TW200404725A - Static charge suppression method and static charge suppression apparatus for plate member, method for removing electricity from plate member, and load pickup method, load pickup apparatus, and load receiving apparatus for plate member - Google Patents

Static charge suppression method and static charge suppression apparatus for plate member, method for removing electricity from plate member, and load pickup method, load pickup apparatus, and load receiving apparatus for plate member Download PDF

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TW200404725A
TW200404725A TW092121316A TW92121316A TW200404725A TW 200404725 A TW200404725 A TW 200404725A TW 092121316 A TW092121316 A TW 092121316A TW 92121316 A TW92121316 A TW 92121316A TW 200404725 A TW200404725 A TW 200404725A
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plate
vibration
shaped member
plates
floating
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TW092121316A
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Chinese (zh)
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TWI226867B (en
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Masaki Takasan
Kazuhiro Suzuki
Yoshikazu Koike
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Toyota Ind Corp
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Priority claimed from JP2002232978A external-priority patent/JP4029689B2/en
Priority claimed from JP2002232977A external-priority patent/JP3894071B2/en
Priority claimed from JP2002232976A external-priority patent/JP4359028B2/en
Application filed by Toyota Ind Corp filed Critical Toyota Ind Corp
Publication of TW200404725A publication Critical patent/TW200404725A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67793Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with orientating and positioning by means of a vibratory bowl or track
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

Several oscillating plates 17 are parallel arranged. Each oscillating plate 17 is formed to become a long rectangular shape which is narrower than the width of the glass-substrate 12. Said oscillating plate 17 keeps the glass-substrate 12 at a floating state. Each oscillating plate 17 is grounded respectively. When the glass-substrate 12 loaded on the oscillating plate 17 is moved from the oscillating plate 17, the oscillating plate 17 is excited and the super sonic wave is generated. By means of the emitting pressure of the sonic wave, the glass-substrate 12 is floated to be kept a definite distance G from the oscillating plate 17.

Description

200404725 玖、發明說明: 【發明所屬之技術領域】 本發明係有關於一種在搬送液晶面板之玻璃基板或半 導體晶圓等板狀構件時,用以抑制在板狀構件中有靜電帶 電、產生靜電等技術,以及有關於將已帶電之板狀構件進 行去電的技術。 【先前技術】 在分離接觸之兩個物體時,在接觸界面方面,由一方之 面移動至另一方之面的局部電荷載體係回到一方之面,而 φ 殘留在表面之局部電荷載體係形成靜電。接觸時之電荷移 動並非僅有絕緣體,即使是作爲導體之各個金屬亦會引起 接觸時之電荷移動。從而,若使藉由絕緣體所維持之各個 金屬接觸、再使其相互剝離時,便會進行帶電(剝離帶電)。 此外,將已帶電之物體以飄浮狀態(非接觸狀態)進行搬送 時,當已帶電之物體與將其以飄浮狀態支撐之支撐構件之 間的距離G在進行變化時,便會產生靜電。 在液晶面板之製造程序或半導體裝置之製造程序中,必 · 須使玻璃基板或半導體晶圓在多數個程序間進行搬送,而 當使板狀構件由載置部移動時,便會產生上述之剝離帶 電。特別是在如同作爲液晶面板之製造程序之一程序的硏 磨程序或貼合程序的易產生靜電的程序中,在使板狀構件 由載置部進行移動時,將由於剝離帶電而導致帶電量增 多。此外,剝離帶電之帶電量係隨著剝離速度的加速而增 加。因此,在減少帶電量方面,爲必須減緩剝離速度、亦 200404725 即減緩將板狀構件由載置部舉起之速度。其結果,造成增 長作業時間、降低生產性。 在板狀構件已帶電的情況下,去靜電器(Ionizer)等去電 裝置係由已帶電之物體中去除或是中和靜電。去電裝置並 非是防止或是抑制剝離帶電之裝置。在對於去靜電器 (I ο η 1 z e r)爲採用作爲較廉價之去電裝置的之去電刷情況 下,一般係將去電刷之前端與作爲應去電之對象的物體間 之距離設定爲數mm。不過,在此種距離中,由已帶電之 物體去除靜電的去電效果較低。此外,在使用去靜電器 (Ionizer)之情況下,若在對象物體與載置部之間爲存在有 空氣層時,係造成去電的困難,且造成在面對載置部之對 象物體裏面之去電的困難。 【發明內容】 本發明之第一目的係爲,在使板狀構件由載置部移動 時,爲將板狀構件之剝離帶電抑制至最佳狀態,同時,亦 可抑制在板狀構件之承接傳送時之靜電的產生。第二目的 係爲,將已帶電之板狀構件去電至最佳狀態。 爲了達成上述目的,本發明係提供如下述之板狀構件之 剝離帶電控制方法。剝離帶電控制方法係爲,當使載置於 載置部之板狀構件由載置部移動時,具備有利用藉由使載 置部激發振動而產生有音波之放射壓,進而使板狀構件由 載置部飄浮。 本發明又提供如下述之剝離帶電控制裝置。剝離帶電控 制裝置係爲,當由載置部剝離被載置於載置部的板狀構件 200404725 之際,爲抑制板狀構件之帶電。載置部係由物體飄浮裝置 所形成。物體飄浮裝置係具備有:振動板,係由可載置板 狀構件之導電性材料所形成;激發振動裝置,係使振動板 激發振動。藉由來自被激發振動之振動板的音波之放射壓 而使板狀構件由振動板之表面飄浮。振動板係被接地。 本發明又提供如下述之卸貨方法,係爲將板狀構件由第 一物體飄浮裝置上移載至第二物體飄浮裝置上。第一以及 第二物體飄浮裝置係分別具備有由導電性材料所形成之多 數的振動板。第一以及第二物體飄浮裝置係分別藉由使各 鲁 個振動板激發振動所產生之音波的放射壓而將板狀構件進 行飄浮維持。第二物體飄浮裝置係更被裝備在可往復作動 之支撐邰上。當將板狀構件由第一物體飄浮裝置上移載至 第二物體飄浮裝置上之際,爲將第一物體飄浮裝置之振動 板相互設爲相同電位、或是進行接地的同時,將第二物體 飄浮裝置之振動板相互設爲相同電位、或是進行接地之狀 態下,調整成使各個物體飄浮裝置之振動板與前述板狀構 件之間的距離形成爲一定狀。 本發明又提供如下述之卸貨裝置。卸貨裝置係具備有: 支撐部,係可往復作動;移動裝置,爲使支撐部往復作動; 物體飄浮裝置,爲利用藉由使以導電性材料所形成之多數 之振動板被激發振動所產生之音波的放射壓,而將板狀構 件維持在飄浮狀態。振動板係被接地,或是振動板爲設成 相互爲相同電位。 本發明又提供如下述之收貨裝置。收貨裝置係具備有由 200404725 導電性材料所形成之多數的振動板。利用使振動板激發振 動所產生之音波的放射壓,而使將板狀構件進行飄浮維持 的物體飄浮裝置裝備在移動體上。振動板係爲相互爲相同 電位,或是振動板爲相互接地。 本發明又提供如下述之板狀構件之去電方法。去電方法 係具備有:飄浮維持步驟,係利用使由導電性材料所形成 之振動板激發振動所產生之音波的放射壓,而將已帶電之 板狀構件進行飄浮維持;去電步驟,在將振動板進行接地 之狀態下,將板狀構件與振動板之間的距離調整爲1 mm以 鲁 下,而將板狀構件進行去電。 本發明又提供其他板狀構件之去電方法。去電方法係包 含有:飄浮維持步驟,係利用使由導電性材料所形成之振 動板激發振動所產生之音波的放射壓,而將已帶電之板狀 構件進行飄浮維持;調整步驟,在將振動板進行接地之狀 態下,將板狀構件與振動板之間的距離調整爲1 mm以下; 去電步驟,係使用去靜電器(Ionizer)而將板狀構件進行去 電。 · 本發明又提供其他板狀構件之卸貨裝置。卸貨裝置係具 備有:支撐部,係可往復作動;移動裝置,爲使支撐部往 復作動;物體飄浮裝置,爲具備有多數之振動板。物體飄 浮裝置係被裝備在支撐部上,爲利用藉由使各個振動板被 激發振動所產生之音波的放射壓,而將板狀構件維持在飄 浮狀態。各個振動板係被接地。將去電刷配置成將去電刷 之前端位於略與對向於板狀構件之振動板之面相同面上。 200404725 本發明又提供其他收貨裝置。收貨裝置係具備有物體飄 浮裝置,係利用藉由使多數之振動板被激發振動所產生之 音波的放射壓,而將板狀構件維持在飄浮狀態。各個振動 板係被接地。將去電刷配置成將去電刷之前端位於略與對 向於板狀構件之振動板之面相同面上。 【實施方式】 以下,基於第1A圖至第4圖,說明將本發明於液晶面 板之製造程序中具體化的第一實施例。 如第1 A圖所示,作爲剝離帶電防止裝置之收貨裝置 ® 1 1,係以物體飄浮裝置1 3所構成,其係具有可將作爲板狀 構件之玻璃基板1 2(以鏈線圖示)暫時性載置的載置部之機 能。物體飄浮裝置1 3係被設置在以水平所配置之支撐板1 4 上。物體飄浮裝置1 3係具備有由導電性材料所形成之多數 (在本實施例中爲兩個)的振動板1 7。各個振動板之長邊方 向想端部係分別經由角板1 6而連結至振動件1 5。兩振動 板1 7係被配設成相互平彳了,並且,爲形成比玻璃基板1 2 之寬度更爲狹窄的長條矩形。藉由兩振動板1 7而使玻璃基 ® 板1 2被支撐、或是被飄浮維持。各個振動板1 7係被接地。 各個角板1 6係爲,在其前端中,爲經由多數之螺絲1 8 而螺鎖至對應的振動板1 7。各個角板1 6係藉由對應之振 動件1 5所激發振動。各個角板1 6係形成爲扁平且略成直 方體狀。在角板1 6之下面係成一體狀的固定有圓錐狀之錐 體16a。錐體16a係爲,被固定在與固定於角板16面之相 反側之面中的振動件1 5上。角板1 6之前端面細雨振動件 375 -10 - 200404725 1 5之軸線正交,而角板1 6之軸線與振動件1 5之軸線係爲 同軸而沿著鉛直方向延伸。此外,在第1 A圖以及第1 B圖 中,係以無視於角板1 6、錐體1 6 a、以及振動件之大小比 例所繪製。 在振動件1 5中爲使用朗格分(音譯:Langevin )形振動 件。各個振動件1 5係如第1 B圖所示,爲具備有形成環狀 之一對壓電元件19a、19b,在兩壓電元件19a、19b之間 係配置有形成環狀之電極板20。使兩個金屬塊21a、21b 配置成夾持電極板20以及兩壓電元件19a、19b,以未圖 鲁 示之螺栓鎖緊固定兩金屬塊2 1 a、2 1 b,藉此而構成振動件 15。前述螺栓係爲,被***至形成在金屬塊21b之孔(未圖 示),同時螺鎖至形成在金屬塊2 1 a之前述螺孔。兩金屬塊 21a、21b係經由螺栓而相互成電氣性的導通。在金屬塊21a 中係形成有突緣2 2。各個振動件1 5之金屬塊2 1 a係以被 嵌合形呈於支撐板14之孔(未圖示)之狀態下,以未圖示之 螺栓經由突緣22而被固定在支撐板14上。 各個振動件1 5係被連接至對應之震盪器2 3。各個電極 ® 板20係經由配線24a而與對應之震盪器23連接,震盪器 23之接地端子爲經由配線24b而被連接至金屬塊21b。構 成以角板16、錐體16a、振動件15、以及震盪器23而使 振動板1 7激發振動地激發振動裝置。此外,在第1 A圖中, 係僅揭示被連接至各個物體飄浮裝置1 3之一方之振動件 1 5的震盪器2 3。 說明如前所述之構造的裝置之作用。 200404725 收穫裝置11係爲在硏磨程序或貼合程序等容易產生靜 電的程序中作爲載置部所配設。在進行硏磨處理或貼合處 理之際,爲停止前述激發振動裝置之驅動,使玻璃基板1 2 在接觸至振動板1 7之狀態下被支撐。 當使玻璃基板1 2在由振動板1 7上移動之際爲使激發振 動裝置驅動。亦即,驅動震盪器2 3、使振動件1 5以指定 之共振頻率(例如,20kHz前後)激發振動,進行縱向振動 角板1 6、而經由角板1 6使振動板1 7被激發振動的撓曲振 動,在振動板1 7上產生駐波。如此,如第2 A圖所示,已 鲁 接觸狀態而被支撐在振動板1 7上之玻璃基板1 2係藉由由 振動板1 7所放射之音波的放射壓而如第2B圖所示,由振 動板1 7之表面飄浮。飄浮距離係例如爲1 0 0 // m以上且3 0 0 //m以下之範圍,在第2B圖中係誇張地進行圖示。 在分離處於接觸狀態之兩個物體時,一般而言係爲產生 剝離帶電。即使在玻璃基板1 2之情況下,在以手動作業握 持玻璃基板1 2之一端而由振動板1 7剝離時,在玻璃基板 1 2上係帶電有極大的電荷。另一方面,在使物體飄浮裝置 ® 1 3作動而使振動板1 7由玻璃基板1 2剝離的情況下’玻璃 基板1 2之電位雖會增大若千程度’不過’電位之增大量額 係減少爲接近於在以手動作業握持玻璃基板1 2之一端而 由振動板1 7剝離之情況下的1 /1 〇。其狀態係揭示在第3 圖之圖表。 如第3圖之虛線所示,在欲單純地由振動板分離玻璃基 板1 2之情況下,爲在以短時間增大至接近4〇〇 V爲止之玻 -12- 37? 200404725 璃基板1 2的電位之後降低。另一方面,如在第3圖之實線 所示,在使用物體飄浮裝置1 3而使玻璃基板1 2由振動板 1 7剝離的情況下,玻璃基板1 2之電位係約增大些許而在 低電位聚合。其理由雖未明確可知,不過,音波飄浮之情 況下爲使玻璃基板1 2與振動板1 7之間的距離維持一定 狀,並且該距離G係較小,因此如第4圖所示,係可判斷 用以使玻璃基板1 2與振動板1 7具有如同電容器之機能。 本實施具有以下之優點。 當使玻璃基板1 2由振動板1 7移動時,使振動板1 7激 發振動而產生高音波,利用音波之放射壓而使玻璃基板1 2 由振動板1 7飄浮。藉由來自振動板1 7之音波的作用而使 玻璃基板1 2與振動板1 7之間的距離形成爲保持一定的狀 態,因此,使得玻璃基板1 2之剝離帶電受到抑制。 因振動板1 7係爲導電性材料,故可容易地進行接地, 而形成可容易地進行靜電防止。 玻璃基板1 2係藉由超音波之作用,於瞬間由振動板1 7 飄浮而起。因此,係爲縮短作業時間,提昇生產性。 因使用長條狀之振動板1 7,相較於使用多數較短之振動 板的構造,係可減少振動板1 7之數目,並且亦可容易地進 行將各個振動板接地之作業。 在將收貨裝置Η作爲在液晶面板之製造程序之硏磨程 序中的載置部來使用,在硏磨處理後將玻璃基板1 2由載置 部移動時,爲可抑制玻璃基板1 2之剝離帶電。 其次,依據第5 Α圖至第6C圖來說明本發明之第二實施 -13- 200404725 例。本實施例與第1 A圖至第4圖之實施例相異點係爲, 在使被載置於振動板上之板狀構件由振動之表面飄浮而起 之際,將振動板構成爲可移動狀,以使對應於板狀構件之 撓曲而用以使各個振動板與板狀構件間之距離保持一定。 針對於與第1 A圖至第4圖之實施例相同部分,係賦予相 同符號而省略其詳細說明。 如第6A圖至第6C圖所示,在本實施例中,係設有三個 振動件1 5、1 1 5。在三個振動件1 5、Π 5中之中央的振動 件1 5係被固定在支撐板1 1 4之指定位置。用以夾持中央之 振動件1 5而設在兩側之兩個振動件1 1 5之振動板1 7,係 被設置成可移動狀,進而用以可調整中央之振動件1 5之振 動板1 7間之距離以及所形成的角度。各個振動板1 7係被 接第。此外,在第6A圖至第6C途中,係在圖面揭示支撐 中央振動板1 5之支撐板1 4,省略支撐兩側之振動件1 1 5 之支撐板1 4的圖式。 如第5 A圖以及第5 B圖所示,爲使支撐可移動之兩個移 動板1 7之振動件1 1 5,分別沿著支撐板1 4上之一對導軌 2 5而固定在可移動的移動體2 6上。導軌2 5係被配設在與 振動板1 7之長邊方向(與第5 A圖以及第5 B圖之紙面垂直 的方向)正交之方向延伸。導軌25之上面係形成爲使其曲 率彎曲成與使玻璃基板1 2以飄浮狀態維持時之撓曲狀態 中的區域略爲相同狀。使孔1 4 a形成在支撐板1 4上,在其 孔之兩側部設有導軌2 5。孔1 4 a係容許振動件Π 5與移動 體2 6依同移動。移動體2 6係具備有在導軌2 5上轉動之車輪 -14- 200404725 26a。移動體26係被連結在固定於支撐板14上之線性引動 器27之衝桿28。移動體26係藉由線性引動器27之之驅 動而沿著導軌25移動。在移動體26與衝桿28間之連結部 分上,所採用之構造(例如,銷與長孔的組合)係可容許對 於移動體26之衝桿28的上下方向之相對移動。 如第6C圖所示,當玻璃基板1 2由與振動板1 7接觸之 狀態下而使玻璃基板1 2飄浮升起之際,首先,爲使各個振 動板1 7激發振動、使玻璃基板1 2由振動板1 7之表面如第 6B圖所示的飄浮。當玻璃基板1 2爲大型且較薄的情況下, 係因其本身重量而造成玻璃基板12撓曲、且造成玻璃基板 1 2與振動板1 7間之距離未形成一定狀。爲了避免該情況, 爲由第6B圖之狀態而即刻使各個線性引動器27被驅動, 使移動體26移動至指定之位置。如第6A圖所示,兩側之 振動件1 1 5爲與振動板1 7 —同配合玻璃基板1 2之撓曲, 而移動至振動板1 7與玻璃基板1 2間之距離形成爲一定的 指定位置。其結果,即使在玻璃基板1 2中產生撓曲的情況 下,亦可將玻璃基板1 2與振動板1 7間之距離維持成一定, 而可抑制玻璃基板1 2之剝離帶電。 本實施例係添加第1 A圖至第4圖之實施例的優點,而 具有下述之優點。 局部之振動板1 7係對應於玻璃基板1 2之撓曲,用以將 振動板1 7與玻璃基板1 2間之距離維持成一定,而構成爲 可與振動件1 1 5 —同移動。從而’即使是對於大型、較薄、 且容易產生撓曲的玻璃基板1 2,亦可良好的抑制剝離帶 200404725 電。 以下,依據第7圖至第1 1 B圖,說明本發明之第三實施 例的收貨裝置1 1 1。 如第7圖所示,收貨裝置11 1係具備有維持玻璃基板等 之板狀構件2 1 5的第一物體飄浮裝置i i 2。第一物體飄浮 裝置係具備有形成矩形之振動板1 1 4 a至n 4 e。振動板n 4 a 至1 1 4 e爲具有相互相同的大小。將設在與板狀構件2丨5 (以 鏈線所不)之四角對應之位置上的振動板設爲第一至第四 振動板114a至114d,將設在與第一至第四振動板114&至 鲁 1 1 4 d爲相等距離之位置上的振動板設爲第五振動板 114e°如第8圖所示,在各個振動板114&至114e中,構 成激發振動裝置之角板1 1 6係分別在其前端中藉由未圖示 之螺絲來鎖緊。使各個振動板i i 4 a至i i 4 e分別接地。 如第8圖所示,形成圓錐台狀之角板i i 6係在對應之振 動板ll4a至U4e之中央部份中,爲被安裝成角板116之 軸線與振動板1 1 4a至1 1 4e成正交狀。第一振動板至第五 振動板1 1 4 a至1 1 4 e係被配置成水平狀。角板〗〗6之前端 鲁 面係與振動件1 1 7之軸向正交。使角板1 1 6以及振動件1 1 7 連結而使角板1 1 6以及振動件1 1 7之各個中心軸位在一値 線上。 在振動件117中爲使用朗格分(音譯:Langevin)形。 振動件1 1 7係如第8圖所示,爲具備有形成一對環狀之壓 電元件1 1 8a、1 1 8b。使形成環狀之電極板丨9配置在兩壓 電兀件1 1 8 a、1 1 8 b間。兩個金屬塊丨2 〇 a、1 2 0 b係被配置 -16- 200404725 成夾持電極板119以及兩壓電元件118a、U8b。藉由未圖 示之螺栓而鎖緊固定金屬塊1 2 0 a、1 2 Ob,藉此以構成振動 件117。在金屬塊120a、120b中爲形成未圖示之螺孔,前 述螺栓係被螺鎖至前述螺孔。兩金屬塊120a、120b係經由 前述螺栓而相互成電氣性的導通。 在金屬塊120a中爲形成有突緣121。各個振動件117之 金屬塊120a係爲,在嵌合至形成在支撐板122之孔(未圖 示)之狀態下,藉由未圖示之螺栓而經由突緣1 2 1被固定在 支撐板122上。與固定有各個振動板114a至11 4e之面爲 相反側之角板116之面上,爲固定有突緣121。電極板119 爲經由配線124a而被連接至震盪器123,震盪器123之接 地端子爲經由配線124b而被連接至金屬塊120b。藉由振 動件117、震盪器123而構成使第一至第五振動板114a至 1 1 4e激發振動的激發振動裝置。此外,在第7圖中,係省 略對於第一振動板1 1 4 a、第三振動板1 1 4 C以及第五振動板 114e的震盪器123之圖示。 