-temperature (_ 5 t ~ _;! 〇t) management and shipment. In addition, for the copper film and aromatic polyimide film with a thickness of 4 // m, 20 / im, and 25 / im of the base material 9, the adhesive material tape 1 was produced. As described above, in actual use, no substrate was generated. The problem of stretch or break of the material 9. In addition, for a copper film and an aromatic polyimide film having a thickness ratio (s / T) of the substrate 9 to the adhesive 11 of 0 · 0 1, 0.05, and 1.0, an adhesive tape 1 was produced, as described above. In actual use, no problems such as stretching or breaking of the substrate 9 occurred. Next, the inventions described in claims 65 to 66 of the scope of patent application will be explained. These inventions relate to a method of forming an adhesive material for an electronic component and a circuit board, or an adhesive fixing between circuit boards, and an electrical connection adhesive tape between electrodes of the two. The invention also relates to a method for forming an adhesive material for an adhesive tape used on a support substrate for fixing a semiconductor element (wafer) to a lead frame, a wafer for fixing a lead frame, or a semiconductor device for supporting a substrate for placing a semiconductor element. In particular, it is related to the method for forming the adhesive material of the tape-shaped adhesive tape-161-(157) 200409405. Next, descriptions will be made on the background art described in claims 65 to 66 of the scope of patent application. Generally speaking, the method of bonding and fixing electronic components such as liquid crystal panels, PDP (plasma display panel fluorescent display) panels, bare chip packages, and electrical or circuit substrates, and the electrodes between the two, uses adhesive tape. . In addition, the adhesive tape is also used for wire frame lead fixing tape, LOC tape, adhesive film with BGA CSP temples bonded with grains, etc. The purpose is to improve the productivity and reliability of semiconductors. Japanese Patent Application Laid-Open No. 200 1-284005 describes a case in which an adhesive material tape for coating an adhesive material is rolled into a disc shape. The width of this traditional adhesive tape is about 1 ~ 3 mm. The length of the tape is about 50m. When the adhesive tape is attached to the adhesive device, an adhesive (hereinafter referred to as "adhesive material tray") is attached to the beginning of the adhesive tape on the adhesive device and attached to the take-up tray. Next, from the base material side of the self-rolled adhesive tape, a circuit board or the like is adhered with a heating and pressing head, and the remaining substrate is taken up by a take-up disk. Secondly, when the adhesive tape of the adhesive material tray is used up, remove and take up the reel of the base material, a new adhesive material tray and a new coil adhesive device, and set the beginning of the adhesive tape to the coil. However, in recent years, as the adhesion area of circuit substrates of panel screens such as PDPs has also increased, the adhesive used for a single use: the invention), EL (circuit substrate, electrical connection applied to lead tape, microbody devices It is all on the base material, rolled up to the tray of adhesive tape, pulled out the adhesive material tray, and pressed until the used tray is loaded on top. Larger, the amount of -162- (158) (158) 200409405 also increased. In addition, due to the expansion of the use of adhesives, the use of adhesives has also increased. Therefore, the replacement of adhesive material trays in electronic equipment manufacturing plants is more frequent, because the replacement of adhesive material trays is very troublesome, so there is no way to improve electronic equipment. In view of this problem, we can consider increasing the number of rolls of adhesive tape that is wound to the tray to increase the adhesive dose per tray to reduce the frequency of disk replacement. However, the roll of adhesive tape number As the winding diameter of the adhesive tape of the disk is increased (hereinafter referred to as the "winding diameter"), the existing adhesive device may not be used because it cannot be mounted on the existing adhesive device. Therefore, a patent is applied for The purpose of the invention described in the items 6-5 to 6 'is to provide a method for forming an adhesive tape, which can increase the production efficiency of electronic equipment without increasing the winding diameter of the adhesive tape. Second, referring to the drawings of the appendix, The following describes the embodiments of the invention described in the 65th to 66th scope of the patent application. Refer to Figures 66 and A, Figure 67, Figure 68, Figure 4, Figure 29, and Figure 5 for patent applications. The first embodiment of the invention described in the range of 65 to 66 will be described. Figs. 66A and B are diagrams showing the steps of forming an adhesive tree for the adhesive tape of the first embodiment, and Fig. 66A is an overlay of the adhesive tapes. Fig. 66 is a schematic view of a step of winding one substrate to a winding disk, and Fig. 66B is a cross-sectional view of the overlapping portion between the adhesives in Fig. 66A. Fig. 67 is on the covering body. Adhesion forming adhesive devices Figures 6 and 8 are perspective views of a disk wrapped with adhesive tape, and Figure 4 is a cross-sectional view of the adhesion between circuit boards, and Figure 29 is the adhesion of a PDP. -163- (159) ( 159) 200409405 An oblique view of the use state of the adhesive, and Fig. 5 is a step diagram of a method for manufacturing an adhesive tape. The adhesive tape 1 is wound around the discs 3, 1 2 1 and each disc 3, 1 2 1 A reel 5 and a side plate 7 disposed on both width sides of the adhesive tape are provided. The adhesive tape 1 is composed of a base material 9 and an adhesive 11 applied to one side of the base material 9. From strength, In terms of the peelability of the adhesive, the substrate 9 should be composed of OPP (extended polypropylene), polytetrafluoroethylene, or silicon-treated PET (polyethylene terephthalate). Limited to this. The adhesive 11 is a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin. Thermoplastic resins are typified by styrene resins and polyester resins, and thermosetting resins are typified by epoxy resins, acrylic resins, and silicones. Adhesives 1 1 The conductive particles 1 3 may be dispersed. The conductive particles 1 3 are metal particles such as An, Ag, Pt, Ni, Cu, W, Sb, Sn, solder, etc., or carbon, graphite, etc., and may be included in the foregoing and / or non-conductive glass and ceramics. Polymer core materials such as plastic and plastic are formed by covering the aforementioned conductive layer. In addition, it is also possible to apply an insulating film particle that covers the aforementioned conductive particles with an insulating layer, or a conductive particle and an insulating particle for use. Forming a conductive layer on a hot molten metal such as solder or a polymer core material such as plastic will have deformability due to heat and pressure or pressure, so the distance between electrodes after connection will be reduced. Can increase the area of contact with the circuit, and improve reliability. In particular, it is better to use polymers as the core material. For example, soldering because -164- (160) (160) 200409405 has no melting point, and can be controlled in a softened state at a wide range of connection temperatures, which can be easily obtained. A connection member that can cope with errors in thickness and flatness of electrodes. Next, a method of using the adhesive tape of this embodiment will be described. As shown in FIG. 6A, the two disks 3 and 121 of the adhesive tape 1 and the disks 17 and 18 for winding are attached to the adhesive device 15, and the adhesive material wound on one of the disks 3 is attached. The front end of the adhesive tape 1 is mounted on one of the take-up disks 17 via the guide pin 22, and the adhesive tape 1 is rolled out (see arrow A in FIG. 66A). In addition, the front end of the adhesive tape 1 wound on the other disc 1 2 1 is also mounted to the other take-up disc 18, and the adhesive tape 1 is rolled out 1 ° from the disc 3, 1 2 1 The adhesive material tape 1 uses the pressing rollers 1 22 arranged between the disks 3, 1 2 1 and the heating and pressing head 19 to overlap the adhesive material tapes 1 into one body. Next, the base material 9 of the other adhesive tape 1 is wound up to a take-up tray 18. Next, one of the adhesive tapes 1 is arranged on the circuit board 21, and the heating and pressing head 19 is used to press the adhesive tape 1 from the substrate 9 side, and the adhesive 11 is pressed to the circuit of the covering body. Substrate 2 1. Thereafter, the base material 9 is taken up to a take-up tray 17. Next, as shown in FIG. 4, a wiring circuit (or an electronic component) 2 3 is arranged on the adhesive 11 pressed onto the circuit substrate 21, and the polytetrafluoroethylene material 24 is used as a buffer material to heat the pressure head. 19 Apply heat and pressure to the circuit board 2 1 and the wiring circuit 2 3. In this way, the electrode 21a of the circuit substrate 21 and the electrode 23a of the wiring circuit 23 can be connected. -165- (161) 200409405 As shown in Figure 2-9, the connection part of the adhesive tape 1 26 using this embodiment, the adhesive 11 will be pressed to the entire area of the PDP 26, and the adhesive is used once. The amount of 1 1 used will be much larger than the amount used. Therefore, the amount of the adhesive material tape 1 wound on the disks 3, 1 2 1 will also increase. The adhesive material tape 1 wound on the disks 3, 121 will be wound up to the winding disk 1 in a short time. 1 8. In this embodiment, in a step of pressing the adhesive 11 to the circuit substrate 2 1, the adhesive 11 of the adhesive tape 1 on one side and the adhesive 1 1 of the adhesive tape 1 on the other side are overlapped to obtain the desired result. After the thickness of the adhesive 11 is 1, the adhesive 11 is pressed to the thickness of each adhesive tape 1 of the circuit board 21 as long as half. Therefore, the number of rolls of the adhesive tape 1 of the disc can be increased, and the amount of adhesive that can be used for a single replacement can be greatly increased. Therefore, fewer replacements of new adhesive tapes are required, which can improve the production efficiency of electronic equipment. Here ', a method for producing an adhesive material adhesive according to this embodiment will be described with reference to FIG. 5. On the separator 9 unwound from the unwinder 25, the adhesive agent 1 1 mixed with the tree conductive particles 1 3 was coated with a coater 27 in a manner of about half the usual degree, and the drying furnace 2 9 was used. After drying, the original material is taken up by a winder 31. The raw material of the rolled adhesive tape 1 is cut into a specific width by a cutting machine 3 3 and the shaft 5 is wound. Then, the side plates 7, 7 are mounted on the roll 5 from both sides, and the wet materials are packed together. Implement low-temperature (-5 ° C ~ · 10 ° C) management and ship. In addition, the adhesive material tape 1 can also be used in the system where the PDP is contained in the adhesive n before the phase and the other is adhered, so the ms -v of 1 per 1 industry is thick and the material is rolled to the roll and removed. -166- (162) (162) 200409405 as described later. Next, other embodiments of the inventions described in items 65 to 66 of the scope of patent application will be described. In the embodiments described below, the same parts as the above embodiments will be given the same symbols and detailed descriptions of those parts will be omitted. Note that the following description is mainly based on the differences from the above embodiment. In the second embodiment shown in FIG. 69A, it is also possible to produce an adhesive 1 1 a adhesive tape 1 a containing a hardener and conductive particles 13 and an adhesive tape 1 a without a hardener and conductive particles 13 As shown in FIG. 69A, the adhesive material tape la containing the hardener and the like and the adhesive material tape lb not containing the hardener and the like are overlapped and integrated, and the overlapped material is pressed onto the circuit board 21. At this time, since only one adhesive U a of the adhesive tape 1 a contains a hardener, and the adhesive 1 1 b of the other adhesive tape 1 b does not need to contain a hardener. Therefore, the adhesive tape 1 b without the hardener-containing adhesive 1 1 b need not be subjected to low-temperature management. Therefore, the number of adhesive tapes 1 a that require low-temperature management can be reduced, and the transportation and storage of adhesive tapes can achieve more efficient management. When the adhesive is an epoxy resin, the hardener of the epoxy resin should be an imidazole, amine imine, ammonium salt, polyamine, or polythiol. In addition, as shown in FIG. 69B, the adhesive 11a of the adhesive material tape la containing one of the hardeners includes conductive particles 13 and has a two-layer structure. Since the pressed side does not contain conductive particles, the resin flows and does not It flows out from the circuit between the conductive particles and the plutonium, and the conductive particles i 3 can be surely kept between the electrodes 2 1 a and 2 3 a when heated and pressurized. The inventions described in the 65th to 66th scope of the patent application are not limited to the embodiments described in -167- (163) (163) 200409405, and are within the scope of the gist of the inventions described in the 6th to 6th scope of the patent application. , Can implement various deformations. In the first embodiment, the adhesive 11 includes the conductive particles 13. However, the adhesive 11 may not include the conductive particles 13. The above description is for the case of electronic components and circuit boards, and the adhesion and fixation between circuit boards. However, it can also be applied to a support substrate for fixing a semiconductor element (wafer) to a lead frame, a wafer for a lead frame, Or on a semiconductor device that supports a substrate for mounting a semiconductor element. Next, the inventions described in items 67 to 72 of the scope of patent application will be described. These inventions are related to electronic components such as a liquid crystal panel, a PDP panel, an EL panel, a bare chip package, and a circuit board, or adhesion and fixation between circuit boards, and to provide an orientation for implementing an electrical connection between the two electrodes. The tape of anisotropic conductive material for the purpose of heteroconductive material is, in particular, related to the winding form of the anisotropic conductive material. Next, the background art of the inventions described in claims 67 to 72 will be described. An electronic component and a circuit board using anisotropic conductive tape, or a connection method between circuit boards, uses an anisotropic conductive material with a film-shaped adhesive sandwiched between opposing electrodes to heat and pressurize the electronic component and the circuit board. , Or connections between circuit boards. The film-shaped adhesive is mixed with conductive particles for the purpose of conducting between electrodes. The resin used is a thermoplastic resin, a thermosetting resin, a mixture of a thermoplastic resin and a thermosetting resin, and -168- ( 164) (164) 200409405 Photocurable resin (for example, refer to Japanese Patent Application Laid-Open No. 5 5-1 0 4 0 0 7) ° In addition, an anisotropic conductive material composed of only resin without conductive particles is used. The circuit connection method is also well known (for example, refer to Japanese Patent Application Laid-Open No. 60-26243 0). Thermoplastic resins are typified by styrene resins and polyester resins, and thermosetting resins are typified by epoxy resins, silicone resins, and acrylic resins. Both the thermoplastic resin system and the thermosetting resin system need to be heated and pressed. The purpose is to make the thermoplastic resin resin flow and obtain the adhesion with the coating body, and to make the thermosetting resin resin obtain a further curing reaction of the resin. In recent years, in terms of connection reliability, a mixture of a thermoplastic resin and a thermosetting resin, and a thermosetting resin are the mainstream. In addition, photo-hardening resins that can be connected at low temperatures have also started to be used in industry. In recent years, in order to prevent reverse warping and stretching of the connected body, it has been required to lower the connection temperature when connecting to a different conductive material. . In addition, with the expansion of the use of connection of anisotropic conductive materials, and the expansion of the needs for liquid crystal panels, PDP panels, EL panels, and bare chip packaging, the demand for shortening the operating time during connection is increasing. . In addition, with the expansion of the connection needs and uses of anisotropic conductive materials, not only a short time connection is required, but also productivity can be improved. Due to the expansion of the needs for liquid crystal panels, PDP panels, EL panels, and bare chip packaging, the use of different conductive materials has also increased. On the other hand, with the use of LCD panels such as • 169- (165) 200409405 large-screen and large-screen flat panels such as PDP panels, the amount of electrical panels used has also increased. The supply of electricity-transmitting materials uses a disk shape in which a film-shaped adhesive is wound on the core material, and the replacement time of the disk hinders productivity. On the other hand, as the thin edge of the liquid crystal panel becomes narrower, Due to the above-mentioned shortcomings, the purpose of the invention is to provide a method for replacing the tape with a different conductive material. Interval, and to avoid low coiling and scatter, which can improve productivity. Next, the embodiments in the scope of patent applications 67 to 72 will be described. Figure 70 is a schematic diagram of the first embodiment in the 67th to 72th of the scope of patent application. As shown in FIG. 70, the anisotropic conductive material of this embodiment will be an anisotropic conductive material composed of a two-layer structure of a film-shaped adhesive U and a material subjected to a peeling treatment on both sides) 9 to be layered in the longitudinal direction of the core material 5. It becomes a coiled shape from the top, and the 70th material is supplied. In Fig. 70, both side plates 7 of the core material 5 are provided. The anisotropic conductive tape is made of the film-shaped adhesive 11 of the anisotropic conductive material on the base film 9 and the film 9. The electric material tape is applied to high-definition electronic components to prevent foreign matter and pollution from inorganic and organic substances. The base film 9 is enlarged, and the anisotropy is improved in a circular shape in cross section. The shape of the anisotropic conductive material is easily deteriorated. According to the -72 items, the invention can be extended to reduce the workability of the disc, and the electrical material tape of the invention described in the invention is a base film (the base film of the multi-volume method is provided separately to the different conductive parts, And coated on the base structure, on the heteroconducting connection, in order to be located outside the adhesive -170- (166) (166) 200409405. The connection using an anisotropic conductive material requires shortening the working time, and requires an anisotropic conductive material Rapid transcription. As mentioned above, the anisotropic conductive material is laminated in multiple rolls on the core material (reel) 5 with side plate 7 in the longitudinal direction to form a coil shape, which can provide no coiling scatter It is a rectangular anisotropic conductive material. Therefore, the interval between the replacement of the anisotropic conductive material tape can be extended to improve the productivity. When the anisotropic conductive tape is used, the tensile strength of the base film 9 should be 12kg / mm2 or more. The elongation at break of the material film 9 should be 60 to 200%. Therefore, because the base film 9 has strength and has a small extension, the process before the film-shaped adhesive U constituting an anisotropic material is transcribed to a connection member such as a circuit board Medium to prevent film-like adhesion 1 1 Stretch, thinner thickness, and narrower width. In addition, from the perspective of handling and environmental protection, the thickness of the substrate film 9 should be 100 // m or less. Because the substrate film 9 is too thin, it will cause The above effects are deteriorated, so the thickness of the substrate film 9 should be 0.5 / m or more. Second, the substrate film 9 used for the anisotropic conductive tape described above has strength and composition of an anisotropic conductive adhesive. From the standpoint of releasability, PP (polypropylene), OPP (extended polypropylene), and PET (polyethylene terephthalate), which have been subjected to silicon and fluorine peeling treatment, should be used. However, it is not limited to this. The peeling treatment of the base film 9 can be realized by silicon or fluorine treatment. If only one side of the base film 9 is subjected to the peeling treatment, the surface and the back of the base film 9 can have different release properties, and It is possible to prevent transcription on the back surface of the base film 9. When both sides of the base film 9 are subjected to a peeling treatment, the film-like adhesion is performed on one side of the film-171-(167) (167) 200409405 Agent 1 and Make the film-shaped adhesive u-side peelable. The film-shaped adhesive 1 1 is heat-cured with high reliability. Resin-based epoxy resins, silicone resins with good adhesive compatibility for the purpose of reducing the stress of adhesives, and free radicals that can be connected at a lower temperature and in a shorter time than the above However, the film-shaped adhesive is not limited to this. The radical adhesive 11 is mainly an acrylic adhesive. Figure 7 1 shows the inventions described in the scope of patent applications Nos. 67 to 72. A schematic diagram of the second embodiment. In Fig. 71, the same constituent elements as those in Fig. 70 are given the same reference numerals and detailed explanations are omitted. As shown in Fig. 71, the differences in this embodiment are different. The conductive material tape has two types of base film. The structure is the same as that of the anisotropic conductive tape of the first embodiment except that the anisotropic conductive material is configured by sandwiching an adhesive with the aforementioned substrate mold. That is, as shown in FIG. 71, the anisotropic conductive material of this embodiment is a three-layered two-layer substrate 9a, 9b which is made of a film-shaped adhesive 11 and an adhesive 1 on one side and subjected to a peeling treatment. Constructed by. When the adhesive constituting the anisotropic conductive material is soft, the substrate film shown below on the reel side can be used to prevent deformation of the adhesive. Second, based on the physical properties of the base film 9a, 9b, the tensile strength of the base film 9a, 9b should be 1.21 ^ / 1111112 or more, and the elongation at break of the base film 93, 91) should be 60 to 200%. It is the same as that in the first embodiment. In this way, the base films 9a and 9b can obtain physical strength, and it is possible to prevent thinning of the film-like adhesive and thinning in the width direction due to stretching of the film-like adhesive. -172 · (168) 200409405 Also, the thickness of the substrates 9a and 9b should be less than or equal to 100 mm, and both work and environmental protection can have a good correspondence. In addition, in the above first and second embodiments, if the structure-shaped adhesive 11 is non-adhesive and does not exhibit resistance, it can be used alone without the base film 9 or 9a, 9b! Roll into a roll. In the following, the examples are described. However, the inventions described in Shen 67 to 72 are not limited to these examples (Example 1) (1) Production of a film of a different conductive material. A 30% by weight solution of ethyl acetate was prepared. , Ni powder with a particle size of 2.5 // m and 5% by volume. The ethyl acetate solution was added with 50 g of phenoxy resin (resin) as a film-forming material, 20 g of epoxy resin, and 5 g of imidazole to obtain a solution. On the other hand, it is prepared to perform silicon treatment on both sides of a 50 #m polyethylene terephthalate film (strength at break and elongation at break of 130%) colored in light blue. One side of the base film is prepared. An anisotropic winding having a thickness of 50m / m was obtained by coating on a roll coater at a temperature of 5 ° C for 5 minutes and drying. (2) Fabrication of anisotropic conductive material tape The above-mentioned anisotropic conductive material film is cut to a wide width. In this way, those who operate the anisotropic conductive material-based phenomenon will have an adhesive 1 1 It is added on average, the above-mentioned acetic acid high molecular weight epoxy to the adhesive forms a transparent substrate film with a thickness i of 25 kg / mm2. Secondly, the coil thickness of the conductive material film of 1.0 was 1.5 mm, and a core material with a diameter of 48 mm and a width of 1,000 m was laminated with a side number of -173- (169) 200409405 in multiple rolls. (Reel) in a longitudinal direction to become a coiled shape, and an anisotropic conductive tape having a length of 3,000 m was obtained.

