SU240792A1 - SOLUTION FOR THE POISONING OF MONOXIDE SILICON - Google Patents

SOLUTION FOR THE POISONING OF MONOXIDE SILICON

Info

Publication number
SU240792A1
SU240792A1 SU1193778A SU1193778A SU240792A1 SU 240792 A1 SU240792 A1 SU 240792A1 SU 1193778 A SU1193778 A SU 1193778A SU 1193778 A SU1193778 A SU 1193778A SU 240792 A1 SU240792 A1 SU 240792A1
Authority
SU
USSR - Soviet Union
Prior art keywords
solution
poisoning
weight
monoxide
monoxide silicon
Prior art date
Application number
SU1193778A
Other languages
Russian (ru)
Original Assignee
Д. И. Гериц , В. А. Седол
Publication of SU240792A1 publication Critical patent/SU240792A1/en

Links

Description

Известен раствор дл  травлени  моноокиси кремни , исиользуемый, наиример, при изготовлении элементов печатных схем, содержащий фтористоводородную кислоту и фтористый аммоний.A known solution for etching silicon monoxide, which is used, is naimer, in the manufacture of elements of printed circuits, containing hydrofluoric acid and ammonium fluoride.

Цель изобретени  - увеличение скорости процесса травлени  и повышение качества вытравливаемых фигур.The purpose of the invention is to increase the speed of the etching process and improve the quality of the etched shapes.

Достигаетс  это, тем, что в раствор, содержащий 2-22 вес. ч. 48%-ной фтористоводородной кислоты, 6-36 вес. ч. фтористого аммони  и 12-108 вес. ч. воды, добавл ют 201-22 вес. ч. 30%-ной перекиси водорода.This is achieved by the fact that in a solution containing 2-22 weight. including 48% hydrofluoric acid, 6-36 weight. am ammonium fluoride and 12-108 weight. including water, add 201-22 weight. including 30% hydrogen peroxide.

Раствор ие разрущает защитную пленку фоторезиста, используемую в качестве маски в процессе травлени . Это улучшает качество вытравливаемых фигур на поверхности пленки моноокиси кремни , скорость травлени  при этом увеличиваетс  в 30-40 раз. РастворThe solution destroys the protective film of the photoresist used as a mask in the etching process. This improves the quality of etched patterns on the surface of the silicon monoxide film, and the etching rate increases by 30–40 times. Solution

может быть использован при нзгоговлении соединительных проводников многослойных пленочных схем и конденсаторов с диэлектриком из моноокиси кремни . It can be used for fixing the connecting conductors of multilayer film circuits and capacitors with a silicon monoxide dielectric.

Предмет изобретени Subject invention

Раствор дл  травлени  моноокиси кремни , используемый, например, при изготовленииThe solution for etching silicon monoxide, used, for example, in the manufacture of

элементов печатных схем, содержащий фтористоводородную кислоту и фтористый аммоний , отличающийс  тем, что, с 1елью увеличени  скорости процесса травлеин  и повышен 1  качества вытравливаемых фигур, в раствор , содержащий 2-22 вес. ч. 48%-ной фтористоводородной кислоты, 6-36 вес. ч. фтористого аммони  и 12-108 вес. ч. воды, добавл ют 201-22 вес. ч. 30%-иой перекиси водорода .elements of printed circuits containing hydrofluoric acid and ammonium fluoride, characterized in that, with an increase in the rate of the process, tralein and 1 quality of etched figures are improved, into a solution containing 2-22 wt. including 48% hydrofluoric acid, 6-36 weight. am ammonium fluoride and 12-108 weight. including water, add 201-22 weight. including 30% hydrogen peroxide.

SU1193778A SOLUTION FOR THE POISONING OF MONOXIDE SILICON SU240792A1 (en)

Publications (1)

Publication Number Publication Date
SU240792A1 true SU240792A1 (en)

Family

ID=

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5454901A (en) * 1990-05-22 1995-10-03 Nec Corporation Process for treating semiconductor substrates

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5454901A (en) * 1990-05-22 1995-10-03 Nec Corporation Process for treating semiconductor substrates

Similar Documents

Publication Publication Date Title
US4501061A (en) Fluorine plasma oxidation of residual sulfur species
US4039371A (en) Etchant for polyimides
SU240792A1 (en) SOLUTION FOR THE POISONING OF MONOXIDE SILICON
JPH06237069A (en) Manufacture of printed wiring board
KR102190784B1 (en) Method for treating wiring substrate, and wiring substrate prepared by using the method
US4353779A (en) Wet chemical etching of III/V semiconductor material without gas evolution
TW200525012A (en) Photoresist residue remover composition and semiconductor circuit element production process employing said composition
KR102013397B1 (en) Etching composition, method of forming a metal pattern and method of manufacturing a display substrate
CN103098181B (en) For suppressing the treatment fluid of the pattern collapse of microstructure and using its manufacture method of microstructure
KR101049383B1 (en) Method for manufacturing semiconductor device
US4960491A (en) Process for etching organic polymeric materials
JP7230908B2 (en) Etching solution for copper foil and method for producing printed wiring board using the same, etching solution for electrolytic copper layer and method for producing copper pillar using the same
WO2011009764A1 (en) Etchant composition and etching process for titanium-aluminum complex metal layer
JP2003282531A (en) Method of manufacturing electronic device
US3532569A (en) Aluminum etchant and process
CA1091139A (en) Method for selective etching of titaniumdioxide
JP2012229460A (en) Treatment agent for copper or copper alloy surface
KR20240082918A (en) Etchant composition for copper-containing metal and etching method using the same
SU790379A1 (en) Solution for removing photoresist
CN117966164A (en) Circuit board etching solution and use method thereof
KR100196523B1 (en) Method of manufacturing semiconductor device
SU568986A1 (en) Etching composition
KR100252759B1 (en) Method for forming semiconductor device
SU333731A1 (en) METHOD FOR REMOVING PHOTORESIST LAYERS
KR101066216B1 (en) Method of forming metal wiring and etchant composition used in the same