其次,針對於在收貨裝置1 1 1與未圖示之般送裝置間所 進行之板狀構件2 1 5之移載作業(卸貨作業)的卸貨裝置 125進行說明。如第9圖所示,卸貨裝置125爲具備有可 往復作動之支撐部126、使支撐部126於第9圖之左右方 向往復作動之移動裝置1 27。支撐部1 2 6係作爲叉部機能 而形成爲長條狀,且具備有相互延伸成平行狀的第一以及 第二臂部 126a、126b。 如第7圖、第9圖、以及第1 〇圖所示,形成長條狀之 -17- 200404725 第一以及第二振動板l:28a、l28b爲被支撐在支撐部126。 詳細而言,如第1 0圖所示,爲使第二振動板1 2 8 b之第一 端部經由以振動件1 29所激發振動的角板1 3 0而被固定在 支撐部126上,第二振動板128b之第二端部爲經由角板 1 3 1而被固定在第二臂部1 26b之前端部。此外,即使是針 對於第一振動板1 2 8 a,亦與第二振動板1 2 8 b相同的被支 撐在第一臂部126a以及支撐部126。各個振動板128a、128b 係被接地。振動件1 2 9爲構成與收貨裝置1 1 1之振動件1 1 7 爲相同狀,而被連接至對應之震盪器1 3 2。藉由第一振動 ® 板1 2 8 a、對應之振動件1 2 9、一對之角板1 3 0、1 3 1、以及 對應之震盪器132而構成一個第二物體飄浮裝置133。 移動裝置127爲具備已具有環部127a之純量式之習知 的機械手臂。移動裝置1 2 7爲藉由未圖示之驅動機構而使 支撐部126往復移動、同時升降。卸貨裝置125係具備有 確認第一以及第二臂部126a、126b之高度的感測器(未圖 示)。 其次,說明構成如前所述之裝置的作用來進行說明。 ® 收貨裝置111係爲,各個振動板114a至114e爲將板狀 構件2 1 5進行飄浮維持。亦即,藉由震盪器1 2 3之驅動, 而使振動件1 17以指定之共振頻率(例如,20kHz前後)來激 發振動,角板1 1 6爲進行縱向振動。經由角板1 1 6而使對 應之振動板114a至114e激發振動、進行撓曲振動。各個 振動板114a至114e爲藉由進行撓曲振動而由各個振動板 114a至114e產生音波(駐波)。藉由由各個振動板114a至 200404725 1 1 4e所放射之音波的放射壓,如第1 1 A圖所示,板狀構件 215爲由振動板114a至114e之表面所飄浮升起。飄浮距離 係爲1 mm以下,例如爲在1 〇 〇 μ m以上、且3 0 0 // m以上 之範圍。使各個振動板114a至114e與板狀構件215間之 距離G形成爲一定狀而使得振動板114a至114e之激發振 動狀態受到控制,抑制剝離帶電以及靜電之產生。 其次,藉由卸貨裝置125來進行在第一物體飄浮裝置112 上維持呈飄浮狀態的板狀構件2 1 5的卸貨作業。亦即,首 先,停止未圖示之搬送裝置,如第1 1 A圖所示在使板狀構 件2 1 5於指定位置上維持呈飄浮狀態的狀態下,使兩臂部 12 6a、126b配置在進入準備位置。由該狀態使移動裝置127 受到驅動,使支撐部1 26前進至與板狀構件2 1 5對應之卸 貨位置。其次,如第1 1 B圖所示,板狀構件2 1 5與兩振動 板128a、128b間之距離GG,係形成爲使板狀構件215上 升至與開始卸貨作業前(參照第1 1 A圖)之板狀構件2 1 5與 振動板114a至114e間之距離GG形成相等。並且,爲使 板狀構件215藉由由兩振動板128a、128b所產生之駐波而 被維持飄浮。之後,將板狀構件2 1 5與兩振動板1 2 8 a、1 2 8b 間之距離GG維持成一定,用以幾乎無因第一物體飄浮裝 置1 1 2所造成之對於板狀構件2 1 5之飄浮力的影響而使兩 臂部126a、12 6b上升至指定高度。其次,支撐部126後退、 且使板狀構件2 1 5連同卸貨裝置1 2 5之第二物體飄浮裝置 13 3 —起移動。 其次,在使臂部126a、126b移動至與未圖示之搬送裝 200404725 置對應之指定位置之後’爲使臂部126a、126b下降、使板 狀構件2 1 5移載至前述搬送裝置上。亦即,板狀構件2 j 5 在由收貨裝置11 1移載至搬送裝置之間,係以非接觸狀態 來移動。 本實施例係具有以下之優點。 板狀構件2 1 5係以非接觸狀態而由第一物體飄浮裝置 1 1 2上移載至第二物體飄浮裝置1 3 3上。將板狀物體2 1 5 寄行飄浮維持之各個物體飄浮裝置1 1 2、1 3 3之各個振動板 1 1 4 a至1 1 4 e、1 2 8 a、1 2 8 b係被接地。爲使各個振動板n 4 a φ 至1 1 4e、128a、12 8b與板狀構件21 5間之距離GG形成爲 一定狀而控制各個振動板1 1 4 a至1 1 4 e、1 2 8 a、1 2 8 b知激 發振動狀態,而使靜電的產生受到抑制。從而,將無須設 置去靜電器(Ionizer)等去電裝置。 - 在本實施例中,爲了抑制靜電之產生係無須減緩卸貨的 速度。因此,係可縮短作業時間、提昇生產性。 藉由在板狀構件2 1 5中較小的多數之振動板1 1 4 a至 1 1 4 e而使板狀構件2 1 5被飄浮維持,因此,相較於使用長 鲁 條狀之振動板的構造,係容易的將振動板1 M a至Π 4 e配 設成不致與卸貨裝置125產生干涉。 其次’基於第1 2圖說明在本發明之第四實施例中之收 貨裝置2 11。收貨裝置2 1 1係具備搭載有第一物體飄浮裝 置2 1 2的台車2 3 3。第一物體飄浮裝置2 1 2爲具備振動板 1 1 4 a至Π 4 e以及振動件4 1 7。第一物體飄浮裝置2 1 2爲將 板狀構件2 1 5維持在飄浮狀態。經由形成圓柱狀之角板 -20- 200404725 14〇,各個振動板114a至114e係被支撐在對應之振動件417 上。各個振動件4 1 7係以使各個振動板1 1 4 a至1 1 4 e位於 水平狀而被固定在支撐架1 34上。各個振動件4 1 7係被連 接至震盪器1 2 3。板狀構件2 1 5係以被飄浮維持在第一物 體飄浮裝置2 1 2之狀態下,伴隨於台車2 3 3之移動而搬送 至指定之位置。 以下,基於第1 3圖至第1 5圖說明本發明之第五實施例 之收或裝置3 1 1。本實施例係爲,在第7圖之收貨裝置1 1 1 之構造中追加有多數之去電刷213之點爲與第7圖至第 · 1 1 B圖之實施例相異。此外,與第7圖至第1 1 B圖之實施 例爲相同部份爲賦予相同符號,省略該說明。 如第13圖所示,在第一以及第二振動板114a、114b之 間、第一以及第三振動板114a、114c之間、第三以及第四 振動板1 1 4 c、1 1 4 d之間、第二以及第四振動板1 1 4b、1 1 4 d 之間,爲分別在不與卸貨裝置1 2 5產生干涉之位置上設有 去電刷2 1 3。各個去電刷2 1 3係被接地。如第1 4圖所示, 各個去電刷213係具有支撐板213a。在支撐板213a上爲 ® 設有多數之導電性纖維2 1 3b。去電刷2 1 3係被配置成將去 電刷2 1 3之前端面、亦即導電性纖維2 1 3b之前端部位於與 對向至板狀構件215之第一至第四振動板114a至114d之 面爲略同一面上(參照第15圖)。由去電刷213之前端面至 板狀構件2 1 5爲止的距離係形成爲與第一至第四振動板 1 1 4a至1 1 4d之面和板狀構件2 1 5間之距離略爲相同。具 體而沿,爲使去電刷2 1 3之導電性纖維2 1 3b之前端部與板 -21 - 200404725 狀構件2 1 5之對向面間之距離維持在1 mm以下。因此,係 可藉由非接觸狀態而去除因去電刷2 1 3在板狀構件2丨5上 所造成之帶電的電荷。此外,無須另外設置用以進行已帶 電之板狀構件2 1 5之去電的時間,而可在搬送時間中效率 爲佳地進行去電。 說明在本實施例中藉由卸貨裝置1 2 5所進行之卸貨作 業。在本實施例中,爲使被飄浮維持在未圖示之搬送裝置 上的板狀構件2 1 5移載至收貨裝置2 1 1之第一物體飄浮裝 置1 1 2上。 停止前述搬送裝置之移動,在使板狀構件2 1 5以在指定 位置上維持呈飄浮狀態的狀態中,使兩臂部126a、126b配 置在進入準備位置。由該狀態使移動裝置127驅動,藉由 使支撐部126前進移動而使兩臂部126a、126b配置在與板 狀構件2 1 5對應之卸貨位置上,之後爲上升至指定位置。 板狀構件2 1 5爲藉由由兩振動板1 2 8 a、1 2 8 b所產生之駐波 而被維持飄浮。在使臂部126a、126b上升至幾乎無因搬送 裝置之物體飄浮裝置所造成對於板狀構件2 1 5之飄浮利之 影響的指定高度後,使支撐部1 2 6後退、使板狀構件2 1 5 由搬送裝置上移動。並且,在使兩臂部126a、126b前進移 動至與收貨裝置3 1 1對應之指定位置爲止之後,使兩臂部 126a、126b下降、將板狀構件215移載至收貨裝置311上。 從而,以未圖示之搬送裝置而被搬送至與收貨裝置311對 應之位置的板狀構件2 1 5,係藉由卸貨裝置2 2 5而以非接 觸狀態由搬送裝置上移載至第一物體飄浮裝置1 1 2上。200404725 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for suppressing electrostatic charge and generation of static electricity in a plate-like member when conveying a plate-like member such as a glass substrate or a semiconductor wafer of a liquid crystal panel. And other techniques, as well as techniques for de-energizing a plate member that has been charged. [Prior art] When separating two objects in contact, in the contact interface, the local charge carriers moving from one side to the other are returned to one side, and the local charge carriers of φ remaining on the surface are formed. Static electricity. The movement of charge during contact is not the only insulator, even the individual metals as conductors will cause the movement of charge during contact. Therefore, when the respective metals held by the insulator are brought into contact with each other and then they are peeled off from each other, charging is performed (peel-off charging). In addition, when a charged object is transported in a floating state (non-contact state), static electricity is generated when the distance G between the charged object and a support member that supports the floating object is changed. In the manufacturing process of a liquid crystal panel or the manufacturing process of a semiconductor device, a glass substrate or a semiconductor wafer must be transported between a plurality of processes. When the plate-like member is moved from the mounting portion, the above-mentioned problems occur. Peel charged. In particular, in a honing process or a bonding process, which is one of the processes for manufacturing a liquid crystal panel, when a plate-like member is moved from a mounting portion, a charge is generated due to peeling and charging, which results in a charge amount. increase. In addition, the charging amount of the peeling charge increases as the peeling speed is accelerated. Therefore, in order to reduce the amount of charge, it is necessary to reduce the peeling speed, that is, to reduce the speed at which the plate-shaped member is lifted from the mounting portion by 200404725. As a result, work time is increased and productivity is reduced. When the plate-like member is charged, a de-ionizing device such as an ionizer is removed from the charged object or neutralizes static electricity. The de-energizing device is not a device for preventing or inhibiting the peeling of the electrification. In the case where the destaticizer (I ο η 1 zer) is a de-brushing device which is a cheaper de-ioning device, the distance between the front end of the de-brush and the object to be de-energized is generally set. It is several mm. However, at such a distance, the static electricity removal effect by a charged object is low. In addition, in the case of using an Ionizer, if there is an air layer between the target object and the mounting portion, it is difficult to remove electricity, and it is caused in the target object facing the mounting portion. Difficulties in going out. [Summary of the Invention] The first object of the present invention is to suppress the peeling and charging of the plate-like member to an optimal state when the plate-like member is moved from the mounting portion, and at the same time, to suppress the plate-like member from being received. Generation of static electricity during transmission. The second purpose is to de-energize the charged plate-like member to an optimal state. In order to achieve the above object, the present invention provides a method for controlling peeling and charging of a plate-like member as described below. The method for controlling the peeling and charging is to move the plate-shaped member placed on the placement portion from the placement portion, and to include the plate-shaped member by using a radiation pressure that generates sound waves by exciting the placement portion to vibrate. Floating from the mounting section. The present invention also provides a peeling charging control device as described below. The peeling control device is designed to suppress the charging of the plate-shaped member when the plate-shaped member 200404725 placed on the placing section is peeled off by the mounting section. The mounting portion is formed by an object floating device. The object floating device includes a vibration plate formed of a conductive material on which a plate-shaped member can be placed, and an excitation vibration device which causes the vibration plate to excite vibration. The plate-shaped member floats from the surface of the vibration plate by the radiation pressure of the sound wave from the vibration plate excited by vibration. The vibration plate is grounded. The present invention also provides a method of unloading as described below, which is to transfer the plate-shaped member from the first object floating device to the second object floating device. The first and second object floating devices are each provided with a plurality of vibration plates formed of a conductive material. The first and second object floating devices respectively float and maintain the plate-like members by radiating pressure of sound waves generated by vibrations of the vibration plates. The second object floating device is further equipped on a reciprocating support cymbal. When the plate-shaped member is transferred from the first object floating device to the second object floating device, in order to set the vibration plates of the first object floating device to the same potential as each other or to ground, the second When the vibration plates of the object floating device are set to the same potential or grounded, the distance between the vibration plate of each object floating device and the plate-like member is adjusted to be constant. The present invention further provides a cargo unloading device as described below. The unloading device is provided with: a support portion that can be reciprocated; a moving device that reciprocates the support portion; an object floating device that is produced by using a plurality of vibration plates formed of a conductive material to be excited and vibrated The radiation pressure of the sound waves maintains the plate-like member