200402782 玖、發明說明 (發明說明應敘明：發明所屬之技術領城、先前技術、内容、實施方式及圖式簡單說明） ^ JSb Jt 發明領域 本發明是關於一種被使用在化學機械研磨方法中的拋 5 光塾’更特別的是關於一種使用雷射光束及光罩在拋光墊 上形成微孔、齒孔及/或凹槽的方法。200402782 发明, description of the invention (the description of the invention should state: the technical leadership of the invention, the prior art, the content, the embodiment and the simple description of the drawings) ^ JSb Jt Field of the invention The invention relates to a method used in chemical mechanical polishing The 5's of light 'is more specifically a method for forming micro holes, perforations and / or grooves on a polishing pad using a laser beam and a photomask.
馭先前技術J 發明背景 在半導體元件製造方法中化學機械研磨（CMP)通常是 10 一種被用於獲得球狀平坦化之高精準/鏡面的表面拋光方 法。依照此CMP，在拋光墊與將被拋光的晶圓之間有一漿 液k供’以便化學|虫刻該晶圓的表面。使用該拋光塾，該 晶圓的蝕刻表面會被機械拋光。 參考第1圖’示意說明一種典型的化學機械研磨機械 15 ，其以數標1表示。一種使用該化學機械研磨機械1的化學 機械研磨方法也被示意說明於第2圖中。該化學機械研磨 方法包括一化學蝕刻反應處理與一機械研磨處理，其是使 用包含於該化學機械研磨機械中之該拋光墊10進行。該化 學姑刻反應是藉由梁液42進行。也就是該梁液42適用於與 2〇將被拋光之晶圓30表面進行化學反應，藉此使它可能在該 化學韻刻反應之後，可以輕易地進行該機械研磨處理。在 該機械拋光處理中’該被穩固地固定在一平臺2〇上的抛光 墊1〇會旋轉。被一護圈環32穩固支撐該晶圓30旋轉的同時 會震動。藉由-漿液供應工具4〇將研磨粒子的裝液供應至 200402782 玖、發明說明 該拋光墊10。該供應的漿液被引至該拋光墊10與該晶圓30 之間。所引進的研磨粒子會藉由該拋光墊1〇與該晶圓3〇之 間的相對旋轉速度差而與該晶圓摩擦接觸，以使它們進行 機械抛光。該漿液42是一種包含具有顆粒大小為奈米尺度 5之研磨顆粒的膠態液體。在拋光處理期間，此漿液42被散 佈在該拋光墊10上。在拋光處理期間，當該拋光墊1〇旋轉 時’由於該拋光墊10旋轉產生的離心力，被供應至該拋光 墊1 〇的漿液疋由该抛光塾1 〇的周邊向外排出。為了達到提 升拋光效率，相當大量的研磨粒子在該拋光墊的上表面維 10持一段令人滿意的漫長時間，以便它們進行該晶圓的拋光 。也就是，該拋光墊1 0應該盡可能使該漿液42在其表面上 保持一段長時間。 為了使該漿液保持在該拋光墊上一段長的時間，一種 形成微米Um)大小的球狀微胞的方法或者在該拋光墊的 15表面上形成齒孔與凹槽的方法可能被使用。在該抛光處理 期間，此些微胞、齒孔與凹槽用作控制該連續被供應之浆 液的流量與分配。 20Background of the Invention J. BACKGROUND OF THE INVENTION Chemical mechanical polishing (CMP) in semiconductor device manufacturing methods is usually a high precision / mirror surface polishing method used to obtain spherical planarization. According to this CMP, a slurry k is provided between the polishing pad and the wafer to be polished to chemically etch the surface of the wafer. Using the polishing pad, the etched surface of the wafer is mechanically polished. Referring to Fig. 1 ', a typical chemical mechanical grinding machine 15 is schematically illustrated, which is indicated by numeral 1. A chemical mechanical polishing method using the chemical mechanical polishing machine 1 is also schematically illustrated in Fig. 2. The chemical mechanical polishing method includes a chemical etching reaction process and a mechanical polishing process, which are performed using the polishing pad 10 included in the chemical mechanical polishing machine. The chemical reaction is carried out by Liangye 42. That is, the beam liquid 42 is suitable for performing a chemical reaction with the surface of the wafer 30 to be polished, thereby making it possible to easily perform the mechanical polishing treatment after the chemical etching reaction. In the mechanical polishing process, the polishing pad 10, which is firmly fixed on a platform 20, is rotated. The wafer 30 is steadily supported by a retainer ring 32 while vibrating. A slurry supply tool 40 was used to supply the liquid containing the abrasive particles to 200402782 玖. Description of the Invention The polishing pad 10. The supplied slurry is introduced between the polishing pad 10 and the wafer 30. The introduced abrasive particles are brought into frictional contact with the wafer by the relative rotational speed difference between the polishing pad 10 and the wafer 30, so that they are mechanically polished. The slurry 42 is a colloidal liquid containing abrasive particles having a particle size of nanometer size 5. This slurry 42 is spread on the polishing pad 10 during the polishing process. During the polishing process, when the polishing pad 10 is rotated 'due to the centrifugal force generated by the rotation of the polishing pad 10, the slurry 疋 supplied to the polishing pad 10 is discharged outward from the periphery of the polishing 塾 10. In order to improve the polishing efficiency, a considerable amount of abrasive particles are maintained on the upper surface of the polishing pad for a satisfactory length of time so that they can polish the wafer. That is, the polishing pad 10 should keep the slurry 42 on its surface as long as possible. In order to keep the slurry on the polishing pad for a long time, a method of forming spherical cells with a size of micrometers (Um) or a method of forming perforations and grooves on the surface of the polishing pad may be used. During the polishing process, these cells, perforations and grooves are used to control the flow and distribution of the continuously supplied slurry. 20
照慣例，在該拋光墊之該些微胞的形成可以使用一種 物理方法或-種化學方法達成。每—個都有—空腔的中空 微元件(mi⑽dements)被併入—聚合體基質以形成微胞的 方法可以作為該物理方法。利用化學形成的泡泡而形成微 胞的發泡方法可以作為該化學方法。 在一聚合體基質中該為元件 — 1千的併入可以猎由使該些 元件均勻地分佈在該聚合體某皙由 月且&貝中的型式，於一聚合體Conventionally, the formation of the cells on the polishing pad can be achieved using a physical method or a chemical method. Each of them has a hollow cavity micro-dements incorporated into a polymer matrix to form cells, and this physical method can be used. A foaming method using chemically formed bubbles to form cells can be used as the chemical method. In a polymer matrix, it is an element—the incorporation of one thousand can be used to make the elements evenly distributed in the polymer.
