TR200002488A2 - Laser şokuyla gravürlemede sınırlandırıcı madde akımını oluşturmak ve kontrol etmek için yöntem. - Google Patents

Laser şokuyla gravürlemede sınırlandırıcı madde akımını oluşturmak ve kontrol etmek için yöntem.

Info

Publication number
TR200002488A2
TR200002488A2 TR2000/02488A TR200002488A TR200002488A2 TR 200002488 A2 TR200002488 A2 TR 200002488A2 TR 2000/02488 A TR2000/02488 A TR 2000/02488A TR 200002488 A TR200002488 A TR 200002488A TR 200002488 A2 TR200002488 A2 TR 200002488A2
Authority
TR
Turkey
Prior art keywords
workpiece
etching
limiting agent
laser shock
generating
Prior art date
Application number
TR2000/02488A
Other languages
English (en)
Inventor
Lee Lawrence Wayne
Eugene Klaassen Richard
Original Assignee
General Electric Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Company filed Critical General Electric Company
Publication of TR200002488A2 publication Critical patent/TR200002488A2/tr

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01DNON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
    • F01D5/00Blades; Blade-carrying members; Heating, heat-insulating, cooling or antivibration means on the blades or the members
    • F01D5/12Blades
    • F01D5/28Selecting particular materials; Particular measures relating thereto; Measures against erosion or corrosion
    • F01D5/286Particular treatment of blades, e.g. to increase durability or resistance against corrosion or erosion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462Nozzles; Features related to nozzles
    • B23K26/1464Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/147Features outside the nozzle for feeding the fluid stream towards the workpiece
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D10/00Modifying the physical properties by methods other than heat treatment or deformation
    • C21D10/005Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F05INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
    • F05DINDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
    • F05D2230/00Manufacture
    • F05D2230/20Manufacture essentially without removing material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02TCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T50/00Aeronautics or air transport
    • Y02T50/60Efficient propulsion technologies, e.g. for aircraft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Laser Beam Processing (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)

Abstract

Bir is parçasinin (108) laser sokuyla gravürlenmesi (LSP) sirasinda bir sinirlandirici madde (121) akitmak için bir seffaf sinirlandirici madde memesinin (123) yerlestirilmesi için yöntemdir asagidaki asamalardan olusur; A asamsi) sinirlandirici maddeyi (121) akitmak için bir akim orani ayarlamak, B asamasi) sinirlandirici maddenin (121) memeden (123) geçerek korelasyon yüzeyine (154) akmasi içiin memeyi (123) konumlandirmak, ve C asamasi) is parçasinin korelasyon yüzeyinin (154) aksi tarafindaki yanina (148) takilmis bir ultrasonik trasdüktör (20) kullanilarak korelasyon yüzeyi (154) üzerindeki sinirlandirci madde kalinliginin (T) ölçülmesi, Ultrasonik transdüktör (20) test parçasinin korelasyon yüzeyinin (154) aksi tarafindaki yanina (148) takilmistir. Bir tasarimdaki is parçasi (108) test parçasi ve korelasyon yüzeyini (154) is parçasinin (108) ilk tarafinda bulunan ilk laser sok gravür yüzeyi (154) olarak uygulanmaktadir.
TR2000/02488A 1999-08-30 2000-08-25 Laser şokuyla gravürlemede sınırlandırıcı madde akımını oluşturmak ve kontrol etmek için yöntem. TR200002488A2 (tr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/385,399 US6333488B1 (en) 1999-08-30 1999-08-30 Method for setting up and controlling confinement media flow in laser shock peening

Publications (1)

Publication Number Publication Date
TR200002488A2 true TR200002488A2 (tr) 2001-04-20

Family

ID=23521226

Family Applications (1)

Application Number Title Priority Date Filing Date
TR2000/02488A TR200002488A2 (tr) 1999-08-30 2000-08-25 Laser şokuyla gravürlemede sınırlandırıcı madde akımını oluşturmak ve kontrol etmek için yöntem.

Country Status (7)

