SG11201909298UA - Aligner apparatus and methods - Google Patents
Aligner apparatus and methodsInfo
- Publication number
- SG11201909298UA SG11201909298UA SG11201909298UA SG11201909298UA SG 11201909298U A SG11201909298U A SG 11201909298UA SG 11201909298U A SG11201909298U A SG 11201909298UA SG 11201909298U A SG11201909298U A SG 11201909298UA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- gripping element
- edge gripping
- pct
- central
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Orthopedics, Nursing, And Contraception (AREA)
Abstract
36 r12 I ii 31- W O 20 18/187 137 Al (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 11 October 2018 (11.10.2018) WIPO I PCT omit VIII °nolo III OH mom 01110111 Imo oimIE (10) International Publication Number WO 2018/187137 Al (51) International Patent Classification: HOlL 21/68 (2006.01) HOlL 21/67 (2006.01) HO1L 21/687 (2006.01) (21) International Application Number: PCT/US2018/025001 (22) International Filing Date: 29 March 2018 (29.03.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 15/481,679 07 April 2017 (07.04.2017) US (71) Applicant: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue, Santa Clara, California 95054 (US). (72) Inventors: AHAMED, Yaseer Arafath; 12100 Metric Blvd, Apt 1036, Austin, Texas 78758 (US). STRASSN- ER, James D.; 2505 Rock Terrace Dr, Austin, Texas 78704 (US). (74) Agent: SERVILLA, Scott S.; Servilla Whitney LLC, 33 Wood Avenue South, Suite 830, Iselin, New Jersey 08830 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, (54) Title: ALIGNER APPARATUS AND METHODS 33 32 FIG. 4 (57) : Described herein are aligners and methods of aligning workpieces. A workpiece aligner apparatus comprises an aligner chuck including an arm having a first end and a second end, a first edge gripping element on the first end and a second edge gripping element on the second end, the first edge gripping element and the second edge gripping element spaced apart to hold a workpiece at edges thereof, and a central workpiece handling element located in a central region of the arm, wherein the central workpiece handling element has a height such that the central workpiece handling element extends higher than the first edge gripping element and second edge gripping element. [Continued on next page] WO 2018/187137 Al MIDEDIMOHNIIMEIDIOMEIMIIIINHINVOIMIE TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/481,679 US10522381B2 (en) | 2017-04-07 | 2017-04-07 | Aligner apparatus and methods |
PCT/US2018/025001 WO2018187137A1 (en) | 2017-04-07 | 2018-03-29 | Aligner apparatus and methods |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201909298UA true SG11201909298UA (en) | 2019-11-28 |
Family
ID=63711229
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201909298U SG11201909298UA (en) | 2017-04-07 | 2018-03-29 | Aligner apparatus and methods |
Country Status (7)
Country | Link |
---|---|
US (1) | US10522381B2 (en) |
JP (1) | JP7169987B2 (en) |
KR (1) | KR102493387B1 (en) |
CN (1) | CN110582844B (en) |
SG (1) | SG11201909298UA (en) |
TW (1) | TWI751309B (en) |
WO (1) | WO2018187137A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11047795B2 (en) | 2019-06-03 | 2021-06-29 | Formfactor, Inc. | Calibration chucks for optical probe systems, optical probe systems including the calibration chucks, and methods of utilizing the optical probe systems |
JP7454959B2 (en) * | 2020-03-03 | 2024-03-25 | 東京エレクトロン株式会社 | Substrate transfer system and atmospheric transfer module |
