SG11202000910YA - Ultrasonic cleaning device and ultrasonic cleaning system - Google Patents
Ultrasonic cleaning device and ultrasonic cleaning systemInfo
- Publication number
- SG11202000910YA SG11202000910YA SG11202000910YA SG11202000910YA SG11202000910YA SG 11202000910Y A SG11202000910Y A SG 11202000910YA SG 11202000910Y A SG11202000910Y A SG 11202000910YA SG 11202000910Y A SG11202000910Y A SG 11202000910YA SG 11202000910Y A SG11202000910Y A SG 11202000910YA
- Authority
- SG
- Singapore
- Prior art keywords
- ultrasonic cleaning
- cleaning device
- cleaning system
- ultrasonic
- cleaning
- Prior art date
Links
- 238000004506 ultrasonic cleaning Methods 0.000 title 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
- B08B3/123—Cleaning travelling work, e.g. webs, articles on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2240/00—Type of materials or objects being cleaned
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017206352A JP6763843B2 (en) | 2017-10-25 | 2017-10-25 | Ultrasonic cleaning equipment and ultrasonic cleaning system |
PCT/JP2018/030784 WO2019082483A1 (en) | 2017-10-25 | 2018-08-21 | Ultrasonic cleaning device and ultrasonic cleaning system |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202000910YA true SG11202000910YA (en) | 2020-05-28 |
Family
ID=66246469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202000910YA SG11202000910YA (en) | 2017-10-25 | 2018-08-21 | Ultrasonic cleaning device and ultrasonic cleaning system |
Country Status (7)
Country | Link |
---|---|
US (1) | US11618060B2 (en) |
JP (1) | JP6763843B2 (en) |
KR (1) | KR102265639B1 (en) |
CN (1) | CN210497445U (en) |
SG (1) | SG11202000910YA (en) |
TW (2) | TWI712454B (en) |
WO (1) | WO2019082483A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102216351B1 (en) | 2020-08-21 | 2021-02-17 | (주)네온테크 | Semiconductor Chip Washing Machine And Semiconductor Chip Making Method Using The Same |
KR102370323B1 (en) | 2020-08-27 | 2022-03-04 | 김신자 | Ultrasonic device for substrate cleaning and cleaning system using the same |
JP7282472B2 (en) * | 2020-09-28 | 2023-05-29 | 株式会社カイジョー | ultrasonic shower cleaner |
JPWO2022064680A1 (en) * | 2020-09-28 | 2022-03-31 | ||
CN112371673A (en) * | 2020-11-30 | 2021-02-19 | 东莞市伟基再生资源集中处理中心有限公司 | Automatic belt cleaning device of printing ink bucket |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03258381A (en) | 1990-03-07 | 1991-11-18 | Shimada Phys & Chem Ind Co Ltd | Ultrasonic cleaning machine |
JPH03259523A (en) * | 1990-03-09 | 1991-11-19 | Hitachi Ltd | Washing equipment |
JPH08168730A (en) * | 1994-10-21 | 1996-07-02 | Mk Seiko Co Ltd | Flowing water type ultrasonic washing apparatus |
DE19629705A1 (en) * | 1996-07-24 | 1998-01-29 | Joachim Dr Scheerer | Ultrasonic cleaning especially of wafer |
JPH1133506A (en) * | 1997-07-24 | 1999-02-09 | Tadahiro Omi | Fluid treatment device and cleaning treatment system |
JPH10296199A (en) * | 1997-04-30 | 1998-11-10 | Shibaura Eng Works Co Ltd | Ultrasonic washing device |
JP3722337B2 (en) * | 1998-05-28 | 2005-11-30 | 忠弘 大見 | Wet processing equipment |
JP3256198B2 (en) | 1999-06-23 | 2002-02-12 | 株式会社カイジョー | Ultrasonic shower cleaning equipment |
JP2001198538A (en) * | 2000-01-20 | 2001-07-24 | Kaijo Corp | Ultrasonic cleaning device |
JP2003181394A (en) * | 2001-12-14 | 2003-07-02 | Honda Electronic Co Ltd | Ultrasonic cleaning method and device used in the same |
JP2003320330A (en) * | 2002-05-07 | 2003-11-11 | Honda Electronic Co Ltd | Ultrasonic cleaning apparatus |
JP3984196B2 (en) | 2003-06-24 | 2007-10-03 | アルプス電気株式会社 | Ultrasonic vibration device and wet processing device using the same |
JP2005013960A (en) * | 2003-06-30 | 2005-01-20 | Tokyo Ohka Kogyo Co Ltd | Apparatus and method for cleaning substrate |
JP3927936B2 (en) | 2003-09-09 | 2007-06-13 | 株式会社カイジョー | Single wafer cleaning method and cleaning apparatus |
JP4036815B2 (en) * | 2003-10-31 | 2008-01-23 | シャープ株式会社 | Cleaning device |
JP5072062B2 (en) * | 2006-03-13 | 2012-11-14 | 栗田工業株式会社 | Method, apparatus and apparatus for producing hydrogen gas-dissolved cleaning water |
JP2009061359A (en) * | 2007-09-04 | 2009-03-26 | Shimada Phys & Chem Ind Co Ltd | Ultrasonic cleaning apparatus |
JP5183777B2 (en) * | 2011-07-12 | 2013-04-17 | 株式会社カイジョー | Ultrasonic cleaning apparatus and ultrasonic cleaning method |
KR101336996B1 (en) * | 2012-02-29 | 2013-12-04 | 주식회사 듀라소닉 | Ultrasonic washing apparatus for large area panel |
JP5701822B2 (en) * | 2012-06-20 | 2015-04-15 | 東レエンジニアリング株式会社 | Cleaning apparatus and cleaning method |
KR101599250B1 (en) * | 2014-03-19 | 2016-03-03 | 주식회사 듀라소닉 | Ultrasonic washing apparatus for large area panel |
-
2017
- 2017-10-25 JP JP2017206352A patent/JP6763843B2/en active Active
-
2018
- 2018-08-20 TW TW107128949A patent/TWI712454B/en active
- 2018-08-20 TW TW109100471A patent/TWI756611B/en active
- 2018-08-21 WO PCT/JP2018/030784 patent/WO2019082483A1/en active Application Filing
- 2018-08-21 US US16/344,585 patent/US11618060B2/en active Active
- 2018-08-21 CN CN201890000296.9U patent/CN210497445U/en active Active
- 2018-08-21 SG SG11202000910YA patent/SG11202000910YA/en unknown
- 2018-08-21 KR KR1020197025450A patent/KR102265639B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TWI712454B (en) | 2020-12-11 |
KR102265639B1 (en) | 2021-06-17 |
TW201916944A (en) | 2019-05-01 |
US20210331215A1 (en) | 2021-10-28 |
JP6763843B2 (en) | 2020-09-30 |
TWI756611B (en) | 2022-03-01 |
US11618060B2 (en) | 2023-04-04 |
KR20190113878A (en) | 2019-10-08 |
CN210497445U (en) | 2020-05-12 |
JP2019076847A (en) | 2019-05-23 |
WO2019082483A1 (en) | 2019-05-02 |
TW202014251A (en) | 2020-04-16 |
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