SG11202006034WA - Handler device for handling substrates - Google Patents

Handler device for handling substrates

Info

Publication number
SG11202006034WA
SG11202006034WA SG11202006034WA SG11202006034WA SG11202006034WA SG 11202006034W A SG11202006034W A SG 11202006034WA SG 11202006034W A SG11202006034W A SG 11202006034WA SG 11202006034W A SG11202006034W A SG 11202006034WA SG 11202006034W A SG11202006034W A SG 11202006034WA
Authority
SG
Singapore
Prior art keywords
handler device
handling substrates
substrates
handling
handler
Prior art date
Application number
SG11202006034WA
Inventor
Johannes Lambertus Gerardus Maria Venrooij
Henricus Antonius Maria Fierkens
Original Assignee
Besi Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Netherlands Bv filed Critical Besi Netherlands Bv
Publication of SG11202006034WA publication Critical patent/SG11202006034WA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Seal Device For Vehicle (AREA)
SG11202006034WA 2018-01-31 2019-01-16 Handler device for handling substrates SG11202006034WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2020360A NL2020360B1 (en) 2018-01-31 2018-01-31 Handler device for handling substrates
PCT/NL2019/050020 WO2019151851A1 (en) 2018-01-31 2019-01-16 Handler device for handling substrates

Publications (1)

Publication Number Publication Date
SG11202006034WA true SG11202006034WA (en) 2020-07-29

Family

ID=61628429

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202006034WA SG11202006034WA (en) 2018-01-31 2019-01-16 Handler device for handling substrates

Country Status (8)

Country Link
US (1) US11450550B2 (en)
KR (1) KR20200111796A (en)
CN (1) CN111656509A (en)
DE (1) DE112019000622T5 (en)
NL (1) NL2020360B1 (en)
SG (1) SG11202006034WA (en)
TW (1) TWI808124B (en)
WO (1) WO2019151851A1 (en)

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4813732A (en) * 1985-03-07 1989-03-21 Epsilon Technology, Inc. Apparatus and method for automated wafer handling
US5235995A (en) * 1989-03-27 1993-08-17 Semitool, Inc. Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization
KR20030016060A (en) * 2001-08-20 2003-02-26 미래산업 주식회사 Picker of Handler for testing Module IC
US6932558B2 (en) * 2002-07-03 2005-08-23 Kung Chris Wu Wafer aligner
JP2005044882A (en) 2003-07-24 2005-02-17 Nikon Corp Transporting device and aligner
US20050112279A1 (en) * 2003-11-24 2005-05-26 International Business Machines Corporation Dynamic release wafer grip and method of use
JP4502199B2 (en) * 2004-10-21 2010-07-14 ルネサスエレクトロニクス株式会社 Etching apparatus and etching method
TWI447840B (en) * 2004-11-15 2014-08-01 尼康股份有限公司 Substrate transport device, substrate transport method and exposure device
NL1036025A1 (en) * 2007-10-10 2009-04-15 Asml Netherlands Bv Method of transferring a substrate, transfer system and lithographic projection apparatus.
US20110064545A1 (en) * 2009-09-16 2011-03-17 Applied Materials, Inc. Substrate transfer mechanism with preheating features
US8941968B2 (en) * 2010-06-08 2015-01-27 Axcelis Technologies, Inc. Heated electrostatic chuck including mechanical clamp capability at high temperature
US9401296B2 (en) 2011-11-29 2016-07-26 Persimmon Technologies Corporation Vacuum robot adapted to grip and transport a substrate and method thereof with passive bias
JP5983080B2 (en) * 2012-06-20 2016-08-31 セイコーエプソン株式会社 Robot hand, robot, and gripping mechanism
ES2712975T3 (en) * 2012-10-16 2019-05-17 Beckman Coulter Inc Ramp arrangement with extraction characteristic
US9947572B2 (en) * 2014-03-26 2018-04-17 SCREEN Holdings Co., Ltd. Substrate processing apparatus
JP6335103B2 (en) * 2014-11-14 2018-05-30 株式会社荏原製作所 Substrate holding device
KR101703904B1 (en) 2015-08-28 2017-02-22 (주)오로스 테크놀로지 Wafer gripping apparatus and dual wafer stress inspection apparatus having the same
JP6660628B2 (en) * 2015-09-29 2020-03-11 株式会社Screenホールディングス Substrate holding / rotating apparatus, substrate processing apparatus having the same, and substrate processing method
US10464218B2 (en) * 2016-05-15 2019-11-05 B.G. Negev Technologies And Applications Ltd., At Ben-Gurion University Convertible frictionless to frictional fingertips for a gripper to improve robotic grasp robustness
JP6964989B2 (en) * 2017-02-09 2021-11-10 キヤノン株式会社 Control methods, robot systems, article manufacturing methods, programs, and recording media
JP6847770B2 (en) * 2017-05-31 2021-03-24 株式会社Screenホールディングス Substrate processing equipment and substrate processing method
US10759062B2 (en) * 2017-12-08 2020-09-01 Dishcraft Robotics, Inc. Article of dishware gripping systems
JP6995602B2 (en) * 2017-12-14 2022-01-14 キヤノン株式会社 Robot hand, robot hand control method, robot device, article manufacturing method, control program and recording medium

Also Published As

Publication number Publication date
TW201935607A (en) 2019-09-01
KR20200111796A (en) 2020-09-29
US20210028050A1 (en) 2021-01-28
CN111656509A (en) 2020-09-11
WO2019151851A1 (en) 2019-08-08
US11450550B2 (en) 2022-09-20
DE112019000622T5 (en) 2020-10-08
NL2020360B1 (en) 2019-08-07
TWI808124B (en) 2023-07-11

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