SG143060A1 - Wire loop, semiconductor device having same and wire bonding method - Google Patents
Wire loop, semiconductor device having same and wire bonding methodInfo
- Publication number
- SG143060A1 SG143060A1 SG200502904-6A SG2005029046A SG143060A1 SG 143060 A1 SG143060 A1 SG 143060A1 SG 2005029046 A SG2005029046 A SG 2005029046A SG 143060 A1 SG143060 A1 SG 143060A1
- Authority
- SG
- Singapore
- Prior art keywords
- wire
- semiconductor device
- same
- bonding method
- loop
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Wire loop, semiconductor device having same and wire bonding method A wire loop includes a wire (3) connecting a first bonding point (A) and a second bonding point (Z) therethrough, wherein an additional wire loop (P) is formed after wire bonding at the second bonding point (Z) without cutting the wire (3) and the additional wire loop (P) is bonded to the second bonding point (Z) or to the vicinity thereof while part of the wire (3) is crushed. Fig. 1A
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200502904-6A SG143060A1 (en) | 2005-05-10 | 2005-05-10 | Wire loop, semiconductor device having same and wire bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200502904-6A SG143060A1 (en) | 2005-05-10 | 2005-05-10 | Wire loop, semiconductor device having same and wire bonding method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG143060A1 true SG143060A1 (en) | 2008-06-27 |
Family
ID=39615553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200502904-6A SG143060A1 (en) | 2005-05-10 | 2005-05-10 | Wire loop, semiconductor device having same and wire bonding method |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG143060A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220199571A1 (en) * | 2020-12-23 | 2022-06-23 | Skyworks Solutions, Inc. | Apparatus and methods for tool mark free stitch bonding |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3621917A1 (en) * | 1986-06-30 | 1988-01-07 | Bosch Gmbh Robert | Method for producing electrical connections inside semiconductor components and electrical connection for semiconductor components |
JPH01276729A (en) * | 1988-04-28 | 1989-11-07 | Nec Kansai Ltd | Wire bonding |
JPH0215137A (en) * | 1985-06-20 | 1990-01-18 | Accmulatorenfab Sonnenschein Gmbh | Lead-calcium alloy and production thereof |
JPH04255237A (en) * | 1991-02-07 | 1992-09-10 | Fujitsu Ltd | Manufacture of semiconductor device |
TW456012B (en) * | 2000-01-27 | 2001-09-21 | Advanced Semiconductor Eng | Semiconductor wire bonding method preventing wire sweeping |
EP1422014A1 (en) * | 2002-11-21 | 2004-05-26 | Kaijo Corporation | Semiconductor device having a wire loop with a crushed part on a ball, loop wire bonding method and loop wire bonding apparatus for carrying out such method |
US6815836B2 (en) * | 2003-03-24 | 2004-11-09 | Texas Instruments Incorporated | Wire bonding for thin semiconductor package |
JP2005019778A (en) * | 2003-06-27 | 2005-01-20 | Shinkawa Ltd | Wire bonding method |
US20050072833A1 (en) * | 2003-10-02 | 2005-04-07 | Wong Yam Mo | Method of forming low wire loops and wire loops formed using the method |
-
2005
- 2005-05-10 SG SG200502904-6A patent/SG143060A1/en unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0215137A (en) * | 1985-06-20 | 1990-01-18 | Accmulatorenfab Sonnenschein Gmbh | Lead-calcium alloy and production thereof |
DE3621917A1 (en) * | 1986-06-30 | 1988-01-07 | Bosch Gmbh Robert | Method for producing electrical connections inside semiconductor components and electrical connection for semiconductor components |
JPH01276729A (en) * | 1988-04-28 | 1989-11-07 | Nec Kansai Ltd | Wire bonding |
JPH04255237A (en) * | 1991-02-07 | 1992-09-10 | Fujitsu Ltd | Manufacture of semiconductor device |
TW456012B (en) * | 2000-01-27 | 2001-09-21 | Advanced Semiconductor Eng | Semiconductor wire bonding method preventing wire sweeping |
EP1422014A1 (en) * | 2002-11-21 | 2004-05-26 | Kaijo Corporation | Semiconductor device having a wire loop with a crushed part on a ball, loop wire bonding method and loop wire bonding apparatus for carrying out such method |
US6815836B2 (en) * | 2003-03-24 | 2004-11-09 | Texas Instruments Incorporated | Wire bonding for thin semiconductor package |
JP2005019778A (en) * | 2003-06-27 | 2005-01-20 | Shinkawa Ltd | Wire bonding method |
US20050072833A1 (en) * | 2003-10-02 | 2005-04-07 | Wong Yam Mo | Method of forming low wire loops and wire loops formed using the method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220199571A1 (en) * | 2020-12-23 | 2022-06-23 | Skyworks Solutions, Inc. | Apparatus and methods for tool mark free stitch bonding |
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