SG11201904418UA - Assembly and method for inspecting components - Google Patents

Assembly and method for inspecting components

Info

Publication number
SG11201904418UA
SG11201904418UA SG11201904418UA SG11201904418UA SG11201904418UA SG 11201904418U A SG11201904418U A SG 11201904418UA SG 11201904418U A SG11201904418U A SG 11201904418UA SG 11201904418U A SG11201904418U A SG 11201904418UA SG 11201904418U A SG11201904418U A SG 11201904418UA
Authority
SG
Singapore
Prior art keywords
component
international
camera
rue
focus
Prior art date
Application number
SG11201904418UA
Inventor
Jerome Paratte
Pierrick Abrial
Thierry Eme
Original Assignee
Ismeca Semiconductor Holding Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ismeca Semiconductor Holding Sa filed Critical Ismeca Semiconductor Holding Sa
Publication of SG11201904418UA publication Critical patent/SG11201904418UA/en

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00Television systems
    • H04N7/18Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H04N7/183Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a single remote source
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95684Patterns showing highly reflecting parts, e.g. metallic elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60Control of cameras or camera modules
    • H04N23/64Computer-aided capture of images, e.g. transfer from script file into camera, check of taken image quality, advice or proposal for image composition or decision on when to take image
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813Controlling of single components prior to mounting, e.g. orientation, component geometry
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/02Mechanical
    • G01N2201/025Mechanical control of operations
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Multimedia (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

00 00 O C (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 09 August 2018 (09.08.2018) WIP0 I PCT omit IIl °nolo DID Ill OH OH IIIII Imo oimIE (10) International Publication Number WO 2018/142188 Al (51) International Patent Classification: GO1N 21/956 (2006.01) H05K 13/08 (2006.01) (21) International Application Number: PCT/IB2017/050563 (22) International Filing Date: 02 February 2017 (02.02.2017) (25) Filing Language: English (26) Publication Language: English (71) Applicant: ISMECA SEMICONDUCTOR HOLDING SA [CH/CH]; Rue de l'Helvetie 283, 2300 La Chaux-de- Fonds (CH). (72) Inventors: PARATTE, Jerome; Rue du 26 Mars 25B, 2720 Tramelan (CH). ABRIAL, Pierrick; Rue Denis de Rougemont 32, 2000 Neuchatel (CH). EME, Thierry; 25 rue du Neuf Clos, 25130 Villers-le-Lac (FR). (74) Agent: P&TS SA (AG, LTD.); Av. J.-J. Rousseau 4, P.O. Box 2848, 2001 Neuchatel (CH). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (54) Title: ASSEMBLY AND METHOD FOR INSPECTING COMPONENTS (57) : According to the present invention there is provided a method of inspecting a component (10), using an assembly comprising a camera (3) with a fixed position, and a moveable stage (5), wherein the moveable stage is configured such that it can rotate about a rotation axis (7), and, can move linearly along two linear axes (9a, 9b) wherein said two linear axes are perpendicular to one another and wherein both of said two linear axes are each perpendicular to the rotation axis, the method comprising the steps of, (a) providing a first component into a predefined orientation on the stage, such that a first side of the component is facing a camera; (b) moving the stage linearly along one or more of said two linear axes so as to bring the first side of the first component into focus of the camera; (c) capturing an image of the first side of the first component after it has been brought into focus of the camera. An assembly according to the above comprising additionally a processor which is configured to determine whether the image of the component is [Continued on next page] WO 2018/142188 Al MIDEDIMOMOIDEIREEMOMMIfilliMMOVOIMIE (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3)) in-focus of the camera, and if not, to determine a movement of the moveable stage and to initiate the moveable stage to undergo said determined movement so as to bring the component into focus is also provided.
SG11201904418UA 2017-02-02 2017-02-02 Assembly and method for inspecting components SG11201904418UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2017/050563 WO2018142188A1 (en) 2017-02-02 2017-02-02 Assembly and method for inspecting components

Publications (1)

Publication Number Publication Date
SG11201904418UA true SG11201904418UA (en) 2019-09-27

Family

ID=58044110

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201904418UA SG11201904418UA (en) 2017-02-02 2017-02-02 Assembly and method for inspecting components

Country Status (7)

Country Link
US (1) US20190320145A1 (en)
KR (2) KR102380479B1 (en)
CN (1) CN110100175A (en)
PH (1) PH12019501364A1 (en)
SG (1) SG11201904418UA (en)
TW (1) TWI667452B (en)
WO (1) WO2018142188A1 (en)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03203399A (en) * 1989-12-29 1991-09-05 Matsushita Electric Ind Co Ltd Parts mounting device
US6996264B2 (en) * 2002-10-18 2006-02-07 Leco Corporation Indentation hardness test system
JP2005072046A (en) * 2003-08-26 2005-03-17 Juki Corp Apparatus for packaging electronic component
KR100945575B1 (en) * 2007-05-22 2010-03-08 충주대학교 산학협력단 Apparatus for inspecting glass
JP5038191B2 (en) * 2008-03-04 2012-10-03 有限会社共同設計企画 Electronic component inspection method and apparatus used therefor
CN102498387A (en) * 2009-09-22 2012-06-13 赛博光学公司 High speed, high resolution, three dimensional solar cell inspection system
TWM425273U (en) * 2011-10-14 2012-03-21 Pantrateq Corp Re-inspection machine for visual inspection
US10539772B2 (en) * 2013-10-09 2020-01-21 Howard Hughes Medical Institute Multiview light-sheet microscopy
JP5835758B1 (en) * 2014-11-21 2015-12-24 上野精機株式会社 Appearance inspection device

Also Published As

Publication number Publication date
TWI667452B (en) 2019-08-01
PH12019501364A1 (en) 2020-02-24
WO2018142188A1 (en) 2018-08-09
KR20210118488A (en) 2021-09-30
US20190320145A1 (en) 2019-10-17
KR102380479B1 (en) 2022-04-01
KR20190112715A (en) 2019-10-07
CN110100175A (en) 2019-08-06
TW201829980A (en) 2018-08-16

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