將此捲繞成捲線狀之向異導電材，亦即，將向異導電 材膠帶裝設於向異導電材膠帶自動壓著機上並供應向異導 電材時，在向異導電材之轉錄性及伸展試驗中獲得良好結 果，而且，可減少盤之裝設次數、無需裝設時間、以及避 免轉錄性及黏著劑之伸展所導致之貼附作業的重複，而這 些效果可提高生產性。 (實施例2 )When this anisotropic conductive material is wound into a coil shape, that is, when the anisotropic conductive material tape is installed on an automatic pressing machine for anisotropic conductive material tape and supplied to the anisotropic conductive material, the transcription to the anisotropic conductive material is performed. Good results were obtained in the performance and extension tests, and the number of times the disk was installed, the time required for installation, and the repetition of attaching operations caused by transcription and adhesive stretching were avoided, and these effects can improve productivity. (Example 2)

製作和實施例1相同之向異導電材膠帶之捲物。其次 ，在基材膜及黏著劑之積層體上，以2基材膜夾住黏著劑 之方式，層壓另1種類之厚度爲25//m之聚對苯二甲酸 乙嫌酯基材膜（斷裂強度爲25kg/mm2、斷裂伸展爲130% )’得到3層構造之向異導電材膜之捲物。其次，和實施 例1相问’將此膜之捲物切割成寬度1 . 5 m m，並將其捲取 至附有側板之直徑4 8 mm、寬度1 〇 〇 m m之芯材（捲軸）而 成爲捲線狀’得到300m長度之向異導電材膠帶。 實施例2亦和實施例1相同，可得到良好之生產性。 (實施例3 ) 除了基材膜採用厚度50/zm之聚四氟乙烯膜（斷裂 強度爲4 · 6 k g / m m2、斷裂伸展爲3 5 0 % )以外，得到和實 -174- (170) (170)200409405 施例1相同之向異導電材膜之捲繞物，此外，和實施例1 相同，將此膜之捲繞物切割成寬度1 .5mm，捲繞於附有側 板之直徑 48mm、幅 lOOmm之芯材（捲軸）而成爲捲線 狀，得到3 00m長度之向異導電材膠帶。此時，亦可捲繞 3〇〇m之長度。 (比較例1 ) 得到和實施例1相同之向異導電材膜之捲繞物，此外 ，和實施例1相同，將此膜之捲繞物切割成寬度1 .5mm， 以同一圓芯狀捲繞至傳統之盤，得到l〇〇m長度之向異導 電材膠帶。 將此捲繞成捲線狀之向異導電材膠帶裝著至向異導電 材膠帶自動壓著機，並供應向異導電材時，向異導電材之 轉錄性及伸展試驗皆獲得良好結果，然而，盤之裝設次數 爲實施例之3倍，裝設時間及調整時間都增加。 本發明之產業上的利用可能性如下所示。 如以上說明所示，利用申請專利範圍第1項記載之發 明時，係利用黏著材膠帶之黏著劑來黏著全部捲出之黏著 材膠帶（一方之黏著材膠帶）之終端部、及新裝著之黏著 材膠帶（另一方之黏著材膠帶）之始端部，實施黏著材盤 之更換，很簡單即可將新黏著材膠帶裝著至黏著裝置。 又，因爲無需在每次更換新黏著材膠帶時都更換捲取 膠帶、將新黏著材膠帶之始端裝設於捲取盤上之作業、以 及在特定路徑設定導引銷等之作業，只需要較少時間即可 -175- (171) (171)200409405 更換新黏著材盤，故可提高電子機器之生產效率。 因爲一方之黏著材膠帶及另一方之黏著材膠帶係以重 疊黏著劑面來進行黏著，故有較高之連接強度。 利用申請專利範圍第2項記載之發明時，除了具有和 申請專利範圍第1項記載之發明相同之效果以外，全部捲 出之黏著材膠帶之切斷係在露出結束標記時實施，切斷及 執行連接作業之部份容易解開且可利用必要最小之位置實 施連接，而可防止黏著材膠帶之浪費。 利用申請專利範圍第3項記載之發明時，具有和申請 專利範圍第1項記載之發明相同之效果，很簡單即可將新 黏著材膠帶裝著至黏著裝置，又，只需要較少時間即可更 換新黏著材盤，故可提高電子機器之生產效率。 此外，因爲係利用黏著材膠帶之前導膠帶黏著全部捲 出之黏著材膠帶之終端部及新裝著之黏著材膠帶之始端部 ，故很簡單即可實施黏著材膠帶間之黏著。 利用申請專利範圍第4項記載之發明時，具有和申請 專利範圍第1項記載之發明相同之效果，很簡單即可將新 黏著材膠帶裝著至黏著裝置，又，只需要較少時間即可更 換新黏著材盤，故可提高電子機器之生產效率。 此外，因爲無需反折全部捲出之黏著材膠帶，將黏著 材膠帶捲取至捲取盤時，可防止可能發生之捲取散亂。 利用申請專利範圍第5項記載之發明時，因爲係以卡 止銷固定全部捲出之黏著材膠帶之終端部、及新裝著之黏 著材膠帶之始端部，故連接十分簡單。又，因爲無需在每 -176- (172) (172)200409405 次更換新黏著材盤時都更換捲取膠帶、將新黏著材膠帶之 始端裝設於捲取盤上作業、以及在特定路徑設定導引銷等 之作業，只需要較少時間即可更換新黏著材盤，故可提高 電子機器之生產效率。 利用申請專利範圍第6項記載之發明時，卡止構件之 一方之爪部會卡止於一方之黏著材膠帶之終端部，其後’ 配設於卡止構件之另一方之爪部會卡止於另一方之黏著材 膠帶之始端部，實施兩者之互相連接，故連接十分容易。 因爲一方之爪部及另一方之爪部之間具有彈性構件’ 故，彈性構件可伸展而使卡止構件之另一方之爪部卡止於 另一方之黏著材膠帶之始端部之任意位置上，故連接具有 [1]自由度。 又，一方之黏著材膠帶之終端部及另一方之黏著材膠 帶之始端部會在互相抵接之狀態進行連接，無需重疊膠帶 ’可利用必要最小之位置實施連接，而可防止黏著材膠帶 之浪費。 利用申請專利範圍第7項記載之發明時，只需以夾子 一方之黏著材膠帶之終端部及另一方之黏著材膠帶之始端 部之重疊部份即可連接，連接作業十分容易。 利用申請專利範圍第8項記載之發明時，係從重疊部 份之兩面壓扁夾持片來連接兩者，可提高黏著材膠帶之重 疊部份的連接強度。 利用申請專利範圍第9項記載之發明時，係利用黏著 材膠帶之黏著劑黏著已用完之黏著材膠帶之終端部、及新 -177- (173) (173)200409405 裝著之黏著材膠帶之始端部，來實施黏著材盤之更換，故 很簡單即可將新黏著材盤裝著至黏著裝置。又，因爲無需 每次更換新黏著材盤時都更換基材之捲取盤、及將新黏著 材之始端裝設至捲取盤，只需要較少時間即可更換新黏著 材盤，故可提高製造效率。 利用申請專利範圍第1 〇項記載之發明時，除了具有 和申請專利範圍第9項記載之發明相同之效果以外，一方 之黏著材膠帶之終端部及另一方之黏著材膠帶之始端部會 互相形成鈎狀卡止，而且’兩者係以黏著劑面互相連接， 故有較高之連接強度。 利用申請專利範圍第1 1項記載之發明時，除了具有 和申請專利範圍第9或1 〇項記載之發明相同之效果以外 ，一方之黏著材膠帶之終端部係結束標記之部份，執行連 接作業之部份容易解開，且防止黏著材膠帶之浪費。 利用申請專利範圍第1 2項記載之發明時，除了具有 和申請專利範圍第9項〜1 1之其中任一項記載之發明相 同之效果以外，因爲連接部份會形成凹凸，可擴大連接面 積，同時，可提高連接部份之黏著材膠帶之拉伸方向（縱 向）之強度。 利用申請專利範圍第1 3項記載之發明時，除了具有 和申請專利範圍第9項〜第1 1項之其中任一項記載之發 明相同之效果以外，連接部份會形成貫通孔，貫通孔之內 緣會有黏著劑滲出，可增加黏著劑之黏著面積，而進一步 提局連接強度。 -178- (174) (174)200409405 利用申請專利範圍第1 4項記載之發明時，只需連接 已用完之黏著材膠帶（一方之黏著材膠帶）、及新黏著材 膠帶（另一方之黏著材膠帶）即可更換盤，故很簡單即可 將新黏著材盤裝著至黏著裝置。又，因爲無需每次更換新 黏著材盤時都更換捲取盤、將新黏著材膠帶之始端裝設於 捲取盤上、以及將黏著材膠帶裝設於導引件之作業，只需 要較少時間即可更換新黏著材盤，故可提高電子機器之生 產效率。 黏著材膠帶之處理基材所使用之處理劑係矽系樹脂， 且粘著膠帶亦使用矽粘著劑，因可降低兩者之表面張力差 而提高密著力，故可實現傳統上十分困難之兩者之黏著。 利用申請專利範圍第1 5項記載之發明時，除了具有 和申請專利範圍第1 4項記載之發明相同之效果以外，矽 粘著膠帶之粘著劑面之表面張力及黏著材膠帶之矽處理基 材之表面張力之差爲l〇mN/m ( lOdyne/cm )以下，可得到 強密著力，而可確實黏著兩者。 利用申請專利範圍第1 6項記載之發明時，除了具有 和申請專利範圍第1 5項記載之發明相同之效果以外，因 爲黏著力爲l〇〇g/2 5 mm以上，可使一方及另一方之黏著 材膠帶之兩黏著劑面之黏著更爲強固。 利用申請專利範圍第1 7項記載之發明時，除了具有 和申請專利範圍第1 6項記載之發明相同之效果以外，係 利用兩面連接一方及另一方之黏著材膠帶，故可得到更爲 強固之連接。 -179· (175) (175)200409405 利用申請專利範圍第1 8項記載之發明時，因爲採用 兩面粘著劑之矽粘著膠帶，利用將兩面矽粘著膠帶夾於一 方及另一方之黏著材膠帶間之方式來實施兩者之黏著（或 密著），故兩者之連接十分簡單且容易。 利用申請專利範圍第1 9項記載之發明時，因已全部 捲出之黏著材膠帶之終端部、及新裝著之黏著材膠帶之始 端部係以糊狀樹脂製黏著劑固定，故連接十分簡單。又， 因爲無需在每次更換新黏著材膠帶時都更換捲取膠帶、將 新黏著材膠帶之始端裝設至捲取盤之作業、以及在特定路 徑設定導引銷等之作業，只需要較少時間即可更換新黏著 材盤，故可提高電子機器之生產效率。 利用申請專利範圍第2 0項記載之發明時，除了具有 和申請專利範圍第1 9項記載之發明相同之作用效果以外 ，因樹脂製黏著劑可從熱硬化性樹脂、光硬化性樹脂、及 熱金屬黏著劑之群組中選取適合黏著材膠帶間之連接的樹 脂製黏著劑，故可提高黏著材膠帶間之連接強度。 利用申請專利範圍第2 1項記載之發明時，黏著裝置 內因配設著供應申請專利範圍第1 9或20項記載之樹脂製 黏著劑之充塡機，無需另行準備充塡機，故可防止連接作 業之浪費。 利用申請專利範圍第22項記載之發明時，捲繞於一 方之捲部的黏著材膠帶全部捲出時，將捲繞於相鄰捲部之 黏著材膠帶裝設至捲取盤，實施黏著材膠帶之更換，因爲 無需將新黏著材膠帶盤裝著至黏著裝置。因此，只需較少 -180- (176) (176)200409405 之新黏著材膠帶盤之更換作業，故可提高電子機器之生產 效率。 利用申請專利範圍第2 3項記載之發明時，除了具有 和申請專利範圍第2 2項記載之發明相同之效果以外，因 係以連結膠帶連接一方之黏著材膠帶之終端部及另~方之 黏著材膠帶之始端部，故一方之黏著材膠帶盤之黏著材膠 帶全部捲出後，無需將另一方之捲部之黏著材膠帶裝設至 盤之作業，故可進一步提高電子機器之生產效率。 利用申請專利範圍第24項記載之發明時，因爲連結 膠帶會自動捲取至捲取盤，一方之捲部之黏著材膠帶全部 捲出後，會依序從下一捲部捲出黏著材膠帶。 又，膠帶檢測手段檢測到連結膠帶時，至連結膠帶通 過壓著部爲止，連結膠帶會被自動捲取至捲取盤，故可省 略捲取之麻煩。 利用申請專利範圍第2 5項記載之發明時，一方之黏 著材膠帶之終端部及另一方之黏著材膠帶之始端部之連接 部份，因爲係以黏著材膠帶覆蓋卡止具，故外觀良好，同 時，可防止連接部份之卡止具接觸黏著材膠帶而使黏著材 膠帶或黏著裝置受損。 利用申請專利範圍第2 6項記載之發明時，連接部檢 測手段檢測到連接部份，至連接部份通過壓著部爲止，會 將一方之黏著材膠帶捲取至捲取盤，可防止連接部份到達 壓著部時實施壓著動作之問題。又，至連接部份通過壓著 部爲止，因爲會自動將一方之黏著材膠帶捲取至捲取盤， -181 - (177) (177)200409405 故可省略捲取之麻煩。 利用申請專利範圍第2 7項記載之發明時，除了具有 和申請專利範圍第2 6項記載之發明相同之作用效果以外 ，以簡單之構成即可實施連接部份之檢測，而且，可利用 這些手段來提高檢測精度。 利用申請專利範圍第2 9項記載之發明時，因可依序 逐條使用複數條黏著劑，可在不增加膠帶之捲數的情形下 ，可使1盤可使用之黏著劑的量增加成傳統之2倍以上。 因未增加捲數’故可防止捲取散亂，同時，可防止因 爲黏著劑從膠帶之寬度方向滲出而使捲取之膠帶間發生黏 著所導致之阻塞，此外，亦可防止因爲膠帶狀之基材較長 而容易發生之伸展等弊病（基材之損傷或斷裂）。 因電子構件之製造工廠可減少新黏著劑膠帶之更換次 數，故可提高作業效率。 又，黏著劑膠帶之製造上，因可減少製造之盤數，可 減少盤材及濕氣防止材之使用量，故可降低製造成本。 利用申請專利範圍第3 0項記載之發明時，除了具有 和和申請專利範圍第29項記載之發明相同之效果以外， 因相鄰之黏著劑條間具有間隔，很容易即可實施逐條分離 ，而使對電路基板之壓著更爲容易。 利用申請專利範圍第3 1項記載之發明時，除了具有 和申請專利範圍第29項相同之效果以外，只需在塗布於 基材之單面全面上之黏著劑上形成縫隙即可，製造十分容 易，而且，相鄰之黏著劑條間的間隙很小，故可增加配置 -182- (178) (178)200409405 於基材上之黏著劑條之條數。 利用申請專利範圍第3 2項記載之發明時，很容易即 可製造申請專利範圍第3 0項記載之黏著劑膠帶。 利用申請專利範圍第3 3項記載之發明時，因可同時 製造2條黏著劑膠帶，故具有良好製造效率。 利用申請專利範圍第3 4項記載之發明時，因係實施 部份黏著劑之加熱來降低該部份之凝聚力並將其壓著至電 路基板，而黏著劑膠帶係使用在基材之單面全面塗布黏著 劑者，故可直接利用既存設備製造黏著劑膠帶。 壓著至電路基板之黏著劑的寬度，可利用變更加熱區 域而進行任意設定，故壓著之黏著劑寬度具有高自由度。 和申請專利範圍第29項記載之發明相同，因爲會依 逐條對基材上之黏著劑加熱並壓著至電路基板，可在不增 加膠帶之捲數的情形下，將1盤可使用黏著劑量增加成2 倍以上。 因無需增加捲數即可增加黏著劑量，故和申請專利範 圍第2 9項記載之發明相同，可防止捲取散亂，同時’亦 可防止因黏著劑之滲出而導致之阻塞及基材伸展之弊病。 利用申請專利範圍第3 5項記載之發明時，因爲黏著 劑膠帶之寬度具有電路基板之一邊以上之長度’故可在增 加黏著劑量，同時，減少黏著劑膠帶之捲數。 因爲無需增加黏著劑膠帶之捲數即可大幅增加使用黏 著劑量，故可防止捲取散亂，同時’可防止阻塞、基材之 損傷或斷裂。又，因電子構件之製造工廠可減少新黏著劑 -183- (179) (179)200409405 膠帶之更換次數，故可提高製造效率。 此外，黏著劑膠帶之製造上，因增加每I盤之黏著劑 量，可減少盤材及濕氣防止材之使用量，故可降低製造成 本 c 利用申請專利範圍第3 6項記載之發明時，除了具有 和申請專利範圍第3 5項記載之發明相同之效果以外，相 鄰之黏著劑條會分離，很容易即可逐條將黏著劑從基材剝 離並實施壓著。 利用申請專利範圍第3 7項記載之發明時，除了具有 和申請專利範圍第3 5項相同之效果以外，尙可增加配置 於基材上之黏著劑條之條數且製造更爲容易。 利用申請專利範圍第3 8項記載之發明時，因爲可利 用既存設備同時製造2條申請專利範圍第3 6項記載之黏 著劑膠帶，故具有良好製造效率。 利用申請專利範圍第3 9項記載之發明時，除了可得 到申請專利範圍第3 5項〜第3 7項之其中任一項記載之效 果以外，很簡單即可將黏著劑壓著至電路基板之一邊，而 可提高電子構件之製造工廠之作業效率。 利用申請專利範圍第4 0項記載之發明時，除了可得 到申請專利範圍第3 5項〜第3 7項記載之效果以外，無需 旋轉電路基板，而只要移動一方之黏著劑膠帶及另一方之 黏著劑膠帶之位置，很容易即可將黏著劑壓著至電路基板 之四周，故有良好之作業效率。 利用申請專利範圍第4 1項記載之發明時，將黏著劑 -184- (180) (180)200409405 壓著至電路基板之周圍時，會沿著寬度方向對黏著劑膠帶 實施條狀加熱加壓，很容易即可將黏著劑壓著至電路基板 ，而有良好之作業效率。 又，因爲只需在黏著劑膠帶之全面塗布黏著劑即可’ 故可直接利用既存設備製造黏著劑膠帶。 此外，壓著至電路基板之黏著劑的寬度’可利用改變 加熱加壓區域來實施任意設定，故壓著之黏著劑寬度具有 高自由度。 又，和申請專利範圍第3 5項記載之發明相同’因爲 未增加捲數卻可增加黏著劑量，故可防止捲取散亂’同時 ，得到可防止因黏著劑之滲出而造成之阻塞、及防止因基 材之伸展而造成之弊病等之效果。 申請專利範圍第42項記載之發明時，因係逐條使用 配置於黏著劑板上之寬度方向的至少2條黏著劑’每1盤 至少可使用2盤份，無需增加黏著劑膠帶之捲數，即可大 幅增加1盤可使用之黏著劑量。 而且，因爲未增加黏著劑膠帶之捲數，故可防止捲取 散亂，同時，可防止因爲黏著劑從膠帶之寬度方向滲出而 使捲取之膠帶間發生黏著所導致之阻塞，此外’亦可防止 因爲基材較長而容易發生之伸展等弊病（基材之損傷或斷 裂）。 因黏著劑膠帶係盒形式，黏著裝置上無需實施將黏著 劑膠帶裝設至盤之繁複業作，而只要將盒裝著至黏著裝置 即可，處理上更爲容易，且具有良好之裝設及更換作業性 -185- (181) (181)200409405 利用申請專利範圍第4 3項記載之發明時，除了具有 和申請專利範圍第42項記載之發明相同之效果以外，相 鄰之黏著劑條會分離，很容即可從基材逐條拉離黏著劑並 實施壓著。 利用申請專利範圍第44項記載之發明時，除了具有 和申請專利範圍第42項相同之效果以外，黏著劑膠帶只 需在基材之單面全面塗布黏著劑並形成縫隙即可，故製造 十分容易。 利用申請專利範圍第4 5項記載之發明時，因爲黏著 劑膠帶只需在基材之全面塗布黏著劑即可，故可直接利用 既存設備製造黏著劑膠帶。 壓著至電路基板之黏著劑的寬度，可利用改變加熱加 壓區域來實施任意設定，故壓著之黏著劑寬度具有高自由 度。 利用申請專利範圍第46項記載之發明時，除了具有 和申請專利範圍第4 5項相同之效果以外，尙和申請專利 範圍第1項記載之發明相同，因爲未增加捲數卻可增加黏 著劑量，故可防止捲取散亂’同時’得到可防止因黏著劑 之滲出而造成之阻塞、及防止因基材之伸展而造成之弊病 等之效果。使用時，1盤份全部捲出時，只需反轉盒即可 ，故下一次之裝著十分容易。因採用盒形式，處理上更爲 容易，且具有良好之裝設及更換作業性。 利用申請專利範圍第4 7項記載之發明時，利用黏著 -186- (182) (182)200409405 材膠帶之基材黏著全部捲出之黏著材膠帶之終端部、及新 裝著之黏著材膠帶之始端部，來實施黏著材盤之更換’故 很簡單即可將新黏著材盤裝著至黏著裝置。又，無需每次 更換新黏著材盤時都更換捲取盤、及將新黏著材盤之始端 裝設至捲取盤之作業，只需要較少時間即可更換新黏著材 盤，故可提高電子機器之生產效率。 利用申請專利範圍第4 8項記載之發明時，除了具有 和申請專利範圍第4 7項記載之發明相同之效果以外，因 爲熱熔融劑層位於基材之表面，可將始端部之黏著劑面重 疊於一方之黏著材膠帶之終端部之熱熔融劑層，對此部份 進行加熱壓著來連接兩者，故連接十分簡單。 又，因爲熱熔融劑層形成於膠帶之縱向全體，重疊長 度無需嚴格定位，故連接具有高自由度。 利用申請專利範圍第49項記載之發明時，除了具有 和申請專利範圍第47項記載之發明相同之效果以外，因 熱熔融劑層係夾於支持層之間，可防止熱熔融劑層曝露於 大氣下，故可防止濕氣之吸濕或灰塵等之附著而導致熱熔 融劑層之黏著強度降低。 利用申請專利範圍第5 0項記載之發明時，去除基材 端部之以脫模劑實施表面處理之部份，利用黏著材膠帶之 黏著劑黏著全部捲出之黏著材膠帶之終端部及新裝著之黏 著材膠帶之始端部，來實施黏著材盤之更換，故很簡單即 可將新黏著材盤裝著至黏著裝置。 利用申請專利範圍第5 1項記載之發明時，除了具有 -187- (183) (183)200409405 和申請專利範圍第50IX 記載之發明相同之效果以外， 因係利用電漿放電、紫外線照射、及雷射照射之其中任何 一種方法去除脫模劑，可在短時間內正確地去除脫模劑。 利用申請專利範圍第5 2項記載之發明時，因爲黏著 材膠帶盤上配設著複數個將黏著材膠帶捲繞於盤上之黏著 材膠帶之捲部（捲部），複數之捲部當中，一個捲部之黏 著材膠帶全部捲出時，會使用和全部捲出之捲部爲相鄰配 置之其他捲部之黏著材膠帶，因爲無需將新黏著材膠帶盤 裝著至黏著裝置，只需較少之新黏著材膠帶盤之更換作業 ，故可提高電子機器之生產效率。又，因爲係依序使用複 數之黏著材膠帶，無需增加1個黏著材膠帶盤之黏著材膠 帶的捲數，即可大幅增加1次更換作業之可使用的黏著劑 量。又，因爲無需增加黏著材膠帶之捲數，故可防止捲取 散亂，同時，可防止黏著劑從膠帶之寬度方向滲出而使已 捲取之黏著材膠帶間發生黏著，亦即，可防止阻塞，而且 ，亦可防止因爲基材較長而容易發生之伸展等弊病。 利用申請專利範圍第5 3項記載之發明時，因爲盤之 側板上配設著乾燥劑之收容部，除了具有和申請專利範圍 第5 2項記載之發明相同之作用效果以外，尙可從內部確 實除去黏著材膠帶盤內之濕氣，故可進一步防止黏著材膠 帶因濕氣之吸濕而發生品質降低下。 利用申請專利範圍第54項記載之發明時，因爲覆蓋 捲繞於盤上之黏著材膠帶之周圍的蓋體構件，係以可自由 裝卸之方式配設於盤上，黏著材膠帶不會直接曝露於大氣 -188- (184) (184)200409405 下，故可防止灰塵或大氣之濕氣對黏著材膠帶產生不良影 響。因此，即使配設複數之捲部時，對未使用之捲部配設 蓋體構件，可防止黏著材膠帶之品質降低。 又，因爲以可自由裝卸之方式配設蓋體構件，只要拆 下蓋體構件，即可簡單地從黏著材膠帶盤捲出黏著材膠帶 C. 利用申請專利範圍第5 5項記載之發明時，除了具有 和申請專利範圍第5 2至5 4項之其中任一項記載之發明相 同之作用效果以外，因爲尙可從蓋體構件之拉出口捲出黏 著材膠帶，故無需拆下黏著材膠帶盤之蓋體構件，而可直 接從黏著材膠帶盤捲出黏著材膠帶。 利用申請專利範圍第5 6項記載之發明時，具有和申 請專利範圍第5 2至5 5項之其中任一項記載之發明相同之 效果以外，尙因爲捲部之側板係以可自由裝卸之方式互相 嵌合，一方之捲部之黏著材膠帶全部捲出後，解除其和另 一方之捲部之嵌合，即可依序從下一捲部捲出黏著材膠帶 〇 利用申I靑專利fe圍第 5 7、5 8項記載之發明時，具有 和申請專利範圍第5 2至5 6項之其中任一項記載之發明相 同之作用效果’尤其是，黏著材膠帶爲將用以連接相對電 極之電極連接用黏著劑塗布於基材上之黏著材膠帶、黏著 材膠帶爲用以實施引線框架之固定用支持基板、半導體元 件載置用支持基板、或引線框架之晶片和半導體元件之連 接的黏著材膠帶時特別有用。 -189- (185) (185)200409405 利用申請專利範圍第5 9項記載之發明時，以單手握 持殼體，使露出黏著劑膠帶之開口部抵壓電路基板，加熱 構件從基材側實施加熱壓著·將黏著劑壓著至電路基板， 故十分小型且可以單手操作，尙且，很容易即可將黏著劑 壓著至基板之一部份。 利用申請專利範圍第6 0項記載之發明時，因爲黏著 材膠帶之基材係金屬膜或芳香族聚醯胺膜，即使基材之厚 度較薄時，亦可防止基材伸展或斷裂等之問題。 因此，利用厚度較薄之基材所構成之黏著材膠帶，可 增加每1盤之捲數，而增加1盤可使用之黏著劑量。又， 使用本發明之黏著材膠帶時，因可增加每1盤之捲數，電 子構件之製造工廠只需實施較少之新黏著材膠帶之更換次 數，故可提高作業效率。其次，黏著材膠帶之製造上，可 減少製造之盤數’並可減少盤材及濕氣防止材之使用量， 故可降低製造成本。 利用申請專利範圍第6 1項記載之發明時，除了具有 和申請專利範圍第6 0項記載之發明相同之效果以外，尙 可獲得較薄且具高拉伸強度之黏著材膠帶。 利用申請專利範圍第62項記載之發明時，除了具有 和申請專利範圍第6〇或6丨項記載之發明相同之效果以外 ，因爲基材之拉伸強度爲300MPa以上，不易發生基材伸 展或斷裂之問題。 利用申請專利範圍第6 3項記載之發明時，除了具有 和申請專利範圍第6 〇至62項之其中任一項記載之發明相 -190- (186) (186)200409405 同之效果以外’因爲基材對黏著劑之厚度比爲0 . 〇 1〜1 . 0 ，此外，尙可得到較薄且具有高拉伸強度之黏著材膠帶。 利用申請專利範圍第64項記載之發明時，除了具有 和申請專利範圍第6 0至6 3項之其中任一項記載之發明相 同之效果以外，基材之表面粗細度Rmax爲0.5〆m以下， 基材之表面十分平滑，將黏著劑壓著至電路基板時，黏著 劑容易從基材分離。 利用申請專利範圍第65項記載之發明時，在被覆體 上形成黏著劑之前一步驟，使一方之黏著材膠帶之黏著劑 、及另一方之黏著材膠帶之黏著劑重疊，得到期望之黏著 劑之厚度後，再在被覆體上形成黏著劑，故各黏著材膠帶 之厚度較薄，雖然黏著材膠帶之捲數增多，每1盤之黏著 材膠帶之捲繞直徑卻更小。 因此，可增加每1盤之黏著材膠帶之捲數，而可大幅 增加1次更換作業之可使用的黏著劑量。因此，只需較少 之新黏著材膠帶之更換作業即可，故可提高電子機器之生 產效率。 利用申請專利範圍第66項記載之發明時，除了具有 和申請專利範圍第65項記載之發明相同之效果以外，可 減少需要低溫管理之黏著材膠帶之數量，黏著材膠帶之運 送及保管可實施更有效率之管理。 利用申請專利範圍第67項〜72項之其中任一項記載 之發明時，因爲對被連接構件具有良好轉錄性（貼附性） 及良好連接信賴性，且可在改善步驟內之廢料率、及提高 -191 - (187) (187)200409405 作業性之情形下，提供傳統之長方形向異導電材膠帶，故 可提高生產性及作業性。 【圖式簡單說明】 第1圖係第1實施形態之黏著材膠帶連接方法時之黏 著材盤間之連接斜視圖。 第2圖A及第2圖B係第1圖之連接部份的連接步 驟斜視圖。 第3圖係黏著裝置之黏著劑的壓著步驟槪略圖。 第4圖係電路基板間之黏著的剖面圖。 第5圖係黏著材膠帶製造方法之步驟圖。 第6圖係本發明第2實施形態之黏著材膠帶連接方法 的斜視圖。 第7圖係本發明第2實施形態之變形例之黏著材膠帶 連接方法的斜視圖。 第8圖A〜C係第1實施形態之黏著材膠帶連接方法 圖，第8圖A係黏著材盤間之連接的斜視圖，第8圖B 係第8圖A之連接部份之連接方法的斜視圖，第8圖C 係第8圖A之連接部份的平面圖。 第9圖係本發明第2實施形態之黏著材膠帶連接方法 的剖面圖。 第1 〇圖係本發明第3實施形態之黏著材膠帶連接方 法的剖面圖。 第1 1圖係本發明第4實施形態之黏著材膠帶連接方 -192- (188) (188)200409405 法的剖面圖。 第1 2圖A及B係第i實施形態之黏著材膠帶連接方 法圖’第1 2圖A係黏著材盤間之連接的斜視圖，第；[2 圖B係第1 2圖A之連接部份之連接方法的斜視圖。 第1 3圖係本發明第2實施形態之黏著材膠帶連接方 法的剖面圖。 第1 4圖A及第丨4圖b係本發明第3實施形態之黏 著材膠帶連接方法的剖面圖，第1 4圖A係加熱加壓前之 狀態，第1 4圖B係加熱加壓後之狀態。 第1 5圖A及第丨5圖b係本發明第4實施形態之黏 著材膠帶連接方法圖，第15圖A係剖面圖，第15圖B 係平面圖。 第1 6圖A及第1 6圖B係第丨實施形態之黏著材膠 帶連接方法圖’第1 6圖A係黏著材盤間之連接的斜視圖 ，第1 6圖B係第1 6圖A之連接部份（b )的斜視圖。 第1 7圖係本發明第2實施形態之黏著材膠帶連接方 法的剖面圖。 第1 8圖係本發明第3實施形態之黏著材膠帶連接方 法的剖面圖。 第1 9圖係本發明第4實施形態之黏著材膠帶連接方 法的剖面圖。 第2 0圖A〜C係第1實施形態之黏著材膠帶連接方 法圖，第2 0圖A係黏著材盤間之連接的斜視圖，第2 0 圖B及C係第2 0圖A之連接部份之連接方法的剖面圖。 -193- (189) (189)200409405 第2 1圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第22圖A〜C係第1實施形態之黏著材膠帶盤圖， 第22圖A係黏著材膠帶盤的斜視圖，第22圖B係第22 圖A之正面圖’第22圖C係第22圖A之連結膠帶之平 面圖。 第2 3圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第24 1M系本發明第2實施形態之連結膠帶之平面圖 〇 第2 5圖係本發明第3實施形態之連結膠帶之平面圖 〇 第26圖係本發明第4實施形態之黏著材膠帶盤的斜 視圖。 第2 7圖A〜C係第1實施形態之黏著材膠帶盤圖， 第27圖A係黏著材膠帶盤的斜視圖，第27圖B係第27 圖A之正面圖，第27圖C係第27圖A之連接部份之剖 面圖。 第2 8圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第29圖係PDP之黏著劑之使用狀態的斜視圖。 第3 0圖係本發明第2實施形態之黏著材膠帶盤的斜 視圖。 第31圖A係將本發明之黏著材膠帶盤之黏著材膠帶 應用於LOC構造之半導體裝置時之黏著材膠帶之剖面圖 ，第31圖B係將本發明之黏著材膠帶盤之黏著材膠帶應 用於LOC構造之半導體裝置時之LOC構造之半導體裝置 (190) (190)200409405 之剖面圖。 第3 2圖A〜C係應用本發明之黏著材膠帶盤的黏著 裝置之槪略圖，第3 2圖A係正面圖，第3 2圖B係側面 圖’第3 2圖C係第3 2圖B之黏著材膠帶冲切貼附部8 9 的重要部位放大圖。 第3 3圖A及B係黏著劑膠帶圖，第3 3圖A係捲，键 著黏著劑膠帶之盤之斜視圖，第3 3圖B係第3 3圖a $ A - A剖面圖。 第34圖係PDP之黏著劑之使用狀態的斜視圖。 第3 5圖係將黏著劑塗布於基材之步驟的剖面圖。 第36圖A〜C係本發明第2實施形態之黏著劑藤帶 之剖面圖。 第3 7圖A〜C係本發明第3實施形態之黏著劑膨帶 及其壓著方法的步驟圖。 第3 8圖A〜C係本發明第4實施形態之黏著劑膨帶 製造方法的步驟圖。 第39圖A及B係黏著劑膠帶圖，第39圖a係捲糸连 著黏著劑膠帶之盤之斜視圖，第3 9圖B係從黏著劑側觀 看第3 9圖A之黏著劑膠帶時的平面圖。 第40圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第4 1圖係本發明第2實施形態之黏著裝置之黏箸劑 懕著步驟的槪略圖。 第42圖A〜C係本發明第3實施形態之黏著劑_帶 之剖面圖。 -195- (191) (191)200409405 第43圖A〜C係本發明第4實施形態之黏著劑膠帶 及其壓著方法的步驟圖。 第44圖A〜C係本發明第5實施形態之黏著劑膠帶 製造方法的步驟圖。 第45圖A及B係本發明第1實施形態之黏著劑膠帶 盒圖，第4 5圖A係黏著劑膠帶盒之斜視圖，第4 5圖B 係弟45圖A之A-A剖面圖。 第46圖係第45圖A所示之膠帶盒之盤的裝設狀態 剖面圖。 第47圖係黏著裝置之黏著劑壓著步驟的正面圖。 第48圖係黏著劑膠帶盒之製造方法的步驟圖。 第49圖係本發明第2實施形態之黏著裝置之黏著劑 壓著步驟的槪略圖。 第5 0圖係本發明第3實施形態之黏著劑膠帶之剖面 圖。 第5 1圖A及B係本發明第4實施形態之黏著劑膠帶 及其壓著方法的步驟圖。 第52圖A及B係第1實施形態之黏著材膠帶圖，第 5 2圖A係黏著材盤間之連接的斜視圖，第5 2圖B係第 5 2圖A之連接部份的剖面圖。 第5 3圖係第2實施形態之黏著材膠帶的剖面圖。 第5 4圖A〜C係第5 5圖之連接部份之連接步驟的剖 面圖，第5 4圖A係放電前之狀態，第5 4圖B係放電後 之狀態，第5 4圖C係連接部份之加熱壓著圖。 -196- (192) 200409405 第5 5圖係黏著材膠帶連接方法之黏著材盤間之連接 的斜視圖。 第5 6圖係黏著裝置之黏著劑壓著步驟的槪略圖。 第5 7圖A〜C係第1實施形態之黏著材膠帶盤圖， 第57圖A係黏著材膠帶盤的斜視圖，第57圖B係第57 圖A之正面圖，第57圖C係第57圖A之蓋體構件之正 面圖。A roll of an anisotropic conductive tape was produced in the same manner as in Example 1. Next, on the laminated body of the base film and the adhesive, two kinds of base film were used to sandwich the adhesive, and another type of polyethylene terephthalate base film having a thickness of 25 // m was laminated. (The breaking strength is 25 kg / mm2, and the breaking elongation is 130%.) A roll of an anisotropic conductive film having a three-layer structure was obtained. Secondly, in relation to Example 1, the roll of this film was cut into a width of 1.  5 m m, and rolled it up to a core material (reel) with a diameter of 48 mm and a width of 1000 m m with a side plate to become a coiled shape 'to obtain an anisotropic conductive tape with a length of 300 m. Example 2 was also the same as Example 1, and good productivity was obtained. (Example 3) Except for using a polytetrafluoroethylene film with a thickness of 50 / zm as a base film (breaking strength of 4 · 6 kg / m 2 and breaking elongation of 3 50%), Heshi-174- (170 ) (170) 200409405 The rolled material of the same anisotropic conductive material film as in Example 1, except that, similar to Example 1, the rolled material of this film was cut to a width of 1. 