7 200402782 玖、發明說明 吳中含浸大量之每一個都有一空腔的中空微元件，藉此形 成微胞而達成。該聚合體基質是藉由將一固化劑與諸如聚 女-曰弋®日、氟化破氫化合物或其混合物混合來製備。對 於4二u元件而言，無機鹽類、糖、水溶性膠、樹脂或其 5 -種或更多種混合物可以被使用。此微元件是由聚乙婦醇 、果膠、聚乙烯比咯酮、聚乙二醇、聚胺酯或其組合做成 4二U元件有大約8〇微米的平均直徑。該些微元件是依 據一一高剪切混合方法均勻地分佈在該聚合體基質上，這 樣它們可以形成均勾的微胞。參考第3圖，使用該些微元 1〇件形成的微胞將被圖示說明。然後，具有上面提提的方式 形成的推i胞之該墊被切割成每一個都具有需要之厚度的片 段，以獍得拋光墊。在每一切片中，無規地分佈在該墊中 之微胞在該切片的切面處是開放的，這樣在該切片的切面 處匕們會顯露出圓形或橢圓形截面的形狀。在每一拋光塾 15之該拋光表面處暴露之該些微胞截面的大小與位置是無規 的。該暴露的微胞截面之如此無規的大小與位置會使該些 拋光墊中所需要的均勻性變差。 依據该化學方法’其中該些微胞（cells)是使用發泡方 法形成，聚合體基質是藉由混合固化劑與一液相聚胺g旨形 20成物質而形成。水與具有低沸點且直接參與化學反應而產 生氣體的液化氣體也可以被使用作為發泡劑，藉此產生氣 泡而在該聚合體基質中形成微胞。該些泡泡的生成是經由 向勇切混合操作造成之成核方式達成。作為獲得表面張力 降低的界面活性劑也可以被使用，以調整該些微泡的大小 200402782 玖、發明說明 ’因而獲得所需要之微泡均勻性。第4圖是顯示使用該方 泡方法形成之微胞的照片。不過依據該發泡方法形成的微 胞有一個問題，該些微胞太大而無法被塗佈在該化學機械 研磨墊上，那些微胞有不均句的分佈，而且方法可以調整 5 該些微胞的大小與分佈。 ， 该些微胞是使用每一個都具有空腔的微元件或者一種 具有圓形或橢圓形截面形狀之球體結構的發泡方法形成。 由於如此的形狀，該些微胞具有一在該拋光墊厚度方向會 改變的截面。基於這個原因，在拋光處理期間，在該拋光 10墊的拋光面上暴露之每一個微泡的截面會隨著該拋光墊的 磨損而被改變。換句話說，當拋光程序進行時，暴露在該 拋光墊的拋光面上之圓形或橢圓形微泡直徑會逐漸縮小， 而且最後會消失。最後，存在於該拋光墊之表面下沒有被 暴露的微胞應該會重新在該拋光墊的拋光表面被暴露。 15 因此，每一個在該拋光墊之拋光表面被暴露的微胞之 截面在拋光處理期間厚度會改變。由於這個理由，會有拋 光速率不· 致的問題產生。 為了在該拋光墊之拋光表面形成齒孔或凹槽，使用切 割或研磨處理的機械加工方法已經被使用。 參考第5a圖，用於形成凹槽之切割機7〇被圖示說明。 當使用安裝在車床上之切割機70的刀具壓模機械加工拋光 墊，在該拋光墊的上表面會形成同心圓形狀的凹槽，如第 5b圖所示。第5c圖是沿著第5b圖之κ線的截面圖示。參 考第5b和5c圖 使用該切割機而形成的凹槽之示範型式將 20 200402782 玖、發明說明 以數標7 5表示。具有 美國專利第5894769 被圖示說明。在第5c圖中，該些凹槽 同心圓形式之凹槽的實施例被揭示於 號中。 茶考第6a圖’其顯示依水平研磨的機械。，切割㈣ 5舆間隔物（spacers)83被安裝在其中。該切割鑛阳皮建構成 在X軸方向上移動。將被機械加工的拋光墊ι〇是在^軸方向 移動。根據這些運動，在第一方向延伸的凹槽以形成在 該拋光墊10的上表面。在該些凹槽85形成之後，㈣光塾 1〇被旋轉90。。在此情況中，當該抛光㈣在丫軸方向移動 1〇時，在垂直於該第一方向之第二方向上延伸的凹槽會被形 成。因此，以格栅型式配置之凹槽是形成在該抛光表面上 ，如第6b與6c圖所示。 參考第7a圖，作為在拋光墊形成齒孔的齒孔检將被圖 不次明。當在該拋光墊是在y軸方向移動的條件下使用該 15些齒孔栓進行打孔操作時，在該拋光墊的該拋光表面上會 形成齒孔，如第7b圖所示。該些齒孔的實施例被揭示於美 國專利第58533 17號中。 因為該些被使用以在拋光墊形成齒孔或凹槽之該些傳 統的方法是藉由一車床或研磨進行切割程序，該些凹槽有 2〇諸如同心圓或格柵之固定圖案。由於這個原因，要形成可 以有效地控制漿液流動的凹槽圖案是困難的。依據使用齒 孔栓而形成齒孔的方法，該些齒孔有固定的形狀。當該齒 孔栓是簡單地在X或y軸方向移動時，該些齒孔也會被形成 。基於這個原因，該些齒孔有簡單且固定的圖案。因此， 10 200402782 玖、發明說明 它很難獲得在化學機械研磨 ,^ f *序中需要的有效孔洞圖案。 在被使用機械工且撼料 塾中，在基謝加工處理期;;=而具有凹槽或齒孔的抱光 ^ ^ '月間形成的碎屑可能留在該些凹槽 或回孔中。在該化學機械研 f序期間，該些碎屑可能被 拋光的表面上形成刮痕。 * 同時，美國專利第59〇〇1 ^ · 64唬和第5578362號分別揭示 利用照射雷射光束甜形成 战凹槽的方法。依據這些方法，一 有黏性的光罩被使用以消 句* $積在拋光墊上的蒸汽痕跡。 ίο 15 不過’這些方法是複雜的’因為該光罩應該與該拋光塾黏 合。此外，有-個問題是不容許該有黏性的光罩黏著盆上 ㈣不能被使用。即衫在該光μ除之後，該料的接 著d也可&由^射光束的機械操作之熱量而留該塾上。 基於這個原因，它需要額外使用-用以除去該殘留的接著 劑之方法。當該有純的光㈣时料時，該塾與該有 黏性的光罩之該接著劑層之間可能形成氣泡。在此情況中 ’當雷射光束照射在該些氣泡上時’它不可能形成具有等 同於設計的凹槽尺寸之大小的凹槽。 t 明内】 發明概要 20 目此’為了解決包含使用每—個都具有空腔的微元件 或-發泡方法形成微泡，以及使用機械方法形成凹槽或齒 孔，本發明已經被完成。本發明擁有一種能夠輕易地在抛 光墊上形成具有有效且分散的圖案之微孔洞、凹槽及/戋 齒孔的方法。 200402782 玖、發明說明 為了消除包含傳統使用每—個都具有空腔的微元件或 -發泡方法的缺點’也就是’結果會產生抛光處理之抛光 速率降低或不-致性之微胞尺寸與分佈的不均句性，本發 明的-個目的是提供-種用於形成與微胞具有相同功能， 5同時具有-受控制的均勾分佈與受控制的均句尺寸之微孔 洞0 本發明的另-個目的是為了消除包含傳統的機械方法 之該些缺點，也就是，由於凹槽或齒孔之固定形狀或圖案 ，不適於控制該⑽的流動，而提供_種在拋光處理期間 10，用於形成具有多種不同的形狀、尺寸與圖案以有效地控 制聚液流動的方法。 本‘明的另一個目的是提供一種用於形成凹槽的方法 ’其不僅能夠消除任-種有黏性的光罩的使用，藉此包含 隨著雷射光束使用一有黏性的光罩的情況，那就是整個製 15程的複雜性以及需要額外的黏著劑去除程序的問題會被消 除，當使用多種不同的拋光墊的同時，也可以獲得該凹槽 形成之準確性的改善。 為了 7C成這些目的，依照雷射機械加工原理與光罩， 本發明提供一種用於在拋光墊上形成具有使用者想要的各 20種不同圖案之微孔、凹槽及/或齒孔的方法。 依據本發明的一實施例，其提供一種用於製造一拋光 塾的方法包含步驟：決定將被形成在拋光墊上之微孔、 凹槽及/或齒孔的圖案；將決定的圖案輸入電腦數位控制 (CNC)控制器；選擇具有相當於該輸入圖案的微孔、凹槽 12 200402782 玖、發明說明 及/或齒孔之圖案的光罩；與當根據該輪入 • 的圖案而在該 CNC控制器的控制下支樓該抛光塾的同 可，驅動適合發射 雷射光束的雷射裝置與適合進行三維移動及旋轉的工作么 ，藉此由該雷射裝置將雷射光束發射至 " 邊工作台支撐的 5拋光墊上，以便具有相當於該已確定圖幸夕m & 〜口茶之圖案的微孔、 凹槽及/或齒孔被形成在該拋光墊上。 圖式簡單說明 第！圖是說明-典型的化學機械研磨機械之構形與使 用该化學機械研磨機械進行拋光方法之示音圖· 10 第2圖是說明一種化學機械研磨之概念的示意圖· 第3圖是依據傳統方法使用每一個都有一空腔的微元 件而形成之微胞的照片； 第4圖是使用傳統發泡方法形成的微胞的照片； 第5a圖是說明用於形成凹槽之傳統切割機的示意圖·， 15 ㈣圖是說明—種具有使用該傳統的切割機形成同心 圓形式的凹槽之拋光墊； 第5c圖是沿著第5b圖之A-A線的截面圖示； 第6a圖是說明藉由安裝傳統切割鋸與間格器之傳統的 水平研磨機械，而形成含有具格柵圖案之凹槽的拋光墊的 20 示意說明圖； 第6b圖是說明藉由第6a圖之傳統的水平研磨機械形成 之一具有格柵型式的凹槽之拋光墊示意圖； 第6g圖說明藉由傳統的水平研磨機械形成的一種格柵 形狀凹槽的截面圖示； 13 200402782 玖、發明說明 第7a圖是說明適合在一拋光墊上形成齒孔之傳統齒孔 检的透視圖， 第7b圖是說明一含有藉由第以圖的傳統齒孔栓而形成 齒孔之拋光墊的平面圖示； 5 第7C圖是說明具有利用傳統的齒孔栓形成之齒孔的拋 光塾之截面圖示； 第8a圖是說明使用在依據本發明之機械加工方法的雷 射系統之示意圖； 第8 b圖是說明將雷射光束照射在依據本發明之機械加 10工方法中·使用的光罩上的條件之示意圖； 第9a圖是顯示在只使用雷射光束的情況中所形成之微 孔的平面圖結構之照片； 第9b圖是顯示具有以雷射光束穿透利用依據本發明之 較佳實施例形成帶有多數圓形圖案之光罩的情況中，所形 15 成之微孔的拋光墊之平面圖結構的照片； 第9c圖是顯示具有以雷射光束穿透利用依據本發明之 較佳實施例形成帶有五角形圖案之光罩的情況中，所形成 之微孔的拋光墊之平面圖結構的照片； 第10圖是說明具有藉由依據本發明之較佳實施例的雷 20 射形成之微孔的拋光墊的示意圖； 第11圖是說明具有藉由依據本發明之另一較佳實施例 的雷射形成之齒孔的拋光墊的示意圖； 第12圖是說明具有藉由依據本發明之另一較佳實施例 的雷射形成之凹槽的拋光墊的示意圖。 14 200402782 玖、發明說明 L貧τ式4 3 進行本發明之最佳模式 現在，將參考該些附錄 口不而就本發明的構造與功 能做詳細的說明。 、 5 10 15 本發明利用雷射光束加工原 、 京里方；抛光墊上微孔、凹槽 及/或齒孔的形成。該雷射機械 wy丄乃忐有一減少層中承 受熱變形之區域的特性。該雷射機械加工也是以非接觸型7 200402782 发明, description of the invention Wu Zhong impregnated a large number of hollow micro-elements, each of which has a cavity, thereby forming micro-cells. The polymer matrix is prepared by mixing a curing agent with a polymer such as Poly-Hydroxybenzine, a fluorinated hydrogen-breaking compound, or a mixture thereof. For the 4-bisu element, inorganic salts, sugars, water-soluble gums, resins, or 5 or more kinds thereof may be used. The micro-element is made of polyethylene glycol, pectin, polyvinylpyrrolidone, polyethylene glycol, polyurethane, or a combination thereof. The two-U element has an average diameter of about 80 microns. The micro-elements are uniformly distributed on the polymer matrix according to a high-shear mixing method, so that they can form uniformly-shaped cells. Referring to Fig. 3, the cells formed by using these 10 microelements will be illustrated. Then, the pad having the push cells formed in the manner mentioned above is cut into pieces each having a desired thickness to obtain a polishing pad. In each slice, the cells randomly distributed in the pad are open at the cut surface of the slice, so that the daggers will show the shape of a circular or oval cross section at the cut surface of the slice. The size and position of the cross sections of the cells exposed at the polishing surface of each polishing pad 15 are random. Such an irregular size and location of the exposed cell cross-section may deteriorate the required uniformity in the polishing pads. According to the chemical method, wherein the cells are formed using a foaming method, the polymer matrix is formed by mixing a curing agent and a liquid-phase polyamine to form a substance. Water and a liquefied gas having a low boiling point and directly participating in a chemical reaction to generate a gas can also be used as a blowing agent, thereby generating air bubbles to form cells in the polymer matrix. The generation of these bubbles is achieved through the nucleation method caused by the aggressive mixing operation. As a surfactant for reducing the surface tension, it can also be used to adjust the size of these microbubbles. 