SG11202007405TA - Method and apparatus for cleaning substrates - Google Patents

Method and apparatus for cleaning substrates

Info

Publication number
SG11202007405TA
SG11202007405TA SG11202007405TA SG11202007405TA SG11202007405TA SG 11202007405T A SG11202007405T A SG 11202007405TA SG 11202007405T A SG11202007405T A SG 11202007405TA SG 11202007405T A SG11202007405T A SG 11202007405TA SG 11202007405T A SG11202007405T A SG 11202007405TA
Authority
SG
Singapore
Prior art keywords
cleaning substrates
substrates
cleaning
Prior art date
Application number
SG11202007405TA
Inventor
Hui Wang
Xi Wang
Fuping Chen
Xiaoyan Zhang
Fufa Chen
Original Assignee
Acm Res Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Res Shanghai Inc filed Critical Acm Res Shanghai Inc
Publication of SG11202007405TA publication Critical patent/SG11202007405TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2220/00—Type of materials or objects being removed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2240/00—Type of materials or objects being cleaned
SG11202007405TA 2018-02-07 2018-02-07 Method and apparatus for cleaning substrates SG11202007405TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/075550 WO2019153134A1 (en) 2018-02-07 2018-02-07 Method and apparatus for cleaning substrates

Publications (1)

Publication Number Publication Date
SG11202007405TA true SG11202007405TA (en) 2020-09-29

Family

ID=67547762

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202007405TA SG11202007405TA (en) 2018-02-07 2018-02-07 Method and apparatus for cleaning substrates

Country Status (6)

Country Link
US (1) US11911807B2 (en)
JP (1) JP7373492B2 (en)
KR (1) KR102512832B1 (en)
CN (1) CN111656486A (en)
SG (1) SG11202007405TA (en)
WO (1) WO2019153134A1 (en)

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0719765B2 (en) * 1986-01-17 1995-03-06 松下電器産業株式会社 Processing method
JPH0795541B2 (en) 1986-07-02 1995-10-11 松下電器産業株式会社 Processing method
JPH04311035A (en) * 1991-04-10 1992-11-02 Fujitsu Ltd Manufacture of semiconductor device
US5427622A (en) * 1993-02-12 1995-06-27 International Business Machines Corporation Method for uniform cleaning of wafers using megasonic energy
TW355815B (en) * 1996-05-28 1999-04-11 Canon Kasei Kk Cleaning methods of porous surface and semiconductor surface
US6058945A (en) 1996-05-28 2000-05-09 Canon Kabushiki Kaisha Cleaning methods of porous surface and semiconductor surface
US6138698A (en) * 1997-11-20 2000-10-31 Tokyo Electron Limited Ultrasonic cleaning apparatus
JP4917651B2 (en) * 1999-08-12 2012-04-18 アクアサイエンス株式会社 Resist film removing apparatus and resist film removing method
TW498471B (en) * 2001-07-13 2002-08-11 Taiwan Semiconductor Mfg Manufacturing method for solder bump
JP4187540B2 (en) 2003-01-31 2008-11-26 大日本スクリーン製造株式会社 Substrate processing method
JP4311035B2 (en) 2003-02-17 2009-08-12 セイコーエプソン株式会社 Printing apparatus, printing method, computer program for printing, computer system for printing, and correction pattern for printing
US7718009B2 (en) * 2004-08-30 2010-05-18 Applied Materials, Inc. Cleaning submicron structures on a semiconductor wafer surface
US7879783B2 (en) 2007-01-11 2011-02-01 Air Products And Chemicals, Inc. Cleaning composition for semiconductor substrates
JP5413016B2 (en) * 2008-07-31 2014-02-12 東京エレクトロン株式会社 Substrate cleaning method, substrate cleaning apparatus and storage medium
US20100224215A1 (en) 2009-03-06 2010-09-09 Imec Method for Reducing the Damage Induced by a Physical Force Assisted Cleaning
US9455139B2 (en) * 2009-06-17 2016-09-27 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US20120052204A1 (en) 2010-08-31 2012-03-01 Applied Materials, Inc. Workpiece wetting and cleaning
US10714436B2 (en) * 2012-12-12 2020-07-14 Lam Research Corporation Systems and methods for achieving uniformity across a redistribution layer
US9613833B2 (en) * 2013-02-20 2017-04-04 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
CN107636799B (en) * 2015-05-20 2021-12-03 盛美半导体设备(上海)股份有限公司 Method and apparatus for cleaning semiconductor substrate
JP2017216443A (en) * 2016-05-20 2017-12-07 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ System and method for achieving uniformity across redistribution layer

Also Published As

Publication number Publication date
CN111656486A (en) 2020-09-11
JP7373492B2 (en) 2023-11-02
JP2021517733A (en) 2021-07-26
WO2019153134A1 (en) 2019-08-15
KR102512832B1 (en) 2023-03-23
US20210394239A1 (en) 2021-12-23
KR20200118459A (en) 2020-10-15
US11911807B2 (en) 2024-02-27

Similar Documents

Publication Publication Date Title
SG11202107662TA (en) Apparatus and method for cybersecurity
IL290841A (en) Method and apparatus for cleaning surfaces
GB2584677B (en) Method and apparatus for trajectory-planning
SG10201911998QA (en) Substrate processing method and substrate processing apparatus
EP3773111A4 (en) Method and apparatus for executing cleaning operation
SG10201907132SA (en) Apparatus for polishing and method for polishing
IL276471B1 (en) Method and apparatus for cleaning surfaces
SG11202007852YA (en) Substrate cleaning device and substrate cleaning method
SG10201707070RA (en) Substrate cleaning apparatus and substrate cleaning method
PL3850145T3 (en) Method and apparatus for cleaning laundry
SG10201906330YA (en) Polishing apparatus and polishing method
SG10201907130YA (en) Apparatus for polishing and method for polishing
IL282349A (en) Method and apparatus for adaptive alignment
SG11202005740XA (en) Wafer cleaning apparatus and wafer cleaning method
SG10201909509UA (en) Substrate cleaning member and substrate cleaning apparatus
SG11202101370YA (en) Apparatus and method for performing deblocking
GB201905795D0 (en) Apparatus and method
EP3516684A4 (en) Methods and apparatus for cleaning substrates
EP3515611A4 (en) Methods and apparatus for cleaning substrates
SG10202010118SA (en) Substrate cleaning apparatus and cleaning method of substrate
SG10201906216RA (en) Substrate cleaning device and substrate cleaning method
SG11202007405TA (en) Method and apparatus for cleaning substrates
SG11202007002YA (en) Methods and apparatus for cleaning substrates
SG11202007003RA (en) Methods and apparatus for cleaning substrates
TWI840355B (en) Cleaning method and substrate processing apparatus