SG185242A1 - Semiconductor-chip bonding apparatus - Google Patents
Semiconductor-chip bonding apparatus Download PDFInfo
- Publication number
- SG185242A1 SG185242A1 SG2012031522A SG2012031522A SG185242A1 SG 185242 A1 SG185242 A1 SG 185242A1 SG 2012031522 A SG2012031522 A SG 2012031522A SG 2012031522 A SG2012031522 A SG 2012031522A SG 185242 A1 SG185242 A1 SG 185242A1
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor chip
- circuit board
- printed circuit
- chip
- supporting plate
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 117
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 238000001179 sorption measurement Methods 0.000 claims abstract description 7
- 230000003287 optical effect Effects 0.000 description 15
- 230000010354 integration Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Disclosed is a semiconductor-chip bonding apparatus, which, in order tobond the semiconductor chip to the printed circuit board, includes a chip adsorbing unit adsorbing a semiconductor chip at an initial position and releasing the adsorption of the semiconductor chip at a mounting position where the semiconductor chip is mounted to a printed circuit board, a substrate supporting plate spaced apart from the initial position of the chip adsorbing unitand supporting the printed circuit board, a chip transferring unit transferring the chip adsorbing unit, and a substrate driving unit transferring or rotating the substrate supporting plate.(Fig. 2)
Description
SEMICONDUCTOR-CHIP BONDING APPARATUS
(a) Field of the Invention
The present invention relates to a semiconductor-chip bonding apparatus, and more particularly to a semiconductor-chip bonding apparatus, in which the semiconductor chip can be more precisely aligned and mounted on a printed circuit board. (b) Description of the Related Art
To practically use a semiconductor device fabricated on a wafer, the semiconductor device has to be cut from the wafer into a unit of chip and fabricated as a package. A semiconductor package not only mechanically supports and fixes the semiconductor chip and protects it from external environment, but also provides an electric connection path and a heat discharging path to a semiconductor chip.
In the early stages, the semiconductor package has generally used a lead frame as a package substrate for mechanically and electrically connecting the semiconductor chip and an external system. However, the semiconductor package using the lead frame reaches the limit as the number of input/output pins is increasing and an operation speed is getting faster. Accordingly, a ball- grid array package has been developed as an alternative to the semiconductor package using the lead frame.
The ball-grid array package employs a printed circuit board instead of the lead frame as the package substrate, and a micro bump instead of an external lead of the lead frame as a connection terminal. Since the micro bumps are two-dimensionally arranged on the surface of the printed circuit board unlike the external leads that are one-dimensionally arranged, it is possible to follow the increasing trend in the number of input/output pins and the operation speed.
From then on, various types of semiconductor package have been developed to meet a rise in demand for a lightweight, thin, simple and small semiconductor package, and various types of connection terminal such as a pillar bump as well as the micro bump have also been employed taking the size and thickness of semiconductor chip, and connection density of the semiconductor chip and the printed circuit board, etc. into account.
Fig. 1 shows a semiconductor chip and a printed circuit board.
If a bump 11 of a semiconductor chip 10 and a printed terminal 21 of a printed circuit board 20 are aligned and then bonded to each other while keeping such an aligned state, a stage of mounting the semiconductor chip 10 onto the printed circuit board 20 is completed without any intermediate stage such as conventional wire bonding.
However, as a degree of integration of the semiconductor package increases, a fine pitch between and high density of the bumps 11 in the semiconductor chip 11 require a high degree of position precision when the semiconductor chip is mounted to the printed circuit board. While a general semiconductor package requires degree of position precision of about 10um, a semiconductor package having an increased degree of integration requires a higher degree of position precision of about Sum.
Such a conventional semiconductor-chip bonding apparatus has a problem that a substrate driving unit for transferring or rotating the printed circuit board is not efficiently controlled while mounting the semiconductor chip to the printed circuit board, and thus an assembling error between the semiconductor chip and the printed circuit board exceeds an allowable error of the semiconductor package having a high degree of integration.
