200304872 (1) 玖、發明說明 【發明所屬之技術領域】 本發明有關電漿顯示器面板（PDP )之介電體層，特 別是有關爲形成後面板用白色介電體層用之組成物及裸片 (green sheet )，以及使用裸片所形成之具有介電體層的 P D P構件。 【先前技術】 代表性影像顯示裝置而言，周知有使用液晶顯示、電 致發光（electroluminescent)顯示，或電漿顯示者。在此 種影像顯示裝置之中，近年來使用電漿顯示的PDP特別 受囑目，而爲改進此種裝置之高品質化、低耗電化、薄型 化、低價格化等方面之性能正在進行種種硏究。 第1圖，係表示PDP構造之一例的模式性剖面圖。 如第1圖所示，PDP具有將成爲光之釋放側的前面板用坡 璃基板1及後面板用玻璃基板2之一對玻璃基板，在各玻 璃基板之內面分別形成有互相垂直相交的透通電極3及位 址電極。透通電極3及位址電極5，係分別被透通介電體 層5及白色介電體層6所覆蓋，而透通介電體層5則設置 有保護膜7。在如上述所構成的玻璃基板1與基板2之間 ’形成有被隔板8所隔開的放電空間（像素），而對每一 個像素設置有螢光體9。 爲實現高品質之PDP起見，透通介電體層5及白色 介電體層6，需要具有均勻的厚度，且其表面必須爲平滑 (2) (2)200304872 者。如介電體層之均勻性及表面平滑性不足時，則可能不 能保持介電體層之絕緣性，或在介電特性方面產生變動而 成爲PDP上的顯示缺失之原因。 又，如爲防止因PDP放電時之電壓而發生單元（cell )缺失起見，介電體層需要具有優異的耐電壓特性。PDP 之介電體層，一般對〇.5kv以上之電壓需要具有耐性。 介電體層，係在玻璃基板上設置介電材料之塗佈層， 接著，將塗佈層予以燒成即可形成。因此，玻璃基板上所 設置的塗佈層需要爲均勻且平滑。塗佈方法之一例而言， 周知有絲網印刷法。在利用絲網印刷法而形成介電體層時 ，則重複進行在玻璃基板上印刷含有玻璃料（glass frit) 及樹脂的糊質，接著乾燥的過程。最後將形成在玻璃基板 上的塗佈層予以燒成，即可形成介電體層。 然而，由於絲網印刷法係濕式之故，一次可形成的塗 佈層之膜厚自然有其限度。又，爲塗佈層之厚膜化時，需 要重複進行在印刷糊質後使溶劑揮發，再印刷糊質的操作 之多重印刷。因此，不僅作業效率差，且在塗佈層中有殘 留溶劑的可能性。其結果，不僅塗佈所需成本高漲，殘留 溶劑影響塗佈層之功能，以致可能引起介電體層之性能低 落。 鑑於如此的狀況，曾有將介電材料預先作成片材狀者 設置在基板上之幾種方法的報導。例如，在日本專利特開 昭6 1 - 226 82號公報中，揭示有在陶瓷基板上形成玻璃層 的施釉陶瓷基板之製造方法。在此方法中，係藉由：在帶 -8- (3) (3)200304872 子或薄膜上將含有玻璃料或能玻璃化的物質之分散體進行 成膜以形成裸片的過程，及在陶瓷基板上壓貼所得的裸片 的過程，及接著，將此等加熱後將裸片熔融固貼在陶瓷基 板上的過程，而在陶瓷基板上形成玻璃層者。惟如照此方 法，則有對陶瓷基板的裸片之密貼力較弱的問題。 又，在日本專利特開昭63 - 1 97640號公報及日本專 利特開昭64 - 73 08 6號公報中，揭示有具有：以玻璃料及 黏合劑爲主成份，必要時添加無機粉末以形成粉末片材的 過程，及介由感壓性黏接劑層而將粉末片材在待被覆之物 體上加壓積層的過程，及接著，燒成所得的積層體的過程 的塗佈方法。然而，如照此方法，由於需要另外多設置感 壓性黏接劑層之故，製造過程將成爲繁雜者。又，在燒成 過程中如感壓性黏接劑成份被熱分解的情形，則因熱分解 所發生的氣體而產生玻璃層之膨脹，以致有作爲介電體製 品之品質會低落的問題。 再者，爲解決上述問題，日本專利特開平！ 〇 _ I 829〗9號公報中，揭示有：以特定之比例含有聚甲基丙 烯酸酯及具有特定粒徑的玻璃粉末的透開介電體層用組成 物，以及由此種組成物而成的乾式薄膜的透開介電體層之 製造方法。又，在曰本專利特開平9 - 1 02273號公報中， 揭示有：在陶瓷基板表面設置由含有玻璃粉末、黏合樹脂 以及溶劑的糊質狀組成物所形成的膜形成材料層，並將此 層燒成即可在陶瓷基板表面形成介電體層的PDP之製造 方法。 -9- (4) (4)200304872 然而，在上述之任一種方法，均非調製介電體層用組 成物後馬上加以加工爲片材狀，而係組成物仍多以經調製 後之狀態保持或交付運輸。如組成物被經久放置，則組成 物中所含粒子之分散性將降低，特別是玻璃料等高比重之 粒子即容易發生二次凝聚。結果，如使用此等組成物以形 成介電體層時，所得的介電體層之缺陷較多，而難於獲得 作爲介電體所需之特性。 【發明內容】 因而，本發明之課題，係以提供一種均勻性及平滑性 優異，而能形成耐電壓特性優異的介電體層且經改善玻璃 料之分散性的介電體層用組成物，以及由這種組成物而成 的介電體層用裸片及PDP用構件者。 本發明之介電體層用組成物，係電漿顯示器面板之介 電體用組成物，而其特徵爲··含有至少含有玻璃成份之玻 璃料、分散劑、熱分解性黏合劑、以及溶劑，而上述分散 劑係聚羧酸系高分子化合物。 在此，上述聚羧酸系高分子化合物，較佳爲選自α -烯烴/無水馬來酸共聚物之部份酯、脂肪族聚羧酸鹽、以 及脂肪族聚羧酸特殊聚矽氧烷而成的群中者。 上述分散劑之含量，以組成物之全重量爲基準時，較 佳爲在0.01至5.0重量％之範圍。 上述玻璃料，較佳爲再含有陶瓷塡料。 上述玻璃料之最大粒徑，較佳爲在分散狀態下爲μ -10- (5) (5)200304872 m以下。 本發明之裸片，係電漿顯示器面板之介電體層用裸片 ’而其特徵爲：將上述之本發明之介電體層用組成物塗佈 在支持體上，接著，加以乾燥而製得者。 本發明之電漿顯示器用構件之特徵爲：具有玻璃基板 ’及在該玻璃基板之一個主面上所設置之由上述本發明之 介電體層用組成物而成的介電體層。 參照所附圖面之下，由下列實施形態即可更明暸本發 明之目的、效果、特性以及優點。 【實施方式】 以下，就本發明更詳細地加以說明。 本發明之第1狀態，係關於爲形成p D P之介電體層 之用的組成物。本發明介電體層用組成物之特徵爲：含有 ;至少含有玻璃成份的玻璃料、熱分解黏合劑、溶劑、以 及作爲分散劑所選擇的聚羧酸系高分子化合物。 本發明之介電體層用組成物之特徵爲：爲改善玻璃料 之分散性，而將聚羧酸系高分子化合物作爲分散劑使用。 在此’本說明書中所使用之用語「聚羧酸系高分子化合物 」係指包含α -烯烴/無水馬來酸共聚物之部份酯、脂肪 族聚羧酸鹽、以及脂肪族聚羧酸特殊聚矽氧烷等之在分子 中具有複數個羧酸基的高分子化合物之意。這種聚羧酸系 高分子化合物，與矽烷偶合劑及一般性表面活性劑等周知 之分散劑比較時，係能使玻璃料等高比重之粒子良好方式 -11 - (6) 200304872 分散者。特別是，α -烯煙/無水馬來酸共聚物之 可呈現優異的分散效果。 因而’將聚羧酸系高分子化合物作爲分散劑使 可改善介電體層用組成物中之玻璃料之分散性以保 物爲良好的分散狀態。亦即，可抑制玻璃料凝聚以 次粒子的現象。其結果，能改善介電體層中的介電 變動，且能提升介電體層之耐電壓。 分散劑之含量，以介電體層用組成物之全重量 ，較佳爲在0.01至5.0重量％之範圍。如分散劑之 0.01重量％以下，則即使利用分散機處理組成物， 玻璃料仍然不能被均均分散的狀態。又，如分散劑 超過5.0重量％，則在燒成後分散劑仍然殘留在介 內而將成爲耐電壓低落的原因。 組成物中所含的玻璃料至少含有玻璃成份，必 再含陶瓷塡料。在此，本發明書中所使用的用語「 」’係指當燒成組成物以形成介電體層時，在介電 所含的主要無機成份之總稱之意。 玻璃料所含的玻璃成份而言，可利用作爲玻璃 般所周知者。可例舉：P b Ο — Β 2 Ο 3 (氧化鉛—氧代 玻璃、PbO — B2o — Si02 (氧化鉛—氧化硼—氧化 玻璃、PbO - B2〇3 - Si02 - A1203 (氧化鉛—氧化硼 石夕—氧化銘）系玻璃、ζ η 0 — B 2 0 3 — s i 0 2 (氧化鋅 砸—氧化砂）系玻璃、PbO — ZnO — B2O3 — Si〇2 ( —氧化辞—氧化砸—氧化砂）系玻璃、N a 2 〇 — Β 2 〇 3 部份酯 用，即 持組成 形成二 特性之 爲基準 含量在 將成爲 之含量 電體層 需時可 玻璃料 體層中 成份一 硼）系 矽）系 一氧化 一氧化 氧化鉛 —S i Ο 2 -12- (7) (7)200304872 C氧化鈉—氧化硼—氧化矽）系玻璃、BaO — CaO — Si02 (氧化鋇-氧化鈣-氧化矽）系玻璃等，較佳爲Pb 〇 一 Β 2 Ο 3 — S i 0 2 — A12 〇 3系玻璃。更具體而言，玻璃料之玻璃 成份較佳爲由30至75重量％之PbO，及1至40重量％之 B2〇3，及 1至 40重量％之 Si02，及1至 1〇重量％之 A12 〇 3而成。作爲好用的一例，可舉：由6 0重量％之P b Ο ，及10重量％之B2〇3，及25重量。/〇之Si02，及5重量％ 之ai2o3所構成的玻璃成份。玻璃成份之粒徑並不特別限 定。惟在組成物之調製時，爲達成良好的分散狀態而本發 明中好用的玻璃成份之平均粒徑爲0.5至5 μ m之範圍。 當形成將設置在PDP之後面側的白色介電體層時， 作爲玻璃料，除玻璃成份之外，再添加陶瓷塡料。能在本 發明中使用的陶瓷塡料而言，可舉：Ti02 (氧化鈦）、 Al2〇3 (氧化鋁）、Si02 (氧化矽）以及Zr02 (鍩）等。 雖然不特別限定，惟較佳爲Ti〇2及ai2o3。塡料之粒徑並 不特別限定。但在組成物之調製中爲達成良好的分散狀態 起見，本發明中好用的陶瓷塡料成份之平均粒徑爲在〇.1 至5 μ m之範圍。 玻璃料中之玻璃成份與陶瓷塡料成份之比例，以其等 之全重量爲基準，係玻璃成份爲50至100重量％及陶瓷 塡料成份爲50至0重量％。在後面（白色）介電體層用 組成物的情形，較佳爲玻璃成份在50至90重量％及陶瓷 塡料成份在50至10重量％。又，在前面（透開）介電體 層用組成物的情形，較佳爲玻璃成份在1 〇〇重量％及陶瓷 -13- (8) (8)200304872 塡料成份在0重量％。玻璃料而言，以組成物之全重量爲 基準，可含有40至80重量％之範圍。 本發明所使用的熱分解性黏合劑，係爲介電體層用組 成物賦與對玻璃基板的黏接性者。雖並不特別限定，惟作 爲好用的熱分解性黏合劑之一例，可舉：丙烯酸樹脂。丙 烯酸樹脂中可包含：（甲基）丙烯酸酯化合物之單獨聚合 物、（甲基）丙烯酸酯化合物之2種以上之共聚物、（甲 基）丙烯酸酯化合物與其他共聚性單體間之共聚物。 (甲基）丙烯酸酯化合物之具體例而言，可舉：（甲 基）丙烯酸甲酯、（甲基）丙烯酸乙酯、（甲基）丙烯酸 丙酯、（甲基）丙烯酸異丙酯、（甲基）丙烯酸丁酯、（ 甲基）丙烯酸異丁酯、（甲基）丙烯酸第三丁酯、（甲基 )丙烯酸戊酯、（甲基）丙烯酸正戊酯、（甲基）丙酸 戊酯、（甲基）丙烯酸己酯、（甲基）丙烯酸庚酯、（甲 基）丙烯酸辛酯、（甲基）丙烯酸異辛酯、（甲基）丙儲 酸2—乙基己酯、（甲基）丙烯酸乙基己酯、（甲基）丙 烯酸壬酯、（曱基）丙烯酸癸酯、（甲基）丙烯酸異癸酯 、（甲基）丙燃酸十一院酯、（甲基）丙烯酸十二院酯、 (甲基）丙烯酸月桂酯、（甲基）丙烯酸硬脂酯、（甲基 )丙烯酸異硬脂酯等之（甲基）丙烯酸烷酯；羥基（甲基 )丙烯酸乙酯、2 -羥基（甲基）丙烯酸丙酯、4 一羥基（ 甲基）丙烯酸丁酯、3 -羥基（甲基）丙烯酸丙酯、2 _經 基（甲基）丁酯、3 -羥基（甲基）丙烯酯丁酯等之經基 (甲基）丙烯酸烷基； -14- 200304872 Ο) 苯氧基（甲基）丙烯酸乙酯、2 -羥基一 3 —苯氧基（ 甲基）丙烯酸丙酯等之苯氧基（甲基）丙烯酸烷酯； 2-甲氧基（甲基）丙烯酸乙酯、2—乙氧基（甲基） 丙嫌酸乙酯、2-丙氧基（甲基）丙烯酸乙酯、2一丁氧基 (甲基）丙烯酸乙酯、2 —甲氧基（甲基）丙烯酸丁酯等 之院氧基（甲基）丙烯酸烷酯； 聚乙二醇一（甲基）丙烯酸酯、乙氧基二乙二醇（甲 基）丙烯酸酯、甲氧基聚乙二醇（甲基）丙烯酸酯、苯氧 基聚乙二醇（甲基）丙烯酸酯、壬基苯氧基聚乙二醇（甲 基）丙烯酸酯、聚丙二醇-（甲基）丙烯酸酯、甲氧基聚 丙二醇（甲基）丙烯酸酯、乙氧基聚丙二醇（甲基）丙儲 酸酯、壬基苯氧基聚丙二醇（甲基）丙烯酸酯等之聚院二 醇（甲基）丙烯酸酯； 環己基（甲基）丙烯酸酯、4-丁基環己基（甲基） 丙烯酸酯、二環戊烷基（甲基）丙烯酸酯、二環戊烯基（ 甲基）丙烯酸酯、二環戊二烯基（甲基）丙烯酸酯、冰片 基（甲基）丙烯酸酯、異冰片基（甲基）丙烯酸酯、三環 癸烷基（甲基）丙烯酸酯等之環烷基（甲基）丙烯酸酯； 苄基C甲基）丙烯酸酯、四氫呋喃（甲基）丙烯酸酯 等。其中，較佳爲（甲基）丙烯酸烷酯或烷氧基（甲基） 丙烯酸烷酯，特佳之（甲基）丙烯酸酯而言，可舉··（甲 基）丙烯酸丁酯、（甲基）丙烯酸乙基己酯、（甲基）丙 烯酸異癸酯、2-乙基（甲基）丙烯酸己酯、以及2-乙 基（甲基）丙烯酸乙酯。 -15- 200304872 do) 其他共聚物而言，衹要是能與上述（甲基）丙烯酸酯 化合物進行共聚合，則並不特別限制，惟可例舉：（甲基 )丙烯酸、乙烯基安息香酸、馬來酸、乙烯基酞酸等之不 飽和羧酸類；乙烯基苄基甲醚、乙烯基縮水甘油醚、苯乙 烯、α -甲基苯乙烯、丁二烯、異戊二烯等之含有乙烯基 之自由基聚合性化合物。 熱分解性黏合劑之含量，並不特別限定，惟以介電體 層用組成物之全重量爲基準時，較佳爲在5至3 0重量％ 之範圍。 本發明所使用的溶劑，較佳爲能對介電體層用組成物 賦與適當的流動性或可塑性、良好的膜形成性者。可使用 的溶劑而言，可例舉：醚類、酯類、醚型酯類、酮類、酮 型酯類、醯胺類、醯胺型酯類、內醯胺類、內酯類、亞硕 類、fi風類、烴類、鹵化烴類等。較佳溶劑之具體例中包含 :甲苯、乙酸乙酯、以及甲基乙基曱酮。可以按單獨或組 合2種以上之方式使用上述溶媒。溶劑之含量，以介電體 層用組成物之全重量作爲基準，係在1 5至5 5重量％之範 圍。 本發明中，作爲添加劑而可在介電體層用組成物中再 含有：如己二酸酯系可塑劑等之可塑劑、粘接賦與劑、保 存安定劑、消泡劑、熱分解促進劑以及氧化防止劑等之添 加劑。此等添加劑，並不特別限定，而可適當選擇在此領 域常用者。 雖並不特別限定，惟本發明之介電體層用組成物之一 -16- (11) (11)200304872 個較佳實施狀態，係含有：含有Pb0/B203/Si02/Al203 = 60/10/25/5重量％之玻璃成份及Al203/Ti〇2之陶瓷塡料成 份的玻璃料、及2 -乙基甲基丙烯酸己酯（熱分解性黏合 劑）、及α -烯烴/無水馬來酸共聚物之部份酯（分散劑 )、及己二酸二丁酯（可塑劑），以及甲苯（溶劑）的組 成物。又，本發明之介電體層用組成物之其他一個較佳實 施形態，係含有：含有 PbO/B2〇3/Si〇2/Al2〇3= 60/ 1 0/25/5 重量％之玻璃成份的玻璃料、及2 -乙基甲基丙烯酸己酯 (熱分解性黏合劑）、及α -烯烴/無水馬來酸共聚物之 部份酯（分散劑）、及己二酸二丁酯（可塑劑）、以及甲 苯（溶劑）的組成物。 本發明之介電體層用組成物，係將玻璃料、分散劑、 熱分解性黏合劑以及必要時所添加的各種添加劑與溶劑一 起預混後，可使用例如，球磨、熔珠磨、三輥硏磨機、捏 合機等之分散機按機械方式使其分散以調製。爲使組成物 之分散狀態更爲均勻起見，亦可延長分散機所處理的時間 ，或選擇更能有效分散的分散機。 分散狀態下的玻璃料，係由於聚羧酸系高分子化合物 之優異的分散作用而一次粒子將被均勻分散並抑制二次凝 聚。玻璃料之最大粒徑在分散狀態下較佳爲20 μ m以下。 如玻璃料之最大粒徑超過2 0 μ m，則由如此的組成物而成 的介電體層，將在其表面容易產生針孔等之缺陷，以致難 於獲得所需要的耐電壓特性。 如上述，由於本發明之介電體層用組成物係作爲分散 -17- (12) (12)200304872 劑而使用聚羧酸系高分子化合物之故，可適當調節玻璃料 之分散狀態以達成良好的分散狀態。再者，由於聚羧酸系 高分子化合物之優異的分散作用而能防止玻璃料之二次凝 聚之故’能將剛調製組成物時之良好分散狀態長時間維持 。因而，使用本發明之介電體層用組成物，即能形成耐電 壓及介電特性優異的介電體層。 本發明之第2狀態，係關於爲形成PDP之介電體層 所使用的裸片。本發明之裸片之特徵爲··將上述所說明的 本發明之介電體層用組成物塗佈在支持體上，接著，加以 乾燥即可製得。 本發明之裸片，更具體而言，係將至少含有玻璃料、 聚羧酸系高分子化合物、熱分解性黏合劑，以及溶劑的組 成物充份混合以使玻璃料均勻分散，依刮刀塗佈法或壓模 塗佈法將所得的分散液塗佈在聚對苯二甲酸乙二醇酯製薄 膜等之支持體上，使其乾燥並去除溶劑而作成薄膜狀者。 由於支持體上之裸片，係具有粘接性，並優於可撓性 、加工性以及操作處理性之故，能容易轉印在玻璃基板上 。在此，「具有粘接性」係指在室溫或加溫下當裸片接觸 至玻璃基板時，裸片將密貼在玻璃基板上並被固定之意。 在此，爲改善將裸板轉印至玻璃基板上時之剝離性起見， 支持體較佳爲經以聚矽氧烷等表面處理者。被轉印至玻璃 基板上的裸板，經過燒成後將形成以玻璃成份爲主成份的 介電體層。 由於使用上述裸片以形成介電體層之故，可依更簡單 -18- (13) (13)200304872 的方法，以一次操作即可在玻璃基板上設置一定厚之高品 質之介電體層。又，如此方式所形成的介電體層並無介電 特性之變動而具有適用爲PDP的特性。 本發明之第3狀態，係關於玻璃基板上設置有介電體 層的PDP用構件。本發明之PDP用構件之特徵爲：具備 有玻璃基板，及在該玻璃基板之一個主面上所設置的介電 體層者，而介電體層係由本發明之介電體層用組成物而成 者。