SG11202004250RA - System and method for improved electronic component interconnections - Google Patents

System and method for improved electronic component interconnections

Info

Publication number
SG11202004250RA
SG11202004250RA SG11202004250RA SG11202004250RA SG11202004250RA SG 11202004250R A SG11202004250R A SG 11202004250RA SG 11202004250R A SG11202004250R A SG 11202004250RA SG 11202004250R A SG11202004250R A SG 11202004250RA SG 11202004250R A SG11202004250R A SG 11202004250RA
Authority
SG
Singapore
Prior art keywords
electronic component
improved electronic
component interconnections
interconnections
improved
Prior art date
Application number
SG11202004250RA
Inventor
Andrew Stemmermann
Original Assignee
Sunray Scientific Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunray Scientific Llc filed Critical Sunray Scientific Llc
Publication of SG11202004250RA publication Critical patent/SG11202004250RA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0169—Using a temporary frame during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
SG11202004250RA 2017-11-15 2018-11-15 System and method for improved electronic component interconnections SG11202004250RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762586815P 2017-11-15 2017-11-15
PCT/US2018/061395 WO2019099754A1 (en) 2017-11-15 2018-11-15 System and method for improved electronic component interconnections

Publications (1)

Publication Number Publication Date
SG11202004250RA true SG11202004250RA (en) 2020-06-29

Family

ID=64901646

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202004250RA SG11202004250RA (en) 2017-11-15 2018-11-15 System and method for improved electronic component interconnections

Country Status (8)

Country Link
EP (1) EP3711463A1 (en)
JP (2) JP7193168B2 (en)
KR (1) KR20200111162A (en)
CN (1) CN111512708A (en)
AU (2) AU2018368939B2 (en)
CA (1) CA3082894A1 (en)
SG (1) SG11202004250RA (en)
WO (1) WO2019099754A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111586979B (en) * 2020-05-20 2021-05-18 江西省开德电子科技有限公司 Equipment for assisting in manufacturing electronic parts of integrated circuit board

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5169471A (en) * 1991-07-29 1992-12-08 Strasser Gene W Auto electrical connecting circuit board assembly
US5429701A (en) * 1992-04-14 1995-07-04 Industrial Technology Research Institute Method of electrically interconnecting conductors
JPH0669643A (en) * 1992-08-19 1994-03-11 Sony Corp Connecting method and connector of conductor and anisotropic conductive film for use therein
WO1994030034A1 (en) * 1993-06-16 1994-12-22 Nihon Almit Co., Ltd. Method of electrical connection and electric circuit mounting board, and paste for executing the method
JPH1140224A (en) * 1997-07-11 1999-02-12 Jsr Corp Anisotropic conductive sheet
AUPR424701A0 (en) * 2001-04-05 2001-05-17 Beson, Robert Magnetic holding device
US20050039323A1 (en) * 2003-08-22 2005-02-24 Simens Medical Solutions Usa, Inc. Transducers with electically conductive matching layers and methods of manufacture
US8256618B2 (en) * 2010-08-11 2012-09-04 All About Packaging, Inc. Magnetic storage device and a method of assembling the device
US20120106111A1 (en) * 2010-10-31 2012-05-03 Joseph Mazzochette Anisotropic electrically and thermally conductive adhesive with magnetic nano-particles
US9349628B2 (en) * 2013-02-25 2016-05-24 Advanced Micro Devices, Inc. Method and an alignment plate for engaging a stiffener frame and a circuit board
US9365749B2 (en) * 2013-05-31 2016-06-14 Sunray Scientific, Llc Anisotropic conductive adhesive with reduced migration
US20160254244A1 (en) * 2013-05-31 2016-09-01 Sunray Scientific, Llc Systems and Methods Utilizing Anisotropic Conductive Adhesives

Also Published As

Publication number Publication date
JP7440120B2 (en) 2024-02-28
CN111512708A (en) 2020-08-07
JP2021503186A (en) 2021-02-04
AU2023274124A1 (en) 2023-12-21
CA3082894A1 (en) 2019-05-23
WO2019099754A1 (en) 2019-05-23
AU2018368939A1 (en) 2020-06-25
JP2023025166A (en) 2023-02-21
AU2018368939B2 (en) 2023-08-31
EP3711463A1 (en) 2020-09-23
KR20200111162A (en) 2020-09-28
JP7193168B2 (en) 2022-12-20

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