Accordingly, the present invention is conceived to solve the forgoing problems, and an aspect of the present invention is to provide a semiconductor- chip bonding apparatus, in which a substrate driving unit for transferring or rotating a printed circuit board while mounting the semiconductor chip to the printed circuit board is divided into two drivers respectively adapted to assembling stages of the semiconductor chip and the printed circuit board, thereby reducing a projected cost of the substrate driving unit and minimizing an assembling error between the semiconductor chip and the printed circuit board.
In accordance with an exemplary embodiment of the present invention, there is provided an apparatus for bonding a semiconductor chip, which, in order to bond the semiconductor chip to the printed circuit board, includes a chip adsorbing unit adsorbing a semiconductor chip at an initial position and releasing the adsorption of the semiconductor chip at a mounting position where the semiconductor chip is mounted to a printed circuit board, a substrate supporting plate spaced apart from the initial position of the chip adsorbing unit and supporting the printed circuit board, a chip transferring unit transferring the chip adsorbing unit, and a substrate driving unit transferring or rotating the substrate supporting plate, wherein the substrate driving unit includes a first driver which transfers the substrate supporting plate in a horizontal direction so as to transfer the printed circuit board to the mounting position; and a second driver which is coupled to the first driver and transfers the substrate supporting plate in a horizontal direction or rotates the substrate supporting plate with respect a direction intersecting the horizontal direction so as to adjust the printed circuit board to be aligned at the mounting position through information about an aligning mark of the printed circuit board, the apparatus further including an inclination adjuster which adjusts inclination of the substrate supporting plate so that the semiconductor chip can be mounted to the printed circuit board in a state that contact surfaces of the semiconductor chip and the printed circuit board are in parallel with each other.
The chip adsorbing unit may include an adsorber to adsorb the semiconductor chip; a moving up/down driver to move the adsorber up and down; and a rotation driver to rotate the adsorber, and the moving up/down driver may include a shaft linear motor including a stator and a rotor which moves relative to the stator and to which the adsorber is fixed installed; and an elastic member elastically urging the stator and the rotor to move in a direction of getting close to each other.
The adsorber may include a first member contacting the semiconductor chip; a second member spaced apart from and coupled to the first member; and a space adjuster to adjust a space between the first member and the second member in a local position between the first member and the second member.
As described above, in accordance with the semiconductor-chip bonding apparatus, it is possible to reduce a projected cost of the substrate driving unit and minimize an assembling error between the semiconductor chip and the printed circuit board.
Also, in accordance with the semiconductor-chip bonding apparatus, it is possible to increase a response speed of a moving up/down driver, and facilitate position control, torque control, or the like mode switch.
Further, in accordance with the semiconductor-chip bonding apparatus, it is possible to eliminate a mounting error occurring when both contact surfaces of the semiconductor chip and the printed circuit board are inclined to each other.
The above and/or other aspects of the present invention will become apparent and more readily appreciated from the following description of the exemplary embodiments, taken in conjunction with the accompanying drawings, in which:
Fig. 1 is a view showing a semiconductor chip and a printed circuit board;
Fig. 2 is a view schematically showing a semiconductor-chip bonding apparatus according to an exemplary embodiment of the present invention;
Fig. 3 is a cross-section view of a chip adsorbing unit in the semiconductor-chip bonding apparatus of Fig. 2;
Figs. 4 and 5 are views showing how the semiconductor-chip bonding apparatus of Fig. 2 operates;
Fig. 6 is a view for explaining what a first driver and a second driver in the semiconductor —chip bonding apparatus of Fig. 2 are used for; and
Fig. 7 is a view showing how an inclination adjuster in the semiconductor-chip bonding apparatus of Fig. 2 operates.
Hereinafter, exemplary embodiments of a semiconductor-chip bonding apparatus according to the present invention will be described with reference to accompanying drawings.
Fig. 2 is a view schematically showing a semiconductor-chip bonding apparatus according to an exemplary embodiment of the present invention; Fig. 3 is a cross-section view of a chip adsorbing unit in the semiconductor-chip bonding apparatus of Fig. 2; Figs. 4 and 5 are views showing how the semiconductor-chip bonding apparatus of Fig. 2 operates; Fig. 6 is a view for explaining what a first driver and a second driver in the semiconductor —chip bonding apparatus of Fig. 2 are used for; and Fig. 7 is a view showing how an inclination adjuster in the semiconductor-chip bonding apparatus of Fig. 2 operates.