介電體層之形成可藉由在玻璃基板上依習用之方法塗 佈介電體層用組成物之分散液，或者，將介電體層用組成 物經加工爲裸片者轉印至玻璃板上之後，將此等加以燒成 而實施。雖然並不特別限定，惟介電體層之形成可藉由裸 片之轉印，而按簡便且高效率之方式實施。 以下，就使用裸片以形成將設置在PDP之後面玻璃 基板的白色介電體層的情形，加以簡單說明。第2圖係說 明PDP用構件之製作例的過程圖。以下，按照第2圖， 就在玻璃基板上形成白色介電體層的情形，加以說明。 首先，使用刮刀塗佈機或壓模塗佈機，將含有既定成 份的本發明之介電體層用組成物塗佈在剝離薄膜1 0之上 面。接著，使用乾燥機將所塗佈的組成物，在90至130 °C下之溫度進行乾燥，在剝離薄膜1 0上製得厚度1 0至 200μηΐ，較佳爲20至ΙΟΟμιτι之均勻的裸片12。接著，在 裸片1 2上貼附另一片剝離薄膜1 1。如此方式可製得按將 本發明之介電體層用組成物挾介在剝離薄膜1 0及1 1之間 的構成使其薄膜化的片狀形成物1 3 (如第2 ( a )圖）。 -19- (14) (14)200304872 從所得的片狀形成物1 3去除剝離薄膜i 〇、n，並將 裸片1 2貼黏在表面形有位址電極4的後面板用玻璃基板 2上（如第2(b)圖）。 接著’將經貼黏在後面板用玻璃基板2的裸片1 2在 燒成爐內加以燒成。燒成時，例如作爲第1階段，在3 00 至45 0°C之溫度進行10至60分鐘之假燒成，接著，作爲 第2階段，在5 00至700°C之溫度進行20至90分鐘之本 燒成即可完成。如此方式，即可形成厚度5至1 00 μ m， 較佳爲7至9〇μπι之白色介電體層6(如第2(c)圖）。 如上述方式所得的白色介電體層6，可展現優異的耐 電壓特性。 另外，在上述說明係就將設置在PDP之後面板用玻 璃基板2的白色介電體層6所記載者，惟對將設置在前面 板用玻璃基板1的透通介電體層5 (參照第1圖），亦可 依同樣方法加以形成。 實施例 以下，藉由實施例，將本發明更具體方式加以說明。 但本發明並不因下述之實施例所限定，當然’不脫離本發 明之主旨的範圍下，可作種種變更。 另外，在各實施例中所調整的組成物之分散狀態以及 有關介電體層之特性的評估方法，係如下所述。 1 .有關組成物之分散狀態的評估 -20- (15) (15)200304872 介電體層用組成物之分散狀態，係就介電體層用組成 物中之粗粒中之存在與否、粒度測定機（grinder)値、玻 璃料之沈降情形之檢查而加以評估。 粗粒子存在與否 對粗粒子存在與否，係按每分散時間或按每放置時間 採取介電體層用組成物，並使用鐵士達產業（股）製之粒 度測定機，以目視確認未發生條紋的面之狀態，列示介電 體層用組成物中可確認的粗粒子之狀態。 粒度測定機値 對粒度測定機値，係按每分散時間或按每放且時間採 取介電體層用組成物，使用鐵士達產業（股）製之粒度測 定機以測定所分散的粒子之最大粒徑。 玻璃料之沈降 使用分散機將組成物處理一定時間後，按每放置時間 採取介電體層用組成物，以目視確認玻璃粒之沈降有無發 生。 2 .介電體層之評估方法 介電體層之評估，係藉由介電體層之耐電壓及介電體 層之表面粗糙度之測定而實施者。 -21 - (16) (16)200304872 耐電壓 爲測定介電體層之耐電壓，將從介電體層用組成物所 製得的裸片貼黏在附有電極之玻璃基板上，接著，在因燒 成所形成的介電體層上面，再形成評估用之電極以製作耐 電壓測定用試樣。就此耐電壓測定用試樣，使用菊水電子 工業（股）製之耐電壓測定機以測定耐電壓。再者，根據 測定所得之耐電壓之値是否超過〇 . 5 kV以判斷作爲介電體 層之適用性。表中以「〇」表示可作爲PDP之介電體層 適用者，而以「X」表示不能適用者。 表面粗糙度 就在附有電極之玻璃基板上，將從介電體層用組成物 所製得的裸片貼黏在玻璃基板上，接著，因燒成所形成的 介電體層’使用明神工機（股）製之接觸式表面粗糙度計 加以測定其介電體層表面並評估。 以下，利用實施例，就本發明加以說明。 (實施例1 ) 將如下列所示的各成份裝入分散機，並使用熔珠磨使 其分散以調製白色介電體層用組成物。在調製中按每分散 時間採取組成物，就其分散狀態按照上述之方法加以評估 其結果如表1 -22- (17) 200304872 成份 重量份 玻璃料 玻璃成份 6 5重量％ (PbO/B203/Si02/Al2〇3 = 60/10 / 25/5 重量 ％， 平均粒徑1 · 0 μ m，最大粒徑2 0 μ m ) 陶瓷塡料成份 3 5重量％ (Ti〇2/Al2〇3 = 43/57 重量 ％ ) 100 熱分解性黏合劑 2-乙基甲基丙烯酸己酯 40 分散劑 α -烯烴/無水馬來酸共聚物之部分酯 (弗洛連G-700 (商品名，共榮社化學（股）製） 0.3 可塑劑 己二酸二丁酯 (東洋油墨製造（股）製） 0.8 溶劑 甲苯 50200304872 (1) Description of the invention [Technical field to which the invention belongs] The present invention relates to a dielectric layer of a plasma display panel (PDP), and in particular, to a composition and a bare chip for forming a white dielectric layer for a rear panel ( green sheet), and a PDP member having a dielectric layer formed using a bare die. [Prior Art] As a representative image display device, a liquid crystal display, an electroluminescent display, or a plasma display is well known. Among such image display devices, in recent years, PDPs using plasma display have been particularly ordered. In order to improve the performance of such devices in terms of high quality, low power consumption, thinness, and low price, etc. All kinds of research. FIG. 1 is a schematic cross-sectional view showing an example of a PDP structure. As shown in FIG. 1, the PDP has a pair of glass substrates, one of which is a sloped glass substrate 1 for a front panel and a glass substrate 2 for a rear panel. The inner surfaces of the glass substrates are formed to intersect each other perpendicularly. Transparent electrode 3 and address electrode. The transparent electrode 3 and the address electrode 5 are covered by the transparent dielectric layer 5 and the white dielectric layer 6, respectively, and the transparent dielectric layer 5 is provided with a protective film 7. A discharge space (pixel) partitioned by the spacer 8 is formed between the glass substrate 1 and the substrate 2 configured as described above, and a phosphor 9 is provided for each pixel. In order to achieve a high-quality PDP, the transparent dielectric layer 5 and the white dielectric layer 6 need to have a uniform thickness, and their surfaces must be smooth (2) (2) 200304872. If the uniformity and surface smoothness of the dielectric layer are insufficient, the insulation of the dielectric layer may not be maintained, or changes in the dielectric characteristics may be the cause of missing display on the PDP. In addition, in order to prevent missing cells due to the voltage during discharge of the PDP, the dielectric layer needs to have excellent withstand voltage characteristics. The dielectric layer of a PDP generally needs to be resistant to voltages above 0.5 kv. The dielectric layer is formed by providing a coating layer of a dielectric material on a glass substrate, and then firing the coating layer. Therefore, the coating layer provided on the glass substrate needs to be uniform and smooth. As an example of the coating method, a screen printing method is known. When the dielectric layer is formed by the screen printing method, the process of printing a paste containing glass frit and resin on a glass substrate and then drying is repeated. Finally, the coating layer formed on the glass substrate is fired to form a dielectric layer. However, since the screen printing method is a wet method, the thickness of the coating layer that can be formed at one time naturally has a limit. In order to increase the thickness of the coating layer, it is necessary to repeat the multi-printing operation in which the solvent is volatilized after printing the paste and the paste is printed again. Therefore, not only the work efficiency is poor, but there is also a possibility that a solvent remains in the coating layer. As a result, not only the cost required for coating increases, but also the residual solvent affects the function of the coating layer, which may cause the performance of the dielectric layer to deteriorate. In view of this situation, there have been reports of several methods of placing a dielectric material in a sheet shape on a substrate in advance. For example, Japanese Patent Laid-Open No. Sho 6 1-226 82 discloses a method for manufacturing a glazed ceramic substrate in which a glass layer is formed on a ceramic substrate. In this method, a process of forming a dispersion containing a glass frit or a vitrified substance on a tape or film to form a die is performed on a tape or film, and The process of pressing the obtained die on the ceramic substrate, and then the process of heating and melting the die on the ceramic substrate to form a glass layer on the ceramic substrate. However, according to this method, there is a problem that the adhesion force to the bare chip of the ceramic substrate is weak. In addition, Japanese Patent Laid-Open No. 63-1 97640 and Japanese Patent Laid-Open No. 64-73 08 6 disclose that glass frit and a binder are used as main components, and inorganic powder is added to form a powder when necessary. A process of sheeting, a process of pressure laminating a powder sheet on an object to be covered through a pressure-sensitive adhesive layer, and a coating method of a process of firing the obtained laminate. However, according to this method, since an additional pressure-sensitive adhesive layer is required, the manufacturing process becomes complicated. In addition, if the pressure-sensitive adhesive component is thermally decomposed during firing, the glass layer expands due to the gas generated by the thermal decomposition, and there is a problem that the quality as a dielectric system product is deteriorated. Furthermore, in order to solve the above-mentioned problems, Japanese Patent Laid-Open Patent No. Hei! 