JP7474325B2 (en) | 2020-06-05 | 2024-04-24 | ローツェ株式会社 | Wafer transport device and wafer transport method |
TW202234470A (en) * | 2020-12-28 | 2022-09-01 | 日商東京威力科創股份有限公司 | Transfer apparatus |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5566466A (en) * | 1994-07-01 | 1996-10-22 | Ontrak Systems, Inc. | Spindle assembly with improved wafer holder |
US6318957B1 (en) | 1998-07-10 | 2001-11-20 | Asm America, Inc. | Method for handling of wafers with minimal contact |
JP3254584B2 (en) * | 2000-07-14 | 2002-02-12 | 東京エレクトロン株式会社 | Processing system |
JP3854083B2 (en) * | 2000-10-12 | 2006-12-06 | 株式会社荏原製作所 | Semiconductor substrate manufacturing equipment |
US6556887B2 (en) | 2001-07-12 | 2003-04-29 | Applied Materials, Inc. | Method for determining a position of a robot |
JP4598325B2 (en) * | 2001-08-21 | 2010-12-15 | 株式会社岡本工作機械製作所 | Substrate temporary table and substrate transfer method |
US20030053904A1 (en) * | 2001-09-14 | 2003-03-20 | Naofumi Kirihata | Wafer aligner |
JP4552222B2 (en) * | 2001-09-21 | 2010-09-29 | ムラテックオートメーション株式会社 | Wafer aligner |
JP3674864B2 (en) * | 2003-03-25 | 2005-07-27 | 忠素 玉井 | Vacuum processing equipment |
JP3944135B2 (en) * | 2003-07-14 | 2007-07-11 | 川崎重工業株式会社 | Edge retention aligner |
US7019817B2 (en) * | 2003-07-14 | 2006-03-28 | Kawasaki Jukogyo Kabuishiki Kaisha | Edge-holding aligner |
US8545165B2 (en) * | 2005-03-30 | 2013-10-01 | Brooks Automation, Inc. | High speed substrate aligner apparatus |
US7712808B2 (en) * | 2005-09-29 | 2010-05-11 | Brooks Automation, Inc. | End effector with centering grip |
CN101039537A (en) * | 2006-03-17 | 2007-09-19 | 中芯国际集成电路制造(上海)有限公司 | High temperature wafer holder for disposing thermal resistance temperature detector wafer |
KR100751496B1 (en) | 2006-05-25 | 2007-08-23 | 이종대 | Vacuum and edge grip aligner of semiconductor wafer and align method using thereof |
US20080138178A1 (en) * | 2006-12-06 | 2008-06-12 | Axcelis Technologies,Inc. | High throughput serial wafer handling end station |
US20090110532A1 (en) * | 2007-10-29 | 2009-04-30 | Sokudo Co., Ltd. | Method and apparatus for providing wafer centering on a track lithography tool |
JP2013006222A (en) * | 2009-10-14 | 2013-01-10 | Rorze Corp | Apparatus for holding thin-board shaped material and method for holding thin-board shaped material |
US9004838B2 (en) | 2011-04-07 | 2015-04-14 | Microtronic, Inc. | Apparatus, system, and methods for weighing and positioning wafers |
CN106548969B (en) * | 2015-09-22 | 2019-08-23 | 北京北方华创微电子装备有限公司 | Clamping device and semiconductor processing equipment |
-
2017
- 2017-04-07 US US15/481,679 patent/US10522381B2/en active Active
-
2018
- 2018-03-22 TW TW107109746A patent/TWI751309B/en active
- 2018-03-29 JP JP2019554970A patent/JP7169987B2/en active Active
- 2018-03-29 CN CN201880028467.3A patent/CN110582844B/en active Active
- 2018-03-29 SG SG11201909298U patent/SG11201909298UA/en unknown
- 2018-03-29 KR KR1020197032802A patent/KR102493387B1/en active IP Right Grant
- 2018-03-29 WO PCT/US2018/025001 patent/WO2018187137A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR102493387B1 (en) | 2023-01-27 |
KR20190128742A (en) | 2019-11-18 |
JP2020517104A (en) | 2020-06-11 |
TW201903934A (en) | 2019-01-16 |
CN110582844A (en) | 2019-12-17 |
TWI751309B (en) | 2022-01-01 |
CN110582844B (en) | 2023-08-22 |
US20180294175A1 (en) | 2018-10-11 |
JP7169987B2 (en) | 2022-11-11 |
US10522381B2 (en) | 2019-12-31 |
WO2018187137A1 (en) | 2018-10-11 |
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