Country Link
US (1) US6333488B1 (tr)
EP (1) EP1081239B1 (tr)
JP (1) JP2001174245A (tr)
BR (1) BR0003861A (tr)
DE (1) DE60011716T2 (tr)
PL (1) PL342157A1 (tr)
TR (1) TR200002488A2 (tr)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6616041B1 (en) * 2000-02-28 2003-09-09 General Electric Company Part marking method applicable to industrial parts
US6833851B1 (en) * 2000-06-06 2004-12-21 Garmin Corporation GPS Receiver and depth sounder unit having an adjustable display screen
US6422082B1 (en) * 2000-11-27 2002-07-23 General Electric Company Laser shock peening quality assurance by ultrasonic analysis
US6657160B2 (en) * 2001-01-25 2003-12-02 The Regents Of The University Of California Laser peening of components of thin cross-section
US20040157803A1 (en) * 2002-03-04 2004-08-12 Williams Deryck J. Nematicidal fatty acid and fatty acid ester related compounds
US6887900B2 (en) * 2002-03-04 2005-05-03 Divergence, Inc. Nematicidal compositions and methods
US6713716B1 (en) * 2003-05-30 2004-03-30 General Electric Company Reduced mist laser shock peening
US6969821B2 (en) * 2003-06-30 2005-11-29 General Electric Company Airfoil qualification system and method
US7148448B2 (en) * 2003-10-31 2006-12-12 General Electric Company Monitored laser shock peening
US7893386B2 (en) * 2003-11-14 2011-02-22 Hewlett-Packard Development Company, L.P. Laser micromachining and methods of same
US8182501B2 (en) 2004-02-27 2012-05-22 Ethicon Endo-Surgery, Inc. Ultrasonic surgical shears and method for sealing a blood vessel using same
US7923658B2 (en) 2004-09-13 2011-04-12 Hewlett-Packard Development Company, L.P. Laser micromachining methods and systems
MX2007004151A (es) 2004-10-08 2007-09-11 Johnson & Johnson Instrumento quirurgico ultrasonico.
US7304266B2 (en) * 2004-12-09 2007-12-04 General Electric Company Laser shock peening coating with entrapped confinement medium
JP4805626B2 (ja) * 2005-07-28 2011-11-02 四国電力株式会社 気中ピーニング加工装置および加工方法
US20070191713A1 (en) 2005-10-14 2007-08-16 Eichmann Stephen E Ultrasonic device for cutting and coagulating
US7621930B2 (en) 2006-01-20 2009-11-24 Ethicon Endo-Surgery, Inc. Ultrasound medical instrument having a medical ultrasonic blade
US8057498B2 (en) 2007-11-30 2011-11-15 Ethicon Endo-Surgery, Inc. Ultrasonic surgical instrument blades
US8911460B2 (en) 2007-03-22 2014-12-16 Ethicon Endo-Surgery, Inc. Ultrasonic surgical instruments
US8142461B2 (en) 2007-03-22 2012-03-27 Ethicon Endo-Surgery, Inc. Surgical instruments
US8523889B2 (en) 2007-07-27 2013-09-03 Ethicon Endo-Surgery, Inc. Ultrasonic end effectors with increased active length
US8808319B2 (en) 2007-07-27 2014-08-19 Ethicon Endo-Surgery, Inc. Surgical instruments
US8430898B2 (en) 2007-07-31 2013-04-30 Ethicon Endo-Surgery, Inc. Ultrasonic surgical instruments
US9044261B2 (en) 2007-07-31 2015-06-02 Ethicon Endo-Surgery, Inc. Temperature controlled ultrasonic surgical instruments
US8512365B2 (en) 2007-07-31 2013-08-20 Ethicon Endo-Surgery, Inc. Surgical instruments
US7816622B2 (en) * 2007-09-28 2010-10-19 General Electric Company System and method for controlling laser shock peening
EP2796102B1 (en) 2007-10-05 2018-03-14 Ethicon LLC Ergonomic surgical instruments
US10010339B2 (en) 2007-11-30 2018-07-03 Ethicon Llc Ultrasonic surgical blades
US9700339B2 (en) 2009-05-20 2017-07-11 Ethicon Endo-Surgery, Inc. Coupling arrangements and methods for attaching tools to ultrasonic surgical instruments
US8951272B2 (en) 2010-02-11 2015-02-10 Ethicon Endo-Surgery, Inc. Seal arrangements for ultrasonically powered surgical instruments
US8486096B2 (en) 2010-02-11 2013-07-16 Ethicon Endo-Surgery, Inc. Dual purpose surgical instrument for cutting and coagulating tissue
FR2960807B1 (fr) 2010-06-03 2013-04-05 Snecma Procede d'usinage de temoins d'usure pour une aube de rotor, bouchon pour aube de rotor pour la mise en oeuvre du procede
CN102052888B (zh) * 2010-10-12 2012-11-21 大连大显精密轴有限公司 多台阶径综合测量仪
US9820768B2 (en) 2012-06-29 2017-11-21 Ethicon Llc Ultrasonic surgical instruments with control mechanisms
CN103028839B (zh) * 2012-12-28 2015-10-28 江苏大学 一种控制液体约束层厚度的激光冲击方法及装置
CN103111751B (zh) * 2012-12-31 2015-12-02 江苏大学 一种脉冲激光连续冲击温成形的方法及装置
US10226273B2 (en) 2013-03-14 2019-03-12 Ethicon Llc Mechanical fasteners for use with surgical energy devices
CN103468925B (zh) * 2013-08-29 2014-11-05 温州大学 一种飞机叶片榫槽底部平面激光冲击强化方法和装置
GB2521229A (en) 2013-12-16 2015-06-17 Ethicon Endo Surgery Inc Medical device
CN103740894A (zh) * 2013-12-31 2014-04-23 唐山轨道客车有限责任公司 一种激光冲击强化装置及其喷水管
US20160262786A1 (en) * 2015-03-10 2016-09-15 Ethicon Endo-Surgery, Llc Surgical blades with fatigue resistant properties
US11020140B2 (en) 2015-06-17 2021-06-01 Cilag Gmbh International Ultrasonic surgical blade for use with ultrasonic surgical instruments
US10357303B2 (en) 2015-06-30 2019-07-23 Ethicon Llc Translatable outer tube for sealing using shielded lap chole dissector
EP3150323B1 (en) * 2015-09-30 2020-11-18 Kabushiki Kaisha Toshiba Laser processing apparatus, laser processing method and distance measurement method
US10245064B2 (en) 2016-07-12 2019-04-02 Ethicon Llc Ultrasonic surgical instrument with piezoelectric central lumen transducer
US10893883B2 (en) 2016-07-13 2021-01-19 Ethicon Llc Ultrasonic assembly for use with ultrasonic surgical instruments
USD847990S1 (en) 2016-08-16 2019-05-07 Ethicon Llc Surgical instrument
US10952759B2 (en) 2016-08-25 2021-03-23 Ethicon Llc Tissue loading of a surgical instrument
US10736649B2 (en) 2016-08-25 2020-08-11 Ethicon Llc Electrical and thermal connections for ultrasonic transducer
EP3515648B1 (en) * 2016-09-23 2023-03-22 Tata Steel Nederland Technology B.V. Method of and arrangement for the liquid-assisted laser texturing of moving steel strip
US10603064B2 (en) 2016-11-28 2020-03-31 Ethicon Llc Ultrasonic transducer
US10820920B2 (en) 2017-07-05 2020-11-03 Ethicon Llc Reusable ultrasonic medical devices and methods of their use
CN108655569B (zh) * 2018-04-13 2020-06-26 江苏大学 一种水下激光冲击无模具渐进成形装置和方法
CN110257623B (zh) * 2019-07-09 2021-04-20 中国航发北京航空材料研究院 一种轴承外圈的激光冲击强化方法及其装置
CN110614448B (zh) * 2019-08-29 2021-05-25 江苏大学 一种用于多种叶片激光冲击的变形抑制夹具
CN111906438B (zh) * 2020-06-19 2022-04-15 宁波大艾激光科技有限公司 一种随动式激光冲击强化处理装置及其方法
CN111872565B (zh) * 2020-08-19 2022-05-17 中国人民解放军空军工程大学 适用于大型零部件的现场激光冲击水约束层施加装置及施加方法
WO2022242384A1 (zh) * 2021-05-17 2022-11-24 武汉大学 基于液滴约束的激光冲击方法及其应用
CN114990323B (zh) * 2022-04-21 2023-10-31 河南机电职业学院 磁水双约束脉冲激光冲击强化方法及***