in a floating state. The vibration plates are grounded, or the vibration plates are set to the same potential as each other. The present invention further provides a receiving device as described below. The receiving device is provided with a plurality of vibration plates made of 200404725 conductive material. The moving body is equipped with an object floating device that maintains the plate-shaped member floating by utilizing the radiation pressure of the sound waves generated by the vibration plate to excite the vibration. The vibration plates are at the same potential as each other, or the vibration plates are grounded to each other. The present invention also provides a method for removing electricity from a plate-shaped member as described below. The method for removing electricity includes: a floating maintenance step, which uses a radiation pressure of a sound wave generated by vibrating a vibration plate formed of a conductive material to float and maintain a charged plate-shaped member; With the vibration plate grounded, the distance between the plate-shaped member and the vibration plate was adjusted to 1 mm or less, and the plate-shaped member was de-energized. The invention also provides a method for removing electricity from other plate-shaped members. The method for removing electricity includes: a floating maintenance step, which uses a radiation pressure of a sound wave generated by exciting a vibration plate formed of a conductive material to float and maintain a charged plate-shaped member; an adjustment step, When the vibration plate is grounded, the distance between the plate-shaped member and the vibration plate is adjusted to 1 mm or less. In the power-discharging step, the plate-shaped member is de-energized using an ionizer (Ionizer). The present invention also provides other unloading devices for plate-like members. The unloading device is equipped with: a supporting part which can be reciprocated; a moving device for reciprocating the supporting part; an object floating device having a plurality of vibration plates. The object floating device is provided on the support portion to maintain the plate-like member in a floating state by utilizing the radiation pressure of sound waves generated by causing each vibration plate to be excited to vibrate. Each vibration plate system is grounded. The de-brushing brush is arranged so that the front end of the de-brushing brush is located on the same plane as the surface facing the vibration plate facing the plate-like member. 200404725 The present invention provides another receiving device. The receiving device is provided with an object floating device, and the plate-like member is maintained in a floating state by using a radiation pressure of a sound wave generated by causing most of the vibration plates to be excited and vibrated. Each vibration plate system is grounded. The de-brushing brush is arranged so that the front end of the de-brushing brush is located on the same plane as the face of the vibration plate facing the plate-like member. [Embodiment] Hereinafter, a first embodiment embodying the present invention in a manufacturing process of a liquid crystal panel will be described based on Figs. 1A to 4. As shown in Fig. 1A, the receiving device ® 1 1 as a peel-off prevention device is composed of an object floating device 13 and has a glass substrate 1 2 (shown in a chain diagram) as a plate-like member. (Shown) The function of the placement section temporarily placed. The object floating device 1 3 is installed on a support plate 1 4 arranged horizontally. The object floating device 13 includes a plurality of vibration plates 17 (two in this embodiment) formed of a conductive material. The long-side direction end portions of the respective vibration plates are connected to the vibration members 15 through the corner plates 16 respectively. The two vibrating plates 17 are arranged so as to be flat with each other, and are formed in a long rectangular shape narrower than the width of the glass substrate 12. The glass-based ® plate 12 is supported or floated by two vibrating plates 17. Each vibration plate 17 is grounded. Each of the corner plates 16 is screwed to the corresponding vibration plate 17 by a plurality of screws 18 at the front end. Each corner plate 16 is vibrated by the corresponding vibration member 15. Each corner plate 16 is formed into a flat and slightly rectangular parallelepiped shape. A conical cone 16a is fixed to the lower surface of the corner plate 16. The cone 16a is fixed to the vibrator 15 on a surface opposite to the side of the corner plate 16 fixed to the vibrator. The axis of the drizzle vibration member 375 -10-200404725 15 before the corner plate 16 is orthogonal, and the axis of the corner plate 16 and the axis of the vibration member 15 are coaxial and extend in the vertical direction. In addition, in FIGS. 1A and 1B, the size ratios of the angle plate 16, the cone 16 a, and the vibrator are disregarded. A vibrator 15 uses a Langevin-type vibrator. As shown in FIG. 1B, each vibrator 15 includes a pair of piezoelectric elements 19a and 19b formed in a ring shape, and an electrode plate 20 formed in a ring shape is disposed between the two piezoelectric elements 19a and 19b. . The two metal blocks 21a and 21b are arranged to sandwich the electrode plate 20 and the two piezoelectric elements 19a and 19b, and the two metal blocks 2 1 a and 2 1 b are locked and fixed with bolts (not shown), thereby constituting vibrations. Piece 15. The bolt is inserted into a hole (not shown) formed in the metal block 21b, and is bolted to the screw hole formed in the metal block 21a. The two metal blocks 21a and 21b are electrically connected to each other via a bolt. A flange 22 is formed in the metal block 21a. The metal block 2 1 a of each of the vibrating pieces 15 is fixed to the support plate 14 with a bolt (not shown) through the flange 22 in a state of being fitted into a hole (not shown) of the support plate 14. on. Each vibrator 15 is connected to a corresponding oscillator 23. Each electrode ® plate 20 is connected to a corresponding oscillator 23 via a wiring 24a, and the ground terminal of the oscillator 23 is connected to a metal block 21b via a wiring 24b. The angle plate 16, the cone 16a, the vibrator 15, and the oscillator 23 are configured to excite the vibration plate 17 to excite the vibration. In addition, in FIG. 1A, only the oscillators 23 of the vibrating members 15 connected to one of the object floating devices 13 are shown. The function of the device constructed as described above will be described. 200404725 The harvesting device 11 is provided as a mounting part in a program that is liable to generate static electricity, such as a honing program or a bonding program. When the honing process or the bonding process is performed, in order to stop the driving of the vibration excitation device described above, the glass substrate 1 2 is supported while being in contact with the vibration plate 17. When the glass substrate 12 is moved by the vibration plate 17, the excitation vibration device is driven. That is, the oscillator 2 is driven, the vibrator 15 is excited to vibrate at a specified resonance frequency (for example, around 20 kHz), and the angle plate 16 is longitudinally vibrated, and the vibration plate 17 is excited to vibrate through the angle plate 16 The deflection vibration causes a standing wave on the vibration plate 17. In this way, as shown in FIG. 2A, the glass substrate 12 supported on the vibration plate 17 in the contact state is shown in FIG. 2B by the radiation pressure of the sound wave radiated from the vibration plate 17 Floating on the surface of the vibration plate 17. The floating distance is, for example, a range from 1 0 // // m to 3 0 0 // m, and is exaggeratedly illustrated in FIG. 2B. When separating two objects that are in contact, it is generally to cause peeling and charging. Even in the case of the glass substrate 12, when the one end of the glass substrate 12 is held by a manual operation and the vibration plate 17 is peeled off, the glass substrate 12 is charged with a great electric charge. On the other hand, when the object floating device ® 1 3 is actuated and the vibration plate 17 is peeled from the glass substrate 12, the potential of the 'glass substrate 12 will increase by about a thousand degrees, but the amount of potential increase will be It is reduced to approximately 1/1/10 when the one end of the glass substrate 12 is held by a manual operation and the vibration plate 17 is peeled off. The status is shown in the chart in Figure 3. As shown by the dashed line in FIG. 3, when the glass substrate 12 is to be simply separated by the vibration plate, it is glass-12-37 to 200404725 glass substrate 1 which increases in a short time to approximately 400V. The potential of 2 then decreases. On the other hand, as shown by the solid line in FIG. 3, when the glass substrate 12 is peeled off from the vibration plate 17 using the object floating device 13, the potential of the glass substrate 12 is increased slightly. Polymerize at low potential. Although the reason is not clear, when the sound wave floats, the distance between the glass substrate 12 and the vibration plate 17 is kept constant, and the distance G is relatively small. Therefore, as shown in FIG. 4, It can be determined that the glass substrate 12 and the vibration plate 17 can function as capacitors. This implementation has the following advantages. When the glass substrate 12 is moved from the vibration plate 17, the vibration plate 17 is caused to vibrate to generate a high sound wave, and the glass substrate 12 is floated from the vibration plate 17 by the radiation pressure of the sound wave. The distance between the glass substrate 12 and the vibration plate 17 is maintained at a constant state by the sound wave from the vibration plate 17, so that the peeling and charging of the glass substrate 12 is suppressed. Since the vibration plate 17 is