200304893 玖、發明說明 (發明說明應敘明：發明所属之技術領域、先前技術、内容、實施方式及圖式簡尊說明） 【發明所屬技術領域】 發明領域 本發明涉及具備可裝卸在形成電子電路的基片的外面 上的吸附面，在該基片的移動中使用的真空卡盤，被利用 於半導體元件的製造工序或作爲它的應用産品的薄膜電晶 體（TFT)液晶面板的製造工序等，存在基片的操作中因靜 電引起電路元件破壞的危險的工序。200304893 (1) Description of the invention (The description of the invention shall state: the technical field, prior art, contents, embodiments, and diagrams of the invention) [Technical Field of the Invention] The present invention relates to an electronic circuit that can be attached and detached. The suction surface on the outer surface of the substrate, the vacuum chuck used in the movement of the substrate, is used in the manufacturing process of semiconductor elements or the manufacturing process of thin film transistor (TFT) liquid crystal panels as its application products. There is a risk of damage to circuit elements due to static electricity during the operation of the substrate.
C 先前 J 10 發明背景 在幵> 成電晶體電路的液晶玻璃基片等的工件的製造工 序中，工件的移動通常是由具有安裝了真空卡盤的手臂的 機益人來進行。這種真空卡盤，如特開平7-237765號公報 中所公佈的浮動型的真空卡盤那樣，對工件吸附部分的結 15構面方面提出了種種改良。另外，此類現有的真空卡盤吸 附部分的材料，一般使用比較硬的聚酰亞胺（PI)或聚醚醚 酮（PEEK)等的硬質樹脂材料。 但是，若吸附部分使用上述材料的話，工件操作時， 解除真空卡盤的吸附使其吸附部分離開工件的時候，會産 20生剝離帶電現象，在工件上會導致相當於8〇〇〜15〇〇v的電 壓的電荷帶電的問題。而且，在TFT液晶面板的製造工序 中，Ik其母體玻璃的大型化和薄板化的發展，由剝離帶電 使電晶體電路達到被破壞程度的抗靜電容限減少，靜電破 壞的危險性增大。 200304893 玖、發明說明 而且，這種帶電，即使在與玻璃接觸的接觸部分使用 電的導體的情況下，由於殘留在玻璃基片上面上的電荷， 也難於防止因感應帶電產生的剝離帶電。 【發明内容】 5 (發明要解決的課題） 本發明的課題是··解決現有技術中的上述問題，提供 一種不會由於剝離帶電而引起電路破壞的真空卡盤。 (解決課題的手段） 本發明疋爲瞭解決上述課題，根據本發明1的發明， 10其特徵在於：在具備可裝卸在形成電子電路的基片的外面 上的吸附面，使用於該基片的移動之真空卡盤中，吸附面 的材料疋與基片表面的材料相同的材料或者在帶電等級方 面具有與基片材料的等級近似的的任何一種材料。 圖式簡單說明 15 第1圖是表示適用於本發明的真空卡盤的實施例的剖 面圖，（a)及（b)分別表示了全體和部分。 第2圖表示了裝配有上述真空卡盤的機械手的一種實 施例，（a)是平面圖，（b)是（a)的沿b— b線的剖面圖。 第3(a)到（d)圖是表示用裝配了上述真空卡盤的機械手 20 移動工件時的狀態的說明圖。 I：實施方式3 較佳實施例之詳細說明 第1圖是表示適用於本發明的真空卡盤的實施例，第2 圖是表示安裝了此真空卡盤的工件操作用的機械手的一部 200304893 玖、發明說明 分的實施例。 真空卡盤1具備可裝卸在作爲工料的外面、通常是 背面Wb上的吸附面2,使用於工件_移動中，工件” 作爲形成電晶體電路的基片的液晶破璃基片構成。吸附面 5 2的材料採用與作爲工#w的背面杨的材料、與工件全體 材料的玻璃相同的材料玻璃，或者採用在帶電等級方面具 有與玻璃的等級接近的等級的材料，例如··佔玻璃主要成 分的二氧化石夕（si〇2)或精細陶莞的一種的氮化石夕⑻n、 SbN4)等的帶電等級近似材料的任何一種材料。 10 這種真空卡盤1，作爲一般的構造部分，由以下幾部 分構成··襯墊3，其上端的一部分上形成吸附面2，外側是 部分球面，中間具有空隙部分；此空隙部分内部，保持槪 墊3可活動狀態的，同時也設計了形成真空空間4的帶有法 蘭盤的環狀物5 ;爲安裝此環狀物的螺釘6 ;以及爲在襯墊 15 3、固定球面支援螺釘ό ,同時形成真空空間4的圓形的中 間板7 ;通常由螺釘102安裝在機械手1〇〇的兩隻手臂ι〇ι上。 本例中的機械手1 〇〇是這樣構成的··通過中間板7將真 空卡盤1分別安裝在2個位置上，中間形成與上述真空空間 4導通的真空通路1〇 1&的所述兩隻手臂ι〇ι ;由這些螺釘 20 103將手臂安裝，中間形成與所述真空通路1〇丨&導通的真 空中間路104a的連接板104。該機械手1〇〇是裝配在圖中沒 有顯示的機器人上，真空中間路l〇4a是與安裝在機器人上 的圖中沒有顯示的真空配管相連接。 正如第1圖中（b)所表示的，吸附面2形成在從襯墊3的 玖、發明說明 t端面31稍稍突出的頂部平面部32上。而jl，如前所述， 採用同工件W相同的破璃或者抓或随等的材料。這種 下幵夕成吸附面2的襯墊3的全體或頂部平面32雖然可 以採用這樣㈣料，本财，在頂部平面32上通過塗敷 5叫等形成吸附面2。叫特別容易塗敷而且便宜，對於 本用途是合適的材料。當工件W是石夕晶片時，在吸附面2 上塗層石夕（Si)最好。例如，爲了能得到足夠的枯附強度， 可以通過錢射等進行該塗敷。 此情況下，由於只有與工件W接觸的接觸面對工件w ίο的帶電性有影響，塗層的厚度不是問題。所以，例如幾十 ^左右的平常的塗層厚度就行了。而且，由於襯塾3的上 端面31由通常的倒角加工，形成退避到比頂部平面32更低 的位置的形狀，因而此部分完全不影響帶電性。因此，也 不需要對這部分塗敷。 5 上述真空卡盤按如下運轉，發揮其作用效果。 工件W疋用最大右方形的大玻璃基片，經過將電 晶體電路照相製版的上膠機、曝光機、熱處理裝置等中的 TFT的各種系列的工序製作液晶玻璃基片。而且，在這樣 的各工序中，由具有裝配了應用本發明的真空卡盤（的機 )械手100的機器人，在各工序内的機械裝置之間與搬送系 統之間移動工件W。 此移動如第3圖所示那樣地進行。在該圖（a)&(b)中， 將安裝了真空卡盤1的機器人的手臂1〇1***到載置在前一 工序的裝置的基片承受體200上的工件冒的下面上，如箭 200304893 玖、發明說明 頭所示上升，工件w就從基片承受體200上被舉起，放在 真空卡盤1中的襯墊3的吸附面2上，與此同時真空系統動 作，依次在真空中間路l〇4a、真空通路1〇1&、真空空間4 令形成負壓，工件W被吸附在真空卡盤丨上，可靠地保持 5 在機械手1〇〇上。 10 在該圖⑷及⑷中"及附支撐工件|的手臂1〇1由機器 人移動到搬送系統或者後一工序裝置的基片承受體3〇〇等 的上面，解除真空系統的動作，使工件貿成爲只放在吸附 面2上的狀態之後，如箭頭所示手臂1〇1下降，工件w放在 基片承受體300的上面上，離開工件w的襯墊3及手臂ι〇ι 從工件W的下面的位置離開，完成了工件的移動。 