〇_I 829〗 9 discloses a composition for a transparent dielectric layer containing polymethacrylate and a glass powder having a specific particle size in a specific ratio, and a composition made of such a composition Method for manufacturing a transparent thin-film dielectric layer. Further, Japanese Patent Laid-Open No. 9-1 02273 discloses that a film-forming material layer formed of a paste-like composition containing glass powder, a binder resin, and a solvent is provided on the surface of a ceramic substrate, and A method of manufacturing a PDP in which a dielectric layer is formed on the surface of a ceramic substrate by firing the layers. -9- (4) (4) 200304872 However, in any of the methods described above, the composition for the dielectric layer is not processed immediately after being processed into a sheet, and the composition is still maintained in the prepared state. Or deliveries. If the composition is left for a long period of time, the dispersibility of the particles contained in the composition will be reduced, and especially the particles with a high specific gravity such as glass frit will easily undergo secondary agglomeration. As a result, when such a composition is used to form a dielectric layer, the resulting dielectric layer has many defects, and it is difficult to obtain characteristics required as a dielectric. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a composition for a dielectric layer having excellent uniformity and smoothness, capable of forming a dielectric layer having excellent withstand voltage characteristics, and improved dispersibility of the frit, and A die for a dielectric layer and a member for a PDP made of such a composition. The composition for a dielectric layer of the present invention is a composition for a dielectric of a plasma display panel, and is characterized by containing a glass frit containing at least a glass component, a dispersant, a thermally decomposable adhesive, and a solvent, The dispersant is a polycarboxylic acid-based polymer compound. Here, the polycarboxylic acid-based polymer compound is preferably selected from a partial ester of an α-olefin / anhydrous maleic acid copolymer, an aliphatic polycarboxylate, and an aliphatic polycarboxylic acid-specific polysiloxane. From the group. The content of the dispersant is preferably in the range of 0.01 to 5.0% by weight based on the total weight of the composition. The glass frit preferably further contains a ceramic frit. The maximum particle size of the glass frit is preferably μ -10- (5) (5) 200,304,872 m or less in a dispersed state. The die of the present invention is a die for a dielectric layer of a plasma display panel, and is characterized in that the above-mentioned composition for a dielectric layer of the present invention is coated on a support and then dried to obtain By. The component for a plasma display of the present invention is characterized by having a glass substrate 'and a dielectric layer made of the composition for a dielectric layer of the present invention provided on one main surface of the glass substrate. The purpose, effects, characteristics, and advantages of the present invention will be more clearly understood from the following embodiments with reference to the drawings. [Embodiment] Hereinafter, the present invention will be described in more detail. The first aspect of the present invention relates to a composition for forming a dielectric layer of p D P. The composition for a dielectric layer of the present invention is characterized by comprising: a glass frit containing at least a glass component, a thermal decomposition adhesive, a solvent, and a polycarboxylic acid-based polymer compound selected as a dispersant. The composition for a dielectric layer of the present invention is characterized in that a polycarboxylic acid-based polymer compound is used as a dispersant in order to improve the dispersibility of the glass frit. As used herein, the term "polycarboxylic acid-based polymer compound" means a partial ester containing an α-olefin / anhydrous maleic acid copolymer, an aliphatic polycarboxylate, and an aliphatic polycarboxylic acid. The meaning of special polysiloxane and other polymer compounds having a plurality of carboxylic acid groups in the molecule. Compared with known dispersants such as silane coupling agents and general surfactants, this polycarboxylic acid-based polymer compound is a good method for dispersing particles with a high specific gravity such as glass frit -11-(6) 200304872. In particular, the α-enefene / anhydrous maleic acid copolymer can exhibit an excellent dispersion effect. Therefore, the use of the polycarboxylic acid-based polymer compound as a dispersant can improve the dispersibility of the glass frit in the composition for a dielectric layer and keep the dispersion in a good state. That is, the phenomenon that the glass frit is agglomerated with secondary particles can be suppressed. As a result, the dielectric variation in the dielectric layer can be improved, and the withstand voltage of the dielectric layer can be improved. The content of the dispersant is in the range of 0.01 to 5.0% by weight based on the total weight of the composition for the dielectric layer. If the dispersant is 0.01% by weight or less, even if the composition is processed with a disperser, the glass frit cannot be uniformly dispersed. In addition, if the dispersant exceeds 5.0% by weight, the dispersant remains in the medium after firing, which causes a drop in withstand voltage. The glass frit contained in the composition contains at least a glass component, and must also contain a ceramic frit. Herein, the term "" used in the present invention means a general term for a main inorganic component contained in a dielectric when a composition is fired to form a dielectric layer. As for the glass component contained in the glass frit, it is known as a glass. For example: P b 〇 — Β 2 Ο 3 (lead oxide—oxo glass, PbO—B2o—Si02 (lead oxide—boron oxide—oxidized glass, PbO-B2〇3-Si02-A1203 (lead oxide—boron oxide Shi Xi—Oxidation) glass, ζ η 0 — B 2 0 3 — si 0 2 (zinc oxide—sand oxide) series glass, PbO — ZnO — B2O3 — Si〇2 (—oxidation—oxidation—oxidation (Sand) series glass, Na 2 〇- Β 2 〇3 for some esters, that is, holding the composition to form the second characteristic as the reference content in the content of the electrical layer will take time, the component in the frit body layer-boron) series silicon) It is lead monoxide monoxide—S i Ο 2 -12- (7) (7) 200304872 C sodium oxide—boron oxide—silicon oxide) glass, BaO — CaO — Si02 (barium oxide—calcium oxide—silicon oxide) It is preferably glass such as Pb 〇-Β 2 0 3-S i 0 2-A12 〇3-based glass. More specifically, the glass composition of the glass frit is preferably from 30 to 75% by weight of PbO, and 1 to 40% by weight of B203, and 1 to 40% by weight of Si02, and 1 to 10% by weight A12 〇3. As an example of good use, it can be made up of 60% by weight of P b 0, 10% by weight of B203 and 25% by weight. / 〇 的 SiO02, and 5% by weight of ai2o3 glass composition. The particle size of the glass component is not particularly limited. However, in the preparation of the composition, in order to achieve a good dispersion state, the average particle diameter of the glass component which is useful in the present invention is in the range of 0.5 to 5 m. When forming a white dielectric layer to be provided on the rear side of the PDP, a ceramic frit is added as a glass frit in addition to the glass component. Examples of ceramic materials that can be used in the present invention include Ti02 (titanium oxide), Al203 (alumina), Si02 (silicon oxide), and Zr02 (rhenium). Although not particularly limited, Ti02 and ai2o3 are preferred. The particle size of the concrete is not particularly limited. However, in order to achieve a good dispersion state in the preparation of the composition, the average particle size of the ceramic material ingredients useful in the present invention is in the range of 0.1 to 5 μm. The ratio of the glass component to the ceramic material in the glass frit is based on the total weight of the glass material, and the glass component is 50 to 100% by weight and the ceramic material is 50 to 0% by weight. In the case of the composition for the rear (white) dielectric layer, the glass component is preferably 50 to 90% by weight and the ceramic material component is 50 to 10% by weight. In the case of the composition for the front (transparent) dielectric layer, the glass component is preferably 100% by weight and the ceramic -13- (8) (8) 200304872 is a 0% by weight component. The glass frit may contain 40 to 80% by weight based on the total weight of the composition. The thermally decomposable adhesive used in the present invention is one that imparts adhesiveness to a glass substrate for a composition for a dielectric layer. Although it is not particularly limited, as an example of a useful thermally decomposable adhesive, an acrylic resin may be mentioned. The acrylic resin may include: a separate polymer of the (meth) acrylate compound, a copolymer of two or more kinds of the (meth) acrylate compound, and a copolymer between the (meth) acrylate compound and other copolymerizable monomers . Specific examples of the (meth) acrylate compound include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, ( Butyl (meth) acrylate, isobutyl (meth) acrylate, tertiary butyl (meth) acrylate, amyl (meth) acrylate, n-amyl (meth) acrylate, amyl (meth) propionate Ester, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl propionate, ( Ethylhexyl methacrylate, nonyl (meth) acrylate, decyl (fluorenyl) acrylate, isodecyl (meth) acrylate, undecyl propionate, (meth) Dodecyl acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, isostearyl (meth) acrylate, etc .; alkyl (meth) acrylates; ethyl hydroxy (meth) acrylate , Propyl 2-hydroxy (meth) acrylate, butyl 4-hydroxy (meth) acrylate, 3-hydroxy (Meth) acrylic acid propyl, 2- (meth) butyl, 3-hydroxy (meth) acrylic butyl, etc. (meth) acrylic alkyl groups; -14-200304872 0) phenoxy Alkyl phenoxy (meth) acrylate, such as ethyl (meth) acrylate, 2-hydroxyl 3-phenoxy (meth) acrylate, etc .; ethyl 2-methoxy (meth) acrylate , 2-ethoxy (meth) propionic acid ethyl ester, 2-propoxy (meth) acrylate, 2-monobutoxy (meth) acrylate, 2-methoxy (methyl) ) Alkoxy (meth) acrylates such as butyl acrylate; polyethylene glycol mono (meth) acrylate, ethoxy diethylene glycol (meth) acrylate, methoxy polyethylene glycol (Meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, nonylphenoxy polyethylene glycol (meth) acrylate, polypropylene glycol- (meth) acrylate, methoxy Polyethylene glycol (meth) acrylate, ethoxy polypropylene glycol (meth) propionate, nonylphenoxy polypropylene glycol (meth) acrylate, etc. Diol (meth) acrylate; cyclohexyl (meth) acrylate, 4-butylcyclohexyl (meth) acrylate, dicyclopentyl (meth) acrylate, dicyclopentenyl (methyl Base) acrylate, dicyclopentadienyl (meth) acrylate, norbornyl (meth) acrylate, isobornyl (meth) acrylate, tricyclodecyl (meth) acrylate, etc. Cycloalkyl (meth) acrylate; benzyl C meth) acrylate, tetrahydrofuran (meth) acrylate, etc. Among them, alkyl (meth) acrylate or alkoxy (meth) acrylate is preferred. Particularly preferred (meth) acrylates include butyl (meth) acrylate and (meth) acrylate. ) Ethylhexyl acrylate, isodecyl (meth) acrylate, hexyl 2-ethyl (meth) acrylate, and ethyl 2-ethyl (meth) acrylate. -15- 200304872 do) For other copolymers, as long as it can be copolymerized with the above (meth) acrylate compound, it is not particularly limited, but examples include: (meth) acrylic acid, vinyl benzoic acid, Unsaturated carboxylic acids such as maleic acid, vinyl phthalic acid, etc .; ethylene containing vinyl benzyl methyl ether, vinyl glycidyl ether, styrene, α-methylstyrene, butadiene, isoprene, etc. Radical polymerizable compound. The content of the thermally decomposable adhesive is not particularly limited, but it is preferably in the range of 5 to 30% by weight based on the total weight of the composition for the dielectric layer. The solvent used in the present invention is preferably one capable of imparting appropriate fluidity or plasticity to the composition for a dielectric layer and good film forming properties. Examples of usable solvents include ethers, esters, ether esters, ketones, ketone esters, amidines, amidine esters, lactams, lactones, Master class, fi wind class, hydrocarbons, halogenated hydrocarbons, etc. Specific examples of the preferred solvent include toluene, ethyl acetate, and methyl ethyl fluorenone. These solvents may be used alone or in combination of two or more. The content of the solvent is in the range of 15 to 55 wt% based on the total weight of the composition for the dielectric layer. In the present invention, a plasticizer such as an adipate-based plasticizer, an adhesive agent, a storage stabilizer, a defoamer, and a thermal decomposition accelerator may be further contained in the composition for a dielectric layer as an additive. And additives such as oxidation inhibitors. These additives are not particularly limited, and those commonly used in this field can be appropriately selected. Although it is not particularly limited, one of the compositions for the dielectric layer of the present invention is -16- (11) (11) 200304872, which is a preferred implementation state and contains: containing Pb0 / B203 / Si02 / Al203 = 60/10 / 25/5% by weight glass frit and Al203 / Ti〇2 ceramic frit, glass frit, and 2-ethylhexyl methacrylate (thermally decomposable adhesive), and α-olefin / anhydrous maleic acid It is a composition of partial ester (dispersant) of copolymer, dibutyl adipate (plasticizer), and toluene (solvent). In another preferred embodiment of the composition for a dielectric layer of the present invention, the composition includes a glass component containing PbO / B2 03 / Si〇2 / Al 2 0 3 = 60/1 1/25/5 wt%. Glass frit, 2-ethylhexyl methacrylate (thermally decomposable adhesive), and partial esters (dispersants) of α-olefin / anhydrous maleic acid copolymers, and dibutyl adipate ( Plasticizer) and toluene (solvent). The composition for a dielectric layer of the present invention is prepared by premixing a glass frit, a dispersant, a thermally decomposable adhesive, and various additives, if necessary, with a solvent. For example, ball milling, bead milling, and three rolls can be used. Dispersers such as honing mills and kneaders are mechanically dispersed for modulation. In order to make the dispersed state of the composition more uniform, the processing time of the dispersing machine can be extended, or a dispersing machine that can disperse more effectively can be selected. The glass frit in the dispersed state is uniformly dispersed in the primary particles due to the excellent dispersing effect of the polycarboxylic acid-based polymer compound and suppresses secondary aggregation. The maximum particle diameter of the glass frit is preferably 20 μm or less in a dispersed state. If the maximum particle size of the glass frit exceeds 20 μm, a