a conductive material, it can be easily grounded, and it can be easily prevented from static electricity. The glass substrate 12 is caused by the ultrasonic wave to float from the vibration plate 17 in an instant. Therefore, in order to shorten the operation time and improve productivity. Since the long-shaped vibration plate 17 is used, the number of the vibration plates 17 can be reduced compared to the structure using most short vibration plates, and the operation of grounding each vibration plate can be easily performed. When the receiving device Η is used as the mounting portion in the honing process of the manufacturing process of the liquid crystal panel, when the glass substrate 12 is moved from the mounting portion after the honing process, the glass substrate 12 can be suppressed. Peel charged. Next, the second embodiment of the present invention will be described with reference to FIGS. 5A to 6C. The difference between this embodiment and the embodiments of FIGS. 1A to 4 is that the vibration plate is configured to allow the plate-shaped member placed on the vibration plate to float from the vibrating surface. It is moved so that the distance between each vibrating plate and the plate-like member is kept constant corresponding to the deflection of the plate-like member. The same reference numerals are given to the same parts as those in the embodiments of FIGS. 1A to 4 and detailed descriptions are omitted. As shown in Figs. 6A to 6C, in this embodiment, three vibration members 15 and 1 15 are provided. The vibrating member 15 at the center of the three vibrating members 15 and Π 5 is fixed at a designated position on the support plate 1 1 4. The vibrating plate 17 for the two vibrating members 1 1 5 arranged on both sides for clamping the vibrating member 15 in the center is arranged to be movable, so as to adjust the vibration of the central vibrating member 15 The distance between the plates 17 and the angle formed. Each of the vibration plates 17 is connected. In addition, in FIGS. 6A to 6C, the supporting plate 14 supporting the central vibration plate 15 is disclosed in the drawing, and the supporting plate 14 supporting the vibration members 1 15 on both sides is omitted. As shown in FIG. 5A and FIG. 5B, in order to support the two vibrating members 1 1 5 of the two movable plates 17 that are movable, they are fixed to the On the moving body 2 6. The guide rails 2 5 are arranged to extend in a direction orthogonal to the long side direction of the vibration plate 17 (the direction perpendicular to the paper surface in FIGS. 5A and 5B). The upper surface of the guide rail 25 is formed so that the curvature thereof is slightly the same as the area in the deflected state when the glass substrate 12 is maintained in a floating state. Holes 1 4a are formed in the support plate 14 and guide rails 25 are provided on both sides of the holes. The hole 1 4 a allows the vibrating member Π 5 to move in accordance with the moving body 26. The moving body 2 6 is provided with wheels -14-200404725 26a which rotate on a guide rail 25. The moving body 26 is a punch 28 connected to a linear actuator 27 fixed to a support plate 14. The moving body 26 is moved along the guide rail 25 by the drive of the linear actuator 27. In the connecting portion between the moving body 26 and the punch 28, a structure (for example, a combination of a pin and an elongated hole) is adopted to allow relative movement in the vertical direction of the punch 28 of the moving body 26. As shown in FIG. 6C, when the glass substrate 12 is caused to float and rise from the state in which the glass substrate 12 is in contact with the vibration plate 17, first, in order to excite the vibration of each of the vibration plates 17 and the glass substrate 1 2 The surface of the vibration plate 17 floats as shown in Fig. 6B. When the glass substrate 12 is large and thin, the glass substrate 12 is deflected due to its own weight, and the distance between the glass substrate 12 and the vibration plate 17 is not constant. In order to avoid this, each linear actuator 27 is immediately driven to move the moving body 26 to a designated position in the state shown in FIG. 6B. As shown in FIG. 6A, the vibration members 1 15 on both sides are flexed with the glass plate 12 together with the vibration plate 17, and the distance between the vibration plate 17 and the glass substrate 12 is fixed to move The specified position. As a result, even when the glass substrate 12 is deflected, the distance between the glass substrate 12 and the vibration plate 17 can be maintained constant, and peeling and charging of the glass substrate 12 can be suppressed. This embodiment has the advantages of the embodiment shown in Figs. 1A to 4 and has the following advantages. The local vibration plate 17 corresponds to the deflection of the glass substrate 12 to maintain a constant distance between the vibration plate 17 and the glass substrate 12 and is configured to be movable together with the vibration member 1 1 5. Therefore, even if the glass substrate 12 is large, thin, and easily deflected, the peeling tape 200404725 can be suppressed well. Hereinafter, a receiving device 1 1 1 according to a third embodiment of the present invention will be described with reference to Figs. 7 to 1 1B. As shown in Fig. 7, the receiving device 11 1 is a first object floating device i i 2 provided with a plate-like member 2 1 5 that holds a glass substrate or the like. The first object floating device is provided with rectangular-shaped vibration plates 1 1 a to n 4 e. The vibration plates n 4 a to 1 1 4 e have the same size as each other. The vibrating plates provided at positions corresponding to the four corners of the plate-like member 2 丨 5 (not shown by the chain line) are set to the first to fourth vibrating plates 114a to 114d, and the first to fourth vibrating plates are set to 114 & to Lu 1 1 4 d is the fifth vibration plate 114e at the position where the distance is equal. As shown in FIG. 8, each of the vibration plates 114 & to 114e constitutes the corner plate 1 for exciting the vibration device. The 16 series are respectively locked in the front end by screws (not shown). Each of the vibration plates i i 4 a to i i 4 e is grounded. As shown in FIG. 8, the corner plate ii 6 forming a truncated cone shape is in the center portion of the corresponding vibration plates 114 to U4e, and is the axis and the vibration plate 1 1 4a to 1 1 4e installed as the corner plate 116. Orthogonal. The first to fifth vibration plates 1 1 4 a to 1 1 4 e are arranged horizontally. Corner plate〗 6 The front end surface is orthogonal to the axial direction of the vibration piece 1 1 7. The corner plates 1 1 6 and the vibrator 1 1 7 are connected, and the respective central axes of the corner plate 1 1 6 and the vibrator 1 1 7 are positioned on a line. In the vibrator 117, a Langevin shape is used. As shown in Fig. 8, the vibrator 1 1 7 is provided with piezoelectric elements 1 1 8a and 1 1 8b forming a pair of rings. The ring-shaped electrode plate 9 is arranged between the two voltage elements 1 1 8 a and 1 1 8 b. The two metal blocks 20a and 1 2b are arranged -16-200404725 to sandwich the electrode plate 119 and two piezoelectric elements 118a and U8b. The metal blocks 1 2 0 a and 1 2 Ob are locked and fixed by bolts (not shown), thereby constituting the vibrating member 117. The metal blocks 120a and 120b are formed with screw holes (not shown), and the bolts are screwed to the screw holes. The two metal blocks 120a and 120b are electrically connected to each other via the bolts. The metal block 120 a is formed with a flange 121. The metal block 120a of each vibrator 117 is fixed to the support plate via a flange 1 2 1 by a bolt (not shown) in a state of being fitted to a hole (not shown) formed in the support plate 122. 122 on. The flange 121 is fixed on the surface of the corner plate 116 on the opposite side to the surface on which the vibration plates 114a to 114e are fixed. The electrode plate 119 is connected to the oscillator 123 via the wiring 124a, and the ground terminal of the oscillator 123 is connected to the metal block 120b via the wiring 124b. The vibrator 117 and the oscillator 123 constitute an excitation vibration device for exciting the first to fifth vibration plates 114a to 1 4e. In addition, in FIG. 7, illustrations of the oscillators 123 for the first vibration plate 1 1 4 a, the third vibration plate 1 1 4 C, and the fifth vibration plate 114e are omitted. Next, the unloading device 125 will be described for the transfer operation (unloading operation) of the plate-like member 2 1 5 performed between the receiving device 11 and the unillustrated feeding device. As shown in Fig. 9, the unloading device 125 is a moving device 127 including a support portion 126 that can be reciprocated, and a support portion 126 that reciprocates in the left-right direction in Fig. 9. The supporting portion 1 2 6 is formed in a long shape as a fork portion function, and includes first and second arm portions 126a and 126b extending parallel to each other. As shown in FIG. 7, FIG. 9, and FIG. 10, the first and second vibrating plates 1: 28a and l28b formed in a long shape are supported by the support portion 126. In detail, as shown in FIG. 10, the first end portion of the second vibration plate 1 2 8 b is fixed to the support portion 126 via the angle plate 1 3 0 excited by the vibration member 1 29. The second end portion of the second vibration plate 128b is fixed to the front end portion of the second arm portion 126b via the corner plate 1 31. The first vibration plate 1 2 8 a is also supported by the first arm portion 126 a and the support portion 126 in the same manner as the second vibration plate 1 2 8 b. Each of the vibration plates 128a and 128b is grounded. The vibrator 1 2 9 has the same shape as the vibrator 1 1 7 of the receiving device 1 1 1 and is connected to the corresponding vibrator 1 3 2. A second object floating device 133 is constituted by the first vibration plate 1 2 8 a, the corresponding vibration member 1 2 9, the pair of corner plates 1 3 0, 1 31, and the corresponding oscillator 132. The moving device 127 is a conventional robot arm having a scalar type having a ring portion 127a. The moving device 1 2 7 moves the support portion 126 to and fro at the same time by a driving mechanism (not shown). The unloading device 125 is provided with a sensor (not shown) for confirming the height of the first and second arm portions 126a and 126b. Next, the function of the device as described above will be described. The ® receiving device 111 is such that each of the vibration plates 114a to 114e floats and maintains the plate-like member 2 1 5. That is, the vibrator 1 17 is caused to vibrate at a specified resonance frequency (for example, around 20 kHz) by the drive of the oscillator 1 2 3, and the corner plate 1 1 6 performs longitudinal vibration. Via the corner plates 1 1 6, the corresponding vibration plates 114 a to 114 e are excited to vibrate and flexure. Each of the vibration plates 114a to 114e generates a sound wave (standing wave) from each of the vibration plates 114a to 114e by performing flexural vibration. Based on the radiation pressure of the sound waves radiated from each of the vibration plates 114a to 200404725 1 1 4e, as shown in FIG. 1A, the plate-shaped member 215 floats and rises from the surfaces of the vibration plates 114a to 114e. The floating distance is 1 mm or less, for example, a range of 100 μm or more and 3 0 // // m or more. The distance G between each of the vibration plates 114a to 114e and the plate-like member 215 is made constant so that the excited vibration state of the vibration plates 114a to 114e is controlled, and the generation of peeling and static electricity is suppressed. Next, the unloading operation is performed by the unloading device 125 to maintain the floating plate-shaped member 2 1 5 on the first object floating device 112. That is, first, stop a conveying device (not shown), and arrange the two arm portions 12 6a, 126b in a state where the plate-like member 2 1 5 is maintained in a floating state as shown in FIG. 1A. Before entering the preparation position. In this state, the moving device 127 is driven to advance the support portion 126 to the unloading position corresponding to the plate-like member 2 1 5. Next, as shown in FIG. 1B, the distance GG between the plate-like member 2 1 5 and the two vibration plates 128a and 128b is formed so that the plate-like member 215 is raised before the unloading operation is started (refer to No. 1 A). The distance GG between the plate-like member 2 1 5 and the vibration plates 114 a to 114 e is equal. In addition, the plate-like member 215 is kept floating by the standing waves generated by the two vibration plates 128a and 128b. Thereafter, the distance GG between the plate-like member 2 1 5 and the two vibration plates 1 2 8 a and 1 2 8b is maintained constant, so that there is almost no effect on the plate-like member 2 caused by the first object floating device 1 1 2. The buoyancy of 15 causes the arms 126a, 12 6b to rise to a specified height. Next, the support portion 126 moves backward and moves the plate-like member 2 1 5 together with the second object floating device 13 3 of the unloading device 1 2 5. Next, after moving the arm portions 126a, 126b to a designated position corresponding to a transport device (not shown) 200404725 ', the arm portions 126a, 126b are lowered, and the plate-like member 2 15 is transferred to the aforementioned transfer device. That is, the plate-like member 2 j 5 is moved in a non-contact state between being transferred from the receiving device 11 1 to the conveying device. This embodiment has the following advantages. The plate-like member 2 1 5 is transferred from the first object floating device 1 1 2 to the second object floating device 1 3 3 in a non-contact state. Each of the plate floating objects 2 1 5 is floated and maintained by each of the object floating devices 1 1 2, 1 3 3 and each of the vibration plates 1 1 4 a to 1 1 4 e, 1 2 8 a, 1 2 8 b are grounded. Each of the vibration plates 1 1 4 a to 1 1 4 e, 1 2 8 is controlled so that the distance GG between each of the vibration plates n 4 a φ to 1 1 4e, 128a, 12 8b and the plate-like member 21 5 is constant. a, 1 2 8 b know the state of excitation vibration, so that the generation of static electricity is suppressed. Therefore, it is not necessary to install a deionizing device such as an Ionizer. -In this embodiment, it is not necessary to slow down the unloading speed in order to suppress the generation of static electricity. Therefore, the system can shorten the operation time and improve the productivity. The plate-shaped member 2 1 5 is float-maintained by the smaller majority of the plate-shaped members 2 1 5 with the vibration plates 1 1 4 a to 1 1 4 e. Therefore, compared with the use of a long-stripe vibration The structure of the plate is easy to arrange the vibration plates 1 M a to Π 4 e so as not to interfere with the unloading device 125. Next, the receiving device 21 in the fourth embodiment of the present invention will be described based on Figs. The receiving device 2 1 1 is provided with a trolley 2 3 3 equipped with a first object floating device 2 1 2. The first object floating device 2 1 2 includes vibration plates 1 1 4 a to Π 4 e and a vibration member 4 1 7. The first object floating device 2 1 2 maintains the plate-like member 2 1 5 in a floating state. Each of the vibration plates 114a to 114e is supported on a corresponding vibration member 417 via a corner plate -20-200404725 14 ° formed in a cylindrical shape. Each of the vibration members 4 1 7 is fixed to the support frame 1 34 so that each of the vibration plates 1 1 4 a to 1 1 4 e is positioned horizontally. Each vibrator 4 1 7 is connected to the oscillator 1 2 3. The plate-like member 2 1 5 is transported to a designated position in accordance with the movement of the trolley 2 3 3 in a state of being floated in the first object floating device 2 1 2. In the following, an OR device 3 1 1 according to a fifth embodiment of the present invention will be described based on FIGS. 13 to 15. This embodiment is different from the embodiments in FIGS. 7 to 11B in that the structure of the receiving device 1 1 1 in FIG. 7 is added with a plurality of debrushing brushes 213. In addition, the same parts as those in the embodiment of Figs. 7 to 11B are given the same reference numerals, and the description is omitted. As shown in FIG. 13, between the first and second vibration plates 114 a and 114 b, between the first and third vibration plates 114 a and 114 c, and the third and fourth vibration plates 1 1 4 c and 1 1 4 d Between the second and fourth vibrating plates 1 1 4b and 1 1 4 d, de-brushing brushes 2 1 3 are provided at positions that do not interfere with the unloading device 1 2 5 respectively. Each debrush 2 3 is grounded. As shown in FIG. 14, each de-brushing brush 213 has a support plate 213 a. A plurality of conductive fibers 2 1 3b are provided on the support plate 213a. The de-brushing brush 2 1 3 is configured so that the front end face of the de-brushing brush 2 1 3, that is, the front end of the conductive fiber 2 1 3b is located opposite to the first to fourth vibration plates 114a to the plate-like member 215 The surface of 114d is almost the same surface (refer to FIG. 15). The distance from the end face before the debrush 213 to the plate-like member 2 1 5 is formed to be slightly the same as the distance between the surfaces of the first to fourth vibration plates 1 1 4a to 1 1 4d and the plate-like member 2 1 5 . Specifically, the distance between the front end of the conductive fiber 2 1 3b of the degreasing brush 2 1 3 and the facing surface of the plate -21-200404725-like member 2 1 5 is kept below 1 mm. Therefore, the non-contact state can remove the charged charges caused by the de-brushing brushes 2 1 3 on the plate-like member 2 5. In addition, it is not necessary to separately set a time for depowering the charged plate-shaped member 2 1 5, and it is possible to perform power removal efficiently in the transportation time. The unloading operation performed by the unloading device 1 2 5 in this embodiment will be described. In this embodiment, the plate-like member 2 1 5 which is floated and maintained on a conveying device (not shown) is transferred to the first object floating device 1 1 2 of the receiving device 2 1 1. The movement of the aforementioned conveying device is stopped, and the two arm portions 126a, 126b are arranged in the entering preparation position while the plate-like member 2 15 is maintained in a floating state at a designated position. In this state, the moving device 127 is driven, and by moving the support portion 126 forward, the two arm portions 126a and 126b are arranged at the unloading position corresponding to the plate-shaped member 2 1 5 and then raised to the designated position. The plate-like member 2 1 5 is kept floating by the standing waves generated by the two vibration plates 1 2 8 a and 1 2 8 b. After raising the arm portions 126a and 126b to a designated height that hardly affects the floating effect of the plate-like member 2 1 5 caused by the object floating device of the conveying device, the support portion 1 2 6 is retracted and the plate-like member 2 1 5 Move from the conveying device. Then, after the two arm portions 126a and 126b are moved forward to a designated position corresponding to the receiving device 3 1 1, the two arm portions 126a and 126b are lowered and the plate-shaped member 215 is transferred to the receiving device 311. Therefore, the plate-like member 2 1 5 which is transported to a position corresponding to the receiving device 311 by a conveying device not shown is transferred from the conveying device to the first position in a non-contact state by the unloading device 2 2 5. An object is floating on the device 1 1 2.