此時，如現有技術那樣、與工件冒接觸的吸附面與襯 墊3是一整體，例如，當使用如特氟隆（注冊商標）材料的時 候，因爲剝離帶電，在工件臀上殘留了具有8〇〇v〜15〇〇v 高電位的電荷。而且，當工件1接地的時候，由該電荷形 成電流，有可能破壞工件Wjl所形成的電晶體電路。特別 是TFT中其傾向更爲顯著。 對此，在應用本發明的真空卡盤4，由於吸附面2採 用與工件W的材料的玻璃相同的玻璃或者與構成玻璃的主 2〇要成分的二氧化矽或氮化矽等的帶電等級近似的材料，或 者其塗層材料，剝離帶電的電荷量是非常小的值。 右把物質的帶電等級由正到負舉例表示，是醋酸醋— 玻璃一人的毛髮—尼龍...........聚乙稀-聚氣乙稀-聚三 氟氣乙婦(KEL· F)-特氣隆（注冊商標）。因此，玻璃與現 200304893 玖、發明說明 有的真空卡盤用的襯墊材料特氟隆（注冊商標）的帶電等級 的等級是在正側和負側距離最大，成爲形成剝離帶電量多 的材料關係，與此相反，由於玻璃與其主要成分的二氧化 矽等的▼電等級上的等級相近，剝離帶電量極少。其結果 5 ，即使將現有的厚度爲0.7mm〜l.lmm的玻璃超薄化，成爲 厚度爲0.5mm〜0.6mm的玻璃，也能夠可靠地防止靜電破壞。 (發明的效果） 如上所述根據本發明，由於可裝卸在形成電子電路的 基片外面上的真空卡盤的吸附面的材料，採用與基片的表 1〇面材料相同的材料、或者在帶電等級方面與基片材料的等 級近似的任何一種材料，能夠充分降低當將真空卡盤裝配 在機械手等上、用於在基片的製造過程中移動基片、吸附 面從基片上分離時所産生的剝離帶電的電荷量，即使在基 片大型化的情況下，也能夠可靠地防止因在現有的平常的 15真空卡盤中發生的危險性很高的剝離帶電而造成的電子電 路的破壞。 I：圖式簡單說明2 第1圖是表示適用於本發明的真空卡盤的實施例的剖 面圖，（a)及（b)分別表示了全體和部分。 10 第2圖表示了裝配有上述真空卡盤的機械手的一種實 施例，（a)是平面圖，（b)是（a)的沿b—b線的剖面圖。 第3(a)到（d)圖是表示用裝配了上述真空卡盤的機械手 移動工件時的狀態的說明圖。 【圖式之主要元件代表符號表】 10 200304893 玖、發明說明 1···真空卡盤 2…吸附面 3…襯塾 4···真空空間 5…環狀物 6…螺釘 7…中間板 31···上端面 3 2…平面部 1(H…手臂 101a…真空通路 102…螺釘 103…螺釘 104···連接板 104a…真空中間路 200,300···基片承受體 W…工件（基片）C. Previous J 10 Background of the Invention In the manufacturing process of a workpiece such as a liquid crystal glass substrate which is a transistor circuit, the workpiece is usually moved by a robot with an arm equipped with a vacuum chuck. Such a vacuum chuck, as in the floating type vacuum chuck disclosed in Japanese Patent Application Laid-Open No. 7-237765, has proposed various improvements in terms of the facet structure of the work suction portion. In addition, as the material of the existing vacuum chuck adsorption portion, hard resin materials such as polyimide (PI) or polyetheretherketone (PEEK), which are relatively hard, are generally used. However, if the above materials are used for the suction part, when the workpiece is operated, the suction of the vacuum chuck is released and the suction part is separated from the workpiece, a peeling and charging phenomenon will occur for 20 years, which will result in an equivalent of 800 ~ 15. The problem of the charge of the voltage of 0V. Furthermore, in the manufacturing process of TFT liquid crystal panels, the size and thickness of Ik and its mother glass have been developed, and the electrostatic capacitance limit of the transistor circuit has been reduced by peeling and charging, and the risk of electrostatic damage has increased. 200304893 发明 、 Explanation of the Invention Furthermore, even in the case where an electric conductor is used in a contact portion with glass, it is difficult to prevent peeling and charging due to induced charging due to the charge remaining on the glass substrate. [Summary of the Invention] 5 (Problems to be Solved by the Invention) The problem of the present invention is to solve the above-mentioned problems in the prior art, and to provide a vacuum chuck that does not cause circuit damage due to peeling and charging. (Means for Solving the Problems) The present invention: In order to solve the above-mentioned problems, according to the invention 1 of the invention 1, 10 is characterized in that it has an adsorption surface that is detachable on an outer surface of a substrate forming