200402782 发明, description of the invention ′ Thus, the required microbubble uniformity is obtained. Figure 4 is a photograph showing the cells formed using this method. However, there is a problem with the microcells formed according to the foaming method. The microcells are too large to be coated on the chemical mechanical polishing pad. The cells have an uneven distribution, and the method can adjust Size and distribution. The microcells are formed using a microelement each having a cavity or a foaming method having a spherical structure with a circular or oval cross-sectional shape. Due to such a shape, the cells have a cross section that changes in the thickness direction of the polishing pad. For this reason, during the polishing process, the cross-section of each microbubble exposed on the polishing surface of the polishing pad was changed as the polishing pad was worn. In other words, when the polishing process is performed, the diameter of the circular or oval microbubbles exposed on the polishing surface of the polishing pad will gradually decrease and eventually disappear. Finally, cells that are not exposed under the surface of the polishing pad should be re-exposed on the polishing surface of the polishing pad. 15 Therefore, the cross section of each cell exposed on the polishing surface of the polishing pad changes in thickness during the polishing process. For this reason, there is a problem that the polishing rate is not the same. In order to form perforations or grooves on the polishing surface of the polishing pad, a machining method using a cutting or grinding process has been used. Referring to Fig. 5a, a cutting machine 70 for forming a groove is illustrated. When a polishing pad is machined using a cutter die of a cutting machine 70 mounted on a lathe, a concentric groove is formed on the upper surface of the polishing pad, as shown in Fig. 5b. Fig. 5c is a cross-sectional view taken along line κ of Fig. 5b. Refer to Figures 5b and 5c for an example of the grooves formed using the cutting machine. 20 200402782 玖, description of the invention is indicated by the number scale 7 5. It is illustrated in U.S. Patent No. 5,894,769. In Fig. 5c, embodiments of the grooves of concentric circles are disclosed in the figure. Tea Test Figure 6a 'shows a horizontal grinding machine. The cutting ㈣ 5 spacers 83 are installed in it. The cut ore skin structure moves in the X-axis direction. The polishing pad to be machined is moved in the axis direction. According to these movements, grooves extending in the first direction are formed on the upper surface of the polishing pad 10. After the grooves 85 are formed, the light beam 10 is rotated 90 °. . In this case, when the polishing pad is moved 10 in the Y-axis direction, a groove extending in a second direction perpendicular to the first direction will be formed. Therefore, grooves arranged in a grid pattern are formed on the polished surface, as shown in FIGS. 6b and 6c. Referring to Fig. 7a, a perforation inspection as a formation of a perforation in a polishing pad will be illustrated. When using the 15 perforation bolts to perform a drilling operation under the condition that the polishing pad is moved in the y-axis direction, perforations will be formed on the polishing surface of the polishing pad, as shown in FIG. 7b. Examples of such perforations are disclosed in U.S. Patent No. 58533 17. Because the conventional methods used to form the perforations or grooves in the polishing pad are cutting procedures by a lathe or grinding, the grooves have a fixed pattern such as concentric circles or grids. For this reason, it is difficult to form a groove pattern which can effectively control the flow of the slurry. According to a method of forming a perforation using a perforation pin, the perforations have a fixed shape. When the bolts are simply moved in the X or y direction, the holes will also be formed. For this reason, the perforations have a simple and fixed pattern. Therefore, 10 200402782 的, description of the invention It is difficult to obtain the effective hole pattern required in the CMP sequence. In the use of mechanical mechanics and materials, during the processing period in Kisie;; = and the light with grooves or perforations ^ ^ 'The debris formed during the month may remain in these grooves or back holes. During the CMP process, the debris may form scratches on the polished surface. * At the same time, U.S. Patent Nos. 5,001,641 and 5,758,362 respectively disclose methods for forming war grooves by irradiating a laser beam. According to these methods, a viscous mask is used to eliminate the traces of steam that have accumulated on the polishing pad. ίο 15 But ‘these methods are complicated’ because the mask should be bonded to the polishing pad. In addition, there is a problem that the sticky mask cannot be allowed to adhere to the basin. That is, after the shirt is divided by the light µ, the contact d of the material can also be left on the shirt by the heat of the mechanical operation of the beam. For this reason, it requires additional use-a method to remove this residual adhesive. When the pure photoresist is seasoned, bubbles may form between the photoresist and the adhesive layer of the adhesive photomask. In this case, 'when a laser beam is irradiated on the bubbles', it is impossible to form a groove having a size equal to the groove size of the design. t Akimi] Summary of the Invention 20 The present invention has been completed in order to solve the problem