5 mm, wound around a core material (reel) with a diameter of 48 mm and a width of 100 mm with a side plate, and wound into a coil shape to obtain an anisotropic conductive tape with a length of 300 m. At this time, a length of 300 m may be wound. (Comparative Example 1) A rolled product of the same anisotropic conductive material film as in Example 1 was obtained. In addition, the rolled product of this film was cut to a width of 1 as in Example 1. 5mm, wound to the traditional disk with the same round core shape to obtain an anisotropic conductive tape with a length of 100m. When this anisotropic conductive material tape wound into a coil shape was mounted to an anisotropic conductive material tape automatic pressing machine and supplied to the anisotropic conductive material, the transcriptional and stretching tests of the anisotropic conductive material both obtained good results, however, The number of installations of the disk is three times that of the embodiment, and the installation time and adjustment time are increased. The industrial applicability of the present invention is as follows. As shown in the above description, when the invention described in the first patent application scope is used, the terminal part of the entire rolled-up adhesive tape (one adhesive tape) is newly adhered with the adhesive of the adhesive tape, and the newly installed At the beginning of the adhesive tape (the other adhesive tape), the adhesive tray can be replaced. It is easy to attach the new adhesive tape to the adhesive device. In addition, because there is no need to change the take-up tape every time a new adhesive tape is replaced, the operation of installing the new end of the new adhesive tape on the take-up tray, and the operation of setting a guide pin in a specific path, etc. -175- (171) (171) 200409405 can be replaced in less time, so it can improve the production efficiency of electronic equipment. Since the adhesive tape of one side and the adhesive tape of the other are adhered by overlapping the adhesive surfaces, the adhesive strength is high. When using the invention described in the second scope of the patent application, except for the same effect as the invention described in the first scope of the patent application, the cutting of all the rolled adhesive tape is performed when the end mark is exposed. The part that performs the connection operation is easy to untie and the connection can be performed with the minimum necessary position, and the waste of adhesive tape can be prevented. When the invention described in item 3 of the patent application scope is used, it has the same effect as the invention described in item 1 of the patent scope application. It is easy to attach a new adhesive tape to an adhesive device, and it takes less time. The new adhesive material plate can be replaced, so the production efficiency of electronic equipment can be improved. In addition, because the terminal part of the rolled-out adhesive material tape and the beginning of the newly installed adhesive material tape are adhered with the guide tape before the adhesive material tape, it is easy to implement the adhesion between the adhesive material tapes. When the invention described in item 4 of the scope of patent application is used, it has the same effect as the invention described in item 1 of the scope of patent application. It is easy to attach a new adhesive tape to an adhesive device, and it takes less time. The new adhesive material plate can be replaced, so the production efficiency of electronic equipment can be improved. In addition, because it is not necessary to fold back all the adhesive tape that is rolled out, when the adhesive tape is wound up to the take-up tray, it is possible to prevent possible winding scatter. When the invention described in item 5 of the scope of patent application is used, since the terminal portion of all the rolled adhesive tape and the beginning of the newly installed adhesive tape are fixed with the locking pin, the connection is very simple. Also, because there is no need to change the take-up tape every -176- (172) (172) 200409405 replacement of the new adhesive material tray, install the beginning of the new adhesive tape on the take-up tray, and set the specific path For operations such as guide pins, it takes less time to replace the new adhesive material plate, so the production efficiency of electronic equipment can be improved. When using the invention described in claim 6 of the patent application scope, the claw portion of one of the locking members is locked at the terminal portion of the adhesive tape of one side, and then the claw portion of the other member provided at the locking member is locked. The other end of the adhesive tape is connected to each other, so the connection is very easy. Because there is an elastic member between one claw portion and the other claw portion, the elastic member can be extended so that the other claw portion of the locking member is locked at any position of the starting end of the other adhesive tape. , So the connection has [1] degrees of freedom. In addition, the terminal portion of one side of the adhesive tape and the beginning of the other side of the adhesive tape are connected in a state of abutting each other. No overlapping tape is needed. The connection can be performed with the minimum necessary position, and the adhesive tape can be prevented. waste. When using the invention described in item 7 of the scope of patent application, it is only necessary to connect the terminal portion of the adhesive tape on one side of the clip with the overlapping portion of the beginning portion of the adhesive tape on the other side, and the connection operation is very easy. When the invention described in the eighth aspect of the patent application is applied, the clamping pieces are compressed from both sides of the overlapping portion to connect the two, which can improve the connection strength of the overlapping portion of the adhesive tape. When using the invention described in claim 9 of the scope of patent application, the terminal part of the used adhesive tape is adhered by the adhesive of the adhesive tape, and the adhesive tape of the new -177- (173) (173) 200409405 is attached At the beginning, the adhesive material plate is replaced, so it is easy to install the new adhesive material plate to the adhesive device. In addition, because there is no need to change the reeling plate of the substrate every time the new adhesive material plate is replaced, and the beginning of the new adhesive material is set to the reeling plate, it takes less time to replace the new adhesive material plate, so it can be replaced. Improve manufacturing efficiency. When using the invention described in claim 10, except for the same effect as the invention described in claim 9, the terminal part of one adhesive tape and the beginning of the other adhesive tape will mutually A hook-shaped lock is formed, and 'the two are connected to each other with an adhesive surface, so the connection strength is high. When using the invention described in item 11 of the scope of patent application, except that it has the same effect as the invention described in item 9 or 10 of the scope of patent application, the terminal part of the adhesive tape of one side is the end mark part, and the connection is performed. The operation part is easy to untie, and the waste of adhesive tape is prevented. When the invention described in the patent application scope item 12 is used, it has the same effect as the invention described in any one of the patent application scope items 9 to 11. Since the joint part will be uneven, the connection area can be enlarged. At the same time, it can improve the strength (longitudinal direction) of the adhesive tape of the connection part. When using the invention described in item 13 of the scope of patent application, except that the invention has the same effect as the invention described in any one of scope 9 to 11 of the scope of patent application, through-holes and through-holes are formed in the connection portion. The inner edge of the adhesive will ooze out, which can increase the adhesive area of the adhesive and further improve the connection strength. -178- (174) (174) 200409405 To use the invention described in item 14 of the scope of patent application, you only need to connect the used adhesive tape (one adhesive tape) and the new adhesive tape (the other Adhesive tape) can replace the disc, so it is very easy to install a new adhesive disc to the adhesive device. In addition, because there is no need to change the take-up disc each time a new adhesive material disc is replaced, install the beginning of the new adhesive material tape on the take-up disc, and install the adhesive material tape on the guide. The new adhesive material plate can be replaced in less time, so the production efficiency of electronic equipment can be improved. The treatment agent used for the substrate of the adhesive tape is a silicon resin, and the adhesive tape also uses a silicon adhesive. Since the difference in surface tension between the two can be reduced and the adhesion is improved, it can be difficult to achieve traditionally. The adhesion of the two. When using the invention described in item 15 of the scope of patent application, except for the same effect as the invention described in item 14 of scope of patent application, the surface tension of the adhesive surface of the silicon adhesive tape and the silicon treatment of the adhesive tape The difference in surface tension between the substrates is 10 mN / m (lOdyne / cm) or less, a strong adhesion can be obtained, and both can be surely adhered. When using the invention described in the 16th scope of the patent application, except that the invention has the same effect as the invention described in the 15th scope of the patent application, the adhesive force is 100 g / 2 5 mm or more. The adhesion of the two adhesive surfaces of one side of the adhesive tape is stronger. When using the invention described in item 17 of the scope of patent application, except that it has the same effect as the invention described in item 16 of the scope of patent application, the adhesive tape is used to connect one side and the other side on both sides, so it can be stronger. Of connection. -179 · (175) (175) 200409405 When using the invention described in item 18 of the scope of patent application, because the silicon adhesive tape with a double-sided adhesive is used, the adhesive is sandwiched between the silicon adhesive tape on one side and the other Adhesive (or close) of the two is implemented by the method of tape, so the connection between the two is very simple and easy. When using the invention described in item 19 of the scope of patent application, the terminal part of the adhesive tape that has been completely rolled out and the starting end of the newly installed adhesive tape are fixed with a paste resin adhesive, so the connection is very simple. In addition, because there is no need to change the take-up tape every time the new adhesive tape is replaced, install the new end of the new adhesive tape to the take-up tray, and set the guide pin in a specific path, etc. The new adhesive material plate can be replaced in less time, so the production efficiency of electronic equipment can be improved. When the invention described in claim 20 is used, the resin adhesive can be used for thermosetting resin, photocurable resin, and From the group of hot metal adhesives, a resin adhesive suitable for the connection between the adhesive tapes is selected, so the connection strength between the adhesive tapes can be improved. When using the invention described in the scope of patent application No. 21, the adhesive device is equipped with a filling machine for supplying the resin adhesive described in the scope of patent application No. 19 or 20, so it is not necessary to prepare a separate filling machine, so it can be prevented. Waste of connection work. When using the invention described in claim 22 of the scope of patent application, when all the adhesive tapes wound on one roll are rolled out, the adhesive tapes wound on the adjacent rolls are mounted on a take-up tray to implement the adhesive. Replacement of adhesive tape, because there is no need to install a new adhesive tape to the adhesive device. Therefore, less replacement work of the new adhesive tape tape of -180- (176) (176) 200409405 is required, so the production efficiency of electronic equipment can be improved. When using the invention described in item 23 of the scope of patent application, except that the invention described in item 22 of the scope of patent application has the same effect, the terminal part of the adhesive tape and the other side are connected by a connecting tape. The beginning of the adhesive tape, so after all the adhesive tape of one adhesive tape tray is rolled out, there is no need to install the adhesive tape of the other coil to the tray, so the production efficiency of electronic equipment can be further improved. . When using the invention described in the scope of application for patent No. 24, because the connecting tape is automatically wound up to the take-up tray, after all the adhesive tapes of one roll part are rolled out, the adhesive tapes are sequentially rolled out from the next roll part . In addition, when the connecting tape is detected by the tape detecting means, the connecting tape is automatically wound up to the take-up disc until the connecting tape passes through the pressing portion, so the trouble of winding can be omitted. When using the invention described in claim 25 of the scope of patent application, the connection between the terminal part of the adhesive tape of one side and the beginning of the adhesive tape of the other side is good because the adhesive is covered with the adhesive tape. At the same time, it can prevent the connecting part of the locking device from contacting the adhesive tape and damaging the adhesive tape or the adhesive device. When using the invention described in claim 26 of the scope of patent application, the connection part detection means detects the connection part, and until the connection part passes the crimping part, one of the adhesive tape is wound to the take-up disc, which can prevent the connection There is a problem that a pressing operation is performed when a part reaches the pressing section. In addition, until the connecting part passes the crimping part, the adhesive tape of one side is automatically wound up to the take-up disc, -181-(177) (177) 200409405, so the trouble of winding can be omitted. When using the invention described in the 27th scope of the patent application, except that the invention has the same effect as the invention described in the 26th scope of the patent application, the connection part can be detected with a simple structure, and these can