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4750117A (en) 1984-12-13 1988-06-07 Surface Systems, Inc. Ultrasonic depth measurement apparatus and methods
US4937421A (en) 1989-07-03 1990-06-26 General Electric Company Laser peening system and method
US5463905A (en) 1993-02-23 1995-11-07 Baird; James D. Portable non-invasive flowmeter for partially filled pipe
US6215097B1 (en) 1994-12-22 2001-04-10 General Electric Company On the fly laser shock peening
US5744781A (en) 1995-08-07 1998-04-28 General Electric Company Method and apparatus for laser shock peening
US6057003A (en) * 1995-10-23 2000-05-02 Lsp Technologies, Inc. Peening process with reduction of dielectric breakdown to increase peak pressure pulse
DE19801013B4 (de) 1998-01-14 2005-06-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Abtragung von Oberflächenschichten mittels deckschichtenverstärkter laserinduzierter Schockwellen

Also Published As

Publication number Publication date
EP1081239A1 (en) 2001-03-07
PL342157A1 (en) 2001-03-12
DE60011716D1 (de) 2004-07-29
JP2001174245A (ja) 2001-06-29
EP1081239B1 (en) 2004-06-23
BR0003861A (pt) 2001-04-03
US6333488B1 (en) 2001-12-25
DE60011716T2 (de) 2005-06-30

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