SU240792A1 - SOLUTION FOR THE POISONING OF MONOXIDE SILICON - Google Patents
SOLUTION FOR THE POISONING OF MONOXIDE SILICONInfo
- Publication number
- SU240792A1 SU240792A1 SU1193778A SU1193778A SU240792A1 SU 240792 A1 SU240792 A1 SU 240792A1 SU 1193778 A SU1193778 A SU 1193778A SU 1193778 A SU1193778 A SU 1193778A SU 240792 A1 SU240792 A1 SU 240792A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solution
- poisoning
- weight
- monoxide
- monoxide silicon
- Prior art date
Links
- UGFAIRIUMAVXCW-UHFFFAOYSA-N carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 title 1
- 230000000607 poisoning Effects 0.000 title 1
- 231100000572 poisoning Toxicity 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N HF Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- LIVNPJMFVYWSIS-UHFFFAOYSA-N Silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 8
- 238000005530 etching Methods 0.000 description 5
- LDDQLRUQCUTJBB-UHFFFAOYSA-N Ammonium fluoride Chemical compound [NH4+].[F-] LDDQLRUQCUTJBB-UHFFFAOYSA-N 0.000 description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000001681 protective Effects 0.000 description 1
Description
Известен раствор дл травлени моноокиси кремни , исиользуемый, наиример, при изготовлении элементов печатных схем, содержащий фтористоводородную кислоту и фтористый аммоний.A known solution for etching silicon monoxide, which is used, is naimer, in the manufacture of elements of printed circuits, containing hydrofluoric acid and ammonium fluoride.
Цель изобретени - увеличение скорости процесса травлени и повышение качества вытравливаемых фигур.The purpose of the invention is to increase the speed of the etching process and improve the quality of the etched shapes.
Достигаетс это, тем, что в раствор, содержащий 2-22 вес. ч. 48%-ной фтористоводородной кислоты, 6-36 вес. ч. фтористого аммони и 12-108 вес. ч. воды, добавл ют 201-22 вес. ч. 30%-ной перекиси водорода.This is achieved by the fact that in a solution containing 2-22 weight. including 48% hydrofluoric acid, 6-36 weight. am ammonium fluoride and 12-108 weight. including water, add 201-22 weight. including 30% hydrogen peroxide.
Раствор ие разрущает защитную пленку фоторезиста, используемую в качестве маски в процессе травлени . Это улучшает качество вытравливаемых фигур на поверхности пленки моноокиси кремни , скорость травлени при этом увеличиваетс в 30-40 раз. РастворThe solution destroys the protective film of the photoresist used as a mask in the etching process. This improves the quality of etched patterns on the surface of the silicon monoxide film, and the etching rate increases by 30–40 times. Solution
может быть использован при нзгоговлении соединительных проводников многослойных пленочных схем и конденсаторов с диэлектриком из моноокиси кремни . It can be used for fixing the connecting conductors of multilayer film circuits and capacitors with a silicon monoxide dielectric.
Предмет изобретени Subject invention
Раствор дл травлени моноокиси кремни , используемый, например, при изготовленииThe solution for etching silicon monoxide, used, for example, in the manufacture of
элементов печатных схем, содержащий фтористоводородную кислоту и фтористый аммоний , отличающийс тем, что, с 1елью увеличени скорости процесса травлеин и повышен 1 качества вытравливаемых фигур, в раствор , содержащий 2-22 вес. ч. 48%-ной фтористоводородной кислоты, 6-36 вес. ч. фтористого аммони и 12-108 вес. ч. воды, добавл ют 201-22 вес. ч. 30%-иой перекиси водорода .elements of printed circuits containing hydrofluoric acid and ammonium fluoride, characterized in that, with an increase in the rate of the process, tralein and 1 quality of etched figures are improved, into a solution containing 2-22 wt. including 48% hydrofluoric acid, 6-36 weight. am ammonium fluoride and 12-108 weight. including water, add 201-22 weight. including 30% hydrogen peroxide.
Publications (1)
Publication Number | Publication Date |
---|---|
SU240792A1 true SU240792A1 (en) |
Family
ID=
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5454901A (en) * | 1990-05-22 | 1995-10-03 | Nec Corporation | Process for treating semiconductor substrates |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5454901A (en) * | 1990-05-22 | 1995-10-03 | Nec Corporation | Process for treating semiconductor substrates |
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