of forming microbubbles by using micro-elements each having a cavity or a foaming method, and forming grooves or perforations using a mechanical method. The present invention has a method capable of easily forming micro holes, grooves and / or perforations with effective and dispersed patterns on a polishing pad. 200402782 发明, description of the invention In order to eliminate the disadvantages of using conventional micro-elements or foaming methods that each have a cavity, that is, the result is that the cell size and The distribution of uneven sentence, the purpose of the present invention is to provide-a kind of micro holes with the same function as the cells, 5 have both-controlled uniform hook distribution and controlled average sentence size Another object of the invention is to eliminate the disadvantages of including traditional mechanical methods, that is, due to the fixed shape or pattern of the grooves or perforations, it is not suitable to control the flow of the cymbals, and provides a kind of during the polishing process 10. A method for forming a plurality of different shapes, sizes, and patterns to effectively control the polymer flow. Another object of the present invention is to provide a method for forming grooves, which can not only eliminate the use of any kind of sticky mask, thereby including using a sticky mask with the laser beam In this case, the complexity of the entire manufacturing process and the need for additional adhesive removal procedures will be eliminated. When using a variety of different polishing pads, the accuracy of the groove formation can also be improved. In order to achieve these goals in 7C, according to the principle of laser machining and a photomask, the present invention provides a method for forming micro holes, grooves and / or perforations with 20 different patterns desired by a user on a polishing pad. . According to an embodiment of the present invention, a method for manufacturing a polishing pad includes the steps of: determining a pattern of micro holes, grooves, and / or perforations to be formed on a polishing pad; and inputting the determined pattern into a computer. Control (CNC) controller; choose a photomask with a pattern of microholes, grooves 12 200402782 玖, description of the invention, and / or perforations corresponding to the input pattern; and when in the CNC according to the pattern of the turn-in • The controller can control the polished cymbals of the sub-floor to drive a laser device suitable for emitting a laser beam and a work suitable for three-dimensional movement and rotation, so that the laser device emits the laser beam to " 5 polishing pads supported by the side table so as to have micro holes, grooves, and / or perforations having a pattern corresponding to the pattern of the identified map Xingxi m & tea, are formed on the polishing pad. Schematic description The figure is a diagram illustrating the configuration of a typical chemical mechanical polishing machine and the polishing method using the chemical mechanical polishing machine. Figure 2 is a schematic diagram illustrating the concept of a chemical mechanical polishing. Figure 3 is based on the traditional method. Photo of cells formed using micro-elements each having a cavity; Figure 4 is a photo of cells formed using a conventional foaming method; Figure 5a is a schematic diagram illustrating a conventional cutting machine for forming grooves ·, Fig. 15 is an illustration—a polishing pad having a concentric groove formed using the conventional cutting machine; Fig. 5c is a cross-sectional view taken along line AA of Fig. 5b; 20 is a schematic illustration of a polishing pad containing a groove with a grid pattern formed by a conventional horizontal grinding machine equipped with a conventional cutting saw and a compartmentalizer; FIG. 6b is a view showing the conventional horizontal grinding by FIG. 6a A schematic diagram of a polishing pad with a grid-shaped groove formed mechanically; Figure 6g illustrates a cross-sectional view of a grid-shaped groove formed by a conventional horizontal grinding machine; 13 200402782 玖 、 发7a is a perspective view illustrating a conventional perforation inspection suitable for forming a perforation on a polishing pad, and FIG. 7b is a plan view illustrating a polishing pad including a perforation formed by the conventional perforation bolt shown in FIG. Fig. 7C is a cross-sectional view illustrating a polishing pad having a perforation formed using a conventional perforation bolt; Fig. 8a is a schematic view illustrating a laser system used in a machining method according to the present invention; Fig. 8 Figure b is a schematic diagram illustrating the conditions under which the laser beam is irradiated on the photomask used in the mechanical processing method according to the present invention; Figure 9a is a diagram showing the micro-holes formed when only the laser beam is used Photograph of the plan view structure; FIG. 9b shows the polishing of the 15 micropores formed in the case where a laser beam is used to form a mask with most circular patterns according to the preferred embodiment of the present invention Photo of the plan view structure of the pad; FIG. 9c shows the level of a polishing pad with microholes formed in a case where a laser beam is used to form a photomask with a pentagonal pattern according to a preferred embodiment of the present invention. Photograph of the structure of the top view; FIG. 10 is a schematic view illustrating a polishing pad having micro holes formed by a laser 20 according to a preferred embodiment of the present invention; FIG. 11 is a view illustrating another polishing pad having a micro-hole formed by a method according to the present invention; FIG. 12 is a schematic diagram illustrating a polishing pad having a groove formed by a laser according to another preferred embodiment of the present invention. 14 200402782 发明 Description of the invention L Lτ Equation 4 3 Best Mode for Carrying Out the Invention Now, reference will be made to these appendices to explain the structure and function of the present invention in detail. 5 10 15 The present invention uses a laser beam to process the original and Jinglifang; the formation of micro holes, grooves and / or perforations on the polishing pad. The laser machine, wy 丄, has the property of reducing the area subjected to thermal deformation in the layer. The laser machining is also non-contact
