SG141222A1 - Semiconductor devices containing epoxy moulding compositions and the compositions per se - Google Patents

Semiconductor devices containing epoxy moulding compositions and the compositions per se

Info

Publication number
SG141222A1
SG141222A1 SG200307197-4A SG2003071974A SG141222A1 SG 141222 A1 SG141222 A1 SG 141222A1 SG 2003071974 A SG2003071974 A SG 2003071974A SG 141222 A1 SG141222 A1 SG 141222A1
Authority
SG
Singapore
Prior art keywords
compositions
per
semiconductor devices
containing epoxy
devices containing
Prior art date
Application number
SG200307197-4A
Inventor
Tat Hong Tan
Original Assignee
Sumitomo Bakelite Singapore Pt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Singapore Pt filed Critical Sumitomo Bakelite Singapore Pt
Priority to SG200307197-4A priority Critical patent/SG141222A1/en
Publication of SG141222A1 publication Critical patent/SG141222A1/en

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Abstract

SEMICONDUCTOR DEVICES CONTAINING EPOXY MOULDING COMPOSITIONS AND THE COMPOSITIONS PER SE A semiconductor device sealed with resin composition and the composition per se, comprising: (A) a resin, (B) a resin curing agent, (C) an inorganic filler comprising aluminum nitride (AIN) and/or silicon oxide (silica) such as aluminum nitride coated with silicon dioxide (silica) which also acts as a flame retardant, and generally (D) a curing accelerator.
SG200307197-4A 2003-12-04 2003-12-04 Semiconductor devices containing epoxy moulding compositions and the compositions per se SG141222A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200307197-4A SG141222A1 (en) 2003-12-04 2003-12-04 Semiconductor devices containing epoxy moulding compositions and the compositions per se

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200307197-4A SG141222A1 (en) 2003-12-04 2003-12-04 Semiconductor devices containing epoxy moulding compositions and the compositions per se

Publications (1)

Publication Number Publication Date
SG141222A1 true SG141222A1 (en) 2008-04-28

Family

ID=39321363

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200307197-4A SG141222A1 (en) 2003-12-04 2003-12-04 Semiconductor devices containing epoxy moulding compositions and the compositions per se

Country Status (1)

Country Link
SG (1) SG141222A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111909487A (en) * 2019-05-07 2020-11-10 长春人造树脂厂股份有限公司 Resin composition and use thereof

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6191243A (en) * 1984-10-11 1986-05-09 Fujitsu Ltd Resin composition for semiconductor sealing
JPS6377924A (en) * 1986-09-19 1988-04-08 Fujitsu Ltd Epoxy resin composition for sealing semiconductor
JPS63142839A (en) * 1986-12-05 1988-06-15 Nitto Electric Ind Co Ltd Semiconductor device
JPH01139648A (en) * 1987-11-27 1989-06-01 Fujitsu Ltd Thermally conductive resin composition
JPH0496929A (en) * 1990-08-14 1992-03-30 Shin Etsu Chem Co Ltd Epoxy resin composition and semiconductor device
JPH05247181A (en) * 1992-03-10 1993-09-24 Toshiba Chem Corp Epoxy resin composition and semiconductor sealing device
US5508110A (en) * 1992-06-08 1996-04-16 The Dow Chemical Company Method of making moisture resistant aluminum nitride powder and powder produced thereby
US5589714A (en) * 1992-06-08 1996-12-31 The Dow Chemical Company Epoxy polymer filled with aluminum nitride-containing polymer and semiconductor devices encapsulated with a thermosetting resin containing aluminum nitride particles
JPH09124774A (en) * 1995-08-31 1997-05-13 Sumitomo Bakelite Co Ltd Resin composition for semiconductor sealing
JPH11147936A (en) * 1997-11-19 1999-06-02 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing and semiconductor device
JPH11158353A (en) * 1997-11-25 1999-06-15 Toshiba Chem Corp Epoxy resin composition and device for sealing semiconductor
JPH11166074A (en) * 1997-12-04 1999-06-22 Sumitomo Bakelite Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device
JPH11166073A (en) * 1997-12-04 1999-06-22 Sumitomo Bakelite Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device
JP2001214039A (en) * 2000-02-07 2001-08-07 Toshiba Chem Corp Epoxy resin composition and sealed semiconductor device

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6191243A (en) * 1984-10-11 1986-05-09 Fujitsu Ltd Resin composition for semiconductor sealing
JPS6377924A (en) * 1986-09-19 1988-04-08 Fujitsu Ltd Epoxy resin composition for sealing semiconductor
JPS63142839A (en) * 1986-12-05 1988-06-15 Nitto Electric Ind Co Ltd Semiconductor device
JPH01139648A (en) * 1987-11-27 1989-06-01 Fujitsu Ltd Thermally conductive resin composition
JPH0496929A (en) * 1990-08-14 1992-03-30 Shin Etsu Chem Co Ltd Epoxy resin composition and semiconductor device
JPH05247181A (en) * 1992-03-10 1993-09-24 Toshiba Chem Corp Epoxy resin composition and semiconductor sealing device
US5508110A (en) * 1992-06-08 1996-04-16 The Dow Chemical Company Method of making moisture resistant aluminum nitride powder and powder produced thereby
US5589714A (en) * 1992-06-08 1996-12-31 The Dow Chemical Company Epoxy polymer filled with aluminum nitride-containing polymer and semiconductor devices encapsulated with a thermosetting resin containing aluminum nitride particles
JPH09124774A (en) * 1995-08-31 1997-05-13 Sumitomo Bakelite Co Ltd Resin composition for semiconductor sealing
JPH11147936A (en) * 1997-11-19 1999-06-02 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing and semiconductor device
JPH11158353A (en) * 1997-11-25 1999-06-15 Toshiba Chem Corp Epoxy resin composition and device for sealing semiconductor
JPH11166074A (en) * 1997-12-04 1999-06-22 Sumitomo Bakelite Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device
JPH11166073A (en) * 1997-12-04 1999-06-22 Sumitomo Bakelite Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device
JP2001214039A (en) * 2000-02-07 2001-08-07 Toshiba Chem Corp Epoxy resin composition and sealed semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111909487A (en) * 2019-05-07 2020-11-10 长春人造树脂厂股份有限公司 Resin composition and use thereof
CN111909487B (en) * 2019-05-07 2023-08-04 长春人造树脂厂股份有限公司 Resin composition and use thereof

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