SI2291064T1 - Elektronska enota s hladilnim rebrom - Google Patents

Elektronska enota s hladilnim rebrom

Info

Publication number
SI2291064T1
SI2291064T1 SI201031321A SI201031321A SI2291064T1 SI 2291064 T1 SI2291064 T1 SI 2291064T1 SI 201031321 A SI201031321 A SI 201031321A SI 201031321 A SI201031321 A SI 201031321A SI 2291064 T1 SI2291064 T1 SI 2291064T1
Authority
SI
Slovenia
Prior art keywords
electronic unit
cooling fins
fins
cooling
electronic
Prior art date
Application number
SI201031321A
Other languages
English (en)
Inventor
Gerhard Leutwein
Original Assignee
Gerhard Leutwein
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gerhard Leutwein filed Critical Gerhard Leutwein
Publication of SI2291064T1 publication Critical patent/SI2291064T1/sl

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909Forced ventilation, e.g. on heat dissipaters coupled to components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SI201031321A 2009-08-25 2010-08-20 Elektronska enota s hladilnim rebrom SI2291064T1 (sl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009038806A DE102009038806A1 (de) 2009-08-25 2009-08-25 Elektronische Einheit mit Kühlrippen
EP10008710.5A EP2291064B1 (de) 2009-08-25 2010-08-20 Elektronische Einheit mit Kühlrippen

Publications (1)

Publication Number Publication Date
SI2291064T1 true SI2291064T1 (sl) 2016-12-30

Family

ID=43332615

Family Applications (1)

Application Number Title Priority Date Filing Date
SI201031321A SI2291064T1 (sl) 2009-08-25 2010-08-20 Elektronska enota s hladilnim rebrom

Country Status (6)

Country Link
US (1) US8320127B2 (sl)
EP (1) EP2291064B1 (sl)
DE (1) DE102009038806A1 (sl)
DK (1) DK2291064T3 (sl)
ES (1) ES2600511T3 (sl)
SI (1) SI2291064T1 (sl)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110108250A1 (en) * 2009-11-09 2011-05-12 Alex Horng Heat Dissipating device
CN102882397A (zh) * 2012-06-25 2013-01-16 山亿新能源股份有限公司 一种逆变器压铸箱体自然散热结构
CN104704934B (zh) * 2013-03-19 2017-02-22 富士电机株式会社 冷却装置以及具备该冷却装置的电力转换装置
JPWO2014147962A1 (ja) * 2013-03-19 2017-02-16 富士電機株式会社 磁気部品の冷却構造及びこれを備えた電力変換装置
JP6256295B2 (ja) * 2014-10-28 2018-01-10 株式会社デンソー 熱交換器
CN206909011U (zh) 2017-04-19 2018-01-19 西门子公司 散热器和变频器
JP7081203B2 (ja) * 2018-02-26 2022-06-07 トヨタ自動車株式会社 放熱フィン構造及びこれを用いた電子基板の冷却構造
DE102021214756A1 (de) * 2021-12-21 2023-06-22 Magna powertrain gmbh & co kg Kühlvorrichtung

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920005988B1 (ko) * 1988-08-31 1992-07-25 가부시기가이샤 히다찌세이사꾸쇼 인버터장치
JP3159071B2 (ja) * 1996-08-01 2001-04-23 株式会社日立製作所 放熱フィンを有する電気装置
US6041287A (en) * 1996-11-07 2000-03-21 Reliance Electric Industrial Company System architecture for on-line machine diagnostics
JPH10150284A (ja) * 1996-11-20 1998-06-02 Yaskawa Electric Corp 制御ユニット
US5909358A (en) * 1997-11-26 1999-06-01 Todd Engineering Sales, Inc. Snap-lock heat sink clip
DE19913450A1 (de) * 1999-03-25 2000-09-28 Mannesmann Sachs Ag Leistungselektronik zum Steuern einer elektrischen Maschine
US6359779B1 (en) * 1999-04-05 2002-03-19 Western Digital Ventures, Inc. Integrated computer module with airflow accelerator
US6296048B1 (en) * 2000-09-08 2001-10-02 Powerwave Technologies, Inc. Heat sink assembly
US7038910B1 (en) * 2002-01-07 2006-05-02 Wave7 Optics, Inc. System and method for removing heat from a subscriber optical interface
US6891725B2 (en) * 2002-09-23 2005-05-10 Siemens Energy & Automation, Inc. System and method for improved motor controller
ES2377018T3 (es) 2004-06-24 2012-03-21 Sma Solar Technology Ag Inversor con una carcasa con componentes eléctricos y/o electrónicos presentando disipadores de calor
DE102004030457A1 (de) 2004-06-24 2006-01-12 Sma Technologie Ag Wechselrichter mit einem Gehäuse mit einem Kühlaggregat
FR2881018B1 (fr) * 2005-01-19 2007-04-06 Intelligent Electronic Systems Procede de refroidissement d'un dispositif de conversion statique d'electronique de puissance et dispositif correspondant
US7472742B2 (en) * 2005-12-01 2009-01-06 General Electric Company Heat sink assembly
CN101518170B (zh) * 2006-09-13 2012-11-07 株式会社安川电机 马达控制器
JP2008140802A (ja) * 2006-11-30 2008-06-19 Fuji Electric Fa Components & Systems Co Ltd ヒートシンク
ES2504515T3 (es) 2007-05-25 2014-10-08 Sma Solar Technology Ag Alojamiento de inversor
JP5381561B2 (ja) * 2008-11-28 2014-01-08 富士電機株式会社 半導体冷却装置

Also Published As

Publication number Publication date
DE102009038806A1 (de) 2011-03-03
EP2291064B1 (de) 2016-08-17
EP2291064A2 (de) 2011-03-02
ES2600511T3 (es) 2017-02-09
US20110051370A1 (en) 2011-03-03
EP2291064A3 (de) 2014-01-01
US8320127B2 (en) 2012-11-27
DK2291064T3 (en) 2016-12-05

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