dielectric layer made of such a composition will easily cause defects such as pinholes on its surface, making it difficult to obtain the required withstand voltage characteristics. As described above, since the composition for the dielectric layer of the present invention uses a polycarboxylic acid-based polymer compound as a dispersion -17- (12) (12) 200304872 agent, the dispersion state of the glass frit can be appropriately adjusted to achieve good results. Dispersed state. Furthermore, because of the excellent dispersing effect of the polycarboxylic acid-based polymer compound, secondary agglomeration of the glass frit can be prevented ', and the good dispersion state at the time of preparing the composition can be maintained for a long time. Therefore, by using the composition for a dielectric layer of the present invention, a dielectric layer having excellent voltage resistance and dielectric characteristics can be formed. The second aspect of the present invention relates to a bare chip used for forming a dielectric layer of a PDP. The bare chip of the present invention is characterized in that the composition for the dielectric layer of the present invention described above is coated on a support and then dried. More specifically, the bare chip of the present invention is a composition in which at least a glass frit, a polycarboxylic acid-based polymer compound, a thermally decomposable adhesive, and a solvent are sufficiently mixed to uniformly disperse the glass frit, and then coated with a doctor blade The obtained dispersion is coated on a support such as a film made of polyethylene terephthalate by a cloth method or a die coating method, and dried to remove a solvent to form a film. Because the bare chip on the support is adhesive, and is superior to flexibility, processability, and handling, it can be easily transferred on a glass substrate. Here, "having adhesiveness" means that when the die contacts the glass substrate at room temperature or under heating, the die is closely adhered to the glass substrate and fixed. Here, in order to improve the releasability when the bare board is transferred to a glass substrate, the support is preferably a surface treated with polysiloxane. The bare board transferred to the glass substrate is fired to form a dielectric layer mainly composed of a glass component. Since the above-mentioned die is used to form the dielectric layer, a simpler method can be used to set a certain thickness of high-quality dielectric layer on the glass substrate in a single operation. In addition, the dielectric layer formed in this manner has characteristics that are suitable for use as a PDP without any change in dielectric characteristics. A third aspect of the present invention relates to a PDP member having a dielectric layer provided on a glass substrate. The PDP member of the present invention is characterized by having a glass substrate and a dielectric layer provided on one main surface of the glass substrate, and the dielectric layer is made of the composition for a dielectric layer of the present invention. . The dielectric layer can be formed by applying a dispersion of the composition for the dielectric layer on a glass substrate according to a conventional method, or after the composition for the dielectric layer is processed into a bare sheet and transferred to a glass plate. These are fired and implemented. Although not particularly limited, the formation of the dielectric layer can be carried out in a simple and efficient manner by transferring the die. Hereinafter, a case where a bare chip is used to form a white dielectric layer to be provided on a glass substrate behind a PDP will be briefly described. Fig. 2 is a process diagram illustrating an example of manufacturing a PDP member. Hereinafter, a case where a white dielectric layer is formed on a glass substrate will be described with reference to FIG. 2. First, the composition for a dielectric layer of the present invention containing a predetermined component is coated on the top surface of a release film 10 using a blade coater or a die coater. Next, the applied composition is dried at a temperature of 90 to 130 ° C using a dryer, and a uniform bare film 12 having a thickness of 10 to 200 μηΐ, preferably 20 to 100 μm is prepared on the release film 10. . Next, another release film 11 is attached to the bare chip 12. In this way, a sheet-like structure 13 (see FIG. 2 (a)) can be obtained in which the composition for a dielectric layer of the present invention is formed between the release films 10 and 11 and formed into a thin film. -19- (14) (14) 200 304 872 Remove the release films i 0 and n from the obtained sheet-like structure 1 3, and stick the die 1 2 to the glass substrate 2 for the rear panel on which the address electrodes 4 are formed on the surface. Up (as shown in Figure 2 (b)). Next, the bare chips 12 adhered to the glass substrate 2 for the rear panel are fired in a firing furnace. During firing, for example, as a first stage, a temporary firing is performed at a temperature of 300 to 4500 ° C for 10 to 60 minutes, and then as a second stage, a firing is performed at a temperature of 5 00 to 700 ° C for 20 to 90 minutes. Minutes of firing can be completed. In this way, a white dielectric layer 6 having a thickness of 5 to 100 μm, preferably 7 to 90 μm can be formed (as shown in FIG. 2 (c)). The white dielectric layer 6 obtained as described above can exhibit excellent withstand voltage characteristics. In the above description, the white dielectric layer 6 provided on the glass substrate 2 for the rear panel of the PDP is described. However, the transparent dielectric layer 5 provided on the glass substrate 1 for the front panel (see FIG. 1) ) Can also be formed in the same way. Examples Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to the following embodiments, and various changes can be made without departing from the scope of the gist of the present invention. In addition, the dispersion state of the composition adjusted in each Example and the method for evaluating the characteristics of the dielectric layer are as follows. 1. Evaluation of the dispersion state of the composition-20- (15) (15) 200304872 The dispersion state of the composition for the dielectric layer is based on the presence or absence of the coarse particles in the composition for the dielectric layer, and the determination of the particle size The machine (grinder), glass frit sedimentation situation is checked and evaluated. The presence or absence of coarse particles The composition of the dielectric layer is taken every dispersion time or every standing time, and a particle size measuring machine made by Tieshi Industry Co., Ltd. is used to visually confirm that it has not occurred The state of the striped surface shows the state of coarse particles that can be confirmed in the composition for a dielectric layer. Particle size measuring machine: For the particle size measuring machine, the composition for the dielectric layer is taken at each dispersion time or at each time. The particle size measuring machine manufactured by Tieshi Industry Co., Ltd. is used to determine the maximum size of the dispersed particles. Particle size. Settling of glass frit After the composition has been treated with a disperser for a certain period of time, the composition for the dielectric layer is taken every standing time, and the presence or absence of settlement of the glass particles is visually confirmed. 