be used. Means to improve detection accuracy. When using the invention described in item 29 of the patent application range, since multiple adhesives can be used one by one in order, the amount of adhesive that can be used on one tray can be increased without increasing the number of tapes. More than 2 times the tradition. Because the number of rolls has not been increased, the coiling can be prevented from being scattered. At the same time, it can prevent blockage caused by adhesion between the coiled tapes caused by the adhesive from seeping out from the width of the tape. In addition, it can also prevent Disadvantages such as long and prone stretch of the substrate (damage or breakage of the substrate). Since the manufacturing plant of electronic components can reduce the number of replacements of new adhesive tapes, the operating efficiency can be improved. In addition, since the number of disks to be manufactured can be reduced in the manufacture of the adhesive tape, the amount of the disk material and the moisture-proof material can be reduced, so the manufacturing cost can be reduced. When using the invention described in the 30th scope of the patent application, except that the invention has the same effect as the invention described in the 29th scope of the patent application, it is easy to separate one by one because there is a space between adjacent adhesive strips. And make pressing on the circuit board easier. When using the invention described in the 31st scope of the patent application, except that it has the same effect as the 29th scope of the patent application, it is only necessary to form a gap in the adhesive coated on the single side of the substrate, and the manufacturing It is easy, and the gap between adjacent adhesive strips is small, so the number of adhesive strips arranged on the substrate can be increased -182- (178) (178) 200409405. When the invention described in claim 32 is used, it is easy to manufacture the adhesive tape described in claim 30. When using the invention described in item 33 of the scope of patent application, two adhesive tapes can be manufactured at the same time, so it has good manufacturing efficiency. When the invention described in item 34 of the scope of patent application is used, the heating of a part of the adhesive is used to reduce the cohesion of the part and press it to the circuit board, and the adhesive tape is used on one side of the substrate Those who fully apply the adhesive can directly use existing equipment to make adhesive tapes. The width of the adhesive to be pressed onto the circuit board can be arbitrarily set by changing the heating area, so the width of the adhesive to be pressed has a high degree of freedom. The invention is the same as the invention described in item 29 of the scope of patent application, because the adhesive on the substrate is heated and pressed to the circuit board one by one, and one disk can be used for adhesion without increasing the number of tapes. The dose was more than doubled. Because the adhesive dose can be increased without increasing the number of rolls, it is the same as the invention described in item 29 of the patent application scope, which can prevent the coiling from being scattered, and at the same time, it can also prevent blockage and substrate stretching caused by the bleeding of the adhesive. The ills. When using the invention described in claim 35 of the patent application range, since the width of the adhesive tape has a length of one side or more of the circuit substrate ', the amount of the adhesive tape can be increased, and the number of rolls of the adhesive tape can be reduced. Because the amount of adhesive used can be increased significantly without increasing the number of rolls of adhesive tape, it can prevent the coiling from being scattered, and at the same time, it can prevent blockage, damage or breakage of the substrate. In addition, the manufacturing plant of electronic components can reduce the number of replacement of new adhesive tapes -183- (179) (179) 200409405, which can improve manufacturing efficiency. In addition, in the manufacture of adhesive tapes, increasing the amount of adhesive per I disk can reduce the amount of disk material and moisture-proof material used, so the manufacturing cost can be reduced. C When using the invention described in item 36 of the scope of patent application, In addition to having the same effect as the invention described in the 35th item of the patent application scope, the adjacent adhesive strips are separated, and the adhesive can be easily peeled from the substrate one by one and pressed. When the invention described in item 37 of the scope of patent application is used, in addition to having the same effects as those in item 35 of the scope of patent application, it is possible to increase the number of adhesive strips arranged on the substrate and make it easier to manufacture. When the invention described in item 38 of the scope of patent application is used, it is possible to manufacture two adhesive tapes described in item 36 of the scope of patent application at the same time using existing equipment, so it has good manufacturing efficiency. When using the invention described in the 39th scope of the patent application, in addition to the effects described in any one of the 35th to 37th scope of the patent application, the adhesive can be simply pressed onto the circuit board. One side can improve the operation efficiency of the manufacturing plant of electronic components. When using the invention described in the 40th scope of the patent application, in addition to the effects described in the 35th to 37th scope of the patent application, it is not necessary to rotate the circuit board, but only to move one of the adhesive tapes and the other The position of the adhesive tape makes it easy to press the adhesive around the circuit board, so it has good operating efficiency. When using the invention described in item 41 of the scope of patent application, when the adhesive -184- (180) (180) 200409405 is pressed around the circuit board, the adhesive tape is heated and pressed along the width direction. It is easy to press the adhesive to the circuit board, and it has good operating efficiency. In addition, since it is only necessary to apply the adhesive on the entire surface of the adhesive tape ', it is possible to directly manufacture the adhesive tape using the existing equipment. In addition, the width of the adhesive to be pressed to the circuit substrate can be arbitrarily set by changing the heating and pressure region, so the width of the adhesive to be pressed has a high degree of freedom. Also, the invention is the same as the invention described in item 35 of the scope of the patent application. “Because the adhesive amount can be increased without increasing the number of rolls, the coiling can be prevented from being scattered. The effect of preventing ills caused by stretching of the substrate. When applying for the invention described in item 42 of the patent scope, since at least two adhesives arranged in the width direction of the adhesive plate are used one by one, at least two disks can be used per one disk without increasing the number of adhesive tapes. , You can greatly increase the adhesive dose that can be used for 1 plate. In addition, because the number of rolls of the adhesive tape is not increased, the coiling can be prevented from being scattered, and at the same time, the blocking caused by the adhesion between the wound tapes due to the adhesive oozing out from the width direction of the tape can be prevented. It can prevent the disadvantages (such as damage or breakage of the base material) that are easy to occur due to the long base material. Because the adhesive tape is in the form of a box, there is no need to implement the complicated work of installing the adhesive tape to the tray on the adhesive device, and only the box is attached to the adhesive device, which is easier to handle and has a good installation. And replacement workability -185- (181) (181) 200409405 When using the invention described in item 43 of the scope of patent application, except for the same effect as the invention described in item 42 of the scope of patent application, adjacent adhesive strips It will separate, and the adhesive can be pulled away from the substrate one by one and pressed. When using the invention described in the 44th scope of the patent application, except for the same effect as the 42nd scope of the patent application, the adhesive tape only needs to be fully coated with an adhesive on one side of the base material to form a gap. easily. When using the invention described in claim 45 of the scope of patent application, since the adhesive tape only needs to be fully coated with the adhesive on the substrate, the existing adhesive equipment can be used to make the adhesive tape directly. The width of the adhesive to be pressed to the circuit board can be arbitrarily set by changing the heating and pressing area, so the width of the adhesive to be pressed has a high degree of freedom. When using the invention described in the 46th scope of the patent application, except that it has the same effect as the 45th scope of the patented scope, it is the same as the invention described in the first scope of the patented scope, because the adhesive dose can be increased without increasing the number of volumes. Therefore, it can prevent the coiling from being scattered at the same time, and can prevent the blocking caused by the adhesive from oozing out, and the effects caused by the stretching of the substrate. When in use, when one tray is rolled out, you only need to reverse the box, so it is very easy to load next time. Because it is in the form of a box, it is easier to handle and has good installation and replacement workability. When using the invention described in item 47 of the scope of patent application, use the adhesive-186- (182) (182) 200409405 substrate to adhere the entire end of the rolled adhesive tape and the newly installed adhesive tape. At the beginning, the replacement of the adhesive material plate is performed, so it is very easy to install the new adhesive material plate to the adhesive device. In addition, there is no need to replace the reeling tray each time a new adhesive material tray is replaced, and the operation of installing the new end of the new adhesive material tray to the reeling tray. It only takes less time to replace the new adhesive material tray, so it can improve Production efficiency of electronic machines. When using the invention described in the 48th scope of the patent application, except that the invention has the same effect as the invention described in the 47th scope of the patent application, because the hot melt layer is located on the surface of the base material, the adhesive surface at the beginning can be placed. The hot-melt layer that overlaps the terminal part of one adhesive tape is heated and pressed to connect the two, so the connection is very simple. In addition, since the hot-melt agent layer is formed in the entire lengthwise direction of the tape, the overlapping length does not need to be strictly positioned, so the connection has a high degree of freedom. When the invention described in claim 49 is used, the hot melt agent layer is sandwiched between the support layers, except that it has the same effect as the invention described in claim 47. This prevents the hot melt agent layer from being exposed to Under the atmosphere, it can prevent the moisture absorption or the adhesion of dust and the like to reduce the adhesive strength of the hot melt layer. When using the invention described in claim 50 of the scope of patent application, remove the part of the end of the substrate that is surface-treated with a release agent, and use the adhesive of the adhesive tape to adhere the entire end of the rolled adhesive tape and the new The starting end of the installed adhesive tape is used to replace the adhesive tray, so it is easy to install the new adhesive tray to the adhesive device. When using the invention described in Article 51 of the scope of patent application, except that the invention has the same effect as -187- (183) (183) 200409405 and the invention described in scope of patent scope 50IX, it is due to the use of plasma discharge, ultraviolet radiation, and Either of the laser irradiation methods can remove the mold release agent, and the mold release agent can be removed accurately in a short time. When using the invention described in Item 52 of the scope of patent application, the adhesive tape tape tray is provided with a plurality of roll sections (roll sections) of the adhesive tape that winds the adhesive tape on the tray. Among the plurality of roll sections, When all the adhesive tapes of one roll are rolled out, the adhesive tapes of the other rolls arranged next to all the rolled parts will be used, because there is no need to install a new adhesive tape to the adhesive device, only It requires less replacement work of new adhesive tapes, which can improve the production efficiency of electronic equipment. In addition, because a plurality of adhesive tapes are used in sequence, it is not necessary to increase the number of adhesive tapes of one adhesive tape tray, which can greatly increase the amount of adhesive that can be used in one replacement operation. In addition, since it is not necessary to increase the number of rolls of the adhesive material tape, it can prevent the coiling from being scattered, and at the same time, can prevent the adhesive from seeping out from the width direction of the adhesive tape and cause adhesion between the rolled adhesive material tapes. Blockage can also prevent ill effects such as stretching that can easily occur due to long substrates. When using the invention described in Article 53 of the scope of patent application, because the storage section of the desiccant is arranged on the side plate of the tray, it has the same effect as the invention described in Article 52 of the scope of patent application. The moisture in the adhesive tape tray is definitely removed, so the quality of the adhesive tape can be further prevented from deteriorating due to moisture absorption. When using the invention described in claim 54 of the patent application scope, the cover member covering the adhesive tape around the disk is detachably disposed on the disk, and the adhesive tape is not directly exposed. Under the atmosphere -188- (184) (184) 200409405, it can prevent dust or atmospheric moisture from adversely affecting the adhesive tape. Therefore, even when a plurality of rolls are provided, a cover member is provided to the unused rolls to prevent the quality of the adhesive tape from being degraded. In addition, because the cover member is provided in a detachable manner, as long as the cover member is removed, the adhesive tape can be easily rolled out from the adhesive tape. C.  