Referring to Figs. 2 to 7, the semiconductor-chip bonding apparatus according to this exemplary embodiment is to minimize a mounting error between a semiconductor chip 10 and a printed circuit board 20 while mounting the semiconductor chip 10 of a chip-scale package to the printed circuit board 20. The semiconductor-chip bonding apparatus includes a chip adsorbing unit
100, a substrate supporting plate 200, an inclination adjuster 210, a chip transferring unit 300, a substrate driving unit 400, a first optical unit 510 and a second optical unit 520.
The chip adsorbing unit 10 adsorbs the semiconductor chip at an initial position, and releases the adsorption of the semiconductor chip 10 at a mounting position where the semiconductor chip 10 is mounted to the printed circuit board 20. The chip adsorbing unit 10 includes an adsorber 110, a moving up/down driver 120, a shaft 140, and a rotation driver 150.
Referring to Fig. 3, the adsorber 110 adsorbs the semiconductor chip 10, in which vacuum adsorption is used to hold the semiconductor chip 10. The adsorber 110 employs the vacuum adsorption to adsorb and hold the semiconductor chip 10 while loading and moving the semiconductor chip 10, and releases the vacuum adsorption to separate the semiconductor chip 10 therefrom while taking the semiconductor chip 10 down onto the printed circuit board 20.
The adsorber 110 includes a first member 111 to be in contact with the semiconductor chip, a second member 112 spaced apart from and coupled to the first member 111, and a space adjuster 113 to adjust a space between the first member 111 and the second member 112 in a local position between the first member 111 and the second member 112.
As opposed to the second member fixed to the shaft 140, the first member 111 is locally adjusted in its vertical position by the space adjuster 113 so that the space from the second member 112 can be adjusted. This is to adsorb the semiconductor chip 10 in the state that a contact surface of the first member 111 and a contact surface of the semiconductor chip 10 are parallel with each other. If the inclination of the first member 111 is adjusted to correspond to an inclined surface of the semiconductor chip 10, compressing force can be uniformly given to a bonding surface between the semiconductor chip 10 and the printed circuit board 20. That is, the compressing force is not concentrated on a certain part but uniformly distributed, so that the semiconductor chip 10 and the printed circuit board 20 can be compressed without worrying about damage.
In this exemplary embodiment, the space adjuster 113 includes a ball member 114 interposed between the first member 111 and the second member 112, a bolt (not shown) coupling the first member with the second member 112, and a stripper bolt (not shown) adjusting a space between the first member 111 and the second member 112.
The first member 111 is inclined forward, backward, leftward or rightward with respect to the ball member 114 and partially adjusts the space from the second member 112. The stripper bolts are provided in forward, backward, leftward and rightward directions so that the space between the first member 111 and the second member 112 can be finely adjusted at a position being in contact with the stripper bolt, thereby generally adjusting the inclination of the first member 111.
The moving up/down driver 120 is coupled to the adsorber 110 and drives the adsorber 110 to move up and down. In this exemplary embodiment, the moving up/down driver 120 includes a shaft linear motor and an elastic member 124. In this exemplary embodiment, a voice coil motor 121 is used as the shaft linear motor, and includes a stator 122, and a rotor 123 which moves relative to the stator 122 and to which the adsorber 110 is fixedly installed. The elastic member 124 elastically returns the stator 122 and the rotor 123 in a direction of getting close to each other.
If electric power is supplied to the voice coil motor 121, the rotor 123 moves in a direction of getting away from the stator 122 and thus the adsorber 110 moves down. If the electric power supplied to the voice coil motor 121 is cut, no more electromagnetic force occurs between the rotor 123 and the stator 122, and thus the elastic member 124 elastically urges the rotor 124 to move in a direction of getting close to the stator 122, thereby moving the adsorber 110 upward.
