SG143998A1 - Method and apparatus for supporting a workpiece to be cut - Google Patents

Method and apparatus for supporting a workpiece to be cut

Info

Publication number
SG143998A1
SG143998A1 SG200609003-9A SG2006090039A SG143998A1 SG 143998 A1 SG143998 A1 SG 143998A1 SG 2006090039 A SG2006090039 A SG 2006090039A SG 143998 A1 SG143998 A1 SG 143998A1
Authority
SG
Singapore
Prior art keywords
workpiece
cut
solidified fluid
cutting
supporting
Prior art date
Application number
SG200609003-9A
Inventor
Michael William Gadd
Original Assignee
Jetsis Int Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jetsis Int Pte Ltd filed Critical Jetsis Int Pte Ltd
Priority to SG200609003-9A priority Critical patent/SG143998A1/en
Priority to JP2009542726A priority patent/JP2010513044A/en
Priority to PCT/SG2007/000439 priority patent/WO2008079098A1/en
Publication of SG143998A1 publication Critical patent/SG143998A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/20—Cutting beds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet
    • B26F3/008—Energy dissipating devices therefor, e.g. catchers; Supporting beds therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Forests & Forestry (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Jigs For Machine Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

METHOD AND APPARATUS FOR SUPPORTING A WORKPIECE TO BE CUT One method and apparatus of cutting a workpiece supported by a solidified fluid comprises cutting a first workpiece portion with a cutting agent and a first solidified fluid portion which supports the first workpiece portion. This makes a solidified fluid cut. The solidified fluid cut is repaired. One method comprises cutting a workpiece which is supported by a solidified fluid having a pre-determined depth. A cutting agent cuts a first workpiece portion and a first solidified fluid making a solidified fluid cut. The pre-determined thickness of the solidified fluid is such that a depth of the solidified fluid cut is less than the pre-determined thickness.
SG200609003-9A 2006-12-22 2006-12-22 Method and apparatus for supporting a workpiece to be cut SG143998A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG200609003-9A SG143998A1 (en) 2006-12-22 2006-12-22 Method and apparatus for supporting a workpiece to be cut
JP2009542726A JP2010513044A (en) 2006-12-22 2007-12-24 Method and apparatus for supporting a workpiece to be cut
PCT/SG2007/000439 WO2008079098A1 (en) 2006-12-22 2007-12-24 Method and apparatus for supporting a workpiece to be cut

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200609003-9A SG143998A1 (en) 2006-12-22 2006-12-22 Method and apparatus for supporting a workpiece to be cut

Publications (1)

Publication Number Publication Date
SG143998A1 true SG143998A1 (en) 2008-07-29

Family

ID=39562778

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200609003-9A SG143998A1 (en) 2006-12-22 2006-12-22 Method and apparatus for supporting a workpiece to be cut

Country Status (3)

Country Link
JP (1) JP2010513044A (en)
SG (1) SG143998A1 (en)
WO (1) WO2008079098A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2956057B1 (en) * 2010-02-10 2012-01-27 Snecma CUTTING PREFORMS BEFORE INJECTION RTM BY WATER JET AND CRYOGENIZATION
US9573289B2 (en) * 2013-10-28 2017-02-21 Flow International Corporation Fluid jet cutting systems
JP5941942B2 (en) * 2014-05-02 2016-06-29 下田　一喜 Cutting method, cutting apparatus and chuck
DE102015221273A1 (en) * 2015-10-30 2017-05-04 Siemens Aktiengesellschaft Water jet cutting process, water jet cutting machine and workpiece holder

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4204448A (en) * 1978-11-13 1980-05-27 Gerber Garment Technology, Inc. Fluid jet cutting apparatus having self-healing bed
JP3008344B2 (en) * 1997-02-17 2000-02-14 禧享 垂水 Freezing work fixing method and freezing work fixing device
US6267364B1 (en) * 1999-07-19 2001-07-31 Xuesong Zhang Magnetorheological fluids workpiece holding apparatus and method
JP2003146678A (en) * 2001-11-07 2003-05-21 Nippon Electric Glass Co Ltd Cutting method and cutting apparatus for brittle material
US6634928B2 (en) * 2001-11-09 2003-10-21 International Business Machines Corporation Fluid jet cutting method and apparatus
JP2003251539A (en) * 2001-12-25 2003-09-09 Murata Mfg Co Ltd Method of fixing and machining workpiece
JP4279572B2 (en) * 2003-02-26 2009-06-17 株式会社ディスコ Water jet processing method
US7144299B2 (en) * 2005-05-09 2006-12-05 Intel Corporation Methods and devices for supporting substrates using fluids

Also Published As

Publication number Publication date
WO2008079098A1 (en) 2008-07-03
JP2010513044A (en) 2010-04-30

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