When using the invention described in claim 55, it has the same effect as the invention described in any of claims 52 to 54, because 尙 can be pulled out from the cover member. The adhesive tape is rolled out, so there is no need to remove the cover member of the adhesive tape tray, but the adhesive tape can be directly rolled out from the adhesive tape tray. The invention described in item 56 of the scope of patent application has the same effect as the invention described in any one of the scope of patent applications 52 to 55, because the side plate of the roll part is freely attachable and detachable. After the adhesive tapes of one roll part are all rolled out, the mating of the adhesive tape with the other roll part can be released, and then the adhesive tape can be rolled out from the next roll part in sequence. Using the patent application When the inventions described in items 5-7 and 58 have the same effect as the inventions described in any one of the items 5-2 to 56 in the scope of application for patents, in particular, the adhesive tape is used to connect Adhesive material tapes and adhesive material tapes applied to the substrate for the electrode connection of the counter electrode are used to implement a support substrate for fixing a lead frame, a support substrate for mounting a semiconductor element, or a wafer of a lead frame and semiconductor components It is particularly useful when attaching adhesive tape. -189- (185) (185) 200409405 When using the invention described in item 5 or 9 of the patent application scope, hold the case with one hand, press the opening exposed by the adhesive tape against the circuit board, and heat the component from the substrate. The side is heated and pressed. The adhesive is pressed to the circuit board, so it is very small and can be operated with one hand, and it is easy to press the adhesive to a part of the substrate. When using the invention described in claim 60 of the scope of patent application, since the base material of the adhesive tape is a metal film or an aromatic polyamide film, even if the thickness of the base material is thin, it can prevent the base material from stretching or breaking. problem. Therefore, the adhesive tape made of a thin substrate can increase the number of rolls per reel and increase the amount of adhesive that can be used per reel. In addition, when the adhesive tape of the present invention is used, since the number of rolls per reel can be increased, the electronic component manufacturing factory only needs to perform fewer replacements of the new adhesive tape, thereby improving work efficiency. Second, in the manufacture of adhesive tapes, the number of discs to be manufactured can be reduced, and the amount of discs and moisture-proof materials can be reduced, so the manufacturing cost can be reduced. When the invention described in Article 61 of the scope of patent application is used, in addition to having the same effects as the invention described in Article 60 of the scope of patent application, 尙 a thin adhesive tape with high tensile strength can be obtained. When using the invention described in the 62nd patent application scope, except that the invention has the same effect as the invention described in the 60th or 6th patent application scope, because the tensile strength of the substrate is 300 MPa or more, it is not easy for the substrate to stretch or The problem of fracture. When using the invention described in item 63 of the scope of patent application, it has the same effect as the invention described in any one of the scope of patent applications 60-62 -190- (186) (186) 200409405 'because The thickness ratio of the substrate to the adhesive is 0.  〇 1 ~ 1.  In addition, 尙 can obtain a thin adhesive tape with high tensile strength. When using the invention described in the scope of application for the patent 64, in addition to having the same effect as the invention described in any of the scope of the patent application for 60 to 63, the surface roughness Rmax of the substrate is 0. Below 5〆m, the surface of the substrate is very smooth. When the adhesive is pressed to the circuit board, the adhesive is easily separated from the substrate. When using the invention described in the patent application No. 65, one step before the adhesive is formed on the cover is to overlap the adhesive of one adhesive tape and the adhesive of the other adhesive tape to obtain the desired adhesive. After the thickness is formed, an adhesive is formed on the covering body, so the thickness of each adhesive tape is thin. Although the number of rolls of the adhesive tape is increased, the winding diameter of each adhesive tape is smaller. Therefore, the number of rolls of adhesive tape per disc can be increased, and the amount of adhesive that can be used in a single replacement operation can be greatly increased. Therefore, fewer replacements of new adhesive tapes are required, which can increase the production efficiency of electronic equipment. When the invention described in the scope of patent application is used, the invention has the same effect as the invention described in the scope of patent application, except that the number of adhesive tapes requiring low temperature management can be reduced, and the transportation and storage of adhesive tapes can be implemented. More efficient management. When using the invention described in any one of claims 67 to 72 in the scope of patent application, because it has good transcription (adhesion) and good connection reliability for the connected member, and it can improve the waste rate in the step, And -191-(187) (187) 200409405 In the case of workability, the conventional rectangular anisotropic conductive tape is provided, so the productivity and workability can be improved. [Brief description of the drawings] FIG. 1 is a perspective view of the connection between the adhesive material discs when the adhesive material tape connection method of the first embodiment is used. Figures 2A and 2B are perspective views of the connecting steps of the connecting portion of Figure 1. Fig. 3 is a schematic diagram of a pressing step of an adhesive of an adhesive device. FIG. 4 is a cross-sectional view showing adhesion between circuit boards. Fig. 5 is a step diagram of a method for manufacturing an adhesive tape. Fig. 6 is a perspective view of a method for connecting an adhesive tape according to a second embodiment of the present invention. Fig. 7 is a perspective view of a method for connecting an adhesive tape according to a modification of the second embodiment of the present invention. 8A to 8C are diagrams of a method for connecting adhesive tapes of the first embodiment, FIG. 8A is a perspective view of a connection between adhesive material discs, and FIG. 8B is a method for connecting a connecting part of FIG. 8A Figure 8 is a plan view of the connecting part of Figure 8A. Fig. 9 is a sectional view of a method for connecting an adhesive tape according to a second embodiment of the present invention. Fig. 10 is a cross-sectional view of a method for connecting an adhesive tape according to a third embodiment of the present invention. Fig. 11 is a cross-sectional view of the adhesive material tape connection method -192- (188) (188) 200409405 of the fourth embodiment of the present invention. Figure 12 and Figure A are diagrams showing the connection method of the adhesive tape in the i-th embodiment. Figure 12 is a perspective view of the connection between the adhesive material discs. Figure 2 shows the connection of Figure 12 and Figure A. Partial connection method. Fig. 13 is a cross-sectional view of a method for connecting an adhesive tape according to a second embodiment of the present invention. Fig. 14A and Fig. 4B are cross-sectional views of a method for connecting an adhesive material tape according to a third embodiment of the present invention. Fig. 14A is a state before heating and pressing, and Fig. 14B is a heating and pressing. After the state. Fig. 15A and Fig. 5b are diagrams of a method for connecting adhesive tapes according to a fourth embodiment of the present invention, Fig. 15 is a sectional view, and Fig. 15B is a plan view. Fig. 16A and Fig. 16B are diagrams of a method for connecting adhesive tapes according to the first embodiment. Fig. 16A is a perspective view of the connection between the adhesive material discs, and Fig. 16B is a 16th diagram. An oblique view of the connecting portion (b) of A. Fig. 17 is a cross-sectional view of a method for connecting an adhesive tape according to a second embodiment of the present invention. Fig. 18 is a cross-sectional view of a method for connecting an adhesive material tape according to a third embodiment of the present invention. Fig. 19 is a cross-sectional view of a method for connecting an adhesive tape according to a fourth embodiment of the present invention. Figures 20 to 20 are the diagrams of the adhesive material tape connection method of the first embodiment. Figure 20 is a perspective view of the connection between the adhesive material disks. Figures 20 and 20 are the drawings of Figure 20A. A sectional view of the connection method of the connection part. -193- (189) (189) 200409405 Fig. 21 is a schematic diagram of a pressure-sensitive adhesive pressing step of an adhesive device. Fig. 22 is a perspective view of the adhesive tape tape of the first embodiment, Fig. 22 is a perspective view of the adhesive tape tape of Fig. 22, and Fig. 22 is a front view of Fig. 22 and Fig. 22 is a front view of Fig. 22 22 A plan view of the connecting tape. Figures 23 and 3 are schematic diagrams of the steps of pressing the adhesive of the adhesive device. Fig. 24 1M is a plan view of a connecting tape according to a second embodiment of the present invention. Fig. 25 is a plan view of a connecting tape according to a third embodiment of the present invention. Fig. 26 is a perspective view of an adhesive material tape tray according to a fourth embodiment of the present invention. Illustration. Figures 27 to A are the adhesive tape tapes of the first embodiment, Figure 27 is a perspective view of the adhesive tape tape of Figure 27, Figure 27 is a front view of Figure 27, and Figure 27 is a C Fig. 27 is a sectional view of a connecting portion. Fig. 28 is a schematic diagram of the adhesive pressing step of the adhesive device. Fig. 29 is a perspective view showing a state of use of the adhesive of the PDP. Figure 30 is a perspective view of an adhesive tape tray according to a second embodiment of the present invention. FIG. 31A is a cross-sectional view of the adhesive tape when the adhesive tape of the adhesive tape tray of the present invention is applied to a semiconductor device with a LOC structure, and FIG. 31B is the adhesive tape of the adhesive tape tray of the present invention. A cross-sectional view of a semiconductor device having a LOC structure (190) (190) 200409405 when applied to a semiconductor device having a LOC structure. Fig. 32 and Fig. A ~ C are schematic diagrams of an adhesive device using the adhesive tape tape of the present invention. Fig. 32 is a front view and Fig. 32 is a side view. Fig. 32 is a C view. An enlarged view of important parts of the adhesive tape die-cutting and attaching portion 8 9 in FIG. B. Figure 3 3 is a diagram of A and B series of adhesive tapes, Figure 33 is a perspective view of a roll of adhesive tape, and Figure 33 is a section of Figure 33 a $ A-A. Fig. 34 is a perspective view showing a state of use of the adhesive of the PDP. Figures 3 and 5 are cross-sectional views of a step of applying an adhesive to a substrate. Figs. 36A to C are sectional views of an adhesive rattan tape according to a second embodiment of the present invention. Figs. 37 to 7 are diagrams showing steps of an adhesive tape and a method for pressing the same according to a third embodiment of the present invention. Figs. 38 to A are steps of a method for producing an adhesive tape according to a fourth embodiment of the present invention. Figure 39 A and B are adhesive tapes, Figure 39 a is a perspective view of a disk with a roll of adhesive tape attached, and Figure 39 is a view of the adhesive tape shown in Figure 3 9A from the adhesive side. Floor plan. Fig. 40 is a schematic diagram of an adhesive pressing step of the adhesive device. Fig. 41 is a schematic diagram of a bonding step of an adhesive of an adhesive device according to a second embodiment of the present invention. Figures 42 to A are cross-sectional views of the adhesive tape of the third embodiment of the present invention. -195- (191) (191) 200409405 Figs. 43A to C are diagrams showing steps of an adhesive tape according to a fourth embodiment of the present invention and a method for pressing the same. Figs. 44A to 44C are diagrams showing the steps of a method for manufacturing an adhesive tape according to a fifth embodiment of the present invention. 45A and 45B are diagrams of the adhesive tape box according to the first embodiment of the present invention, Fig. 45A is a perspective view of the adhesive tape box, and Fig. 45B is a cross-sectional view taken along the line A-A of Fig. 45A. Fig. 46 is a cross-sectional view showing the installation state of the disk of the tape cassette shown in Fig. 45A. Figure 47 is a front view of an adhesive pressing step of the adhesive device. Fig. 48 is a step diagram of the manufacturing method of the adhesive tape case. Fig. 49 is a schematic view showing a pressure-sensitive adhesive bonding step of an adhesive device according to a second embodiment of the present invention. Figure 50 is a sectional view of an adhesive tape according to a third embodiment of the present invention. Fig. 51 A and B are process diagrams of an adhesive tape and a pressing method according to a fourth embodiment of the present invention. Fig. 52A and B are diagrams of the adhesive tape of the first embodiment, Fig. 52 is a perspective view of the connection between the adhesive material discs, and Fig. 52B is a cross-section of the connection part of Fig. 52A Illustration. Fig. 53 is a cross-sectional view of the adhesive tape of the second embodiment. Fig. 54 A to C are sectional views of the connection steps of the connection part of Fig. 55, Fig. 54 is a state before discharging, Fig. 54 is a state after discharging, and Fig. 54 is C This is the heating and pressing diagram of the connection part. -196- (192) 200409405 Figure 5 5 is an oblique view of the connection between the adhesive material plates of the adhesive material tape connection method. Figures 5 and 6 are schematic diagrams of the steps of pressing the adhesive of the adhesive device. Figures 5 to 7 are views of the adhesive tape tape disk of the first embodiment, Figure 57 is a perspective view of the adhesive tape tape disk of Figure 57, Figure 57 is a front view of Figure 57A, and Figure 57 is C Fig. 57 is a front view of a cover member.

