SG11202110914XA - Test device - Google Patents

Test device

Info

Publication number
SG11202110914XA
SG11202110914XA SG11202110914XA SG11202110914XA SG11202110914XA SG 11202110914X A SG11202110914X A SG 11202110914XA SG 11202110914X A SG11202110914X A SG 11202110914XA SG 11202110914X A SG11202110914X A SG 11202110914XA SG 11202110914X A SG11202110914X A SG 11202110914XA
Authority
SG
Singapore
Prior art keywords
test device
test
Prior art date
Application number
SG11202110914XA
Inventor
Chang-Hyun Song
Jae-Hwan Jeong
Original Assignee
Leeno Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leeno Ind Inc filed Critical Leeno Ind Inc
Publication of SG11202110914XA publication Critical patent/SG11202110914XA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/045—Sockets or component fixtures for RF or HF testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
SG11202110914XA 2019-04-22 2020-04-17 Test device SG11202110914XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020190046788A KR102174427B1 (en) 2019-04-22 2019-04-22 Test Device
PCT/KR2020/005149 WO2020218779A1 (en) 2019-04-22 2020-04-17 Test device

Publications (1)

Publication Number Publication Date
SG11202110914XA true SG11202110914XA (en) 2021-10-28

Family

ID=72941068

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202110914XA SG11202110914XA (en) 2019-04-22 2020-04-17 Test device

Country Status (7)

Country Link
US (1) US11892472B2 (en)
EP (1) EP3918348A4 (en)
KR (1) KR102174427B1 (en)
CN (1) CN113597561A (en)
SG (1) SG11202110914XA (en)
TW (1) TWI741531B (en)
WO (1) WO2020218779A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113504468B (en) * 2021-09-13 2022-02-08 苏州华兴源创科技股份有限公司 Detection equipment for key assembly

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2709990B2 (en) * 1991-09-10 1998-02-04 日立電子エンジニアリング株式会社 IC tester measurement jig
JPH0720606Y2 (en) * 1991-12-27 1995-05-15 スタック電子株式会社 Command switch mechanism
JP2584580Y2 (en) * 1992-02-14 1998-11-05 沖電気工業株式会社 Semiconductor element measurement probe
JPH0799220A (en) * 1993-08-04 1995-04-11 Tokyo Electron Ltd Probe card, coaxial probe needle for probe card and their production
US6232789B1 (en) * 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
JP2001357914A (en) 2000-06-13 2001-12-26 Advantest Corp Connecting structure of coaxial cable to electric circuit board
US6515499B1 (en) 2000-09-28 2003-02-04 Teradyne, Inc. Modular semiconductor tester interface assembly for high performance coaxial connections
JP2003270291A (en) 2002-03-18 2003-09-25 Murata Mfg Co Ltd Inspection device for high-frequency product
JP2003307552A (en) 2002-04-17 2003-10-31 Tokyo Electron Ltd Contact body for signal detection and signal calibrating device
JP4251855B2 (en) 2002-11-19 2009-04-08 株式会社ヨコオ Manufacturing method of inspection jigs for high frequency and high speed devices
US7057410B1 (en) * 2003-05-14 2006-06-06 Credence Systems Corporation Interface structure for semiconductor integrated circuit test equipment
US20060079102A1 (en) * 2004-10-13 2006-04-13 The Ludlow Company Lp Cable terminal with flexible contacts
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
WO2006137979A2 (en) 2005-06-13 2006-12-28 Cascade Microtech, Inc. Wideband active-passive differential signal probe
US7405582B2 (en) 2006-06-01 2008-07-29 Advantest Corporation Measurement board for electronic device test apparatus
KR100808875B1 (en) 2006-08-14 2008-03-03 삼성전자주식회사 Connector of coaxial cable and connecting assembly of coaxial cable including the same
JP2008070146A (en) * 2006-09-12 2008-03-27 Yokowo Co Ltd Socket for inspection
JPWO2009098770A1 (en) * 2008-02-07 2011-05-26 株式会社アドバンテスト Product exchange unit and manufacturing method
DE202009003966U1 (en) 2009-03-20 2009-06-04 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg measuring tips
JP6380549B2 (en) * 2014-11-07 2018-08-29 株式会社村田製作所 probe
KR101882209B1 (en) * 2016-03-23 2018-07-27 리노공업주식회사 Coaxial Test Socket Assembly
KR101962529B1 (en) * 2017-01-03 2019-03-26 주식회사 텝스 Vertical ultra-low leakage current probe card for dc parameter test
CN109239421A (en) * 2018-09-11 2019-01-18 深圳市矽电半导体设备有限公司 Conducting probe and use and manufacturing method reduce the method that conducting probe discharges

Also Published As

Publication number Publication date
EP3918348A4 (en) 2022-03-23
KR20200123646A (en) 2020-10-30
CN113597561A (en) 2021-11-02
KR102174427B1 (en) 2020-11-05
WO2020218779A1 (en) 2020-10-29
TWI741531B (en) 2021-10-01
EP3918348A1 (en) 2021-12-08
US20220155341A1 (en) 2022-05-19
US11892472B2 (en) 2024-02-06
TW202045932A (en) 2020-12-16

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