-22- 200404725 收貨裝置3 1 1係將板狀構件2 1 5維持在飄浮狀態之期 間,將板狀構件2 1 5與第一至第五振動板1 1 4a至1 1 4e間 之距離調整成1mm以下。藉由使第一至第五振動U4a至 1 14e接地、以及使板狀構件215與第一至第五振動板1 14a 至1 1 4e間之距離調整成1 mm以下,藉此,在板狀構件2 1 5 帶電之情況下,爲以非接觸狀態下進行板狀構件2 1 5之去 電。 本實施例係具有以下之優點。 將已帶電之板狀構件2 1 5藉由由第一至第五振動板1 1 4a 至1 1 4e所產生之音波的放射壓,而由第一至第五振動板 1 1 4a至1 1 4e維持在飄浮狀態。藉由將板狀構件2 1 5與第一 至第五振動板1 1 4 a至1 1 4 e間之距離調整爲1 mm以下,而 在非接觸狀態下進行板狀構件2 1 5之去電。從而,無須使 用去靜電器(Ionizer)等高價位的去電裝置,而可藉由非接 觸狀態來去除於板狀構件2 1 5中帶電的電荷。再者,藉由 去電刷2 1 3係可確實的將板狀構件2 1 5之靜電進行去電。 板狀構件2 1 5之去電之際,係可將板狀構件2 1 5與第一 至第五振動板Π 4a至1 1 4e間之距離跨越板狀構件2 1 5之 全面而維持成均勻狀,因此可抑制靜電的產生。 兩振動板1 2 8 a、1 2 8 b係被接地。因此,在以卸貨裝置 1 2 5進行卸貨作業期間,係可去除在板狀構件2 1 5中帶電 的局部電荷。 使第一至第四振動板1 1 4 a至1 1 4 d分別配置在與板狀構 件2 1 5之四角對應之處,在鄰接之振動板1 1 4a至1 1 4e間 -23- 200404725 配設有去電刷2 1 3。從而,相較於使用長條狀之振動板, 爲可容易的將去電刷2 1 3以不至與卸貨裝置1 2 5產生干涉 之狀態下進行配設。 其次’基於第1 6圖,針對於在本發明之第六實施例中 之卸貨裝置2 2 5而進行說明。本實施例之卸貨裝置2 2 5係 爲’在第13圖之卸貨裝置125中裝設有多數之去電刷213。 不過,於第16圖中所示之兩臂部126a、126b之寬度係形 成爲寬於第13圖中所示之兩臂部126a、126b之寬度。沿 著振動板128a、128b之長邊方向上、對應於振動板128a、 1 2 8 b之兩側的位置上,爲設有去電刷2 1 3。各個去電刷2 1 3 之前端部爲配置成位於略與和板狀構件2 1 5對向之振動板 128a、128b之面爲同一面上。即使在本實施例中,藉由卸 貨裝置22 5而在飄浮狀態(非接觸狀態)所卸下的板狀構件 2 1 5,係在被維持在卸貨裝置2 2 5之期間爲效率較佳地進行 去電。 其次,基於第1 7圖而針對於在本發明之第七實施例中 之卸貨裝置3 2 5進行說明。本實施例係爲在第1 3圖之卸貨 裝置125中,在各個臂部126a、126b上裝備有多數(在第 1 7圖中爲三個)振動板3 3 4,以取代形成爲長條狀之振動板 1 2 8 a、1 2 8 b。各個振動板3 3 4係經由角板1 1 6而被支撐在 未圖示之振動件上。各個振動板3 3 4係被接地的同時,爲 在相鄰接的振動板3 3 4之間配設有去電刷2 1 3。亦即振動 板3 3 4與去電刷213係沿著支撐部126之往復動作方向而 交互配置。即使在此種情況下,藉由卸貨裝置1 2 5而在飄 -24- 200404725 浮狀態下所卸貨的板狀構件2 1 5,係可在維持於卸 1 2 5之期間效率爲佳的被去電。此外,即使不增大 126a、126b之寬度,亦可將去電刷213裝設至臂部 1 26b ° 此外,亦可將實施例變更爲例如如下所述。 在第5A圖至第6C圖之實施例中,在玻璃基板 薄、大型且易撓曲的情況下,用以替代將玻璃基板 方成凸狀撓曲狀地進行飄浮維持,亦可將玻璃基板 方成凸狀撓曲狀地進行飄浮維持。 在第5 A圖至第6C圖之實施例中,作爲對應於玻 1 2之撓曲而將玻璃基板1 2與振動板1 7間之距離G 一定狀的構造,用以替代將移動體26沿著導軌25 之構造,係可將支撐振動件1 1 5之支撐板設成可藉 裝置來進行升降,亦可藉由可傾斜動作狀的將振動 設置在支撐板上。即使是在此種情況下,藉由組合 傾斜動作,係可將玻璃基板1 2與振動板1 7間之距 整至指定之値。 在第1A圖至第6C圖之實施例中,角板16之寬 未與振動板1 7之寬度相同,係可較振動板1 7之寬度 或是爲窄。較希望係爲大於振動板1 7之寬度爲佳。 第12圖之台車233亦可藉由導體所形成。在此 下,爲使各個振動板114a至114e、128a、128b以 的連接至台車2 3 3。也因此,各個振動板1 1 4 a至 128 a.、128b之電位係形成爲一定。 貨裝置 兩臂部 12 6a、 1 2爲較 12於下 12於上 璃基板 維持成 所移動 由升降 件115 升降與 離G調 度易可 爲寬、 種情況 電氣性 1 1 4e、 200404725 在第1 3圖至第1 7圖之各個實施例中,使板狀構件2 1 5 移載至收貨裝置3 11、4 1 1之裝置並非被限定在以非接觸狀 態來進行卸貨的卸貨裝置1 2 5,亦可將板狀構件2 1 5搬送 至收貨裝置311、411、移載至收貨裝置311、411。收貨裝 置3 1 1、4 1 1係在接收板狀構件2 1 5之後,爲將板狀構件 2 1 5維持在飄浮狀態,直到使板狀構件2 1 5爲藉由卸貨裝 置1 2 5而被卸貨至其他場所,以去除在板狀構件2 1 5中所 帶電的電荷。 在第13圖至第17圖之各個實施例中,並未在收貨裝置 3 1 1、4 1 1中設置去電刷2 1 3,而亦可使僅將振動板1 1 4a至 1 1 4e與板狀構件2 1 5間之距離調整成1 mm以下,去除在板 狀構件2 1 5中所帶電的電荷。然而,藉由倂用去電刷2 1 3 係可提昇去電效率。 在第1 3圖至第1 7圖之各個實施例中,亦可將板狀構件 215與第五振動板114a至114e間之距離調整成1mm以下, 使用去靜電器(Ionizer)而進行去電。在此種情況下,於剝 離帶電之中,爲藉由飄浮來抑制在去靜電器(Ionizer)中所 無法抑制阻斷之靜電的產生。再者,係在振動板與板狀構 件間爲具有空氣層之狀態下藉由去靜電器(Ionizer)來進行 去電,因此,係可經度爲佳地進行去電(爲將靜電抑制在數 1 〇至1 kv以下)。 在第1 A圖至第1 7圖之各個實施例中振動件1 5、1 1 5、 1 17、129、417並非限制在朗格分(音譯:Langevin )之振 動件,亦可使用其他的振動件。 -26- 200404725 第1 A圖至第1 7圖之各個實施例中,在增大各個振動板 的面積、板狀構建爲較小的情況下,並非一定要將振動板 接地。在此種情況下,振動板本身係達到接地之作用。 第1A圖至第17圖之各個實施例中,在振動板17中並 非被限制在經由直接配線而連接至地面的方法,亦可將支 撐板1 4或是收貨裝置1 1之框架由導電性材料所形成,將 其與地面之間經由配線而進行接地。 在第1 A圖至第1 7圖之各個實施例中,板狀構件並非被 限制在玻璃基板1 2,亦可爲其他物體、例如亦可爲半導體 晶圓。 在第1 A圖至第1 7圖之各個實施例中,對於振動板之角 板之固定並非被限定在藉由螺絲來鎖緊之固定,亦可使用 接著劑、或是以焊接或熔接來固定。 在第1 A圖至第1 7圖之各個實施例中,用以取代將振動 板進行接地而亦可將各個振動板設爲相同電位。例如,若 是連接至體積爲大於各個振動板之導體時,各個振動板之 電位係形成與導體之電位爲相同狀,而各個振動板之電位 係形成爲一定。 【圖式簡單說明】 第1 A圖係爲在將本發明具體化之第一實施例中之收貨 裝置的模式立體圖。 第1 B圖係爲第1 A圖之收貨裝置之側面圖。 第2A圖係爲使玻璃基板載置於振動板上之狀態的模式 圖。-22- 200404725 The receiving device 3 1 1 keeps the plate-like member 2 1 5 in a floating state, and the distance between the plate-like member 2 1 5 and the first to fifth vibration plates 1 1 4a to 1 1 4e Adjust to 1mm or less. By grounding the first to fifth vibrations U4a to 1 14e and adjusting the distance between the plate-shaped member 215 and the first to fifth vibration plates 1 14a to 1 1 4e to 1 mm or less, the plate shape When the member 2 1 5 is charged, the plate-shaped member 2 1 5 is de-energized in a non-contact state. This embodiment has the following advantages. The charged plate-like members 2 1 5 are transmitted from the first to fifth vibrating plates 1 1 4a to 1 1 by the radiation pressure of sound waves generated by the first to fifth vibrating plates 1 1 4a to 1 1 4e. 4e remains floating. The plate-shaped member 2 1 5 is removed in a non-contact state by adjusting the distance between the plate-shaped member 2 1 5 and the first to fifth vibration plates 1 1 4 a to 1 1 4 e to be 1 mm or less. Electricity. Therefore, it is not necessary to use a high-priced electricity removing device such as an ionizer, and the charged charges in the plate-like member 2 1 5 can be removed in a non-contact state. Furthermore, the static electricity of the plate-like member 2 1 5 can be reliably de-energized by the de-brushing brush 2 1 3. When the plate-shaped member 2 1 5 is de-energized, the distance between the plate-shaped member 2 1 5 and the first to fifth vibration plates Π 4a to 1 1 4e can be maintained across the entire surface of the plate-shaped member 2 1 5. It is uniform, so static electricity can be suppressed. The two vibration plates 1 2 8 a and 1 2 8 b are grounded. Therefore, during the unloading operation with the unloading device 1 2 5, the local electric charges charged in the plate-like member 2 1 5 can be removed. The first to fourth vibrating plates 1 1 4 a to 1 1 4 d are respectively arranged at positions corresponding to the four corners of the plate-like member 2 1 5, and between adjacent vibrating plates 1 1 4a to 1 1 4e -23- 200404725 Equipped with de-brush 2 1 3. Therefore, compared with the use of a long-shaped vibrating plate, the debrushing brushes 2 1 3 can be easily arranged without interfering with the unloading device 1 25. Next, the unloading device 2 25 in the sixth embodiment of the present invention will be described based on Fig. 16. The unloading device 2 2 5 of this embodiment is a plurality of brushes 213 provided in the unloading device 125 in FIG. 13. However, the width of the two arm portions 126a and 126b shown in FIG. 16 is wider than the width of the two arm portions 126a and 126b shown in FIG. In a direction along the long sides of the vibration plates 128a and 128b and at positions corresponding to both sides of the vibration plates 128a and 1 2 8 b, brushes 2 1 3 are provided. The front end of each of the de-brushing brushes 2 1 3 is arranged so as to be located on the same surface as the faces of the vibration plates 128 a and 128 b which are slightly opposed to the plate-shaped member 2 1 5. Even in this embodiment, the plate-like member 2 1 5 removed in the floating state (non-contact state) by the unloading device 22 5 is more efficient while being maintained in the unloading device 2 2 5 Make a call. Next, the unloading device 3 2 5 in the seventh embodiment of the present invention will be described based on Fig. 17. In this embodiment, in the unloading device 125 in FIG. 13, each of the arm portions 126 a and 126 b is equipped with a plurality of (three in FIG. 17) vibration plates 3 3 4 instead of being formed into long strips. Shaped vibration plates 1 2 8 a, 1 2 8 b. Each of the vibration plates 3 3 4 is supported on a vibration member (not shown) via a corner plate 1 1 6. While each of the vibration plates 3 3 4 is grounded, a de-brushing brush 2 1 3 is provided between adjacent vibration plates 3 3 4. That is, the vibration plate 3 3 4 and the de-brushing brush 213 are alternately arranged along the reciprocating direction of the support portion 126. Even in this case, the plate-like member 2 1 5 which is unloaded in the floating state by the unloading device 1 2 5 is floated in the floating state 24- 200404725, which can be effectively maintained during the unloading 1 2 5 period. Go out. In addition, even if the widths of 126a and 126b are not increased, the de-brushing brush 213 can be attached to the arm portion 126b °. In addition, the embodiment can be modified as described below, for example. In the embodiments of FIGS. 5A to 6C, when the glass substrate is thin, large, and easily deflected, it can be used instead of floating and maintaining the glass substrate in a convex shape, and the glass substrate can also be used. Fang maintains a floating shape in a convex shape. In the embodiments shown in FIGS. 5A to 6C, a structure in which the distance G between the glass substrate 12 and the vibration plate 17 is constant is used to correspond to the deflection of glass 12, instead of moving the moving body 26. Along the structure of the guide rail 25, the supporting plate for supporting the vibrating member 1 15 can be set to be raised and lowered by a device, and the vibration can be set on the supporting plate by tilting action. Even in this case, by combining the tilting action, the distance between the glass substrate 12 and the vibration plate 17 can be adjusted to a predetermined value. In the embodiments of FIGS. 1A to 6C, the width of the corner plate 16 is not the same as the width of the vibration plate 17 and may be narrower or narrower than the width of the vibration plate 17. It is more desirable that the width is larger than the width of the vibration plate 17. The trolley 233 of FIG. 12 can also be formed by a conductor. In this case, each of the vibration