第58圖係黏著材膠帶盤之製造方法的步驟圖。 第5 9圖係本發明第2實施形態之黏著材膠帶盤之側 面圖。 第60圖A及B係本發明第3實施形態之黏著材膠帶 盤之正面圖、及黏著劑膠帶之更換說明圖。 第6 1圖係本發明第4實施形態之捲部之側板的斜市見 圖。Fig. 58 is a step diagram of a manufacturing method of an adhesive material tape reel. Figures 5 and 9 are side views of an adhesive tape tray according to a second embodiment of the present invention. Figs. 60 and A are front views of the adhesive tape tray of the third embodiment of the present invention, and illustrations of replacement of the adhesive tape. Fig. 61 is an oblique view of a side plate of a roll section according to a fourth embodiment of the present invention.

第62圖A及B係本發明第1實施形態之黏著具圆， 弟62圖A係黏者具之斜視圖，第62圖B係第62圖 A-A剖面圖。 第63圖係用以說明第62圖A及第62圖B所示之黏 著具之使用方法的側面圖。 第64圖係黏著具之製造方法的步驟圖。 第6 5圖A及B係第1實施形態之黏著材膠帶圖，第 65圖A係黏著材膠帶捲繞於盤之斜視圖，第65圖A丨系^ 65圖A之A-A剖面圖。 第66圖A及B係第1實施形態之黏著材膠帶之黏著 -197- (193) (193)200409405 材形成步驟圖’第6 6圖A係使各黏著材膠帶重疊成一鑛 且將一方之基材捲取至捲取用盤之步驟的槪略圖，第66 圖B係第66圖A之黏著劑間之重疊部份的剖面圖。 第6 7圖係黏著裝置在被覆體上形成黏著劑之步驟的 槪略圖。 第6 8圖係捲繞著黏著材膠帶之盤之斜視圖。 第69圖A係第2實施形態之黏著材膠帶之黏著材形 成步驟的剖面圖’第69圖B係應用第69圖A之黏著材 實施電路基板間之黏著的剖面圖。 第70圖係本發明之2層構成向異導電材膠帶之供應 形態的模式圖。 第71圖係本發明之3層構成向異導電材膠帶之供應 形態的模式圖。 【主要元件對照表】 1 黏著材膠帶 2 捲部 2a 捲部 2b 黏著材膠帶盤 2c 黏著材膠帶盤 3 盤 3 a 盤 5 捲軸 7 側板 -198- (194)200409405Figures 62 and A are circle views of the adhesive tool of the first embodiment of the present invention, Figure 62 is a perspective view of the adhesive tool, and Figure 62 is a sectional view of Figure 62A-A. Fig. 63 is a side view for explaining how to use the adhesive tool shown in Figs. 62A and 62B. Fig. 64 is a step diagram of a method for manufacturing an adhesive. Fig. 65 and Fig. A and B are views of the adhesive tape of the first embodiment, Fig. 65 is a perspective view of the adhesive tape wound on the disk, and Fig. 65A is a cross-sectional view of A-A of Fig. 65A. Fig. 66 A and B are the adhesion of the adhesive tape of the first embodiment -197- (193) (193) 200409405 Material formation steps diagram 'Fig. 6 6 A shows the adhesive tapes of each adhesive are overlapped into one ore and one of them is FIG. 66 is a schematic view of a step of winding a substrate to a winding tray, and FIG. 66B is a cross-sectional view of an overlapping portion between the adhesives in FIG. 66A. Figures 6 and 7 are schematic diagrams of the steps in which the adhesive device forms an adhesive on the cover. Figures 6 and 8 are perspective views of a disk wrapped with adhesive tape. Fig. 69A is a cross-sectional view of the step of forming the adhesive material of the adhesive tape of the second embodiment. Fig. 69B is a cross-sectional view of the circuit board using the adhesive of Fig. 69A for adhesion. Fig. 70 is a schematic view showing a form of supply of a two-layer constitution to a tape of a different conductive material according to the present invention. Fig. 71 is a schematic view showing a form of supply of a three-layer constitution to a tape of a different conductive material according to the present invention. [Comparison table of main components] 1 Adhesive tape 2 Roll section 2a Roll section 2b Adhesive tape tray 2c Adhesive tape tray 3 tray 3 a tray 5 Reel 7 Side plate -198- (194) 200409405

7 a 側板 7b 側板 8 蓋體構件 9 基材 9 a 基材 9b 基材 10 乾燥齊11 11 膜狀黏著劑 11a 黏著齊U lib 黏著齊IJ 12 收容部 13 導電粒子 15 黏著裝置 16 導引件 17 捲取盤 19 加熱加壓頭 2 1 電路基板 2 1 a 電極 22 導引銷 23 配線電路 23a 電極 24 聚四氟乙烯材 2 5 捲出機 26 PDP (195) 塗布機 結束標記 乾燥爐 終端部 捲取機 始端部 切割機 重疊部份 縫隙 工作台 連結膠帶 黏著劑 凹凸 卡止銷 卡止構件 爪部 爪部 彈性構件 爪 夾子 夾持片 模具 模具 凹凸 -200 - (196) 貫通孔 矽粘著膠帶 矽粘著膠帶 矽粘著劑 基材 樹脂製黏著劑 充塡機 加熱器 連結膠帶 切口部份 標記 標記 發光部 受光部 連接部份 切口 卡止具 厚度檢測感測器 支持膜 控制裝置 黏著劑層 半導體用黏著膜 半導體元件 引線框架 -201 - (197) 密封材 焊絲 匯流排條 冲切模具 引線框架搬運部 黏著材膠帶冲切貼附部 加熱器部 黏著材膠帶盤 黏著材膠帶 黏著材膠帶捲出滾輪 黏著材膠帶 公模 母模 膜壓板 縫隙 殼體 半殼體 半殼體 黏著劑膠帶盒 導引件 縫隙 凝聚力降低線 工作台 放電機 -202- (198) 拉出口 軸 蓋帽 被嵌合部 黏著具 開口部 加熱構件 電熱板 齒輪 齒輪 齒輪單元 第三殼體 電源開關 盤 -203-7 a side plate 7b side plate 8 cover member 9 base material 9 a base material 9b base material 10 dry 11 11 film adhesive 11a adhesive U lib adhesive IJ 12 container 13 conductive particles 15 adhesive device 16 guide 17 Winding plate 19 Heating and pressing head 2 1 Circuit board 2 1 a Electrode 22 Guide pin 23 Wiring circuit 23a Electrode 24 Teflon 2 5 Unwinder 26 PDP (195) Coating machine end mark Drying furnace terminal section roll Take the beginning of the end of the cutting machine overlapping part gap table connection tape adhesive concave-convex locking pin locking member claw part claw part elastic member claw clip holding piece mold mold uneven -200-(196) through-hole silicon adhesive tape silicon Adhesive tape Silicone adhesive substrate Resin-based adhesive filling machine heater connection tape Notch part mark Marking light emitting part Light receiving part connection part Notch stopper Thickness detection sensor Supporting film control device Adhesive layer semiconductor Adhesive Film Semiconductor Element Lead Frame -201-(197) Sealing Material Wire Bus Bar Punching Die Lead Frame Carrying Section Adhesive Material Tape Punching Adhesive part Heater part Adhesive tape Tape Adhesive tape Adhesive tape Adhesive tape roll out Roller Adhesive tape Adhesive tape Male mold master film Press plate gap shell Half shell Half shell Adhesive tape box Guide Gap cohesion reduction line table Discharger -202- (198) Pull-out shaft cap is adhered to the fitting part with an opening part heating member electric heating plate gear gear unit third housing power switch board -203-

Claims (1)

(1) (1)200409405 拾、申請專利範圍 1 · 一種黏著材膠帶連接方法，係用以連接基材上塗布 著電極連接用黏著劑之捲取至一方之盤上之一方之黏著材 膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶，其 特徵爲： 將一方之黏著材膠帶之終端部反折，使一方之黏著材 膠帶之黏著劑面及另一方之黏著材膠帶之黏著劑面重疊， 並實施兩者之重疊部份的加熱壓著使其連接。 2 .如申請專利範圍第1項記載之黏著材膠帶連接方法 ，其中 一方之黏著材膠帶之終端部標示著結束標記。 3. —種黏著材膠帶連接方法，係用以連接基材上塗布 著電極連接用黏著劑之捲取至一方之盤之一方之黏著材膠 帶、及捲取至另一方之盤上之另一方之黏著材膠帶，其特 徵爲： 另一方之黏著材膠帶之始端部係利用將前導膠帶貼附 於捲附至盤上之黏著材膠帶基材面來使其停止，在將一方 之黏著材膠帶之終端部反折後，再使前導膠帶之黏著劑面 和一^方之黏著材膠帶之終細部之黏者劑面重Η，貫施重疊 部份之加熱壓著。 4. 一種黏著材膠帶連接方法，係用以連接基材上塗布 著電極連接用黏著劑之捲取至一方之盤上之一方之黏著材 膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶，其 特徵爲ζ -204- (2) (2)200409405 另一方之黏著材膠帶之始端部係利用將前導膠帶貼附 於捲附至盤上之黏著材膠帶基材面來使其停止，使前導膠 帶之黏著劑面和一方之黏著材膠帶之終端部之黏著劑面重 疊，實施重疊部份之加熱壓著。 5 · —種黏著材膠帶連接方法，係用以連接基材上塗布 著電極連接用黏著劑之捲取至一方之盤之一方之黏著材膠 帶、及捲取至另一方之盤上之另一方之黏著材膠帶，其特 徵爲： 使一方之黏著材膠帶之終端部、及另一方之黏著材膠 帶之始端部重疊，在兩者之重疊部份***卡止銷來實施連 接。 6. —種黏著材膠帶連接方法，係利用卡止構件來連接 用以連接基材上塗布著電極連接用黏著劑之捲取至一方之 盤上之一方之黏著材膠帶、及捲取至另一方之盤上之另一 方之黏著材膠帶的黏著材膠帶，其特徵爲= 卡止構件具有配設於一方及另一方之端部之爪部、及 配設於爪部間之彈性構件，一方之黏著材膠帶之終端部及 另一方之黏著材膠帶之始端部會互相抵接，配設於卡止構 件之一端之爪部會卡止於一方之黏著材膠帶之終端部，配 設於另一端之爪部會卡止於另一方之黏著材膠帶之始端部 ，以彈性構件拉近兩方之爪部。 7. —種黏著材膠帶連接方法，係用以連接基材上塗布 著電極連接用黏著劑之捲取至一方之盤上之一方之黏著材 膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶，其 -205- (3) (3)200409405 特徵爲： 使一方之黏著材膠帶之終端部、及另一方之黏著材膠 帶之始端部重疊，以橫剖面略呈〕字形之可彈性變形之夾 子實施兩者之重疊部份的夾持固定。 8.—種黏著材膠帶連接方法，其特徵爲： 係以橫剖面略呈〕字形之金屬製夾持片夾住一方之黏 著材膠帶及另一方之黏著材膠帶之重疊部份，並從重疊部 份之兩面側壓扁夾持片來連接兩者。 9 · 一種黏著材膠帶連接方法，係用以連接基材上塗布 著電極連接用黏著劑之捲取至一方之盤上之一方之黏著材 膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶，其 特徵爲： 使一方之黏著材膠帶之終端部、及另一方之黏著材膠 帶之始端部之其中任何一方之黏著劑面重疊於另一方之基 材面上，兩者之重疊長度爲黏著劑膠帶寬度之2倍至50 倍之範圍，以兩者之加熱壓著實施連接。 1 〇 . —種黏著材膠帶連接方法，係用以連接基材上塗 布著電極連接用黏著劑之捲取至一方之盤上之一方之黏著 材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶， 其特徵爲： 將一方之黏著材膠帶之終端部折向黏著劑相對之方向 ，而將另一方之黏著材膠帶之始端部折向黏著劑相對之方 向，使兩者之彎折部份互相卡止重疊且使兩者之黏著材面 相對，實施重疊部份之加熱壓著。 •206- (4) (4)200409405 η ·如申請專利範圍第9或l 〇項記載之黏著材膠帶連 接方法，其中 一方之黏著材膠帶之終端部會標示著結束標記。 1 2 .如申請專利範圍第9至1 1項項之其中任一項記載 之黏著材膠帶連接方法，其中 以形成凹凸之一方之模具、及和其咬合之另一方之模 具，夾住一方之黏著材膠帶及另一方之黏著材膠帶之重疊 部份’貫施加熱壓著。 1 3 ·如申請專利範圍第9〜1 1項之其中任一項記載之 黏著材膠帶連接方法，其中 在一方之黏著材膠帶及另一方之黏著材膠帶之重疊部 份形成貫通孔後，實施重疊部份之加熱壓著。 1 4 · 一種黏著材膠帶連接方法，係用以連接矽處理基 材上塗布著電極連接用黏著劑之捲取至一方之盤上之一方 之黏著材膠帶、及捲取至另一方之盤上之另一方之黏著材 膠帶，其特徵爲： 一方之黏著材膠帶之終端部及另一方之黏著材膠帶之 始端部會重疊或抵接，以跨越兩黏著材膠帶之矽處理基材 之表面部份的方式貼附矽粘著膠帶，實施兩黏著材膠帶之 連接。 1 5 . —種黏著材膠帶連接方法，其特徵爲： 申請專利範圍第1 4項記載之矽粘著膠帶之粘著劑面 之表面張力及黏著材膠帶之矽處理基材之表面張力之差爲 10mN/m ( 10dyne/cm)以下。 -207- (5) (5)200409405 1 6 ·如申請專利範圍第1 4或1 5項記載之黏著材膠帶 連接方法，其中 石夕粘者膠帶之黏者力係100g/25mm以上。 1 7 . —種黏著材膠帶連接方法，其特徵爲： 使一方之黏著材膠帶之終端部及另一方之黏著材膠帶 之始端部重疊或抵接，並將申請專利範圍第1 6項記載之 矽粘著膠帶張貼於兩黏著材膠帶之兩面來實施連接。 1 8 · —種黏著材膠帶連接方法，係用以連接砂處理基 材上塗布著電極連接用黏著劑之捲取至一方之盤上之一方 之黏著材膠帶、及捲取至另一方之盤上之另一方之黏著材 膠帶，其特徵爲： 以一方之黏著材膠帶之終端部及另一方之黏著材膠帶 之始端部間夾著兩面塗布著矽粘著劑之矽粘著膠帶之方式 來實施兩黏著材膠帶之連接，兩面之矽粘著劑和矽處理基 材之表面張力之差爲l〇mN/m(10dyne/cm)以下，且黏著 力爲100g/25mm以上。 1 9 . 一種黏著材膠帶連接方法，係用以連接基材上塗 布著電極連接用黏著劑之捲取至一方之盤上之一方之黏著 材膠帶、及捲取至另一方之盤上之另一方之黏著材膠帶， 其特徵爲= 一方之黏著材膠帶之終端部、及另一方之黏著材膠帶 之始端部重疊或抵接，使糊狀之樹脂製黏著劑附著於重疊 部份或抵接部份，以糊狀之樹脂製黏著劑之硬化來實施兩 者之連接。 -208- (6) (6)200409405 2 0 ·如申請專利範圍第！ 9項記載之黏著材膠帶連接方 法，其中 樹脂製黏著劑係從熱硬化性樹脂、光硬化性樹脂、及 熱金屬黏著劑之群組中選取之至少1種材料所構成。 21·—種黏著材膠帶黏著裝置，其特徵爲： 裝著著黏著材膠帶之黏著裝置上，裝設著用以供應申 請專利範圍第1 9或2 0項記載之樹脂製黏著劑的充塡機。 2 2 · —種黏著材膠帶盤，係用以捲取基材上塗布著電 極連接用黏著劑之黏著材膠帶，其特徵爲： 黏著材膠帶盤在膠帶之寬度方向配設著複數黏著材膠 帶之捲部。 2 3 ·如申請專利範圍第2 2項記載之黏著材膠帶盤，其 中 一方之黏著材膠帶之終端部及另一方之黏著材膠帶之 始端部間’具有用以連接兩者之連結膠帶，一方之黏著材 膠帶全部捲出時，會接著開始捲出另一方之黏著材膠帶。 24·—種黏著裝置，係具有申請專利範圍第23項記載 之黏著材膠帶盤、黏著材膠帶之捲取盤、配設於黏著材膠 帶盤及捲取盤之間且以加熱加壓頭將黏著材膠帶之黏著材 壓著至電子機器之電路基板的壓著部、以及用以檢測連結 膠帶之膠帶檢測手段，其特徵爲： 膠帶檢測手段檢測到連結膠帶時，至連結膠帶通過壓 著部爲止會將連結膠帶捲取至捲取盤。 2 5 . —種黏著材膠帶盤，係利用卡止具連接一方之黏 -209- (7) (7)200409405 著材膠帶之終端部及另一方之黏著材膠帶之始端部，其特 徵爲： 連接部份係以黏著材膠帶覆蓋卡止具。 2 6 . —種黏著裝置，係具有申請專利範圍第2 5項記載 之黏著材膠帶盤、黏著材膠帶之捲取盤、配設於黏著材膠 帶盤及捲取盤之間且以加熱加壓頭將黏著材膠帶之黏著材 壓著至電路基板之壓著部、以及用以檢測膠帶之連接部份 的連接部檢測手段，其特徵爲= 連接部檢測手段檢測到膠帶之連接部份時，至連接部 份通過壓著部爲止，會將一方之黏著材膠帶捲取至捲取盤 〇 27·如申請專利範圍第26項記載之黏著裝置，其中 連接部檢測手段係C C D攝影機、厚度檢測感測器、 及透射率檢測感測器之其中之一。 28·—種黏著材膠帶連接方法，其特徵爲： 利用卡止具連接一方之黏著材膠帶之終端部及另一方 之黏著材膠帶之始端部，連接部份會以黏著材膠帶覆蓋卡 止具。 2 9 . —種黏著劑膠帶，係在基材上塗布黏著劑並捲成 盤狀，其特徵爲： 基材上會在膠帶之縱向上配置著複數條黏著劑。 3〇·如申請專利範圍第29項記載之黏著劑膠帶，其中 複數條黏著劑之相鄰的黏著劑條具有間隔。 3 1 ·如申請專利範圍第29項記載之黏著劑膠帶，其中 -210- (8) (8)200409405 黏著劑係利用在膠帶之縱向上形成縫隙來分離成複數 條。 3 2 · —種黏著劑膠帶製造方法，係在基材上塗布黏著 劑並將其捲成盤狀，其特徵爲： 以在基材之寬度方向具有間隔之方式配置之塗布器， 對以連續方式搬運之基材面上供應黏著劑來對基材實施複 數條黏著劑之塗布。 3 3 · —種黏著劑膠帶製造方法，係在基材上塗布黏著 劑並將其捲成盤狀，其特徵爲： 在一方之基材之單面全面塗布黏著劑，並在黏著劑上 形成縱向之縫隙後，在黏著劑面上配置另一方之基材，以 一方及另一方之基材夾住黏著劑，然後再使一方之基材及 另一方之基材互相分離，一方及另一方之基材上分別交互 貼附著複數條黏著劑，而在一方及另一方之基材上以具有 間隔之方式配置複數條黏著劑。 3 4 . —種黏著劑壓著方法，係在基材上塗布黏著劑， 並利用捲成盤狀之黏著劑膠帶將黏著劑壓著至電路基板， 其特徵爲： 基材之單面全面會塗布著黏著劑，對黏著劑膠帶之寬 度方向的部份黏著劑從基材側沿膠帶之縱向實施加熱加壓 形成條狀，降低經過加熱之部份之黏著劑的凝聚力並壓著 至電路基板，壓著後，將殘餘之黏著劑和基材同時捲成盤 狀，並再度利用捲成盤狀之黏著劑膠帶對電路基板實施殘 餘之黏著劑的加熱加壓。 -211 - (9) (9)200409405 *"5·—種黏著劑膠帶’係在基材上塗布黏著劑並捲成 盤狀’其特徵爲： ^鸯劑膠帶之寬度爲和電路基板之_^邊之長度相同或 以上’且在膠帶之寬度方向上配置著複數條黏著劑。 3 6 ·如申請專利範圍第3 5項記載之黏著劑膠帶，其中 以相鄰之黏著劑條具有間隔之方式配設複數條黏著劑 〇 3 7 ·如申請專利範圍第3 5項記載之黏著劑膠帶，其中 黏著劑係利用形成於膠帶之寬度方向的縫隙而分離成 複數條。 3 8 · —種黏著劑膠帶製造方法，係在基材上塗布黏著 劑並將其捲成盤狀，其特徵爲： 將黏著劑塗布於一方之基材之全面，並在黏著劑上沿 著膠帶之寬度方向形成縫隙後，在黏著劑面上配置另一方 之基材，以一方及另一方之基材夾住黏著劑，然後再使一 方之基材及另一方之基材互相分離，一方及另一方之基材 上分別交互貼附著複數條黏著劑，而在一方及另一方之基 材上以具有間隔之方式配置著複數條黏著劑。 3 9·—種黏著劑膠帶壓著方法，其特徵爲： 將申請專利範圍第3 5項〜第3 7項之其中任一項記載 之黏著劑膠帶配置於電路基板上，沿著寬度方向對黏著劑 膠帶實施加熱加壓，將黏著劑條壓著至電路基板之一邊。 40·—種黏著劑膠帶壓著方法，至少在移動電路基板 之搬運路上配置2條申請專利範圍第3 5項〜第3 7項之其 -212- 200409405 do) 中任一項記載之黏著劑膠帶，一方之黏著劑膠帶之配置上 ，其寬度方向和搬運路成垂直，另一方之黏著劑膠帶之配 置上，其寬度方向係沿著搬運路之方向，一方之黏著劑膠 帶係針對電路基板之相對2邊沿著寬度方向實施黏著劑膠 帶之加熱加壓將黏著劑條壓著至電路基板之相對2邊，其 次’使電路基板朝另一方之黏著劑膠帶移動，針對電路基 板之其餘2邊從基材側沿著寬度方向實施黏著劑膠帶之加 熱加壓，將黏著劑條壓著至電路基板之四周。 4 1 · 一種黏著劑膠帶壓著方法，係在基材之單面全面 塗布黏著劑，並利用捲成盤狀之黏著劑膠帶對電路基板實 施黏著劑之壓著，其特徵爲： 黏著劑膠帶之寬度爲電路基板之一邊之長度以上，從 寬度方向實施黏著劑膠帶之寬度方向之部份黏著劑的加熱 加壓，降低加熱部份之黏著劑的凝聚力，將黏著劑壓著至 電路基板。 4 2.—種黏著劑膠帶盒，其特徵爲： 具有一方之盤、另一方之盤、以及用以收容以可自由 旋轉方式裝設之這些盤的殼體，一方之盤上捲繞著在基材 上塗布著黏著劑之黏著劑膠帶，另一方之盤則固定著黏著 劑膠帶之一端，黏著劑膠帶上沿著膠帶之縱向至少配置著 2條黏著劑。 4 3.如申請專利範圍第42項記載之黏著劑膠帶盒，其 中 至少爲2條之黏著劑，其相鄰之黏著劑條會具有間隔 -213· (11) (11)200409405 4 4 .如申請專利範圍第4 2項記載之黏著劑膠帶盒，黏 著劑係利用膠帶之縱向上形成之縫隙來分離成至少2條。 4 5 · —種黏著劑壓著方法，其特徵爲： 將：具有一方之盤、另一方之盤、以及用以收容以可 自由旋轉方式裝設之這些盤的殼體；及一方之盤上捲繞著 在基材上塗布著黏著劑之黏著劑膠帶，而另一方之盤固定 著黏著劑膠帶之一端；之黏著劑膠帶盒，裝著至壓著裝置 ，從黏著劑膠帶盒將黏著劑膠帶拉出至電路基板上，對黏 著劑膠帶之寬度方向的一部份實施加熱加壓，降低加熱部 份之黏著劑的凝聚力，將寬度方向之部份黏著劑壓著至電 路基板。 4 6.—種黏著劑壓著方法，其特徵爲： 將：具有一方之盤、另一方之盤、以及用以收容以可 自由旋轉方式裝設之這些盤的殼體；及一方之盤上捲繞著 在基材上塗布著黏著劑之黏著劑膠帶，而另一方之盤則固 定著黏著劑膠帶之一端；之黏著劑膠帶盒，裝著至壓著裝 置，從黏著劑膠帶盒將黏著劑膠帶拉出至電路基板上，對 黏著劑膠帶之寬度方向的一部份實施加熱加壓，降低加熱 部份之黏著劑的凝聚力，將寬度方向之部份黏著劑壓著至 電路基板，捲取至一方之盤上之黏著劑膠帶全部捲出後’ 將黏著劑膠帶盒反轉’而將殘餘之部份黏著劑壓著至電路 基板。 47.—種黏著材膠帶，係塗布於基材上之捲成盤狀之 -214· (12) (12)200409405 黏著劑膠帶，其特徵爲： 基材具有熱熔融劑層及支持層。 4 8 .如申請專利範圍第4 7項記載之黏著材膠帶，其中 支持層夾於熱熔融劑層之間。 49·如申請專利範圍第47項記載之黏著材膠帶，其中 熱熔融劑層夾於支持層之間。 5 0 . —種黏著材膠帶連接方法，係用以連接捲取至一 方之盤上之一方之黏著材膠帶、及捲取至另一方之盤上之 另一方之黏著材膠帶，其特徵爲： 黏著材膠帶具有以脫模劑實施表面處理之基材及黏著 劑，除去其中任何一方之黏著材膠帶之基材端部之脫模劑 ，使另一方之黏著材膠帶之黏著劑面重疊於該部份，以實 施兩者之重疊部份的加熱壓著來進行連接。 5 1 ·如申請專利範圍第1項記載之黏著材膠帶連接方 法，其中 脫模劑之除去係利用電漿放電、紫外線照射、雷射照 射之其中任何一種方式來實施。 5 2 · —種黏著材膠帶盤，係以具有兩側板之盤捲取黏 著材膠帶，其特徵爲： 黏著材膠帶盤之膠帶之寬度方向上配設著複數之黏著 材膠帶之捲部。 5 3 ·如申請專利範圍第5 2項記載之黏著材膠帶盤，其 中 盤之側板上配設著乾燥劑之收容部。 -215- (13) (13)200409405 5 4 .如申請專利範圍第5 2或5 3項記載之黏著劑膠帶 盤，其中 以可自由裝卸之方式，將覆蓋捲繞於盤上之黏著材膠 帶之周圍的蓋體構件配設於盤上。 5 5 .如申請專利範圍第5 4項記載之黏著材膠帶盤，其 中 蓋體構件具有黏著材膠帶之拉出口。 5 6 ·如申請專利範圍第5 2或5 3項記載之黏著材膠帶 盤，其中 黏著材膠帶之捲部之側板係以可自由裝卸之方式互相 嵌合。 57·申請專利範圍第52或53項記載之黏著劑膠帶盤 ，其中 黏著材膠帶係將用以連接相對電極之電極連接用黏著 劑塗布於基材上之黏著材膠帶。 5 8 ·如申請專利範圍第5 2或5 3項記載之黏著劑膠帶 盤，其中 黏著材膠帶係用以實施引線框架之固定用支持基板、 半導體元件載置用支持基板、或引線框架之晶片和半導體 元件之連接之黏著材膠帶。 59.—種黏著具，係具有一方之盤、另一方之盤、使 一方之盤及另一方之盤實施連動旋轉之齒輪單元、收容前 述構件之殼體、配置於殼體之開口部的加熱構件、以及對 加熱構件供應電力之電源手段，其特徵爲： -216- (14) (14)200409405 一方之盤上捲繞著在基材上塗布著黏著劑之黏著劑膠 帶，另一方之盤則固定著黏著劑膠帶之一端，加熱構件具 有利用供應之電力實施發熱之電熱構件，將捲取至一方之 盤上之黏著劑膠帶從殼體之開口部拉出，以加熱構件從基 材側對位於開口部之黏著劑膠帶實施加熱加壓，將黏著劑 壓著至電路基板，並以另一方之盤捲取黏著劑已被剝離之 基材。 60.—種黏著材膠帶，係塗布於基材上之黏著材膠帶 ，其特徵爲： 基材係由金屬膜或芳香族聚醯胺膜所構成。 6 1 .如申請專利範圍第6 0項記載之黏著材膠帶，其中 基材之厚度爲l//m〜25/^m。 6 2.如申請專利範圍第60或61項記載之黏著材膠帶 ，其中 基材之拉伸強度在2 5 °C時爲3 0 0 Μ P a以上。 6 3 .如申請專利範圍第6 0或6 1項記載之黏著材膠帶 ，其中 基材對黏著劑之厚度比爲0.01〜1 . 0。 6 4 ·如申請專利範圍第6 0頭或申請專利範圍第6 1項 δ己載之黏著材膠帶，其中 基材之表面粗細度Rmax爲0.5 // m以下。 65.—種黏著材膠帶之黏著材形成方法，係在基材上 塗布黏著劑，利用捲成盤狀之黏著材膠帶在被覆體上形成 黏著劑，其特徵爲： -217- (15) (15)200409405 分別從複數之盤拉出黏著材膠帶，使各黏著材膠帶重 疊成一體，；剝離一方之基材的同時，在被覆體上形成重 疊成一體之黏著劑。 6 6 ·申請專利範圍第6 5項記載之黏著材膠帶之黏著材 形成方法，其中 只有一方之黏著材膠帶之黏著劑含有硬化劑。 67.—種向異導電材膠帶，其特徵爲： 在芯材之縱向上實施具有膜狀黏著劑之向異導電材的 多數次捲繞積層。 6 8 .如申請專利範圍第6 7項記載之向異導電材膠帶’ 其中 前述向異導電材係在膜狀黏著劑之單面配設基材膜之 2層構造的向異導電材。 69.如申請專利範圍第67項記載之向異導電材膠帶， 其中 前述向異導電材係在膜狀黏著劑之兩面配設基材0旲之 3層構造之向異導電材。 7〇.如申請專利範圍第68或69項記載之向異導電材 膠帶，其中 對前述基材膜之單面或兩面實施剝離處理。 7 !.如申請專利範圍第67至69項之其中任一項記載 之向異導電材膠帶，其中 前述膜狀黏著劑之寬度爲〇·5〜5mm。 72.如申請專利範圍第68或69項記載之向異導電材 -218- (16) 200409405 膠帶，其中 基材膜之強度爲12kg/mm2以上、伸展爲60〜200 %、 厚度爲l〇〇/im以下。 -219-(1) (1) 200409405 Pickup, patent application scope 1 · An adhesive material tape connection method is used to connect a substrate coated with an electrode connection adhesive to a roll of one of the adhesive tape, And the adhesive tape of the other side wound onto the disk of the other side, which is characterized in that: the terminal part of the adhesive tape of one side is folded back, so that the adhesive side of the adhesive tape of one side and the adhesive tape of the other side The adhesive surfaces are overlapped, and heating and pressing of the overlapped portions of the two are connected to each other. 2. The adhesive material tape connection method described in item 1 of the scope of the patent application, wherein the end portion of one of the adhesive material tapes is marked with an end mark. 3. —An adhesive material tape connection method, which is used to connect the adhesive material tape on the substrate coated with the electrode connection adhesive to one of the disks and to the other disk The adhesive material tape is characterized in that the other end of the adhesive material tape is stopped by using a leading tape attached to the base material surface of the adhesive material tape wound on the disc, and one adhesive tape is stopped. After the terminal part is reversely folded, the adhesive side of the leading tape and the adhesive side of the final detail of the one-sided adhesive tape are re-weighted, and the overlapping part is heated and pressed. 