SG140496A1 - Pre-encapsulated lead frames for microelectronic device packages, and associated methods - Google Patents

Pre-encapsulated lead frames for microelectronic device packages, and associated methods

Info

Publication number
SG140496A1
SG140496A1 SG200605817-6A SG2006058176A SG140496A1 SG 140496 A1 SG140496 A1 SG 140496A1 SG 2006058176 A SG2006058176 A SG 2006058176A SG 140496 A1 SG140496 A1 SG 140496A1
Authority
SG
Singapore
Prior art keywords
microelectronic device
lead frames
device packages
associated methods
encapsulated
Prior art date
Application number
SG200605817-6A
Inventor
Wang Ai-Chie
Lee Choon Kuan
Chong Chin Hui
Tay Wuu Yean
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to SG200605817-6A priority Critical patent/SG140496A1/en
Publication of SG140496A1 publication Critical patent/SG140496A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PRE-ENCAPSULATED LEAD FRAMES FOR MICROELECTRONIC DEVICE PACKAGES, AND ASSOCIATED METHODS Pre-encapsulated lead frames suitable for use in microelectronic device packages are disclosed. Individual lead frames can include a set of multiple lead fingers arranged side by side with neighboring lead fingers spaced apart from each other by a corresponding gap. An encapsulating compound at least partially encapsulates the set of lead fingers without encapsulating a microelectronic device. The encapsulating compound can generally fill the plurality of gaps between two adjacent lead fingers.
SG200605817-6A 2006-08-25 2006-08-25 Pre-encapsulated lead frames for microelectronic device packages, and associated methods SG140496A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200605817-6A SG140496A1 (en) 2006-08-25 2006-08-25 Pre-encapsulated lead frames for microelectronic device packages, and associated methods

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200605817-6A SG140496A1 (en) 2006-08-25 2006-08-25 Pre-encapsulated lead frames for microelectronic device packages, and associated methods

Publications (1)

Publication Number Publication Date
SG140496A1 true SG140496A1 (en) 2008-03-28

Family

ID=39205036

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200605817-6A SG140496A1 (en) 2006-08-25 2006-08-25 Pre-encapsulated lead frames for microelectronic device packages, and associated methods

Country Status (1)

Country Link
SG (1) SG140496A1 (en)

Similar Documents

Publication Publication Date Title
TW200735302A (en) Stress buffering package for a semiconductor component
EP4068354A4 (en) Display device using semiconductor light-emitting elements, and manufacturing method therefor
SG139573A1 (en) Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods
TW200709360A (en) Semiconductor die package and method for making the same
MY151802A (en) Device and method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier
MY155671A (en) LED package and method for manufacturing same
WO2017112396A8 (en) System and method for providing 3d wafer assembly with known-good-dies
SG155793A1 (en) Upgradeable and repairable semiconductor packages and methods
SG150395A1 (en) Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
GT200800019A (en) DRINK PRODUCTS
EP3926682A4 (en) Display device using semiconductor light-emitting elements, and method for manufacturing same
TW201130113A (en) System comprising a semiconductor device and structure
EP2164098A4 (en) Semiconductor package and method for manufacturing the same
SG149725A1 (en) Thin semiconductor die packages and associated systems and methods
WO2012025475A3 (en) Semiconductor element for a thermoelectric module, and method for the production thereof
EP1756854A4 (en) Gallium nitride-based semiconductor stacked structure, production method thereof, and compound semiconductor and light-emitting device each using the stacked structure
WO2010044642A3 (en) Semiconductor light emitting device and method for manufacturing the same
EP2267770A4 (en) Semiconductor package and method for manufacturing the same
NO20063938L (en) Packing machine including several lifting devices per workstation
MX2008009962A (en) Oral care packages and arrangements thereof.
WO2009135948A3 (en) Process for preparing a high drug load tablet
WO2009061704A3 (en) Atomic layer deposition encapsulation
WO2007098160A3 (en) Sealed package for multiple products
EP2856502A4 (en) Semiconductor package substrate, package system using the same and method for manufacturing thereof
WO2013035247A3 (en) High aspect ratio structure and method for manufacturing the same