TW197985B - - Google Patents
Info
- Publication number
- TW197985B TW197985B TW081100211A TW81100211A TW197985B TW 197985 B TW197985 B TW 197985B TW 081100211 A TW081100211 A TW 081100211A TW 81100211 A TW81100211 A TW 81100211A TW 197985 B TW197985 B TW 197985B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US1991/008777 WO1993010652A1 (en) | 1991-11-22 | 1991-11-22 | Process for improved adhesion between a metallic oxide and a polymer surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW197985B true TW197985B (zh) | 1993-01-11 |
Family
ID=22225987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW081100211A TW197985B (zh) | 1991-11-22 | 1992-01-14 |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW197985B (zh) |
| WO (1) | WO1993010652A1 (zh) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5492595A (en) * | 1994-04-11 | 1996-02-20 | Electrochemicals, Inc. | Method for treating an oxidized copper film |
| US6878628B2 (en) | 2000-05-15 | 2005-04-12 | Asm International Nv | In situ reduction of copper oxide prior to silicon carbide deposition |
| US6679951B2 (en) | 2000-05-15 | 2004-01-20 | Asm Intenational N.V. | Metal anneal with oxidation prevention |
| US7494927B2 (en) | 2000-05-15 | 2009-02-24 | Asm International N.V. | Method of growing electrical conductors |
| EP1282911B1 (en) | 2000-05-15 | 2018-09-05 | Asm International N.V. | Process for producing integrated circuits |
| US9139906B2 (en) | 2001-03-06 | 2015-09-22 | Asm America, Inc. | Doping with ALD technology |
| US7491634B2 (en) | 2006-04-28 | 2009-02-17 | Asm International N.V. | Methods for forming roughened surfaces and applications thereof |
| US7202166B2 (en) | 2003-08-04 | 2007-04-10 | Asm America, Inc. | Surface preparation prior to deposition on germanium |
| US7067407B2 (en) | 2003-08-04 | 2006-06-27 | Asm International, N.V. | Method of growing electrical conductors |
| EP1851794A1 (en) | 2005-02-22 | 2007-11-07 | ASM America, Inc. | Plasma pre-treating surfaces for atomic layer deposition |
| US8025922B2 (en) | 2005-03-15 | 2011-09-27 | Asm International N.V. | Enhanced deposition of noble metals |
| US7666773B2 (en) | 2005-03-15 | 2010-02-23 | Asm International N.V. | Selective deposition of noble metal thin films |
| KR101379015B1 (ko) | 2006-02-15 | 2014-03-28 | 한국에이에스엠지니텍 주식회사 | 플라즈마 원자층 증착법을 이용한 루테늄 막 증착 방법 및고밀도 루테늄 층 |
| US8545936B2 (en) | 2008-03-28 | 2013-10-01 | Asm International N.V. | Methods for forming carbon nanotubes |
| US9379011B2 (en) | 2008-12-19 | 2016-06-28 | Asm International N.V. | Methods for depositing nickel films and for making nickel silicide and nickel germanide |
| US7927942B2 (en) | 2008-12-19 | 2011-04-19 | Asm International N.V. | Selective silicide process |
| US8871617B2 (en) | 2011-04-22 | 2014-10-28 | Asm Ip Holding B.V. | Deposition and reduction of mixed metal oxide thin films |
| US9607842B1 (en) | 2015-10-02 | 2017-03-28 | Asm Ip Holding B.V. | Methods of forming metal silicides |
| CN117690869B (zh) * | 2024-01-30 | 2024-05-07 | 安徽大学 | 一种在空气环境中的铜-铜低温直接键合方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5106454A (en) * | 1990-11-01 | 1992-04-21 | Shipley Company Inc. | Process for multilayer printed circuit board manufacture |
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1991
- 1991-11-22 WO PCT/US1991/008777 patent/WO1993010652A1/en active Application Filing
-
1992
- 1992-01-14 TW TW081100211A patent/TW197985B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO1993010652A1 (en) | 1993-05-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |