SG114522A1 - Apparatus and methods for improving uniform cover tape adhesion on a carrier tape - Google Patents
Apparatus and methods for improving uniform cover tape adhesion on a carrier tapeInfo
- Publication number
- SG114522A1 SG114522A1 SG200200345A SG200200345A SG114522A1 SG 114522 A1 SG114522 A1 SG 114522A1 SG 200200345 A SG200200345 A SG 200200345A SG 200200345 A SG200200345 A SG 200200345A SG 114522 A1 SG114522 A1 SG 114522A1
- Authority
- SG
- Singapore
- Prior art keywords
- methods
- uniform cover
- adhesion
- tape
- improving uniform
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/767,359 US20030019784A1 (en) | 2000-01-14 | 2001-01-22 | Apparatus and methods for improving uniform cover tape adhesion on a carrier tape |
Publications (1)
Publication Number | Publication Date |
---|---|
SG114522A1 true SG114522A1 (en) | 2005-09-28 |
Family
ID=25079236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200200345A SG114522A1 (en) | 2001-01-22 | 2002-01-21 | Apparatus and methods for improving uniform cover tape adhesion on a carrier tape |
Country Status (4)
Country | Link |
---|---|
CN (1) | CN1367120A (en) |
HK (1) | HK1048291A1 (en) |
SG (1) | SG114522A1 (en) |
TW (1) | TW577852B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9211988B2 (en) * | 2009-09-18 | 2015-12-15 | Cao Group, Inc. | Packaging for gummy substratum |
DE102010005048A1 (en) * | 2010-01-20 | 2011-07-21 | SEMIKRON Elektronik GmbH & Co. KG, 90431 | Arrangement with at least one power semiconductor module and with a transport packaging |
TWI617497B (en) * | 2017-01-26 | 2018-03-11 | 華邦電子股份有限公司 | Tape and reel packaging material |
CN111439407B (en) * | 2017-05-31 | 2022-04-26 | 深圳市宝尔威精密机械有限公司 | Error-proofing component of SMD carrier tape general material receiving machine |
JP2019094078A (en) * | 2017-11-20 | 2019-06-20 | 信越ポリマー株式会社 | Carrier tape and method for molding carrier tape |
CN112512926B (en) * | 2018-08-08 | 2023-04-04 | 克里奥瓦克公司 | Apparatus and method for vacuum skin packaging of products |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4736841A (en) * | 1985-02-20 | 1988-04-12 | Murata Manufacturing Co., Ltd. | Electronic component series |
US5265723A (en) * | 1992-09-30 | 1993-11-30 | Advantek, Inc. | Microchip storage tape and cover therefor |
US5499717A (en) * | 1993-09-30 | 1996-03-19 | Yayoi Corporation | Embossed carrier tape system |
US5526935A (en) * | 1995-02-15 | 1996-06-18 | Minnesota Mining And Manufacturing Company | Component carrier tape |
-
2002
- 2002-01-21 TW TW91100896A patent/TW577852B/en not_active IP Right Cessation
- 2002-01-21 SG SG200200345A patent/SG114522A1/en unknown
- 2002-01-22 CN CN 02102461 patent/CN1367120A/en active Pending
-
2003
- 2003-01-23 HK HK03100566.1A patent/HK1048291A1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4736841A (en) * | 1985-02-20 | 1988-04-12 | Murata Manufacturing Co., Ltd. | Electronic component series |
US5265723A (en) * | 1992-09-30 | 1993-11-30 | Advantek, Inc. | Microchip storage tape and cover therefor |
US5499717A (en) * | 1993-09-30 | 1996-03-19 | Yayoi Corporation | Embossed carrier tape system |
US5526935A (en) * | 1995-02-15 | 1996-06-18 | Minnesota Mining And Manufacturing Company | Component carrier tape |
Also Published As
Publication number | Publication date |
---|---|
HK1048291A1 (en) | 2003-03-28 |
CN1367120A (en) | 2002-09-04 |
TW577852B (en) | 2004-03-01 |
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