SG11201909298UA - Aligner apparatus and methods - Google Patents

Aligner apparatus and methods

Info

Publication number
SG11201909298UA
SG11201909298UA SG11201909298UA SG11201909298UA SG 11201909298U A SG11201909298U A SG 11201909298UA SG 11201909298U A SG11201909298U A SG 11201909298UA SG 11201909298U A SG11201909298U A SG 11201909298UA
Authority
SG
Singapore
Prior art keywords
international
gripping element
edge gripping
pct
central
Prior art date
Application number
Inventor
Yaseer Arafath Ahamed
James D Strassner
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201909298UA publication Critical patent/SG11201909298UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Orthopedics, Nursing, And Contraception (AREA)

Abstract

36 r12 I ii 31- W O 20 18/187 137 Al (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 11 October 2018 (11.10.2018) WIPO I PCT omit VIII °nolo III OH mom 01110111 Imo oimIE (10) International Publication Number WO 2018/187137 Al (51) International Patent Classification: HOlL 21/68 (2006.01) HOlL 21/67 (2006.01) HO1L 21/687 (2006.01) (21) International Application Number: PCT/US2018/025001 (22) International Filing Date: 29 March 2018 (29.03.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 15/481,679 07 April 2017 (07.04.2017) US (71) Applicant: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue, Santa Clara, California 95054 (US). (72) Inventors: AHAMED, Yaseer Arafath; 12100 Metric Blvd, Apt 1036, Austin, Texas 78758 (US). STRASSN- ER, James D.; 2505 Rock Terrace Dr, Austin, Texas 78704 (US). (74) Agent: SERVILLA, Scott S.; Servilla Whitney LLC, 33 Wood Avenue South, Suite 830, Iselin, New Jersey 08830 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, (54) Title: ALIGNER APPARATUS AND METHODS 33 32 FIG. 4 (57) : Described herein are aligners and methods of aligning workpieces. A workpiece aligner apparatus comprises an aligner chuck including an arm having a first end and a second end, a first edge gripping element on the first end and a second edge gripping element on the second end, the first edge gripping element and the second edge gripping element spaced apart to hold a workpiece at edges thereof, and a central workpiece handling element located in a central region of the arm, wherein the central workpiece handling element has a height such that the central workpiece handling element extends higher than the first edge gripping element and second edge gripping element. [Continued on next page] WO 2018/187137 Al MIDEDIMOHNIIMEIDIOMEIMIIIINHINVOIMIE TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))
SG11201909298U 2017-04-07 2018-03-29 Aligner apparatus and methods SG11201909298UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/481,679 US10522381B2 (en) 2017-04-07 2017-04-07 Aligner apparatus and methods
PCT/US2018/025001 WO2018187137A1 (en) 2017-04-07 2018-03-29 Aligner apparatus and methods

Publications (1)

Publication Number Publication Date
SG11201909298UA true SG11201909298UA (en) 2019-11-28

Family

ID=63711229

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201909298U SG11201909298UA (en) 2017-04-07 2018-03-29 Aligner apparatus and methods

Country Status (7)

Country Link
US (1) US10522381B2 (en)
JP (1) JP7169987B2 (en)
KR (1) KR102493387B1 (en)
CN (1) CN110582844B (en)
SG (1) SG11201909298UA (en)
TW (1) TWI751309B (en)
WO (1) WO2018187137A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11047795B2 (en) 2019-06-03 2021-06-29 Formfactor, Inc. Calibration chucks for optical probe systems, optical probe systems including the calibration chucks, and methods of utilizing the optical probe systems
JP7454959B2 (en) * 2020-03-03 2024-03-25 東京エレクトロン株式会社 Substrate transfer system and atmospheric transfer module
JP7474325B2 (en) 2020-06-05 2024-04-24 ローツェ株式会社 Wafer transport device and wafer transport method
TW202234470A (en) * 2020-12-28 2022-09-01 日商東京威力科創股份有限公司 Transfer apparatus

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5566466A (en) * 1994-07-01 1996-10-22 Ontrak Systems, Inc. Spindle assembly with improved wafer holder
US6318957B1 (en) 1998-07-10 2001-11-20 Asm America, Inc. Method for handling of wafers with minimal contact
JP3254584B2 (en) * 2000-07-14 2002-02-12 東京エレクトロン株式会社 Processing system
JP3854083B2 (en) * 2000-10-12 2006-12-06 株式会社荏原製作所 Semiconductor substrate manufacturing equipment
US6556887B2 (en) 2001-07-12 2003-04-29 Applied Materials, Inc. Method for determining a position of a robot
JP4598325B2 (en) * 2001-08-21 2010-12-15 株式会社岡本工作機械製作所 Substrate temporary table and substrate transfer method
US20030053904A1 (en) * 2001-09-14 2003-03-20 Naofumi Kirihata Wafer aligner
JP4552222B2 (en) * 2001-09-21 2010-09-29 ムラテックオートメーション株式会社 Wafer aligner
JP3674864B2 (en) * 2003-03-25 2005-07-27 忠素 玉井 Vacuum processing equipment
JP3944135B2 (en) * 2003-07-14 2007-07-11 川崎重工業株式会社 Edge retention aligner
US7019817B2 (en) * 2003-07-14 2006-03-28 Kawasaki Jukogyo Kabuishiki Kaisha Edge-holding aligner
US8545165B2 (en) * 2005-03-30 2013-10-01 Brooks Automation, Inc. High speed substrate aligner apparatus
US7712808B2 (en) * 2005-09-29 2010-05-11 Brooks Automation, Inc. End effector with centering grip
CN101039537A (en) * 2006-03-17 2007-09-19 中芯国际集成电路制造(上海)有限公司 High temperature wafer holder for disposing thermal resistance temperature detector wafer
KR100751496B1 (en) 2006-05-25 2007-08-23 이종대 Vacuum and edge grip aligner of semiconductor wafer and align method using thereof
US20080138178A1 (en) * 2006-12-06 2008-06-12 Axcelis Technologies,Inc. High throughput serial wafer handling end station
US20090110532A1 (en) * 2007-10-29 2009-04-30 Sokudo Co., Ltd. Method and apparatus for providing wafer centering on a track lithography tool
JP2013006222A (en) * 2009-10-14 2013-01-10 Rorze Corp Apparatus for holding thin-board shaped material and method for holding thin-board shaped material
US9004838B2 (en) 2011-04-07 2015-04-14 Microtronic, Inc. Apparatus, system, and methods for weighing and positioning wafers
CN106548969B (en) * 2015-09-22 2019-08-23 北京北方华创微电子装备有限公司 Clamping device and semiconductor processing equipment

Also Published As

Publication number Publication date
KR102493387B1 (en) 2023-01-27
KR20190128742A (en) 2019-11-18
JP2020517104A (en) 2020-06-11
TW201903934A (en) 2019-01-16
CN110582844A (en) 2019-12-17
TWI751309B (en) 2022-01-01
CN110582844B (en) 2023-08-22
US20180294175A1 (en) 2018-10-11
JP7169987B2 (en) 2022-11-11
US10522381B2 (en) 2019-12-31
WO2018187137A1 (en) 2018-10-11

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