plates 114a to 114e, 128a, and 128b is connected to the trolley 2 3 3. Therefore, the potential systems of the respective vibration plates 1 1 4 a to 128 a., 128 b are formed constant. The two arms of the cargo device 12 6a, 12 are maintained on the upper glass substrate compared with 12 and lower 12 and are moved by the lifting member 115. Lifting and lifting away from G. The scheduling can be wide and the electrical is 1 1 4e, 200404725 in the first In each of the embodiments shown in FIG. 3 to FIG. 17, the device for transferring the plate-like member 2 1 5 to the receiving device 3 11 and 4 1 1 is not limited to the unloading device for unloading in a non-contact state 1 2 5. It is also possible to transfer the plate-like member 2 1 5 to the receiving devices 311 and 411, and transfer it to the receiving devices 311 and 411. The receiving device 3 1 1, 4 1 1 is after receiving the plate-shaped member 2 1 5 to maintain the plate-shaped member 2 1 5 in a floating state until the plate-shaped member 2 1 5 is passed through the unloading device 1 2 5 And it is unloaded to another place to remove the electric charges charged in the plate-like member 2 1 5. In each of the embodiments of FIG. 13 to FIG. 17, the de-brushing brush 2 1 3 is not provided in the receiving device 3 1 1, 4 1 1 and only the vibration plates 1 1 4a to 1 1 can be used. The distance between 4e and the plate-like member 2 1 5 is adjusted to 1 mm or less, and the electric charges charged in the plate-like member 2 1 5 are removed. However, by using the brush 2 1 3 series, the power-off efficiency can be improved. In each of the embodiments shown in FIGS. 13 to 17, the distance between the plate-shaped member 215 and the fifth vibration plates 114 a to 114 e may be adjusted to 1 mm or less, and the power may be removed using an ionizer (Ionizer). . In this case, during the stripping and charging, the generation of static electricity that cannot be blocked by the deionizer (Ionizer) is suppressed by floating. In addition, the deionization is performed by an ionizer in a state where an air layer is provided between the vibration plate and the plate-like member. Therefore, the deionization can be performed with a longitude (to suppress static electricity to a few 10 to 1 kv or less). In each of the embodiments of FIGS. 1A to 17, the vibration members 15, 1 1 5, 1 17, 129, and 417 are not limited to the vibration members of Langevin (transliteration: Langevin), and other vibration members may also be used. Vibration pieces. -26- 200404725 In each of the embodiments shown in FIGS. 1A to 17, when the area of each vibration plate is increased and the plate shape is made small, it is not necessary to ground the vibration plate. In this case, the vibration plate itself is grounded. In each of the embodiments shown in FIGS. 1A to 17, the vibration plate 17 is not limited to a method of connecting to the ground through direct wiring, and the frame of the support plate 14 or the receiving device 11 may be conductive. It is formed of a flexible material and grounded between it and the ground via wiring. In each of the embodiments shown in FIGS. 1A to 17, the plate-like member is not limited to the glass substrate 12, and may be another object, for example, a semiconductor wafer. In each of the embodiments of FIG. 1A to FIG. 17, the fixing of the corner plate of the vibration plate is not limited to the fixing by screwing, but also using an adhesive or welding or welding. fixed. In each of the embodiments shown in FIGS. 1A to 17, instead of grounding the vibration plate, each vibration plate can be set to the same potential. For example, if it is connected to a conductor having a volume larger than that of each of the vibration plates, the potential system of each vibration plate is the same as the potential of the conductor, and the potential system of each vibration plate is formed constant. [Brief description of the drawings] Fig. 1A is a schematic perspective view of a receiving device in the first embodiment embodying the present invention. Figure 1B is a side view of the receiving device of Figure 1A. Fig. 2A is a schematic view showing a state where a glass substrate is placed on a vibration plate.

-27 - 200404725 第2B圖係爲玻璃基板已飄浮之狀態的模式圖。 第3圖將玻璃基板剝離時之時間與電位之關係的圖表。 第4圖係爲說明作用之模式圖。 第5 A圖所示係爲在本發明之第二實施例中之剝離帶電 抑制裝置的側面圖。 第5 B圖所示係由第5 A圖之剝離帶電抑制裝置去除振動 板之該裝置的平面圖。 第6 A圖係爲說明第5 A圖之裝置作用的側面圖。 第6 B圖係爲說明第5 A圖之裝置作用的側面圖。 第6C圖係爲說明第5 A圖之裝置作用的側面圖。 第7圖係爲在本發明之第三實施例中之收貨裝置以及卸 貨裝置的立體圖。 第8圖所示係爲設在第7圖之收貨裝置之角板與振動件 的正面圖。 第9圖係爲第7圖之卸貨裝置的平面圖。 第1 〇圖係爲第7圖之卸貨裝置的側面圖。 第1 1 A圖所示係爲使板狀構件載置於第7圖之收貨裝置 上之狀態的模式圖。 弟1 1 B圖所不係爲弟7圖之卸貨裝置之卸貨時之狀態的 模式圖。 第1 2圖係爲在本發明之第四實施例中之收貨裝置的側 面圖。 第1 3圖係爲在本發明之第五實施例中之收貨裝置以及 卸貨裝置的立體圖。 -2.8- 200404725 第1 4圖係爲在第1 3圖之收貨裝置中所具備的去電刷之 圖式。 第1 5圖所示係爲使板狀構件載置於第1 3圖之收貨裝置 上之狀態的示意圖。 第1 6圖所示係爲在本發明之第六實施例中之卸貨裝置 的平面圖。 第1 7圖所示係爲在本發明之第七實施例中之卸貨裝置 的平面圖。 【主要部分之代表符號說明】 1 1 :收貨裝置 1 1 2 :第一物體飄浮裝置 114a〜114e:振動板 1 2 :玻璃基板 1 2 0 a :金屬塊 120b :金屬塊 1 2 1 :突緣 1 2 5 :卸貨裝置 1 2 6 ·支撐部 1 2 6 a :臂部 126b :臂部 127 :移動裝置 1 2 7 a :環部 1 3 :物體飄浮裝置 1 3 3 :第二物體飄浮裝置 394 -29- 200404725 134 :支撐架 1 4 :支撐板 140 :角板 14a :孔 1 5 :振動件 1 6 :角板 1 6 a :錐體 1 7 :振動板 19a :壓電元件 19b :壓電元件 2 0 :電極板 2 1 3 :去電刷 2 13b :導電性纖維 2 1 5 :板狀構件 2 1 a :金屬塊 2 1 b :金屬塊 2 2 :突緣 2 3 :震盪器 2 3 3 :台車 25 :導軌 2 6 :移動件 27 :線性引動器 2 8 :衝桿-27-200404725 Figure 2B is a schematic diagram of the state where the glass substrate has floated. Fig. 3 is a graph showing the relationship between time and potential when the glass substrate is peeled. Figure 4 is a schematic diagram illustrating the function. Fig. 5A is a side view showing a peeling-off suppression device in a second embodiment of the present invention. Figure 5B is a plan view of the device in which the vibration plate is removed by the stripped charge suppression device of Figure 5A. Fig. 6A is a side view illustrating the operation of the device of Fig. 5A. Fig. 6B is a side view illustrating the operation of the device of Fig. 5A. Fig. 6C is a side view illustrating the operation of the device of Fig. 5A. Fig. 7 is a perspective view of a receiving device and an unloading device in a third embodiment of the present invention. Fig. 8 is a front view of a corner plate and a vibrating member of the receiving device shown in Fig. 7. Fig. 9 is a plan view of the unloading device of Fig. 7. Figure 10 is a side view of the unloading device of Figure 7. Fig. 11A is a schematic view showing a state in which a plate-like member is placed on the receiving device of Fig. 7. Figure 1 1B is not a schematic diagram of the state of the unloading device of Figure 7 when unloading. Fig. 12 is a side view of a receiving device in a fourth embodiment of the present invention. Fig. 13 is a perspective view of a receiving device and an unloading device in a fifth embodiment of the present invention. -2.8- 200404725 Fig. 14 is a drawing of the de-brushing device provided in the receiving device of Fig. 13. Fig. 15 is a schematic view showing a state where the plate-shaped member is placed on the receiving device of Fig. 13. Fig. 16 is a plan view showing the unloading device in the sixth embodiment of the present invention. Fig. 17 is a plan view of the unloading device in the seventh embodiment of the present invention. [Description of Representative Symbols of Main Parts] 1 1: Receiving device 1 1 2: First object floating device 114a ~ 114e: Vibration plate 1 2: Glass substrate 1 2 0 a: Metal block 120b: Metal block 1 2 1: Projection Edge 1 2 5: unloading device 1 2 6 · support 1 2 6 a: arm 126 b: arm 127: mobile device 1 2 7 a: ring 1 3: object floating device 1 3 3: second object floating device 394 -29- 200404725 134: Support frame 1 4: Support plate 140: Corner plate 14a: Hole 1 5: Vibrator 16: Corner plate 1 6a: Cone 17: Vibration plate 19a: Piezo element 19b: Pressure Electrical component 2 0: electrode plate 2 1 3: debrush 2 13b: conductive fiber 2 1 5: plate-like member 2 1 a: metal block 2 1 b: metal block 2 2: flange 2 3: oscillator 2 3 3: Trolley 25: Guide rail 2 6: Moving part 27: Linear actuator 2 8: Punch bar

- 30--30-

Claims (1)