式進订戶斤以，又有工具磨耗。該雷射機械加工也能夠精準 地加工有複雜形狀的物件、消除雜音與震動的產生並且维 持一清潔的工作環境。當雷料束照射在拋光塾的拋光表 面上時’它㈣地增加該拋光墊的表面溫度。結果，該抛 光墊的材料在被該雷射光束照射的拋光墊上之表面區域會 被溶解及蒸發。當該拋光塾的材料由上面說明的型式在被 雷射照射的區域被移除時，微孔、凹槽及/或齒孔的機械 加工即被完成。Entering subscribers weighs, and there are tools to wear. The laser machining can also accurately process objects with complex shapes, eliminate noise and vibration, and maintain a clean working environment. When the mine beam is irradiated on the polishing surface of the polishing pad, it rapidly increases the surface temperature of the polishing pad. As a result, the surface area of the polishing pad material on the polishing pad illuminated by the laser beam will be dissolved and evaporated. When the material of the polishing pad is removed from the area illuminated by the laser from the pattern described above, the machining of the micro-holes, grooves and / or perforations is completed.
參考第8a圖，其說明被使用於進行依據本發發明之雷 射機械加工方法的雷射機械加工系統。如第8a圖所示，該 雷射加工系統包含用於照射一雷射光束的雷射裝置1〇〇、 光罩101、用於進行旋轉運動以3維運動的工作台1〇4和用 20於控制該雷射裝置100與該工作台104之電腦數位控制 (CNC)控制器1 〇2。該將被拋光的拋光墊是安裝在該工作台 104上 〇 知作貝可以自由地決定將被形成在該抛光塾上的微孔 凹槽及/或齒孔的圖案，那就是，那些微孔、凹槽及/或 15 200402782 玖、發明說明 齒孔的大小、深度與空間。 下面僅就微孔的形成做說明。當然 凹槽或齒孔的形 成可以使用類適於微孔的形成方式進行。 5 #作員可以由各種形狀’諸如圓形、橢圓形、三角形 與矩形或正方形之各種形狀選擇所需要之微孔形狀。該操 作員也可以自由地決定該些微孔的直徑、寬度或深度。該 些微孔對於該拋光表面的傾斜度以及該些微孔的配置也可 以由該操作員決定。 10 15 20 由該操作員決定之微孔的圖帛被輸入該C N C控制器 102中。·該圖案輸入可以使用掃晦方法、電腦輔助設計 (CAD)或其他方法完成。該CNC控制器1()2會韻該輸人的 圖案，並且控制該雷射裝置100與該工作台1〇4。由該操作 員決定的該微孔圖案被直接設計在光罩㈣h舉例來說 ，所需要的圖案可以依據光微影技術，而被形成在由玻璃 基材與電鍍在該玻璃基材上的鉻層組成之光罩上。另外， 雷射遮蔽材料薄膜可以依據切割方法而被圖案化。根據此 -結構’彳以達到雷射光束之選擇性穿透，如第肋圖所示 。因此雷射光束被照射在該塾之表面的選擇部分，以形成 -需要的圖案。在使用此一光罩處，可能會形成難以用 CNC形成的微圖案。因此，在該cnc與該光罩結合使用處 ，其可能形成難以由傳統機械加工方法形成的圖案。舉例 來說’雖然傳土使用的雷射機械加工方法被限制於圓點或 連續線的生成，依據本發明其可能會生成矩形或五角形的 點。 16 200402782 邡就疋，在該CNC控制器1 〇2的控制 10 15 20 玖、發明說明 依據上面說明而設計的光罩以剛好是在該拋光墊丨〇的 上方，同時平行於該拋光墊10之型式被安裝在該雷射裝置 100的下端。 當該雷射裝置100與工作台104在該CNC控制器1 〇2的 5 控制之下被驅動時’雷射光束照射通過安裝在該工作台 104上的光罩1 〇 1上，藉此在該拋光墊上形成具有相當於被 輸入該CNC控制器102的圖案之圖案的微孔。 置100會在該拋光墊10上形成具有一形狀、大小與空間分 別相當於那些輸入至該CNC控制器102的圖案之微孔。每 一微孔的形狀，諸如圓形、正方形或五角形可以藉由調整 聚焦在該拋光墊10上的雷射點形狀而被決定。將被形成在 該拋光墊10上的每一微孔的直徑或寬度可以藉由調整該雷 射光點的大小而被控制。舉例來說，當該雷射點的大小被 调整至1G至15G微米時’具有⑴⑻微米之直徑的微恐可 以被形成。每—微孔的長度與在該雷射光束行進方向中彼 郇配置的U孔之間的空間也可以藉由控制該雷射光束 的連續/間歇照射期間而被調整。每—微孔的深度可以藉 由控制該雷射光束的能量而被調整。 έ同時，該拋光塾10安裝其上的該工作台HM可以在三 向上移動那就是Χ、*轴方向移動，同時對於R軸做 万疋轉。根據該輸入的料 从孔圖木，在該CNC控制器102的控 及兮下’依據該工作台104沿著該〜和z轴的三維運動以 «λ工作台1 的旋轉戶斤雲 斤而要的倣孔圖案可以藉由雷射光 17 200402782 玖、發明說明 束的照射而形成在該拋光墊10上。該些微孔對於該抛光表 面可以具有想要的角丨。該些微孔的密度與配置也可以藉 由&制省工作台丨04的移動與旋轉速度而被調整。 因此，具有由各種圖案選出之所需要的圖案的微孔可 5以依據對於雷射裝置1〇〇的控帝】、對於該光罩⑻的控制與 對於。玄工作台104的控制之結合而被形成在該抛光塾上。 5亥凹槽或齒孔的形成是使用與該些微孔形成所用的相同方 法。此些微孔、凹槽及/或齒孔可以被選擇性地形成在該 拋光塾1G上。另外，它們可以形成組合圖案型式。在後者 10的情况中，該些微孔、凹槽及/或齒孔可能是循序地或同 時地被形成。 X光罩101 —般可以藉由在一透明的玻璃基材上形成 I。層並且依據光微影方法圖案化該鉻層而被製造。該光 罩101可以由塑膠、金屬、聚合物或紙做成。 15 第扑與9(：圖分別顯示依據本發明的方法形成之微孔的 照片。 第9c圖的微孔是藉由在5至1〇瓦特能量下震盪具有Η? 至8示氷波長的雷射光束，並且選擇性地照射該震盪的 曰射光束’同時允許該雷射光束通過該光罩的圖案而形成 2〇 。在此日^，該些微孔的深度是藉由將該雷射光束照射時間 控制在0.1至10秒，同時在相同的位置重複該雷射光束照 射而被4工制。那界是，該雷射光束照射的控制不僅是依照 該照射時間，也根據照射的次數來完成。 如第9a、9b和9c圖所示，依據本發明而形成的該些微 18 734 200402782 玖、發明說明 ίο 15 20 孔具有一致的直徑與均勻的分佈，同時具有平滑的表面。 該些微孔也可以被形成具有準確的以及各種不同的圖案。 不過，只使用雷射光束照射形成的該些傳統微孔如可能具 有粗糙的表面，因為每一個微孔9&的表面由於接近該被形 成的微孔處之區域的雷射光束照射熱量而被熔融。依據傳 統的方法；，使用每一個都具有空腔的微元件或一發泡方法 形成第3與4圖之微胞，具有分均勻的分不與不均勻的大小 。基於這個理由，當胎拋光程序進行時，該些暴露的該些 微胞會具有不均句的截面。本發明之該些微孔具有與傳統 的微包相同之功能，其中它們可以供應研磨的粒子同時可 以收集該研磨處理期間產生的碎屑，同時當該抛光塾被在 調理時回排出收㈣碎4。除此之外，本發㈣該些微孔 具有均勻·的分佈並且有均句的大小。因此，本發明的微孔 具有比該傳統的微包更好之非常優異的效果。依據本發明 ’如果需[該微孔的分佈、密度與大小可以被自由地決 定。該光罩被簡單地安裝在該雷射裝置的夏端兒沒有被接 合在依據本發明之該拋光塾上。因此，整個方法是簡單的 。它也可能不需要使用任一額外的處理，舉例來說，黏著 劑去除程序。除此之外’本發明的方法有—優點是其也可 以應用在任—種絲性的光罩不能被使用的情況中。 第3圖中顯示的照片之右下部分的對角傾斜區域使用 傳統齒孔检而形成在該拋光塾上的一齒孔。如第3圖所示 ’該齒孔具有因為碎屑造成並保持在該齒孔中的粗糙表面 。在該化學機械研磨處理期間，此些碎屑-可能在將被拋光 -Γ…广 19 200402782 玖、發明說明 的^面形成刮痕。不過，依據本發明而形成的齒孔或凹槽 :曰產生此一問題，因為藉由雷射機械加工處理，該齒孔 或凹槽具有平滑的表面。依據本發明，如果需$，具有各 種不同圖案的齒孔或凹槽可以被自由地形成。 、第10、U和⑽分別是說明依據本發明而形成之微孔 、齒孔或·凹槽的實施例之示意圖。 第_是說明-抛光塾的示意圖。在其上有依據本發 明而形成的微孔配置。第10圖中顯示該些微孔在不同的抛 ίο 15 2塾半徑區域具有不同的密度。在每—半徑區域中，該些 微孔具有均勻的密度與均勻的大小。 第η圖是說明一拋光塾的示意圖，在其上有依據本發 明而形成的齒孔配置。第12圖是說明一拋光塾的示意圖， 在其上有依據本發明而形成的凹槽配置。在第1!或12圖中 說明的情財，職械加工處理是藉由在χ々γ•方向移動 該工作台同時選轉該工作台來進行。雖然依據傳統的機械 加工方法只能夠形成-固定的圖案’如第5b、6b_圖所 示’依據本發明使用一 CNC控制器、雷射光束與光罩可以 自由地形成沒有固定、各種不同的微孔、齒孔或凹槽的圖 案0 2〇 ㈣本發明，該拋—可以具有各種不關案的微孔 、齒孔或凹槽，而不僅限於㈣、11或12圖中說明的圖荦 。該拋光墊也可以具有微孔、齒孔或凹槽圖案之組合的圖 案/。舉例來說，該抛光墊可具有微孔與齒孔、微孔與凹槽 或微孔、齒孔和凹槽之組合圖案。 20 200402782 玖、發明說明 工業的應.用性 由上面的說明顯見，本發明提供一種能夠藉由雷射光 束與光罩而輕易地形成微孔、齒孔及/或凹槽的方法。當 與具有不均勾的微胞之傳統的拋光墊相比，依據本發明， 5具有均勻分佈與均勻大小的微孔可以藉由雷射光束形成在 拋光墊上，藉此可以最大化該拋光墊的拋光效率。本發明 也提供在機械加工效率上，以及在生產成本降低上可以產 生提升的效果。依據本發明，具有準確的以及各種不同的 圖案之齒孔與凹槽可以被形成。因此，它可能有效地控制 10 在該拋光墊上之漿液的流動。 依據本發明，所需要之具有各種不同形狀、大小與深 度之微孔、齒孔及凹槽的圖案以及其之組合，可以藉由雷 射光束與光罩在短時間根據給定的拋光條件而被形成在拋 光墊上。因此，它能夠達成製造效率提升與製造成本降 15 。 ~ 雖然關於用在製造形成具有微孔、齒孔及/或凹措之 拋光墊的方法的說明目的之本發明之該些較佳實施例已經 被揭不，那些熟悉該技藝者將會領會到在不偏離於伴隨的 申凊專利範圍中揭示知本發明的範圍與精神下，可能進行 20各種不同的修正、附加與替代。 【圖式簡單說明】 第1圖是說明一典型的化學機械研磨機械之構形與使 用該化學機械研磨機械進行拋光方法之示意圖； 第2圖是說明一種化學機械研磨之概念的示意圖； 21 玖、發明說明 q疋m骤傳統方法使用 件而形成之微胞的照片； 個都有—空腔的微. 