SG125965A1 - Laser beam processing method and laser beam processing machine - Google Patents
Laser beam processing method and laser beam processing machineInfo
- Publication number
- SG125965A1 SG125965A1 SG200404075A SG200404075A SG125965A1 SG 125965 A1 SG125965 A1 SG 125965A1 SG 200404075 A SG200404075 A SG 200404075A SG 200404075 A SG200404075 A SG 200404075A SG 125965 A1 SG125965 A1 SG 125965A1
- Authority
- SG
- Singapore
- Prior art keywords
- laser beam
- workpiece
- plate
- beam processing
- height
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
- B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Abstract
A laser beam processing method comprising holding a plate-like workpiece having dividing lines formed in a lattice pattern on the front surface on a chuck table and applying a laser beam capable of passing through the plate-like workpiece to the plate-like workpiece held on the chuck table along the dividing lines to form a deteriorated layer in the inside of the plate-like workpiece along the dividing lines, wherein a height position detection step of detecting the position of a height of the surface on the side to which the laser beam is applied, of the plate-like workpiece held on the chuck table along a dividing line; and a laser beam application step of applying a laser beam to the workpiece along the dividing line while controlling the position of the focusing point of the laser beam corresponding to the position of the height detected in the height position detection step.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003272483A JP2005028423A (en) | 2003-07-09 | 2003-07-09 | Laser beam machining method and device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG125965A1 true SG125965A1 (en) | 2006-10-30 |
Family
ID=33562708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200404075A SG125965A1 (en) | 2003-07-09 | 2004-06-30 | Laser beam processing method and laser beam processing machine |
Country Status (5)
Country | Link |
---|---|
US (2) | US20050006358A1 (en) |
JP (1) | JP2005028423A (en) |
CN (1) | CN1575908A (en) |
DE (1) | DE102004033132A1 (en) |
SG (1) | SG125965A1 (en) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005297012A (en) * | 2004-04-13 | 2005-10-27 | Disco Abrasive Syst Ltd | Laser beam machining apparatus |
JP2006059839A (en) * | 2004-08-17 | 2006-03-02 | Oki Electric Ind Co Ltd | Semiconductor device and its manufacturing method |
JP4664710B2 (en) * | 2005-03-09 | 2011-04-06 | 株式会社ディスコ | Laser processing equipment |
JP4198123B2 (en) | 2005-03-22 | 2008-12-17 | 浜松ホトニクス株式会社 | Laser processing method |
JP4694880B2 (en) * | 2005-04-26 | 2011-06-08 | 株式会社ディスコ | Laser processing equipment |
JP4705418B2 (en) * | 2005-06-29 | 2011-06-22 | 株式会社ディスコ | Wafer processing method |
JP5036181B2 (en) * | 2005-12-15 | 2012-09-26 | 株式会社ディスコ | Laser processing equipment |
JP4767711B2 (en) * | 2006-02-16 | 2011-09-07 | 株式会社ディスコ | Wafer division method |
JP4917382B2 (en) * | 2006-08-09 | 2012-04-18 | 株式会社ディスコ | Laser beam irradiation device and laser processing machine |
JP2008207210A (en) * | 2007-02-26 | 2008-09-11 | Disco Abrasive Syst Ltd | Laser beam radiating apparatus, and laser beam machine |
US7982162B2 (en) * | 2007-05-15 | 2011-07-19 | Corning Incorporated | Method and apparatus for scoring and separating a brittle material with a single beam of radiation |
US7971012B2 (en) * | 2007-05-15 | 2011-06-28 | Pitney Bowes Inc. | Mail processing computer automatic recovery system and method |
JP2009140959A (en) * | 2007-12-03 | 2009-06-25 | Tokyo Seimitsu Co Ltd | Laser dicing device and dicing method |
KR101142290B1 (en) * | 2007-12-21 | 2012-05-07 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Laser processing apparatus and laser processing method |
JP5213112B2 (en) * | 2008-06-17 | 2013-06-19 | 株式会社ディスコ | Laser processing method and laser processing apparatus |
JP2010000517A (en) * | 2008-06-19 | 2010-01-07 | Disco Abrasive Syst Ltd | Device and program for working workpiece |
JP5329199B2 (en) * | 2008-12-16 | 2013-10-30 | 株式会社ディスコ | Laser processing apparatus, laser processing control method, and laser processing program |
CN101474733B (en) * | 2009-01-16 | 2011-07-13 | 山东科技大学 | Method for welding shipping container top reinforcing plate and welding robot |
JP5213783B2 (en) * | 2009-03-31 | 2013-06-19 | 三菱電機株式会社 | Laser processing apparatus and laser processing method |
JP5641835B2 (en) | 2010-09-10 | 2014-12-17 | 株式会社ディスコ | Split method |
TWI576320B (en) | 2010-10-29 | 2017-04-01 | 康寧公司 | Method and apparatus for cutting glass ribbon |
CN102646611B (en) * | 2011-02-17 | 2014-08-20 | 竑腾科技股份有限公司 | Method for detecting height of wafer splitting breakpoint |
JP5860228B2 (en) * | 2011-06-13 | 2016-02-16 | 株式会社ディスコ | Laser processing equipment |
TW201316425A (en) * | 2011-10-12 | 2013-04-16 | Horng Terng Automation Co Ltd | Detection method of wafer breaking |