an electronic circuit, and is used for the substrate. In the moving vacuum chuck, the material of the suction surface is the same as the material on the surface of the substrate or any material having a charge level similar to that of the substrate material. Brief Description of the Drawings Fig. 1 is a sectional view showing an embodiment of a vacuum chuck to which the present invention is applied. (A) and (b) show the whole and a part, respectively. Fig. 2 shows an embodiment of the robot arm equipped with the vacuum chuck, (a) is a plan view, and (b) is a cross-sectional view taken along line b-b of (a). Figures 3 (a) to (d) are explanatory views showing a state when a workpiece is moved by the robot arm 20 equipped with the vacuum chuck. I: Detailed description of the preferred embodiment of the third embodiment. Fig. 1 shows an example of a vacuum chuck applicable to the present invention, and Fig. 2 shows a part of a manipulator for operating a workpiece equipped with the vacuum chuck. 200304893 (ii) Examples of invention description. The vacuum chuck 1 is provided with a suction surface 2 which can be attached to and detached from the outside as a work material, usually on the back surface Wb, and is used in a workpiece_moving, workpiece "liquid crystal glass substrate as a substrate forming a transistor circuit. The suction surface 5 2 The material is the same as the material of the back side of the work #w, the glass of the same material as the entire material of the workpiece, or a material with a level close to that of the glass in terms of charge level, such as ... Any one of the materials with similar charging grades such as SiO2 (Si02) or Nitride (SbN4), which is a kind of fine ceramics. 10 This vacuum chuck 1 is used as a general structural part. The pad 3 is composed of the following parts: The suction surface 2 is formed on a part of the upper end, and the outer part is a spherical surface, and there is a gap in the middle. The gap part inside is to keep the pad 3 movable, and it is also designed to form A ring 5 with a flange 4 in the vacuum space 4; a screw 6 for mounting the ring; and a gasket 15 3 for fixing a spherical support screw, and a vacuum space 4 is formed at the same time The circular intermediate plate 7 is usually mounted on the two arms of the manipulator 100 by screws 102. The manipulator 100 in this example is constituted as follows. The vacuum chuck is passed through the intermediate plate 7 1 are respectively installed in 2 positions, and the two arms ιιι of the vacuum path 10 and the vacuum path 10 communicating with the vacuum space 4 are formed in the middle; the arms are installed by these screws 20 103, and the vacuum path is formed in the middle 1〇 丨 & the connecting plate 104 of the vacuum intermediate circuit 104a. The robot 100 is assembled on a robot not shown in the figure, and the vacuum intermediate circuit 104a is not shown in the figure installed on the robot. The vacuum piping is connected. As shown in FIG. 1 (b), the suction surface 2 is formed on the top flat portion 32 which slightly protrudes from the 玖 of the gasket 3, the end surface 31 of the invention description, and jl, as previously described. It is described that the same broken glass