4. An adhesive material tape connection method, which is used to connect an adhesive material tape coated on one side of a substrate coated with an electrode connection adhesive to one of the plates and wound to the other side of the other plate The adhesive material tape is characterized by ζ -204- (2) (2) 200409405 The other end of the adhesive material tape is made by using a leading tape attached to the base material surface of the adhesive material tape which is wound on a disc. When it stops, the adhesive surface of the leading tape and the adhesive surface of the terminal portion of one side of the adhesive tape are overlapped, and the overlapped portion is heated and pressed. 5 · —A kind of adhesive material tape connection method, which is used to connect the adhesive material tape coated on one side of the substrate coated with the electrode connection adhesive to one side of the adhesive tape and the other side to the other side of the disk The adhesive tape is characterized in that the terminal portion of one adhesive tape and the starting end of the other adhesive tape are overlapped, and a locking pin is inserted at the overlapping portion of the two to implement connection. 6. —An adhesive material tape connection method, which uses a locking member to connect the adhesive material tape coated on one side of the substrate coated with the electrode connection adhesive to one of the adhesive tapes and to the other The adhesive tape of the adhesive tape of the other side on one plate is characterized in that: the locking member has a claw portion arranged at one end portion of the other and the other side, and an elastic member disposed between the claw portions. The terminal portion of the adhesive material tape and the other end of the adhesive material tape will abut each other, and the claw portion disposed at one end of the locking member will be locked at the terminal portion of the adhesive material tape, which is disposed at the other The claws at one end will be locked at the beginning of the adhesive tape of the other side, and the claws of both sides will be drawn closer by the elastic member. 7. —An adhesive material tape connection method, which is used to connect a substrate coated with an electrode connection adhesive to a coil of one side of the adhesive tape and a coil of the other material to the other. The adhesive tape of one side has the following characteristics: -205- (3) (3) 200409405: The terminal portion of one adhesive tape and the beginning of the other adhesive tape are overlapped, and the cross-section is slightly shaped.] The elastically deformable clip clamps and fixes the overlapping portion of the two. 8. A method for connecting adhesive tapes, which is characterized in that: a metal clamping piece with a shape of [] in a cross section is used to sandwich the overlapping portion of one adhesive tape and the adhesive tape of the other and The two sides of the part flatten the clamping pieces to connect the two. 9 · An adhesive material tape connection method, which is used to connect an adhesive material tape coated on one side of a substrate coated with an electrode connection adhesive to one of the plates and wound to the other side of the other plate The adhesive material tape is characterized in that the adhesive surface of one of the terminal portion of the adhesive material tape of one side and the starting end portion of the other adhesive material tape is superimposed on the substrate surface of the other. The overlapping length is in the range of 2 to 50 times the width of the adhesive tape, and the two are connected by heating and pressing. 1 〇. — An adhesive material tape connection method, which is used to connect a substrate coated with an electrode connection adhesive to a roll of one of the adhesive tapes and a roll of the adhesive tape to the other. The other adhesive tape is characterized in that the terminal end of one adhesive tape is folded in the opposite direction of the adhesive, and the beginning end of the other adhesive tape is folded in the opposite direction of the adhesive, so that the two The bent portions are locked and overlapped with each other and the adhesive material surfaces of the two are opposed to each other, and the overlapped portions are heated and pressed. • 206- (4) (4) 200409405 η • If the adhesive tape connection method described in item 9 or 10 of the scope of patent application is applied, the end of one of the adhesive tapes will be marked with an end mark. 1 2. The method for connecting an adhesive tape as described in any one of items 9 to 11 of the scope of patent application, wherein a mold forming one of the unevenness and a mold engaging the other is sandwiched between the mold The overlapping portion of the adhesive tape and the adhesive tape of the other side is subjected to thermal compression. 1 3 · According to the adhesive material tape connection method described in any one of items 9 to 11 of the scope of application for a patent, in which a through hole is formed after an overlapping portion of one of the adhesive material tape and the other adhesive material tape is overlapped, and then implemented Overlaps are heated and pressed. 1 4 · An adhesive material tape connection method, which is used to connect a silicon-treated substrate coated with an electrode connection adhesive to a roll of one of the adhesive tapes and a roll of the adhesive tape to the other. The other adhesive tape is characterized in that: the terminal portion of one adhesive tape and the beginning of the other adhesive tape overlap or abut, so as to span the surface portion of the silicon-treated substrate of the two adhesive tapes Attach the silicon adhesive tape in the same way, and connect the two adhesive tapes. 15. A method for connecting adhesive tapes, characterized by the difference between the surface tension of the adhesive surface of the silicon adhesive tape and the surface tension of the silicon-treated substrate of the adhesive tape described in item 14 of the scope of patent application. It is 10 mN / m (10dyne / cm) or less. -207- (5) (5) 200409405 1 6 · As for the adhesive material tape connection method described in item 14 or 15 of the scope of patent application, the adhesive force of Shixi Adhesive Tape is 100g / 25mm or more. 17. A method for connecting adhesive tapes, characterized in that: the terminal portion of one adhesive tape and the beginning of the other adhesive tape are overlapped or abutted, and the one described in item 16 of the scope of patent application is Silicone adhesive tape is affixed on both sides of the two adhesive tapes for connection. 1 8 · —An adhesive material tape connection method, which is used to connect one of the adhesive tapes wound on one side of the disc coated with the electrode connection adhesive on the sand-treated substrate, and wound to the other side of the disc The other adhesive tape is characterized in that a silicon adhesive tape coated with a silicon adhesive is applied between the terminal portion of one adhesive tape and the beginning of the other adhesive tape. The connection between two adhesive tapes is implemented. The difference in surface tension between the silicon adhesive on both sides and the silicon-treated substrate is 10 mN / m (10dyne / cm) or less, and the adhesive force is 100 g / 25 mm or more. 1 9. A method for connecting adhesive tapes, which is used to connect a substrate coated with an electrode connection adhesive to a roll of one of the adhesive tapes and a roll of the adhesive tape to the other. The adhesive tape of one side is characterized in that: the terminal portion of the adhesive tape of one side and the starting end portion of the adhesive tape of the other overlap or abut, so that a paste-like resin adhesive is attached to the overlapping portion or abuts In some cases, a paste-like resin adhesive is hardened to connect the two. -208- (6) (6) 200409405 2 0 · If the scope of patent application is the first! The adhesive tape connecting method according to item 9, wherein the resin-made adhesive is composed of at least one material selected from the group consisting of a thermosetting resin, a photocurable resin, and a hot metal adhesive. 21 · —A kind of adhesive tape adhesive device, characterized in that: the adhesive device with the adhesive tape is provided with a filling device for supplying the resin adhesive described in item 19 or 20 of the patent application scope; machine. 2 2 · —A kind of adhesive material tape tray is used to take up the adhesive material tape coated with the electrode connection adhesive on the substrate, which is characterized in that: the adhesive material tape tray is provided with a plurality of adhesive material tapes in the width direction of the tape. The roll department. 2 3 · If the adhesive tape tray described in item 22 of the scope of the patent application, one of the terminal portion of the adhesive tape and the beginning of the other adhesive tape have a connecting tape to connect the two, one When all the adhesive tape is rolled out, the other adhesive tape will then be rolled out. 24 · —A kind of adhesive device, which has the adhesive material tape reel, adhesive material tape reel as described in item 23 of the scope of application for a patent, is arranged between the adhesive material tape reel and the reel, and is heated by a pressure head. The adhesive material of the adhesive tape is pressed to the pressing portion of the circuit board of the electronic device, and the tape detecting means for detecting the connecting tape is characterized in that when the connecting tape detects the connecting tape, the connecting tape passes through the pressing portion. The connecting tape is wound up to the take-up tray. 2 5. —A kind of adhesive tape tray, which is used to connect one end of the adhesive tape with a stopper-209- (7) (7) 200409405 The terminal end of the adhesive tape and the beginning end of the other adhesive tape, which are characterized by: The connecting part is covered with the adhesive tape. 2 6. An adhesive device, which has the adhesive material tape tray, the adhesive material tape reel described in item 25 of the patent application scope, is arranged between the adhesive material tape tray and the reel, and is heated and pressurized. The head presses the adhesive material of the adhesive tape to the pressing portion of the circuit board and the connecting portion detecting means for detecting the connecting portion of the tape. The characteristic is that when the connecting portion detecting means detects the connecting portion of the tape, Until the connection part passes the crimping part, one side of the adhesive tape will be wound up to the take-up tray. 27. The adhesive device described in item 26 of the scope of patent application, in which the detection method of the connection part is a CCD camera and a thickness detection sensor. One of the sensor and the transmittance detection sensor. 28 · —A method for connecting adhesive tapes, characterized in that: the terminal part of one adhesive tape and the beginning of the other adhesive tape are connected by a stopper, and the connecting part is covered with the adhesive tape . 2 9. — An adhesive tape, which is coated with an adhesive on a substrate and rolled into a disk shape, which is characterized in that: a plurality of adhesives are arranged on the substrate in the longitudinal direction of the tape. 30. The adhesive tape described in item 29 of the scope of patent application, wherein the adjacent adhesive strips of the plurality of adhesives have a space. 3 1 · The adhesive tape described in item 29 of the scope of patent application, where -210- (8) (8) 200409405 The adhesive is separated into a plurality of strips by forming a gap in the longitudinal direction of the tape. 3 2 · —A method for manufacturing an adhesive tape is to apply an adhesive on a substrate and roll it into a disk shape, which is characterized in that the applicator is arranged in a manner to have a gap in the width direction of the substrate, and the continuous An adhesive is supplied on the surface of the substrate conveyed by the method to apply a plurality of adhesives to the substrate. 3 3 · — A method for manufacturing an adhesive tape, which is to apply an adhesive on a substrate and roll it into a disk shape, which is characterized in that: one side of one substrate is fully coated with an adhesive and formed on the adhesive After the longitudinal gap, arrange the other substrate on the adhesive surface, sandwich the adhesive with one and the other substrate, and then separate one substrate and the other substrate from each other, and one and the other A plurality of adhesives are attached to the substrates alternately, and a plurality of adhesives are arranged on one and the other substrates in a spaced manner. 3 4. — An adhesive pressing method is to apply an adhesive on a substrate and press the adhesive onto a circuit board with an adhesive tape rolled into a disc shape, which is characterized in that: The adhesive is applied, and a part of the adhesive in the width direction of the adhesive tape is heated and pressed along the longitudinal direction of the tape from the substrate side to form a strip shape, reducing the cohesive force of the heated portion of the adhesive and pressing it to the circuit board. After the pressing, the remaining adhesive and the substrate are rolled into a disc shape at the same time, and the remaining adhesive is heated and pressurized on the circuit board by using the rolled adhesive tape. -211-(9) (9) 200409405 * " 5 · —A kind of adhesive tape 'is an adhesive coated on a substrate and rolled into a disc shape', which is characterized by: ^ The width of the tincture tape is the same as that of the circuit board. The length of the ^ side is the same or more, and a plurality of adhesives are arranged in the width direction of the tape. 3 6 · The adhesive tape described in item 35 of the scope of patent application, wherein a plurality of adhesives are arranged in a manner that adjacent adhesive strips are spaced apart. 