The shaft 140 includes one end coupled to a top of the adsorber 110, and the other end coupled to a rotation driver 150 (to be described later). The shaft 140 is slidably provided while penetrating the stator 122, and at the same time fixed to the rotor 123 while penetrating the rotor 123. The shaft 140 is internally provided with a through hole via which air inhaled by the adsorber 110 is transferred outward in order to adsorb the semiconductor chip 10.
The rotation driver 150 is coupled to the other end of the shaft 140 and rotates the adsorber 110. The rotation driver 150 is aligned with the moving up/down driver 120, and rotates the semiconductor chip 10 while the semiconductor chip 10 is aligned using an aligning mark of the semiconductor chip 10.
In this exemplary embodiment, the rotation driver 150 includes a stepping motor and a harmonic drive. If a general direct current (DC) motor is used for the rotation driver 150, a problem may arise in that the adsorber 110 is rotated while the semiconductor chip 10 and the printed circuit board 20 are compressed in a torque control mode of a mode switch 130 since static torque of the DC motor is not large. Therefore, in this exemplary embodiment, the stepping motor, static torque of which is relatively large, is used to solve the above problem, and the harmonic drive is also of help to improvement in degree of position precision and the static torque.
The substrate supporting plate 200 is arranged to be spaced apart from an initial position of the chip adsorbing unit 100, and supports the printed circuit board 20. The substrate supporting plate 200 further includes a vacuum adsorbing unit (not shown) for adsorbing and holding the printed circuit board 20 seated on the top thereof. The vacuum adsorbing unit adsorbs and holds the printed circuit board 20 not to be separated or changed in position from the substrate supporting plate 200 while the aligning mark of the printed circuit board 20 seated on the substrate supporting plate 200 is photographed or while the semiconductor chip 10 is bonded to the printed circuit board 20.
The inclination adjuster 210 adjusts the inclination of the substrate supporting plate 200 on which the printed circuit board 20 is sated, so that the semiconductor chip 10 can be mounted to the printed circuit board 20 in the state that both contact surfaces of the semiconductor chip 10 and the printed circuit board 20 are in parallel with each other. If the semiconductor chip 10 is mounted in the state that both contact surfaces of the semiconductor chip 10 and the printed circuit board 20 are inclined to each other, an error more than scores of um occurs and exceeds an allowable error of the bonding apparatus.
Therefore, in order to minimize a mounting error between the semiconductor chip 10 and the printed circuit board 20, both contact surfaces of the semiconductor chip 10 and the printed circuit board 20 have to be kept in parallel with each other.
As shown in Fig. 7, the inclination adjuster 210 is provided in each of three or four corners at a lower side of the substrate supporting plate 200, which includes a first inclination member 211, a second inclination member 212, a driver 213, and a guide member 214. The first inclination member 211 has one surface inclined, and the second inclination member 212 has one surface, which faces the one surface of the first inclination member 211, inclined and contacting the first inclination member 211 and the other surface coupled to the substrate supporting plate 200. Also, the driver 213 pushes the first inclination member 211 toward the second inclination member 212, and the guide member 214 is vertically provided to guide the second inclination member 212 pushed up by the first inclination member 211 to move in up and down directions.
As shown in (b) of Fig. 7, it is possible to adjust the height of the substrate supporting plate 200 at an installation position of the second inclination member by repeating operations of pushing up or down the second inclination member 212. Such operations are performed at a plurality of positions on the lower side of the substrate supporting plate 200, so that the semiconductor chip 10 can be mounted to the printed circuit board 20 in the state that both contact surfaces of the semiconductor chip 10 and the printed circuit board 20 are in parallel with each other all over the surface.
The chip transferring unit 300 transfers the chip adsorbing unit 100 in a horizontal direction, i.e., transfers the semiconductor chip 10 in two directions of intersecting each other on a plane when the semiconductor chip 10 is adsorbed by the adsorber 110. The chip transferring unit 300 includes a linear motor as a driving source, a base coupled to the linear motor, a linear guide guiding the base to move rectilinearly, an encoder giving feedback on a stop position of the base in order to enhance degree of position precision, and so on. Such configurations related to the rectilinear-transferring unit are well known to a person having an ordinary skill in the art, and therefore detailed descriptions thereof will be omitted.