第第:圖是使用傳統發泡方法形成的微胞的照片； 第二"明用於形成凹槽之傳統切割機的示意圖; 圓开η… 有使用該傳統的切割機形成同 w形式的凹槽之拋光墊； 乂 以c圖是沿著第5b圖之α_α線的載面圖示； 弟6 a圖是說明藉由安裝傳統切龜與間格器之傳統自 10 水平研磨機械，而形成含有具格柵圖案之凹槽的抛光心 不意說明圖； 第6bS)是說明藉由第6aB]之傳統的水平研磨機械形成 之一具有格栅型式的凹槽之拋光塾示意圖； 第以圖說明藉由傳統的水平研磨機械形成的一種格拇 形狀凹槽的截面圖示； 15 第7a圖是說明適合在一拋光墊上形成齒孔之傳統齒孔 栓的透視圖； 第7b圖是說明一含有藉由第7a圖的傳統齒孔栓而形成 齒孔之拋光墊的平面圖示； 第7c圖是說明具有利用傳統的齒孔栓形成之齒孔的拋 20 光墊之戴面圖示； 第8a圖是說明使用在依據本發明之機械加工方法的雷 射系統之示意圖； 第8b圖是說明將雷射光束照射在依據本發明之機械加 工方法t使用的光罩上的條件之示意圖； 22 200402782 玖、發明說明 第9a圖是顯示在只使 田射先束的情況中所形成之微 孔的平面圖結構之照片； 试 ㈣圖是顯示具有以雷射光束穿透利用依據本發明之 較佳實施例形成帶有多數圓形圖案之光罩的情況中，所形 成之微孔的拋光墊之平面圖結構的照片； 」9c圖是顯示具有以雷射光束穿透利用依據本發明之 較佳貫施例形成帶有五角形圖案之光罩的情況中，所形成 之微孔的拋光墊之平面圖結構的照片； 10 15 第ίο圖是說明具有藉由依據本發明之較佳實施例的雷 射形成之微孔的拋光塾的示意圖； 第U圖是說明具有藉由依據本發明之另一較佳實施例 的雷射形成之齒孔的拋光墊的示意圖； 第12圖是說明具有藉由依據本發明之另一較佳實施例 的雷射形成之凹槽的拋光墊的示意圖。 圖式之主要元件代表符號表】 1…化學機械研磨機械 10…抛光塾 20…平臺 3 0…晶圓 32···護圈環 40.. .漿液供應工具 42…漿液 70·.·切割器 75.. .凹槽· 81…水平研磨的機械 82·.·切割器 83…間隔器 85...凹槽 1〇〇···雷射裝置 101…光罩 102…電腦數位控制控制器 104.··工作台 23Referring to Fig. 8a, there is illustrated a laser machining system used to perform the laser machining method according to the present invention. As shown in Fig. 8a, the laser processing system includes a laser device 100 for irradiating a laser beam, a reticle 101, a table 104 for performing a rotary motion in a three-dimensional motion, and A computer digital control (CNC) controller 102 for controlling the laser device 100 and the workbench 104. The polishing pad to be polished is mounted on the table 104. It is free to determine the pattern of the micro-hole grooves and / or perforations to be formed on the polishing pad, that is, those micro-holes , Groove and / or 15 200402782 玖, the invention describes the size, depth and space of the perforations. Only the formation of micropores will be described below. Of course, the formation of grooves or perforations can be performed using a method suitable for the formation of micropores. 5 # 作 员 can choose the desired microporous shape from various shapes, such as circular, oval, triangular and rectangular or square shapes. The operator is also free to determine the diameter, width, or depth of the microwells. The inclination of the micropores to the polished surface and the configuration of the micropores can also be determined by the operator. 10 15 20 A picture of a microwell determined by the operator is input into the CN controller 102. The pattern input can be done using the obscure method, computer-aided design (CAD), or other methods. The CNC controller 1 () 2 rhymes the input pattern and controls the laser device 100 and the workbench 104. The microhole pattern determined by the operator is directly designed on the photomask. For example, the required pattern can be formed on a glass substrate and chromium plated on the glass substrate according to the photolithography technology. Layer consisting of a mask. In addition, the laser shielding material film may be patterned according to a cutting method. According to this-structure ', the selective penetration of the laser beam is achieved, as shown in the first rib. Therefore, a laser beam is irradiated to a selected portion of the surface of the grate to form a desired pattern. Where such a mask is used, micropatterns that are difficult to form with a CNC may be formed. Therefore, where the cnc is used in combination with the photomask, it may form a pattern that is difficult to form by conventional machining methods. For example, 'Although the laser machining method used for soil transfer is limited to the generation of dots or continuous lines, it may generate rectangular or pentagonal points according to the present invention. 16 200402782 邡 On the control of the CNC controller 1 〇 10 15 20 玖, description of the invention The photomask designed according to the above description is just above the polishing pad 丨 〇, and is parallel to the polishing pad 10 The type is mounted on the lower end of the laser device 100. When the laser device 100 and the workbench 104 are driven under the control of the CNC controller 102, the 'laser beam is irradiated through the photomask 1001 mounted on the workbench 104, thereby The polishing pad is formed with micro holes having a pattern corresponding to a pattern input to the CNC controller 102. The device 100 will form micro holes in the polishing pad 10 having a shape, size, and space corresponding to those of the patterns input to the CNC controller 102, respectively. The shape of each microhole, such as a circle, a square, or a pentagon, can be determined by adjusting the shape of the laser spot focused on the polishing pad 10. The diameter or width of each microhole to be formed on the polishing pad 10 can be controlled by adjusting the size of the laser light spot. For example, when the size of the laser spot is adjusted to 1G to 15G micrometers, a micrometer with a diameter of ⑴⑻ micrometers may be formed. The space between the length of each micro-hole and the U-holes arranged in the laser beam traveling direction can also be adjusted by controlling the continuous / intermittent irradiation period of the laser beam. The depth of each micro-hole can be adjusted by controlling the energy of the laser beam. At the same time, the polishing table 10 on which the polishing table 10 is mounted can be moved in three directions, that is, in the directions of the X and * axes, and at the same time, it can be rotated for the R axis. According to the input material from the hole figure, under the control of the CNC controller 102, according to the three-dimensional movement of the table 104 along the ~ and z axes, the rotation of the «λ table 1 A desired imitation hole pattern can be formed on the polishing pad 10 by the irradiation of laser light 17 200402782 玖, invention description beam. The micro holes may have a desired angle to the polished surface. The density and arrangement of these micro-holes can also be adjusted by the