SG11202105857RA - Improved resistivity stabilization measurement of fat neck slabs for high resistivity and ultra-high resistivity single crystal silicon ingot growth - Google Patents

Improved resistivity stabilization measurement of fat neck slabs for high resistivity and ultra-high resistivity single crystal silicon ingot growth

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Publication number
SG11202105857RA
SG11202105857RA SG11202105857RA SG11202105857RA SG11202105857RA SG 11202105857R A SG11202105857R A SG 11202105857RA SG 11202105857R A SG11202105857R A SG 11202105857RA SG 11202105857R A SG11202105857R A SG 11202105857RA SG 11202105857R A SG11202105857R A SG 11202105857RA
Authority
SG
Singapore
Prior art keywords
resistivity
high resistivity
slabs
ultra
single crystal
Prior art date
Application number
SG11202105857RA
Inventor
Hyungmin Lee
Jaewoo Ryu
Richard J Phillips
Robert Wendell Standley
Carissima Marie Hudson
Original Assignee
Globalwafers Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Globalwafers Co Ltd filed Critical Globalwafers Co Ltd
Publication of SG11202105857RA publication Critical patent/SG11202105857RA/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/02Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/02Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt
    • C30B15/04Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt adding doping materials, e.g. for n-p-junction
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/10Crucibles or containers for supporting the melt
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/14Heating of the melt or the crystallised materials
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/02Heat treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11202105857RA 2018-12-27 2019-12-13 Improved resistivity stabilization measurement of fat neck slabs for high resistivity and ultra-high resistivity single crystal silicon ingot growth SG11202105857RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862785432P 2018-12-27 2018-12-27
PCT/US2019/066187 WO2020139584A1 (en) 2018-12-27 2019-12-13 Improved resistivity stabilization measurement of fat neck slabs for high resistivity and ultra-high resistivity single crystal silicon ingot growth

Publications (1)

Publication Number Publication Date
SG11202105857RA true SG11202105857RA (en) 2021-07-29

Family

ID=69160399

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202105857RA SG11202105857RA (en) 2018-12-27 2019-12-13 Improved resistivity stabilization measurement of fat neck slabs for high resistivity and ultra-high resistivity single crystal silicon ingot growth

Country Status (8)

Country Link
US (2) US11739437B2 (en)
EP (2) EP3902942B1 (en)
JP (1) JP2022515283A (en)
KR (1) KR20210109540A (en)
CN (1) CN113227464A (en)
SG (1) SG11202105857RA (en)
TW (1) TW202031944A (en)
WO (1) WO2020139584A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
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CN113655094B (en) * 2021-08-06 2024-01-19 上海新昇半导体科技有限公司 Method for determining conductivity type of silicon wafer
CN113721076A (en) * 2021-08-09 2021-11-30 上海新昇半导体科技有限公司 Method for measuring resistivity of silicon wafer
CN114454364A (en) * 2021-08-19 2022-05-10 青岛高测科技股份有限公司 Silicon rod cutting method, device and system

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JPS59190300A (en) 1983-04-08 1984-10-29 Hitachi Ltd Method and apparatus for production of semiconductor
JPS6395629A (en) 1986-10-13 1988-04-26 Hitachi Ltd Processing instruction device for semiconductor single crystal ingot
US5449883A (en) * 1992-08-07 1995-09-12 Mitsubishi Materials Corporation Continuous heat treatment system of semiconductor wafers for eliminating thermal donor
JP2001326108A (en) * 2000-05-18 2001-11-22 Mitsubishi Electric Corp Voltage nonlinear resistor and its manufacturing method
JP4463957B2 (en) * 2000-09-20 2010-05-19 信越半導体株式会社 Silicon wafer manufacturing method and silicon wafer
US6743495B2 (en) * 2001-03-30 2004-06-01 Memc Electronic Materials, Inc. Thermal annealing process for producing silicon wafers with improved surface characteristics
JP2004006615A (en) * 2002-04-26 2004-01-08 Sumitomo Mitsubishi Silicon Corp High resistance silicon wafer and its manufacturing method
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US7074271B2 (en) * 2004-02-23 2006-07-11 Sumitomo Mitsubishi Silicon Corporation Method of identifying defect distribution in silicon single crystal ingot
KR101111436B1 (en) * 2004-09-13 2012-02-15 신에쯔 한도타이 가부시키가이샤 Soi wafer manufacturing method and soi wafer
DE102005013831B4 (en) * 2005-03-24 2008-10-16 Siltronic Ag Silicon wafer and method for the thermal treatment of a silicon wafer
JP2008545605A (en) * 2005-05-19 2008-12-18 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド High resistivity silicon structure and manufacturing method thereof
JP4868880B2 (en) * 2006-02-15 2012-02-01 富士通株式会社 Silicon wafer processing method and wafer processing apparatus
CN101908486B (en) * 2009-06-08 2012-05-23 刘有 Novel process for applying neutron transmutation doping transverse magnetic field czochralski silicon to high-power semiconductor device
JP5767461B2 (en) 2010-12-14 2015-08-19 Sumco Techxiv株式会社 Manufacturing method of semiconductor wafer
CN102181919B (en) * 2011-04-13 2012-12-26 天津市环欧半导体材料技术有限公司 Method for controlling resistivity of head of Czochralski silicon
JP5817542B2 (en) 2012-01-12 2015-11-18 信越半導体株式会社 Silicon substrate manufacturing method
DE102012213793B3 (en) * 2012-08-03 2013-10-24 Solarworld Innovations Gmbh Method for inspecting wire-sawn silicon substrate for solar cell, involves exposing silicon substrate with infrared radiation and detecting infrared radiation transmitted by silicon substrate, where detected infrared radiation is evaluated
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FR3045074B1 (en) * 2015-12-14 2018-01-05 Commissariat A L'energie Atomique Et Aux Energies Alternatives METHOD FOR ADJUSTING THE RESISTIVITY OF A SEMICONDUCTOR INGOT DURING ITS MANUFACTURE
WO2017137438A1 (en) * 2016-02-08 2017-08-17 Topsil Globalwafers A/S A phosphorus doped silicon single crystal
US10920337B2 (en) 2016-12-28 2021-02-16 Globalwafers Co., Ltd. Methods for forming single crystal silicon ingots with improved resistivity control
US10793969B2 (en) 2018-06-27 2020-10-06 Globalwafers Co., Ltd. Sample rod growth and resistivity measurement during single crystal silicon ingot production

Also Published As

Publication number Publication date
US20200208294A1 (en) 2020-07-02
WO2020139584A1 (en) 2020-07-02
TW202031944A (en) 2020-09-01
US20230340690A1 (en) 2023-10-26
EP3902942A1 (en) 2021-11-03
EP4209625A1 (en) 2023-07-12
US11739437B2 (en) 2023-08-29
CN113227464A (en) 2021-08-06
EP3902942B1 (en) 2023-03-22
WO2020139584A8 (en) 2021-06-24
JP2022515283A (en) 2022-02-17
KR20210109540A (en) 2021-09-06

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