37 · The adhesive as described in item 35 of the scope of patent application In the adhesive tape, the adhesive is separated into a plurality of strips by using slits formed in the width direction of the adhesive tape. 3 8 · — A method for manufacturing an adhesive tape, comprising applying an adhesive on a substrate and rolling it into a disk shape, which is characterized in that: the adhesive is applied to the entire surface of one substrate, and After the gap is formed in the width direction of the tape, the other substrate is arranged on the adhesive surface, the adhesive is sandwiched between the one and the other substrate, and then the one substrate and the other substrate are separated from each other. A plurality of adhesives are adhered to each other on the substrate of the other side, and a plurality of adhesives are arranged on the substrate of one side and the other side in a spaced manner. 3 9 · —A method for pressing an adhesive tape, which is characterized in that: the adhesive tape described in any one of items 35 to 37 of the scope of patent application is arranged on a circuit board, and is aligned along the width direction. The adhesive tape is heated and pressed to press the adhesive strip to one side of the circuit board. 40 · —A method for pressing an adhesive tape, at least two adhesives described in any one of the scope of patent application No. 35 to 37 (-212- 200409405 do) are arranged on the transportation circuit of the mobile circuit board. In the configuration of the adhesive tape on one side, the width direction is perpendicular to the conveying path, and in the configuration of the other adhesive tape, the width direction is along the conveying path direction. The adhesive tape on one side is directed to the circuit board. The opposite two sides are heated and pressed along the width direction of the adhesive tape to press the adhesive strips to the opposite two sides of the circuit board, and then the circuit board is moved toward the other side of the adhesive tape, aiming at the other two sides of the circuit board. The adhesive tape is heated and pressed from the substrate side along the width direction, and the adhesive strip is pressed around the circuit board. 4 1 · An adhesive tape pressing method is a method in which an adhesive is coated on one side of a substrate, and a pressure-sensitive adhesive tape is applied to a circuit board using a rolled adhesive tape. The characteristics are as follows: The width is greater than the length of one side of the circuit board. The width of the adhesive tape in the width direction is heated and pressurized to reduce the cohesive force of the heated part of the adhesive and press the adhesive to the circuit board. 4 2. An adhesive tape box, which is characterized by having one disk, the other disk, and a housing for accommodating these disks that can be installed in a freely rotatable manner. The adhesive tape is coated on the substrate, and the other disk is fixed to one end of the adhesive tape. At least two adhesive tapes are arranged on the adhesive tape along the longitudinal direction of the tape. 4 3. The adhesive tape box described in item 42 of the scope of patent application, where there are at least two adhesives, and the adjacent adhesive strips will have a space of -213 · (11) (11) 200409405 4 4. The adhesive tape box described in item 42 of the scope of the patent application, the adhesive is separated into at least two strips by using a gap formed in the longitudinal direction of the tape. 4 5 · — An adhesive pressure method, characterized by: having: one disk, the other disk, and a housing for accommodating the disks that can be installed in a freely rotatable manner; and one disk An adhesive tape coated with an adhesive on a base material is wound, and one end of the adhesive tape is fixed on the other side; an adhesive tape box is mounted to a pressing device, and the adhesive is passed from the adhesive tape box. The tape is pulled out onto the circuit board, and a part of the width direction of the adhesive tape is heated and pressurized to reduce the cohesive force of the heating part of the adhesive, and the width direction part of the adhesive is pressed to the circuit board. 4 6. An adhesive pressing method, characterized by: having: one disk, the other disk, and a housing for accommodating these disks that can be installed in a freely rotatable manner; and one disk The adhesive tape coated with the adhesive on the substrate is wound, and the other side of the tray holds one end of the adhesive tape; the adhesive tape box is mounted to the pressing device, and the adhesive is adhered from the adhesive tape box. The adhesive tape is pulled out onto the circuit board, and a part of the width direction of the adhesive tape is heated and pressurized to reduce the cohesive force of the heating part of the adhesive, and the width direction part of the adhesive is pressed to the circuit board, and rolled. Take out all the adhesive tape on one of the discs, and then “reverse the adhesive tape box” to press the remaining part of the adhesive onto the circuit board. 47.—A kind of adhesive tape, which is rolled into a disc shape and coated on a substrate. -214 · (12) (12) 200409405 Adhesive tape, characterized in that the substrate has a hot melt agent layer and a support layer. 48. The adhesive tape according to item 47 of the scope of patent application, wherein the support layer is sandwiched between the hot-melt agent layers. 49. The adhesive tape according to item 47 of the patent application scope, wherein the hot-melt agent layer is sandwiched between the support layers. 5 0. — An adhesive material tape connection method, which is used to connect one of the adhesive material tapes wound on one side of the disc and the other adhesive material tape wound on the other side of the disc, which is characterized by: The adhesive material tape has a base material and an adhesive that are surface-treated with a release agent. The release agent at the end of the substrate of any one of the adhesive material tapes is removed so that the adhesive surface of the other adhesive material tape overlaps the surface. In some cases, the heating and pressing are performed to overlap the two to make connection. 5 1 · The adhesive tape connection method described in item 1 of the scope of patent application, wherein the removal of the release agent is performed by any one of plasma discharge, ultraviolet irradiation, and laser irradiation. 5 2 · —An adhesive tape roll is a tape with two side plates to take up the adhesive tape. It is characterized in that a plurality of adhesive tape rolls are arranged in the width direction of the adhesive tape tray. 5 3 · The adhesive tape tray as described in item 52 of the scope of patent application, in which the side of the tray is equipped with a desiccant storage section. -215- (13) (13) 200409405 5 4. The adhesive tape reel as described in item 5 2 or 53 of the scope of the patent application, wherein the adhesive tape covering the winding on the reel can be freely attached and detached. The surrounding cover member is arranged on the tray. 55. The adhesive tape tray as described in item 54 of the scope of patent application, wherein the cover member has a pull-out opening of the adhesive tape. 5 6 · The adhesive material tape reel according to item 5 2 or 53 of the scope of patent application, in which the side plates of the rolled portion of the adhesive material tape are fitted to each other in a freely attachable and detachable manner. 57. The adhesive tape reel according to item 52 or 53 of the scope of patent application, wherein the adhesive tape is an adhesive tape that is coated on the substrate with an electrode connection adhesive for connecting the opposite electrode. 5 8 · The adhesive tape reel according to item 5 2 or 53 of the scope of patent application, in which the adhesive tape is a support substrate for fixing a lead frame, a support substrate for mounting a semiconductor element, or a wafer of a lead frame. Adhesive tape for connecting semiconductor devices. 59. An adhesive device, which has one plate, the other plate, a gear unit that rotates one plate and the other plate in a coordinated rotation, a housing that houses the aforementioned components, and heating disposed in the opening portion of the housing A component and a power supply means for supplying power to a heating component are characterized in that: -216- (14) (14) 200409405 One of the disks is wound with an adhesive tape coated with an adhesive on a substrate, and the other disk One end of the adhesive tape is fixed, and the heating member has an electric heating member that generates heat by using the supplied power, and the adhesive tape wound onto one of the trays is pulled out from the opening of the casing to heat the member from the substrate side The pressure-sensitive adhesive tape located at the opening is heated and pressurized, the pressure-sensitive adhesive is pressed to the circuit board, and the substrate from which the pressure-sensitive adhesive has been peeled off is wound by the other coil. 60.—An adhesive tape, which is an adhesive tape coated on a substrate, which is characterized in that the substrate is composed of a metal film or an aromatic polyurethane film. 61. The adhesive tape according to item 60 of the scope of patent application, wherein the thickness of the substrate is 1 // m to 25 / ^ m. 6 2. The adhesive tape according to item 60 or 61 of the scope of patent application, wherein the tensile strength of the substrate is more than 300 MPa at 25 ° C. 63. The adhesive tape described in item 60 or 61 of the scope of the patent application, wherein the thickness ratio of the substrate to the adhesive is 0.01 to 1.0. 6 4 · If the number 60 of the scope of patent application or the number 61 of the scope of patent application is δ already contained adhesive tape, the surface roughness Rmax of the substrate is 0.5 // m or less. 65. A method for forming an adhesive material for an adhesive material tape, which comprises applying an adhesive on a substrate, and forming an adhesive on a covering body by using an adhesive material tape rolled into a disc shape, which is characterized by: -217- (15) ( 15) 200409405 Pull out the adhesive tapes from the plural disks, so that the adhesive tapes are overlapped into one body. At the same time, one of the substrates is peeled off, and an overlapping adhesive is formed on the covering body. 6 6 · The method for forming an adhesive material for an adhesive material tape described in Item 65 of the scope of patent application, wherein only one adhesive of the adhesive material tape contains a hardener. 67. An anisotropic conductive tape, characterized in that a plurality of times of laminated layers of an anisotropic conductive material having a film-like adhesive are applied in the longitudinal direction of the core material. 68. The anisotropic conductive tape described in item 67 of the scope of the patent application, wherein the anisotropic conductive material is an anisotropic conductive material having a two-layer structure in which a base film is arranged on one side of a film-shaped adhesive. 69. The anisotropic conductive tape according to item 67 of the scope of the patent application, wherein the anisotropic conductive material is an anisotropic conductive material having a three-layer structure of a base material of 0 旲 on both sides of the film-shaped adhesive. 70. The anisotropic conductive tape according to item 68 or 69 of the scope of patent application, wherein one or both sides of the aforementioned base film are subjected to a peeling treatment. 7 .. The anisotropic conductive tape according to any one of the claims 67 to 69, wherein the width of the film-shaped adhesive is 0.5 to 5 mm. 72. The anisotropic conductive material -218- (16) 200409405 as described in the 68th or 69th of the scope of application for a patent, wherein the base film has a strength of 12 kg / mm2 or more, a stretch of 60 to 200%, and a thickness of 100. / im following. -219-
TW092120892A 2002-07-30 2003-07-30 Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material reel, adhering device, adhesive agent-tape cassette, method of press-conducting adhesive agent using same, and anisotropic electroconductive tape TW200409405A (en)

Applications Claiming Priority (17)

Application Number Priority Date Filing Date Title
JP2002221225A JP2004059776A (en) 2002-07-30 2002-07-30 Anisotropic conductive material tape
JP2002370624A JP4477823B2 (en) 2002-12-20 2002-12-20 Adhesive tape connection method and adhesive tape connector
JP2002370623A JP4032961B2 (en) 2002-12-20 2002-12-20 Adhesive tape connection method
JP2002370622A JP2004196540A (en) 2002-12-20 2002-12-20 Method of connecting adhesive tape
JP2002371888A JP4239585B2 (en) 2002-12-24 2002-12-24 Adhesive tape connection method and adhesive tape connector
JP2002371887A JP2004203944A (en) 2002-12-24 2002-12-24 Method for connecting adhesive tapes to each other and adhesion apparatus
JP2002371889A JP4608839B2 (en) 2002-12-24 2002-12-24 Adhesive tape reel and bonding apparatus
JP2003002094A JP2004210523A (en) 2003-01-08 2003-01-08 Adhesive tape cassette and method of pressing adhesive using adhesive tape cassette
JP2003002092A JP2004211017A (en) 2003-01-08 2003-01-08 Adhesive tape, method of producing the same and compression adhesion method for the same
JP2003002095A JP2004210524A (en) 2003-01-08 2003-01-08 Bonding device
JP2003002093A JP4333140B2 (en) 2003-01-08 2003-01-08 Method for producing adhesive tape
JP2003118286A JP2004323621A (en) 2003-04-23 2003-04-23 Adhesive material tape
JP2003118287A JP4654566B2 (en) 2003-04-23 2003-04-23 Adhesive tape connection method and adhesive tape connector
JP2003130196A JP2004331833A (en) 2003-05-08 2003-05-08 Tape reel for adhesive materials
JP2003130197A JP4238626B2 (en) 2003-05-08 2003-05-08 Adhesive tape reel, adhesive device, connection method, and adhesive tape connector
JP2003176322A JP2005330297A (en) 2003-06-20 2003-06-20 Method of forming adhesive material by adhesive material tape
JP2003176321A JP2005330296A (en) 2003-06-20 2003-06-20 Connecting method of adhesive material tape

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TW200409405A true TW200409405A (en) 2004-06-01
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TW096139425A TW200823137A (en) 2002-07-30 2003-07-30 Joining structure and adhesive material reel
TW097143987A TW200913827A (en) 2002-07-30 2003-07-30 Adhesive material reel
TW097143991A TW200913829A (en) 2002-07-30 2003-07-30 Adhesive material reel
TW097143988A TW200913828A (en) 2002-07-30 2003-07-30 Adhesive material reel
TW092120892A TW200409405A (en) 2002-07-30 2003-07-30 Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material reel, adhering device, adhesive agent-tape cassette, method of press-conducting adhesive agent using same, and anisotropic electroconductive tape

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TW097143991A TW200913829A (en) 2002-07-30 2003-07-30 Adhesive material reel
TW097143988A TW200913828A (en) 2002-07-30 2003-07-30 Adhesive material reel

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