JP2014099521A (en) * | 2012-11-15 | 2014-05-29 | Disco Abrasive Syst Ltd | Laser processing method and laser processing device |
CN103111761B (en) * | 2012-12-05 | 2015-05-20 | 大族激光科技产业集团股份有限公司 | Scribing method and scribing device |
JP6494382B2 (en) * | 2015-04-06 | 2019-04-03 | 株式会社ディスコ | Wafer generation method |
DE102016000051A1 (en) * | 2016-01-05 | 2017-07-06 | Siltectra Gmbh | Method and apparatus for planar generation of modifications in solids |
KR102551442B1 (en) | 2017-04-20 | 2023-07-06 | 실텍트라 게엠베하 | How to produce wafers with defined oriented crystal lines |
JP6907011B2 (en) * | 2017-04-24 | 2021-07-21 | 株式会社ディスコ | Laser processing equipment and laser processing method |
JP6955893B2 (en) * | 2017-04-25 | 2021-10-27 | 株式会社ディスコ | Evaluation jig for the height position detection unit of the laser processing device and evaluation method for the height position detection unit of the laser processing device |
JP7106210B2 (en) * | 2018-04-06 | 2022-07-26 | 株式会社ディスコ | Workpiece processing method |
JP7235563B2 (en) * | 2019-03-29 | 2023-03-08 | 株式会社ディスコ | Laser processing method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11201719A (en) * | 1998-01-09 | 1999-07-30 | Nikon Corp | Position measuring device and laser beam machining device |
JP2005150537A (en) * | 2003-11-18 | 2005-06-09 | Disco Abrasive Syst Ltd | Method and device for working plate-shaped object |
US20050224475A1 (en) * | 2004-04-13 | 2005-10-13 | Disco Corporation | Laser beam processing machine |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06210475A (en) * | 1993-01-14 | 1994-08-02 | Fanuc Ltd | Height sensor device for laser robot |
US5718832A (en) * | 1993-10-15 | 1998-02-17 | Fanuc Ltd. | Laser beam machine to detect presence or absence of a work piece |
DE4418845C5 (en) * | 1994-05-30 | 2012-01-05 | Synova S.A. | Method and device for material processing using a laser beam |
JP3498895B2 (en) * | 1997-09-25 | 2004-02-23 | シャープ株式会社 | Substrate cutting method and display panel manufacturing method |
US6392683B1 (en) * | 1997-09-26 | 2002-05-21 | Sumitomo Heavy Industries, Ltd. | Method for making marks in a transparent material by using a laser |
WO2000019167A1 (en) * | 1998-09-30 | 2000-04-06 | Lasertec Gmbh | Calibrating a depth sensor of a laser-processing device and producing a die layer by layer using variable programming |
US6483071B1 (en) * | 2000-05-16 | 2002-11-19 | General Scanning Inc. | Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site |
JP4659300B2 (en) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | Laser processing method and semiconductor chip manufacturing method |
US6676878B2 (en) * | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
US6596967B2 (en) * | 2000-10-24 | 2003-07-22 | Edward Miesak | Laser based etching device |
US6720567B2 (en) * | 2001-01-30 | 2004-04-13 | Gsi Lumonics Corporation | Apparatus and method for focal point control for laser machining |
US6495794B2 (en) * | 2001-01-31 | 2002-12-17 | Hanmin Shi | Rapid prototyping method using 3-D laser inner cutting |
DE10131610C1 (en) * | 2001-06-29 | 2003-02-20 | Siemens Dematic Ag | Method for calibrating the optical system of a laser machine for processing electrical circuit substrates |
US6744009B1 (en) * | 2002-04-02 | 2004-06-01 | Seagate Technology Llc | Combined laser-scribing and laser-breaking for shaping of brittle substrates |
JP3607259B2 (en) * | 2002-04-16 | 2005-01-05 | ヤマザキマザック株式会社 | 3D linear processing equipment |
JP2003320466A (en) * | 2002-05-07 | 2003-11-11 | Disco Abrasive Syst Ltd | Processing machine using laser beam |
US20040144760A1 (en) * | 2002-05-17 | 2004-07-29 | Cahill Steven P. | Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein |
JP2004343008A (en) * | 2003-05-19 | 2004-12-02 | Disco Abrasive Syst Ltd | Workpiece dividing method utilizing laser beam |
-
2003
- 2003-07-09 JP JP2003272483A patent/JP2005028423A/en active Pending
-
2004
- 2004-06-30 SG SG200404075A patent/SG125965A1/en unknown
- 2004-07-01 US US10/880,452 patent/US20050006358A1/en not_active Abandoned
- 2004-07-08 DE DE200410033132 patent/DE102004033132A1/en not_active Withdrawn
- 2004-07-09 CN CNA2004100638112A patent/CN1575908A/en active Pending
-
2007
- 2007-12-21 US US12/004,405 patent/US20080105662A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11201719A (en) * | 1998-01-09 | 1999-07-30 | Nikon Corp | Position measuring device and laser beam machining device |
JP2005150537A (en) * | 2003-11-18 | 2005-06-09 | Disco Abrasive Syst Ltd | Method and device for working plate-shaped object |
US20050224475A1 (en) * | 2004-04-13 | 2005-10-13 | Disco Corporation | Laser beam processing machine |
Also Published As
Publication number | Publication date |
---|---|
DE102004033132A1 (en) | 2005-02-10 |
US20080105662A1 (en) | 2008-05-08 |
CN1575908A (en) | 2005-02-09 |
JP2005028423A (en) | 2005-02-03 |
US20050006358A1 (en) | 2005-01-13 |
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