2. Evaluation method of the dielectric layer The evaluation of the dielectric layer is performed by measuring the withstand voltage of the dielectric layer and the surface roughness of the dielectric layer. -21-(16) (16) 200304872 Withstand voltage is used to measure the withstand voltage of a dielectric layer. A bare chip made from a composition for a dielectric layer is affixed to a glass substrate with electrodes. The upper surface of the formed dielectric layer was fired, and then an electrode for evaluation was formed to prepare a sample for withstand voltage measurement. With respect to this sample for measuring withstand voltage, a withstand voltage measuring machine manufactured by Kikusui Electronics Co., Ltd. was used to measure the withstand voltage. In addition, the applicability as a dielectric layer was judged based on whether or not the withstand voltage obtained by the measurement exceeded 0.5 kV. "○" in the table indicates those who can be used as the dielectric layer of the PDP, and "X" indicates those who cannot. The surface roughness is just on the glass substrate with electrodes, and the bare chip made from the composition for the dielectric layer is stuck on the glass substrate. Then, the dielectric layer formed by firing is used. The surface of the dielectric layer was measured and evaluated by a contact surface roughness meter made of (strand). Hereinafter, the present invention will be described using examples. (Example 1) Each component shown below was charged into a disperser and dispersed using a bead mill to prepare a composition for a white dielectric layer. The composition is taken at each dispersion time during the preparation, and the dispersion state is evaluated according to the method described above. The results are shown in Table 1 -22- (17) 200304872 Ingredients parts by weight Glass frit Glass ingredients 65% by weight (PbO / B203 / Si02 / Al2〇3 = 60/10/25/5% by weight, average particle size 1.0 μm, maximum particle size 20 μm) Ceramic material composition 35% by weight (Ti〇2 / Al2〇3 = 43 / 57% by weight) 100 Thermally decomposable adhesive 2-ethylhexyl methacrylate 40 Dispersant Partial ester of α-olefin / anhydrous maleic acid copolymer (Florien G-700 (trade name, Kyoeisha) Chemical product) 0.3 Plasticizer dibutyl adipate (manufactured by Toyo Ink Manufacturing Co., Ltd.) 0.8 Solvent toluene 50
接著，使用所得的各組成物，按下述步驟在玻璃基板 上製作白色介電體層。首先，在經以聚矽氧烷樹脂施予剝 離處理之厚度38μηι之聚對苯二甲酸乙二醇酯製剝離薄膜 上，使用刮刀塗佈機將先前所調製之各組成物加以塗佈。 接著，使用乾燥機在1 〇〇t下乾燥所得的塗膜2分鐘，以 -23- (18) (18)200304872 形成均勻的膜厚50μ m之裸片。接著，將剝離薄膜上之裸 片貼黏在附有電極之玻璃基板上之後，從裸片去除剝離薄 膜。其次，將貼黏有裸片的玻璃基板在400 °C下燒成20 分鐘，接著按每分鐘10°C之速度升溫至5 80°C，並在580 °C燒成40分鐘以製得厚度20 μ m之白色介電體層。按照 先前所說明之方法，測定所得的介電體層之耐電壓及表面 粗糙度。其結果如表1。 (實施例2) 將如下列所示的各成份裝入分散機，並使用熔珠磨使 其分散1 6小時以調製透通介電體層用組成物。就所得的 組成物之分散狀態按照先前所說明的方法加以評估。其結 果如表1。 -24- (19) 200304872 成份 重量份 玻璃料 玻璃成份 1 0 0重量％ (Pb0/B203/Si02/Al203 = 60/I0 / 25/5 重量 ％， 平均粒徑1 · 5 μ m，最大粒徑1 8 μ m ) 100 熱分解性黏合劑 聚2-乙基甲基丙烯酸己酯 15 分散劑 α -烯烴/無水馬來酸共聚物之部分酯 (弗洛連G-700 (商品名，共榮社化學（股）製） 0.3 可塑齊U 己二酸二丁酯 (東洋油墨製造（股）製） 4.5 溶劑 甲苯 3 5Next, using each of the obtained compositions, a white dielectric layer was formed on a glass substrate in the following procedure. First, each of the previously prepared compositions was coated on a peeling film made of polyethylene terephthalate with a thickness of 38 µm by a peeling treatment with a polysiloxane resin, using a doctor blade coater. Next, the obtained coating film was dried at 100 t for 2 minutes using a dryer to form a bare film having a uniform film thickness of 50 μm at -23- (18) (18) 200304872. Next, the bare film on the release film was adhered to the electrode-attached glass substrate, and then the release film was removed from the die. Next, the glass substrate with the die attached was fired at 400 ° C for 20 minutes, and then heated to 5 80 ° C at a rate of 10 ° C per minute, and fired at 580 ° C for 40 minutes to obtain a thickness. 20 μm white dielectric layer. The withstand voltage and surface roughness of the obtained dielectric layer were measured according to the methods described previously. The results are shown in Table 1. (Example 2) Each component shown below was charged into a disperser and dispersed using a bead mill for 16 hours to prepare a composition for a transparent dielectric layer. The dispersion state of the obtained composition was evaluated according to the method described previously. The results are shown in Table 1. -24- (19) 200304872 Ingredients parts by weight Glass frit Glass ingredients 100% by weight (Pb0 / B203 / Si02 / Al203 = 60 / I0 / 25/5% by weight, average particle size 1.5 μm, maximum particle size 1 8 μm) 100 Thermally decomposable adhesive poly 2-ethylhexyl methacrylate 15 Dispersant Partial ester of α-olefin / anhydrous maleic acid copolymer (Florien G-700 (trade name, Gongrong) Social Chemical Co., Ltd.) 0.3 Plastic U Dibutyl Adipate (manufactured by Toyo Ink Manufacturing Co., Ltd.) 4.5 Solvent toluene 3 5
接著，使用所得的組成物，按下述步驟在玻璃基板上 製作介電體層。首先，在經以聚矽氧烷樹脂施予剝離處理 之厚度3 8 μ m之聚對苯二甲酸乙二醇酯製剝離薄膜上，使 用刮刀塗佈機將先前所調製之組成物加以塗佈。接著，使 用乾燥機在1 〇〇°C下乾燥所得的塗膜2分鐘，以形成均勻 的膜厚6 5 μ m之裸片。接著，將剝離薄膜上之裸片貼黏在 附有電極之玻璃基板上之後’從裸片去除剝離薄膜。其次 - 25- (20) (20)200304872 ，將貼黏有裸片的玻璃基板在420°C下燒成20分鐘，接 著按每分鐘10 °c之速度升溫至620 °C，並在620 °C燒成60 分鐘以製得厚度約3 0 μ ill之透通介電體層。按照先前所說 明之評估方法，測定所得的介電體層之耐電壓及表面粗糙 度。其結果如表1。 (比較例1 ) 除不含有分散劑以外，調製由與實施例1同樣成份而 φ 成的白色介電體層用組成物，並就其分散狀態按照先前所 說明的方法加以評估。其結果如表1。 其次，按與實施例1同樣方式將所得的各組成物裸片 化，並繼續進行燒成藉以在玻璃基板上形成白色介電體層 。就所得的介電體層，按照先前所說明的方法測定耐電壓 及表面粗糙度。其結果如表1。 (比較例2 ) ^Next, using the obtained composition, a dielectric layer was formed on a glass substrate in the following procedure. First, a previously prepared composition was coated on a peeling film made of polyethylene terephthalate with a thickness of 38 μm which was subjected to a peeling treatment with a polysiloxane resin, using a doctor blade coater. . Next, the obtained coating film was dried at 100 ° C for 2 minutes using a dryer to form a bare chip having a uniform film thickness of 65 µm. Next, after the die on the release film is adhered to the electrode-attached glass substrate, the release film is removed from the die. Secondly,-25- (20) (20) 200304872, the glass substrate with the die attached is fired at 420 ° C for 20 minutes, and then heated to 620 ° C at a rate of 10 ° c per minute, and at 620 ° C was fired for 60 minutes to obtain a transparent dielectric layer having a thickness of about 30 μl. The withstand voltage and surface roughness of the obtained dielectric layer were measured according to the evaluation method described previously. The results are shown in Table 1. (Comparative Example 1) A composition for a white dielectric layer composed of the same components as in Example 1 except that it did not contain a dispersant was prepared, and its dispersion state was evaluated by the method described previously. The results are shown in Table 1. Next, each of the obtained compositions was die-formed in the same manner as in Example 1, and firing was continued to form a white dielectric layer on the glass substrate. With respect to the obtained dielectric layer, the withstand voltage and surface roughness were measured according to the methods described above. The results are shown in Table 1. (Comparative example 2) ^