or grasping or equivalent material is used as the workpiece W. Although the whole or the top plane 32 of the pad 3 that is the adsorption surface 2 can be used, the material is on the top plane Forming an adsorption surface 2 by coating 5 on 32, etc. It is easy to apply and cheap, and it is a suitable material for this application. When the work piece W is a stone wafer, it is best to coat the stone surface (Si) on the adsorption surface 2. For example, in order to obtain a sufficient dry strength, you can This coating is performed by coin shooting, etc. In this case, since only the contact with the workpiece W is affected by the chargeability of the workpiece w, the thickness of the coating is not a problem. The thickness of the layer is sufficient. Moreover, since the upper end surface 31 of the liner 3 is formed by a normal chamfering process, the shape is retreated to a position lower than the top plane 32, so this portion does not affect the charging performance at all. Apply to this part. 5 The vacuum chuck is operated as follows to exert its effect. For the workpiece W, a large glass substrate with a largest right square is used to produce a liquid crystal glass substrate through various series of processes of a TFT in a gluing machine, an exposure machine, a heat treatment device, etc. for making a plate of a transistor circuit. In each of these steps, a robot having a robot 100 equipped with a vacuum chuck to which the present invention is applied moves a workpiece W between a mechanical device and a transport system in each step. This movement is performed as shown in FIG. 3. In this figure (a) & (b), the arm 101 of the robot in which the vacuum chuck 1 is mounted is inserted on the lower surface of the workpiece placed on the substrate receiving body 200 of the apparatus of the previous step. As shown by arrow 200304893 玖 and the invention description head, the workpiece w is lifted from the substrate support 200 and placed on the suction surface 2 of the pad 3 in the vacuum chuck 1, and at the same time the vacuum system operates In order, a negative pressure is formed in the vacuum intermediate path 104a, the vacuum passage 101, and the vacuum space 4 in order, and the workpiece W is adsorbed on the vacuum chuck, and is reliably held on the robot 100. 10 In the figures ⑷ and &" and the arm 1101 with the supporting workpiece |, the robot is moved to the conveying system or the substrate receiving body 300 of the subsequent process device, and the operation of the vacuum system is released, so that After the workpiece is placed only on the suction surface 2, the arm 101 is lowered as shown by the arrow, and the workpiece w is placed on the upper surface of the substrate support 300, leaving the pad 3 and the arm of the workpiece w. The lower position of the workpiece W is left, and the movement of the workpiece is completed. At this time, as in the prior art, the suction surface in contact with the workpiece is integral with the gasket 3. For example, when a material such as Teflon (registered trademark) is used, due to peeling and charging, 800v ~ 150,000v high-potential charge. Furthermore, when the work 1 is grounded, a current is generated by the charge, which may destroy the transistor