SG11201904418UA - Assembly and method for inspecting components - Google Patents
Assembly and method for inspecting componentsInfo
- Publication number
- SG11201904418UA SG11201904418UA SG11201904418UA SG11201904418UA SG11201904418UA SG 11201904418U A SG11201904418U A SG 11201904418UA SG 11201904418U A SG11201904418U A SG 11201904418UA SG 11201904418U A SG11201904418U A SG 11201904418UA SG 11201904418U A SG11201904418U A SG 11201904418UA
- Authority
- SG
- Singapore
- Prior art keywords
- component
- international
- camera
- rue
- focus
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
- H04N7/183—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a single remote source
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/64—Computer-aided capture of images, e.g. transfer from script file into camera, check of taken image quality, advice or proposal for image composition or decision on when to take image
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/02—Mechanical
- G01N2201/025—Mechanical control of operations
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Multimedia (AREA)
- Manufacturing & Machinery (AREA)
- Operations Research (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
00 00 O C (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 09 August 2018 (09.08.2018) WIP0 I PCT omit IIl °nolo DID Ill OH OH IIIII Imo oimIE (10) International Publication Number WO 2018/142188 Al (51) International Patent Classification: GO1N 21/956 (2006.01) H05K 13/08 (2006.01) (21) International Application Number: PCT/IB2017/050563 (22) International Filing Date: 02 February 2017 (02.02.2017) (25) Filing Language: English (26) Publication Language: English (71) Applicant: ISMECA SEMICONDUCTOR HOLDING SA [CH/CH]; Rue de l'Helvetie 283, 2300 La Chaux-de- Fonds (CH). (72) Inventors: PARATTE, Jerome; Rue du 26 Mars 25B, 2720 Tramelan (CH). ABRIAL, Pierrick; Rue Denis de Rougemont 32, 2000 Neuchatel (CH). EME, Thierry; 25 rue du Neuf Clos, 25130 Villers-le-Lac (FR). (74) Agent: P&TS SA (AG, LTD.); Av. J.-J. Rousseau 4, P.O. Box 2848, 2001 Neuchatel (CH). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (54) Title: ASSEMBLY AND METHOD FOR INSPECTING COMPONENTS (57) : According to the present invention there is provided a method of inspecting a component (10), using an assembly comprising a camera (3) with a fixed position, and a moveable stage (5), wherein the moveable stage is configured such that it can rotate about a rotation axis (7), and, can move linearly along two linear axes (9a, 9b) wherein said two linear axes are perpendicular to one another and wherein both of said two linear axes are each perpendicular to the rotation axis, the method comprising the steps of, (a) providing a first component into a predefined orientation on the stage, such that a first side of the component is facing a camera; (b) moving the stage linearly along one or more of said two linear axes so as to bring the first side of the first component into focus of the camera; (c) capturing an image of the first side of the first component after it has been brought into focus of the camera. An assembly according to the above comprising additionally a processor which is configured to determine whether the image of the component is [Continued on next page] WO 2018/142188 Al MIDEDIMOMOIDEIREEMOMMIfilliMMOVOIMIE (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3)) in-focus of the camera, and if not, to determine a movement of the moveable stage and to initiate the moveable stage to undergo said determined movement so as to bring the component into focus is also provided.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/IB2017/050563 WO2018142188A1 (en) | 2017-02-02 | 2017-02-02 | Assembly and method for inspecting components |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201904418UA true SG11201904418UA (en) | 2019-09-27 |
Family
ID=58044110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201904418UA SG11201904418UA (en) | 2017-02-02 | 2017-02-02 | Assembly and method for inspecting components |
Country Status (7)
Country | Link |
---|---|
US (1) | US20190320145A1 (en) |
KR (2) | KR102380479B1 (en) |
CN (1) | CN110100175A (en) |
PH (1) | PH12019501364A1 (en) |
SG (1) | SG11201904418UA (en) |
TW (1) | TWI667452B (en) |
WO (1) | WO2018142188A1 (en) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03203399A (en) * | 1989-12-29 | 1991-09-05 | Matsushita Electric Ind Co Ltd | Parts mounting device |
US6996264B2 (en) * | 2002-10-18 | 2006-02-07 | Leco Corporation | Indentation hardness test system |
JP2005072046A (en) * | 2003-08-26 | 2005-03-17 | Juki Corp | Apparatus for packaging electronic component |
KR100945575B1 (en) * | 2007-05-22 | 2010-03-08 | 충주대학교 산학협력단 | Apparatus for inspecting glass |
JP5038191B2 (en) * | 2008-03-04 | 2012-10-03 | 有限会社共同設計企画 | Electronic component inspection method and apparatus used therefor |
CN102498387A (en) * | 2009-09-22 | 2012-06-13 | 赛博光学公司 | High speed, high resolution, three dimensional solar cell inspection system |
TWM425273U (en) * | 2011-10-14 | 2012-03-21 | Pantrateq Corp | Re-inspection machine for visual inspection |
US10539772B2 (en) * | 2013-10-09 | 2020-01-21 | Howard Hughes Medical Institute | Multiview light-sheet microscopy |
JP5835758B1 (en) * | 2014-11-21 | 2015-12-24 | 上野精機株式会社 | Appearance inspection device |
-
2017
- 2017-02-02 WO PCT/IB2017/050563 patent/WO2018142188A1/en active Application Filing
- 2017-02-02 KR KR1020217030321A patent/KR102380479B1/en active IP Right Grant
- 2017-02-02 US US16/474,945 patent/US20190320145A1/en not_active Abandoned
- 2017-02-02 CN CN201780081568.2A patent/CN110100175A/en active Pending
- 2017-02-02 SG SG11201904418UA patent/SG11201904418UA/en unknown
- 2017-02-02 KR KR1020197017801A patent/KR20190112715A/en active Application Filing
-
2018
- 2018-01-29 TW TW107103101A patent/TWI667452B/en active
-
2019
- 2019-06-14 PH PH12019501364A patent/PH12019501364A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
TWI667452B (en) | 2019-08-01 |
PH12019501364A1 (en) | 2020-02-24 |
WO2018142188A1 (en) | 2018-08-09 |
KR20210118488A (en) | 2021-09-30 |
US20190320145A1 (en) | 2019-10-17 |
KR102380479B1 (en) | 2022-04-01 |
KR20190112715A (en) | 2019-10-07 |
CN110100175A (en) | 2019-08-06 |
TW201829980A (en) | 2018-08-16 |
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