SG141222A1 - Semiconductor devices containing epoxy moulding compositions and the compositions per se - Google Patents
Semiconductor devices containing epoxy moulding compositions and the compositions per seInfo
- Publication number
- SG141222A1 SG141222A1 SG200307197-4A SG2003071974A SG141222A1 SG 141222 A1 SG141222 A1 SG 141222A1 SG 2003071974 A SG2003071974 A SG 2003071974A SG 141222 A1 SG141222 A1 SG 141222A1
- Authority
- SG
- Singapore
- Prior art keywords
- compositions
- per
- semiconductor devices
- containing epoxy
- devices containing
- Prior art date
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
SEMICONDUCTOR DEVICES CONTAINING EPOXY MOULDING COMPOSITIONS AND THE COMPOSITIONS PER SE A semiconductor device sealed with resin composition and the composition per se, comprising: (A) a resin, (B) a resin curing agent, (C) an inorganic filler comprising aluminum nitride (AIN) and/or silicon oxide (silica) such as aluminum nitride coated with silicon dioxide (silica) which also acts as a flame retardant, and generally (D) a curing accelerator.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200307197-4A SG141222A1 (en) | 2003-12-04 | 2003-12-04 | Semiconductor devices containing epoxy moulding compositions and the compositions per se |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200307197-4A SG141222A1 (en) | 2003-12-04 | 2003-12-04 | Semiconductor devices containing epoxy moulding compositions and the compositions per se |
Publications (1)
Publication Number | Publication Date |
---|---|
SG141222A1 true SG141222A1 (en) | 2008-04-28 |
Family
ID=39321363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200307197-4A SG141222A1 (en) | 2003-12-04 | 2003-12-04 | Semiconductor devices containing epoxy moulding compositions and the compositions per se |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG141222A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111909487A (en) * | 2019-05-07 | 2020-11-10 | 长春人造树脂厂股份有限公司 | Resin composition and use thereof |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6191243A (en) * | 1984-10-11 | 1986-05-09 | Fujitsu Ltd | Resin composition for semiconductor sealing |
JPS6377924A (en) * | 1986-09-19 | 1988-04-08 | Fujitsu Ltd | Epoxy resin composition for sealing semiconductor |
JPS63142839A (en) * | 1986-12-05 | 1988-06-15 | Nitto Electric Ind Co Ltd | Semiconductor device |
JPH01139648A (en) * | 1987-11-27 | 1989-06-01 | Fujitsu Ltd | Thermally conductive resin composition |
JPH0496929A (en) * | 1990-08-14 | 1992-03-30 | Shin Etsu Chem Co Ltd | Epoxy resin composition and semiconductor device |
JPH05247181A (en) * | 1992-03-10 | 1993-09-24 | Toshiba Chem Corp | Epoxy resin composition and semiconductor sealing device |
US5508110A (en) * | 1992-06-08 | 1996-04-16 | The Dow Chemical Company | Method of making moisture resistant aluminum nitride powder and powder produced thereby |
US5589714A (en) * | 1992-06-08 | 1996-12-31 | The Dow Chemical Company | Epoxy polymer filled with aluminum nitride-containing polymer and semiconductor devices encapsulated with a thermosetting resin containing aluminum nitride particles |
JPH09124774A (en) * | 1995-08-31 | 1997-05-13 | Sumitomo Bakelite Co Ltd | Resin composition for semiconductor sealing |
JPH11147936A (en) * | 1997-11-19 | 1999-06-02 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for semiconductor sealing and semiconductor device |
JPH11158353A (en) * | 1997-11-25 | 1999-06-15 | Toshiba Chem Corp | Epoxy resin composition and device for sealing semiconductor |
JPH11166074A (en) * | 1997-12-04 | 1999-06-22 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor device |
JPH11166073A (en) * | 1997-12-04 | 1999-06-22 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor device |
JP2001214039A (en) * | 2000-02-07 | 2001-08-07 | Toshiba Chem Corp | Epoxy resin composition and sealed semiconductor device |
-
2003
- 2003-12-04 SG SG200307197-4A patent/SG141222A1/en unknown
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6191243A (en) * | 1984-10-11 | 1986-05-09 | Fujitsu Ltd | Resin composition for semiconductor sealing |
JPS6377924A (en) * | 1986-09-19 | 1988-04-08 | Fujitsu Ltd | Epoxy resin composition for sealing semiconductor |
JPS63142839A (en) * | 1986-12-05 | 1988-06-15 | Nitto Electric Ind Co Ltd | Semiconductor device |
JPH01139648A (en) * | 1987-11-27 | 1989-06-01 | Fujitsu Ltd | Thermally conductive resin composition |
JPH0496929A (en) * | 1990-08-14 | 1992-03-30 | Shin Etsu Chem Co Ltd | Epoxy resin composition and semiconductor device |
JPH05247181A (en) * | 1992-03-10 | 1993-09-24 | Toshiba Chem Corp | Epoxy resin composition and semiconductor sealing device |
US5508110A (en) * | 1992-06-08 | 1996-04-16 | The Dow Chemical Company | Method of making moisture resistant aluminum nitride powder and powder produced thereby |
US5589714A (en) * | 1992-06-08 | 1996-12-31 | The Dow Chemical Company | Epoxy polymer filled with aluminum nitride-containing polymer and semiconductor devices encapsulated with a thermosetting resin containing aluminum nitride particles |
JPH09124774A (en) * | 1995-08-31 | 1997-05-13 | Sumitomo Bakelite Co Ltd | Resin composition for semiconductor sealing |
JPH11147936A (en) * | 1997-11-19 | 1999-06-02 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for semiconductor sealing and semiconductor device |
JPH11158353A (en) * | 1997-11-25 | 1999-06-15 | Toshiba Chem Corp | Epoxy resin composition and device for sealing semiconductor |
JPH11166074A (en) * | 1997-12-04 | 1999-06-22 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor device |
JPH11166073A (en) * | 1997-12-04 | 1999-06-22 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor device |
JP2001214039A (en) * | 2000-02-07 | 2001-08-07 | Toshiba Chem Corp | Epoxy resin composition and sealed semiconductor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111909487A (en) * | 2019-05-07 | 2020-11-10 | 长春人造树脂厂股份有限公司 | Resin composition and use thereof |
CN111909487B (en) * | 2019-05-07 | 2023-08-04 | 长春人造树脂厂股份有限公司 | Resin composition and use thereof |
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