circuit formed by the work Wjl. This tendency is particularly significant in TFTs. On the other hand, in the vacuum chuck 4 to which the present invention is applied, since the suction surface 2 is made of the same glass as the material of the workpiece W or a charge level such as silicon dioxide or silicon nitride, which is the main component of the glass, 20 The approximate material, or its coating material, has a very small amount of charged charge. On the right, the charge level of the substance is shown from positive to negative as an example. It is acetic acid vinegar-the hair of a glass man-nylon .............. Polyethylene-Polyethylene-Polytrifluoroethane KEL · F) -Teclon (registered trademark). Therefore, the charging level of glass and Teflon (registered trademark), which is the gasket material for vacuum chucks, which is the current 200304893 and the invention description, has the largest distance between the positive and negative sides, making it a material with a large amount of peeling charge. On the contrary, because the glass and its main component, such as silicon dioxide, have similar electrical levels, the peeling charge is extremely small. As a result, even if the conventional glass having a thickness of 0.7 mm to 1.1 mm is ultra-thinned to a glass having a thickness of 0.5 mm to 0.6 mm, static electricity can be reliably prevented. (Effects of the Invention) As described above, according to the present invention, since the material of the suction surface of the vacuum chuck that can be attached to and detached from the outer surface of the substrate on which the electronic circuit is formed, the same material as that of the surface of the substrate of Table 10 is used, or Any material that is similar to the grade of the substrate material in terms of charge level can sufficiently reduce when a vacuum chuck is mounted on a robot, etc., used to move the substrate during the manufacturing process of the substrate, and the adsorption surface is separated from the substrate. The amount of peeling charge generated can reliably prevent the occurrence of electronic circuits caused by the high risk of peeling and charging in the conventional 15-vacuum chuck even when the substrate is enlarged. damage. I: Brief description of drawings 2 FIG. 1 is a sectional view showing an embodiment of a vacuum chuck to which the present invention is applied, and (a) and (b) show the whole and a part, respectively. Fig. 2 shows an embodiment of the robot arm equipped with the vacuum chuck, (a) is a plan view, and (b) is a cross-sectional view taken along line b-b of (a). 3 (a) to (d) are explanatory diagrams showing a state when a workpiece is moved by a robot equipped with the vacuum chuck. [Representative symbols for main components of the drawing] 10 200304893 玖, description of the invention 1 ·· vacuum chuck 2 ... suction surface 3 ... lining 4 ... vacuum space 5 ... annulus 6 ... screw 7 ... intermediate plate 31 ··· Upper end surface 3 2 ... Flat surface 1 (H ... Arm 101a ... Vacuum passage 102 ... Screw 103 ... Screw 104 ... Connecting plate 104a ... Vacuum intermediate path 200, 300 ... Base substrate W ... Workpiece (substrate )
Wb···背面（外面） 10 0 · · ·機械手Wb ··· Back (outside) 10 0 · · · Robot