movement and rotation speed of the & manufacturing workbench 04. Therefore, the microholes having a desired pattern selected from various patterns can be based on the control of the laser device 100], the control of the photomask 对于, and the control. The combination of the control of the stern table 104 is formed on the polishing pad. The grooves or perforations are formed using the same method used for the formation of these micropores. Such micro-holes, grooves and / or perforations may be selectively formed on the polishing pad 1G. In addition, they can form a combination pattern. In the latter case, the micro-holes, grooves and / or perforations may be formed sequentially or simultaneously. The X-ray mask 101 can generally be formed by forming I on a transparent glass substrate. Layer and was fabricated by patterning the chromium layer according to a photolithography method. The mask 101 may be made of plastic, metal, polymer, or paper. 15th flutter and 9th: pictures showing micropores formed in accordance with the method of the present invention. The micropores in Figure 9c are obtained by oscillating thunder with a wavelength of Η? To 8 indicating ice at an energy of 5 to 10 watts. The laser beam and selectively irradiate the oscillating laser beam, while allowing the laser beam to pass through the pattern of the mask to form 20. On this date ^, the depth of the micro-holes is achieved by the laser The beam irradiation time is controlled from 0.1 to 10 seconds, and at the same time, the laser beam irradiation is repeated at the same position and is controlled by the 4th system. The limit is that the laser beam irradiation control is not only based on the irradiation time, but also based on the number of irradiations. As shown in Figures 9a, 9b, and 9c, the micro-holes 18 734 200402782 formed according to the present invention, the description of the invention 1520 holes have a uniform diameter and a uniform distribution, while having a smooth surface. These The micropores can also be formed with accurate and various patterns. However, the conventional micropores formed using only laser beam irradiation may have a rough surface, because the surface of each micropore 9 & The laser beam in the area of the formed micropores is irradiated with heat and melted. According to the conventional method, microcells each having a cavity or a foaming method are used to form the cells of Figs. 3 and 4, which have It is divided into non-uniform and non-uniform sizes. For this reason, when the tire polishing process is performed, the exposed microcells will have an uneven cross section. The micropores of the present invention have the same characteristics as the traditional micropackages. The same function, in which they can supply the abrasive particles while collecting the debris generated during the grinding process, and at the same time when the polishing pad is conditioned, it is discharged and collected. 4 The pores have a uniform distribution and a uniform sentence size. Therefore, the micropores of the present invention have a much better effect than the traditional micropackets. According to the present invention, 'if the distribution, density and The size can be determined freely. The photomask is simply mounted on the Xia Duan of the laser device without being bonded to the polishing pad according to the present invention. Therefore, the entire method is simple. It can also be There is no need to use any additional processing, for example, an adhesive removal procedure. In addition, the method of the present invention has—the advantage is that it can also be applied in situations where any kind of silky photomask cannot be used. The diagonally inclined area in the lower right part of the photo shown in Fig. 3 is a perforation formed on the polishing pad using a conventional perforation test. As shown in Fig. 3, the perforation has been caused by debris and remains Rough surface in the perforations. During the chemical mechanical grinding process, these debris-may be scratched on the surface to be polished-Γ 广 19 200402782 发明, invention description. However, according to the present invention, Perforations or grooves formed: This problem arises because the perforations or grooves have a smooth surface by laser machining. According to the present invention, if a perforation with various patterns is required, The groove can be formed freely. 10th, 10th, U, and ⑽ are schematic diagrams illustrating embodiments of micropores, perforations, or grooves formed according to the present invention, respectively. Number _ is a schematic diagram of the description-polishing cymbal. There is a microhole arrangement formed thereon according to the present invention. Figure 10 shows that the micropores have different densities in different regions of 15 ° radius. In each radius area, the micropores have a uniform density and a uniform size. Fig. N is a schematic diagram illustrating a polishing pad with a perforation arrangement formed thereon according to the present invention. Fig. 12 is a schematic diagram illustrating a polishing pad with a groove configuration formed thereon according to the present invention. In the case of the wealth shown in Figure 1 or Figure 12, the processing of vocational machinery is performed by moving the table in the direction of χ々γ • and selecting the table at the same time. Although according to the traditional machining method, only fixed patterns can be formed-as shown in Figures 5b and 6b. According to the present invention, using a CNC controller, the laser beam and the photomask can be freely formed without fixed, various Patterns of micro-holes, perforations or grooves. According to the present invention, the polishing can have various non-relevant micro-holes, perforations or grooves, and is not limited to those illustrated in Figures 11 and 12 . The polishing pad may also have a pattern of micro holes, perforations or groove patterns. For example, the polishing pad may have a combination of micropores and perforations, micropores and recesses, or a combination of micropores, perforations and recesses. 