SG11202012537RA - Methods for manufacturing a roll carrier for electronic components, a chip-card module and a chip-card, and a carrier for electronic components - Google Patents

Methods for manufacturing a roll carrier for electronic components, a chip-card module and a chip-card, and a carrier for electronic components

Info

Publication number
SG11202012537RA
SG11202012537RA SG11202012537RA SG11202012537RA SG11202012537RA SG 11202012537R A SG11202012537R A SG 11202012537RA SG 11202012537R A SG11202012537R A SG 11202012537RA SG 11202012537R A SG11202012537R A SG 11202012537RA SG 11202012537R A SG11202012537R A SG 11202012537RA
Authority
SG
Singapore
Prior art keywords
chip
electronic components
carrier
card
manufacturing
Prior art date
Application number
SG11202012537RA
Inventor
Christophe Mathieu
Original Assignee
Linxens Holding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linxens Holding filed Critical Linxens Holding
Publication of SG11202012537RA publication Critical patent/SG11202012537RA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Credit Cards Or The Like (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
SG11202012537RA 2018-06-15 2019-06-12 Methods for manufacturing a roll carrier for electronic components, a chip-card module and a chip-card, and a carrier for electronic components SG11202012537RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1870711A FR3082696B1 (en) 2018-06-15 2018-06-15 METHOD OF MANUFACTURING A ROLL HOLDER FOR ELECTRONIC COMPONENTS, A CHIP CARD MODULE AND A CHIP CARD, AS WELL AS A HOLDER FOR ELECTRONIC COMPONENTS
PCT/FR2019/051413 WO2019239061A1 (en) 2018-06-15 2019-06-12 Methods for manufacturing a roll medium for electronic components, a chip-card module and a chip card, and a medium for electronic components

Publications (1)

Publication Number Publication Date
SG11202012537RA true SG11202012537RA (en) 2021-02-25

Family

ID=63491821

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202012537RA SG11202012537RA (en) 2018-06-15 2019-06-12 Methods for manufacturing a roll carrier for electronic components, a chip-card module and a chip-card, and a carrier for electronic components

Country Status (7)

Country Link
US (1) US11412620B2 (en)
EP (1) EP3815479A1 (en)
KR (1) KR102674926B1 (en)
CN (1) CN112335347B (en)
FR (1) FR3082696B1 (en)
SG (1) SG11202012537RA (en)
WO (1) WO2019239061A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3063555B1 (en) * 2017-03-03 2021-07-09 Linxens Holding CHIP CARD AND PROCESS FOR MANUFACTURING A CHIP CARD
KR102565999B1 (en) * 2022-08-04 2023-08-10 안승배 Small parts carrier and manufacturing method therefor
FR3141833A1 (en) 2022-11-03 2024-05-10 Linxens Holding Process for manufacturing a roll support for electronic components

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0787277B2 (en) * 1987-03-25 1995-09-20 ティーディーケイ株式会社 Board mounting method for surface mount components
FR2769110B1 (en) * 1997-09-26 1999-12-03 Gemplus Card Int METHOD FOR MANUFACTURING AN ELECTRONIC MODULE OR LABEL, MODULE OR LABEL OBTAINED AND SUPPORT COMPRISING SUCH A MODULE OR LABEL
FR2785071B1 (en) * 1998-10-26 2002-10-25 Gemplus Card Int METHOD FOR MANUFACTURING A CHIP CARD AND AN ELECTRONIC MODULE TO BE INSERTED IN SUCH A CARD
DE10110939B4 (en) * 2001-03-07 2004-07-08 Mühlbauer Ag Method and device for hot press connecting a chip module to a carrier substrate
DE10122416A1 (en) * 2001-05-09 2002-11-14 Giesecke & Devrient Gmbh Method and semi-finished product for producing a chip card with a coil
DE102010025774A1 (en) * 2010-07-01 2012-01-05 Giesecke & Devrient Gmbh Method of making an inlay for a portable data carrier and inlay
US10193211B2 (en) * 2014-08-10 2019-01-29 Féinics Amatech Teoranta Smartcards, RFID devices, wearables and methods
FR3049739B1 (en) * 2016-03-30 2021-03-12 Linxens Holding METHODS OF MANUFACTURING CHIP CARDS AND ANTENNA BRACKETS FOR CHIP CARDS
FR3051063B1 (en) * 2016-05-06 2021-02-12 Linxens Holding PROCESS FOR MANUFACTURING CHIP CARDS AND CHIP CARD OBTAINED BY THIS PROCESS

Also Published As

Publication number Publication date
US20210251084A1 (en) 2021-08-12
FR3082696A1 (en) 2019-12-20
CN112335347A (en) 2021-02-05
KR20210020099A (en) 2021-02-23
KR102674926B1 (en) 2024-06-14
WO2019239061A1 (en) 2019-12-19
CN112335347B (en) 2023-02-10
FR3082696B1 (en) 2020-09-11
US11412620B2 (en) 2022-08-09
EP3815479A1 (en) 2021-05-05

Similar Documents

Publication Publication Date Title
EP3519616A4 (en) Smart yarn and method for manufacturing a yarn containing an electronic device
EP3539285A4 (en) A smart case for electronic wearable device
EP3644596A4 (en) Camera module and electronic device having same, and method for manufacturing camera module
EP3245618A4 (en) Smart card systems comprising a card and a carrier
PL3143557T3 (en) Method for producing a circuit for a chip card module and circuit for a chip card module
PT3572478T (en) Adhesive film, and method for manufacturing electronic device
EP3646239A4 (en) Fingerprint sensor module comprising antenna and method for manufacturing a fingerprint sensor module
SG11202012537RA (en) Methods for manufacturing a roll carrier for electronic components, a chip-card module and a chip-card, and a carrier for electronic components
EP3813193C0 (en) Electronic device including antenna module
GB2536068B (en) Method for configuring an electronic element in a lighting system, electronic element and configuring system
ZA201805784B (en) Integrated circuit modules and smart cards incorporating the same
IL238581A0 (en) An electronic card assembly, an electronic device and a method for using thereof
EP3722268A4 (en) Functional element, method for manufacturing functional element, and electronic device
HK1245744A1 (en) Carrier tape for electronic component storage tape, electronic component storage tape, and method for manufacturing electronic component storage tape
SG11201806384RA (en) Method for manufacturing a smart card module and a smart card
SG11202103548XA (en) Electronic module for chip card
GB201412958D0 (en) Method for manufacturing a printed circuit board, printed circuit board and rear view device
PT3825918T (en) Label with electronic chip for a barrel and method for manufacturing same
EP3486819A4 (en) Ic module, ic card, and collation device
EP3764467C0 (en) Electronic device including antenna module
GB2589361B (en) Wearable article, electronic module, system and method
EP3552198C0 (en) An electronic display and a display module, especially for trolleys
EP3518032A4 (en) Camera module, manufacturing method, and electronic device
EP3686709A4 (en) Structural assembly, electronic device, and method for assembling fingerprint module
EP3394796B8 (en) Electronic wireless communication device comprising two electronic chips and method for manufacturing such a device