SG138517A1 - High-frequency probe card and transmission line for high-frequency probe card - Google Patents

High-frequency probe card and transmission line for high-frequency probe card

Info

Publication number
SG138517A1
SG138517A1 SG200702176-9A SG2007021769A SG138517A1 SG 138517 A1 SG138517 A1 SG 138517A1 SG 2007021769 A SG2007021769 A SG 2007021769A SG 138517 A1 SG138517 A1 SG 138517A1
Authority
SG
Singapore
Prior art keywords
signal
frequency
circuits
probe card
frequency probe
Prior art date
Application number
SG200702176-9A
Inventor
Wei-Cheng Ku
Hsin-Hung Lin
Chih-Hao Ho
Te-Chen Feng
Original Assignee
Mjc Probe Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mjc Probe Inc filed Critical Mjc Probe Inc
Publication of SG138517A1 publication Critical patent/SG138517A1/en

Links

Landscapes

  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. High-frequency test signal provided by a test machine to the signal circuits can be transmitted to the signal probes through the first lead wires. Since the grounding circuits and second lead wires are provided adjacent to the signal circuits and first lead wires respectively, the high-frequency signal can be efficiently transmitted and the characteristic impedance matching can be maintained during high-frequency signal transmission. The bi-wire structure of the transmission lines has a diameter equal to or less than 1 millimeter, thereby allowing installation of a big number of the transmission lines such that the high-frequency test for a big number of electronic elements can be realized.
SG200702176-9A 2006-07-06 2007-03-23 High-frequency probe card and transmission line for high-frequency probe card SG138517A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95124686A TW200804822A (en) 2006-07-06 2006-07-06 High-frequency probe card and transmission line for high-frequency probe card

Publications (1)

Publication Number Publication Date
SG138517A1 true SG138517A1 (en) 2008-01-28

Family

ID=39004448

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200702176-9A SG138517A1 (en) 2006-07-06 2007-03-23 High-frequency probe card and transmission line for high-frequency probe card

Country Status (2)

Country Link
SG (1) SG138517A1 (en)
TW (1) TW200804822A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407106B (en) * 2009-09-17 2013-09-01 Mpi Corp High frequency cantilever probe card
WO2013006771A2 (en) * 2011-07-06 2013-01-10 Celadon Systems, Inc. Test systems with a probe apparatus and index mechanism
TW201305574A (en) 2011-07-22 2013-02-01 Mpi Corp High-frequency signal path adjustment method and testing device thereof
TWI512300B (en) * 2013-07-15 2015-12-11 Mpi Corp Cantilever high frequency probe card
TWI572867B (en) * 2015-06-05 2017-03-01 Mpi Corp Probe module with feedback test function (2)
TWI576590B (en) * 2015-07-03 2017-04-01 Mpi Corp Cantilever high frequency probe card
TW202035995A (en) * 2019-03-18 2020-10-01 旺矽科技股份有限公司 Probe device
TWI707145B (en) * 2019-09-24 2020-10-11 松翰股份有限公司 Probe head structure for probe card of image sensing chip

Also Published As

Publication number Publication date
TWI306154B (en) 2009-02-11
TW200804822A (en) 2008-01-16

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