200404725 拾、申請專利範圍: 1 · 一種板狀構件之剝離帶電控制方法,其特徵在於:當使 載置於載置部之板狀構件由載置部移動時,利用藉由使 載置部激發振動而產生有音波之放射壓,進而使板狀構 件由載置部飄浮。 2·如申請專利範圍第1項之剝離帶電控制方法,其中前述 載置部係由導電性材料所形成,且被接地。 3 · —種剝離帶電抑制裝置,爲當由載置部剝離被載置於載 置部的板狀構件之際,抑制板狀構件之帶電,其特徵在 · 於:前述載置部係由物體飄浮裝置所形成,前述物體飄 浮裝置係具備有··振動板,係由可載置板狀構件之導電 性材料所形成;激發振動裝置,係使前述振動板激發振 動;藉由來自被激發振動之振動板的音波之放射壓而使 前述板狀構件由前述振動板之表面飄浮,振動板係被接 地。 4·如申請專利範圍第3項之剝離帶電抑制裝置,其中前述 振動板係爲多數中之一個,在使被載置於前述振動板上 ® 之前述板狀構件由該振動板之表面飄浮時,對應於前述 板狀構件之撓曲而將振動板與前述板狀構件間之距離維 持成一定,且具備以移動前述振動板的移動裝置。 5.如申請專利範圍第3或4項之剝離帶電抑制裝置,其中 前述振動板係形成爲長條狀。 6 ·如申請專利範圍第3或4項之剝離帶電抑制裝置,其中 前述板狀構件係爲玻璃基板。 -31- 200404725 7 ·如申請專利範圍第4項之剝離帶電抑制裝置,其中前述 移動裝置係爲使前述振動板傾斜移動、且使其升降。 8 · —種卸貨方法,係爲將板狀構件由第一物體飄浮裝置上 移載至第二物體飄浮裝置上,其特徵在於:第一以及第 二物體飄浮裝置係分別具備有由導電性材料所形成之多 數的振動板;利用使各個振動板激發振動所產生之音波 的放射壓而將板狀構件進行飄浮維持,第二物體飄浮裝 置係更被裝備在可往復作動之支撐部上,當將板狀構件 由第一物體飄浮裝置上移載至第二物體飄浮裝置上之 際,爲將第一物體飄浮裝置之振動板相互設爲相同電 位、或是進行接地的同時,將第二物體飄浮裝置之振動 板相互設爲相同電位、或是進行接地之狀態下,調整成 使各個物體飄浮裝置之振動板與前述板狀構件之間的距 離形成爲一定狀。 9· 一種卸貨裝置,其特徵在於具備有: 支撐部,係可往復作動; 移動裝置,爲使前述支撐部往復作動; 物體飄浮裝置,係被裝設在前述支撐部上,爲利用藉 由使以導電性材料所形成之多數之振動板被激發振動所 產生之音波的放射壓,而將板狀構件維持在飄浮狀態; 前述振動板係被接地,或是振動板爲設成相互爲相同 電位。 1 0. —種收貨裝置,其特徵在於:利用使由導電性材料所形 成之多數的振動板激發振動所產生之音波的放射壓,而 -32- 200404725 使將板狀構件進行飄浮維持的物體飄浮裝置裝備在移動 體上’前述振動板係爲相互爲相同電位,或是前述振動 板爲相互接地。 1 1 .如申請專利範圍第1 〇項之收貨裝置,其中前述移動體之 框架係由導電性材料所構成,前述各個振動板係被連接 至前述框架。 1 2 · —種板狀構件之去電方法,其特徵在於具備有: 飄浮維持步驟,係利用使由導電性材料所形成之振動 板激發振動所產生之音波的放射壓,而將已帶電之板狀 構件進行飄浮維持; 去電步驟,在將前述振動板進行接地之狀態下,將前 述板狀構件與前述振動板之間的距離調整爲1 m m以下, 而將板狀構件進行去電。 1 3 ·如申請專利範圍第丨2項之板狀構件之去電方法,其中爲 使去電刷配置成將去電刷之前端位於略與對向於前述板 狀構件之前述振動板之面相同面上。 1 4 · 一種板狀構件之去電方法,其特徵在於具備有: 飄浮維持步驟,係利用使由導電性材料所形成之振動 板激發振動所產生之音波的放射壓,而將已帶電之板狀 構件進行飄浮維持; 調整步驟,在將振動板進行接地之狀態下,將板狀構 件與振動板之間的距離調整爲1 mm以下; 去電步驟,係使用去靜電器(Ionizer)而將板狀構件進 行去電。 200404725 1 5 · —種卸貨裝置,係特徵在於: 具備有: 支撐部,係可往復作動; 移動裝置,爲使前述支撐部往復作動; 物體飄浮裝置,爲具備有多數之振動板,物體飄浮裝 置係被裝備在前述支撐部上,爲利用藉由使各個振動板 被激發振動所產生之音波的放射壓,而將板狀構件維持 在飄浮狀態; 各個振動板係被接地,將去電刷配置成將去電刷之前 端位於略與對向於前述板狀構件之前述振動板之面相同 面上。 1 6. —種收貨裝置,其特徵在於:具備有物體飄浮裝置,係 利用藉由使多數之振勸板被激發振動所產生之音波的放 射壓,而將板狀構件維持在飄浮狀態; 前述各個振動板係被接地。將去電刷配置成將去電刷 之前端位於略與對向於前述板狀構件之振動板之面相同 面上。 1 7 ·如申專利範圍第1 6項之收貨裝置,其中前述物體飄浮裝 置以及前述去電刷係被裝設在移動體上。200404725 Patent application scope: 1 · A method for controlling the peeling and charging of a plate-shaped member, characterized in that when the plate-shaped member placed on the placement portion is moved from the placement portion, the placement portion is excited by The vibration generates radiated pressure of sound waves, and further, the plate-shaped member floats from the mounting portion. 2. The peeling and charging control method according to item 1 of the scope of patent application, wherein the mounting portion is formed of a conductive material and is grounded. 3. A peeling suppression device for suppressing the electrification of a plate-shaped member when the plate-shaped member placed on the placing section is peeled off by the placing section, which is characterized in that the placing section is an object Formed by a floating device, the object floating device is provided with a vibration plate made of a conductive material on which a plate-like member can be placed; an excitation vibration device is made to cause the vibration plate to excite vibration; The radiation pressure of the sound wave of the vibration plate causes the plate-shaped member to float from the surface of the vibration plate, and the vibration plate is grounded. 4. The peel-off electrification suppression device according to item 3 of the patent application, wherein the aforementioned vibration plate is one of the majority, and when the aforementioned plate-shaped member placed on the aforementioned vibration plate® is floated from the surface of the vibration plate The mobile device is provided with a moving device for moving the vibration plate while maintaining a constant distance between the vibration plate and the plate member in response to the deflection of the plate-shaped member. 5. The peeling electrification suppression device according to item 3 or 4 of the scope of patent application, wherein the aforementioned vibration plate is formed in a long shape. 6 · The peeling charge suppressing device according to item 3 or 4 of the scope of patent application, wherein the aforementioned plate-like member is a glass substrate. -31- 200404725 7 · The peeling-off electrification suppressing device according to item 4 of the patent application scope, wherein the moving device is for tilting and moving the vibration plate. 8 · A method of unloading is to transfer a plate-shaped member from a first object floating device to a second object floating device, characterized in that the first and second object floating devices are each provided with a conductive material Most of the formed vibration plates; the plate-shaped members are floated and maintained by using the radiation pressure of the sound waves generated by the vibration vibration of each vibration plate, and the second object floating device is further equipped on a reciprocating support portion. When the plate-shaped member is transferred from the first object floating device to the second object floating device, in order to set the vibration plates of the first object floating device to the same potential as each other, or to ground the second object, When the vibration plates of the floating device are at the same potential or grounded, the distance between the vibration plate of each object floating device and the plate-shaped member is adjusted to be constant. 9. An unloading device, comprising: a support portion capable of reciprocating motion; a moving device to reciprocate the support portion; an object floating device is installed on the support portion to make use of The plate-shaped member is maintained in a floating state by a plurality of vibration plates formed of a conductive material being excited by sound waves generated by vibration; the aforementioned vibration plates are grounded, or the vibration plates are set to the same potential as each other . 1 0. A receiving device characterized in that by utilizing the radiation pressure of a sound wave generated by exciting a plurality of vibration plates formed of a conductive material, -32-200404725 enables the plate-shaped member to be floated and maintained. The object floating device is provided on the moving body. The aforementioned vibration plates are at the same potential as each other, or the aforementioned vibration plates are grounded to each other. 1 1. The receiving device according to item 10 of the application, wherein the frame of the moving body is made of conductive material, and each of the vibration plates is connected to the frame. 1 2 · A method for removing electricity from a plate-shaped member, comprising: a floating maintenance step, utilizing a radiation pressure of a sound wave generated by exciting a vibration of a vibration plate formed of a conductive material, The plate-shaped member is float-maintained; in the power-off step, the distance between the plate-shaped member and the vibration plate is adjusted to 1 mm or less while the vibration plate is grounded, and the plate-shaped member is de-energized. 1 3 · The method for removing electricity of a plate-like member according to item 丨 2 of the scope of patent application, wherein the brush is configured so that the front end of the electricity-removing brush is located slightly opposite to the face of the vibration plate facing the plate-like member. Same surface. 1 4 · A method for removing electricity from a plate-shaped member, comprising: a floating maintenance step, utilizing a radiation pressure of a sound wave generated by exciting a vibration plate made of a conductive material to vibrate, and charging the charged plate The floating member is maintained by floating; the adjusting step is to adjust the distance between the plate-shaped member and the vibration plate to 1 mm or less while the vibration plate is grounded; and the de-energizing step is to use an Ionizer to remove The plate-like member is de-energized. 200404725 1 5 · A kind of unloading device, characterized in that: It is equipped with: a supporting part, which can be reciprocated; a moving device for reciprocating the aforementioned supporting part; an object floating device, which has a plurality of vibration plates and an object floating device It is equipped on the support part to maintain the plate-like member in a floating state by using the radiation pressure of the sound waves generated by causing each vibration plate to be excited to vibrate; each vibration plate is grounded and the de-brushing device is arranged The front end of the de-brushing brush is located on the same plane as that of the vibration plate facing the plate-shaped member. 1 6. —A receiving device, characterized in that: it is provided with an object floating device, which maintains the plate-like member in a floating state by using the radiation pressure of a sound wave generated by exciting a large number of vibrating plates; Each of the aforementioned vibration plates is grounded. The de-brushing brush is arranged so that the front end of the de-brushing brush is located on the same side as the face of the vibration plate facing the plate-shaped member. 17 · The receiving device of item 16 in the scope of the patent application, wherein the object floating device and the de-brushing device are installed on a moving body.
TW092121316A 2002-08-09 2003-08-05 Static charge suppression method and static charge suppression apparatus for plate member, method for removing electricity from plate member, and load pickup method, load pickup apparatus, and load receiving apparatus for plate member TWI226867B (en)

Applications Claiming Priority (3)

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JP2002232978A JP4029689B2 (en) 2002-08-09 2002-08-09 Loading method for plate-like members
JP2002232977A JP3894071B2 (en) 2002-08-09 2002-08-09 Method for removing electricity from plate-like member, load receiving device and load receiving device
JP2002232976A JP4359028B2 (en) 2002-08-09 2002-08-09 Peeling suppression device

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CN111377246A (en) * 2018-12-28 2020-07-07 上海微电子装备(集团)股份有限公司 Material conveying device and system
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