SG11202106434VA - Hybrid system architecture for thin film deposition - Google Patents

Hybrid system architecture for thin film deposition

Info

Publication number
SG11202106434VA
SG11202106434VA SG11202106434VA SG11202106434VA SG11202106434VA SG 11202106434V A SG11202106434V A SG 11202106434VA SG 11202106434V A SG11202106434V A SG 11202106434VA SG 11202106434V A SG11202106434V A SG 11202106434VA SG 11202106434V A SG11202106434V A SG 11202106434VA
Authority
SG
Singapore
Prior art keywords
thin film
system architecture
film deposition
hybrid system
hybrid
Prior art date
Application number
SG11202106434VA
Inventor
Terry Bluck
Original Assignee
Intevac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/583,165 external-priority patent/US11414748B2/en
Application filed by Intevac Inc filed Critical Intevac Inc
Priority claimed from PCT/US2019/067235 external-priority patent/WO2020132105A1/en
Publication of SG11202106434VA publication Critical patent/SG11202106434VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
SG11202106434VA 2018-12-18 2019-12-18 Hybrid system architecture for thin film deposition SG11202106434VA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862781577P 2018-12-18 2018-12-18
US16/583,165 US11414748B2 (en) 2019-09-25 2019-09-25 System with dual-motion substrate carriers
PCT/US2019/067235 WO2020132105A1 (en) 2018-12-18 2019-12-18 Hybrid system architecture for thin film deposition

Publications (1)

Publication Number Publication Date
SG11202106434VA true SG11202106434VA (en) 2021-07-29

Family

ID=77338426

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202106434VA SG11202106434VA (en) 2018-12-18 2019-12-18 Hybrid system architecture for thin film deposition

Country Status (4)

Country Link
JP (1) JP2022538949A (en)
KR (1) KR102543798B1 (en)
CN (1) CN113811427A (en)
SG (1) SG11202106434VA (en)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6719516B2 (en) * 1998-09-28 2004-04-13 Applied Materials, Inc. Single wafer load lock with internal wafer transport
JP2002305232A (en) * 2001-01-22 2002-10-18 Cosam Inc Semiconductor producing device
US20030010449A1 (en) * 2001-07-16 2003-01-16 Gramarossa Daniel J. Automatic wafer processing and plating system
US7286890B2 (en) * 2005-06-28 2007-10-23 Tokyo Electron Limited Transfer apparatus for target object
EP2118334A1 (en) * 2007-03-02 2009-11-18 Oerlikon Trading AG, Trübbach Vacuum coating apparatus
KR101718540B1 (en) * 2009-02-27 2017-03-21 인테벡, 인코포레이티드 Apparatus and methods for transporting and processing substrates
WO2013070978A2 (en) * 2011-11-08 2013-05-16 Intevac, Inc. Substrate processing system and method
MY171044A (en) * 2011-12-27 2019-09-23 Intevac Inc System architecture for combined static and pass-by processing
WO2015149848A1 (en) * 2014-04-02 2015-10-08 Applied Materials, Inc. System for substrate processing, vacuum rotation module for a system for substrate processing and method of operating a substrate processing system
EP3655562A1 (en) * 2017-07-19 2020-05-27 Intevac, Inc. System for forming nano-laminate optical coating

Also Published As

Publication number Publication date
KR20210153030A (en) 2021-12-16
JP2022538949A (en) 2022-09-07
KR102543798B1 (en) 2023-06-14
CN113811427A (en) 2021-12-17

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