The substrate driving unit 400 transfers or rotates the substrate supporting plate 200, and includes a first driver 410 and a second driver 420. If the chip adsorbing unit 100 adsorbing the semiconductor chip 10 reaches an upper side of the substrate supporting plate 200, the mounting position between the semiconductor chip 10 and the printed circuit board 20 is adjusted by moving the substrate supporting plate 200 while the chip adsorbing unit 100 is remained stationary. Such movement of the substrate supporting plate 200 for adjusting the mounting position is broadly divided into two.
As shown in (a) of Fig. 6, one is to move the substrate supporting plate 200 so that the chip adsorbing unit 100 can be moved from an upper side of a mounting position 1 (refer to Fig. 6) to an upper side of a mounting position 2 (see Fig. 6), if there are a plurality of mounting positions for mounting the semiconductor chip 10 to the printed circuit board 20 and a plurality of semiconductor chips 10 are respectively mounted to the plurality of mounting positions. For this movement, a driver having a relatively long stroke is needed,
but a high degree of position precision is not required since the substrate supporting plate 200 moves between the different mounting positions.
The first driver 410 is to perform the above movement, which moves the substrate supporting plate 200 horizontally so that the chip adsorbing unit 100 can be positioned at each of the mounting positions on the printed circuit board 20.
As shown in (b) of Fig. 6, the other one is to minutely transfer or rotate the substrate supporting plate 200 so as to align the semiconductor chip 10 with the printed circuit board 20 while the semiconductor chip 10 moves down, if the chip adsorbing unit 100 is positioned above a desired mounting position on the printed circuit board 20 and the semiconductor chip 10 is moved down for compressing the semiconductor chip 10 and the printed circuit board 20. Such movement can be controlled through image information about the aligning mark of the printed circuit board 20. For this movement, a driver having not only a relatively short stroke but also a high degree of position precision is required.
The second driver 420 is to perform the above movement, which is coupled to an upper part of the first driver 410. The second driver 420 transfers the substrate supporting plate 200 in horizontal directions (i.e., u and v directions, refer to Fig. 6) or rotates the substrate supporting plate 200 with respect to a direction (i.e., a w direction, refer to Fig. 6) intersecting the horizontal direction, thereby adjusting the position of the printed circuit board 20 to be aligned with the semiconductor chip 10 in the mounting position.
Thus, in this exemplary embodiment, the substrate driving unit 400 includes two drivers different in the degree of position precision because different degrees of position precision are needed while mounting the semiconductor chip 10 to the printed circuit board 20. A single driver having both the long stroke and the high degree of position precision is necessarily expensive. However, in this exemplary embodiment, the first driver 410 having the relatively long stroke and the relatively low degree of position precision and the second driver 420 having the relatively short stroke and the relatively high degree of position precision are separately provided to constitute the substrate driving unit 400, thereby reducing costs.
Each of the first driver 410 and the second driver 420 in this exemplary embodiment may be configured to include a linear motor as a driving source, a base coupled to the linear motor, a linear guide guiding the base to move rectilinearly, an encoder giving feedback on a stop position of the base in order to enhance degree of position precision, and so on.
The first optical unit 510 is to photograph a pair of aligning marks provided on the semiconductor chip 10 and spaced at a predetermined distance from each other. The first optical unit 510 is arranged between the chip adsorbing unit 100 at the initial position and the substrate supporting plate 200 with regard to a horizontal direction, and arranged under the chip adsorbing unit 100 with regard to a vertical direction. The first optical unit 510 includes a pair of cameras.
The second optical unit 520 is to photograph a pair of aligning marks provided on the printed circuit board 20 and spaced at a predetermined distance from each other. The second optical unit 520 is arranged above the substrate supporting plate 200. Likewise, the second optical unit 520 includes a pair of cameras.
Referring to Figs. 4 and 5, the adsorber 110 adsorbs the semiconductor chip 10, and the chip transferring unit 300 moves the adsorber 110 adsorbing the semiconductor chip 10 toward the substrate supporting plate 200 without a stop.