除將作爲分散劑所使用的^ -烯烴/無水馬來酸共聚 物之部份酯之量作成0.01重量份以外，調製由與實施例1 同樣成份而成的白色介電體層用組成物，並就其分散狀態 按照先前所說明的方法加以評估。在此，爲評估，則使用 I 將分散時間作成1 6小時的組成物，其結果如表1。 其次，按與實施例1同樣方式將所得的組成物裸片化 ，並繼續進行燒成藉以在玻璃基板上形成白色介電體層。 就所得的介電體層’按照先前所說明的方法測定耐電壓及 - 26- (21) (21)200304872 表面粗糙度。其結果如表1。 (比較例3) 除將作爲分散劑所使用的^ -條烴/無水馬來酸共聚 物之部份酯之量作成1 〇重量份以外，調製由與實施例1 ’ 同樣成份而成的白色介電體層用組成物，並就其分散狀態 · 按照先前所說明的方法加以評估。在此，爲評估，則使用 將分散時間作成1 6小時的組成物，其結果如表1。 φ 其次，按與實施例1同樣方式將所得的組成物裸片化 ，並繼續進行燒成藉以在玻璃基板上形成白色介電體層。 就所得的介電體層，按照先前所說明的方法測定耐電壓及 表面粗糙度。其結果如表1。 (實施例3 ) 除作爲分散劑而使用脂肪族聚羧酸鈉（弗洛連G -600，共榮社化學（股）製）1.0重量份以外，其餘則與實 施例1同樣方式調製白色介電體層用組成物。就將分散時 間作成1 6小時的組成物，按照先前所說明的方法評估其 分散狀態。其結果如表1。 其次，按與實施例1同樣方式將所得的組成物裸片化 ^ ，並繼續進行燒成藉以在玻璃基板上形成白色介電體層。 就所得的介電體層，按照先前所說明的方法測定耐電壓及 表面粗糙度。其結果如表1。 -27- (22) (22)200304872 (實施例4) 除將作爲分散劑而使用脂肪族聚羧酸特殊聚矽氧烷（ 弗洛連AF — 1 005，共榮社化學（股）製）1.0重量份以外 ，其餘則與實施例1同樣方式調製白色介電體層用組成物 。就將分散時間作成1 6小時的組成物，按照先前所說明 的方法評估其分散狀態。其結果如表1。 其次，按與實施例1同樣方式將所得的組成物裸片化 ，並繼續進行燒成藉以在玻璃基板上形成白色介電體層。 就所得的介電體層，按照先前所說明的方法測定耐電壓及 表面粗糙度。其結果如表1。 (比較例4 ) 除作爲分散劑而使用油酸1 . 0重量份以外，其餘則與 實施例1同樣方式調製白色介電體層用組成物。就將分散 時間作成1 6小時的組成物，按照先前所說明的方法評估 其分散狀態。其結果如表1。 其次’按與實施例1同樣方式將所得的組成物裸片化 ’並繼續進行燒成藉以在玻璃基板上形成白色介電體層。 就所得的白色介電體層，按照先前所說明的方法測定耐電 壓及表面粗糙度。其結果如表1。 -28- 200304872 撇 表面粗糙度 Ra(p m ) CN ν〇 d tn d ο CO o r-H t/Ί d s ο 00 ο ο t> ο d cn O in 〇 〇 對介電體層之 適用性 X 〇 〇 〇 〇 〇 X X X X 〇 〇 X 耐電壓 (kV) d in d cn Ό d o Os d 00 τ—Η (Μ ο ITi <Τ) 〇· 〇\ ο (N CN 〇 00 d 〇 〇· m is a 姻3 Μ 25以上 csi o 1—1 卜· Ο in 25以上 25以上 25以上 iT) 卜· 00 〇 25以上 粗粒有無存在 相當多 少於4小時 少於8小時 鹿 壤 壊 相當多 相當多 相當多 ί_ 壊 壊 壊 熔珠磨分散時 間 4小時 8小時 i 12小時 14小時 16小時 16小時 4小時 16小時 16小時 16小時 16小時 16小時 16小時 分散劑含量 (重量份） ΓΠ d cn o' ο Γ-Η Ο ο ο ο 〇 r-H 〇 r-H 分散劑 弗洛連 1 G-700a) 弗洛連 G-700a) 壊 弗洛連 G -700a) «ό 挪孓 叙ό 弗洛連 AF-1005C) 油酸 實施例號碼 實施例1 實施例2 比較例1 比較例2 比較例3 實施例3 實施例4 比較例4Except that the amount of the partial ester of the ^ -olefin / anhydrous maleic acid copolymer used as a dispersant was 0.01 parts by weight, a composition for a white dielectric layer composed of the same components as in Example 1 was prepared, and The state of dispersion is evaluated in accordance with the method described previously. Here, for evaluation, I was used to make a composition with a dispersion time of 16 hours. The results are shown in Table 1. Next, the obtained composition was die-formed in the same manner as in Example 1, and firing was continued to form a white dielectric layer on the glass substrate. With respect to the obtained dielectric layer ', the withstand voltage and the surface roughness were measured according to the method described previously. The results are shown in Table 1. (Comparative Example 3) A white color composed of the same components as in Example 1 'was prepared except that the amount of a partial ester of the ^ -hydrocarbon / anhydrous maleic acid copolymer used as a dispersant was 10 parts by weight. The composition for the dielectric layer is evaluated for its dispersion state according to the method described previously. For evaluation, a composition having a dispersion time of 16 hours was used. The results are shown in Table 1. φ Next, the obtained composition was die-formed in the same manner as in Example 1, and firing was continued to form a white dielectric layer on the glass substrate. With respect to the obtained dielectric layer, the withstand voltage and surface roughness were measured according to the methods described above. The results are shown in Table 1. (Example 3) A white medium was prepared in the same manner as in Example 1 except that 1.0 parts by weight of an aliphatic sodium polycarboxylate (Florian G-600, manufactured by Kyoeisha Chemical Co., Ltd.) was used as a dispersant. Composition for electric layer. The dispersion time was made into a composition for 16 hours, and the dispersion state was evaluated according to the method described previously. The results are shown in Table 1. Next, the obtained composition was die-formed in the same manner as in Example 1, and firing was continued to form a white dielectric layer on the glass substrate. With respect to the obtained dielectric layer, the withstand voltage and surface roughness were measured according to the methods described above. The results are shown in Table 1. -27- (22) (22) 200304872 (Example 4) Except that aliphatic polycarboxylic acid special polysiloxane is used as a dispersant (Florien AF — 1 005, manufactured by Kyoeisha Chemical Co., Ltd.) Except for 1.0 part by weight, the composition for a white dielectric layer was prepared in the same manner as in Example 1. A composition having a dispersion time of 16 hours was used, and the dispersion state was evaluated according to the method described previously. The results are shown in Table 1. Next, the obtained composition was die-formed in the same manner as in Example 1, and firing was continued to form a white dielectric layer on the glass substrate. With respect to the obtained dielectric layer, the withstand voltage and surface roughness were measured according to the methods described above. The results are shown in Table 1. (Comparative Example 4) A composition for a white dielectric layer was prepared in the same manner as in Example 1 except that 1.0 parts by weight of oleic acid was used as a dispersant. The composition was prepared for a dispersion time of 16 hours, and the dispersion state was evaluated according to the method described previously. The results are shown in Table 1. Next, "the obtained composition was formed into a bare chip in the same manner as in Example 1" and firing was continued to form a white dielectric layer on the glass substrate. With respect to the obtained white dielectric layer, the withstand voltage and surface roughness were measured according to the methods described above. The results are shown in Table 1. -28- 200304872 Surface roughness Ra (pm) CN ν〇d tn d ο CO o rH t / Ί ds ο 00 ο ο t > ο d cn O in 〇〇 Applicability to dielectric layer X 〇〇〇〇 〇〇XXXX 〇〇X Withstand voltage (kV) d in d cn Ό do Os d 00 τ—Η (Μ ο ITi < T) 〇 · 〇 \ ο (N CN 〇00 d 〇〇 · m is a marriage 3 Μ 25 or more csi o 1-1 BU · 〇in 25 or more 25 or more 25 or more iT) Bu 00 or more or not 25 or more coarse grains exist 4 or less than 8 hours Deer soil 壊 壊 多 相当 相当 相当 _ 壊壊 壊 Molten bead mill dispersion time 4 hours 8 hours i 12 hours 14 hours 16 hours 16 hours 4 hours 16 hours 16 hours 16 hours 16 hours 16 hours 16 hours Dispersant content (parts by weight) ΓΠ d cn o 'ο Γ-Η Ο ο ο ο 〇rH 〇rH Dispersant Florian 1 G-700a) Florian G-700a) 壊 Florian G-700a) «ό Norwegian 孓 Florian AF-1005C) Example of oleic acid Number Example 1 Example 2 Comparative Example 1 Comparative Example 2 Comparative Example 3 Example 3 Example 4 Comparative Example 4
-29- (24) (24)200304872 由表1可知，如將規定量之聚羧酸系高分子化合物作 爲分散劑使用時，組成物將呈現優異的分散狀態，且從這 種組成物所形成的介電體層則具有優異的特性之事實（參 照實施例1至4)。又可知，即使作爲分散劑而使用聚羧 酸系高分子化合物時，如其含量不恰當，仍難於獲得組成 物之良好的分散狀態或難於達成所需要的耐電壓特性之事 實（參照比較例2及3 )。另外，隨著分散時間之增加而 最大粒徑在減少之現象，表示經凝聚的粒子已被解除凝聚 而分散性已獲改善之意。 另一方面，在組成物中不存在分散劑的比較例1中， 並未能成爲良好的分散狀態。又，可知即使延長分散時間 ’其分散性仍不獲改善，玻璃料引起二次凝聚而增大最大 粒徑値且耐電壓特性會降低的事實。再者，由比較例4可 知，在分子內所存在的羧酸基爲1個之油酸中，其分散效 果不足。 (實施例5 ) 將在實施例1所調製之分散時間爲1 6小時之組成物 ，在23°C、50%RH (相對濕度）之條件下放置，並確認經 過既定時間後之玻璃料之沈降情形。其結果如表2。 (比較例5 ) 將在比較例1所調製之分散時間爲1 6小時之組成物 ，在23°C、50%RH之條件下放置，並確認經過既定時間 -30- (25) 200304872 後之玻璃料之沈降情形。其結果如表2。 (比較例6) 將在比較例2所調製之分散時間爲丨6小時之組成物 ，在23°C、50%RH之條件下放置，並確認經過既定時間 後之玻璃料之沈降情形。其結果如表2。 表 2-29- (24) (24) 200304872 As can be seen from Table 1, if a predetermined amount of a polycarboxylic acid-based polymer compound is used as a dispersant, the composition will exhibit an excellent dispersion state, and it will be formed from this composition The fact that the dielectric layer has excellent characteristics (refer to Examples 1 to 4). It is also known that even when a polycarboxylic acid-based polymer compound is used as a dispersant, if the content is not appropriate, it is difficult to obtain a good dispersion state of the composition or to achieve the required withstand voltage characteristics (see Comparative Examples 2 and 2). 