20 200402782 发明, description of the invention, industrial applicability As apparent from the above description, the present invention provides a method capable of easily forming micro holes, perforations and / or grooves by using a laser beam and a photomask. According to the present invention, when compared with a conventional polishing pad having unevenly distributed cells, 5 micro holes with uniform distribution and uniform size can be formed on the polishing pad by a laser beam, thereby maximizing the polishing pad. Polishing efficiency. The present invention also provides an improvement effect in terms of machining efficiency and reduction in production cost. According to the present invention, perforations and grooves having accurate and various patterns can be formed. Therefore, it may effectively control the flow of the slurry on the polishing pad. According to the present invention, the required patterns of microholes, perforations and grooves with various shapes, sizes and depths, and combinations thereof, can be obtained by a laser beam and a mask in a short time according to a given polishing condition. Is formed on a polishing pad. As a result, it can achieve increased manufacturing efficiency and reduced manufacturing costs 15. ~ Although the preferred embodiments of the present invention have not been disclosed for illustrative purposes in a method for manufacturing a polishing pad having micropores, perforations and / or recesses, those skilled in the art will appreciate Without deviating from the scope of the accompanying patent application, the scope and spirit of the present invention are disclosed, and 20 different amendments, additions and substitutions are possible. [Schematic description] Figure 1 is a schematic diagram illustrating the configuration of a typical chemical mechanical polishing machine and a polishing method using the chemical mechanical polishing machine; Figure 2 is a schematic diagram illustrating the concept of a chemical mechanical polishing; 21 玖、 Explanation of the invention Photographs of microcells formed by using the traditional method of q 疋 m step; all have—cavity micrographs. No .: The picture is a photo of microcells formed using the traditional foaming method; the second " ming Schematic diagram of a conventional cutting machine for forming grooves; circle opening η ... There are polishing pads that use the traditional cutting machine to form grooves of the same w form; 图 C is a loading surface along the line α_α in Figure 5b Figure; Figure 6a is a diagram explaining the polishing intention of forming a groove with a grid pattern by installing a traditional self-leveling 10-level grinding machine with a traditional cutting turtle and a grid divider; Section 6bS) is an illustration borrowing A schematic diagram of a polishing pad with a grid-shaped groove formed by the conventional horizontal grinding machine of Section 6aB]; The figure illustrates a cross-sectional diagram of a groove in the shape of a thumb formed by the conventional horizontal grinding machine; 15 Section 7a A perspective view illustrating a conventional perforation bolt suitable for forming a perforation on a polishing pad; FIG. 7b is a plan view illustrating a polishing pad including a perforation formed by the conventional perforation plug of FIG. 7a; FIG. 7c Figure 8 is a diagram illustrating a wearing surface of a polishing 20 light pad having a perforation formed by a conventional perforation bolt; Fig. 8a is a schematic diagram illustrating a laser system used in a machining method according to the present invention; Fig. 8b is Schematic diagram illustrating the conditions for irradiating a laser beam on a photomask used in the machining method t according to the present invention; 22 200402782 玖, description of the invention Fig. 9a shows the micro-formation formed when only the field beam is used first Photo of the plan view structure of the hole; The test chart shows a polishing pad with microholes formed in the case where a laser beam is used to form a mask with most circular patterns according to the preferred embodiment of the present invention Photo of the plan view structure; "Figure 9c shows a polishing pad with microholes formed in the case where a laser beam is used to form a reticle with a pentagonal pattern according to a preferred embodiment of the present invention. A photograph of the structure of a plan view; 10 15 FIG. Ο is a schematic diagram illustrating a polishing pad having micropores formed by a laser according to a preferred embodiment of the present invention; FIG. FIG. 12 is a schematic diagram illustrating a polishing pad having a perforation formed by a laser according to a preferred embodiment. FIG. 12 is a schematic diagram illustrating a polishing pad having a groove formed by a laser according to another preferred embodiment of the present invention. Schematic representation of the main components of the drawing] 1 ... Chemical mechanical grinding machine 10 ... Polishing 20 ... Plate 3 0 ... Wafer 32 ... Guard ring 40 ... Serum supply tool 42 ... Slurry 70 ... Cutter 75 ... grooves ... 81 ... horizontal grinding machine 82 ... cutters 83 ... spacers 85 ... grooves 100 ... laser device 101 ... photomask 102 ... computer digital control controller 104 .. · Workbench 23