Then, at the moment when the semiconductor chip 10 passes above the first optical unit 510, the first optical unit 510 photographs the aligning mark of the semiconductor chip 10. Since the semiconductor chip 10 moves toward the substrate supporting plate 200 without a stop, the semiconductor chip 10 is on the way to the substrate supporting plate 200 even when the first optical unit 510 photographs the aligning mark of the semiconductor chip 10.
Meanwhile, the second optical unit 520 photographs the aligning mark of the printed circuit board 20 seated on the substrate supporting plate 200. The operations of photographing the aligning mark of the printed circuit board 20 may be performed before the chip adsorbing unit 100 starting at the initial position reaches the substrate supporting plate 200.
Then, the aligning mark of the semiconductor chip 10 and the aligning mark of the printed circuit board 20 are aligned while the chip transferring unit 300 moves from the first optical unit 510 to the substrate supporting plate 200, so that the semiconductor chip 10 and the printed circuit board 20 can be aligned. At this time, using an image of the aligning mark of the semiconductor chip 10 taken by the first optical unit 510 and an image of the aligning mark of the printed circuit board 20 taken by the second optical unit 520, deviation in a 8 axial direction and separated distances in x and y axial directions between the aligning marks are compensated, and the semiconductor chip 10 and the printed circuit board 20 are moved or rotated based on the compensated information.
As described above, in accordance with the semiconductor-chip bonding apparatus, the substrate driving unit for transferring or rotating the printed circuit board while mounting the semiconductor chip to the printed circuit board is divided into two drivers respectively adapted to assembling stages of the semiconductor chip and the printed circuit board, thereby reducing a projected cost of the substrate driving unit and minimizing an assembling error between the semiconductor chip and the printed circuit board.
Also, in accordance with the semiconductor-chip bonding apparatus, the shaft linear motor is employed as the moving up/down driver for moving the semiconductor chip up and down, thereby increasing a response speed of the moving up/down driver, and facilitating position control, torque control, or the like mode switch.
Further, in accordance with the semiconductor-chip bonding apparatus, the inclination adjuster for adjusting the inclination of the substrate supporting plate on which the printed circuit board is seated is provided, so that the semiconductor chip can be mounted to the printed circuit board in the state that both contact surfaces of the semiconductor chip and the printed circuit board are in parallel with each other, thereby eliminating the mounting error occurring when both contact surfaces of the semiconductor chip and the printed circuit board are inclined to each other.
Although a few exemplary embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (3)
1. An apparatus for bonding a semiconductor chip, which, in order to bond the semiconductor chip to the printed circuit board, comprises a chip adsorbing unit adsorbing a semiconductor chip at an initial position and releasing the adsorption of the semiconductor chip at a mounting position where the semiconductor chip is mounted to a printed circuit board, a substrate supporting plate spaced apart from the initial position of the chip adsorbing unit and supporting the printed circuit board, a chip transferring unit transferring the chip adsorbing unit, and a substrate driving unit transferring or rotating the substrate supporting plate, wherein the substrate driving unit comprises a first driver which transfers the substrate supporting plate in a horizontal direction so as to transfer the printed circuit board to the mounting position; and a second driver which is coupled to the first driver and transfers the substrate supporting plate in a horizontal direction or rotates the substrate supporting plate with respect a direction intersecting the horizontal direction so as to adjust the printed circuit board to be aligned at the mounting position through information about an aligning mark of the printed circuit board, the apparatus further comprises an inclination adjuster which adjusts inclination of the substrate supporting plate so that the semiconductor chip can be mounted to the printed circuit board in a state that contact surfaces of the semiconductor chip and the printed circuit board are in parallel with each other.
2. The apparatus according to claim 1, wherein the chip adsorbing unit comprises an adsorber to adsorb the semiconductor chip; a moving up/down driver to move the adsorber up and down; and a rotation driver to rotate the adsorber, and the moving up/down driver comprises a shaft linear motor comprising a stator and a rotor which moves relative to the stator and to which the adsorber is fixed installed; and an elastic member elastically urging the stator and the rotor to move in a direction of getting close to each other.