3). In addition, the phenomenon that the maximum particle size decreases with increasing dispersion time indicates that the aggregated particles have been deagglomerated and the dispersibility has been improved. On the other hand, in Comparative Example 1 in which no dispersant was present in the composition, it did not become a good dispersed state. In addition, it was found that even if the dispersion time was prolonged, the dispersibility was not improved, the glass frit caused secondary agglomeration, the maximum particle diameter was increased, and the withstand voltage characteristics were reduced. Further, it is understood from Comparative Example 4 that the oleic acid having one carboxylic acid group existing in the molecule has insufficient dispersion effect. (Example 5) The composition prepared in Example 1 with a dispersion time of 16 hours was placed under the conditions of 23 ° C and 50% RH (relative humidity), and the glass frit after the predetermined time passed was confirmed. Settlement situation. The results are shown in Table 2. (Comparative Example 5) The composition prepared in Comparative Example 1 with a dispersion time of 16 hours was left to stand at 23 ° C and 50% RH, and it was confirmed that the predetermined time had passed after -30- (25) 200304872. Settling of glass frit. The results are shown in Table 2. (Comparative Example 6) The composition prepared in Comparative Example 2 with a dispersion time of 6 hours was placed under the conditions of 23 ° C and 50% RH, and the settlement of the glass frit after a predetermined time was confirmed. The results are shown in Table 2. Table 2
實施例 號碼 放置 時間 沈 降 粗粒有無 存在 粒度測 定機値 (μηι ) 耐電壓 (kV ) 適用 性 實施例 5 剛分散後 Μ y 1 ΛΝ /fnT τπτ： 7.5 0.95 〇 2星期後 /frrr Μ 魅 J\\\ 7.5 0.95 〇 4星期後 Μ J\S\ ίΕΕ J\\\ 7.5 0.95 〇 比較例 5 剛分散後 Μ j\\\ 相當多 25以上 0.35 X 2星期後 有 相當多 25以上 不能測定* X 比較例 6 剛分散後 Μ 相當多 25以上 0.39 X 2星期後 有 相當多 25以上 不能測定* X 比較例 7 剛分散後 Μ j \ \\ 多 25以上 0.44 X 2星期後 有 相當多 25以上 0.38 X *未能成膜者。 由表2可知，在含有規定量之聚羧酸系高分子化合物 的實施例5中，能長期維持良好的分散狀態。其結果，即 -31 - (26) 200304872 使使用經放置4星期的組成物以形成介電體層 之最大粒徑之値仍然在容許範圍內（20μηι以 形成的介電體層維持有高的耐電壓特性。 相當於此，可知在組成物中不存在分散劑 中’由於玻璃料會引起二次凝聚之故，耐電壓 實。又，如比較例6所示，可知即使作爲分散 羧酸系高分子化合物時，如其含量不足，即難 物之良好的分散狀態之事實。再者，由比較例 分子內所存在的羧酸基爲1個之油酸的情形， 不足的事實。另外，雖分別再度攪拌經確認有 降的放置2星期後之介電體層用組成物，惟各 能恢復剛分散後之狀態。 如上所說明，如採用本發明，而在爲形成 組成物中含有能提高如玻璃料等之高比重之粒 的聚羧酸系高分子化合物，即能有效改善組成 料之分散狀態。因而，能以優異的分散狀態調 且抑制所得的分散液之二次凝聚之故，即使保 仍然不會發生沈降而能維持良好的分散狀態。 又，如將本發明之介電體層用組成物裸片 在玻璃基板上，加以燒成，即能容易在玻璃基 有所需要的耐電壓特性的介電體層。 再者，如將具備有使用本發明之介電體組 之耐電壓特性優異的介電體層之玻璃基板作怎 件使用，即能實現對PDP使用時之電漿放電 時，玻璃料 下），而所 的比較例5 會降低的事 劑而使用聚 於維持組成 7可知，在 其分散效果 玻璃料之沈 組成物均未 介電體層之 子之分散性 物中之玻璃 製組成物， 存長時間後 化，並貼黏 板上形成具 成物所形成 ;PDP用構 電壓具有耐 -32- (27) (27)200304872 性，且單元缺陷少的高品質PDP。 本發明所揭示之內容已在最佳實施形態中詳細說明’ 故同行從業人員可在不脫離本發明之主旨的範圍內可做變 更或修改，惟這種變更或修改均屬於本發明之精神所在。 【圖式簡單說明】 第1圖··表示PDP構造之一例的剖面圖。 第2圖：說明PDP用構件之製作例的過程圖，而（a )至（c)係表示形成介電體層的主要過程者。 【主要元件對照表】 1 前面板用玻璃基板 2 後面板用玻璃基板 3 透通電極 4 位址電極 5 透通介電體層 6 白色介電體層 7 保護膜 8 隔板 9 螢光體 10 剝離薄膜 11 剝離薄膜 12 裸片 13 片狀形成物 -33-Example number Presence of settling coarse particles Presence or absence of particle size measuring machine (μηι) Withstand voltage (kV) Applicability Example 5 M y 1 ΛN / fnT τπτ immediately after dispersion: 7.5 0.95 〇2 weeks later / frrr Μ charm J \ \\ 7.5 0.95 〇4 weeks later Μ J \ S \ ίΕΕ J \\\ 7.5 0.95 〇 Comparative Example 5 Immediately after dispersion Μ j \\\ Quite a lot more than 25 0.35 X After 2 weeks, quite a lot more than 25 cannot be measured * X Comparative Example 6 M was quite large immediately after dispersing 25 or more and 0.39 X 2 weeks later was quite large and 25 or more could not be measured * X Comparative Example 7 M was immediately after dispersing M j \ \\ 25 or more 0.44 X 2 weeks later was quite 25 or more 0.38 X * failed to form a film. As can be seen from Table 2, in Example 5 containing a predetermined amount of a polycarboxylic acid-based polymer compound, a good dispersion state can be maintained for a long period of time. As a result, -31-(26) 200304872 kept the maximum particle size of the dielectric layer formed by using the composition left for 4 weeks to remain within the allowable range (20 μηι to form a dielectric layer with a high withstand voltage Characteristics. Corresponding to this, it is found that the dispersant does not exist in the composition. 'The glass frit causes secondary agglomeration, and the withstand voltage is high. Moreover, as shown in Comparative Example 6, it is understood that even as a dispersed carboxylic polymer In the case of a compound, if the content is insufficient, it means the fact that the hard substance is well dispersed. In addition, the fact that the carboxylic acid group existing in the molecule of the comparative example is one oleic acid is not sufficient. In addition, although it is stirred again separately It has been confirmed that the composition for the dielectric layer after being left for 2 weeks can be restored to the state immediately after dispersion. As described above, if the present invention is used, the composition for forming the composition can improve the glass frit, etc. The high specific gravity of the polycarboxylic acid-based polymer compound can effectively improve the dispersion state of the composition. Therefore, it can adjust and suppress the secondary coagulation of the obtained dispersion liquid in an excellent dispersion state. Therefore, even if sedimentation does not occur, a good dispersion state can be maintained. Moreover, if the composition die for a dielectric layer of the present invention is sintered on a glass substrate and fired, it can be easily obtained on a glass substrate. A dielectric layer having a required withstand voltage characteristic. Furthermore, if a glass substrate provided with a dielectric layer having an excellent withstand voltage characteristic using the dielectric group of the present invention is used, what kind of component can be used to realize the use of a PDP. During plasma discharge, under the glass frit), in Comparative Example 5, the reducing agent was used to maintain the composition 7. It can be seen that in its dispersion effect, the glass frit composition does not have a dispersant of the dielectric layer. The glass composition is formed after storage for a long period of time, and formed by forming objects on the adhesive board; the structure voltage of PDP has a resistance of -32- (27) (27) 200304872, and high quality with few unit defects PDP. The content disclosed in the present invention has been described in detail in the best embodiment. Therefore, the practitioners in the industry can make changes or modifications within the scope not departing from the gist of the present invention, but such changes or modifications belong to the spirit of the present invention. . [Brief Description of the Drawings] Fig. 1 is a cross-sectional view showing an example of a PDP structure. FIG. 2 is a process diagram illustrating an example of manufacturing a member for a PDP, and (a) to (c) show main processes for forming a dielectric layer. [Comparison table of main components] 1 Glass substrate for front panel 2 Glass substrate for rear panel 3 Transparent electrode 4 Address electrode 5 Transparent dielectric layer 6 White dielectric layer 7 Protective film 8 Separator 9 Phosphor 10 Peeling film 11 Release film 12 Die 13 Sheet-shaped product -33-