SU519498A1 - Solution for chemical nickel plating - Google Patents
Solution for chemical nickel platingInfo
- Publication number
- SU519498A1 SU519498A1 SU2050062A SU2050062A SU519498A1 SU 519498 A1 SU519498 A1 SU 519498A1 SU 2050062 A SU2050062 A SU 2050062A SU 2050062 A SU2050062 A SU 2050062A SU 519498 A1 SU519498 A1 SU 519498A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solution
- chemical nickel
- nickel plating
- thionalide
- acetic acid
- Prior art date
Links
Description
(54) РАСТВОР ДЛЯ ХИМИЧЕСКОГО НИКЕЛИРОВАНИЯ(54) SOLUTION FOR CHEMICAL NICKELING
покрыти ми, работающими в услови х агресивных сред и повышенных температур.coatings operating under aggressive media and elevated temperatures.
Пример. Образцы из стали 20 погружают в раствор, содержащий 20 г/л сернокислого никел , 25 г/л гипофосфита натри , 45 г/л сернокислого аммони , 20 мл/л уксусной кислоты , 1,5 г/л малеинового ангидрида и 0,002 г/л тионалида. Процесс ведут при рН 5,0, температуре 90°С, плотности загрузки 1 , в ванне объемом 5 л в течение 10 час с корректировкой раствора в гор чем состо нии после каждого часа работы. Скорость осаждени измен лась от 30 до 28 мкм/час. Раствор полностью стабилен. Полученные покрыти прочно сцеплены с основой.Example. Samples of steel 20 are immersed in a solution containing 20 g / l nickel sulphate, 25 g / l sodium hypophosphite, 45 g / l ammonium sulphate, 20 ml / l acetic acid, 1.5 g / l maleic anhydride and 0.002 g / l thionalide. The process is carried out at a pH of 5.0, a temperature of 90 ° C, a loading density of 1, in a 5 liter bath for 10 hours with the adjustment of the solution in a hot state after each hour of operation. The deposition rate varied from 30 to 28 µm / h. The solution is completely stable. The coatings obtained are strongly bonded to the substrate.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU2050062A SU519498A1 (en) | 1974-08-01 | 1974-08-01 | Solution for chemical nickel plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU2050062A SU519498A1 (en) | 1974-08-01 | 1974-08-01 | Solution for chemical nickel plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU519498A1 true SU519498A1 (en) | 1976-06-30 |
Family
ID=20592970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU2050062A SU519498A1 (en) | 1974-08-01 | 1974-08-01 | Solution for chemical nickel plating |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU519498A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6933231B1 (en) * | 2004-06-28 | 2005-08-23 | Micron Technology, Inc. | Methods of forming conductive interconnects, and methods of depositing nickel |
-
1974
- 1974-08-01 SU SU2050062A patent/SU519498A1/en active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6933231B1 (en) * | 2004-06-28 | 2005-08-23 | Micron Technology, Inc. | Methods of forming conductive interconnects, and methods of depositing nickel |
| US7358170B2 (en) | 2004-06-28 | 2008-04-15 | Micron Technology, Inc. | Methods of forming conductive interconnects, and methods of depositing nickel |
| US7820545B2 (en) | 2004-06-28 | 2010-10-26 | Micron Technology, Inc. | Methods of forming conductive interconnects |
| US8062969B2 (en) | 2004-06-28 | 2011-11-22 | Micron Technology, Inc. | Methods of selectively growing nickel-containing materials |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1177204A (en) | Process and composition for the immersion deposition of gold | |
| US4233107A (en) | Ultra-black coating due to surface morphology | |
| Nakahara | The Preparation and Properties of N-Salicylideneglycinato-aquo-copper (II), Sodium N-Salicylideneglycylglycinato-cuprate (II) and Related Compounds | |
| US4361630A (en) | Ultra-black coating due to surface morphology | |
| CA1222511A (en) | Diazonium affinity matrixes | |
| SU519498A1 (en) | Solution for chemical nickel plating | |
| JPS605672B2 (en) | Treatment method for black chromate coating | |
| JPS6256859B2 (en) | ||
| SU452631A1 (en) | Solution for chemical lead plating and its alloys | |
| SU406967A1 (en) | METALS ON ALUMINUM SURFACE | |
| SU1135804A1 (en) | Aqueous acid solution for chemical nickel plating | |
| US4028116A (en) | Solution for electroless chrome alloy plating | |
| SU397562A1 (en) | FOUNDATION | |
| SU492595A1 (en) | Chemical Gilding Solution | |
| GB604644A (en) | Improvements in or relating to the metallising of non-metallic bodies | |
| SU590368A1 (en) | Solution for chemical nickel-plating | |
| SU1315407A1 (en) | Method for metal deposition on dielectric articles | |
| JPS59205464A (en) | Whisker for metal composite material | |
| SU1423625A1 (en) | Solution for electroless nickel plating | |
| SU1558459A1 (en) | Method of preparing iron catalyst for hydrogenation of phenylacetylene | |
| SU1399371A1 (en) | Solution for chemical gold plating | |
| SU1477783A1 (en) | Chemical copper-plating composition | |
| RU2212471C1 (en) | Method of making metal coats on ferrites, ceramics and ferrito-ceramics | |
| SU1014978A1 (en) | Aqueous solution for chemical deposition of metal coatings | |
| FR2444691A1 (en) | PROCESS FOR PREPARING THE SURFACE OF A POLYAMIDE SUBSTRATE TO RECEIVE A CHEMICAL DEPOSIT |