3. The apparatus according to claim 2, wherein the adsorber comprises a first member contacting the semiconductor chip; a second member spaced apart from and coupled to the first member; and a space adjuster to adjust a space between the first member and the second member in a local position between the first member and the second member.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110042207A KR101090816B1 (en) | 2011-05-04 | 2011-05-04 | Apparatus for bonding semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG185242A1 true SG185242A1 (en) | 2012-11-29 |
Family
ID=45505793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012031522A SG185242A1 (en) | 2011-05-04 | 2012-04-27 | Semiconductor-chip bonding apparatus |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR101090816B1 (en) |
| CN (1) | CN102769997A (en) |
| SG (1) | SG185242A1 (en) |
| TW (1) | TW201247070A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017130342A1 (en) * | 2017-12-18 | 2019-06-19 | Melexis Bulgaria Ltd. | Reinforced electronic device for an electric motor |
| CN112490158B (en) * | 2020-11-30 | 2024-01-26 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Chip back-mounted splicing equipment and splicing method |
| CN115884588B (en) * | 2023-01-16 | 2023-04-25 | 长城电源技术有限公司 | Method for forming switching power supply converter and switching power supply converter formed by same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4937482B2 (en) * | 2000-05-22 | 2012-05-23 | 東レエンジニアリング株式会社 | Chip mounting apparatus and alignment method in the apparatus |
| JP4264403B2 (en) * | 2004-10-18 | 2009-05-20 | 株式会社新川 | Bonding equipment |
| KR100792523B1 (en) | 2007-03-29 | 2008-01-10 | 삼성전자주식회사 | Pre-align apparaus |
| KR100993483B1 (en) * | 2008-06-11 | 2010-11-11 | 주식회사 아이. 피. 에스시스템 | Apparatus for bonding chip or film on glass and Method for bonding chip or film on glass using the same |
-
2011
- 2011-05-04 KR KR1020110042207A patent/KR101090816B1/en not_active IP Right Cessation
-
2012
- 2012-04-27 SG SG2012031522A patent/SG185242A1/en unknown
- 2012-05-01 TW TW101115473A patent/TW201247070A/en unknown
- 2012-05-04 CN CN2012101427999A patent/CN102769997A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW201247070A (en) | 2012-11-16 |
| KR101090816B1 (en) | 2011-12-12 |
| CN102769997A (en) | 2012-11-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4208155B2 (en) | Mounting head and electronic component mounting apparatus | |
| WO2014087491A1 (en) | Transfer device | |
| US7337939B2 (en) | Bonding apparatus | |
| JP6919019B2 (en) | Joining device and joining method | |
| KR101044622B1 (en) | Apparatus for bonding semiconductor chip | |
| JP2010232660A (en) | Vacuum laminator | |
| SG185242A1 (en) | Semiconductor-chip bonding apparatus | |
| KR101214832B1 (en) | Die bonder for providing a large bonding force | |
| JP3970135B2 (en) | Die bonder | |
| JP2007035669A (en) | Wafer transport device, wafer lamination transport device, and method for manufacturing stacked semiconductor device | |
| JP2000150970A (en) | Light emitting device bonding method and equipment | |
| US20170162428A1 (en) | Room-temperature bonding apparatus | |
| KR101394312B1 (en) | Wafer alignment apparatus | |
| JP2000183404A (en) | Light emitting element array and method and apparatus for bonding it | |
| JP3506952B2 (en) | Method and apparatus for positioning and supplying electric parts | |
| CN111615739A (en) | Substrate processing apparatus and substrate processing method | |
| JP2000338896A (en) | Substrate positioning and substrate bonding device | |
| KR100487581B1 (en) | Bonding device of surface mounting equipment | |
| JP6200737B2 (en) | Die bonder dipping mechanism and flip chip bonder | |
| KR20020042741A (en) | Chip Mounter | |
| JP3400735B2 (en) | Tilt adjusting device and bonding device | |
| KR102539924B1 (en) | Electronic component bonding apparatus | |
| KR102552469B1 (en) | Electronic component bonding apparatus | |
| KR102220338B1 (en) | Apparatus and method of bonding chips | |
| CN216049679U (en) | Be applied to skew detection mechanism of PCB |